Electronic device and method of manufacturing the same

Abstract

The present disclosure provides an electronic device, comprising: a back plate; a circuit board disposed on the back plate; a first attachment member disposed between the back plate and the circuit board; and a second attachment member disposed between the back plate and the circuit board; wherein the circuit board is fixed on the back plate through the first attachment member and the second attachment member, and a material of the first attachment member is different from a material of the second attachment member. The present disclosure also provides a method for manufacturing the electronic device.

Description

Technical Field

[0001] This disclosure relates to an electronic device and a method for manufacturing the same, and more particularly to an electronic device having a first attachment and a second attachment. Background Technology

[0002] Electronic devices, equipped with circuit boards, can be used in a wide range of applications. Traditionally, these circuit boards are attached to the back panel of the electronic device using screws. However, this method still suffers from drawbacks such as high cost, time consumption, and poor reliability.

[0003] Therefore, there is still a need to provide an electronic device to improve upon the existing shortcomings. Summary of the Invention

[0004] This disclosure provides an electronic device comprising: a backplate; a circuit board disposed on the backplate; a first attachment disposed between the backplate and the circuit board; and a second attachment disposed between the backplate and the circuit board; wherein the circuit board is fixed to the backplate by the first attachment and the second attachment, and the material of the first attachment is different from the material of the second attachment.

[0005] This disclosure also provides a method for manufacturing an electronic device, comprising the following steps: providing a backplate; disposing a circuit board on the backplate; disposing a first attachment between the backplate and the circuit board; and disposing a second attachment between the backplate and the circuit board; wherein the circuit board is fixed to the backplate by the first attachment and the second attachment, and the material of the first attachment is different from the material of the second attachment. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0007] Figure 2A This is a top view of a portion of an electronic device according to an embodiment of the present disclosure;

[0008] Figure 2B for Figure 2A A cross-sectional view of line segment I-I';

[0009] Figure 3 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure;

[0010] Figure 4 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure;

[0011] Figure 5 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure;

[0012] Figure 6This is a top view of a portion of an electronic device according to an embodiment of the present disclosure;

[0013] Figure 7 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure;

[0014] Figure 8 This is a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure.

[0015] The meanings of the reference numerals in the above figures are as follows:

[0016] 1-Electronic Devices

[0017] 100-Light Source Module

[0018] 200-Display Panel

[0019] 10-Backplate

[0020] 11-Protrusion

[0021] 20-First Attachment

[0022] 30-Second Attachment

[0023] 40-Circuit Board

[0024] 41-First Circuit Board

[0025] 42-Second Circuit Board

[0026] 43-Third Circuit Board

[0027] 50-Electronic Components

[0028] 60 connector

[0029] 70-Optical Adjustment Unit

[0030] B-Main Body

[0031] E-end

[0032] E1 - First end

[0033] E2 - Second end

[0034] H-opening

[0035] X-First Direction

[0036] Y-Second Direction

[0037] Z-Third-party direction Detailed Implementation

[0038] The present invention will now be described in detail with reference to exemplary embodiments thereof, which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0039] Throughout this specification and the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same element. This document is not intended to distinguish between elements that have the same function but different names. In the following specification and claims, words such as "containing" and "comprising" are open-ended terms and should therefore be interpreted as "containing but not limited to...".

[0040] The directional terms used herein, such as "up," "down," "front," "back," "left," and "right," are for reference only when referring to the accompanying drawings. Therefore, the directional terms used are illustrative and not intended to limit this disclosure. In the accompanying drawings, each figure illustrates general features of the methods, structures, and / or materials used in specific embodiments. However, these figures should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and positions of various films, regions, and / or structures may be reduced or enlarged.

[0041] In this disclosure, a structure (or layer, element, substrate) located on / above another structure (or layer, element, substrate) can refer to two structures being adjacent and in direct contact, or to two structures being adjacent but not in direct contact. Indirect contact means that there is at least one intermediate structure (or intermediate layer, intermediate element, intermediate substrate, intermediate spacer) between the two structures, with the lower surface of one structure adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure adjacent to or directly connected to the lower surface of the intermediate structure. The intermediate structure can be composed of a single or multiple solid or non-solid structure, without limitation. In this disclosure, when a structure is disposed "on" another structure, it may mean that the structure is "directly" on the other structure, or that the structure is "indirectly" on the other structure, i.e., at least one structure is sandwiched between the structure and the other structure. Terms such as "connection" and "interconnection," unless specifically defined, can refer to two structures being in direct contact, or to two structures not being in direct contact, with another structure disposed between the two structures. Furthermore, the term "joining" or "connection" can also include cases where both structures are movable or both structures are fixed. In addition, the term "electrical connection" includes any means of direct or indirect electrical connection.

