Processing device and method for manufacturing a processed product
Patent Information
- Application Number
- CN202280047979.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-08-03
- Filing Date
- 2022-03-22
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2042-03-22
AI Technical Summary
其结果,装置结构变得复杂
[0015]根据如此构成的本发明,可不需要使保持加工对象物的加工台移动的移动机构,并且将经单片化的加工对象物收容于筒状容器。
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Figure CN117678055B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a processing apparatus and a method for manufacturing processed articles. Background Technology
[0002] Previously, as shown in Patent Document 1, a cutting system was considered with the following structure: a strippicker moves in the X-axis direction to transfer a semiconductor strip from the loading device to the chuck stage of the cutting device; the chuck stage picks up the semiconductor strip and moves in the Y-axis direction to the rear of the system; then, the semiconductor strip is cut into semiconductor packages by a mandrel. Furthermore, the chuck stage is designed to move in the Y-axis direction using a ball screw mechanism. Additionally, as a component for housing the cut semiconductor package, as shown in Patent Document 2, a component housed in a rectangular transparent shell called a stick is considered.
[0003] However, in the cutting system, since the chuck table is moved using a ball screw for cutting, a conical member is required to protect the ball screw from processing water or chips during actual cutting, as shown in Patent Document 3. This necessitates the installation of multiple plate members on the conical member for protection. Consequently, the device structure becomes complex.
[0004] In addition, in the cutting system, the semiconductor strip is not only moved in the X-axis direction, but also moved to the rear of the system in the Y-axis direction in order to cut the semiconductor strip, thus increasing the footprint of the device.
[0005] Existing technical documents
[0006] Patent documents
[0007] Patent Document 1: Japanese Patent Publication No. 2007-536727
[0008] Patent Document 2: Japanese Patent Utility Model No. 63-131902
[0009] Patent Document 3: Japanese Patent Application Publication No. 2004-186361 Summary of the Invention
[0010] The problem that the invention aims to solve
[0011] Therefore, the present invention was made to solve the aforementioned problems. Its main objective is to eliminate the need for a moving mechanism that moves the worktable while maintaining the workpiece, and to house the monolithically processed workpiece in a cylindrical container.
[0012] Technical means to solve the problem
[0013] That is, the processing apparatus of the present invention is characterized by comprising: a processing table for holding a workpiece; a first holding mechanism for holding the workpiece to be transferred to the processing table; a processing mechanism for cutting the workpiece held on the processing table into a single piece; a transfer table for moving the single-piece workpiece through the processing mechanism; a second holding mechanism for holding the single-piece workpiece to be transferred from the processing table to the transfer table; and a transfer mechanism having a moving mechanism along the processing table. The workbench and the transfer table extend in an arrangement direction and share a common transfer shaft for moving the first holding mechanism and the second holding mechanism; a processing moving mechanism for moving the processing mechanism on a horizontal plane in a first direction along the transfer shaft and a second direction orthogonal to the first direction; a container setting section for providing a cylindrical container with an opening at one end to receive the monolithized processing object; and a conveying and receiving mechanism for conveying the monolithized processing object from the transfer table to the cylindrical container provided on the container setting section for receiving.
[0014] The effects of the invention
[0015] According to the present invention configured in this way, a moving mechanism that moves the processing table that holds the workpiece is not required, and the monolithized workpiece can be housed in a cylindrical container. Attached Figure Description
[0016] [ Figure 1 [Illustrated diagram] is a schematic diagram showing the structure of a cutting device according to an embodiment of the present invention.
[0017] [ Figure 2 [Illustrated view] is a perspective view schematically showing the cutting platform and its surrounding structure in the described embodiment.
[0018] [ Figure 3 [Illustration] is a schematic diagram (plan view) of the cutting platform and its surrounding structure in the described embodiment, viewed from the Z direction.
[0019] [ Figure 4 [Illustration 1] is a schematic diagram (front view) showing the structure of the cutting platform and its surrounding structure in the described embodiment, viewed from the Y direction.
[0020] [ Figure 5 [This is a front view] schematically showing the structure of the first holding mechanism and the conveying moving mechanism of the described embodiment, viewed from the Y direction.
[0021] [ Figure 6 [This is a side view] schematically showing the structure of the first holding mechanism and the conveying moving mechanism of the described embodiment, viewed from the X direction.
[0022] [ Figure 7 [Illustration 1] is a cross-sectional view schematically showing the structure of the rack and pinion mechanism of the described embodiment.
[0023] [ Figure 8 [This is a front view] schematically showing the structure of the second holding mechanism and the conveying moving mechanism of the described embodiment, viewed from the Y direction.
[0024] [ Figure 9 [1] is a schematic diagram (plan view) showing the structure of the transfer platform, container mounting section and conveying and receiving mechanism of the embodiment as viewed from the Z direction.
[0025] [ Figure 10 [A] is a perspective view and [B] is a cross-sectional view schematically illustrating the structure of the cylindrical container of the described embodiment.
[0026] [ Figure 11 [Illustration 1] is a diagram (front view) schematically showing the structure of the first conveying mechanism of the described embodiment, viewed from the Y direction.
[0027] [ Figure 12 [ ] is a schematic diagram showing (a) the good product route and (b) the defective product route of the classification mechanism based on the above implementation.
[0028] [ Figure 13 [Illustration] is a diagram schematically showing the movement paths of the first holding mechanism and the second holding mechanism in the embodiment described.
[0029] [ Figure 14 [] is a schematic diagram showing the classification mechanism of the modified implementation method. Detailed Implementation
[0030] Next, the invention will be described in more detail with examples. However, the invention is not limited to the following description.
[0031] As described above, the processing apparatus of the present invention is characterized by comprising: a processing table for holding a workpiece; a first holding mechanism for holding the workpiece to be transferred to the processing table; a processing mechanism for cutting and slicing the workpiece held on the processing table; a transfer table for moving the sliced workpiece through the processing mechanism; a second holding mechanism for holding the sliced workpiece to be transferred from the processing table to the transfer table; and a transfer mechanism having a moving mechanism along the […]. The processing table and the transfer table extend in an arrangement direction and share a common transfer shaft for moving the first holding mechanism and the second holding mechanism; a processing moving mechanism for moving the processing mechanism in a horizontal plane in a first direction along the transfer shaft and a second direction orthogonal to the first direction; a container setting part for providing a cylindrical container with an opening at one end to receive the monolithized processing object; and a conveying and receiving mechanism for conveying the monolithized processing object from the transfer table to the cylindrical container provided on the container setting part for receiving.
