Backlight module and display device

Abstract

The application belongs to the field of display, and particularly relates to a backlight module and a display device. The backlight module comprises a first light source plate and a second light source plate. The first light source plate comprises a first driving substrate and a first light emitting chip. The first driving substrate comprises a first area and a second area. The first area is a region where a normal projection of an irradiation area of the first light emitting chip on the first driving substrate is located. The second area is an area outside the normal projection of the irradiation area of the first light emitting chip on the first driving substrate. At least the second area is a light transmission area. The second light source plate is arranged on a side of the first driving substrate away from the first light emitting chip. The second light source plate comprises a second driving substrate and a second light emitting chip. A normal projection of an irradiation area of the second light emitting chip on the first driving substrate is greater than or equal to the second area. Brightness compensation is performed on the second area by the second light emitting chip, so that the brightness of the second area is the same as or close to the brightness of the first area, and the problem of backlight non-uniformity is improved or eliminated.

Description

Technical Field

[0001] This application belongs to the field of display, specifically relating to a backlight module and display device. Background Technology

[0002] With the development of display technology, thin film transistor liquid crystal displays (TFT-LCDs) have become the mainstream display devices due to their advantages such as high image quality, energy saving, thin body and mature and stable manufacturing process.

[0003] An LCD monitor consists of a backlight module and a display panel. The backlight module provides uniform white light across the entire surface. In the display panel, liquid crystal molecules change orientation under the influence of an electric field, controlling the transmission and blocking of backlight. The backlight then passes through a color filter in the display panel to achieve RGB display. Uneven light emission from the backlight module will significantly affect the display effect of the LCD monitor.

[0004] Most existing backlight modules are single-layer lamp board designs, which include an array of LED (light-emitting diode) chips. Due to factors such as LED chip heat generation and cost, a large gap is usually reserved between LED chips. Dark areas are easily formed at the diagonal intersection of four adjacent LED chips, resulting in uneven light output from the backlight module. Summary of the Invention

[0005] The purpose of this application is to provide a backlight module and display device to improve or eliminate the problem of uneven backlighting, thereby improving the image quality of the liquid crystal display.

[0006] To achieve the above objectives, this application provides a backlight module, including a first light source board. The first light source board includes a first driving substrate and a plurality of first light-emitting chips spaced apart on the first driving substrate. The first driving substrate includes a first region and a second region. The first region is the area where the illumination area of ​​the first light-emitting chip is projected onto the first driving substrate, and the second region is the area other than the projection of the illumination area of ​​the first light-emitting chip onto the first driving substrate. At least the second region is a light-transmitting region.

[0007] The backlight module further includes a second light source board, which is disposed on the side of the first driving substrate away from the first light-emitting chip. The second light source board includes a second driving substrate and a second light-emitting chip. The second light-emitting chip is disposed on the side of the second driving substrate close to the first driving substrate. The orthographic projection of the illumination area of ​​the second light-emitting chip on the first driving substrate is greater than or equal to the second area.

[0008] Optionally, the first driving substrate is a light-transmitting substrate, and the first light source board further includes chip bonding points and conductive lines. The chip bonding points and the conductive lines are both disposed in the first region of the first driving substrate, and the first light-emitting chip is connected to the conductive lines through the chip bonding points.

[0009] Optionally, the backlight module further includes a support layer, which is disposed between the first driving substrate and the second driving substrate, and the height of the support layer relative to the second driving substrate is greater than the height of the second light-emitting chip relative to the second driving substrate.

[0010] Optionally, the support layer is a light-shielding structure layer, and the orthographic projection of the support layer on the first driving substrate is located within or coincides with the first area.

[0011] Optionally, the first driving substrate is a non-transparent substrate, the second area is a light-transmitting hole of the non-transparent substrate, and the first light source board further includes chip bonding points and conductive lines. The chip bonding points and the conductive lines are both disposed in the first area of ​​the first driving substrate, and the first light-emitting chip is connected to the conductive lines through the chip bonding points.