[0042] The terms “approximately,” “equal to,” “same,” “substantially,” or “generally” are generally interpreted as being within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range. In this disclosure, a first direction is “generally” perpendicular to a second direction; more specifically, the angle between the first and second directions may be between 80 and 100 degrees.

[0043] The ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number of that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0044] In this disclosure, the thickness can be measured using an optical microscope, or it can be measured from a cross-sectional image in an electron microscope, but is not limited thereto. Furthermore, the terms "given range is from a first value to a second value" and "given range is within the range of the first value to the second value" indicate that the given range includes the first value, the second value, and other values ​​in between.

[0045] It should be understood that the features described below can be replaced, recombined, or mixed in several different embodiments to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0046] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It is understood that such terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in embodiments of this disclosure.

[0047] The electronic device disclosed herein may include electronic components. The electronic device may include, for example, a display device, a light-emitting device, an antenna device, a detection device, a touch display, a curved display, or a free-shape display, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The electronic device may include, for example, light-emitting diodes (LEDs), fluorescence, phosphorescence, other suitable display media, or combinations thereof, but is not limited thereto. Electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs (QDs, such as QLEDs, QDLEDs), or other suitable materials or any arrangement and combination of the above materials, but are not limited thereto. The display device may include, for example, a video wall display device, but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna, but is not limited thereto. It should be noted that the electronic device may be any of the aforementioned arrangements and combinations, but is not limited thereto. Furthermore, the electronic device may be rectangular, circular, polygonal, have curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, control system, light source system, shelving system, etc., to support the display device or splicing device. It should be noted that the electronic device may be any of the aforementioned arrangements and combinations, but is not limited thereto. The electronic device may include multiple components, and at least two components may be assembled to form a composite component. The following description uses a display device as an example of an electronic device to illustrate the contents of this disclosure, but this disclosure is not limited thereto.

[0048] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0049] like Figure 1 As shown, the electronic device 1 of this disclosure may include: a light source module 100; and a display panel 200 disposed on the light source module 100. The light source module 100 can provide light to the display panel 200 to display various images; therefore, the electronic device 1 of this disclosure may be a display device. In another embodiment not shown, the electronic device may include a light source module, and therefore the electronic device may be a light-emitting device, but this disclosure is not limited thereto.

[0050] Although not shown in detail in the figures, the display panel 200 may include upper and lower substrates, display units, sealing components, alignment films, polarizing plates, light-shielding layers, color filter layers, and / or driving elements, but this disclosure is not limited to these. Furthermore, the display panel may be, for example, a flexible display panel, a touch display panel, a curved display panel, or a tiled display panel, but this disclosure is not limited to these. The electronic device of this disclosure may be any electronic device including a display panel, such as a monitor, mobile phone, laptop computer, camera, video camera, music player, mobile navigation device, automotive electronic device, television, or other electronic device that needs to display images, but this disclosure is not limited to these.

[0051] Figure 2A This is a top view of a portion of an electronic device according to an embodiment of the present disclosure. Figure 2B for Figure 2A A cross-sectional view of line segment I-I'.

[0052] like Figure 2A and Figure 2B As shown, a back sheet 10 is provided first. In this disclosure, the material of the back sheet 10 may include metal, alloy, polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET) or other plastic or polymeric materials, or combinations thereof, but this disclosure is not limited thereto.

[0053] A circuit board 40 is disposed on a backplane 10. In this disclosure, the circuit board 40 may be a printed circuit board (PCB) or a flexible printed circuit board (FPCB). At least one electronic component 50 may be disposed on the circuit board 40 before being disposed on the backplane 10, wherein the electronic component 50 may be electrically connected to the circuit board 40. The electronic component 50 may be, for example, a light-emitting diode (LED), but this disclosure is not limited thereto. The circuit board 40 may be used to transmit signals and power to the electronic component 50 to drive the electronic component 50.

