Laminated film, laminating apparatus, and laminating method

Abstract

The application provides a compression film, a compression device and a compression method. The compression film comprises a first surface and a second surface arranged oppositely, and the first surface is used for approaching a plurality of micro elements relative to the second surface. The compression film comprises a plurality of compression units connected with each other, one compression unit is used for corresponding to at least one micro element, and at least part of the compression units is provided with a segmentation slot in the circumferential direction, and the segmentation slot extends from the first surface to the second surface. In this way, the application can reduce the probability of position deviation of the micro elements in the compression process.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a pressing film, a pressing device, and a pressing method. Background Technology

[0002] With the development of traditional flat panel displays and micro-projection displays, Micro-LED inorganic light-emitting diode technology, a promising mainstream core display technology, has significant performance advantages and is therefore attracting increasing attention. Micro-LED can be considered a miniaturized chip that can be individually lit, offering advantages such as low power consumption, high brightness, high definition, and long lifespan. It is poised to become a new display technology on par with AMOLED displays in the future.

[0003] Currently, after transferring a large number of Micro-LEDs onto a backplane, a lamination process is required to electrically connect the Micro-LEDs to the backplane. However, in existing lamination methods, there is a risk of Micro-LEDs shifting position, which could prevent the Micro-LEDs from being driven to light up by the backplane. Summary of the Invention

[0004] This application provides a pressing film, a pressing device, and a pressing method to reduce the probability of micro-element position displacement during the pressing process.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a pressing film, the pressing film including a first surface and a second surface disposed opposite to each other, the first surface being used to approach a plurality of micro-elements relative to the second surface; wherein, the pressing film includes a plurality of pressing units interconnected, one pressing unit being used to correspond to at least one micro-element, and at least a portion of the individual pressing units having a circumferentially provided dividing slit, the dividing slit extending from the first surface to the second surface.

[0006] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a pressing device, comprising: a stage, including a bearing surface, the bearing surface being used to bear a backplate to be pressed and a plurality of micro-elements, and the backplate being located between the stage and the plurality of micro-elements; a pressing film as described in any of the above embodiments, used to be disposed on the side of the plurality of micro-elements away from the backplate; a cover, used to cover the side of the pressing film away from the stage and press it against the stage to form a cavity; a pressing assembly, communicating with the cavity, used to apply a preset pressure toward the plurality of micro-elements from the side of the pressing film away from the plurality of micro-elements, and used to heat the cavity to a preset temperature so that the plurality of micro-elements are electrically connected to the backplate.

[0007] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a pressing method, comprising: placing a back plate on a carrier platform; setting a plurality of micro-elements on the side of the back plate away from the carrier platform, and setting a pressing film as described in any of the above embodiments on the side of the plurality of micro-elements away from the back plate; covering the side of the pressing film away from the carrier platform with a cover, and pressing the cover with the carrier platform to form a cavity; applying a preset pressure toward the plurality of micro-elements from the side of the pressing film away from the micro-elements using a pressing assembly communicating with the cavity, and heating the cavity to a preset temperature so that the plurality of micro-elements are electrically connected to the back plate.

[0008] Generally, during the lamination process, a certain heating temperature is required to establish an electrical connection between the micro-element and the backplate. However, the lamination film closest to the micro-element away from the backplate undergoes thermal expansion at this heating temperature. This expansion can cause the lamination films to stretch and pull against each other, potentially displacing the micro-element below. Unlike existing technologies, the advantages of this application are: the lamination film provided includes multiple interconnected lamination units, each corresponding to at least one micro-element. A dividing slit is provided between adjacent lamination units, extending from the first surface closest to the micro-element. On one hand, the introduction of this dividing slit allows the stress generated by the thermal expansion of a single lamination unit to be released at the dividing slit around it, reducing the impact on other adjacent lamination units. This reduces the mutual stretching and deformation between lamination units, thereby reducing the probability of displacement of the micro-element below the lamination unit and ensuring the effective electrical connection between the micro-element and the backplate. On the other hand, the multiple pressing units mentioned above are still interconnected. That is, although there are dividing seams in the pressing film, it is still a whole. This method makes it easier to align the pressing film with the micro-component and reduces the difficulty of the process. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0010] Figure 1 This is a top view schematic diagram of one embodiment of the lamination film of this application;