[0012] Optionally, the second light-emitting chip is located within the light-transmitting hole, and the height of the second light-emitting chip relative to the second driving substrate is less than the height of the first driving substrate relative to the second driving substrate; and / or

[0013] The backlight module further includes a light-shielding unit, which is disposed on the first driving substrate and surrounds the first light-emitting chip. The height of the light-shielding unit relative to the first driving substrate is greater than the height of the first light-emitting chip relative to the first driving substrate.

[0014] Optionally, the backlight module further includes a buffer layer disposed between the first driving substrate and the second driving substrate, wherein the orthographic projection of the buffer layer on the first driving substrate is located within or coincides with the first area.

[0015] Optionally, the first light-emitting chips are arrayed on the first driving substrate along the row and column directions, the spacing between adjacent first light-emitting chips in the row direction and the spacing between adjacent first light-emitting chips in the column direction are equal, and the shape of the second light-emitting chip is similar to the second region or the inscribed rectangle of the second region.

[0016] Optionally, the first light-emitting chip is disposed on the first driving substrate along the row and column directions, and the first light-emitting chips in odd-numbered rows and even-numbered rows are staggered in the column direction, or the first light-emitting chips in odd-numbered columns and even-numbered columns are staggered in the row direction.

[0017] This application also provides a display device, including:

[0018] The backlight module;

[0019] The display panel is located on the light-emitting side of the backlight module.

[0020] The backlight module and display device disclosed in this application have the following beneficial effects:

[0021] In this application, the backlight module includes a first light source board and a second light source board. The first light source board includes a first driving substrate and a first light-emitting chip. The first driving substrate includes a first region and a second region. The first region is the area where the illumination area of ​​the first light-emitting chip is projected onto the first driving substrate. The second region is the area outside the projection of the illumination area of ​​the first light-emitting chip onto the first driving substrate. The second light source board is disposed on the side of the first driving substrate away from the first light-emitting chip. The second light source board includes a second driving substrate and a second light-emitting chip. The projection of the illumination area of ​​the second light-emitting chip onto the first driving substrate is greater than or equal to the second region to perform brightness compensation, so that the brightness of the second region is the same as or close to the brightness of the first region, thereby improving or eliminating the problem of uneven backlight.

[0022] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0025] Figure 1 This is a schematic diagram of the backlight module in Embodiment 1 of this application.

[0026] Figure 2 This is a schematic diagram of the structure of the first light source board in Embodiment 1 of this application.

[0027] Figure 3 This is a schematic diagram of the first light source plate illuminating the optical film in Embodiment 1 of this application.

[0028] Figure 4 This is a schematic diagram of the bright and dark areas emitted by the first light source plate in Embodiment 1 of this application.

[0029] Figure 5 This is a schematic diagram of the structure of the second light source board in Embodiment 1 of this application.

[0030] Figure 6 This is a schematic diagram of the backlight module in Embodiment 2 of this application.

[0031] Figure 7 This is a schematic diagram of the structure of the first light source plate in Embodiment 3 of this application.

[0032] Figure 8 This is a schematic diagram of the display device in Embodiment 4 of this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100. Backlight module;

[0035] 110. First light source board; 111. First driving substrate; 1111. First region; 1112. Second region; 112. First light-emitting chip;

[0036] 120. Second light source board; 121. Second driving substrate; 122. Second light-emitting chip;

[0037] 130. Support layer; 140. Light-shielding unit; 150. Buffer layer; 160. Thermal conductive layer;

[0038] 200, Display panel; 300, Optical film. Detailed Implementation

[0039] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0040] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0041] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.

[0042] Example 1

[0043] See Figures 1 to 4 As shown, in this embodiment, the backlight module 100 includes a first light source board 110 and a second light source board 120.

[0044] The first light source board 110 includes a first driving substrate 111 and a plurality of first light-emitting chips 112 spaced apart on the first driving substrate 111. The first driving substrate 111 includes a first region 1111 and a second region 1112. The first region 1111 is the area where the illumination area of ​​the first light-emitting chip 112 is projected onto the first driving substrate 111, and the second region 1112 is the area outside the projection of the illumination area of ​​the first light-emitting chip 112 onto the first driving substrate 111. The second region 1112 includes the area formed by the four first regions 1111.