[0054] Next, a first attachment 20 and a second attachment 30 are respectively disposed between the back plate 10 and the circuit board 40, wherein the circuit board 40 can be fixed to the back plate 10 by means of the first attachment 20 and the second attachment 30. In this disclosure, the material of the first attachment 20 is different from the material of the second attachment 30. The material of the first attachment 20 may contain silicon, such as silicone, but this disclosure is not limited thereto. The material forming the first attachment 20 may be liquid or gel at room temperature, and can be cured after absorbing moisture to form the first attachment 20 for fixation. The cured first attachment 20 requires a high temperature (e.g., at least greater than 200 degrees Celsius, i.e., 200°C) to soften back into a liquid or gel state. The material of the second attachment 30 may contain polymer materials, such as pressure sensitive adhesive (PSA), hot melt pressure sensitive adhesive (HMPSA), hot melt adhesive, UV adhesive, double-sided tape, or combinations thereof, but this disclosure is not limited thereto. The material forming the second attachment 30 may be solid, gel, or liquid at room temperature. In some embodiments, when the material of the second attachment 30 is a hot melt pressure-sensitive adhesive or hot melt glue, it can be processed by heating (e.g., between 130°C and 200°C) to form a liquid state, and after cooling, it can be cured again to form the second attachment 30 for fixation. In some embodiments, when the material forming the second attachment 30 is a UV adhesive, it can be cured by irradiation with a UV lamp (e.g., a mercury lamp) to form the second attachment 30 for fixation. The cured second attachment 30 can be softened back into a liquid state at an environment of at least 90°C. In some embodiments, when the material of the second attachment 30 is a pressure-sensitive adhesive or double-sided tape, the second attachment 30 can be directly adhered to the back plate 10 or the circuit board 40. In one embodiment of this disclosure, the softening temperature of the first attachment 20 can be greater than the softening temperature of the second attachment 30. The "softening temperature" refers to the temperature at which the first attachment 20 or the second attachment 30, disposed on the backplate 10 or circuit board 40, begins to soften again into a liquid or gel state. Since the cured first attachment 20 requires a higher temperature (e.g., at least greater than 200°C) to soften again into a liquid or gel state, the softening temperature of the first attachment 20 can be considered higher than that of the second attachment 30. In this disclosure, suitable processing methods (e.g., spraying, spin coating, dispensing, adhesive bonding, etc.) can be used to dispose of the first attachment 20 and the second attachment 30 on the backplate 10 or circuit board 40, respectively. Furthermore, the processing methods for the first attachment 20 and the second attachment 30 can be the same or different; this disclosure is not limited thereto.In this disclosure, the processing order of the first attachment 20 and the second attachment 30 is not particularly limited. For example, the first attachment 20 can be set on the back plate 10 or circuit board 40 first, and then the second attachment 30 can be set on the back plate 10 or circuit board 40; or, the second attachment 30 can be set on the back plate 10 or circuit board 40 first, and then the first attachment 20 can be set on the back plate 10 or circuit board 40; or, the first attachment 20 and the second attachment 30 can be set on the back plate 10 or circuit board 40 simultaneously. In this disclosure, the thickness and shape of the first attachment 20 and the second attachment 30 are not particularly limited and can be adjusted as needed.

[0055] Therefore, the electronic device 1 of this disclosure may include: a back plate 10; a circuit board 40 disposed on the back plate 10; a first attachment member 20 disposed between the back plate 10 and the circuit board 40; and a second attachment member 30 disposed between the back plate 10 and the circuit board 40; wherein the circuit board 40 is fixed to the back plate 10 by the first attachment member 20 and the second attachment member 30. The electronic device 1 of this disclosure can fix the circuit board 40 to the back plate 10 by the first attachment member 20 and the second attachment member 30, and utilize the different material properties of the first attachment member 20 and the second attachment member 30 to achieve cost savings and / or improve defects such as poor adhesion.