[0011] Figure 2 for Figure 1 A cross-sectional view of one embodiment of the medium-pressure membrane along section AA;

[0012] Figure 3This is a top view schematic diagram of another embodiment of the lamination film of this application;

[0013] Figure 4 for Figure 1 A schematic diagram of another embodiment along section AA;

[0014] Figure 5 for Figure 1 A cross-sectional view of another embodiment along section AA;

[0015] Figure 6 This is a schematic diagram of the structure of one embodiment of the pressing device of this application;

[0016] Figure 7 for Figure 6 A top view schematic diagram of one embodiment of the medium-pressure membrane, backplane, and micro-components;

[0017] Figure 8 This is a flowchart illustrating one embodiment of the pressing method of this application. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] Please see Figure 1 and Figure 2 , Figure 1 This is a top view schematic diagram of one embodiment of the lamination film of this application. Figure 2 for Figure 1 A cross-sectional view of one embodiment of the pressure bonding film along section AA. The pressure bonding film 10 includes a first surface 100 and a second surface 102 disposed opposite to each other. The first surface 100 is used to approach multiple micro-elements relative to the second surface 102. For example, the first surface 100 is used to contact multiple micro-elements (not shown). Optionally, the material of the pressure bonding film 10 can be polyimide (PI), polyethylene terephthalate (PET), polypropylene (PP), or poly(4-methylpentene-1TPX), etc., and its thickness is relatively thick, for example, 50-250 micrometers. When multiple micro-elements have different heights, and there is a height difference on the side of the multiple micro-elements away from the back plate, the introduction of the pressure bonding film 10 can compensate for the height difference because the pressure bonding film 10 has a certain rigidity and hardness. After the pressure bonding film 10 presses down on multiple micro-elements, the surfaces of the multiple micro-elements away from the back plate can be flush.

[0020] The press film 10 includes a plurality of press units 104 interconnected with each other. Each press unit 104 is used to correspond to at least one micro-element, and at least a portion of the individual press units 104 are provided with a circumferentially arranged dividing slit 106, which extends from the first surface 100 to the second surface 102.

[0021] Optionally, the width of the dividing seam 106 can be greater than or equal to 0; that is, when the width of the dividing seam 106 is 0, it means that the pressing units 104 on both sides of the dividing seam 106 can contact each other, but the bonding force between them is 0; when the width of the dividing seam 106 is greater than 0, it means that the pressing units 104 on both sides of the dividing seam 106 are not in contact.

[0022] Generally, a certain heating temperature is required during the lamination process to achieve electrical connection between the micro-element and the backplane. However, the lamination film 10 undergoes thermal expansion at this temperature. The expansion of the lamination units within the film 10 can cause mutual pulling, potentially leading to displacement of the underlying micro-element. To address this issue, this application introduces a dividing slit 106 into the lamination film 10. The dividing slit 106 allows the stress generated by the thermal expansion of a single lamination unit 104 to be released at the dividing slit 106 around it, reducing the impact on other adjacent lamination units 104. This reduces the mutual pulling deformation between the lamination units 104, thereby decreasing the probability of displacement of the micro-element below the lamination unit 104 and ensuring effective electrical connection between the subsequent micro-element and the backplane. In addition, although the dividing seam 106 is introduced, the multiple pressing units are still interconnected, that is, the pressing film 10 can be considered as a whole. This method makes it easier to align the pressing film 10 with the multiple micro-elements before pressing, and the process of removing the pressing film 10 after pressing is simpler, thereby greatly reducing the difficulty of the process.

