An optical device, a package base and a plating structure thereof

Abstract

The present application relates to the technical field of packaging, and discloses an optical device, a packaging base and an electroplating structure thereof, the electroplating structure comprising: a main body provided as a conductor and having a mounting groove; an input / output terminal comprising an insulator and a conductive wiring provided on the insulator, the insulator being mounted at the mounting groove; a wire terminal electrically connected with the conductive wiring; and an electroplating wiring, the main body, the conductive wiring and the wire terminal being electrically connected through the electroplating wiring, at least a part of the electroplating wiring being exposed on the surface of the insulator and not coinciding with the conductive wiring. The main body, the input / output terminal and the wire terminal are electrically connected with each other through the electroplating wiring, and the electroplating fixture only needs to be connected with the conductive wiring of the main body and the input / output terminal or the wire terminal, so that the electroplating operation requirement of the packaging base is met, thereby reducing the electroplating operation difficulty of the packaging base, improving the production efficiency and reducing the economic cost.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and in particular to an optical device, a packaging substrate and its electroplating structure. Background Technology

[0002] Packaging substrates used in semiconductor lasers include a main body and input / output terminals. The lead wires of the main body and the input / output terminals are separated by the ceramic material of the input / output terminals, preventing them from being electrically connected. The main body and lead wires need to be plated with nickel-gold on their respective surfaces. During electroplating, the plating racks need to connect each component to be plated, resulting in complex rack design, cumbersome plating operations, low production efficiency, and high economic costs. Summary of the Invention

[0003] The purpose of this invention is to provide an optical device, a packaging substrate, and its electroplating structure, which can reduce the difficulty of electroplating operations on the packaging substrate, improve production efficiency, and reduce economic costs.

[0004] To achieve the above objectives, the present invention provides an electroplating structure for an encapsulation base, comprising:

[0005] The main body is configured as a conductor and includes a substrate and a frame disposed on the substrate, the frame having a mounting groove;

[0006] Input / output terminals include an insulator and conductive wiring and electroplated wiring disposed on the insulator, wherein the insulator is mounted at the mounting groove;

[0007] The wire terminal is electrically connected to the conductive wiring.

[0008] The electroplated wiring is provided, wherein the main body, the conductive wiring, and the wire terminals are electrically connected through the electroplated wiring, and at least a portion of the electroplated wiring is exposed on the surface of the insulator and does not overlap with the conductive wiring.

[0009] In some embodiments of this application:

[0010] The input / output terminals also include a metal layer, which is disposed on the surface of the insulator that contacts the main body.

[0011] In some embodiments of this application:

[0012] The metal layer is disposed on the surface of the insulator that contacts the groove wall of the mounting groove.

[0013] In some embodiments of this application, the electroplating structure of the encapsulation base further includes:

[0014] A sealing ring, wherein the sealing ring is configured as a conductor, the sealing ring is disposed on the upper surface of the main body and the insulator, and the sealing ring and the main body together clamp the insulator;

[0015] The metal layer is disposed on the surface of the insulator that contacts the sealing ring.

[0016] In some embodiments of this application, the electroplating structure of the encapsulation base further includes:

[0017] The connecting ribs are provided, and the wire terminals are configured in multiple ways, with each wire terminal connected to the other through the connecting ribs.

[0018] In some embodiments of this application:

[0019] The main body and the input / output terminals form a cavity for mounting a semiconductor laser;

[0020] The insulator includes a flat plate portion and a vertical wall portion disposed on the flat plate portion. The conductive wiring is disposed on the flat plate portion and is located on the surface of the flat plate portion connected to the vertical wall portion. The conductive wiring on the side of the vertical wall portion facing the inside of the cavity forms an internal pad, and the conductive wiring on the side of the vertical wall portion facing the outside of the cavity forms an external pad. The wire terminal is electrically connected to the external pad.

[0021] In some embodiments of this application:

[0022] The ratio of the width of the electroplated wiring to the width of the internal pad is in the range of 1 / 10 to 1.

[0023] The present invention also provides a packaging base, comprising:

[0024] The main body is configured as a conductor and includes a substrate and a frame disposed on the substrate, the frame having a mounting groove;

[0025] Input / output terminals include an insulator and conductive wiring disposed on the insulator, wherein the insulator is mounted at the mounting slot;

[0026] The wire terminal is electrically connected to the conductive wiring.

