Method, electronic device and storage medium for box cascade heat dissipation design
By establishing a system air duct grading model and precise simulation of the impedance curve of the middle panel, optimize the ventilation hole design of the middle panel, solve the problem of how to quickly find solutions that meet the needs of the system in the multi -level joint heat dissipation system, and achieve efficient efficiency. The cooling design.
Patent Information
- Application Number
- CN202311576168.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-24
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2043-11-24
AI Technical Summary
In a multi-stage cascaded heat dissipation system, how to quickly find solutions that meet system needs, establish a decisive relationship between each level, and optimize the ventilation hole design of the mid-mounted panel to improve heat dissipation efficiency.
By splitting and refining the system air duct, establishing a system air duct hierarchical model, accurately simulating the impedance curve of the mid -panel, and the interior panel opening hole in the calculated impedance curve design, optimizing the ventilation hole design of the central panel.
A precise optimization of the ventilation holes of the mid -panel is achieved, the heat dissipation efficiency is improved, the design iterative time is shortened, and the efficiency of the system air duct design is improved.
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Abstract
Citation Information
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