Grinding equipment, grinding method, slip ring system and computed tomography (CT) scanner

Abstract

This disclosure provides a polishing apparatus for slip rings, relating to the fields of radiation detection, security inspection, or other applications. The polishing apparatus includes: a body; a connector mounted on the body, wherein the connector is configured to connect the body to a computed tomography (CT) scanner having the slip ring; and N polishing elements mounted on the body, wherein each polishing element is configured to contact a conductive ring of the slip ring and polish the contacted conductive ring during relative movement with the slip ring, where N is an integer greater than or equal to 1. This disclosure also provides a polishing method for slip rings, a slip ring system, and a CT scanner.

Description

Technical Field

[0001] This disclosure relates to the fields of radiation detection, security inspection, or other fields, and more specifically, to grinding apparatus, grinding methods, slip ring systems, and computed tomography (CT) scanners. Background Technology

[0002] Computed tomography (CT) equipment typically includes a scanning unit, a computer system, a power supply, and auxiliary equipment. The scanning unit includes a slip ring (rotating gantry), an X-ray tube mounted on the slip ring, and a detector. Computed tomography, based on X-ray imaging, is widely used in security checks, especially for inspecting suspicious items in luggage.

[0003] In realizing the inventive concept disclosed herein, the inventors discovered that in related technologies, slip rings transmit electrical energy and signals through rotational contact between stator-side carbon brushes and rotor-side conductive rings. Frictional wear inevitably occurs between the carbon brushes and the conductive rings. The carbon brushes, as consumable parts, need to be replaced periodically, while the conductive rings cannot be replaced. When the conductive rings exhibit abnormal wear, such as unevenness, grooves, or scratches, manual polishing or replacement of the slip ring body is necessary, which is time-consuming, labor-intensive, and costly. Summary of the Invention

[0004] In view of the above problems, this disclosure provides a grinding apparatus, a grinding method, a slip ring system, and a computed tomography (CT) scanner.

[0005] One aspect of this disclosure provides a polishing apparatus for a slip ring, comprising: a body; a connector mounted on the body, wherein the connector is configured to connect the body to a computed tomography device having the slip ring; and N polishing elements mounted on the body, wherein each polishing element is configured to contact a conductive ring of the slip ring and polish the contacted conductive ring during relative movement with the slip ring, wherein N is an integer greater than or equal to 1.

[0006] According to embodiments of this disclosure, each of the grinding elements is configured to grind the contacted conductive ring as the slip ring rotates, and remains stationary during the rotation of the slip ring.

[0007] According to embodiments of this disclosure, it further includes: N damping elements, each corresponding to one of the N grinding elements, wherein each damping element is further away from the slip ring than the grinding element it contacts, for providing buffering for the grinding element it contacts during the grinding process.

[0008] According to embodiments of this disclosure, it further includes: N adjusting members that correspond one-to-one with the N damping members, wherein each adjusting member is further away from the slip ring than the damping member it contacts, for adjusting the pressure of the corresponding grinding member on the contacting conductive ring.

[0009] According to embodiments of this disclosure, it further includes: N first sleeves, wherein the N grinding elements are installed in the N first sleeves in a one-to-one correspondence; and N second sleeves, wherein the N first sleeves are installed in the N second sleeves in a one-to-one correspondence; wherein one end of each grinding element that contacts the conductive ring of the slip ring extends out of the corresponding first sleeve and second sleeve.

[0010] According to an embodiment of this disclosure, N damping elements are installed one-to-one in N second sleeves; wherein each damping element contacts a first sleeve installed in the same second sleeve and is further away from the slip ring than the first sleeve, the first sleeve being movably installed in the same second sleeve.

[0011] According to an embodiment of this disclosure, N adjusting members are installed in N second sleeves in a one-to-one correspondence; wherein, for the first sleeve, damping member and adjusting member installed in the same second sleeve, the first sleeve is installed at one end of the second sleeve that is closer to the slip ring in the axial direction, the adjusting member is installed at the other end of the second sleeve that is further away from the slip ring in the axial direction, and the damping member is placed between the first sleeve and the adjusting member.

[0012] According to embodiments of this disclosure, each of the adjustment members is configured to adjust the pressure of the corresponding grinding member on the contacting conductive ring by moving closer to or further away from the first sleeve within the installed second sleeve.

[0013] According to an embodiment of this disclosure, the body includes: a plate-shaped member, including a first end and a second end opposite to each other; wherein, the connector is installed at the first end, the second sleeve is installed at the second end, and the axial direction of the second sleeve is perpendicular to the plate surface of the plate-shaped member.

[0014] According to an embodiment of this disclosure, the plate-like member further includes: an elongated hole disposed between the first end and the second end, the elongated hole extending in the length direction toward the first end and the second end; wherein the connector is disposed within the elongated hole, the connector being configured to change the conductive ring contacted by each grinding member by being closer to the first end or closer to the second end within the elongated hole.