[0027] The remaining portion formed by removing a portion of the electroplated wiring of any of the above-described electroplated structures, wherein the main body component has no electrical connection with the conductive wiring and the wire terminals.

[0028] In some embodiments of this application:

[0029] The input / output terminals also include a metal layer, which is disposed on the surface of the insulator that contacts the main body.

[0030] There is at least one or more retention sections, at least a portion of which is exposed on the surface of the insulator.

[0031] The present invention also provides an optical device, comprising:

[0032] The encapsulation base as described in any of the preceding paragraphs;

[0033] Optical semiconductor elements are disposed within the cavity of the package substrate.

[0034] This invention provides an optical device, a packaging substrate, and its electroplating structure. Compared with the prior art, its advantages are as follows:

[0035] The electroplating structure of the packaging base of the present invention electrically connects the main body, input / output terminals and wire terminals to each other by setting electroplating wiring. During the electroplating operation, the electroplating fixture only needs to be connected to the conductive wiring or wire terminals of the main body and input / output terminals to meet the electroplating requirements of the packaging base, thereby reducing the difficulty of the electroplating operation of the packaging base, improving production efficiency and reducing economic costs.

[0036] After the electroplating process is completed, the portion of the electroplated wiring exposed on the surface of the insulator in the above-mentioned electroplating structure of the packaging base of the present invention is cut off, so as to disconnect the electrical connection between the conductive wiring and the main body. This reduces the difficulty of the electroplating process of the packaging base, improves production efficiency, reduces economic costs, and ensures the normal use of the product.

[0037] The optical device of the present invention includes the above-mentioned packaging base. Since the packaging base reduces the difficulty of electroplating, the optical device as a whole also improves production efficiency, reduces economic costs, and ensures normal use of the product. Attached Figure Description

[0038] Figure 1 This is a perspective view of the electroplating structure according to an embodiment of the present invention.

[0039] Figure 2 This is a perspective view of the packaging base according to an embodiment of the present invention.

[0040] Figure 3 yes Figure 2 Enlarged schematic diagram of the retention section.

[0041] Figure 4 This is a perspective view of the main component of an embodiment of the present invention.

[0042] Figure 5 This is a perspective view of the input and output terminals of the electroplating structure in an embodiment of the present invention.

[0043] Figure 6 This is a perspective view of the input and output terminals of the encapsulation base in an embodiment of the present invention.

[0044] Figure 7 This is a perspective view of the input and output terminals of the electroplated structure in another embodiment of the present invention.

[0045] Figure 8 yes Figure 7 A perspective view of the corresponding package base input / output terminals in the embodiment.

[0046] Figure 9 This is a perspective view of the input and output terminals of the electroplated structure in another embodiment of the present invention.

[0047] Figure 10 yes Figure 9 A perspective view of the corresponding package base input / output terminals in the embodiment.

[0048] Figure 11 This is a perspective view of the input and output terminals of the electroplated structure in another embodiment of the present invention.

[0049] Figure 12 yes Figure 11 A schematic diagram showing the connection between the metal layer, electroplated wiring, and conductive wiring in the embodiment (hidden parts of the entity).

[0050] Figure 13 yes Figure 11 A perspective view of the corresponding package base input / output terminals in the embodiment.

[0051] Figure 14 This is a schematic diagram showing the connection between the main body, metal layer, electroplated wiring, conductive wiring and wire terminals in the electroplating structure of an embodiment of the present invention (insulators are not shown).

[0052] Figure 15 yes Figure 14 An enlarged schematic diagram showing the connection between the main body, metal layer, electroplated wiring, conductive wiring, and wire terminals.

[0053] Figure 16 Is with Figure 14 A schematic diagram of the packaging base of the corresponding embodiment of the present invention (insulators are not shown).

[0054] Figure 17 yes Figure 16 Enlarged schematic diagram of the retention section.

[0055] The electroplating structure of the packaging base includes: 1. Main body; 2. Input / output terminals; 3. Wire terminals; 4. Electroplated wiring; 11. Mounting groove; 12. Sealing ring; 13. Cavity; 14. Substrate; 15. Frame; 21. Insulator; 22. Conductive wiring; 211. Flat plate; 212. Vertical wall; 221. Internal pad; 222. External pad; 23. Metal layer; 31. Connecting rib.

