Apparatus and method for mounting components on a substrate

Abstract

The invention relates to an apparatus and method for mounting components on a substrate. The apparatus comprises a bonding head with a component gripper, a first drive system for moving a carrier through a relatively long distance, a second drive system attached to the carrier for moving the bonding head back and forth between a nominal working position and a standby position, a drive member or a rotary drive member, the drive member being attached to the bonding head for rotating the component gripper, the rotary drive member being for rotating the substrate around an axis, at least one substrate camera, and at least one component camera. The second drive system is also designed to perform high-precision correction movements with the bonding head, or a third drive system is provided for performing high-precision correction movements with the substrate. At least one reference mark is attached to the bonding head or the component gripper.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 201810391562.1, which was filed on April 27, 2018, entitled "Apparatus and Method for Mounting Components on a Substrate". Technical Field

[0002] This invention relates to apparatus and methods for mounting components (typically electronic or optical components, particularly semiconductor chips and flip chips) onto a substrate. In this field, this mounting is also referred to as a bonding process or assembly process. Background Technology

[0003] This type of equipment is particularly used in the semiconductor industry. Examples of such equipment are die bonders or pick-and-place machines, with which components in the form of semiconductor chips, flip chips, micromechanical, micro-optical, and electro-optical parts are deposited and bonded onto substrates (such as leadframes, printed circuit boards, ceramics, etc.). The component is picked up by a bonding head at the pick-up position, specifically sucked in, moved to a precisely defined location on the substrate, and deposited onto the substrate. The bonding head is part of a pick-and-place system capable of moving the bonding head in at least three spatial directions. For the component to be accurately positioned on the substrate, the precise positioning of the component held by the bonding head relative to the positioning axis of the bonding head and the precise positioning of the substrate location must be determined.

[0004] Commercially available installation equipment achieves a positioning accuracy of 2 to 3 micrometers under optimal conditions, with a standard deviation of 3 sigma. Summary of the Invention

[0005] The purpose of this invention is to develop an apparatus and method that achieves higher placement accuracy compared to existing technologies.

[0006] The device according to the invention includes: a coupling head having a component holder; a first drive system for moving a bracket over a relatively long distance; a second drive system attached to the bracket for reciprocating movement of the coupling head between a nominal working position and a standby position; a drive member or rotary drive member attached to the coupling head for rotating the component holder, the rotary drive member for rotating the substrate about an axis extending perpendicular to the substrate surface; at least one substrate camera attached to the bracket; and at least one component camera. The coupling head or the component holder includes at least one reference mark, the at least one reference mark being used by both the at least one component camera and the at least one substrate camera to determine the position of the component relative to the coupling head or the position of the coupling head relative to the substrate location. The substrate includes at least one substrate mark, and the component includes at least one component mark or a structure suitable for serving as a component mark.

[0007] The first drive system is used to move the bonding head a relatively long distance with relatively low positioning accuracy. The second drive system is used to move the bonding head back and forth between a nominal working position and a standby position. In the nominal working position, the bonding head covers the substrate mark attached to the substrate, and thus temporarily moves to the standby position, in which the bonding head no longer covers the substrate mark, allowing the substrate camera to capture an image of the substrate mark. The second drive system is preferably also used to move the bonding head a relatively small distance with very high positioning accuracy, i.e., to perform a high-precision correction movement of the bonding head. Alternatively, a third drive system may be provided to perform a high-precision correction movement of the substrate.

[0008] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one or more embodiments of the invention and, together with the detailed description, serve to explain the principles and implementation of the invention. These drawings are not drawn to scale. Attached Figure Description

[0009] Figure 1 A first embodiment of the apparatus for mounting components on a substrate according to the present invention is illustrated schematically.

[0010] Figure 2 A second embodiment of the apparatus for mounting components on a substrate according to the present invention is schematically illustrated, and

[0011] Figure 3-5 A snapshot taken during the assembly process according to the invention is shown. Detailed Implementation

[0012] Figure 1A first embodiment of the apparatus for mounting a component 1 on a substrate 2 according to the present invention is schematically shown. The substrate 2 includes at least one substrate mark 23. Figure 3 Component 1 is particularly a flip chip, but also includes other semiconductor chips. Component 1 can also be electronic, optical, electro-optical, or any other component to be mounted with micrometer or submicrometer precision.

