Circuit board assembly with electromagnetic shielding function and method of manufacturing the same

Abstract

The application provides a manufacturing method of a circuit board assembly with electromagnetic shielding function, comprising the following steps: arranging a first electronic component on a circuit substrate; pressing a first copper-clad plate and a second copper-clad plate on opposite sides of the circuit substrate respectively to obtain a first intermediate body; arranging two first slots through the first intermediate body to obtain a second intermediate body; forming a first metal layer on the second intermediate body, wherein the first metal layer comprises a first surface layer and a second surface layer arranged on opposite sides of the second intermediate body, and a first hole wall layer arranged on hole walls of the first slots; arranging a first insulator on the first slots to obtain a third intermediate body; arranging two second slots through the third intermediate body, wherein each second slot is connected to two ends of the two first slots; arranging a second hole wall layer on hole walls of the second slots; electrically connecting the first surface layer, the second surface layer, the first hole wall layer and the second hole wall layer to form an electromagnetic shielding layer to obtain the circuit board assembly. The application also provides a circuit board assembly with electromagnetic shielding function.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and more particularly to a circuit board assembly with electromagnetic shielding function and its manufacturing method. Background Technology

[0002] With the development of the 5G millimeter-wave communication market, the evolution of antenna-in-package (AiP) technology has initiated the process of integrating radio frequency components and antennas. AiP technology integrates antennas, radio frequency chips, and other active / secondary electronic components within a package structure to achieve system-level wireless transmission capabilities.

[0003] In existing AiP (Antenna-in-Package) packaging processes, the active / secondary electronic components are typically packaged onto a circuit board first, then an antenna structure is laminated onto one side of the circuit board, followed by electrical connections between the components and the antenna. This method is costly and hinders the miniaturization and thinning of electronic products. Furthermore, current packaging technologies primarily achieve shielding by adding a grounded conductive cover or shell to the outside of the packaging structure. However, the conductive cover is usually fixed to the outside of the packaging structure with adhesive, making it susceptible to peeling or detachment due to external environmental influences. Moreover, the size and shape of this conductive cover must be compatible with different packaging structures, which increases manufacturing costs. Additionally, the conductive cover increases the overall package size and cannot be flexibly applied to high-density packaging structures, further hindering the miniaturization and thinning of electronic products. Summary of the Invention

[0004] In view of this, this application provides a method for manufacturing a circuit board assembly with electromagnetic shielding function.

[0005] In addition, this application also provides a circuit board assembly with electromagnetic shielding function.

[0006] This application provides a method for manufacturing a circuit board assembly with electromagnetic shielding function, including the following steps:

[0007] Including the following steps:

[0008] A circuit board is provided, wherein a receiving hole is formed through the circuit board;

[0009] A peelable layer is provided on one side of the circuit board, and the peelable layer covers the receiving hole;

[0010] At least one first electronic component is disposed in the receiving hole, the first electronic component including a first electrode facing the peelable layer;

[0011] An adhesive is disposed in the receiving hole;

[0012] Remove the peelable layer, and press a first copper-clad laminate and a second copper-clad laminate onto opposite sides of the circuit substrate to obtain a first intermediate body, wherein the second copper-clad laminate is connected to the first electrode;

[0013] Two first slots are made through the first intermediate body, and the two first slots are respectively located on opposite sides of the receiving hole. Multiple first blind holes are made through the second copper-clad laminate to obtain the second intermediate body. The first electrode is exposed through the first blind holes.

[0014] A first metal layer is formed on the second intermediate body. The first metal layer includes a first surface layer and a second surface layer disposed on opposite sides of the second intermediate body, and a first hole wall layer attached to the hole wall of the first slot. A portion of the second surface layer is attached to the first blind hole.

[0015] A first insulator is provided in the first slot to obtain a third intermediate;

[0016] Two second slots are formed through the third intermediate body, and the two second slots are respectively provided on the other opposite sides of the receiving hole. Each second slot is connected to the two ends of the two first slots.

[0017] A second hole wall layer is provided on the hole wall of the second slot, and the first surface layer, the second surface layer, the first hole wall layer and the second hole wall layer are electrically connected to form an electromagnetic shielding layer, which surrounds the first electronic component;

[0018] A second insulator is provided in the second slot to obtain the circuit board assembly.

[0019] In some embodiments, the step of removing a portion of the second surface layer to form a grounding layer, the grounding layer comprising a plurality of spaced-apart grounding lines, each of the grounding lines being electrically connected to the first electrode.