[0056] In this disclosure, such as Figure 2A and Figure 2B As shown, a connector 60 may be provided on the circuit board 40, wherein the connector 60 can be electrically connected to the circuit board 40. The connector 60 can be used to electrically connect to an external signal or power source to transmit the external signal or power source to the circuit board 40. In one embodiment of this disclosure, as... Figure 2B As shown, when the electronic component 50 is a light-emitting diode (LED), an optical adjustment unit 70 may also be provided on the circuit board 40. More specifically, the optical adjustment unit 70 is disposed on both the circuit board 40 and the electronic component 50, and the optical adjustment unit 70 may be disposed corresponding to the electronic component 50. The optical adjustment unit 70 can be used to adjust (e.g., concentrate or disperse) the light emitted by the electronic component 50 to improve or enhance the light emission quality of the electronic device 1. In this disclosure, in the top view direction (e.g., the third direction Z) of the electronic device 1, the optical adjustment unit 70 may at least partially overlap with the electronic component 50. Furthermore, although... Figure 1 Not shown in detail, the light source module 100 may also include optical film assemblies such as reflective sheets, light guide plates, and diffuser sheets, but this disclosure is not limited thereto.

[0057] In this disclosure, such as Figure 2AAs shown, in the third direction Z of the electronic device 1, the circuit board 40 can extend along the first direction X. In the first direction X, the circuit board 40 may have a main body B and two ends E (e.g., a first end E1 and a second end E2). The main body B is connected to and located between the two ends E. A second attachment 30 may be provided corresponding to at least one end E of the circuit board 40, and an electronic component 50 may be provided corresponding to the main body B of the circuit board 40 and located between the two ends E (e.g., the electronic component 50 may be located between the first end E1 and the second end E2). In one embodiment of this disclosure, the first attachment 20 may be provided corresponding to the electronic component 50. More specifically, in the third direction Z of the electronic device 1, the electronic component 50 may at least partially overlap with the first attachment 20. This reduces the likelihood of the circuit board 40 warping due to heat generated by the electronic component 50 during operation. In one embodiment of this disclosure, the second attachment 30 may be disposed corresponding to an end E of the circuit board 40 (e.g., a first end E1 and / or a second end E2). More specifically, in a third direction Z of the electronic device 1, the second attachment 30 may at least partially overlap with an end E of the circuit board 40. In one embodiment of this disclosure, the connector 60 may be disposed corresponding to an end E of the circuit board 40 (e.g., a first end E1). More specifically, in a third direction Z of the electronic device 1, the connector 60 may at least partially overlap with an end E of the circuit board 40 (e.g., a first end E1). In one embodiment of this disclosure, in a third direction Z of the electronic device 1, the connector 60 may at least partially overlap with the second attachment 30.

[0058] In this disclosure, such as Figure 2A As shown, the electronic device 1 may further include multiple circuit boards 40 (e.g., a first circuit board 41, a second circuit board 42, and a third circuit board 43) disposed on the back plate 10; and multiple electronic components 50 disposed on the first circuit board 41, the second circuit board 42, and the third circuit board 43, respectively. The first circuit board 41, the second circuit board 42, and the third circuit board 43 may be arranged along a second direction Y, and the second circuit board 42 may be disposed between the first circuit board 41 and the third circuit board 43. The first circuit board 41, the second circuit board 42, and the third circuit board 43 may be fixed to the back plate 10 by a first attachment 20 and a second attachment 30, respectively. Here, the circuit boards 40 (e.g., the first circuit board 41, the second circuit board 42, and the third circuit board 43), the first attachment 20, the second attachment 30, and the electronic components 50 are as described above and will not be repeated here.

[0059] like Figure 2AAs shown, the electronic device 1 may include a plurality of first attachments 20, respectively disposed corresponding to the main body portion B of the first circuit board 41, the second circuit board 42, and the third circuit board 43, and the first attachments 20 may be disposed corresponding to the electronic components 50. Therefore, the first attachments 20 may be formed using a coating process and have an approximately circular block shape, but this disclosure is not limited thereto. Similarly, the second circuit board 42 and the third circuit board 43 may have a design similar to that of the first circuit board 41, which will not be described in detail here.

[0060] like Figure 2A As shown, the electronic device 1 may include a plurality of second attachments 30, respectively disposed at the ends E of the first circuit board 41, the second circuit board 42, and the third circuit board 43. Therefore, in a third direction Z of the electronic device 1, the second attachments 30 may at least partially overlap with the ends E of the first circuit board 41, the second circuit board 42, and the third circuit board 43, respectively. The second attachments 30 may have an approximately rectangular block shape, but this disclosure is not limited thereto.

[0061] Figure 3 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure. Figure 3 electronic devices and Figure 2A Similar, except for the following differences.