[0032] If it is the aforementioned processing apparatus, a structure is adopted in which the first holding mechanism and the second holding mechanism are moved by a common transfer shaft extending along the arrangement direction of the processing table and the transfer table. The processing mechanism is moved on a horizontal plane in a first direction along the transfer shaft and a second direction orthogonal to the first direction by a processing moving mechanism. Therefore, the workpiece can be monolithically processed without moving the processing table in the first and second directions. Thus, the processing table can be moved without using a ball screw mechanism or the like, and there is no need for a basalt member to protect the ball screw mechanism or the cover member to protect the basalt member. As a result, the structure of the processing apparatus can be simplified.
[0033] Furthermore, since the processing table does not move in the first and second directions on the horizontal plane, the movement space of the processing table and the unused space around it can be reduced, thus reducing the area occupied by the processing device.
[0034] Furthermore, the processed object that has been individually cut can be transported from the transfer platform to the cylindrical container provided on the container setting section by the transfer and receiving mechanism, and the processed object that has been individually cut can be received from the opening at one end of the cylindrical container.
[0035] Ideally, the transmission shaft and the machining moving mechanism should be configured such that the transmission shaft is arranged to pass through the machining moving mechanism above it.
[0036] With the aforementioned structure, the first holding mechanism, which moves along the transmission axis, can be moved above the machining moving mechanism, thereby preventing physical interference between the first holding mechanism and the machining moving mechanism. Furthermore, the second holding mechanism, which moves along the transmission axis, can be moved above the machining moving mechanism, thereby preventing physical interference between the second holding mechanism and the machining moving mechanism.
[0037] As a specific implementation of the transport and containment mechanism, the transport and containment mechanism ideally includes: an intermediate platform for temporarily holding the monolithized workpiece; a first transport mechanism for transporting the monolithized workpiece from the transfer platform to the intermediate platform; and a second transport mechanism for transporting the monolithized workpiece from the intermediate platform to the cylindrical container disposed on the container setting for containment.
[0038] In order to confirm or inspect the state of the monolithized workpiece, it is ideal to also include a camera unit that captures images of the monolithized workpiece held by the first conveying mechanism or the monolithized workpiece placed on the transfer table.
[0039] In order to automatically determine whether the processed object is good or bad, it is ideal to also include a determination unit that uses the video data obtained by the camera unit to determine whether the processed object is good or bad.
[0040] In order to automatically classify good and defective products based on the determination result of the determination unit, it is ideal to also include a classification mechanism that classifies the monolithic processed objects that are determined to be defective by the determination unit.
[0041] Ideally, the sorting mechanism is located within the second conveying mechanism.
[0042] Ideally, as a specific implementation of the sorting mechanism, the sorting mechanism can switch between a good product route that guides the monolithically processed workpieces determined as good by the determination unit to the cylindrical container, and a defective product route that discards the processed workpieces determined as defective by the determination unit to a waste container.
[0043] As a specific embodiment of a moving mechanism that allows the machining mechanism to move at least in the X direction (a first direction) and the Y direction (a second direction), the ideal machining moving mechanism includes: an X-direction moving part that allows the machining mechanism to move linearly in the X direction; and a Y-direction moving part that allows the machining mechanism to move linearly in the Y direction. The X-direction moving part has: a pair of X-direction guide rails disposed along the X direction across the machining table; and a support that moves along the pair of X-direction guide rails and supports the machining mechanism via the Y-direction moving part.
[0044] With the aforementioned structure, since the pair of X-direction guides are positioned across the machining table, the spacing between them can be increased. As a result, the impact of the Z-direction positional offset between the X-direction guides on machining can be reduced. That is, the offset in orthogonality between the rotating tool (e.g., an insert) and the machining table can be reduced, improving machining accuracy. Furthermore, for the X-direction guides, guides with lower specifications than before can be used.
[0045] In addition, the method of manufacturing the processed article using the aforementioned processing apparatus is also an embodiment of the present invention.
[0046] <An embodiment of the present invention>
[0047] Hereinafter, an embodiment of the processing apparatus of the present invention will be described with reference to the accompanying drawings. Furthermore, all figures shown below are schematic depictions that are appropriately omitted or exaggerated for ease of understanding. Identical components are labeled with the same reference numerals, and descriptions are appropriately omitted.
[0048] <Overall Structure of the Processing Equipment>
[0049] The processing apparatus 100 in this embodiment is a cutting device, which cuts the sealed substrate W, which is the object of processing, into multiple products P, which are processed products.
[0050] Here, the term "sealed substrate W" refers to a substrate on which electronic components such as semiconductor chips, resistors, and capacitors are connected, which has been resin-molded to at least seal the electronic components. The substrate constituting the sealed substrate W can be a lead frame, a printed circuit board, or, in addition, a semiconductor substrate (including semiconductor wafers such as silicon wafers), a metal substrate, a ceramic substrate, a glass substrate, or a resin substrate. Furthermore, wiring may or may not be provided on the substrate constituting the sealed substrate W.
[0051] Furthermore, in this embodiment, one side of the sealed substrate W and the product P becomes the mounting surface for subsequent mounting. In the description of this embodiment, the side used for subsequent mounting is referred to as the "mounting surface," and the side opposite to it is referred to as the "opposite surface."
[0052] Specifically, such as Figure 1 As shown, the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W to transfer it to the cutting tables 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B; a transfer table 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P to transfer them from the cutting tables 2A and 2B to the transfer table 5; a transfer moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting moving mechanism (processing moving mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B. In addition, a conveying mechanism (loader) for conveying the sealed substrate W is composed of a first holding mechanism 3 and a conveying moving mechanism 7, and a conveying mechanism (unloader) for conveying multiple products P is composed of a second holding mechanism 6 and a conveying moving mechanism 7.
[0053] In the following description, mutually orthogonal directions along the plane (horizontal plane) of the upper surfaces of cutting table 2A and cutting table 2B are respectively designated as the X direction as the first direction and the Y direction as the second direction, and the vertical direction orthogonal to the X and Y directions is designated as the Z direction. Specifically, Figure 1 The left-right direction is defined as the X direction, and the up-down direction as the Y direction. Although described later, the X direction is the direction of movement of the support 812, and it is orthogonal to the length direction (the direction of beam extension) of the beam (crossbeam) of the portal support 812, which has a pair of legs (see reference). Figure 2 and Figure 3 ).
[0054] <Cutting table 2A, Cutting table 2B>
[0055] Two cutting tables 2A and 2B are fixedly installed in the X, Y, and Z directions. Furthermore, cutting table 2A can rotate in the θ direction via a rotating mechanism 9A located beneath it. Similarly, cutting table 2B can rotate in the θ direction via a rotating mechanism 9B located beneath it.
[0056] These two cutting tables 2A and 2B are arranged along the X direction on a horizontal plane. Specifically, the two cutting tables 2A and 2B are configured such that their upper surfaces are on the same horizontal plane (at the same height in the Z direction) (see reference). Figure 4 ), and are arranged such that the centers of these upper surfaces (specifically, the rotation centers based on rotation mechanisms 9A and 9B) lie on the same straight line extending along the X direction (see reference). Figure 2 and Figure 3 ).