[0013] The mounting device includes: a coupling head 3; a feed unit 4 for supplying component 1; a means 5 for feeding and providing substrate 2; a first drive system 6 for a bracket 7; and a second drive system 8 for the coupling head 3. The second drive system 8 is attached to the bracket 7. The device also includes at least one component camera 9 and at least one substrate camera 10. The substrate camera 10 is attached to the bracket 7. The coupling head 3 includes a component holder 11 rotatable about axis 12. Hereinafter, the component held by the coupling head 3 is referred to as component 1a. The component holder 11 is, for example, a vacuum-operated suction element for drawing component 1a into the air.

[0014] Feed unit 4 includes, for example, a wafer stage that provides a plurality of semiconductor chips; and a flip-chip device that removes the semiconductor chips one by one from the wafer stage and provides the semiconductor chips as flip chips for transfer to bonding head 3. Feed unit 4 may also be a feed unit that provides flip chips or other components one by one for transfer to bonding head 3.

[0015] The connecting head 3 or component holder 11 includes at least one reference mark 13 ( Figure 3Advantageously, it includes at least two reference marks 13, enabling the detection and correction of displacement of component 1a held by component holder 11 of the coupling head 3 and rotation of component 1a from its set position. One or more reference marks 13 are mounted on the coupling head 3 or component holder 11 in such a way that when the coupling head 3 is located in the field of view of component camera 9 or multiple fields of view of multiple component cameras 9 and is correspondingly visible in the image supplied by substrate camera 10 or multiple images supplied by multiple substrate cameras, the one or more reference marks 13 are visible in the image supplied by component camera 9 or multiple images supplied by multiple substrate cameras 9. The one or more reference marks 13 are formed, for example, in a cross shape in a hole in the component holder 11, preferably they are formed on a glass sheet in the form of a chrome structure. The glass is transparent, such that the reference marks 13 are visible from above and from below and therefore from all cameras 9 and 10. Preferably, glass with a very low coefficient of thermal expansion is selected. The thickness of the glass plate is advantageously selected such that at a specific height above the bonding head 3 above the substrate 2, both the reference mark 13 and the substrate mark 23 are imaged with sufficient sharpness in the image captured by the substrate camera 10, i.e., both the reference mark 13 and the substrate mark 23 are within the field depth of the substrate camera 10.

[0016] The first drive system 6 is used to transport the coupling head 3 over a considerable distance, i.e., from the component removal position to the substrate 2. At the component removal position, the coupling head 3 carries the component 1 to be installed from the feed unit 4 to the substrate 2. At the substrate 2, the coupling head 3 places the component 1a on the substrate surface of the substrate 2. The positional accuracy requirement for the first drive system 6 is relatively moderate; typically, a positional accuracy of + / - 10 μm is sufficient. The first drive system 6 is designed, for example, as a so-called "gantry" with two or more mechanically highly stable axes of motion. The two axes of motion of the first drive system 6 allow the carriage 7 to move in two horizontal directions that extend perpendicularly to each other.

[0017] The vertical movement of the head 3, which removes component 1 from the feed unit 4 and places component 1a on the substrate of the substrate 2, can be accomplished in different ways, for example...

[0018] --The first drive system 6 includes a third height-stabilized axis of motion for the vertical movement of the bracket 7.

[0019] --The second drive system 8 includes additional high-precision drive components for the up-and-down movement of the coupling head 3.

[0020] --The coupling head 3 includes a high-precision drive for the up-and-down movement of the component holder 11, which is advantageously supported by an air bearing or a ball bearing.

[0021] The device may contain only one, two, or all three of the aforementioned motion / drive axes for vertical movement.

[0022] The second drive system 8 is used, on the one hand, to move the coupling head 3 to a standby position as described in more detail below, and on the other hand, to achieve high-precision calibrated movement of the coupling head 3 in two different horizontal directions. The second drive system 8 includes: a first drive member for moving the coupling head 3 along a first direction designated as u; and a second drive member for moving the coupling head 3 along a second direction designated as v. Directions u and v continue in the horizontal direction and are preferably orthogonal to each other. The coupling head 3 optionally includes a drive member 14 for rotating the component holder 11 about axis 12. The means 5 for feeding and providing the substrate 2 may include a rotation drive member 15 to rotate the substrate 2 about an axis extending orthogonally to the surface of the substrate 2, so as to alternately eliminate any angular errors in this manner.