[0062] In this embodiment, as Figure 3 As shown, the second attachment 30 can extend continuously along the second direction Y and is simultaneously disposed corresponding to the ends E of the first circuit board 41, the second circuit board 42, and the third circuit board 43. More specifically, for example, the second attachment 30 can simultaneously be disposed corresponding to the first end E1 of the first circuit board 41, the first end E1 of the second circuit board 42, and the first end E1 of the third circuit board 43. Therefore, in the third direction Z of the electronic device 1, the second attachment 30 can simultaneously at least partially overlap with the ends E of the plurality of circuit boards 40. The second attachment 30 can be a strip-shaped structure with an approximately rectangular appearance, wherein the strip-shaped structure can extend along the second direction Y.

[0063] Figure 4 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure. Figure 4 electronic devices and Figure 2A Similar, except for the following differences.

[0064] In this embodiment, as Figure 4As shown, the first attachment 20 extends along the second direction Y and is simultaneously disposed corresponding to the main body portion B of the first circuit board 41, the second circuit board 42, and the third circuit board 43. The first attachment 20 can simultaneously correspond to multiple electronic components 50. More specifically, the first attachment 20 can simultaneously correspond to at least one electronic component 50 on the first circuit board 41, at least one electronic component 50 on the second circuit board 42, and at least one electronic component 50 on the third circuit board 43. Therefore, in the third direction Z of the electronic device 1, the first attachment 20 can simultaneously at least partially overlap with electronic components 50 on multiple different circuit boards. The first attachment 20 can be a strip-shaped structure with a strip-like appearance, wherein the strip-shaped structure can extend along the second direction Y. Furthermore, in one embodiment of this disclosure, in the third direction Z of the electronic device 1, at least a portion of the first attachment 20 may not overlap with the circuit board 40.

[0065] Figure 5 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure. Figure 5 electronic devices and Figure 2A Similar, except for the following differences.

[0066] In this embodiment, as Figure 5 As shown, the electronic device 1 may include a first attachment 20 disposed between a backplate 10 and a circuit board 40 (e.g., a first circuit board 41); and a plurality of electronic components 50 disposed on the circuit board 40 (e.g., the first circuit board 41). The first attachment 20 may extend along a first direction X and simultaneously correspond to the plurality of electronic components 50. Therefore, in a third direction Z of the electronic device 1, the first attachment 20 may simultaneously at least partially overlap with the plurality of electronic components 50 on the same circuit board 40 (e.g., the first circuit board 41). The first attachment 20 may be an elongated structure with an elongated appearance, wherein the elongated structure may extend along the first direction X. Similarly, as... Figure 5 As shown, the second circuit board 42 and the third circuit board 43 may have a similar design to the first circuit board 41, which will not be described in detail here.

[0067] Figure 6 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure. Figure 6 electronic devices and Figure 2A Similar, except for the following differences.

[0068] In this embodiment, as Figure 6As shown, the first attachment 20 extends along the second direction Y and is simultaneously disposed corresponding to the main body portion B of the first circuit board 41, the second circuit board 42, and the third circuit board 43. The first attachment 20 can simultaneously correspond to electronic components 50 on multiple different circuit boards. More specifically, the first attachment 20 can simultaneously correspond to at least one electronic component 50 on the first circuit board 41, at least one electronic component 50 on the second circuit board 42, and at least one electronic component 50 on the third circuit board 43. Therefore, in the third direction Z of the electronic device 1, the first attachment 20 can simultaneously at least partially overlap with multiple electronic components 50 on different circuit boards 40. The first attachment 20 can be a strip-shaped structure with a strip-shaped appearance, wherein the strip-shaped structure can extend along the second direction Y. Furthermore, in one embodiment of this disclosure, in the third direction Z of the electronic device 1, at least a portion of the first attachment 20 may not overlap with the circuit board 40.

[0069] Additionally, in this embodiment, as Figure 6 As shown, the second attachment 30 can extend along the second direction Y and is simultaneously disposed corresponding to the ends E of the first circuit board 41, the second circuit board 42, and the third circuit board 43. More specifically, for example, the second attachment 30 can simultaneously be disposed corresponding to the first end E1 of the first circuit board 41, the first end E1 of the second circuit board 42, and the first end E1 of the third circuit board 43. Therefore, in the third direction Z of the electronic device 1, the second attachment 30 can simultaneously at least partially overlap with the ends E of the plurality of circuit boards 40. The second attachment 30 can be a strip-shaped structure and has a strip-shaped appearance, wherein the strip-shaped structure can extend along the second direction Y.

