Method for manufacturing a driving backplane

Abstract

The application discloses a kind of drive backboard manufacturing method, comprising: first metal layer is made on substrate and is patterned, form multiple drive structures, each drive structure includes two mutually spaced welding area, two transmission lines respectively communicated to one welding area, a connecting line connected between two welding areas;Detect the electrification of each drive structure, wherein two welding areas are electrically connected by connecting line;In succession, insulating layer, second metal layer, photoresist layer are made on substrate, and are respectively patterned, so that insulating layer covers each transmission line, second metal layer and photoresist layer are successively covered on welding area, and connecting line is at least partially exposed;Etching removes the exposed part of connecting line, disconnects the electrical connection between two welding areas;Remove photoresist layer.The method of the application is by setting connecting line, so that in the process of making drive backboard, detection is realized to drive structure, to improve the yield of drive backboard, to improve the yield of display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a method for manufacturing a driving backplate. Background Technology

[0002] The driver backplane is an important component of the display panel. In display panels such as Micro LED or Mini LED, the driver backplane has multiple pads and transmission lines connected to the pads. Each pad and transmission line works together to provide electrical signals to the light-emitting chips, thereby driving each light-emitting chip to emit light and realizing the display function of the display panel.

[0003] Because Micro LED or Mini LED display panels are small in size, the transmission lines are narrow, and the spacing between adjacent transmission lines is also narrow, a single transmission line may experience an open circuit, or adjacent transmission lines may short-circuit. If such defects are not effectively detected during the manufacturing process, the yield rate of the display panel will be reduced. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide a method for manufacturing a driver backplane, which detects the power supply of the driver backplane during the manufacturing process to improve the yield of the driver backplane, specifically including the following scheme:

[0005] The method for manufacturing the drive backplane in this application includes the following steps:

[0006] A first metal layer is fabricated and patterned on the plane of a substrate to form multiple driving structures; wherein each driving structure includes two soldering areas, two transmission lines, and one connecting line, the two soldering areas are spaced apart from each other, each transmission line is connected to one soldering area, and the connecting line is connected between the two soldering areas.

[0007] The electrical conductivity of each drive structure is tested, with the two welded areas electrically connected by a connecting line;

[0008] An insulating layer, a second metal layer, and a photoresist layer are sequentially fabricated on a substrate and patterned accordingly, such that the insulating layer covers each transmission line, the second metal layer and the photoresist layer are sequentially covered on the soldering area, and the connecting lines are at least partially exposed.

[0009] Etching removes the exposed portion of the connector to break the electrical connection between the two soldered areas;

[0010] Remove the photoresist layer.

[0011] The method for fabricating the driving backplane in this application involves forming multiple driving structures on a substrate, allowing each soldering area to be connected to a transmission line, and connecting each pair of soldering areas via a connecting line. This means that each driving structure forms an electrical path due to the connecting lines. By detecting the electrical conductivity of each driving structure, it is possible to detect any open or short circuits. Subsequently, an insulating layer and a second metal layer are fabricated on the substrate to achieve the main insulation of the driving backplane and the formation of pads at the corresponding soldering areas. Simultaneously, the connecting lines between the paired pads are at least partially exposed. After etching the exposed at least part of the connecting lines, an open circuit is formed between the two pads, allowing the driving backplane to drive the light-emitting chip via two spaced-apart pads.

[0012] The driving backplane manufacturing method of this application forms an electrical path in the driving structure by setting up connecting lines. Then, during the manufacturing process of the driving backplane, the structure of the transmission lines and the area of ​​the pads can be detected based on the electrical path. Before the pads and transmission lines are fully formed, the continuity of each driving circuit of the driving backplane can be detected, which facilitates the identification of defects such as open circuits and overlaps, and timely alignment and repair. This improves the yield of the driving backplane, and consequently improves the yield of the display panel and reduces the manufacturing cost of the display panel.

[0013] Optionally, detecting the energization of each driving structure includes: simultaneously detecting the energization of two adjacent driving structures, wherein the signals transmitted in the two driving structures are different, in order to detect whether there is a connection between the two adjacent driving structures.

[0014] In this implementation, the transmission lines of two adjacent driving structures are also arranged adjacently, which can easily lead to overlap. By simultaneously applying different signals to the two driving structures, it is possible to detect whether there is a short circuit or overlap in the transmission lines between the two adjacent driving structures.

[0015] Optionally, an insulating layer and a second metal layer are sequentially formed on the substrate, including: forming an insulating layer on the substrate and patterning it to form a cutout structure corresponding to each driving structure; wherein the projection of the cutout structure on the substrate accommodates two soldering areas and at least a portion of the connecting lines;

[0016] Create and pattern a second metal layer, and then cover the two solder areas with the second metal layer.