[0023] The component camera 9 or the plurality of component cameras 9 are used to detect the position of component 1a relative to one or more reference marks 13. The substrate camera 10 or the plurality of substrate cameras 10 are used to detect the positioning of the substrate on which component 1a will be placed relative to one or more reference marks 13. Each component camera 9 and each substrate camera 10 includes an image sensor 17 and optics 18. Figure 3 The optics 18 of the (one or more) substrate camera 10 include, for example, two deflection mirrors 19.

[0024] One or more component cameras 9 are, for example, fixedly arranged on the equipment, and the coupling head 3 is moved from the component removal position to the substrate location above the component cameras 9 during its journey, and preferably, but not necessarily, stops capturing one or more images. The component cameras 9 may alternatively be attached to the bracket 7. For example, the component cameras 9 or the coupling head 3 are attached to the bracket 7 via a retractable and extendable rotary mechanism. Then, while moving from the component removal position to the substrate location, the component cameras 9 or the coupling head 3 retract to the image capture position respectively, such that one or more images from each component camera 9 can be captured during the movement. For removing component 1 from the feed unit 4 and for recording images with the substrate cameras 10 and for depositing component 1a, the component cameras 9 extend into the standby position and the coupling head 3 extends into its working position.

[0025] Compared to the range of motion of the first drive system 6, the range of motion of the second drive system 8 is relatively small, even very small. The second drive system 8 must be able to move the coupling head 3 from its nominal working position to its standby position, where, on the one hand, the substrate mark 23 is not covered by the coupling head 3, and on the other hand, it must be able to achieve high-precision calibrated movement of the coupling head 3 in two different horizontal directions. For this purpose, it is sufficient if the range of motion of the second drive system 8 is relatively long in one horizontal direction and very short in the other. The range of motion in one direction is typically tens of millimeters, such as 20mm or 30mm or more, while the range of motion in the other direction is typically (only) a few micrometers.

[0026] The nominal working position of the coupling head 3 is a position that differs slightly from the final position it occupies in the final step of the assembly process. The accuracy requirement for the nominal working position is relatively low because any deviation from the nominal working position will be automatically compensated for later during the assembly process.

[0027] The device is configured to lower the bracket 7 and / or the coupling head 3 and / or the component holder 11 to an extremely low height, typically only 50-200 μm above the substrate surface, before capturing images of the substrate marker 23 using one or more substrate cameras 10. By doing so, the movement of the component 1a only after determining its actual position relative to its designated location on the substrate site and after performing a high-precision correction movement is achieved, and the movement is solely a downward movement of the bracket 7 and / or the coupling head 3 and / or the component holder 11, and this distance is so short that any displacement in the u and v directions during this downward movement is within the submicron range.

[0028] From the moment the bracket 7 reaches its position within the region of the substrate 2, the position of (one or more) substrate cameras 10 relative to the substrate 2 remains unchanged. From this point onward, only the position of the coupling head 3 changes by means of the second drive system 8. Therefore, the position of (one or more) reference marks 13 can be monitored until component 1a is placed on the substrate 2, and any new deviations from its set position that may occur during the final descent phase of component 1a can be corrected. Thus, these components can be mounted with unprecedented precision in the sub-micron range.