[0020] In some embodiments, the step "forming a first metal layer in the second intermediate" includes:

[0021] The second intermediate is electroplated on the entire plate to form the first metal layer;

[0022] The step "to provide a second hole wall layer on the hole wall of the second slot" includes:

[0023] The third intermediate is electroplated to form a second hole wall layer on the hole wall of the second slot.

[0024] In some embodiments, the step of "disposing at least one first electronic component in the receiving hole" further includes:

[0025] At least one second electronic component is disposed in the receiving hole, the second electronic component including a second electrode exposed through the first blind hole.

[0026] In some embodiments, after the step of "providing a second insulator in the second slot", the method further includes:

[0027] A third copper clad laminate is disposed on the side of the first surface layer opposite to the first copper clad laminate;

[0028] A second blind hole is formed through the third copper-clad laminate, the first surface layer, the first copper-clad laminate, and the adhesive, and the second electrode is exposed through the second blind hole to obtain the fourth intermediate body;

[0029] A second metal layer is formed on the fourth intermediate, the second metal layer including a third surface layer formed on the side of the third copper-clad laminate opposite to the first surface layer, and a third hole wall layer formed on the hole wall of the second blind hole, the third hole wall layer being connected to the second electrode;

[0030] A portion of the third surface layer is removed to form an antenna structure, which is electrically connected to the second electronic component.

[0031] In some implementations, the step "forming a second metal layer on the fourth intermediate" includes:

[0032] A release film is provided on the side of the second surface layer opposite to the second copper-clad laminate;

[0033] The fourth intermediate is electroplated to form the second metal layer; and

[0034] Remove the release film.

[0035] In some embodiments, the third copper-clad laminate includes a stacked dielectric layer and a copper foil layer, the dielectric layer facing the first surface layer;

[0036] The step "removing part of the third surface layer to form the antenna structure" includes:

[0037] The portion of the copper foil layer corresponding to the third surface layer is removed, and the remaining portion of the third surface layer and the portion of the copper foil layer superimposed on it form the antenna structure. The antenna structure has a plurality of first openings, and a portion of the dielectric layer is exposed through the first openings.

[0038] This application also provides a circuit board assembly with electromagnetic shielding function, including a circuit board substrate, a first electronic component, an adhesive, a first copper-clad laminate, a second copper-clad laminate, and an electromagnetic shielding layer. The circuit board substrate has a through-hole, the first electronic component is disposed in the through-hole, and the adhesive covers the first electronic component. The first copper-clad laminate and the second copper-clad laminate are disposed on opposite sides of the circuit board substrate, and a first slot and a second slot are formed around the through-hole. The first slot and the second slot penetrate the first copper-clad laminate, the circuit board substrate, and the second copper-clad laminate.

[0039] The electromagnetic shielding layer includes a first surface layer disposed on the side of the first copper-clad laminate facing away from the circuit substrate, a grounding line layer disposed on the side of the second copper-clad laminate facing away from the circuit substrate, a first hole wall layer formed on the hole wall of the first slot, and a second hole wall layer formed on the hole wall of the second slot; wherein, the first electronic component includes a first electrode, and the grounding line layer is electrically connected to the first electrode.

[0040] In some embodiments, the circuit board assembly further includes a second electronic component disposed in the receiving hole, the second electronic component including a second electrode, the grounding layer being electrically connected to the second electrode.

[0041] In some embodiments, the circuit board assembly further includes a dielectric layer and an antenna structure, wherein the dielectric layer is disposed on the side of the first surface layer opposite to the first copper-clad laminate, and the antenna structure is disposed on the side of the dielectric layer opposite to the first surface layer.

[0042] A second blind via is provided through the dielectric layer, the first copper-clad laminate, and the adhesive, and the second electrode is exposed through the second blind via. A third via wall is provided on the wall of the second blind via, and the third via wall layer is electrically connected to the second electrode and the antenna structure.