[0015] According to an embodiment of this disclosure, it further includes: a dust collection box connected to a computed tomography device having the slip ring; wherein the dust collection box includes a box body with an opening, and N of the grinding elements are placed on one side of the opening of the box body.

[0016] According to an embodiment of this disclosure, the dust collection box further includes: a suction pipe installed on the non-opening side of the box body, configured to allow external airflow to pass through in order to suck away dust generated during grinding inside the box body.

[0017] According to embodiments of this disclosure, for any conductive ring of the slip ring, one or more of the N grinding elements are simultaneously in contact with the conductive ring.

[0018] According to embodiments of this disclosure, N of the grinding elements are configured to contact one-to-one with the N conductive rings of the slip ring.

[0019] According to embodiments of this disclosure, when N is greater than or equal to 2, at least two of the N grinding elements are in contact with the same conductive ring of the slip ring.

[0020] According to an embodiment of this disclosure, N of the grinding elements are configured to contact a corresponding number of grinding elements according to the wear degree of each conductive ring of the slip ring, the number being positively correlated with the wear degree.

[0021] Another aspect of the present disclosure provides a method for polishing a slip ring, characterized in that it includes: connecting a polishing device as described in any of the preceding claims to a computed tomography (CT) scanner having the slip ring; contacting each polishing element of the polishing device with a conductive ring of the slip ring; and polishing the contacted conductive ring by each polishing element during relative movement with the slip ring in a non-scanning state of the CT scanner.

[0022] Another aspect of the present disclosure provides a slip ring system, characterized in that it includes: a slip ring having at least one conductive ring disposed thereon, the slip ring being mounted on a computed tomography scanning device; and a grinding device as described in any of the preceding claims.

[0023] Another aspect of the present disclosure provides a computed tomography (CT) scanning apparatus, characterized in that it includes the slip ring system described above.

[0024] The above one or more embodiments have the following beneficial effects: They provide a method for grinding a contacting conductive ring, where the contacting conductive ring is ground during relative movement with the slip ring, replacing manual grinding or replacement of the slip ring body. This method can efficiently handle abnormalities such as unevenness, grooves, and scratches caused by uneven wear of the conductive ring during long-term use of the slip ring, avoiding problems such as unstable current and signal transmission, or even arcing that damages equipment components. This greatly reduces the waste of manpower, material resources, and financial resources, and effectively reduces equipment operating noise. Attached Figure Description

[0025] The foregoing contents, as well as other objects, features, and advantages of this disclosure, will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0026] Figure 1 A simplified schematic diagram of a CT apparatus according to some embodiments of the present disclosure is shown;

[0027] Figure 2 The schematic diagram illustrates the principle of a CT apparatus according to some embodiments of the present disclosure;

[0028] Figure 3 A perspective view of a slip ring system according to some embodiments of the present disclosure is shown schematically;

[0029] Figure 4 The schematic diagram illustrates the contact between a grinding apparatus and a slip ring according to some embodiments of the present disclosure;

[0030] Figure 5 Some embodiments of this disclosure are illustrated schematically. Figure 4 A cross-sectional view along line AA in the middle;

[0031] Figure 6 The illustrations illustrate some embodiments of this disclosure. Figure 5 A schematic diagram of the grinding device viewed from the C-direction;

[0032] Figure 7 Some embodiments of this disclosure are illustrated schematically. Figure 6 Sectional view along line BB;

[0033] Figure 8 The schematic diagram illustrates the structure of a dust collection box according to some embodiments of the present disclosure;

[0034] Figure 9 A flowchart illustrating a method for polishing slip rings according to some embodiments of the present disclosure is shown.

[0035] The reference numerals used in the above figures are as follows:

[0036] 100. CT device; 101. Conductive ring; 102. Carbon brush; 200. Conveying device; 300. Target; 400. Inspection channel; 500. X-ray tube; 600. Detector array; 700. Fixed bracket; 800. Rotating bracket; 1. Slip ring; 2. Support frame; 3. Grinding device; 301. Second sleeve; 302. Damping component; 303. Adjusting component; 304. Grinding component; 305. Connecting component; 306. Body; 307. First sleeve; 4. Dust collection box; 401. Box body; 402. Suction pipe; 403. Connecting screw.