[0029] Figure 2A second embodiment of the device according to the invention is shown. The second embodiment is generally similar to the first embodiment, but the essential difference lies in that the second drive system 8 is designed to move the coupling head 3 back and forth between a nominal working position and a standby position, but not for high-precision correction movement, and the device 5 for feeding and providing the substrate 2 includes a third drive system 16 that enables the substrate 2 to perform high-precision correction movement in at least two different horizontal directions. The second drive system 8 can therefore move the coupling head 3 only in a single direction extending parallel to the surface of the substrate 2. However, the second drive system 8 can also optionally be designed to raise and lower the coupling head 3, i.e., move the coupling head 3 in a direction extending perpendicular to the surface of the substrate 2. However, in this embodiment, high-precision correction movement is performed in a plane extending parallel to the surface of the substrate 2 by the third drive system 16. The third drive system 16 includes: a first drive member for moving the substrate 2 along a first direction (again designated as the u direction); and a second drive member for moving the substrate 2 along a second direction (again designated as the v direction). Directions u and v continue in the horizontal direction and are preferably orthogonal to each other. The third drive system 16 may optionally also include a rotary drive 15, which allows the substrate 2 to rotate about an axis perpendicular to the surface of the substrate 2 in order to eliminate any angular errors.

[0030] Using this device, similar high positioning accuracy can be achieved even during the final stage of the descent of component 1a, eliminating the need to check for another correction movement of substrate 2 that may still be necessary and performed in order to achieve the correction result.

[0031] The installation of component 1 will now be explained in detail. The installation method according to the present invention includes the following steps A to O. These steps may be performed in different orders.

[0032] A) Pick up part 1 from feed unit 4 using part holder 11.

[0033] B) The bracket 7 is moved to the component camera 9 or multiple component cameras 9 by the first drive system 6, such that the reference mark or these reference marks 13 and component 1a are in the field of view of the component camera 9 or in the field of view of these component cameras 9.

[0034] For mounting devices arranging one or more component cameras 9 in a fixed configuration, step B is performed by moving the bracket 7 to the component camera 9 or the component cameras 9 using the first drive system 6. In mounting devices where one or more component cameras 9 are attached to the bracket 7, step B is performed by moving the one or more component cameras 9 and the coupling head 3 relative to each other to an image acquisition position.

[0035] C) Take one or more images using the component camera 9 or these component cameras 9.

[0036] Component 1 includes component label 22 ( Figure 3 Alternatively, it can be used as a component marker. Component marker 22 is used to detect the position of component 1a relative to one or more reference markers 13 with the required accuracy.

[0037] In the mounting device of attaching (one or more) component cameras 9 to the bracket 7, the steps after step C are: moving (one or more) component cameras 9 and the coupling head 3 relative to each other, so that the coupling head 3 is in its normal operating position, and, if necessary, placing (one or more) component cameras 9 in a standby position.

[0038] D) Based on the images(one or more) acquired in the previous step, determine a first correction vector describing the deviation of the actual position of component 1a from the set position of reference marks(one or more) 13.

[0039] The first correction vector includes three components: Δx1, Δy1, and Δy2. Wherein, Δx1 represents the displacement of the reference point of component 1a in a first direction designated as x1, and Δy1 represents the displacement of the reference point of component 1a in a second direction designated as y1. This represents the rotation of component 1a relative to one or more reference marks 13 about a reference point of component 1a. Components Δx1 and Δy1 are given in the pixel coordinates of one or more component cameras 9. It is an angle. If the actual position of component 1a already corresponds to its set position, then the first correction vector is the zero vector.

[0040] E) Calculate the first correction shift based on the first correction vector.

[0041] The first correction shift includes three correction values ​​Δu1, Δv1, and Δθ1. The correction values ​​Δu1 and Δv1 are calculated based on the components Δx1, Δy1, and Δθ1. This is based on the angular error. Calculate the correction value Δθ1. The correction values ​​Δu1, Δv1, and Δθ1 are all given in the machine coordinates of the corresponding drive components. The correction values ​​Δu1 and Δv1 indicate that the second drive system 8 must ensure that the coupling head 3 (in...) Figure 1 In the device shown) or the third drive system 16, the substrate 2 (in Figure 2In the device shown, the distance moved in the direction specified as u and the direction specified as v, and the correction value Δθ1 represents the angle by which the drive member 14 mounted on the coupling head 3 must rotate the component holder 11 or the angle by which the rotation drive member 15 must rotate the substrate 2, in order to eliminate the detection deviation of the actual position of the component 1a relative to (one or more) reference marks 13 and its set position.

[0042] F) Use the first drive system 6 to move the bracket 7 to a position above the substrate site of the substrate 2.