[0043] Compared to existing technologies, the method for manufacturing a circuit board assembly with electromagnetic shielding function provided in this application involves sequentially setting the first slot and the second slot around the first and second electronic components, forming the first surface layer on one side of the first copper-clad laminate, forming the second surface layer on one side of the second copper-clad laminate, forming the first hole wall layer in the first slot, and forming the second hole wall layer in the second slot. This allows the first surface layer, the second surface layer, the first hole wall layer, and the second hole wall layer to be electrically connected to each other to form an electromagnetic shielding layer. The electromagnetic shielding layer is manufactured during the circuit board layering process. This method is simple to operate, has low manufacturing costs, and the size and shape of the formed electromagnetic shielding layer are controllable, making it difficult to peel off or fall off. It can effectively isolate electromagnetic signal interference and does not require additional electromagnetic shielding shells, enabling thinner and lighter electronic products.

[0044] In addition, by setting the second blind hole and electroplating simultaneously during the layering process, the antenna structure is formed and the electrical connection between the antenna structure and the second electronic component and the antenna structure is completed. The operation is simple, no additional antenna circuit board is required, the manufacturing cost is low, and the antenna structure is conducive to the miniaturization and thinning of the electronic product. Attached Figure Description

[0045] Figure 1 This is a cross-sectional schematic diagram of a circuit board provided in an embodiment of this application.

[0046] Figure 2 Is Figure 1 The diagram shows a cross-section of the circuit board after the peelable layer has been attached to one side.

[0047] Figure 3 Is Figure 2 A schematic cross-sectional view of the first and second electronic components placed in the receiving hole shown.

[0048] Figure 4 Is Figure 3 The diagram shows a cross-section of the container after the adhesive body is installed in the air.

[0049] Figure 5 Is it removal? Figure 4 The diagram shows a cross-section after the peelable layer is shown.

[0050] Figure 6 Is Figure 4 The diagram shows a cross-sectional view of the first intermediate body obtained after the first copper-clad laminate and the second copper-clad laminate are respectively installed on both sides of the circuit board.

[0051] Figure 7 Is Figure 6 The diagram shows a cross-sectional view of the second intermediate obtained after the first intermediate body has a first slot and a first blind hole.

[0052] Figure 8 yes Figure 7 The top view of the second intermediate shown.

[0053] Figure 9 It is Figure 7 The diagram shows a cross-section of the second intermediate plate after the first metal layer has been formed by electroplating.

[0054] Figure 10 Is Figure 9 The diagram shows a cross-sectional view of the third intermediate body obtained after the first insulator is placed in the first slot.

[0055] Figure 11 Is Figure 10The diagram shows a cross-sectional view of the fourth intermediate obtained after the third intermediate has a second groove opened and a second hole wall layer is formed by electroplating.

[0056] Figure 12 yes Figure 11 The top view of the fourth intermediate shown.

[0057] Figure 13 Is Figure 12 The diagram shows a cross-section of the fourth intermediate body after a third copper-clad laminate and a release film are respectively installed on both sides and a second blind hole is opened.

[0058] Figure 14 Is Figure 13 The diagram shows a cross-sectional view of the third copper-clad laminate and the second blind via after the second metal layer is formed on the hole wall.

[0059] Figure 15 Is it removal? Figure 14 The diagram shows a cross-sectional view of the fifth intermediate obtained by etching the release film, etching the second surface layer to form a grounding line layer, and etching the first surface layer to form an antenna structure.

[0060] Figure 16 yes Figure 15 The top view of the fifth intermediate shown.

[0061] Figure 17 This is a cross-sectional schematic diagram of a circuit board assembly provided in an embodiment of this application.