[0017] In this implementation, by setting a hollow structure, two soldering areas and at least some of the connecting lines can be exposed. Subsequently, based on the hollow structure, a second metal layer can be fabricated on each of the two soldering areas, and the second metal layer and the corresponding soldering area can form the pads in the driving structure; and, based on the hollow structure, at least some of the connecting lines can be etched to disconnect the conductivity between the two pads.

[0018] Optionally, the hollow structure includes two avoidance zones and a break zone located between the two avoidance zones. Each avoidance zone corresponds to the position of a welding zone, and the break zone is used to expose at least part of the connecting wire.

[0019] In this implementation, by setting the avoidance area of ​​the hollow structure to correspond one-to-one with the welding area, a second metal layer can be made on the two welding areas based on the avoidance area to form a pad; by setting the disconnect area to expose at least part of the connection line, it can be ensured that the connection line is accurately disconnected during the etching stage.

[0020] Optionally, the disconnect zone is connected between the two avoidance zones.

[0021] In this implementation, by setting a disconnect area between the two avoidance areas, the connection line can be etched as a whole to ensure a reliable disconnect between the two pads.

[0022] Optionally, in a plane perpendicular to the distance between the two welding zones, the width of the break zone is less than or equal to the width of the avoidance zone.

[0023] In this implementation, by setting the width of the break zone to be less than or equal to the width of the avoidance zone in a plane perpendicular to the plane between the two welding zones, the undesirable phenomenon of the break zone being too wide, causing the part outside the drive structure to be etched or exposed, can be avoided.

[0024] Optionally, the projection of the disconnected area onto the substrate accommodates the connecting lines.

[0025] In this implementation, by setting the projection of the disconnection area onto the substrate to accommodate the connecting line, it can be ensured that the connecting line is completely etched off in the direction parallel to the substrate plane, thus avoiding short circuits caused by incomplete etching of the connecting line, which would lead to poor pad conductivity.

[0026] Optionally, the projection of the avoidance area onto the welding area is flush with the edge of the welding area, or is contained within the welding area.

[0027] In this implementation, when the projected area of ​​the second metal layer on the substrate plane is larger than that of the first metal layer on the substrate plane, the second metal layer will be suspended below after etching and assembly of the light-emitting chip, which may lead to poor bonding. By setting the projection of the avoidance area of ​​the insulating layer stacked on the second metal layer onto the soldering area of ​​the first metal layer to be flush with the edge of the soldering area or contained within the soldering area, a more stable structure can be provided, avoiding damage to the driving backplane after assembly of the light-emitting chip, thereby improving the reliability and yield of the driving backplane.

[0028] Optionally, the connecting wire includes a bend, which is used to increase the resistance of the connecting wire to release static electricity.

[0029] In this implementation, static electricity is easily generated during the manufacturing process of the driver backplane. If the static electricity is not released in time, it may cause breakdown of low-resistance connecting lines or transmission lines when it accumulates to a certain level, damaging the circuit. By bending the connecting lines, the resistance of the connecting lines can be increased, thus releasing static electricity and avoiding the breakdown of transmission lines, thereby improving the yield of the driver backplane.

[0030] Optionally, the bent segment is constructed in the shape of a continuous square wave.

[0031] In this implementation, the circuit design of the continuous square waveform is simpler and can increase the resistance. By setting the bending section to form the shape of a continuous square wave, the static electricity in the circuit can be released better, reducing the risk of static electricity to the driver backplane and improving the yield of the driver backplane. Attached Figure Description

[0032] Figure 1 A schematic diagram of the planar structure of the driving backplate fabricated for this application applied to the display panel;

[0033] Figure 2 A schematic diagram of a partial planar structure of the driving backplate fabricated for this application applied to a display panel;

[0034] Figure 3 A partial cross-sectional schematic diagram of the driving backplate fabricated for this application applied to a display panel;

[0035] Figure 4 A schematic diagram of the planar structure of the drive backplane fabricated for this application, showing local transmission line open circuits and bridging short circuits.

[0036] Figure 5 This is a flowchart illustrating the workflow steps of the backplane fabrication method described in this application.

[0037] Figure 6 This is a cross-sectional schematic diagram of step S100 in the method for manufacturing the drive backplane of this application;

[0038] Figure 7 This is a schematic diagram of the planar structure of step S100 in the method for manufacturing the drive backplane of this application;

[0039] Figure 8 This is a schematic diagram of the test signal plane in step S200 of the method for manufacturing a drive backplane in this application;

[0040] Figure 9 This is a test signal waveform diagram of step S200 in the method for manufacturing a drive backplane of this application.