[0057] In addition, the two cutting platforms 2A and 2B adsorb and hold the sealed substrate W, such as Figure 1 As shown, two vacuum pumps 10A and 10B for adsorption and holding are configured corresponding to the two cutting platforms 2A and 2B. Each vacuum pump 10A and 10B is, for example, a water-sealed vacuum pump.
[0058] Here, the cutting platforms 2A and 2B are fixed in the XYZ directions, thus shortening the piping (not shown) connecting the vacuum pumps 10A and 10B to the cutting platforms 2A and 2B. This reduces pressure loss in the piping and prevents a decrease in adsorption force. As a result, even extremely small packages, such as those less than 1 mm square, can be reliably adsorbed onto the cutting platforms 2A and 2B. Furthermore, the reduction in adsorption force due to pressure loss in the piping is prevented, allowing for a reduction in the capacity of the vacuum pumps 10A and 10B, contributing to miniaturization and cost reduction.
[0059] <First Holding Agency 3>
[0060] like Figure 1 As shown, the first holding mechanism 3 holds the sealed substrate W in order to transport it from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B. Figure 5 and Figure 6 As shown, the first holding mechanism 3 includes: an adsorption head 31 with a plurality of adsorption portions 311 for adsorbing and holding the sealed substrate W; and a vacuum pump (not shown) connected to the adsorption portions 311 of the adsorption head 31. Furthermore, the adsorption head 31 is moved to a desired position by a conveying mechanism 7, etc., as described later, thereby conveying the sealed substrate W from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B.
[0061] like Figure 1As shown, the substrate supply mechanism 11 includes: a substrate receiving section 111 for receiving a plurality of sealed substrates W from the outside; and a substrate supply section 112 for moving the sealed substrates W received in the substrate receiving section 111 to a holding position RP held by the first holding mechanism 3. The holding position RP is set in the same row as the two cutting stages 2A and 2B in the X direction. In addition, the substrate supply mechanism 11 may also include a heating section 113 for heating the sealed substrates W to make them soft and easy to hold by the first holding mechanism 3.
[0062] <Cutting Mechanism 4>
[0063] like Figure 1 , Figure 2 and Figure 3 As shown, the cutting mechanism 4, as a processing mechanism, has two rotating tools 40 comprising blades 41A and 41B and two spindle portions 42A and 42B. The two spindle portions 42A and 42B are arranged with their rotation axes along the Y direction, and the blades 41A and 41B mounted on these spindle portions are arranged facing each other (see reference). Figure 3 The blades 41A of spindle section 42A and 41B of spindle section 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X and Z directions. Furthermore, as... Figure 4 As shown, the cutting device 100 in this embodiment is provided with a liquid supply mechanism 12, which has a spray nozzle 121 for spraying cutting water (machining fluid) to suppress the frictional heat generated by the blades 41A and 41B. The spray nozzle 121 is supported, for example, on the Z-direction moving part 83 described later.
[0064] <Transfer Platform 5>
[0065] like Figure 1 As shown, the transfer table 5 in this embodiment is a table for moving multiple products P that have been inspected by the inspection unit 13 described later. This transfer table 5 is called an indexing table and temporarily holds multiple products P. Furthermore, as... Figure 1 and Figure 9 As shown, the transfer table 5 is configured to move along the Y direction between a transfer position X1 where multiple products P are placed via the second holding mechanism 6 and a removal position X2 where multiple products P are transported via the transfer receiving mechanism 22. Furthermore, the transfer position X1 is located closer to the front than the transfer shaft 71 and is aligned with the two cutting tables 2A and 2B in a horizontal plane along the X direction, while the removal position X2 is located further inward than the transfer shaft 71.
[0066] <Inspection Department 13>
[0067] Here, as Figure 1 As shown, the inspection unit 13 is disposed between the cutting table 2A, the cutting table 2B, and the transfer table 5, and inspects a plurality of products P held in the second holding mechanism 6. In this embodiment, the inspection unit 13 has a first inspection unit 131 for inspecting the opposite side of the product P, and a second inspection unit 132 for inspecting the mounting surface of the product P. The first inspection unit 131 is a camera with an optical system for inspecting the opposite side, and the second inspection unit 132 is a camera with an optical system for inspecting the mounting surface. Alternatively, the first inspection unit 131 and the second inspection unit 132 may be shared.
[0068] In addition, in order to inspect both sides of the multiple products P through the inspection section 13, a reversing mechanism 14 is provided to reverse the multiple products P (see reference). Figure 1 The reversing mechanism 14 includes a holding table 141 for holding a plurality of articles P, and a reversing part 142 such as a motor for reversing the holding table 141 in a manner that makes the front and back sides reverse.
[0069] When the second holding mechanism 6 holds multiple products P on the processing tables 2A and 2B, the opposite side of the products P faces downwards. In this state, during the transfer of the multiple products P from the processing tables 2A and 2B to the reversing mechanism 14, the opposite side of the products P is inspected by the first inspection unit 131. Afterwards, the multiple products P held in the second holding mechanism 6 are reversed by the reversing mechanism 14, and then the reversing mechanism 14 moves to the position of the transfer table 5. During this movement, the mounting surface of the products P facing downwards is inspected by the second inspection unit 132. Afterwards, the products P are transferred to the transfer table 5.
[0070] <Second Maintenance Agency 6>
[0071] like Figure 1 As shown, the second holding mechanism 6 holds multiple products P to transport them from the cutting table 2A and the cutting table 2B to the holding table 141 or the transfer table 5. Figure 8 As shown, the second holding mechanism 6 includes: an adsorption head 61 with multiple adsorption sections 611 for adsorbing and holding multiple products P; and a vacuum pump (not shown) connected to the adsorption sections 611 of the adsorption head 61. The adsorption head 61 is then moved to a desired position by a conveying mechanism 7 (described later), thereby conveying the multiple products P from the cutting table 2A and the cutting table 2B to the holding table 141 or the transfer table 5.
[0072] <Transfer and Moving Mechanism 7>
[0073] like Figure 1As shown, the conveying moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting table 2A and the cutting table 2B, and moves the second holding mechanism 6 at least between the cutting table 2A, the cutting table 2B and the holding table 141.
[0074] Moreover, such as Figure 1 As shown, the conveying moving mechanism 7 has a common transfer shaft 71, which extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, for moving the first holding mechanism 3 and the second holding mechanism 6.