[0062] Explanation of main component symbols

[0063] Circuit board assembly 100

[0064] Circuit board 10

[0065] Substrate layer 101

[0066] First Line Level 102

[0067] Second line layer 103

[0068] Reception Hole 11

[0069] Peelable layer 12

[0070] First Electronic Component 20

[0071] First ontology 201

[0072] First electrode 202

[0073] Second electronic component 21

[0074] Second Body 211

[0075] Second electrode 212

[0076] Adhesive 30

[0077] First copper-clad laminate 40

[0078] First dielectric layer 401

[0079] First copper foil layer 402

[0080] Second copper-clad laminate 41

[0081] Second dielectric layer 411

[0082] Second copper foil layer 412

[0083] First intermediate 1

[0084] First slot 50

[0085] Second slot 50a

[0086] First blind hole 51

[0087] Second intermediate 2

[0088] First metal layer 60

[0089] First seed layer 60a

[0090] First surface layer 601

[0091] Second layer 602

[0092] Grounding line layer 602a

[0093] Grounding line 6021

[0094] First borehole wall layer 603

[0095] Second borehole wall layer 603a

[0096] Electromagnetic shielding layer S

[0097] First insulator 61

[0098] Second insulator 61a

[0099] Third intermediate 3

[0100] Fourth intermediate 4

[0101] Third copper-clad laminate 70

[0102] Third dielectric layer 701

[0103] Third copper foil layer 702

[0104] Release film 71

[0105] Second blind hole 72

[0106] Second metal layer 80

[0107] Third layer 801

[0108] Antenna structure 801a

[0109] First opening 8011

[0110] Third hole wall layer 802

[0111] Second seed layer 802a

[0112] Fifth intermediate 5

[0113] First weld shielding layer 90

[0114] Second opening 901

[0115] Second weld shielding layer 91

[0116] Third opening 911

[0117] Solder paste 92

[0118] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0119] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0120] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0121] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0122] One embodiment of this application provides a method for manufacturing a circuit board assembly 100 with electromagnetic shielding function, including the following steps:

[0123] Step S1, please refer to Figure 1 A circuit board 10 is provided, and a receiving hole 11 is formed through the circuit board 10. The circuit board 10 includes a substrate layer 101 and a first circuit layer 102 and a second circuit layer 103 formed on opposite sides of the substrate layer 101.

[0124] The substrate layer 101 can be made of one of the following resins: epoxy resin, ABF resin, polypropylene (PP), BT resin, polyphenylene ether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the substrate layer 101 is made of ABF resin.

[0125] For step S2, please refer to [link / reference]. Figure 2 A peelable layer 12 is attached to one side of the circuit board 10.

[0126] In this embodiment, the peelable layer 12 seals one end of the receiving hole 11. The peelable layer 12 is disposed on the side of the second circuit layer 103 opposite to the substrate layer 101. The peelable layer 12 may be a polyimide (PI) film.

[0127] Step S3, please refer to Figure 3 A first electronic component 20 and a second electronic component 21 are disposed in the receiving hole 11.

[0128] The first electronic component 20 and the second electronic component 21 are also located on the peelable layer 12.

[0129] In this embodiment, the first electronic component 20 includes a first body 201 and a first electrode 202 electrically connected to the first body 201. The second electronic component 21 includes a second body 211 and a second electrode 212 electrically connected to the second body 211. Both the first electrode 202 and the second electrode 212 face one side of the peelable layer 12.

[0130] In this embodiment, the first electronic component 20 is an active component, specifically a chip. The second electronic component 21 is a passive component, specifically a resistor, capacitor, or inductor. There are two first electrodes 202, spaced apart. There are also two second electrodes 212, spaced apart.

[0131] For step S4, please refer to [link / reference]. Figure 4 An adhesive 30 is provided in the receiving hole 11.

[0132] The adhesive 30 covers the first electronic component 20 and the second electronic component 21, and a portion of the adhesive 30 overflows and forms on the surface of the first circuit layer 102 opposite to the substrate layer 101.

[0133] In this embodiment, the adhesive 30 can be ABF resin (Ajinomoto Build-up Film).

[0134] For step S5, please refer to [link / reference]. Figure 5 Remove the peelable layer 12.

[0135] Step S6, please refer to Figure 6 A first copper-clad laminate 40 is laminated on one side of the circuit substrate 10 where the first circuit layer 102 is provided, and a second copper-clad laminate 41 is laminated on one side of the circuit substrate 10 where the second circuit layer 103 is provided, to obtain a first intermediate body 1.

[0136] The first copper-clad laminate 40 includes a first dielectric layer 401 and a first copper foil layer 402 stacked together, with the first dielectric layer 401 facing the adhesive 30. The second copper-clad laminate 41 includes a second dielectric layer 411 and a second copper foil layer 412 stacked together, with the second dielectric layer 411 facing the adhesive 30, and a portion of the second dielectric layer 411 filling the gap between the two first electrodes 202 and the two second electrodes 212.

[0137] The materials of the first dielectric layer 401 and the second dielectric layer 411 can be selected from resins such as epoxy resin, ABF resin, polypropylene (PP), BT resin, polyphenylene oxyether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the materials of the first dielectric layer 401 and the second dielectric layer 411 are ABF resin.

[0138] For step S7, please refer to [link / reference]. Figure 7 and Figure 8 Two first slots 50 are formed through the first intermediate body 1, and multiple first blind holes 51 are formed on one side of the first intermediate body 1. The first electrode 202 and the second electrode 212 are exposed through the first blind holes 51 to obtain a second intermediate body 2.