[0041] Figure 10 This is another test signal waveform diagram of step S200 in the method for manufacturing a drive backplane of this application;

[0042] Figure 11 This is a cross-sectional schematic diagram of step S301 in the method for manufacturing the drive backplane of this application;

[0043] Figure 12 This is a schematic diagram of the planar structure of step S301 in the method for manufacturing the drive backplane of this application;

[0044] Figure 13 This is a cross-sectional schematic diagram of step S302 in the method for manufacturing the drive backplane of this application;

[0045] Figure 14 This is a schematic diagram of the planar structure of step S302 in the method for manufacturing the drive backplane of this application;

[0046] Figure 15 This is a cross-sectional schematic diagram of step S303 in the method for manufacturing the drive backplane of this application;

[0047] Figure 16 A cross-sectional schematic diagram of step S400 in the method for manufacturing the drive backplane of this application;

[0048] Figure 17 A schematic diagram of the planar structure of step S400 in the method for manufacturing the drive backplane of this application;

[0049] Figure 18 This is a plan view of an embodiment of the hollow structure in step S301 of the method for manufacturing the drive backplate in this application.

[0050] Figure 19 This is a cross-sectional schematic diagram of an embodiment of the hollow structure in step S301 of the method for manufacturing the drive backplate of this application.

[0051] Figure 20 This is a plan view of another embodiment of the hollow structure in step S301 of the method for manufacturing the drive backplate in this application.

[0052] Figure 21This is a cross-sectional schematic diagram of another embodiment of the hollow structure in step S301 of the method for manufacturing the drive backplate of this application.

[0053] Figure 22 This is a schematic diagram of the planar structure of the second metal layer and the welding area in step S302 of the method for manufacturing the drive backplane in this application.

[0054] Figure 23 This is a cross-sectional schematic diagram of one configuration of the second metal layer and the welding area in step S302 of the method for manufacturing the drive backplate in this application.

[0055] Figure 24 This is a cross-sectional schematic diagram of another form of the second metal layer and the welding area in step S302 of the method for manufacturing the drive backplate in this application.

[0056] Figure 25 This is a schematic diagram of the planar structure of the connecting line in step S100 of the method for manufacturing the drive backplane in this application. Detailed Implementation

[0057] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0058] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. The component designations used herein, such as "first," "second," etc., are merely for distinguishing the described objects and do not have any sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages). Directional terms used in this application, such as "up," "down," "front," "rear," "left," "right," "inner," "outer," "side," etc., are merely for reference to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of this application, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application.

[0059] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising," "may include," "include," or "may include" used in this application indicate the presence of the corresponding disclosed function, operation, element, etc., and do not limit one or more other functions, operations, elements, etc. Moreover, the terms "comprising" or "include" indicate the presence of the corresponding features, number, steps, operations, elements, components, or combinations thereof disclosed in the specification, but do not exclude the presence or addition of one or more other features, number, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusion.

[0060] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0061] The specific structure and working process of the drive backplane of this application will be described in detail below with reference to the accompanying drawings.

[0062] Please see Figure 1 The diagram shown is a schematic representation of the working scenario of the drive backplane 100 in one embodiment of this application.

[0063] like Figure 1 As shown, the driving backplane 100 of this application can be used in the display panel 200, and in Figure 1 In the illustration, the display panel 200 is a Micro LED display panel. The display panel 200 also includes multiple light-emitting chips 201, each of which is mounted on the same surface of the driving backplate 100. The driving backplate 100 also has a driving chip (not shown), which is electrically connected to each light-emitting chip 201 and is used to drive each light-emitting chip 201 to emit light, thereby realizing the display function of the entire display panel 200.

[0064] Understandable, Figure 1In the illustrated embodiment, multiple light-emitting chips 201 are arranged in an array on the driving backplane 100. In other embodiments, the arrangement of the light-emitting chips 201 may also be other, and this application does not impose any particular limitation on this.

[0065] Meanwhile, each light-emitting chip 201 can be set to a different color, and the light-emitting chips 201 of different colors are arranged alternately so that the light emitted by the light-emitting chips 201 of different colors is mixed to achieve the display effect. For example, multiple light-emitting chips 201 can be set to red light-emitting chips, green light-emitting chips, and blue light-emitting chips respectively, forming a structure in which "RGB" three primary color light-emitting chips are arranged alternately. Multiple light-emitting chips 201 are also arranged in an array on the same surface of the driving backplate 100, thereby realizing the display function of the display panel 200.

[0066] In other embodiments, the number, color, and arrangement of the light-emitting chips 201 can be arbitrarily set based on the specific application scenario of the display panel 200. The light-emitting chips 201 emit different colors of light by being arranged alternately, and can mix colors to form a display effect.

[0067] Understandably, this is to clearly illustrate the structure within the display panel 200. Figure 1 The description of the driving backplane 100 and the light-emitting chips 201 is merely illustrative and does not represent the actual structure and shape of the display panel 200. That is, in other embodiments of the display panel 20 of this application, the shape and area of ​​the driving backplane 100 can be adjusted according to the actual scenario. Simultaneously, the shape, area, and spacing of each light-emitting chip 201 can also be adjusted accordingly. In actual display panel 200 products, the area of ​​each light-emitting chip 201 is typically small, and the arrangement density is typically higher.