[0056] In the package base: 2′, input / output terminals; 4′, metal layer; 5, storage area; 21′, insulator; 22′, conductive wiring. Detailed Implementation

[0057] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0058] In the description of this invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0059] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0060] Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0061] Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0062] Please refer to Figure 1 An electroplating structure for a packaging base according to a preferred embodiment of the present invention includes: a main body 1, input / output terminals 2, wire terminals 3, and electroplated wiring 4.

[0063] Please refer to Figure 4 The main body 1 is configured as a conductor and has a mounting groove 11. In this embodiment, please refer to... Figure 4The main body 1 is made of metal and includes a base plate 14 and a frame 15. The frame 15 is disposed on the base plate 14, and the mounting grooves 11 are disposed on the frame 15. In this embodiment, there are two mounting grooves 11 located on opposite sides of the frame 15. In other embodiments, the number of mounting grooves 11 is not limited to two, and they can be disposed in other parts of the frame.

[0064] Please refer to Figure 1 and Figure 5 The input / output terminal 2 includes an insulator 21 and conductive wiring 22 and electroplated wiring 4 disposed on the insulator 21. The insulator 21 is installed in the mounting groove 11.

[0065] The wire terminal 3 is electrically connected to the conductive wiring 22. In this embodiment, the wire terminal 3 extends away from the main body 1; in other embodiments, the wire terminal 3 may also extend upward or downward.

[0066] Please refer to Figure 14 and Figure 15 The main body 1, conductive wiring 22 and wire terminal 3 are electrically connected by electroplated wiring 4. At least a portion of the electroplated wiring 4 is exposed on the surface of the insulator 21 and does not overlap with the conductive wiring 22.

[0067] The electroplating structure of the packaging base of the present invention electrically connects the main body 1, input / output terminals 2 and wire terminals 3 to each other by setting electroplating wiring 4. During the electroplating operation, the electroplating fixture only needs to be connected to the conductive wiring 22 or wire terminals 3 of the main body 1 and input / output terminals 2 to meet the electroplating operation requirements of the packaging base, thereby reducing the difficulty of the electroplating operation of the packaging base, improving production efficiency and reducing economic costs.

[0068] In some embodiments of the present invention, there are two or more input / output terminals 2. Some input / output terminals have electroplated wiring, while others do not. In this case, the input / output terminals without electroplated wiring cannot achieve the above-mentioned effect, thus greatly reducing the effect of such embodiments in reducing the difficulty of electroplating operations. Therefore, a preferred embodiment of the present invention is to provide electroplated wiring on all input / output terminals.

[0069] The purpose of setting at least a portion of the electroplated wiring 4 to be exposed on the surface of the insulator 21 and not overlapping with the conductive wiring 22 is to allow for the removal of a portion of the electroplated wiring 4 exposed on the surface of the insulator 21 after the electroplating operation is completed, thus ensuring that the product can be used normally.

[0070] The main body 1 and the conductive wiring 22 are electrically connected via electroplated wiring 4. The substrate 14 and the frame 15 are electrically connected to each other, and the frame 15 in the main body 1 is connected to the electroplated wiring 4. In this embodiment, the electroplated wiring 4 extends to the outer surface of the input / output terminal 2 and contacts the frame 15, forming an electrical connection between the main body 1 and the electroplated wiring 4.

[0071] The frame 15 is also provided with a through hole, which is located on one of the sides where the mounting slot 11 is not provided, and a light window bracket is installed on the through hole.

[0072] In some embodiments, the input / output terminal 2 further includes a metal layer 23, which is disposed on the surface of the insulator 21 that contacts the main body 1; for example, it can be disposed on the side of the insulator 21 that contacts the mounting groove 11, or it can be disposed on the bottom surface of the insulator 21.

[0073] Please refer to Figure 14 The electroplated wiring 4 is configured as a conductor, with conductive wiring 22 and metal layer 23 connected at both ends to form an electrical connection between metal layer 23 and conductive wiring 22. At least a portion of the electroplated wiring 4 is exposed on the surface of insulator 21 and does not overlap with conductive wiring 22.

[0074] Please refer to Figure 5 , Figure 7 and Figure 9 For the electroplated wiring 4, it can be entirely disposed on at least one surface of the insulator 21, including the top and bottom surfaces, front and back surfaces, and side surfaces. Please refer to... Figure 11 and Figure 12 The electroplated wiring 4 can also have at least a portion located inside the insulator 21. The electroplated wiring 4 can be formed on the same ceramic layer of the insulator 21 or on different ceramic layers. When formed on different ceramic layers, the electroplated wiring 4 passes through the via without affecting the routing of the electroplated wiring 4. Figure 12 As shown.