[0075] The transfer shaft 71 is positioned such that the first holding mechanism 3 is movable above the substrate supply section 112 of the substrate supply mechanism 11, and the second holding mechanism 6 is movable above the transfer stage 5 (see reference). Figure 1 Furthermore, the first holding mechanism 3, the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the transfer table 5 are all located on the same side (near the front) relative to the transfer shaft 71 when viewed from above. Additionally, the inspection unit 13, the reversing mechanism 14, the first cleaning mechanism 18, the second cleaning mechanism 19 (described later), and the container placement unit 21 are also located on the same side (near the front) relative to the transfer shaft 71.
[0076] Furthermore, such as Figure 5 , Figure 6 and Figure 8 As shown, the conveying moving mechanism 7 includes: a main moving mechanism 72 for moving the first holding mechanism 3 and the second holding mechanism 6 along the transfer shaft 71 in the X direction; a lifting moving mechanism 73 for moving the first holding mechanism 3 and the second holding mechanism 6 in the Z direction relative to the transfer shaft 71; and a horizontal moving mechanism 74 for moving the first holding mechanism 3 and the second holding mechanism 6 horizontally relative to the transfer shaft 71 in the Y direction.
[0077] like Figures 5-8 As shown, the main moving mechanism 72 has: a common guide rail 721, which is disposed on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, which moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.
[0078] The guide rail 721 extends in a straight line along the transfer axis 71 in the X direction, and is located within the same range as the transfer axis 71, namely, the first holding mechanism 3 is movable above the substrate supply section 112 of the substrate supply mechanism 11, and the second holding mechanism 6 is movable above the transfer stage 5. A sliding member 723 is slidably provided on the guide rail 721, and the first holding mechanism 3 and the second holding mechanism 6 are provided on the sliding member 723 via a lifting mechanism 73 and a horizontal movement mechanism 74. Here, the guide rail 721 is shared by the first holding mechanism 3 and the second holding mechanism 6, but the lifting mechanism 73, the horizontal movement mechanism 74, and the sliding member 723 are provided separately for each of the first holding mechanism 3 and the second holding mechanism 6.
[0079] The rack and pinion mechanism 722 includes: a cam rack 722a, shared by the first retaining mechanism 3 and the second retaining mechanism 6; and a pinion 722b, respectively disposed in the first retaining mechanism 3 and the second retaining mechanism 6, and rotated by an actuator (not shown). The cam rack 722a is disposed on a shared transmission shaft 71 and can be varied in length by connecting multiple cam rack elements. Additionally, the pinion 722b is disposed on a sliding member 723 and is referred to as a roller pinion, such as... Figure 7 As shown, the device includes: a pair of roller bodies 722b1 that rotate together with the rotating shaft of the motor; and a plurality of roller pins 722b2 that are equally spaced in the circumferential direction between the pair of roller bodies 722b1 and configured to roll relative to the roller bodies 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion, so that two or more roller pins 722b2 contact the cam rack 722a without backlash in either direction, resulting in good positioning accuracy when the first holding mechanism 3 and the second holding mechanism 6 move in the X direction.
[0080] like Figure 5 and Figure 8 As shown, the lifting and moving mechanism 73 is respectively arranged correspondingly to the first holding mechanism 3 and the second holding mechanism 6. Figure 5 and Figure 6 As shown, the lifting and moving mechanism 73 of the first holding mechanism 3 is disposed between the transmission shaft 71 (specifically the main moving mechanism 72) and the first holding mechanism 3, and includes: a Z-direction guide rail 73a disposed along the Z-direction; and an actuator 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. Furthermore, the actuator 73b may be, for example, a ball screw mechanism, a cylinder, or a linear motor. Additionally, as... Figure 8 As shown, the structure of the lifting and moving mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and moving mechanism 73 of the first holding mechanism 3.
[0081] like Figure 5 , Figure 6 and Figure 8 As shown, the horizontal moving mechanism 74 is respectively arranged correspondingly to the first holding mechanism 3 and the second holding mechanism 6. Figure 5 and Figure 6 As shown, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, and includes: a Y-direction guide rail 74a, arranged along the Y-direction; an elastic body 74b, which applies force to one side of the first holding mechanism 3 toward the Y-direction guide rail 74a; and a cam mechanism 74c, which moves the first holding mechanism 3 toward the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y-direction can be adjusted by rotating the eccentric cam using an actuator such as a motor.
[0082] In addition, such as Figure 8 As shown, the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the lifting movement mechanism 73 of the first holding mechanism 3. Alternatively, it can be configured such that the horizontal movement mechanism 74 is not provided in the second holding mechanism 6, or that neither the first holding mechanism 3 nor the second holding mechanism 6 has the horizontal movement mechanism 74 provided. Furthermore, similar to the lifting movement mechanism 73, the horizontal movement mechanism 74 can be made using, for example, a ball screw mechanism, a cylinder, or a linear motor instead of a cam mechanism 74c.
[0083] <Cutting moving mechanism 8 (processing moving mechanism)>
[0084] The cutting moving mechanism 8 causes the two spindle parts 42A and 42B to move linearly in the X, Y and Z directions respectively.
[0085] Specifically, such as Figure 2 , Figure 3 and Figure 4 As shown, the cutting moving mechanism 8 includes: an X-direction moving part 81 that moves the spindle parts 42A and 42B linearly in the X direction; a Y-direction moving part 82 that moves the spindle parts 42A and 42B linearly in the Y direction; and a Z-direction moving part 83 that moves the spindle parts 42A and 42B linearly in the Z direction.
[0086] The X-direction moving part 81 is shared by two cutting stations 2A and 2B, especially as Figure 2 and Figure 3As shown, the device includes: a pair of X-direction guide rails 811, arranged along the X direction and spaced apart by two cutting tables 2A and 2B; and a support body 812, which moves along the pair of X-direction guide rails 811 and supports spindle portions 42A and 42B via Y-direction moving portions 82 and Z-direction moving portions 83. The pair of X-direction guide rails 811 are arranged to the sides of the two cutting tables 2A and 2B arranged along the X direction. Furthermore, the support body 812 is, for example, gate-shaped, having a shape extending along the Y direction. Specifically, the support body 812 has a pair of legs extending upward from the pair of X-direction guide rails 811, and a beam portion (crossbeam portion) supported on the pair of legs, the beam portion extending along the Y direction.
[0087] Furthermore, the support 812 can move linearly in the X direction along a pair of X-direction guide rails 811, for example, via a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 can also be configured to move linearly in the X direction via other direct-acting mechanisms such as a linear motor.
[0088] Especially Figure 3 As shown, the Y-direction moving part 82 includes: a Y-direction guide rail 821, which is disposed in the support body 812 along the Y-direction; and a Y-direction slider 822, which moves along the Y-direction guide rail 821. The Y-direction slider 822 is driven, for example, by a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle parts 42A and 42B. Thus, the two spindle parts 42A and 42B can move independently of each other in the Y-direction. Alternatively, the Y-direction slider 822 can also be configured to move back and forth by using other linear mechanisms such as ball screw mechanisms.