[0023] Please see Figure 3 , Figure 3This is a top view schematic diagram of another embodiment of the lamination film of this application. The total length of the circumferential dividing seams 106 of at least some of the individual lamination units 104 relatively far from the center point O of the lamination film 10 is greater than the total length of the circumferential dividing seams 106 of the individual lamination units 104 relatively close to the center point O. It should be noted that during subsequent lamination, the center point O of the lamination film 10 can coincide with the center point of the entire area composed of multiple micro-elements. When heated, the lamination film 10 generally expands outward from the center point O; that is, the further outward it is, the greater the degree of thermal expansion and the greater the tensile force it experiences / generates. In the above design, the lamination units 104 relatively close to the center point O experience less thermal expansion, and their total length of the circumferential dividing seams 106 is smaller, so that the lamination units 104 relatively close to the center point O have a larger interconnected area, resulting in a higher similarity in the forces exerted by the multiple lamination units 104 relatively close to the center point O on the multiple micro-elements below them, and the side of these multiple micro-elements facing away from the back plate is flatter. Furthermore, in the above design, the pressing unit 104, which is relatively far from the center point O, experiences greater thermal expansion, resulting in a larger total length of the surrounding dividing seams 106. This reduces the tensile force exerted / generated by the thermal expansion of the pressing unit 104, thereby decreasing the probability of deformation of the pressing unit 104 and the probability of displacement of the micro-components beneath it. For example, Figure 3 The total length of the dividing seam 106 around the pressing unit 104 marked as ① is less than the total length of the dividing seam 106 around the pressing unit 104 marked as ②, and the total length of the dividing seam 106 around the pressing unit 104 marked as ② is less than the total length of the dividing seam 106 around the pressing unit 104 marked as ③.

[0024] Alternatively, please continue reading Figure 3 Multiple pressing units 104 are arranged in an array along a first direction X and a second direction Y. Optionally, the first direction X is perpendicular to the second direction Y. In the direction away from the center point O, the multiple pressing units 104 form a central region 1040 and at least one annular region 1042 surrounding the central region 1040; wherein the center of the central region 1040 coincides with the aforementioned center point O, and the center of the annular region 1042 coincides with the aforementioned center point O. Furthermore, the total length of the circumferential dividing seams 106 of each pressing unit 104 located in the same region (i.e., the same central region 1040 or the same annular region 1042) is the same. This design is relatively simple and easy to cut and form.

[0025] For example, Figure 3The diagram illustrates a central region and two annular regions, labeled 1042a and 1042b respectively. The pressing units within the central region are labeled ①, those within the annular region 1042a are labeled ②, and those within the annular region 1042b are labeled ③. Specifically, the total length of the dividing seams 106 surrounding all pressing units labeled ① is the same; the total length of the dividing seams 106 surrounding all pressing units labeled ② is the same; and the total length of the dividing seams 106 surrounding all pressing units labeled ③ is the same. The total length of the dividing seams 106 surrounding the pressing units labeled ① is the shortest, the total length of the dividing seams 106 surrounding the pressing units labeled ② is in the middle, and the total length of the dividing seams 106 surrounding the pressing units labeled ③ is the longest. Furthermore, it should be noted that… Figure 3 The solid line in the middle represents seam 106. Figure 3 The dotted line in the diagram does not represent the dividing seam 106; it only serves to distinguish the extent of each area.

[0026] Of course, in other embodiments, if the difference in thermal expansion is not considered, such as Figure 1 As shown, the total length of the circumferential dividing slits 106 of each pressing unit 104 on the pressing film 10 may also be the same or approximately the same, and this application does not limit this.