[0075] In some embodiments, please refer to Figure 5 The metal layer 23 is disposed on the surface of the groove wall of the insulator 21 contacting the mounting groove 11.

[0076] With this configuration, when the input / output terminal 2 is installed in the mounting slot 11, the metal layer 23 will contact the wall of the mounting slot 11, forming an electrical connection between the main body 1 and the metal layer 23.

[0077] In some embodiments, please refer to Figure 1 The main body 1 also includes a sealing ring 12, which is configured as a conductor. The sealing ring 12 is disposed on the upper surface of the main body 1 and the frame 15, and the sealing ring 12 and the frame 15 together clamp the insulator 21.

[0078] The sealing ring 12 contacts the main body 1, forming an electrical connection between the sealing ring 12 and the main body 1. Therefore, the metal layer 23 can also form an electrical connection with the main body 1 by contacting the sealing ring 12. In some embodiments, the metal layer 23 is disposed on the surface of the insulator 21 that contacts the sealing ring 12, that is, disposed on the top surface of the insulator 21, forming an electrical connection between the metal layer 23 and the sealing ring 12.

[0079] In some embodiments, the electroplating structure of the encapsulation base also includes connecting ribs 31, and multiple wire terminals 3 are provided, with each wire terminal 3 connected to each other through the connecting ribs 31.

[0080] The connecting rib 31 enables each wire terminal 3 to be electrically connected to each other. If one wire terminal 3 is connected to the electroplating wiring 4, then all wire terminals 3 can be connected to the electroplating wiring 4.

[0081] In some embodiments, the main body 1 and the input / output terminals 2 form a cavity 13 for mounting a semiconductor laser.

[0082] The insulator 21 includes a flat plate portion 211 and a vertical wall portion 212 disposed on the flat plate portion 211. Conductive wiring 22 is disposed on the flat plate portion 211 and is located on the surface of the flat plate portion 211 connected to the vertical wall portion 212. The conductive wiring 22 on the side of the vertical wall portion 212 facing the inside of the cavity 13 forms an inner pad 221, and the conductive wiring 22 on the side of the vertical wall portion 212 facing the outside of the cavity 13 forms an outer pad 222. The wire terminal 3 is electrically connected to the outer pad 222.

[0083] In this embodiment, the metal layer 23 can be disposed on the bottom surface of the flat plate portion 211, or on the side surface of at least one of the flat plate portion 211 and the vertical wall portion 212. The electroplated wiring 4 is disposed in the cavity 13 and connected to the internal solder pad 221.

[0084] In some embodiments, the ratio of the width of the electroplated wiring 4 to the width of the internal pad 221 is in the range of 1 / 10 to 1.

[0085] If the ratio is less than 1 / 10, the parasitic resistance of the electroplated wiring 4 is too large, affecting the uniformity of the gold plating thickness between the pad and the main body 1; if the ratio is greater than 1, it will increase the short circuit risk of the electroplated wiring 4 and affect the normal use of the product.

[0086] This embodiment also provides a method for preparing a packaging base, including the following steps:

[0087] S1. Prepare input / output terminals 2, main body 1, and wire terminals 3.

[0088] Specifically, the ceramic slurry is cast into a ceramic green body, which is then punched and filled, and conductive wiring patterns 22 and electroplated wiring patterns 4 are printed. The ceramic green body with multiple conductive wiring patterns 22 is then stacked and cut to form a component. If the side of the component requires a metal layer 23, another portion of conductive wiring 22, or electroplated wiring patterns 4, the metal layer 23, the other portion of conductive wiring 22, or electroplated wiring patterns are printed on the side of the component. After high-temperature co-firing, input / output terminals 2 are formed. The exposed metal of the input / output terminals 2 undergoes a nickel plating treatment.

[0089] Metal or alloy sheets are cut and then formed into a substrate 14 and a frame 15. These are then connected by brazing or other methods to obtain the main body 1. For embodiments with a sealing ring, the sealing ring also needs to be cut out and connected together. The wire terminal 3 can also be obtained by cutting metal or alloy sheets.

[0090] S2. Assemble the input / output terminal 2, main body 1, and wire terminal 3 into a unit, so that the conductive wiring 22 and electroplated wiring 4 on the input / output terminal 2 are electrically connected to the main body 1 and wire terminal 3.