[0043] G) Lower the bracket 7 to a height above the substrate 2, at which the lower side of the component 1a held by the component holder 11 is located at a predetermined distance D above the substrate field, wherein the distance D is set such that (one or more) reference marks 13 and (one or more) substrate marks 23 are located in the field depth of (one or more) substrate cameras 10.

[0044] The distance D is typically about 50-200 micrometers, but is not limited to these values. However, the distance D is so small that when part 1a is subsequently lowered to the substrate site, displacement of part 1a in the directions u and v that would cause significant positional errors typically does not occur.

[0045] H) Use the second drive system 8 to move the coupling head 3 to the standby position.

[0046] Steps F, G, and H can be performed one after another or simultaneously, i.e., in parallel. The bracket 7 and the substrate camera 10(s) attached thereto to the bracket 7 do not move during the remaining steps.

[0047] During steps A to G, the bonding head 3 is normally in its nominal working position. Since the bonding head 3 covers one or more substrate cameras 10, the substrate markings 23 are not visible to the substrate cameras 10. The standby position is selected such that the bonding head 3 does not cover the substrate markings 23.

[0048] I) A first image is captured using one or more substrate cameras 10, wherein the field of view of the substrate camera 10 or each field of view of the substrate camera 10 includes at least one substrate mark 23 disposed on the substrate 2.

[0049] J) The second drive system 8 moves the coupling head 3 to the nominal working position, in which the field of view of the substrate camera 10 or each field of view of the substrate camera 10 contains at least one reference mark 13.

[0050] K) A second image is captured using one or more substrate cameras 10.

[0051] L) A second correction vector is determined using the first image and the second image, or the first image and the second image, captured by one or more substrate cameras 10, respectively. The second correction vector describes the actual position of the substrate site relative to the reference mark 13 or the deviation of the reference mark 13 from the set position.

[0052] The second correction vector includes three components: Δx², Δy², and Δy². Where Δx2 represents the displacement of (one or more) reference marks 13 in a first direction designated as x2, and Δy2 represents the displacement of (one or more) reference marks 13 in a second direction designated as y2. This represents the rotation of (one or more) reference markers 13 relative to the substrate location. Components Δx2 and Δy2 are given in the pixel coordinates of (one or more) substrate cameras 10. It's an angle.

[0053] M) Calculate the second correction movement based on the second correction vector.

[0054] The second correction shift includes three correction values: Δu2, Δv2, and Δθ2. These are based on the components Δx2, Δy2, and... Calculate the correction values ​​Δu2 and Δv2. Based on the angle error... Calculate the correction value Δθ2. The correction values ​​Δu2, Δv2, and Δθ2 are all given in the machine coordinates of the corresponding drive components. The correction values ​​Δu2 and Δv2 indicate that the second drive system 8 must ensure that the coupling head 3 (in...) Figure 1 In the device shown) or the third drive system 16, the substrate 2 (in Figure 2 In the device shown, the distance moved in the directions specified as u and v, and the correction value Δθ2 represents the angle by which the drive 14 mounted on the connector 3 must cause the component holder 11 or the rotation drive 15 to rotate the substrate 2 in order to eliminate the detection deviation of the reference marks 13 of the connector 3 relative to the substrate marks 23 of the substrate 2 and their set positions.

[0055] N) Perform the first and second correction moves.

[0056] The displacements of the correction values ​​Δu1, Δv1, Δu2, and Δv2 are determined by... Figure 1 The second drive system 8 of the device and according to Figure 2 The third drive system 16 of the device performs the operation. The rotation of the correction values ​​Δθ1 and Δθ2 is performed by the drive element 14 or the rotation drive element 15.

[0057] O) Lower the bracket 7 and / or the coupling head 3 and / or the component holder 11, and place the component 1a on the substrate site.

[0058] If based on Figure 1 If the device is to perform an installation process, the method may optionally further include performing steps P to T one or more times after step N:

[0059] P) Images are captured using substrate camera 10 or multiple substrate cameras 10.

[0060] Q) Use images from substrate camera 10 or multiple images from multiple substrate cameras 10 to determine the actual position of one or more reference marks 13.

[0061] R) Calculate the actual corrected position of the reference mark 13 or one or more of these reference marks 13 using the first correction vector.