[0068] Please see Figure 2 The diagram shown is a planar structural schematic of a drive backplane 100 provided in one embodiment of this application.

[0069] like Figure 2As shown, in this embodiment, the driving backplane 100 provided by this application includes a substrate 10, transmission lines 20, and pads 30. The substrate 10 serves as the substrate of the driving backplane 100, and the transmission lines 20 and pads 30 are fabricated on the substrate 10. The transmission lines 20 and pads 30 also jointly form the driving circuit of the driving backplane 201. Each driving circuit includes two transmission lines 20 and two pads 30 spaced apart from each other. Each transmission line 20 is connected to and conducts through one pad 30. The driving circuit is connected between the driving chip and the light-emitting chip 201. Specifically, two pins of the light-emitting chip 201 can be fixed and conducted through one pad 30, and the end of the transmission line 20 away from the pad 30 is electrically connected to the driving chip, thereby allowing the driving chip to transmit driving signals to the light-emitting chip 201, so as to control the corresponding light-emitting chip 201 to emit light through the driving circuit.

[0070] Please see Figure 3 The diagram shows a cross-sectional view of the drive backplane 100 corresponding to a single light-emitting chip 201 for the display panel 200 shown.

[0071] like Figure 3 As shown, the driving backplane 100 includes a substrate 10, a transmission line 20, a pad 30, and an insulating layer 40. The transmission line 20 and the pad 30 are both mounted on the substrate 10. The transmission line 20 is located between the substrate 10 and the pad 30, and is used to connect the driving chip and the pad 30 to form a driving circuit. The side of the transmission line 20 facing away from the substrate 10 is covered by the insulating layer 40, which protects the transmission line 20. The pad 30 is exposed relative to the insulating layer 40 and is used to connect to the light-emitting chip 201, thereby turning on the light-emitting chip 201.

[0072] Please see back Figure 2 In this embodiment, the display panel 200 is relatively small, and the transmission lines 20 are not only narrow in width but also have a narrow spacing between adjacent transmission lines 20. The transmission lines 20 are densely arranged, and during the manufacturing process, defects such as open circuits (a single transmission line 20 is broken) or overlaps (a short circuit between two adjacent transmission lines 20) can occur. These open circuits or overlaps can obstruct or cause crosstalk in the driving signals of the light-emitting chip 201, thereby affecting the display effect of the display panel 200.

[0073] Please see Figure 4 ,like Figure 4 As illustrated at point A, due to the close proximity of adjacent transmission lines 20, overlap may occur during manufacturing, causing crosstalk between the drive circuits. For example... Figure 4 As shown at point B, a single transmission line 20 experiences a break due to its narrow width, preventing the transmission of drive signals between the corresponding light-emitting chip 201 and the driver chip.

[0074] During the manufacturing process of the drive backplane 100, according to Figure 3 As shown, the two pads 30 are relatively insulated from each other in order to transmit drive signals. During the fabrication of the drive backplane 100, all drive circuits are in an open-circuit state. Without effective detection methods, it is difficult to detect issues such as… Figure 4 The defects shown are short circuits or open circuits. If short circuits or open circuits occur after the light-emitting chip 201 is installed, it is difficult to distinguish whether the defect occurs on the light-emitting chip 201 or on the driver backplane 100. Furthermore, the method to correct the defect is too complicated, and some defects are irreparable, which reduces the product yield of the driver backplane 201 or the display panel 200.

[0075] Please see Figure 5 The diagram shows a workflow diagram of the manufacturing method of the drive backplane 100 of this application.

[0076] like Figure 5 As shown, the manufacturing method of the drive backplane 100 of this application includes the following steps:

[0077] S100. A first metal layer 20a is fabricated on the plane of the substrate 10 and patterned thereon to form a plurality of driving structures 12. Each driving structure 12 includes two soldering areas 22, two transmission lines 20, and one connecting line 21. The two soldering areas 22 are spaced apart from each other. Each transmission line 20 is connected to one soldering area 22, and the connecting line 21 is connected between the two soldering areas 22.

[0078] For details, please refer to Figure 6 and Figure 7 . Figure 6 To illustrate the cross-sectional view of the drive structure 12 fabricated on the substrate 10, Figure 7 This is a planar structural diagram of the drive structure 12 fabricated on the substrate 10. (See diagram below.) Figure 6 As shown, the substrate 10 has a first surface 11. A first metal layer 20a is formed on the first surface 11. The first metal layer 20a can be patterned and etched using photolithography or etching techniques to form the driving structure 12. Figure 7 As shown, each drive structure 12 includes two welding areas 22, two transmission lines 20, and one connecting line 21. The two welding areas 22 are spaced apart to allow the subsequent second metal layer 30a to form corresponding areas in the welding areas 22. Figure 2 The structure of the middle pad 30. Two transmission lines 20 correspond to... Figure 2 The transmission line 20 described herein connects to a soldering area 22, and the end of each transmission line 20 furthest from the soldering area 22 can be used to connect to... Figure 1 and Figure 2The driver chip involved in the drive backplane 100. A connecting line 21 is also provided between the two spaced soldering areas 22. The two ends of the connecting line 21 are respectively connected to one soldering area 22, so that the two transmission lines 20 are interconnected by passing through one soldering area 22, the connecting line 21 and the other soldering area 22 in sequence, that is, an electrical path is formed between the two transmission lines 20.