[0070] Figure 7 This is a top view of a portion of an electronic device according to an embodiment of the present disclosure. Figure 7 electronic devices and Figure 2A Similar, except for the following differences.

[0071] In this embodiment, as Figure 7 As shown, the electronic device 1 may include a first attachment 20 disposed between a backplate 10 and a circuit board 40 (e.g., a first circuit board 41); and a plurality of electronic components 50 disposed on the circuit board 40 (e.g., the first circuit board 41). The first attachment 20 may extend along a first direction X and simultaneously correspond to the plurality of electronic components 50. Therefore, in a third direction Z of the electronic device 1, the first attachment 20 may simultaneously at least partially overlap with the plurality of electronic components 50 on the same circuit board 40 (e.g., the first circuit board 41). The first attachment 20 may be an elongated structure with an elongated appearance, wherein the elongated appearance may extend along the first direction X. Similarly, as... Figure 7As shown, the second circuit board 42 and the third circuit board 43 may have a similar design to the first circuit board 41, which will not be described in detail here.

[0072] Additionally, in this embodiment, as Figure 7 As shown, the second attachment 30 can extend along the second direction Y and is simultaneously disposed corresponding to the ends E of the first circuit board 41, the second circuit board 42, and the third circuit board 43. More specifically, for example, the second attachment 30 can simultaneously be disposed corresponding to the first end E1 of the first circuit board 41, the first end E1 of the second circuit board 42, and the first end E1 of the third circuit board 43. Therefore, in the third direction Z of the electronic device 1, the second attachment 30 can simultaneously at least partially overlap with the ends E of the plurality of circuit boards 40. The second attachment 30 can be a strip-shaped structure and has a strip-shaped appearance, wherein the strip-shaped structure can extend along the second direction Y.

[0073] Figure 8 This is a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure. Figure 8 and Figure 2B Similar, except for the following differences.

[0074] like Figure 8 As shown, the backplate 10 may include a protrusion 11; and the circuit board 40 may include an opening H, wherein the opening H corresponds to the protrusion 11. In this disclosure, the location of the protrusion 11 of the backplate 10 is not particularly limited. The circuit board 40 can engage with the protrusion 11 of the backplate 10 through the opening H for alignment, thereby improving assembly errors. In one embodiment of this disclosure, in the third direction Z of the electronic device 1, the projection of the protrusion 11 of the backplate 10 may overlap with the projection of the opening H of the circuit board 40. More specifically, in the third direction Z of the electronic device 1, the projection of the protrusion 11 of the backplate 10 may be located within the projection range of the opening H of the circuit board 40.

[0075] Characteristic analysis of the first and second attachments

[0076] The material of the first attachment A is a first type of silicone; the material of the first attachment B is a second type of silicone; the material of the second attachment A is a hot melt pressure-sensitive adhesive; and the material of the second attachment B is a UV adhesive. At room temperature, the first and second types of silicone are in a liquid or gel state, the hot melt pressure-sensitive adhesive is solid, and the UV adhesive is liquid. Adhesion testing was conducted using a cross-cut adhesion test, according to the ASTM D3002 / D3359 cross-cut adhesion test standard. Specifically, the test sample was cut with a blade in both horizontal and vertical directions into a grid of 100 squares, each 1 cm wide and long. Then, 3M 600 test tape was applied to the surface of the grid-like test sample and peeled off. The surface condition of the test sample after the tape was removed was measured and evaluated according to specifications. The test results are expressed in ASTM grades: 5B indicates no peeling surface; 4B indicates that the total peeling surface area is no more than 5% based on the total surface area; 3B indicates that the total peeling surface area is 5% to 15% based on the total surface area; 2B indicates that the total peeling surface area is 15% to 35% based on the total surface area; 1B indicates that the total peeling surface area is 35% to 65% based on the total surface area; and 0B indicates that almost all of the surface is peeled.

[0077] At room temperature, a first type of silicone and a second type of silicone are applied to a backing plate (the material contains iron). After absorbing moisture, both silicones cure into solids, forming first attachment A and first attachment B, respectively. Adhesion tests were performed on the cured first attachments A and B using a cross-cut adhesion test. The results are expressed in ASTM ratings: first attachment A received a 5B, and first attachment B received 2B to 4B. Furthermore, the cured first attachments A and B require relatively high temperatures (e.g., at least above 200°C) to soften again into a liquid or gel state. At room temperature, touching the cured first attachments A and B with a finger revealed a slight stickiness or no stickiness at all.