[0062] The first corrective movement for the coupling head 3 and component holder 11, calculated in step E and performed in step N, also causes the position of one or more reference marks 13 to shift. This shift of the one or more reference marks 13 is derived in step R because the first corrective movement is independent of the orientation relative to the substrate location.

[0063] S) Determine another correction vector that describes the deviation of the actual corrected position of (one or more) reference marks 13 from the set position of (one or more) substrate marks 23.

[0064] T) Calculate another corrective movement of the combined head 3 and component holder 11 based on another corrective vector.

[0065] Another corrective movement of the combined head 3 and component holder 11 includes: component Δu w Δv w The component Δu w Δv w The mechanical coordinates of the second drive system 8 are given; and the component Δθ. w The component Δθ w It refers to the angular change in the machine coordinate system of the drive component 14 or the rotary drive component 15.

[0066] U) The second drive system 8 performs further corrective movement of the coupling head 3, and the drive member 14 or the rotary drive member 15 performs further corrective movement of the component holder 11.

[0067] This continues until each component of the other correction vector is less than the limit value assigned to that component.

[0068] Optional steps P through U are used to check whether the coupling head 3 has actually reached the position within the required accuracy after the corrective movement performed in step N. If not, another corrective step is performed iteratively until this occurs. The detection deviation of each component must be within the required accuracy range.

[0069] Especially according to Figure 1 In the case of the device, step O of the method according to the invention can be supplemented by monitoring, wherein the position of (one or more) reference marks 13 is continuously detected by means of (one or more) substrate cameras 10 while the bracket 7 or coupling head 3 or component holder 11 is lowered and kept stable by means of the second drive system 8 and drive member 14 or rotation drive member 15 to avoid any change in the position of (one or more) reference marks 13 and thus component 1a. Step O can therefore be replaced by the following step O1:

[0070] O1) Lower the bracket 7 and / or the coupling head 3 and / or the component holder 11 and place the component 1a on the substrate site, wherein during the descent and stabilization by means of the second drive system 8 and optionally also by means of the drive member 14 or the rotation drive member 15, the position of (one or more) reference marks 13 is continuously detected by means of the substrate camera 10 or these substrate cameras 10.

[0071] If necessary, the substrate camera 10 or these substrate cameras 10 (including image evaluation) and the second drive system 8 together with the drive member 14 or the rotary drive member 15 form a closed-loop motion axis. This means that the output of the image evaluation of the image captured by the at least one substrate camera is fed back to the second drive system 8, and, if necessary, to the drive member 14 or the rotary drive member 15, and thus directly controls the movement of the second drive system 8, and, if necessary, directly controls the movement of the drive member 14 or the rotary drive member 15.

[0072] Figures 3 to 5 A snapshot taken during the installation process according to the invention is shown. The illustration uses an installation apparatus comprising a single component camera 9 and two substrate cameras 10, which are attached to the bracket 7 as described above.

[0073] Figure 3 A portion of the installation equipment after step B is shown. Figure 4 A portion of the installation apparatus is shown during step I, with the coupling head 3 in a standby position and the two substrate cameras 10 capturing the first image. Figure 5 A portion of the mounting apparatus is shown slightly later during step K, wherein the bonding head 3 is positioned where the field of view of each of the two substrate cameras 10 includes at least one reference mark 13. The bonding head 3 is positioned from... Figure 4 The state shown moves to Figure 5 During the state shown, the position of the substrate camera 10 relative to the substrate 2 has not changed. Figure 3 and Figure 5 The beam path 20 from reference mark 13 to image sensor 17 of substrate camera 10 is also shown, while Figure 4 The beam path 21 from substrate mark 23 to image sensor 17 of substrate camera 10 is shown.

[0074] The placement of the substrate mark 23 on the substrate 2 is left to the user of the mounting device of the present invention. A mounting device with a single substrate camera 10 requires different arrangements of the reference marks 13(s) on the head 3 or component holder 11 and the substrate marks 23(s) on the substrate 2. Since the component 1 is typically rectangular, the component marks 22(s), reference marks 13(s), and substrate marks 23(s) are typically arranged at opposite corners of the rectangle or at two adjacent corners of the rectangle, as this achieves the highest accuracy.