[0045] The first light-emitting chip 112 emits light at an angle greater than 90° and less than 180°, such as Figure 3 As shown, the arrows represent the light emitted by the first light-emitting chip 112, and the angle between the two arrows is the maximum light emission angle of the first light-emitting chip 112. When the light emitted by the first light-emitting chip 112 illuminates the optical film, the illumination area of ​​the first light-emitting chip 112 is conical or approximately conical. The light spot formed by the first light-emitting chip 112 on the optical film is circular or approximately circular. The orthographic projection of the illumination area of ​​the first light-emitting chip 112 on the first driving substrate 111 has the same shape as the light spot formed on the optical film; that is, the first region 1111 is circular or approximately circular, and the second region 1112 is the area outside the first region 1111. Adjacent first regions 1111 may or may not intersect, depending on the distance between adjacent first light-emitting chips 112 and the distance between the first light-emitting chip 112 and the optical film. At least the second region 1112 is a light-transmitting region, meaning that light can pass through the second region 1112 to illuminate the optical film.

[0046] The backlight module 100 also includes a second light source board 120, which is disposed on the side of the first driving substrate 111 away from the first light-emitting chip 112. The second light source board 120 includes a second driving substrate 121 and a second light-emitting chip 122, which is disposed on the side of the second driving substrate 121 closer to the first driving substrate 111. Both the first light-emitting chip 112 and the second light-emitting chip 122 can be LED chips. The orthographic projection of the illumination area of ​​the second light-emitting chip 122 onto the first driving substrate 111 is greater than or equal to the second area 1112, in order to perform brightness compensation so that the brightness of the second area 1112 is the same as or close to the brightness of the first area 1111.

[0047] For backlight modules with a single-layer lamp board design, due to factors such as LED chip heat generation and cost, a certain gap is reserved between the LED chips. The brightness of the light spot covered by the LED chip on the optical film is high, while the brightness is low at the diagonal intersection of four adjacent LED chips, forming obvious bright and dark areas. This indicates that the backlight module suffers from uneven light output. Even if the spacing between the LED chips is designed to be small enough that the light spot of the LED chip is sufficient to cover the optical film, the overlap area of ​​the light spots of adjacent LED chips on the optical film will still be higher than other areas. In other words, the backlight module with a single-layer lamp board design suffers from uneven backlighting, which will significantly affect the display effect of the display device.

[0048] In this embodiment, the backlight module 100 includes a first light source board 110 and a second light source board 120. The first light source board 110 includes a first driving substrate 111 and a first light-emitting chip 112. The first driving substrate 111 includes a first region 1111 and a second region 1112. The first region 1111 is the area where the illumination area of ​​the first light-emitting chip 112 is projected onto the first driving substrate 111. The second region 1112 is the area outside the projection of the illumination area of ​​the first light-emitting chip 112 onto the first driving substrate 111. The second light source board 120 is disposed on the side of the first driving substrate 111 away from the first light-emitting chip 112. The second light source board 120 includes a second driving substrate 121 and a second light-emitting chip 122. The projection of the illumination area of ​​the second light-emitting chip 122 onto the first driving substrate 111 is greater than or equal to the second region 1112 to perform brightness compensation, so that the brightness of the second region 1112 is the same as or close to the brightness of the first region 1111, thereby improving or eliminating the problem of uneven backlight.

[0049] See Figure 1 and Figure 2 As shown, the first driving substrate 111 is a light-transmitting substrate, such as a glass substrate. The first light source board 110 also includes chip bonding points and conductive lines, both of which are disposed in the first region 1111 of the first driving substrate 111. The first light-emitting chip 112 is connected to the conductive lines through the chip bonding points.