[0139] The two first slots 50 are located on opposite sides of the receiving hole 11, that is, on opposite sides of the first electronic component 20 and the second electronic component 21.

[0140] In this embodiment, two first slots 50 can be longitudinally retrieved using a laser first, and then multiple first blind holes 51 can be drilled corresponding to the positions of the first electrode 202 and the second electrode 212 using a laser.

[0141] Step S8, please refer to Figure 9 The second intermediate 2 is electroplated on the whole plate to form a first metal layer 60. Part of the first metal layer 60 fills the hole wall of the first slot 50, and part of the first metal layer 60 fills the first blind hole 51.

[0142] The first metal layer 60 includes a first surface layer 601 formed on the side of the first copper-clad laminate 40 away from the adhesive body 30, a second surface layer 602 formed on the side of the second copper-clad laminate 41 away from the adhesive body 30, and a first hole wall layer 603 filled in the hole wall of the first slot 50, with a portion of the second surface layer 602 filling into the first blind hole 51.

[0143] Before the step of “electroplated the second intermediate 2 on the whole board to form a first metal layer 60”, the method further includes: plating the second intermediate 2 with copper on the whole board to form a first seed layer 60a.

[0144] The first seed layer 60a can be formed by, but is not limited to, chemical plating, sputtering, etc. In this embodiment, the first seed layer 60a is formed by horizontal copper plating.

[0145] For step S9, please refer to [link / reference]. Figure 10 A first insulator 61 is provided in the hollow first slot 50 to obtain a third intermediate 3.

[0146] In this embodiment, the first insulator 61 can be formed by filling the first slot 50 with insulating material and then heating and curing the insulating material.

[0147] Step S10, please refer to Figure 11 and Figure 12 Two second slots 50a are formed in the third intermediate 3, and a second hole wall layer 603a is electroplated on the hole wall of the second slot 50a. A second insulator 61a is formed in the hollow second slot 50a to obtain the fourth intermediate 4.

[0148] Each of the second slots 50a connects the two ends of the two first slots 50, that is, the two second slots 50a and the two first slots 50 form a closed quadrilateral, and the first electronic component 20 and the second electronic component 21 are disposed inside the quadrilateral.

[0149] In this embodiment, two second slots 50a can be first horizontally retrieved using a laser. Then, referring to steps S17 to S19, the second hole wall layer 603a is formed by whole-plate electroplating, and the second slots 50a are filled with insulating material to form the second insulator 61a.

[0150] The first surface layer 601, the second surface layer 602, the first hole wall layer 603, and the second hole wall layer 603a are electrically connected to each other, covering the first electronic component 20 and the second electronic component 21 to form an electromagnetic shielding layer S. This effectively isolates electromagnetic signal interference and eliminates the need for additional electromagnetic shielding shells. This allows for thinner and lighter electronic products that can be used with the first electronic component 20 and the second electronic component 21, which have a smaller volume and higher integration.

[0151] Step S11, please refer to Figure 13 A third copper-clad laminate 70 and a release film 71 are respectively pressed onto the opposite sides of the fourth intermediate body 4. The release film 71 is disposed on the side facing the first electrode 202 and the second electrode 212, and a second blind hole 72 is formed on the side of the third copper-clad laminate 70.

[0152] The third copper-clad laminate 70 includes a third dielectric layer 701 and a third copper foil layer 702 stacked together, with the third dielectric layer 701 facing the first surface layer 601. A second blind via 72 is provided corresponding to a second electrode 212, and the second blind via 72 penetrates the third copper-clad laminate 70, the first surface layer 601, the first copper-clad laminate 40, and the adhesive 30, with a portion of the second electrode 212 exposed through the second blind via 72.

[0153] Step S12, please refer to Figure 14 A second metal layer 80 is formed by electroplating on the side of the third copper-clad laminate 70 opposite to the first surface layer 601, and part of the second metal layer 80 fills into the hole wall of the second blind hole 72.

[0154] The second metal layer 80 includes a third surface layer 801 formed on the side of the third copper-clad laminate 70 opposite to the first surface layer 601, and a third hole wall layer 802 formed on the hole wall of the second blind via 72. The third hole wall layer 802 is electrically connected to the second electrode 212 of the second electronic component 21, thereby the second surface layer 801 is electrically connected to the second electronic component 21.