[0075] exist Figure 3 and Figure 4 In the illustrated embodiment, the connecting head 3 moves from its nominal working position to a standby position in a direction located on the drawing plane. However, this could also occur in a direction perpendicular to the drawing plane.

[0076] The term "part camera" will be understood functionally, meaning that the optical deflection system can form a part camera together with a substrate camera, as described in published patent application CN 106559977(A), which is incorporated herein by reference. In this case, the (single) camera and the first optical deflection system together form a first image detection system, which enables the acquisition of images of the substrate location on which the part is to be mounted, and the camera, the first optical deflection system, and the second optical deflection system together form a second image detection system, which enables the acquisition of images of the underside of the part held by the coupling head. The first image detection system corresponds to the substrate camera, and the second image detection system corresponds to the part camera. The first optical deflection system may also be omitted in some cases.

[0077] While embodiments and applications of the invention have been shown and described, it will be apparent to those skilled in the art that many beneficial effects of this disclosure, beyond those described above, are possible without departing from the inventive concept herein. Therefore, the invention is not to be limited except in the spirit of the claims and their equivalents.

Claims

1. An apparatus for mounting components on a substrate (2), comprising: A coupling head (3) having a component holder (11); At least one reference mark (13) is arranged at the joint (3) or at the component holder (11); Feeding unit (4), the feeding unit (4) is used to supply components; Device (5), said device (5) for providing substrate (2); A first drive system (6) is used to move the bracket (7); A second drive system (8) is attached to the bracket (7) for moving the coupling head (3) in one or more different directions; A drive member (14) or a rotary drive member (15), the drive member (14) being attached to the coupling head (3) for rotating the component holder (11) about the axis (12), and the rotary drive member (15) for rotating the substrate (2) about the axis. At least one substrate camera (10); and At least one component camera (9) or at least one optical deflection system, wherein the at least one optical deflection system together with the at least one substrate camera (10) forms at least one component camera. Among them The bracket (7) can be moved to the feed unit (4) by means of the first drive system (6). The bracket (7) can be moved to the at least one component camera (9) by means of the first drive system (6), or the at least one component camera (9) is fixed to the bracket (7) and can rotate relative to the coupling head (3) such that the at least one reference mark (13) and the component held by the component holder (11) are in the field of view of the at least one component camera (9), such that the actual position of the component relative to the at least one reference mark (13) is detectable. The bracket (7) is movable above the substrate location of the substrate (2) by means of the first drive system (6), and the coupling head (3) is movable to a standby position by means of the second drive system (8), in which each field of view of the at least one substrate camera (10) includes at least one substrate mark (23) arranged on the substrate (2), and the coupling head (3) is movable to a nominal working position by means of the second drive system (8), in which each field of view of the at least one substrate camera (10) includes one of the at least one reference mark (13), wherein when the second drive system (8) moves the coupling head (3) from the nominal working position to the standby position or from the standby position to the nominal working position, the second drive system (8) moves the coupling head (3) by a distance within a range of tens of millimeters. Furthermore, the distance between the lower side of the component and the substrate can be reduced to such an extent that the at least one reference mark (13) and the at least one substrate mark (23) are both within the field depth of the at least one substrate camera (10).

2. The device for mounting a component on a substrate (2) according to claim 1, wherein the second drive system (8) is configured to: on the one hand, move the coupling head (3) back and forth between the nominal working position and the standby position, and on the other hand, enable corrective movement of the coupling head (3).

3. The device for mounting components on a substrate (2) according to claim 1, wherein the at least one substrate camera (10) and the second drive system (8) and the drive member (14) or the rotary drive member (15) form a closed-loop motion axis.

4. The device for mounting components on a substrate (2) according to claim 2, wherein the at least one substrate camera (10) and the second drive system (8) and the drive member (14) or the rotary drive member (15) form a closed-loop motion axis.

5. The apparatus for mounting a component on a substrate (2) according to claim 1, wherein the second drive system (8) is configured to move the coupling head (3) back and forth between the nominal working position and the standby position, and the apparatus includes a third drive system (16) that allows corrective movement of the substrate (2).

6. The apparatus for mounting a component on a substrate (2) according to any one of claims 1 to 5, wherein the at least one component camera (9) is fastened to the bracket (7) and is movable or rotatable relative to the coupling head (3).