[0089] like Figures 2-4 As shown, the Z-direction moving part 83 includes: a Z-direction guide rail 831, which is arranged along the Z-direction in each Y-direction slider 822; and a Z-direction slider 832, which moves along the Z-direction guide rail 831 and supports the spindle portions 42A and 42B. That is, the Z-direction moving part 83 is arranged correspondingly to each spindle portion 42A and 42B. The Z-direction slider 832 is driven, for example, by an eccentric cam mechanism (not shown), and moves linearly back and forth on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 can also be configured to move back and forth by other linear mechanisms such as a ball screw mechanism.
[0090] Regarding the positional relationship between the cutting moving mechanism 8 and the transmission shaft 71, as follows: Figure 1 and Figure 4As shown, the transmission shaft 71 is arranged to pass through the cutting moving mechanism 8 above it. Specifically, the transmission shaft 71 is arranged to pass through the support body 812 above it, and the transmission shaft 71 and the support body 812 are in a mutually intersecting positional relationship.
[0091] <Processing chip receiving section 17>
[0092] In addition, such as Figure 1 As shown, the cutting device 100 of this embodiment also includes a chip collection section 17, which collects the chip S, such as end material, generated during the cutting of the sealed substrate W.
[0093] like Figures 2-4 As shown, the chip collection section 17 is disposed below the cutting tables 2A and 2B, and includes: a guide groove 171 having an upper opening 171X that surrounds the cutting tables 2A and 2B when viewed from above; and a recovery container 172 for recovering the chip S guided by the guide groove 171. By disposing of the chip collection section 17 below the cutting tables 2A and 2B, the recovery rate of the chip S can be improved.
[0094] The guide chute 171 guides the machining chips S scattered or falling from the cutting table 2A and cutting table 2B to the recovery container 172. In this embodiment, the guide chute 171 is configured such that its upper opening 171X surrounds the cutting table 2A and cutting table 2B (see reference). Figure 3 Therefore, it is less likely to miss machining chips S, which can further improve the recovery rate of machining chips S. In addition, the guide chute 171 is provided in such a way that it surrounds the rotating mechanism 9A and rotating mechanism 9B which are provided below the cutting table 2A and the cutting table 2B (see reference). Figure 4 It is configured to protect the rotating mechanism 9A and rotating mechanism 9B from the effects of machining chips S and cutting water.
[0095] In this embodiment, the chip receiving section 17 is shared by the two cutting tables 2A and 2B, but it can also be provided corresponding to the cutting tables 2A and 2B respectively.
[0096] The recycling container 172 collects the machining chips S that pass through the guide chute 171 due to their own weight. In this embodiment, as... Figure 4As shown, the two cutting tables 2A and 2B are respectively provided. Furthermore, two recovery containers 172 are positioned near the front of the transfer shaft and are configured to be independently detachable from the front of the cutting device 100. This structure improves maintainability regarding the disposal of processing chips S. Moreover, the recovery container 172 can be provided as a single unit below all cutting tables, taking into account factors such as the size of the sealed substrate W, the size and quantity of processing chips S, and workability; or it can be divided into three or more units.
[0097] In addition, such as Figure 4 As shown, the chip receiving section 17 has a separation section 173 that separates the cutting water from the cutting chips S. As a structure for the separation section 173, a filter such as a perforated plate through which the cutting water passes can be considered, for example, being provided on the bottom surface of the recovery container 172. With the separation section 173, the cutting chips S can be recovered without accumulating cutting water in the recovery container 172.
[0098] <First Cleaning Agency 18>
[0099] In addition, such as Figure 1 and Figure 5 As shown, the cutting device 100 of the present invention further includes a first cleaning mechanism 18, which cleans the upper surface (mounting surface) of a plurality of products P held on the cutting table 2A and the cutting table 2B. The first cleaning mechanism 18 cleans the upper surface of the plurality of products P held on the cutting table 2A and the cutting table 2B by spraying cleaning liquid and / or compressed air through a spray nozzle 18a (see reference 18a). Figure 5 ), to clean the upper surface of product P.
[0100] like Figure 5 As shown, the first cleaning mechanism 18 is configured to move along the transmission shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is disposed on a sliding member 723, which slides on a guide rail 721 disposed on the transmission shaft 71. Here, a lifting and moving mechanism 181 is provided between the first cleaning mechanism 18 and the sliding member 723 to move the first cleaning mechanism 18 vertically in the Z direction. For example, a rack and pinion mechanism, a ball screw mechanism, or a cylinder can be used for the lifting and moving mechanism 181.
[0101] <Second Cleaning Agency>
[0102] Furthermore, such as Figure 1As shown, the cutting device 100 of the present invention further includes a second cleaning mechanism 19, which cleans the lower surface (opposite side) of the plurality of products P held in the second holding mechanism 6. The second cleaning mechanism 19 is disposed between the cutting table 2B and the inspection section 13, and cleans the lower surface of the products P by spraying cleaning fluid and / or compressed air onto the lower surface of the plurality of products P held in the second holding mechanism 6. That is, the second cleaning mechanism 19 cleans the lower surface of the products P midway as the second holding mechanism 6 moves along the transfer shaft 71.
[0103] <Structure of the tube containing the contents>
[0104] Furthermore, the cutting device 100 of this embodiment is configured to accommodate multiple articles P in a cylindrical container 20 (also referred to as a "tube container"). In addition, the cylindrical container 20 is sometimes referred to as a tube, magazine stick, stick magazine, stick, etc.
[0105] Specifically, such as Figure 1 , Figure 9 and Figure 10 As shown, the cutting device 100 includes: a container setting section 21 for setting a cylindrical container 20 that holds multiple products P from one end opening 20x; and a conveying and holding mechanism 22 for conveying the multiple products P from the transfer table 5 to the cylindrical container 20 set on the container setting section 21 for holding.
[0106] The container setting section 21 is provided with an empty cylindrical container 20 that does not contain the product P. The product P is inserted into the cylindrical container 20 through one end opening 20x by the conveying and receiving mechanism 22.
[0107] like Figure 1 and Figure 9 As shown, the container setting unit 21 of this embodiment includes: an empty container receiving unit 211 for receiving an empty cylindrical container 20; an insertion position setting unit 212 for dispensing an empty cylindrical container 20 from the empty container receiving unit 211 and setting the empty cylindrical container 20 at an insertion position where the product P is inserted from one end opening 20x; and a receiving container receiving unit 213 for receiving a fully loaded cylindrical container 20 or a receiving container 20 of a desired number.
