一种功率模块与电子设备
By introducing a support component to connect with the heat sink in the power module, the problem of easy cracking of the ceramic substrate is solved, and a more stable stress distribution and higher module reliability are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LIONSGATE MICROELECTRONICS (WENLING) CO LTD
- Filing Date
- 2023-12-18
- Publication Date
- 2026-07-17
AI Technical Summary
In the prior art, the ceramic substrate of the power module is prone to cracking due to excessive clamping force or excessive thermal paste, resulting in reduced voltage resistance and leakage faults.
By incorporating a support component within the power module, the locking force is prevented from acting directly on the ceramic substrate. Instead, the support component connects to the heat sink, supporting the outer casing and thus distributing the force evenly, preventing direct pressure damage to the ceramic substrate.
It effectively prevents the ceramic substrate from cracking, improves the stability and pressure resistance of the module, avoids failures caused by loose or overtightened bolts, and enhances the reliability of the power module.
Smart Images
Figure CN117672980B_ABST