[0027] Please refer to it again. Figure 1 and Figure 3 The pressing film 10 also includes an edge region 108 located around the periphery of the plurality of pressing units 104, and the edge region 108 is also provided with a dividing slit 106. Although the edge region 108 does not come into contact with the micro-element, it will still exert a certain tensile force on the adjacent pressing unit 104 when it is heated and expanded. The above-mentioned method of introducing the dividing slit 106 in the edge region 108 can reduce the tensile force on the adjacent pressing unit 104 when the edge region 108 is heated and expanded, thereby reducing the probability of deformation of the adjacent pressing unit 104 and thus reducing the probability of micro-element position displacement.

[0028] Optionally, multiple pressing units 104 are arranged in an array along a first direction X and a second direction Y. All dividing seams 106 located in the edge region 108 and around the pressing units 104 extend along either the first direction X or the second direction Y, and adjacent dividing seams 106 in the same row are located on the same straight line. Preferably, the first direction X and the second direction Y are perpendicular. This design reduces the difficulty of forming the dividing seams 106.

[0029] Please refer to it again. Figure 1 In the length extension direction of a single dividing slit 106, the dividing slit 106 may include a plurality of sub-dividing slits 1060 spaced apart, and the lengths of the plurality of sub-dividing slits 1060 may be different or not exactly the same. For example, Figure 1 The plurality of sub-slits 1060 include a first sub-slit 1060a and a second sub-slit 1060b, wherein the length of the first sub-slit 1060a is less than or equal to the length of the second sub-slit 1060b. In the length extension direction of a single slit 106, the first sub-slit 1060a and the second sub-slit 1060b are alternately spaced. Preferably, the length of the first sub-slit 1060a is less than the length of the second sub-slit 1060b. The longer second sub-slit 1060b allows the stress generated by the thermal expansion of adjacent pressing units 104 to be released more quickly, thereby reducing the probability of deformation of the pressing unit 104. The shorter first sub-slit 1060a is equivalent to a small stress release point introduced at the connection between adjacent pressing units 104, allowing the stress transmitted to the connection to be released through this stress release point, further reducing the probability of deformation of the pressing unit 104.

[0030] Please refer to it again. Figure 2 Generally, during the pressing process, a flexible gas pressure membrane is stacked on one side of the second surface 102 of the pressing film 10 to allow the gas pressure applied by the pressing assembly to act more uniformly on the pressing film 10 through the gas pressure membrane. The gas pressure membrane is generally a thin film with a certain degree of elasticity, such as polycarbonate (PC), polypropylene (PP), or acrylonitrile-butadiene-styrene copolymer (ABS). The backing plate located on the first surface 100 side of the pressing film 10 is generally made of inorganic materials such as glass, whose overall coefficient of thermal expansion is smaller than that of the aforementioned gas pressure membrane. At this time, in the direction from the first surface 100 to the second surface 102 (i.e.... Figure 2 (As indicated by the dashed arrow in the middle), the coefficient of thermal expansion of the pressed film 10 increases. For example, the coefficient of thermal expansion of the pressed film 10 near the first surface 100 can be close to or even the same as that of the backplate. This design allows the degree of thermal expansion of the pressed film 10 near the first surface 100 to be close to or even the same as that of the backplate, thereby reducing the probability of misalignment between the micro-component and the backplate. As another example, the coefficient of thermal expansion of the pressed film near the second surface 102 can be close to or even the same as that of the gas pressure film. This design allows the degree of thermal expansion of the pressed film 10 near the second surface 102 to be close to or even the same as that of the gas pressure film, thereby reducing the probability of relative movement between the pressed film 10 and the gas pressure film, and reducing the tensile force exerted by the gas pressure film on the pressed film 10.

[0031] Optionally, the press-fit film 10 may comprise an organic host material and inorganic particles doped within the organic host material, with the doping concentration of the inorganic particles gradually decreasing in the direction from the first surface 100 to the second surface 102. That is, the coefficient of thermal expansion is changed by altering the doping concentration of the inorganic particles.