[0108] Here, as Figure 10 As shown, the cylindrical container 20 houses multiple articles P arranged in a row. Specifically, the cylindrical container 20 has a straight-lined shape and an internal space for housing the articles P. Furthermore, the cross-sectional shape orthogonal to the length direction of the cylindrical container corresponds to the cross-sectional shape of the articles P. Figure 10The cylindrical container 20 shown has a structure where a portion of its sidewall is open along its length, but it can also be a structure where the sidewall is closed. Furthermore, the cylindrical container 20 can be configured to hold multiple articles P arranged in a single row, or it can be configured to hold multiple articles P arranged in multiple rows. Moreover, the cylindrical container 20 can be made of resin or metal. Figure 10 The diagram shows the form of product P with leads, but it can also be a leadless type such as Quad Flat No-Lead (QFN).
[0109] like Figure 1 and Figure 9 As shown, the conveying and receiving mechanism 22 includes: an intermediate platform 23 for temporarily holding multiple products P; a first conveying mechanism 24 for conveying multiple products P from the transfer platform 5 in the take-out position to the intermediate platform 23; and a second conveying mechanism 25 for conveying multiple products P from the intermediate platform 23 to the cylindrical container 20 provided on the insertion position setting part 212 on the container setting part 21 for receiving.
[0110] The intermediate platform 23 transfers the product P from the transfer platform 5, which is in the take-out position X2, via the first conveying mechanism 24 and temporarily places it there. Furthermore, the product P temporarily placed on the intermediate platform 23 is transferred to the cylindrical container 20 provided on the container placement section 21 via the second conveying mechanism 25. In this embodiment, the intermediate platform 23 is fixed in the X and Y directions, but it can also be configured to be movable.
[0111] The first conveying mechanism 24 moves multiple products P from the transfer table 5, which has moved to the take-out position X2, to the intermediate table 23 in a specified number (e.g., one).
[0112] Specifically, such as Figure 9 and Figure 11 As shown, the first conveying mechanism 24 includes: a product adsorption mechanism 241, which adsorbs and holds a plurality of products P on the transfer stage 5 in a predetermined number (e.g., one); and an adsorption moving mechanism 242, which moves the product adsorption mechanism 241 along the X direction.
[0113] like Figure 11 As shown, the product adsorption mechanism 241 includes: an adsorption head 241A, an adsorption section 241a for adsorbing and holding multiple products P; and a vacuum pump or vacuum ejector (not shown) connected to the adsorption section 241a of the adsorption head 241A. The product adsorption mechanism 241 is configured such that each adsorption section 241a adsorbs one product P. Furthermore, the multiple adsorption sections 241a are configured to move independently up and down, allowing each adsorption section 241a to adsorb a product P individually as it descends.
[0114] like Figure 11As shown, the adsorption moving mechanism 242 includes: an X-direction moving part 242a for moving the product adsorption mechanism 241 in the X direction; and a Z-direction moving part 242b for moving the product adsorption mechanism 241 in the Z direction. Furthermore, the adsorption moving mechanism 242 may also have a Y-direction moving part for moving the product adsorption mechanism 241 in the Y direction.
[0115] The X-direction moving part 242a includes: an X-direction guide rail 242a1, which is provided along the X-direction on the inner side of the transmission shaft 71; and a support body 242a2, which moves along the X-direction guide rail 242a1 and supports the article adsorption mechanism 241 via the Z-direction moving part 242b. Furthermore, the support body 242a2 moves linearly back and forth along the X-direction on the X-direction guide rail 242a1, for example, by means of a ball screw mechanism (not shown) extending along the X-direction. The ball screw mechanism is driven by a drive source (not shown) such as a servo motor. Alternatively, the support body 242a2 may also be configured to move back and forth by other linear mechanisms such as a linear motor.
[0116] like Figure 11 As shown, the Z-direction moving part 242b includes: a Z-direction guide rail 242b1, which is provided on the support body 242a2 along the Z-direction; and a Z-direction slider 242b2, which moves along the Z-direction guide rail 242b1 and supports the article adsorption mechanism 241. Furthermore, the Z-direction slider 242b2 moves linearly back and forth along the Z-direction guide rail 242b1 along the Z-direction, for example, by means of a ball screw mechanism (not shown) extending along the Z-direction. Alternatively, the Z-direction slider 242b2 can also be configured to move back and forth by means of other linear motion mechanisms such as a linear motor.
[0117] like Figure 9 and Figure 12 As shown, the second conveying mechanism 25 conveys the product P placed on the intermediate table 23 to the cylindrical container 20 provided on the insertion position setting part 212 on the container setting part 21, and inserts the product P into the opening 20x at one end of the cylindrical container 20 to receive it.
[0118] Specifically, the second conveying mechanism 25 has: a product guide 251 that guides the product P to one end opening 20x of the cylindrical container 20; and a product moving part 252 that moves the product P toward one end opening 20x of the cylindrical container 20 on the product guide 251.
[0119] The product guide 251 arranges and guides the product P to the cylindrical container 20. Since the cylindrical container 20 in this embodiment is arranged along the Y direction, the product guide 251 is also arranged along the Y direction. In this embodiment, since the container setting part 21 is provided near the front side of the transfer shaft 71 and the intermediate platform 23 is provided inside the transfer shaft 71, the product guide 251 is below the transfer shaft 71 and orthogonal to the transfer shaft 71.
[0120] The article moving part 252 includes a pressing member 252a for pressing the article P, and a driving part 252b for moving the pressing member 252a along the Y direction. Furthermore, the driving part 252b can be, for example, a ball screw mechanism, a cylinder, or a linear motor.
[0121] <Classification function of defective products>
[0122] The cutting device 100 of this embodiment has the function of classifying defective products by checking whether multiple products P are good or bad.
[0123] Specifically, such as Figure 1 , Figure 9 and Figure 12 As shown, the cutting device 100 also includes: a camera unit 26 for capturing images of multiple products P; a judgment unit 27 for using the image data obtained by the camera unit 26 to determine whether the multiple products P are good or bad; and a classification mechanism 28 for classifying the products P that are determined to be defective by the judgment unit 27.
[0124] The camera unit 26 is a camera that takes pictures of the product P held in the product adsorption mechanism 241 of the first conveying mechanism 24 from below, and takes pictures of the lower surface (opposite side) of the product P. Alternatively, it can be configured to take pictures of, for example, the upper surface (mounting surface) of the product P placed on the transfer table 5 through other camera units.
[0125] The determination unit 27 uses the video data obtained by the camera unit 26 to detect defects in the product P (such as bent leads, unfilled resin, air bubbles, etc.) to determine whether the product P is good or bad. The determination unit 27 includes a control unit CTL.
[0126] The sorting mechanism 28 is located within the second conveying mechanism 25, such as... Figure 12 As shown, the system switches between a good product route R1, which guides the product P determined as good by the determination unit 27 to the cylindrical container 20, and a defective product route R2, which discards the product P determined as defective by the determination unit 27 to the waste container 29.