[0155] Before the step of “electroplated to form a second metal layer 80 on the side of the third copper-clad laminate 70 away from the first surface layer 601”, the method further includes: forming a second seed layer 802a on the hole wall of the second blind hole 72.

[0156] The second seed layer 802a can be formed by, but is not limited to, chemical plating, sputtering, etc. In this embodiment, the second seed layer 802a is formed by horizontal copper plating. The second seed layer 802a is electrically connected to the first seed layer 60a.

[0157] Step S13, please refer to Figure 15 and Figure 16 Remove the release film 71, etch the second surface layer 801 to form an antenna structure 801a, and etch a second surface layer 602 connected to the first electrode 202 and the second electrode 212 to form a ground line layer 602a, thereby obtaining the fifth intermediate 5.

[0158] The step of "etching the second surface layer 801 to form the antenna structure 801a" also includes simultaneously etching the third copper foil layer 702.

[0159] The antenna structure 801a has multiple first openings 8011, through which a portion of the third dielectric layer 701 is exposed. In this embodiment, the antenna structure 801a is generally coil-shaped.

[0160] The grounding line layer 602a includes a plurality of grounding lines 6021 arranged at intervals, and each grounding line 6021 is electrically connected to a first electrode 202 or a second electrode 212.

[0161] Step S14, please refer to Figure 17 A first solder resist layer 90 and a second solder resist layer 91 are respectively provided on opposite sides of the fifth intermediate body 5.

[0162] The first solder resist layer 90 has at least one second opening 901 through which the antenna structure 801a is exposed. The second solder resist layer 91 covers the grounding line layer 602a. The second solder resist layer 91 has multiple third openings 911 through which a portion of the grounding line 6021 is exposed.

[0163] Step S14 further includes: applying solder paste 92 to the third opening 911.

[0164] The solder paste 92 is electrically connected to the grounding line 6021. In this embodiment, the solder paste 92 is a solder ball. The first solder resist layer 90 and the second solder resist layer 91 are green paint.

[0165] The method for manufacturing the circuit board assembly 100 provided in this application involves setting the first slot 50 and the second slot 50a around the first electronic component 20 and the second electronic component 21, and directly using whole-board electroplating to form the first surface layer 601 on one side of the first copper-clad laminate, the second surface layer 602 on one side of the second copper-clad laminate, the first hole wall layer 603 in the first slot 50, and the second hole wall layer 603a in the second slot 50a. This allows the first surface layer 601, the second surface layer 602, the first hole wall layer 603, and the second hole wall layer 603a to be electrically connected to each other to form an electromagnetic shielding layer S. The electromagnetic shielding layer S is manufactured during the circuit board layering process. The operation is simple, the manufacturing cost is low, and the size and shape of the formed electromagnetic shielding layer S are controllable, making it difficult to peel off or fall off. It can effectively isolate electromagnetic signal interference, and there is no need to add other electromagnetic shielding shells, which can make electronic products thinner and lighter.

[0166] In addition, by setting the second blind hole and electroplating and etching during the layering process, the antenna structure 801a is formed simultaneously, and the electrical connection between the antenna structure 801a and the second electronic component 21 and the antenna structure 801a is completed. The operation is simple, no additional antenna circuit board is required, the manufacturing cost is low, and the antenna structure 801a is conducive to the miniaturization and thinning of the electronic product.

[0167] Please see Figure 16 and Figure 17 An embodiment of this application also provides a circuit board assembly 100 with electromagnetic shielding function manufactured by the above-described manufacturing method. The circuit board assembly 100 includes a circuit board 10, a first electronic component 20, a second electronic component 21, an adhesive 30, an electromagnetic shielding layer S, and an antenna structure 801a. The circuit board 10 has a through-hole 11. The first electronic component 20, the second electronic component 21, and the adhesive 30 are disposed in the through-hole 11. The adhesive 30 covers the first electronic component 20 and the second electronic component 21.

[0168] The circuit board 10 includes a substrate layer 101 and a first circuit layer 102 and a second circuit layer 103 formed on opposite sides of the substrate layer 101. The first electronic component 20 includes a first body 201 and a first electrode 202 electrically connected to the first body 201. The second electronic component 21 includes a second body 211 and a second electrode 212 electrically connected to the second body 211.