[0079] S200, Detect the energization of each drive structure 12, wherein the two welding areas 22 are electrically connected by a connecting line 21;

[0080] Specifically, in this step, by detecting the power supply of each drive structure 12, it is possible to detect whether there are any short circuits or open circuits in each drive structure 12.

[0081] For example, in each drive structure 12, an electrical signal is transmitted from the far end of one transmission line 20 to the far end of another conducting transmission line 20, where an electrical signal can be received. By detecting whether this electrical signal is effectively received, it can be determined whether the drive structure 12 has an open-circuit defect. It is understood that if an electrical signal is received at the far end of the other transmission line 20 and this signal matches the input electrical signal, it can be determined that the drive structure 12 does not have an open-circuit defect.

[0082] Please see Figure 8 For a single drive structure 12, the signal is transmitted from the far end of a transmission line 20 as follows: Figure 9 The electrical signal Signal1 shown in part a, if the electrical signal Signal1′ received from the far end of another transmission line 20 is as follows: Figure 9 As shown in part b, this indicates that the drive structure 12 does not have an open circuit. If the electrical signal Signal1′ received from the far end of another transmission line 20 is as follows... Figure 9 As shown in section c, this indicates that the drive structure 12 has an open circuit.

[0083] The method described in this application can also employ another detection method, such as:

[0084] S201. Detect the energization of each drive structure 12, including: simultaneously detecting the energization of two adjacent drive structures 12, and the signals transmitted in the two drive structures 12 are different, so as to detect whether there is a connection between the two adjacent drive structures 12.

[0085] Specifically, between two adjacent drive structures 12, different electrical signals can be transmitted simultaneously, and these different electrical signals can be received at the far end of their respective corresponding transmission lines 20 to observe whether the corresponding electrical signals can be received at the far end of the corresponding transmission lines 20. If the received electrical signals overlap or the received electrical signals are from the far end of another transmission line 20, that is, if the received electrical signals are subject to interference, it indicates that there is overlap between the adjacent transmission lines 20 in the two adjacent drive structures 12.

[0086] Please see back Figure 8 The transmission line 20 of one of the two adjacent drive structures 12 is used to deliver, for example, the transmission line 20 of one of the ... Figure 10 The electrical signal Signal1 shown in part a sends a signal to another driving structure 12, such as... Figure 10 The electrical signal Signal2 shown in part b, if the electrical signal Signal2′ received from the far end of its transmission line 20 is as follows: Figure 10 As shown in section c, this indicates that there is no overlap between the two adjacent drive structures 12. If the electrical signal Signal2′ received from the far end of its transmission line 20 is as follows... Figure 10 If it is shown as a or d, it indicates that the electrical signal has been interfered with, and it can be further determined that there is a short circuit between the two adjacent drive structures 12.

[0087] S300, an insulating layer 40, a second metal layer 30a, and a photoresist layer 50 are sequentially fabricated on the substrate and patterned respectively, so that the insulating layer 40 covers each transmission line 20, the second metal layer 30a and the photoresist layer 50 are sequentially covered on the soldering area 22, and the connecting line 21 is at least partially exposed.

[0088] For details, please refer to Figure 11 and Figure 12 Combining Figure 11 and Figure 12 As shown, an insulating layer 40 is fabricated on the substrate 10. The insulating layer 40 covers each transmission line 20 on the first metal layer 20a to protect the transmission lines 20 and achieve main body insulation of the drive backplane 100. After patterning and etching, the insulating layer 40 needs to expose the structure of the soldering areas 22 and the connecting lines 21. Alternatively, after patterning, the insulating layer 40 forms a hollow structure 41. The projection of the hollow structure 41 on the substrate 10 accommodates two soldering areas 22 and the connecting lines 21 connecting the two soldering areas 22. That is, the position of the hollow structure 41 on the insulating layer 40 needs to correspond to the positions of the two soldering areas 22 and the connecting lines 21 to expose the two soldering areas 22 and the connecting lines 21.

[0089] That is, this step may also include the following sub-steps:

[0090] S301. An insulating layer 40 is formed on the substrate 10 and patterned thereon to form a cutout structure 41 corresponding to each driving structure 12; wherein the projection of the cutout structure 41 on the substrate 10 accommodates two soldering areas 22 and at least a portion of the connecting lines 21.