[0127] Specifically, the sorting mechanism 28 is provided as a part of the product guide section 251, switching between the good product route R1 and the defective product route R2. In this embodiment, the sorting mechanism 28 has a rotary table 281 for holding the product P, and a moving mechanism 282 for moving the product P from the rotary table 281 to each route R1, R2. The good product route R1 and the defective product route R2 are switched by rotating the rotary table 281. Here, the good product route R1 is along the Y direction, and the defective product route R2 is along the X direction. Furthermore, the moving mechanism 282 can be configured with the same structure as the product moving section 252 of the second conveying mechanism 25.
[0128] <An example of the operation of a cutting device>
[0129] Next, refer to Figure 9 , Figure 11 , Figure 12 and Figure 13 An example of the operation of the cutting device 100 will be described. Furthermore, in Figure 13 The diagram shows the movement paths of the first holding mechanism 3 and the second holding mechanism 6 during the operation of the cutting device 100. In this embodiment, all operations or controls of the cutting device 100, such as the transport of the sealed substrate W, the cutting of the sealed substrate W, the inspection of the product P, and the tube reception of the product P, are controlled by the control unit CTL (see reference). Figure 1 )conduct.
[0130] The substrate supply section 112 of the substrate supply mechanism 11 moves the sealed substrate W housed in the substrate receiving section 111 toward the holding position RP held by the first holding mechanism 3 (see reference). Figure 1 ).
[0131] Next, as Figure 13 As shown, the conveying mechanism 7 moves the first holding mechanism 3 to the holding position RP, whereby the first holding mechanism 3 holds the sealed substrate W. Subsequently, the conveying mechanism 7 moves the first holding mechanism 3, holding the sealed substrate W, to the cutting tables 2A and 2B, whereby the first holding mechanism 3 releases its hold, and the sealed substrate W is placed on the cutting tables 2A and 2B. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72, and the position of the sealed substrate W in the Y direction is adjusted by the horizontal moving mechanism 74. Furthermore, the cutting tables 2A and 2B hold the sealed substrate W.
[0132] Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, the lifting and moving mechanism 73 raises the first holding mechanism 3 to a position where it does not physically interfere with the cutting moving mechanism 8 (support 812). Furthermore, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, if the support 812 is retracted from the cutting stage 2B towards the transfer stage 5, it is not necessary to raise and lower the first holding mechanism 3 as described above.
[0133] In this state, the cutting moving mechanism 8 moves the two spindle parts 42A and 42B sequentially in the X and Y directions, and by rotating the cutting tables 2A and 2B, the sealed substrate W is cut into a grid shape and monolithized.
[0134] After cutting, the conveying moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface (mounting surface) of the plurality of products P held on the cutting table 2A and the cutting table 2B. After cleaning, the conveying moving mechanism 7 moves the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.
[0135] Next, the conveying mechanism 7 moves the second holding mechanism 6 to the cutting table 2A and the cutting table 2B after cutting, where the second holding mechanism 6 holds multiple products P. Then, the conveying mechanism 7 moves the second holding mechanism 6, which holds the multiple products P, to the second cleaning mechanism 19. Thereby, the second cleaning mechanism 19 cleans the lower surface (opposite surface) of the multiple products P held in the second holding mechanism 6.
[0136] After cleaning, multiple products P held in the second holding mechanism 6 are inspected on their lower surface (opposite side) by the inspection section 131, and then transferred to the reversing mechanism 14. After being held on the opposite side by the reversing mechanism 14, they are reversed. After reversal, the reversing mechanism 14 moves and inspects the mounting surface of product P by the inspection section 132. After this double-sided inspection, product P is transferred from the reversing mechanism 14 to the transfer table 5.
[0137] The transfer stage 5, which holds multiple products P, moves to the removal position X2 (see reference). Figure 1 , Figure 9 and Figure 11 On the other hand, an empty cylindrical container 20 is provided in the insertion position setting part 212 of the container setting part 21 (see reference). Figure 9 and Figure 12 ).
[0138] In the stated state, such as Figure 11As shown, the first conveying mechanism 24 holds the product P from the transfer table 5, which is in the take-out position X2. Then, it moves upwards towards the camera unit 26. Thereby, the camera unit 26 captures an image of the product P held by the first conveying mechanism 24. Furthermore, the judgment unit 27 uses the image data obtained by the camera unit 26 to determine the quality of the product P. Afterwards, the first conveying mechanism 24 moves the product P to the intermediate table 23, releases the product P from its holding position, and places the product P on the intermediate table 23. The product P placed on the intermediate table 23 is then conveyed to the rotary table 281, for example, via the moving mechanism 282 of the sorting mechanism 28.
[0139] Based on the result of the quality determination by the judgment unit 27, the classification unit 28 switches between the good product route R1 and the defective product route R2 for each product P. If it is a good product, it switches to the good product route R1 (see...). Figure 12 (a) and the product P is transported to the product guide section 251 via the moving mechanism 282. The product P, transported to the product guide section 251, is inserted into the cylindrical container 20 for storage via the product moving section 252 of the second transport mechanism 25. On the other hand, if it is a defective product, it is switched to the defective product route R2 (see [reference]). Figure 12 (b) and the article P is transported to the waste container 29 by the moving mechanism 282 for disposal.
[0140] When the cylindrical container 20 is fully loaded, or when the cylindrical container 20 contains a desired number of articles P, the cylindrical container 20 that has been contained in the insertion position setting section 212 moves to the contained container receiving section 213, and an empty cylindrical container 20 is sent out from the empty container receiving section 211 and placed in the insertion position setting section 212.
[0141] <Effects of this implementation method>
[0142] According to the cutting device 100 of this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are configured to be connected via a common transfer shaft 71 extending along the arrangement direction of the cutting table 2A, the cutting table 2B, and the transfer table 5. The cutting mechanism 4 is moved in the horizontal plane in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction by the cutting moving mechanism 8. Therefore, the sealed substrate W can be monolithically produced without moving the cutting table 2A and the cutting table 2B in the X and Y directions. Thus, the cutting table 2A and the cutting table 2B can be moved without using a ball screw mechanism or the like, and there is no need for a basalt member to protect the ball screw mechanism or the like, or a cover member to protect the basalt member. As a result, the device structure of the cutting device 100 is simplified.
[0143] Furthermore, since the cutting table 2A and the cutting table 2B are structured to not move in the X and Y directions on the horizontal plane, the movement space of the cutting table 2A and the cutting table 2B and the useless space around them can be reduced, thereby reducing the area occupied by the cutting device 100.
[0144] Furthermore, multiple products P can be transferred from the transfer platform 5 to the cylindrical container 20 provided on the container setting section 21 by the transfer and receiving mechanism 22, and multiple products P can be received from one end opening 20x of the cylindrical container 20.
[0145] <Other variations and implementations>
[0146] Furthermore, the present invention is not limited to the embodiments described herein.