[0169] The circuit board 10 has a first copper-clad laminate 40 and a second copper-clad laminate 41 on opposite sides. The first copper-clad laminate 40 includes a first dielectric layer 401 and a first copper foil layer 402 stacked together, with the first dielectric layer 401 facing the adhesive 30. The second copper-clad laminate 41 includes a second dielectric layer 411 and a second copper foil layer 412 stacked together, with the second dielectric layer 411 facing the adhesive 30. Two first slots 50 and two second slots 50a are provided through the first copper-clad laminate 40, the circuit board 10, and the second copper-clad laminate 41. The two first slots 50 and the two second slots 50a are opposite to each other and are formed around the first electronic component 20 and the second electronic component 21, forming a quadrilateral. A plurality of first blind holes 51 are provided through the second copper-clad laminate 41, through which the first electrode 202 and the second electrode 212 are exposed.

[0170] The first copper-clad laminate 40 has a first surface layer 601 on the side opposite to the adhesive body 30, and the second copper-clad laminate 41 has a grounding line layer 602a on the side opposite to the adhesive body 30. Part of the grounding line layer 602a fills the first blind via 51. The grounding line layer 602a includes a plurality of spaced grounding lines 6021, each of which is electrically connected to a first electrode 202 or a second electrode 212. The hole wall of the first slot 50 has a first hole wall layer 603, and the hole wall of the second slot 50a has a second hole wall layer 603a. The first surface layer 601, the first hole wall layer 603, the second hole wall layer 603a, and the grounding line layer 602a surround the first electronic component 20 and the second electronic component 21 to form the electromagnetic shielding layer S.

[0171] The first slot 50 is provided with a first insulator 61, and the second slot 50a is provided with a second insulator 61a.

[0172] A third dielectric layer 701 is provided on the side of the first surface layer 601 opposite to the first copper-clad laminate 40. A second blind hole 72 is provided through the third dielectric layer 701, the first surface layer 601, the first copper-clad laminate 40, and the adhesive 30, and a second electrode 212 is exposed through the second blind hole 72. The antenna structure 801a is disposed on the side of the third dielectric layer 701 opposite to the first surface layer 601. The wall of the second blind hole 72 is provided with a third hole wall layer 802, which is connected to the antenna structure 801a and the second electrode 212, thereby electrically connecting the second electronic component 21 to the antenna structure 801a.

[0173] The third dielectric layer 701, on the side facing away from the first surface layer 601, is further provided with a first solder resist layer 90. The first solder resist layer 90 has at least one second opening 901, through which the antenna structure 801a is exposed. The grounding line layer 602a, on the side facing away from the second copper-clad laminate 41, is provided with a second solder resist layer 91. The second solder resist layer 91 has multiple third openings 911, through which a portion of the grounding line 6021 is exposed. Solder paste 92 is provided in the third opening 911, and the solder paste 92 is electrically connected to the grounding line 6021.

[0174] The above description is merely an optimized implementation of this application, but in actual applications, it should not be limited to this implementation.

Claims

1. A method for manufacturing a circuit board assembly with electromagnetic shielding function, characterized in that, Including the following steps: A circuit board is provided, wherein a receiving hole is formed through the circuit board; A peelable layer is provided on one side of the circuit board, and the peelable layer covers the receiving hole; At least one first electronic component is disposed in the receiving hole, the first electronic component including a first electrode facing the peelable layer; At least one second electronic component is disposed in the receiving hole, the second electronic component including a second electrode facing the peelable layer; An adhesive is disposed in the receiving hole, and the adhesive covers the first electronic component and the second electronic component; Remove the peelable layer, and press a first copper-clad laminate and a second copper-clad laminate onto opposite sides of the circuit substrate to obtain a first intermediate body, wherein the second copper-clad laminate is connected to the first electrode and the second electrode; Two first slots are made through the first intermediate body, and the two first slots are respectively located on opposite sides of the receiving hole. Multiple first blind holes are made through the second copper-clad laminate to obtain the second intermediate body. The first electrode and the second electrode are exposed through the first blind holes. A first metal layer is formed on the second intermediate body. The first metal layer includes a first surface layer and a second surface layer disposed on opposite sides of the second intermediate body, and a first hole wall layer attached to the hole wall of the first slot. A portion of the second surface layer is attached to the first blind hole. A first insulator is provided in the first slot to obtain a third intermediate; Two second slots are formed through the third intermediate body. The two second slots are respectively located on the other opposite sides of the receiving hole. Each second slot is connected to the two ends of the two first slots. The two second slots and the two first slots form a closed quadrilateral. The first electronic component and the second electronic component are located inside the quadrilateral. A second hole wall layer is provided on the hole wall of the second slot. The first surface layer, the second surface layer, the first hole wall layer and the second hole wall layer are electrically connected to form an electromagnetic shielding layer. The electromagnetic shielding layer surrounds the first electronic component and the second electronic component. A second insulator is provided in the second slot to obtain the circuit board assembly.