[0091] It should be noted that, Figure 12 The hollow structure 41 is only described as an example and does not represent the actual structure and shape of the hollow structure 41. That is, in other embodiments, the hollow structure 41 can be adjusted according to actual needs.

[0092] S302. Fabricate and pattern the second metal layer 30a, and make the second metal layer 30a cover the two welding areas 22 respectively.

[0093] like Figure 13 and Figure 14 As shown, a second metal layer 30a is fabricated on the substrate 10. After patterning, the second metal layer 30a covers the two aforementioned soldering areas 22, exposing at least a portion of the connecting lines 21. That is, the position of the second metal layer 30a corresponds to the position of the two soldering areas 22. The second metal layer 30a is used to form together with its corresponding soldering area 22. Figure 2 The structure of the pad 30 shown, namely the structure of two second metal layers 30a, is combined with the structure of a solder area 22 to form as shown. Figure 2 The diagram shows the structure of two spaced-apart pads 30. A connecting line 21 connects the two pads 30 and conducts electricity between them.

[0094] It should be noted that, in one interpretation, the pad 30 comprises two layers: the metal structure of the soldering area 22 and the metal structure of the second metal layer 30a. The two metal layers are interconnected to form the pad 30. The layer of the pad 30 closest to the substrate 10 (i.e., the soldering area 22) is connected to the transmission line 20, while the layer of the pad 30 away from the substrate 10 (i.e., the second metal layer 30a) is exposed relative to the insulating layer 40.

[0095] In another interpretation, the pad 30 can be understood as consisting of only one layer (i.e., the second metal layer 30a), while the other layer (soldering area 22) is constructed as part of the transmission line 20. In this case, one side of the pad 30 is connected to the transmission line 20 (i.e., soldering area 22), and the other side (i.e., the second metal layer 30a) is exposed relative to the insulating layer 40 (e.g., ...). Figure 3 (As shown).

[0096] Understandably, in both of the above interpretations, the transmission line 20 can be considered to be connected to the pad 30, and one side of the pad 30 is exposed relative to the insulating layer 40. Furthermore, neither of these interpretations affects the functional implementation of the drive backplane 100 of this application.

[0097] S303, Fabrication of the structure of photoresist layer 50.

[0098] Specifically, such as Figure 15 As shown, a photoresist layer 50 is fabricated and patterned on the substrate 10. The photoresist layer 50 covers the second metal layer 30a, and its position corresponds to the position of the pad 30. The photoresist layer 50 is used to cover the pad 30. The photoresist layer 50 is used to protect the second metal layer 30a and its corresponding soldering area 22 from forming the structure of the pad 30. Since the second metal layer 30a exposes at least a portion of the connection line 21, the photoresist layer 50 corresponding to the second metal layer 30a also exposes at least a portion of the connection line 21.

[0099] It should be noted that, for the sake of clarity in illustrating the various structures within the drive backplane 100, in Figure 12 and Figure 14 The transmission line 20 covered by the insulation layer 40 is shown in dashed lines, but this does not represent a change in the structure of the transmission line 20.

[0100] S400, Etching to remove the exposed portion of the connecting line 21 to disconnect the electrical connection between the two solder areas 22;

[0101] like Figure 16 and 17 As shown, an over-etching process can be used to... Figure 15 The exposed structure of the connecting line 21 is removed. That is, in this step, the connecting line 21 connecting the two pads 30 is etched off, thereby disconnecting the signal transmission function of the connecting line 21 and forming a structure as shown in the figure. Figure 2 The diagram shows the structure of two spaced-apart pads 30. It is understood that the two pads 30 are spaced apart and there is no circuit between them; that is, the two spaced-apart pads 30 are relatively insulated from each other. Thus, the drive backplane 100 can drive the light-emitting chip 201 through the two relatively insulated pads 30.

[0102] S500, Remove photoresist layer 50.

[0103] Specifically, the corresponding photoresist can be removed. Figure 16 The photoresist layer 50 covering the second metal layer 30a in the photoresist layer 50 is removed (e.g. Figure 16 As shown), to complete the structure of exposed pad 30, and form as shown Figure 2 The structure of the drive backplane 100 of this application is shown.

[0104] Understandably, in the manufacturing method of the drive backplane 100 provided in this application, by setting the connecting line 21, the two pads 30 that are spaced apart from each other can be made conductive during the manufacturing process. At this time, the drive circuit composed of the transmission line 20 and the pads 30 forms an electrical path under the connection of the connecting line 21. Thus, the method of this application can realize the continuity detection step of the drive backplane 100 during the manufacturing process of the drive structure 12.

[0105] Meanwhile, through the manufacturing method of the drive backplane 100 of this application, the continuity of each drive circuit of the drive backplane 100 can be detected before the pads 30 and transmission lines 20 are fully formed, so as to find out the defects such as open circuits and overlaps and repair them in time, thereby improving the yield of the drive backplane 100 and thus improving the yield of the display panel 200.