[0032] Alternatively, the laminated film 10 may also be formed by multiple sub-laminated films stacked together, with each sub-laminated film made of the same material and different sub-laminated films having different coefficients of thermal expansion. For example, please refer to... Figure 4 , Figure 4 for Figure 1 A schematic diagram of another embodiment along section AA. In the direction from the first surface 100 to the second surface 102, the press-fit film 10 includes a first sub-press-fit film 101 and a second sub-press-fit film 103 stacked together; wherein, the side of the first sub-press-fit film 101 facing away from the second sub-press-fit film 103 is the first surface 100, and the side of the second sub-press-fit film 103 facing away from the first sub-press-fit film 101 is the second surface 102; the coefficient of thermal expansion of the first sub-press-fit film 101 is smaller than that of the second sub-press-fit film 103. This structural design is relatively simple and the process is easy to fabricate.

[0033] Furthermore, such as Figure 2 and Figure 4 As shown, in the direction from the first surface 100 to the second surface 102, the dividing slit 106 may only penetrate a portion of the pressed film 10. For example, Figure 4 The dividing slit 106 penetrates the first sub-pressed film 101 and ends at the side of the second sub-pressed film 103 facing the first sub-pressed film 101.

[0034] Of course, in other embodiments, such as Figure 5 As shown, Figure 5 for Figure 1 A cross-sectional view along section AA of another embodiment. The dividing slit 106 may also extend from the first surface 100 and penetrate the second surface 102, that is, in the direction from the first surface 100 to the second surface 102, the dividing slit 106 may penetrate the entire pressed film 10. The specific choice can be made according to actual needs.

[0035] Based on this, such as Figure 1 As shown, a dividing slit 106 is provided between any two adjacent pressing units 104. In the length extension direction of the dividing slit 106, the length of the dividing slit 106 is less than the length of the adjacent pressing unit 104. Of course, in other embodiments, the dividing slit 106 may only be provided between some of the two adjacent pressing units 104, and in the length extension direction of the dividing slit 106, the length of the dividing slit 106 may be less than or equal to the length of the adjacent pressing unit 104; and when the length of the dividing slit 106 is equal to the length of the adjacent pressing unit 104, at least one side of any pressing unit 104 is not provided with the dividing slit 106. That is, as long as the introduction of the dividing slit 106 does not cause the two adjacent pressing units 104 to completely separate, the pressing film 10 remains a single unit. Please refer to... Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of one embodiment of the pressing device of this application. Figure 7 for Figure 6 A top view schematic diagram of one embodiment of the bonding membrane, backplate, and micro-components. The bonding apparatus specifically includes: a stage 20, a bonding membrane 10 mentioned in any of the above embodiments, a cover 26, and a bonding assembly (not shown).

[0036] Specifically, the stage 20 includes a bearing surface 200, which is used to support the backplate 22 to be pressed and multiple micro-components 24, with the backplate 22 located between the stage 20 and the multiple micro-components 24. It can be understood that, although... Figure 6 The backplate 22 and micro-components 24 are schematically shown, but the backplate 22 and micro-components 24 are not included in the components covered by the pressing device; that is, the backplate 22 and micro-components 24 are not sold together with the pressing device. The pressing film 10 is used to be disposed on the side of the plurality of micro-components 24 opposite to the backplate 22. The cover 26 is used to cover the side of the pressing film 10 opposite to the platform 20 and press it against the platform 20 to form a cavity 21. The pressing assembly communicates with the cavity 21 and is used to apply a preset pressure toward the micro-components 24 from the side of the pressing film 10 opposite to the micro-components 24, and to apply a preset temperature to the cavity 21, so that the micro-components 24 are electrically connected to the backplate 22.

[0037] Optionally, the pressing assembly is used to apply gas toward the microelement 24 from the side of the pressing film 10 away from the microelement 24, and the gas has a preset pressure and a preset temperature. In one application scenario, the pressing assembly may include a gas source and a pipe connected to the gas source; the gas source is located outside the cavity 21, and one end of the pipe may be connected to the cavity 21. The gas source is used to provide gas with a preset pressure and preset temperature, and the gas may be nitrogen or an inert gas, etc.