[0078] In addition, the first and second types of silicone were applied to an iron plate approximately 0.8 cm thick (here, the iron plate was used as the test backplate). Next, an aluminum plate approximately 1.0 cm thick (here, the aluminum plate was used as the test circuit board) was placed on the test backplate. After the first and second silicone absorbed moisture and cured, they formed the first attachment A and the first attachment B, which fixed the test circuit board to the test backplate. Then, the test circuit board and the test backplate were disassembled to separate them, and the residue of the first attachment A and the first attachment B was observed. It was found that most of the first attachment A remained on the test circuit board, while most of the first attachment B remained on the test backplate.

[0079] The hot-melt pressure-sensitive adhesive was heated to 160°C to 180°C to form a liquid state. This liquid hot-melt pressure-sensitive adhesive was then applied to the test backing plate. After cooling, the hot-melt pressure-sensitive adhesive cured to form the second attachment A. Separately, at room temperature, liquid UV adhesive was applied to the test backing plate and cured by irradiating it with an 800mW / cm² mercury lamp to form the second attachment B. Adhesion tests were performed on the cured second attachments A and B using a cross-cut adhesion test. The results are expressed in ASTM ratings: 5B for both second attachment A and second attachment B. Furthermore, both cured second attachments A and B softened again into a liquid state at temperatures above 90°C. At room temperature, touching the cured second attachments A and B with a finger revealed that both were tacky, and their tackiness was greater than that of the first attachments A and B.

[0080] In addition, following the above method, hot-melt pressure-sensitive adhesive and UV adhesive were applied to an iron plate with a thickness of approximately 0.8 cm (here, the iron plate is used as the test backplate). Next, an aluminum plate with a thickness of approximately 1.0 cm (here, the aluminum plate is used as the test circuit board) was placed on the test backplate. After the hot-melt pressure-sensitive adhesive and UV adhesive cured, second attachment A and second attachment B were formed to fix the test circuit board to the test backplate. Then, the test circuit board and the test backplate were disassembled to separate them, and the residue of second attachment A and second attachment B was observed. It was found that the area of ​​second attachment A remaining on the test circuit board and the test backplate was similar, with no significant difference, while most of the second attachment B remained on the test backplate.

[0081] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electronic device, characterized in that, Include: One back panel; A circuit board is mounted on this backplane; A first attachment is disposed between the backplate and the circuit board; and A second attachment is disposed between the back plate and the circuit board; The circuit board is fixed to the back plate by the first attachment and the second attachment, and the material of the first attachment is different from the material of the second attachment. The first attachment is made of silicon, and the second attachment is made of a polymer.

2. The electronic device according to claim 1, characterized in that, The softening temperature of the first attachment is greater than that of the second attachment.

3. The electronic device according to claim 1, characterized in that, In a top view of the electronic device, the circuit board has two ends, wherein the second attachment is provided at least one end of the circuit board.

4. The electronic device according to claim 3, characterized in that, It also includes at least one electronic component, wherein the at least one electronic component is disposed on the circuit board and located between the two ends.

5. The electronic device according to claim 4, characterized in that, In a top view of the electronic device, the at least one electronic component at least partially overlaps with the first attachment.

6. A method for manufacturing an electronic device, characterized in that, Includes the following steps: Provide a back panel; A circuit board is mounted on the backplane; A first attachment is disposed between the backplate and the circuit board; and A second attachment is provided between the back plate and the circuit board; The circuit board is fixed to the back plate by the first attachment and the second attachment, and the material of the first attachment is different from the material of the second attachment. The first attachment is made of silicon, and the second attachment is made of a polymer.

7. The preparation method according to claim 6, characterized in that, In a top view of the electronic device, the circuit board has two ends, wherein the second attachment is provided at least one end of the circuit board.

8. The preparation method according to claim 7, characterized in that, It also includes setting at least one electronic component on the circuit board, wherein the at least one electronic component is located between the two ends.

9. The preparation method according to claim 8, characterized in that, In a top view of the electronic device, the at least one electronic component at least partially overlaps with the first attachment.

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