[0106] In one embodiment, the hollow structure 41 formed by the patterning of the insulating layer 40 includes two recessed areas 411 and a break area 412 located between the two recessed areas 411. Each recessed area 411 is positioned corresponding to a welding area 22, and the two recessed areas 411 are arranged in a spaced-apart manner. The break area 412 is used to expose at least a portion of the connecting wire 21.

[0107] like Figure 18 and 19 As shown, in this embodiment, each cutout structure 41 includes two avoidance areas 411 and one break area 412, with the break area 412 located between the two avoidance areas 411. Each avoidance area 411 can be configured to have the same size and shape as its corresponding welding area 22. By providing avoidance areas 411 in the cutout structure 41 that correspond one-to-one with the welding areas 22, the welding areas 22 are accurately exposed. Under the constraint of the avoidance areas 411, when fabricating the second metal layer 30a, the second metal layer 30a is accurately positioned on the corresponding welding area 22 to jointly form the structure of the solder pad 30. The break area 412 is positioned between the two avoidance areas 411, that is, the two avoidance areas 411 are located on opposite sides of the break area 412. By providing a break area 412 on the insulating layer on the side of the connecting line 20 away from the substrate 10, and correspondingly forming an opening on the surface of the connecting line 21 to expose at least part of the connecting line 21, it can be ensured that the connecting line 21 is reliably etched off during the etching stage of step S400.

[0108] In one embodiment, the disconnection zone 412 is connected between two avoidance zones 411.

[0109] like Figure 20 and 21As shown, in this embodiment, the avoidance areas 411 arranged on opposite sides of the disconnection area 412 are connected through the disconnection area 412. Alternatively, the length of the disconnection area 412 in the first direction 001 is equal to the distance between the two avoidance areas 411, that is, the length of the disconnection area 412 in the first direction 001 is equal to the distance between the two spaced-apart pads 20. It can be understood that by setting the disconnection area 412 connecting the two avoidance areas 411, a complete etching effect can be achieved on the connecting line 21, ensuring a reliable disconnection between the two pads 30.

[0110] In one embodiment, in a plane direction perpendicular to the two welded areas 22 spaced apart from each other, the width of the break area 412 is less than or equal to the width of the avoidance area 411.

[0111] like Figure 21 As shown, in this embodiment, in the plane direction perpendicular to the interval between the two welding areas 22, the width of the break area 412 is less than or equal to the width of the avoidance area 411. This can be described as the length of the break area 412 in the second direction 002 being less than or equal to the length of the avoidance area 411. Therefore, it avoids the break area 412 being too large in the second direction 002, which could cause the portion outside the drive structure 12 to be etched or exposed, thus affecting the quality of the drive backplate 100.

[0112] In one embodiment, the projection of the disconnection area 412 onto the substrate 10 accommodates the connecting line 21.

[0113] In this embodiment, by setting the projection of the disconnection area 412 on the substrate 10 to accommodate the connecting line 21, it can be ensured that the connecting line 21 is completely etched off in the direction parallel to the plane of the substrate 10. This avoids the phenomenon that the driving circuit is short-circuited due to the connecting line 21 not being completely etched off after the driving backplate 100 is manufactured, resulting in poor conduction of the pad 30, and thus reducing the yield of the driving backplate.

[0114] In one embodiment, the projection of the avoidance area 411 onto the welding area 22 is flush with the edge of the welding area 22 or contained within the welding area 22.

[0115] In this embodiment, when the projected area of ​​the second metal layer 30a on the plane of the substrate 10 is greater than the projected area of ​​the first metal layer 20a on the plane of the substrate 10, or as described, the projected area of ​​the second metal layer 30a covering the solder area 22 on the substrate 10 is greater than the projected area of ​​its corresponding solder area 22 on the substrate 10, after the etching is completed and the light-emitting chip 201 is assembled, the area of ​​the second metal layer 30a will be larger than the area of ​​the solder area 22 (e.g., Figure 22 As shown), therefore, in Figure 23In the illustration, a suspended structure is formed below the second metal layer 30a, which in turn affects the stability of the pad 30 structure formed by the second metal layer 30a and the welding area 22.

[0116] Understandably, when the light-emitting chip 201 is subsequently bonded to the driving backplane 100 of this application, the suspended structure below the second metal layer 30a is relatively weakly stressed and may collapse, resulting in poor bonding between the driving backplane 100 and the light-emitting chip 201. Because the avoidance region 411 is used to form the pad 30 structure together with the second metal layer 30a and the corresponding soldering region 22, by setting the projection of the avoidance region 411 of the insulating layer 40 stacked on the first metal layer 20a onto the soldering region 22 of the first metal layer 20a to be flush with the edge of the soldering region 22 or contained within the soldering region 22, it can be ensured that the area of ​​the second metal layer 30a is smaller than the area of ​​the soldering region 22. That is, the structure of the pad 30 formed by the avoidance region 411 and the soldering region 22 is as follows... Figure 24 As shown, no suspended structure is formed below the second metal layer 30a, thus providing a more stable structure for the pad 30, avoiding damage to the driving backplane 100 after the light-emitting chip 201 is assembled, thereby improving the reliability and yield of the driving backplane 100.