[0091] S3. Connect the conductive wiring 22 or wire terminal 3 of the main body 1 and input / output terminal 2 of the assembly to the electroplating electrode to perform electroplating on the assembly.

[0092] Using a jig, any metal part of the assembly, input / output terminal 2 or wire terminal 3 is electrically connected to the electroplating electrode to electroplat the assembly.

[0093] S4. Cut off the portion of the electroplated wiring 4 exposed on the surface of the insulator 21 to disconnect the electrical connection between the conductive wiring 22 and the main body 1.

[0094] In some embodiments, step S4 further includes cutting the electroplated wiring 4 by a distance greater than 0.05 mm. If the cutting distance is too small, it will result in poor electrical insulation and affect the use of subsequent products.

[0095] In some embodiments, multiple wire terminals 3 are provided, and each wire terminal 3 is connected to each other by a connecting rib 31. Step S4 further includes: removing the connecting rib 31, thereby disconnecting the electrical connection between each wire terminal 3.

[0096] This embodiment also provides a packaging base, including a main body, input / output terminals 2', and wire terminals.

[0097] The main body is configured as a conductor and includes a substrate and a frame disposed on the substrate, the frame having a mounting groove.

[0098] The input / output terminal 2′ includes an insulator 21′, conductive wiring 22′ on the insulator 21′, and a storage part 5. The insulator 21′ is installed in the mounting slot 1.

[0099] The wire terminal is electrically connected to the conductive wiring 22'.

[0100] The retention section 5 is formed by removing a portion of the electroplated wiring 4 from the aforementioned electroplated structure. After a portion of the electroplated wiring 4 is removed, there is no electrical connection between the main body, the conductive wiring 22', and the wire terminals. Figure 2 and Figure 16 As shown.

[0101] In this embodiment, after the electroplating operation of the above-mentioned electroplating structure is completed, the portion of the electroplated wiring 4 exposed on the surface of the insulator 21′ in the above-mentioned electroplating structure is cut off, so that the electrical connection between the conductive wiring 22′ and the main body is disconnected. This reduces the difficulty of the electroplating operation of the packaging base, improves production efficiency, reduces economic costs, and ensures the normal use of the product.

[0102] The input / output terminal 2′ also includes a metal layer 4′, which is disposed on the surface of the insulator 21′ that is in contact with the main body; there is at least one retention portion 5, at least a portion of which is exposed on the surface of the insulator.

[0103] The retention portion 5 in the packaging base is formed by cutting the electroplated wiring 4 in the electroplating structure. The cutting position and cutting length can be flexibly set.

[0104] This embodiment provides several specific structural examples:

[0105] In some embodiments, the input / output terminal 2′ further includes a metal layer 4′, which is disposed on the surface of the insulator 21′ that contacts the main body; in other embodiments, please refer to Figure 10 In addition to being disposed on the side and bottom surfaces of the insulator 21', the metal layer 4' can also be disposed on the top surface of the insulator 21'. The metal layer 4' can be indirectly electrically connected to the main body, such as by disposing of a conductive sealing ring on the top surface.

[0106] Please refer to Figure 5 and Figure 6 When the electroplated wiring 4 in the electroplating structure is completely set on the surface of the insulator 21, the two ends of the electroplated wiring 4 are connected to the conductive wiring 22 and the metal layer 23 respectively. In the corresponding encapsulation base, the remaining part after cutting the electroplated wiring 4 forms the retention part 5 in the encapsulation base on the surface of the insulator 21'.

[0107] Please refer to Figure 11 and Figure 13When part of the electroplated wiring 4 of the electroplated structure is inside the insulator 21 and part of it is on the outer surface of the insulator 21, part of the corresponding encapsulation base retention part 5 is inside the insulator 21' and part of it is on the outer surface of the insulator 21'.

[0108] The electroplating effect is demonstrated here through experimental data.

[0109] Fourteen groups of experiments were set up, and the specific parameters are shown in Table 1.

[0110] Table 1. Electroplating wiring setup for each test group

[0111]

[0112]

[0113] The packaging substrate underwent performance testing, as detailed below:

[0114] Test metric 1: Production efficiency (hanging efficiency)

[0115] Qualified range:

[0116] Test method: Calculate the manufacturing time for every 100 corresponding packaging bases.