2. The method for manufacturing a circuit board assembly as described in claim 1, characterized in that, Also includes: A portion of the second surface layer is removed to form a grounding layer, which includes a plurality of spaced grounding lines, each of which is electrically connected to the first electrode.

3. The method for manufacturing a circuit board assembly as described in claim 1, characterized in that, The step "forming a first metal layer in the second intermediate" includes: The second intermediate is electroplated on the entire plate to form the first metal layer; The step "to provide a second hole wall layer on the hole wall of the second slot" includes: The third intermediate is electroplated to form a second hole wall layer on the hole wall of the second slot.

4. The method for manufacturing a circuit board assembly as described in claim 1, characterized in that, After step "setting a second insulator in the second slot", the method further includes: A third copper clad laminate is disposed on the side of the first surface layer opposite to the first copper clad laminate; A second blind hole is formed through the third copper-clad laminate, the first surface layer, the first copper-clad laminate, and the adhesive, and the second electrode is exposed through the second blind hole to obtain the fourth intermediate body; A second metal layer is formed on the fourth intermediate, the second metal layer including a third surface layer formed on the side of the third copper-clad laminate opposite to the first surface layer, and a third hole wall layer formed on the hole wall of the second blind hole, the third hole wall layer being connected to the second electrode; A portion of the third surface layer is removed to form an antenna structure, which is electrically connected to the second electronic component.

5. The method for manufacturing a circuit board assembly as described in claim 4, characterized in that, The step "forming a second metal layer on the fourth intermediate" includes: A release film is provided on the side of the second surface layer opposite to the second copper-clad laminate; The fourth intermediate is electroplated to form the second metal layer; and Remove the release film.

6. The method for manufacturing a circuit board assembly as described in claim 4, characterized in that, The third copper-clad laminate includes a stacked dielectric layer and a copper foil layer, with the dielectric layer facing the first surface layer; The step "removing part of the third surface layer to form the antenna structure" includes: The portion of the copper foil layer corresponding to the third surface layer is removed, and the remaining portion of the third surface layer and the portion of the copper foil layer superimposed on it form the antenna structure. The antenna structure has a plurality of first openings, and a portion of the dielectric layer is exposed through the first openings.

7. A circuit board assembly with electromagnetic shielding function, characterized in that, The device includes a circuit board, a first electronic component, a second electronic component, an adhesive, a first copper-clad laminate, a second copper-clad laminate, and an electromagnetic shielding layer. The circuit board has a through-hole, the first electronic component and the second electronic component are disposed in the through-hole, and the adhesive covers the first electronic component and the second electronic component. The first copper-clad laminate and the second copper-clad laminate are disposed on opposite sides of the circuit substrate. Two first slots and two second slots are formed around the receiving hole. The first slots and the second slots penetrate the first copper-clad laminate, the circuit substrate and the second copper-clad laminate. The two second slots and the two first slots form a closed quadrilateral. The first electronic component and the second electronic component are disposed inside the quadrilateral. The electromagnetic shielding layer includes a first surface layer disposed on the side of the first copper-clad laminate away from the circuit substrate, a grounding line layer disposed on the side of the second copper-clad laminate away from the circuit substrate, a first hole wall layer formed on the hole wall of the first slot, and a second hole wall layer formed on the hole wall of the second slot. The first electronic component includes a first electrode, the second electronic component includes a second electrode, and the grounding layer is electrically connected to the first electrode and the second electrode.

8. The circuit board assembly as claimed in claim 7, characterized in that, The circuit board assembly further includes a dielectric layer and an antenna structure. The dielectric layer is disposed on the side of the first surface layer opposite to the first copper-clad laminate, and the antenna structure is disposed on the side of the dielectric layer opposite to the first surface layer. A second blind via is provided through the dielectric layer, the first copper-clad laminate, and the adhesive, and the second electrode is exposed through the second blind via. A third via wall is provided on the wall of the second blind via, and the third via wall layer is electrically connected to the second electrode and the antenna structure.

Images