[0038] Furthermore, the cover 26 includes a first plate 260 and a plurality of second plates 262 surrounding the first plate 260, the second plates 262 being used to press against the platform 20. The first plate 260 is provided with a plurality of air inlets 2600 communicating with the cavity 21, and the pressing assembly is connected to the air inlets 2600; and when the gas pressure inside the cavity 21 reaches a preset requirement, the air inlets 2600 can be closed, thereby sealing the cavity 21.

[0039] In addition, please refer to again Figure 6The pressing device provided in this application may further include a pneumatic membrane 28, a portion of which is located within the cavity 21 and positioned on the side of the pressing membrane 10 opposite to the plurality of micro-elements 24. The orthographic projection of the pneumatic membrane 28 onto the stage 20 overlaps the orthographic projection of the backplate 22 onto the stage 20, and the edge of the pneumatic membrane 28 is pressed between the cover 26 and the stage 20. The function of the pneumatic membrane 28 has been explained in the above embodiments and will not be repeated here. Furthermore, the method by which the edge of the pneumatic membrane 28 is pressed between the cover 26 and the stage 20 not only fixes the position of the pneumatic membrane 28 but also allows it to act as a sealing gasket, thereby improving the sealing performance of the cavity 21.

[0040] Please refer to the following: Figure 6 and Figure 8 , Figure 8 This is a flowchart illustrating one embodiment of the pressing method of this application. The pressing method includes:

[0041] S101: Place the back plate 22 on the stage 20.

[0042] S102: Multiple micro-element 24 are provided on the side of the back plate 22 away from the stage 20, and a pressing film 10 is provided on the side of the multiple micro-element 24 away from the back plate 22.

[0043] Specifically, the micro-element 24 can be an LED or the like, and the micro-element 24 has two first electrodes on the side facing the back plate 22; the back plate 22 can have multiple second electrode groups on the side facing the micro-element 24, each second electrode group containing two second electrodes, and each second electrode group corresponds to one micro-element 24.

[0044] In one embodiment, step S102 can be implemented as follows: First, a transfer device is used to transfer multiple micro-element 24 to the side of the backplate 22 away from the stage 20; then, a laminating film 10 is placed on the side of the multiple micro-element 24 away from the backplate 22, at which point the laminating film 10 is in direct contact with the micro-element 24. Alternatively, a transfer device is used to transfer multiple micro-element 24 onto the laminating film 10, at which point the micro-element 24 and the laminating film 10 can be connected by a removable adhesive layer; the side of the laminating film 10 with the multiple micro-element 24 is positioned opposite to the backplate 22.

[0045] In addition, please see Figure 7 One bonding unit 104 on the bonding film 10 can cover one pixel, and one pixel can contain three micro-elements 24 with different light-emitting colors. Of course, in other embodiments, one bonding unit 104 can also cover more pixels, and this application does not limit this.

[0046] S103: Cover the press film 10 with the cover 26 on the side away from the stage 20, and press the cover 26 and the stage 20 together to form a closed cavity 21.

[0047] S104: A preset pressure is applied to the micro-element 24 from the side of the pressing film 10 away from the micro-element 24 using a pressing assembly connected to the cavity 21, and a preset temperature is provided to the cavity using the pressing assembly so that the micro-element 24 is electrically connected to the back plate 22.

[0048] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A pressure-pressed film, characterized in that, The laminated film includes a first surface and a second surface disposed opposite to each other, wherein the first surface is used to approach a plurality of micro-elements relative to the second surface; The pressed film includes a plurality of interconnected pressing units, one pressing unit is used to correspond to at least one micro-element, and at least a portion of the individual pressing units are provided with a dividing slit in the circumferential direction, the dividing slit extending from the first surface to the second surface; Wherein, at least a portion of the total length of the circumferential dividing seams of a single pressing unit that is relatively far from the center point of the pressing film is greater than the total length of the circumferential dividing seams of a single pressing unit that is relatively close to the center point.