[0050] The first driving substrate 111 is a light-transmitting substrate, allowing light from the second light-emitting chip 122 to pass through the second region 1112 for brightness compensation. Chip bonding points and conductive lines are disposed in the first region 1111 to prevent the conductive lines from blocking the light from the second light-emitting chip 122.

[0051] See Figure 1 and Figure 2 As shown, the backlight module 100 also includes a support layer 130, which is disposed between the first driving substrate 111 and the second driving substrate 121. The height of the support layer 130 relative to the second driving substrate 121 is greater than the height of the second light-emitting chip 122 relative to the second driving substrate 121. For example, the material of the support layer 130 may be double-sided foam adhesive, double-sided coated silicone, etc.

[0052] A support layer 130 is provided between the first driving substrate 111 and the second driving substrate 121. The height of the support layer 130 is greater than the height of the second light-emitting chip 122, so that a certain protective gap is reserved between the second light-emitting chip 122 and the first driving substrate 111, which can protect the second light-emitting chip 122. At the same time, the support layer 130 can also play a role in buffering and shock absorption, thereby preventing damage to the first driving substrate 111 and the second driving substrate 121.

[0053] It should be noted that a support layer 130 can be provided between the first driving substrate 111 and the second driving substrate 121 to protect the second light-emitting chip 122, but it is not limited to this. An encapsulation layer can also be provided on the side of the second light-emitting chip 122 away from the second driving substrate 121 to protect the second light-emitting chip 122, depending on the specific situation.

[0054] See Figure 1 and Figure 2 As shown, the support layer 130 can be a light-shielding structural layer, that is, the support layer 130 can also be made of a light-shielding material. The orthographic projection of the support layer 130 on the first driving substrate 111 is located within or coincides with the first region 1111.

[0055] The support layer 130 can be a light-shielding structure layer, which can not only reserve a certain protective gap between the second light-emitting chip 122 and the first driving substrate 111, but also block the first area 1111 to prevent the light from the second light-emitting chip 122 from shining on the first area 1111, thus improving the problem of uneven backlight.

[0056] See Figure 1 , Figure 2 and Figure 5 As shown, the first light-emitting chips 112 are arrayed on the first driving substrate 111 along the row direction and the column direction, and the spacing between adjacent first light-emitting chips 112 in the row direction and the spacing between adjacent first light-emitting chips 112 in the column direction are equal.

[0057] The spacing between adjacent first light-emitting chips 112 in the row direction and the spacing between adjacent first light-emitting chips 112 in the column direction are equal. The second area 1112 formed by the first area 1111 of four adjacent first light-emitting chips 112 is approximately a square. The shape of the second area 1112 is simpler and more regular, which makes it easier to compensate for the brightness of the second area 1112 through the second light-emitting chip 122.

[0058] See Figure 2 As shown, the shape of the first light-emitting chip 112 is similar to that of the second region 1112 or the inscribed rectangle of the second region 1112.

[0059] The shape of the second light-emitting chip 122 is the same as or similar to that of the second region 1112. Most of the light from the second light-emitting chip 122 illuminates the second region 1112, thereby improving the light utilization rate.

[0060] In some embodiments, the first light-emitting chip 112 and the second light-emitting chip 122 may further include Mini / MicroLED chips. The Mini LED chips have a size of 50 micrometers to 200 micrometers, and when bonded to the driving substrate, the gap between two adjacent Mini LED chips is 0.3 mm to 1.2 mm. The Micro LED chips have a size of less than 50 micrometers, and when bonded to the driving substrate, the gap between two adjacent Micro LED chips is less than 0.3 mm.

[0061] Mini / Micro LED chips are small in size and have small gaps between them. A large number of Mini / Micro LED chips are integrated on the driving substrate, so the backlight module 100 can be divided into multiple backlight zones, which greatly improves the screen contrast.