[0117] In one embodiment, the connecting wire 21 includes a bend 211, which is used to increase the resistance of the connecting wire 21 to release static electricity.

[0118] In this embodiment, static electricity is easily generated during the manufacturing process of the drive backplane 100. If the static electricity is not released in time, when the static electricity accumulates to a certain level, it may cause a breakdown of the connection line 21 or transmission line 20 with a small resistance value. This may cause the test results to be distorted due to the open circuit of the connection line 21 during the detection process of step S200, or cause the drive circuit of the drive backplane 100 to be open after the transmission line 20 is damaged.

[0119] like Figure 25 As shown, during the fabrication of the drive structure 12, the connecting line 21 between the two spaced welding areas 22 is bent to form a bent section 211. This increases the resistance of the connecting line 21, creating an electrostatic discharge effect, thereby preventing the transmission line 20 from being damaged and improving the yield of the drive backplane 100.

[0120] In one embodiment, the bent segment 211 is configured as a continuous square wave shape.

[0121] like Figure 25As shown, in this embodiment, the bent section 211 of the connecting line 21 is configured as a continuous square wave. On the one hand, the circuit of the continuous square wave is not only simpler to design and easier to manufacture, but also increases the resistance of the connecting line 21. It can be understood that by configuring the bent section 211 as a continuous square wave, static electricity in the circuit can be better released, reducing the risk of static electricity to the drive backplane 100 and improving the yield of the drive backplane 100.

[0122] Of course, the above-described embodiments can be applied individually or in combination. The above description is the preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. A method for manufacturing a drive backplane, characterized in that, Includes the following steps: A first metal layer is fabricated and patterned on a plane of a substrate to form multiple driving structures; wherein each driving structure includes two soldering areas, two transmission lines, and one connecting line, the two soldering areas are spaced apart from each other, each transmission line is connected to one of the soldering areas, and the connecting line is connected between the two soldering areas. The energization of each of the drive structures is detected, wherein the two welding areas are electrically connected through the connecting line; An insulating layer, a second metal layer, and a photoresist layer are sequentially fabricated on the substrate and patterned accordingly, such that the insulating layer covers each of the transmission lines, the second metal layer and the photoresist layer sequentially cover the soldering area, and the connecting lines are at least partially exposed. Etching is used to remove the exposed portion of the connector to disconnect the electrical connection between the two solder areas; Remove the photoresist layer.

2. The method for manufacturing a drive backplane as described in claim 1, characterized in that, The detection of the energization of each of the driving structures includes: Simultaneously, the power supply of two adjacent drive structures is detected, and the signals transmitted in the two drive structures are different, so as to detect whether there is a connection between the two adjacent drive structures.

3. The method for manufacturing a drive backplane as described in claim 1, characterized in that, The step of sequentially fabricating an insulating layer and a second metal layer on the substrate includes: An insulating layer is formed on the substrate and patterned thereon to form a cutout structure corresponding to each of the driving structures; wherein the projection of the cutout structure on the substrate accommodates the two soldering areas and at least a portion of the connecting lines; The second metal layer is fabricated and patterned, such that the second metal layer covers the two welding areas respectively.

4. The method for manufacturing the drive backplane as described in claim 3, characterized in that, The hollow structure includes two clearance areas and a break area located between the two clearance areas. Each clearance area is positioned corresponding to one of the welding areas. The break area is used to expose at least a portion of the connecting line.

5. The method for manufacturing a drive backplane as described in claim 4, characterized in that, The disconnection zone connects the two avoidance zones.

6. The method for manufacturing a drive backplane as described in claim 4, characterized in that, In a plane perpendicular to the two welded areas that are spaced apart from each other, the width of the break zone is less than or equal to the width of the avoidance zone.

7. The method for manufacturing a drive backplane as described in claim 4, characterized in that, The projection of the disconnected area on the substrate accommodates the connecting line.

8. The method for manufacturing a drive backplane as described in claim 4, characterized in that, The projection of the avoidance area onto the welding area is flush with the edge of the welding area, or is contained within the welding area.

9. The method for manufacturing a drive backplane as described in claim 1, characterized in that, The connecting wire includes a bent section, which is used to increase the resistance of the connecting wire to release static electricity.

10. The method for manufacturing a drive backplane as described in claim 9, characterized in that, The bent segment is constructed in the shape of a continuous square wave.

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