2. The press-fit film according to claim 1, characterized in that, In the direction away from the center point, the plurality of pressing units form a central region and at least one annular region surrounding the central region; the total length of the circumferential dividing seam of each pressing unit located in the same region is the same.

3. The press-fit film according to claim 1, characterized in that, The pressing film also includes an edge region located around the plurality of pressing units, and the edge region is provided with the dividing seam.

4. The press-fit film according to claim 3, characterized in that, The plurality of pressing units are arranged in an array along a first direction and a second direction, all of the dividing seams extend along the first direction or the second direction, and the plurality of adjacent dividing seams in the same row are located on the same straight line.

5. The press-fit film according to any one of claims 1-4, characterized in that, Along the length extension direction of the dividing seam, the dividing seam includes a plurality of sub-dividing seams spaced apart.

6. The press-fit film according to claim 5, characterized in that, The plurality of sub-dividing seams include a first sub-dividing seam and a second sub-dividing seam, and the length of the first sub-dividing seam is less than or equal to the length of the second sub-dividing seam; wherein, in the length extension direction of the dividing seam, the first sub-dividing seam and the second sub-dividing seam are alternately arranged.

7. The press-fit film according to claim 1, characterized in that, The coefficient of thermal expansion of the pressed film increases in the direction from the first surface to the second surface.

8. The press-fit film according to claim 7, characterized in that, In the direction from the first surface to the second surface, the pressed film includes a first sub-pressed film and a second sub-pressed film stacked together; wherein, the side of the first sub-pressed film opposite to the second sub-pressed film is the first surface, and the side of the second sub-pressed film opposite to the first sub-pressed film is the second surface; the coefficient of thermal expansion of the first sub-pressed film is less than the coefficient of thermal expansion of the second sub-pressed film.

9. The press-fit film according to claim 8, characterized in that, The dividing seam extends through the first sub-pressed film and ends at the side of the second sub-pressed film facing the first sub-pressed film.

10. The press-fit film according to claim 1, characterized in that, The dividing seam extends from the first surface and penetrates the second surface.

11. A pressing device, characterized in that, include: A stage, including a bearing surface, is used to support a backplate to be pressed and a plurality of micro-components, wherein the backplate is located between the stage and the plurality of micro-components; The lamination film according to any one of claims 1-10 is used to be disposed on the side of the plurality of micro-elements opposite to the backplate; A cover is used to cover the side of the pressed film away from the platform and to press it against the platform to form a cavity; A pressing assembly, in communication with the cavity, is used to apply a preset pressure toward the plurality of micro-elements from the side of the pressing film away from the plurality of micro-elements, and to heat the cavity to a preset temperature so that the plurality of micro-elements are electrically connected to the backplate.

12. The pressing device according to claim 11, characterized in that, The pressing assembly is used to apply gas toward the plurality of micro-elements from the side of the pressing film away from the micro-elements, and the pressing device further includes: A pressure membrane, part of which is located within the cavity and is disposed on the side of the pressure membrane opposite to the plurality of micro-elements; wherein the orthographic projection of the pressure membrane on the stage covers the orthographic projection of the back plate on the stage, and the edge of the pressure membrane is used to be pressed between the cover and the stage.

13. A pressing method, characterized in that, include: Place the backplate on the platform; A plurality of micro-elements are disposed on the side of the back plate away from the stage, and the plurality of micro-elements are provided with a pressing film as described in any one of claims 1-10 on the side of the back plate away from the back plate; The cover is placed over the side of the pressed film away from the platform, and the cover is pressed tightly against the platform to form a cavity; A preset pressure is applied to the plurality of micro-elements from the side of the pressing film away from the micro-elements using a pressing assembly connected to the cavity, and the cavity is heated to a preset temperature so that the plurality of micro-elements are electrically connected to the backplate.

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