7. A method for mounting a component on a substrate (2) by means of a mounting device, said mounting device comprising a first drive system (6) for a bracket (7); a second drive system (8) for a coupling head (3) having a component holder (11); at least one substrate camera (10); at least one component camera (9) or at least one optical deflection system, said at least one optical deflection system forming said at least one component camera together with said at least one substrate camera (10); The method includes a drive member (14) or a rotary drive member (15), the drive member (14) being attached to the coupling head (3) for rotating the component holder (11) about an axis (12), the rotary drive member (15) for rotating the substrate (2) about an axis, wherein the second drive system (8) is attached to the bracket (7), and the coupling head (3) or the component holder (11) includes at least one reference mark (13), the method comprising the following steps: A) Pick up the component from the feed unit (4) using the component holder (11); B) Move the bracket (7) to the at least one component camera (9) using the first drive system (6) such that the at least one reference mark (13) and the component are in the field of view of the at least one component camera (9); C) Take one or more images using the camera (9) of at least one component; D) Based on the one or more images captured in the previous step, determine a first correction vector, the first correction vector describing the deviation between the actual position of the component and the set position of the component relative to the at least one reference mark (13); E) Calculate the first correction shift from the first correction vector; F) Use the first drive system (6) to move the bracket (7) to a position above the substrate location of the substrate (2); G) Reduce the distance between the underside of the component and the substrate (2) until the distance reaches a predetermined distance D, wherein the dimension of the distance D is set such that the at least one reference mark (13) and the at least one substrate mark (23) arranged on the substrate (2) are located in the field depth of the at least one substrate camera (10). H) Use the second drive system (8) to move the coupling head (3) to the standby position; I) Capture a first image using the at least one substrate camera (10), wherein each field of view of the at least one substrate camera (10) includes one of the at least one substrate markers (23); J) The second drive system (8) moves the coupling head (3) to a nominal working position, in which each field of view of the at least one substrate camera (10) includes one of the at least one reference mark (13); K) Take a second image using the at least one substrate camera (10); L) Using the first image and the second image captured by the at least one substrate camera (10), a second correction vector is determined, the second correction vector describing the deviation between the actual position of the substrate site and the set position of the substrate site relative to the at least one reference mark (13); M) Calculate the second correction shift from the second correction vector; N) The first corrective movement and the second corrective movement are performed by means of the second drive system (8) or the third drive system (16) capable of corrective movement of the substrate (2), and by means of the drive member (14) for rotating the component holder (11) or the rotation drive member (15) for rotating the substrate (2); and O) Place the component on the substrate. When the second drive system (8) moves the coupling head (3) from the nominal working position to the standby position or from the standby position to the nominal working position, the second drive system (8) moves the coupling head (3) by a distance within tens of millimeters.

8. The method of claim 7, wherein one or more of the following steps are performed after step N: P) Take images using the at least one substrate camera (10); Q) Using the images from the at least one substrate camera (10), determine the actual position of the at least one reference mark (13); R) Calculate the actual corrected position of the at least one reference mark (13) using the first correction vector; S) Determine another correction vector, which describes the deviation of the actual corrected position of the at least one reference mark (13) from the set position of the at least one reference mark (13) relative to the at least one substrate mark (23); T) Calculate another corrective movement for the coupling head (3) and the component holder (11) from the other corrective vector; and U) The second drive system (8) performs the other corrective movement for the coupling head (3), and the drive (14) for rotating the component holder (11) or the rotation drive (15) for rotating the substrate (2) is performed until each component of the other corrective vector is less than the limit value assigned to that component.

9. The method according to claim 7, wherein in step O, the position of the at least one reference mark (13) is continuously detected by means of the at least one substrate camera (10), and the position of the at least one reference mark (13) is stabilized by means of the second driving system (8).

10. The method according to claim 7, wherein in step O, the position of the at least one reference mark (13) is continuously detected by means of the at least one substrate camera (10), and the position of the at least one reference mark (13) is stabilized by means of the second drive system (8) and the drive member (14) for rotating the component holder (11) or the rotation drive member (15) for rotating the substrate (2).

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