[0062] Example 2

[0063] The main difference between Embodiment 2 and Embodiment 1 lies in the structure of the first driving substrate 111. (See also...) Figure 6 As shown, the first driving substrate 111 is a non-transparent substrate, such as a PCB board. The second region 1112 is a light-transmitting hole of the non-transparent substrate. The first light source board 110 also includes chip bonding points and conductive lines. The chip bonding points and conductive lines are both disposed in the first region 1111 of the first driving substrate 111. The first light-emitting chip 112 is connected to the conductive lines through the chip bonding points.

[0064] The first driving substrate 111 can also be a non-transparent substrate. With this design, the first driving substrate 111 and the second driving substrate 121 can be made of the same material, thereby further reducing the manufacturing cost of the backlight module 100.

[0065] See Figure 6As shown, the second light-emitting chip 122 is located inside the light-transmitting hole, and the height of the second light-emitting chip 122 relative to the second driving substrate 121 is less than the height of the first driving substrate 111 relative to the second driving substrate 121. That is to say, the second light-emitting chip 122 does not protrude from the light-transmitting hole, so the light-transmitting hole can be used to block part of the large-angle light from the second light-emitting chip 122.

[0066] For the second light-emitting chip 122 with a large light emission angle, the backlight module 100 is prone to haloing. When used in a display device, the backlight module 100 can affect the display effect. In this embodiment, the second light-emitting chip 122 is located inside a light-transmitting hole, and the height of the second light-emitting chip 122 is less than the height of the first driving substrate 111. By using the light-transmitting hole to block part of the large-angle light from the second light-emitting chip 122, the haloing phenomenon can be improved, thereby improving the display effect of the display device.

[0067] It should be noted that when the first driving substrate 111 is a light-transmitting substrate, a light-transmitting hole can also be provided in the second region 1112 of the light-transmitting substrate, and a light-shielding layer can be provided inside the light-transmitting hole to block part of the large-angle light of the second light-emitting chip 122.

[0068] See Figure 6 As shown, the backlight module 100 also includes a light-shielding unit 140, which is disposed on the first driving substrate 111 and surrounds the first light-emitting chip 112. The height of the light-shielding unit 140 relative to the first driving substrate 111 is greater than the height of the first light-emitting chip 112 relative to the first driving substrate 111. The light-shielding unit 140 can be made of a curable adhesive, which is applied to the first driving substrate 111 and then photocured or thermocured.

[0069] The light-shielding unit 140 surrounds the first light-emitting chip 112. The height of the light-shielding unit 140 is greater than the height of the first light-emitting chip 112. Therefore, the light-shielding unit 140 can block part of the large-angle light from the first light-emitting chip 112 to improve the halo phenomenon and thus improve the display effect of the display device. At the same time, due to the structure of the double-layer light source board, the spacing between the first light-emitting chips 112 on the first driving substrate 111 is large, making it easier to manufacture the light-shielding unit 140 and avoiding the light-shielding unit 140 from blocking the top light-emitting surface of the first light-emitting chip 112.

[0070] See Figure 6 As shown, the backlight module 100 also includes a buffer layer 150, which is disposed between the first driving substrate 111 and the second driving substrate 121. The orthographic projection of the buffer layer 150 on the first driving substrate 111 is located within or coincides with the first region 1111. The buffer layer 150 has a certain degree of adhesion and flexibility, and the buffer layer 150 can be made of materials such as epoxy resin.

[0071] A buffer layer 150 is disposed between the first driving substrate 111 and the second driving substrate 121. The buffer layer 150 has a certain degree of adhesion and flexibility. On the one hand, it can connect the first driving substrate 111 and the second driving substrate 121. On the other hand, it can play a buffering and shock-absorbing role, thereby preventing damage to the first driving substrate 111 and the second driving substrate 121.

[0072] In some embodiments, the buffer layer 150 is further doped with a thermally conductive ceramic material, including one or more of alumina, beryllium oxide, aluminum nitride, and boron nitride. The thermal conductivity of the buffer layer 150 doped with thermally conductive ceramic is greater than that of the first driving substrate 111 and the second driving substrate 121. The buffer layer 150 includes a plurality of spaced buffer sheets, and the second light-emitting chip 122 is located in the gap between adjacent buffer sheets.