[0147] For example, in the embodiment described, the container setting part 21 is provided near the front side of the transfer shaft 71, but it may also be provided on the inner side of the transfer shaft 71.
[0148] In addition, the cylindrical container 20 provided in the container setting section 21 can be set along the X direction or other directions, in addition to being set along the Y direction.
[0149] Furthermore, regarding the classification mechanism 28, it only needs to be a structure that can be classified into products P judged as good and products P judged as defective, and it only needs to be a structure that removes defective products from the good product route. For example, the classification mechanism 28 can also be as follows: Figure 14 As shown in (a), an opening and closing mechanism 283 is provided on the bottom surface of the product guide 251 where the product P slides. Opening the opening and closing mechanism 283 allows defective products to fall and be removed. Alternatively, the sorting mechanism 28 may also be as follows... Figure 14 (b) shows a structure in which a removal mechanism 284 is provided to press a product P that has been determined to be defective and moves in the product guide 251 to the side, and the defective product is removed by pressing the product with the removal mechanism 284.
[0150] The camera unit 26 in the described embodiment captures images of the product P held on the first conveying mechanism 24, but it can also capture images of the product P placed on the transfer table 5. Alternatively, the camera unit 26 can be installed in the product adsorption mechanism 241 of the first conveying mechanism 24 to capture images of the product P placed on the transfer table 5 or the intermediate table 23. Furthermore, in addition to the camera unit in the described embodiment, the camera unit 26 can also be a camera unit installed in the product adsorption mechanism 241 of the first conveying mechanism 24.
[0151] In the described embodiment, a cutting device with a dual-cutting table and a dual-mandrel structure has been described, but it is not limited to this. It may also be a cutting device with a single-cutting table and a single-mandrel structure, or a cutting device with a single-cutting table and a dual-mandrel structure, etc.
[0152] Furthermore, the cam rack elements constituting the transmission shaft 71 can be configured by connecting multiple components. Therefore, for example, the cutting device (processing device) 100 can be configured as a modular structure that can be separated and connected (removed) between the second cleaning mechanism 19 and the inspection section 13. In this case, for example, a module that performs a different type of inspection than the inspection performed in the inspection section 13 can be added between the module on the second cleaning mechanism 19 side and the module on the inspection section 13 side. In addition, besides the structure illustrated here, the cutting device (processing device) 100 can also be configured as a modular structure that can be separated and connected (removed) at a certain point, and the added module can be a module with various functions other than inspection.
[0153] In addition, the present invention is not limited to the described embodiments, and various modifications can be made without departing from its spirit.
[0154] Industrial availability
[0155] According to the present invention, a moving mechanism that moves the processing table is not required, and the monolithic processing object can be housed in a cylindrical container.
[0156] Explanation of symbols
[0157] 100: Cutting device (processing device)
[0158] W: Sealed substrate (object to be processed)
[0159] P: Product (Processed Goods)
[0160] 2A, 2B: Cutting table (processing table)
[0161] 3: First Maintaining Agency
[0162] 4: Cutting mechanism (processing mechanism)
[0163] 5: Transfer stage
[0164] 6: Second Maintenance Agency
[0165] 7: Moving mechanism for transport
[0166] 71: Transmission Shaft
[0167] 8: Moving mechanism for processing
[0168] 81: X-direction moving part
[0169] 82: Y-direction moving part
[0170] 811: A pair of X-axis guide rails
[0171] 812: Support
[0172] 20: cylindrical container
[0173] 20x: Open at one end
[0174] 21: Container Setup Department
[0175] 22: Transfer to shelter
[0176] 23: Intermediate Platform
[0177] 24: First transport organization
[0178] 25: Second transport unit
[0179] 26: Camera Department
[0180] 27: Judgment Department
[0181] 28: Classification agencies
[0182] 29: Discarded Containers
[0183] R1: Good Product Route
[0184] R2: Defective Product Route
Claims
1. A processing apparatus, comprising: A processing table to hold the object being processed; A first holding mechanism holds the workpiece for transporting it to the processing table; The processing mechanism cuts the workpiece held on the processing table into single pieces; A transfer table moves the workpiece, which has been monolithized by the processing mechanism; The second holding mechanism holds the monolithic workpiece in order to transfer it from the processing table to the transfer table. The conveying mechanism has a common transmission shaft that extends along the arrangement direction of the processing table and the transfer table and is used to move the first holding mechanism and the second holding mechanism. A processing moving mechanism that allows the processing mechanism to move on a horizontal plane in a first direction along the transmission axis and in a second direction orthogonal to the first direction; A container housing section is used to provide a cylindrical container that receives the monolithic workpiece from one open end; and The transport and containment mechanism transports the monolithic processed object from the transfer platform to the cylindrical container disposed on the container housing for containment. in, The processing table is fixedly arranged in the first direction, the second direction, and the vertical direction. The processing moving mechanism causes the processing mechanism to move further along the vertical direction. The processing mechanism has a blade for cutting the workpiece. The blade rotates in a plane that includes the first direction and the vertical direction.
2. The processing apparatus according to claim 1, wherein, The transmission shaft is configured to pass transversely over the machining moving mechanism above it.
3. The processing apparatus according to claim 1 or 2, wherein, The transport and reception facilities include: The intermediate platform temporarily holds the monolithic processing object. A first conveying mechanism transports the monolithized processing object from the transfer table to the intermediate table; and The second conveying mechanism conveys the monolithic processing object from the intermediate table to the cylindrical container provided on the container setting section for housing.
4. The processing apparatus according to claim 3 further includes a camera unit, which captures images of the monolithic processing object held by the first conveying mechanism or the monolithic processing object placed on the transfer table.
5. The processing apparatus according to claim 4 further includes a determination unit, which uses the video data obtained by the camera unit to determine whether the monolithic processing object is good or bad.
6. The processing apparatus according to claim 5 further includes a sorting mechanism, which sorts the monolithic processing objects that are determined to be defective by the determination unit.
7. The processing apparatus according to claim 6, wherein, The sorting mechanism is located in the second conveying mechanism.
8. The processing apparatus according to claim 6, wherein, The sorting mechanism switches between a good product route that guides the monolithic processed object, which is determined to be good by the determination unit, to the cylindrical container, and a defective product route that discards the processed object, which is determined to be defective by the determination unit, to a waste container.
9. The processing apparatus according to claim 1 or 2, wherein, The processing moving mechanism includes: an X-direction moving part for linearly moving the processing mechanism in the X direction, which is the first direction; and a Y-direction moving part for linearly moving the processing mechanism in the Y direction, which is the second direction. The X-direction moving part includes: a pair of X-direction guide rails disposed along the X direction across the processing table; and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving part.
10. A method for manufacturing a processed article, wherein the processed article is manufactured using the processing apparatus as described in any one of claims 1 to 9.
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