[0117] Test index 2: Coating integrity

[0118] Acceptable range: Ni coating thickness: 2~9μm; Au coating thickness: ≥1.0μm

[0119] Test method: Use an X-ray fluorescence thickness gauge to test the gold plating thickness of the main component 1 and the pads to ensure that the gold plating thickness is not lower than the lower limit required by the product.

[0120] Test indicator 3: Short circuit or open circuit condition

[0121] Test method: Use a flying probe tester to test the open circuit and short circuit between the various components of the product; the substrate 14 and the frame 15, and the wire terminal 3 and the conductive wiring pattern 22 should maintain electrical connection, and there should be no short circuit between the conductive wiring pattern 22 and the frame 15.

[0122] Table 2 Test results for each experimental group

[0123]

[0124]

[0125] Therefore, by setting up electroplating wiring 4 to electrically connect the main body 1, input / output terminals 2 and wire terminals 3 to each other, the electroplating requirements of the packaging base can be met, resulting in higher production efficiency, better plating integrity and fewer short circuit or open circuit defects.

[0126] The present invention also provides an optical device, including the above-described packaging substrate and an optical semiconductor element, wherein the optical semiconductor element is disposed within the cavity 13 of the packaging substrate.

[0127] Since the packaging base itself can reduce the difficulty of electroplating, it can improve production efficiency and reduce economic costs for the overall optical device product while ensuring the normal use of the product.

[0128] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. An electroplating structure for a packaging base, characterized in that, include: The main body is configured as a conductor and includes a substrate and a frame disposed on the substrate, the frame having a mounting groove; Input / output terminals include an insulator and conductive wiring and electroplated wiring disposed on the insulator, wherein the insulator is mounted at the mounting groove; The wire terminal is electrically connected to the conductive wiring. The electroplated wiring is provided, wherein the main body, the conductive wiring, and the wire terminals are electrically connected through the electroplated wiring, and at least a portion of the electroplated wiring is exposed on the surface of the insulator and does not overlap with the conductive wiring.

2. The electroplating structure of the encapsulation base according to claim 1, characterized in that: The input / output terminals also include a metal layer, which is disposed on the surface of the insulator that contacts the main body.

3. The electroplating structure of the encapsulation base according to claim 2, characterized in that: The metal layer is disposed on the surface of the insulator that contacts the groove wall of the mounting groove.

4. The electroplating structure of the encapsulation base according to claim 2, characterized in that, The main body also includes a sealing ring, which is configured as a conductor. The sealing ring is disposed on the upper surface of the frame and the insulator, and the sealing ring and the frame together clamp the insulator. The metal layer is disposed on the surface of the insulator that contacts the sealing ring.

5. The electroplating structure of the encapsulation base according to claim 1, characterized in that, Also includes: The connecting ribs are provided, and the wire terminals are configured in multiple ways, with each wire terminal connected to the other through the connecting ribs.

6. The electroplating structure of the encapsulation base according to claim 1, characterized in that: The main body and the input / output terminals form a cavity for mounting a semiconductor laser; The insulator includes a flat plate portion and a vertical wall portion disposed on the flat plate portion. The conductive wiring is disposed on the flat plate portion and is located on the surface of the flat plate portion connected to the vertical wall portion. The conductive wiring on the side of the vertical wall portion facing the inside of the cavity forms an internal pad, and the conductive wiring on the side of the vertical wall portion facing the outside of the cavity forms an external pad. The wire terminal is electrically connected to the external pad.

7. The electroplating structure of the encapsulation base according to claim 6, characterized in that: The ratio of the width of the electroplated wiring to the width of the internal pad is in the range of 1 / 10 to 1.

8. A packaging base, characterized in that, include: The main body is configured as a conductor and includes a substrate and a frame disposed on the substrate, the frame having a mounting groove; Input / output terminals include an insulator and conductive wiring disposed on the insulator, wherein the insulator is mounted at the mounting slot; The wire terminal is electrically connected to the conductive wiring. The remaining portion formed by removing a portion of the electroplated wiring of the electroplated structure according to any one of claims 1-7, wherein the main body has no electrical connection with the conductive wiring and the wire terminals.

9. The packaging base according to claim 8, characterized in that: The input / output terminals also include a metal layer, which is disposed on the surface of the insulator that contacts the main body. There is at least one or more retention sections, at least a portion of which is exposed on the surface of the insulator.

10. An optical device, characterized in that, include: The packaging base as described in claim 8 or 9; Optical semiconductor elements are disposed within the cavity of the package substrate.

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