[0073] Thermally conductive ceramic material is doped into the buffer layer 150, giving the buffer layer 150 excellent thermal conductivity. The buffer layer 150 includes multiple spaced buffer sheets, and the second light-emitting chip 122 is located in the gap between adjacent buffer sheets. The air at the position of the buffer sheet and the side gap forms a temperature gradient, and the buffer sheet dissipates heat through the air, which enhances the heat dissipation performance of the backlight module 100 and avoids the light-emitting chip from overheating and affecting the display effect.

[0074] In some embodiments, the backlight module 100 further includes a heat-conducting layer 160, which is formed on the side of the first driving substrate 111 away from the second light source plate 120. The heat-conducting layer 160 at least covers the first light-emitting chip 112. That is, the heat-conducting layer 160 may cover the first light-emitting chip 112, the light-shielding unit 140, and the side of the first driving substrate 111 away from the second light source plate 120. The heat-conducting layer 160 may even cover the side of the second light-emitting chip 122 away from the second light source plate 120. The heat-conducting layer 160 is a light-transmitting film layer.

[0075] A heat-conducting layer 160 is provided on the side of the first light-emitting chip 112 away from the second light source plate 120, which can accelerate the heat dissipation of the first light-emitting chip 112 and enhance the thermal stability of the backlight module 100. A full-surface heat-conducting layer 160 is provided on the side of the first driving substrate 111 away from the second light source plate 120, which can accelerate the heat dissipation of the first light-emitting chip 112 and the first driving substrate 111. The light-shielding unit 140 and the light-transmitting hole make the heat-conducting layer 160 undulate, increasing the contact surface between the heat-conducting layer 160 and the air, enhancing the heat exchange between the heat-conducting layer 160 and the air, that is, enhancing the heat dissipation performance of the backlight module 100.

[0076] Example 3

[0077] The difference between Embodiment 3 and Embodiment 1 is that the arrangement of the first light-emitting chip 112 is different.

[0078] See Figure 7As shown, the first light-emitting chip 112 is disposed on the first driving substrate 111 along the row and column directions. The first light-emitting chips 112 in odd-numbered rows and even-numbered rows are staggered in the column direction, or the first light-emitting chips 112 in odd-numbered columns and even-numbered columns are staggered in the row direction. The first light-emitting chips 112 in adjacent rows or columns are staggered, and the second region 1112 formed by the four first regions 1111 is an inclined rectangle or approximately a rectangle. The second light-emitting chip 122 can be disposed in accordance with the formation of the second region 1112 and is installed at an angle.

[0079] The first light-emitting chips 112 in adjacent rows or columns are staggered, and the second area 1112 formed by the four first areas 1111 is smaller. The area where the second light-emitting chip 122 performs brightness compensation is smaller, and a lower power consumption second light-emitting chip 122 can be used, thereby reducing the manufacturing cost of the backlight module 100 and also making it more conducive to the heat dissipation of the backlight module 100.

[0080] Example 4

[0081] See Figure 4 As shown, in this embodiment, the display device includes a backlight module 100 and a display panel 200. The display panel 200 is disposed on the light-emitting side of the backlight module 100, and the backlight module 100 includes the backlight modules 100 disclosed in Embodiments 1 to 3. Furthermore, the display device may also include other necessary structures such as an optical film 300, which is disposed between the backlight module 100 and the display panel 200.

[0082] In this embodiment, the backlight module 100 includes a first light source board 110 and a second light source board 120. The first light source board 110 includes a first driving substrate 111 and a first light-emitting chip 112. The first driving substrate 111 includes a first region 1111 and a second region 1112. The first region 1111 is the area where the illumination area of ​​the first light-emitting chip 112 is projected onto the first driving substrate 111. The second region 1112 is the area outside the projection of the illumination area of ​​the first light-emitting chip 112 onto the first driving substrate 111. The second light source board 120 is disposed on the side of the first driving substrate 111 away from the first light-emitting chip 112. The second light source board 120 includes a second driving substrate 121 and a second light-emitting chip 122. The projection of the illumination area of ​​the second light-emitting chip 122 onto the first driving substrate 111 is greater than or equal to the second region 1112 to perform brightness compensation, so that the brightness of the second region 1112 is the same as or close to the brightness of the first region 1111, thereby improving or eliminating the problem of uneven backlight. Therefore, the backlight module 100 can be used in a display device to improve the display effect of the display device.

[0083] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0084] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0085] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0086] Although embodiments of this application have been shown above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A backlight module, comprising a first light source board, the first light source board including a first driving substrate and a plurality of first light-emitting chips spaced apart on the first driving substrate, characterized in that, The first driving substrate includes a first region and a second region. The first region is the area where the irradiation area of ​​the first light-emitting chip is projected onto the first driving substrate. The second region is the area other than the projected irradiation area of ​​the first light-emitting chip onto the first driving substrate. At least the second region is a light-transmitting region. The backlight module further includes a second light source board, which is disposed on the side of the first driving substrate away from the first light-emitting chip. The second light source board includes a second driving substrate and a second light-emitting chip. The second light-emitting chip is disposed on the side of the second driving substrate close to the first driving substrate. The orthographic projection of the illumination area of ​​the second light-emitting chip on the first driving substrate is greater than or equal to the second area. Multiple first light-emitting chips are disposed on the first driving substrate along the row and column directions. The spacing between adjacent first light-emitting chips in the row direction is equal to the spacing between adjacent first light-emitting chips in the column direction. The first light-emitting chips in odd-numbered rows and the first light-emitting chips in even-numbered rows are staggered in the column direction, or the first light-emitting chips in odd-numbered columns and the first light-emitting chips in even-numbered columns are staggered in the row direction and the staggered distance is less than the spacing between adjacent first light-emitting chips. The second light-emitting chips are disposed in accordance with the shape of the second area and are installed at an angle.

2. The backlight module according to claim 1, characterized in that, The first driving substrate is a light-transmitting substrate, and the first light source board further includes chip bonding points and conductive lines. The chip bonding points and the conductive lines are both disposed in the first region of the first driving substrate, and the first light-emitting chip is connected to the conductive lines through the chip bonding points.

3. The backlight module according to claim 2, characterized in that, The backlight module further includes a support layer, which is disposed between the first driving substrate and the second driving substrate. The height of the support layer relative to the second driving substrate is greater than the height of the second light-emitting chip relative to the second driving substrate.

4. The backlight module according to claim 3, characterized in that, The support layer is a light-shielding structure layer, and the orthographic projection of the support layer on the first driving substrate is located within or coincides with the first area.

5. The backlight module according to claim 1, characterized in that, The first driving substrate is a non-transparent substrate, the second area is a light-transmitting hole of the non-transparent substrate, the first light source board also includes chip bonding points and conductive lines, the chip bonding points and the conductive lines are both disposed in the first area of ​​the first driving substrate, and the first light-emitting chip is connected to the conductive lines through the chip bonding points.

6. The backlight module according to claim 5, characterized in that, The second light-emitting chip is located inside the light-transmitting hole, and the height of the second light-emitting chip relative to the second driving substrate is less than the height of the first driving substrate relative to the second driving substrate. and / or The backlight module further includes a light-shielding unit, which is disposed on the first driving substrate and surrounds the first light-emitting chip. The height of the light-shielding unit relative to the first driving substrate is greater than the height of the first light-emitting chip relative to the first driving substrate.

7. The backlight module according to claim 6, characterized in that, The backlight module further includes a buffer layer, which is disposed between the first driving substrate and the second driving substrate. The orthographic projection of the buffer layer on the first driving substrate is located within or coincides with the first area.

8. The backlight module according to claim 1, characterized in that, The shape of the second light-emitting chip is similar to that of the second region or the inner rectangle of the second region.

9. A display device, characterized in that, include: The backlight module as described in any one of claims 1 to 8; The display panel is located on the light-emitting side of the backlight module.

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