[0037] It should be noted that, for clarity, the dimensions of the overall / partial structure or the overall / partial region in the drawings used to describe the embodiments of this disclosure may be enlarged or reduced, i.e., these drawings are not drawn to actual scale. Detailed Implementation

[0038] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0039] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0040] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0041] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0042] In related technologies, slip rings introduce electrical energy and related control signals through carbon brushes on the stator side. The slip ring body then transmits electrical energy and signals to the electrical components on the rotor side, such as the X-ray tube, high-voltage generator, and detector in a CT scanner. The image signals received by the detector are then processed and sent from the rotor side to the stator side. Frictional wear inevitably occurs between the carbon brushes and the slip rings. While the carbon brushes, as consumable parts, need to be replaced periodically, the slip rings cannot be replaced. Abnormal wear on the slip rings, such as unevenness, grooves, or scratches, can only be addressed by manual polishing or replacement of the slip ring body, which is time-consuming, labor-intensive, and costly.

[0043] This disclosure provides, in some embodiments, a polishing apparatus, a polishing method, a slip ring system, and a computed tomography (CT) scanner. For example, the polishing apparatus for a slip ring includes: a body; a connector mounted on the body, wherein the connector is configured to connect the body to a CT scanner having the slip ring; and N polishing elements mounted on the body, wherein each polishing element is configured to contact a conductive ring of the slip ring and polish the contacted conductive ring during relative movement with the slip ring, where N is an integer greater than or equal to 1.

[0044] According to embodiments of this disclosure, a grinding component is provided to contact the conductive ring and grind the contacted conductive ring during relative movement with the slip ring. This replaces the solution of manual grinding or replacing the slip ring body. It can efficiently handle abnormalities such as unevenness, grooves, and scratches caused by uneven wear of the conductive ring during long-term use of the slip ring. It avoids problems such as unstable current and signal transmission, or even arcing that damages equipment components, greatly reducing the waste of manpower, material resources, and financial resources, and effectively reducing equipment operating noise.

[0045] Figure 1 A simplified schematic diagram of a CT apparatus according to some embodiments of the present disclosure is shown; Figure 2 The schematic diagram illustrates the principle of a CT apparatus according to some embodiments of the present disclosure. Figure 3 A perspective view of a slip ring system according to some embodiments of the present disclosure is shown schematically.

[0046] It is important to note that Figure 1 and Figure 2 The examples shown are merely examples of embodiments applicable to this disclosure, intended to help those skilled in the art understand the technical content of this disclosure, but do not imply that embodiments of this disclosure cannot have other structures for use in other devices, systems, environments, or scenarios.

[0047] In some embodiments, see Figure 1 The CT device 100 (i.e., a computed tomography scanner) is suitable for inspecting packages, suitcases, handbags, and other objects 300 at locations such as train stations, airports, and docks for contraband such as drugs, explosives, and flammable materials. The CT device 100 includes: an inspection channel 400; a transport device 200 for transporting the object 300 within the inspection channel 400; and a scanning device configured to inspect the object 300 transported by the transport device 200. The transport device 200 includes a conveyor belt for carrying the object 300 and drive rollers for moving the conveyor belt.

[0048] See also Figures 1-3The CT apparatus 100 also includes: a support frame 2 including a fixed support 700 and a rotating support 800; a slip ring 1 rotatably supported in the support frame 2, through which the examination channel 400 passes; a drive mechanism (such as a motor, not shown) configured to drive the slip ring 1 to rotate relative to the support frame; and a scanning apparatus including the slip ring 1 (rotating gantry), an X-ray tube 500 mounted on the slip ring 1, and a detector array 600.

[0049] For example, the slip ring system includes a conductive ring 101 and a carbon brush 102. The slip ring 1 is a closed annular structure fixed on the CT rotating bracket 800 and approximately concentric with the CT scanning aperture. It is connected to various electrical components on the rotating bracket 800 and has a conductive ring 101 as a contact part. The carbon brush 102 is fixed on the CT fixed bracket 700 and contacts the conductive ring 101. Conductivity is achieved through friction between the conductive ring 101 and the carbon brush 102. The main material of the carbon brush 102 is graphite. During the operation of the CT equipment, the conductive ring 101 rotates at high speed with the CT rotating bracket 800. The carbon brush 102 will wear down during the friction with the conductive ring 101. In severe cases, short circuits may occur, affecting the normal use of the slip ring system and even causing damage to the slip ring system.

[0050] For example, during the inspection of target 300, the controller receives operation instructions input by the user through the computer at the workstation and controls the drive mechanism to move according to the operation instructions; the slip ring drives the X-ray tube 500 and detector array 600 to rotate under the drive mechanism, and at the same time, the X-ray tube 500 can generate an X-ray beam under the control of the controller. The X-ray beam passes through the inspected target 300 moving on the conveyor 200 and irradiates the detector array 600; the detector array 600 converts the received X-ray beam into electrical signals and transmits them to the data acquisition module; the image recognition module receives the data from the data acquisition module, reconstructs the received data and generates image data; the generated image data is transmitted to the computer, thereby identifying and inspecting the inspected target 300.

[0051] In some embodiments, the CT device 100 includes a slip ring system and a grinding device provided in some embodiments of this disclosure. (In conjunction with...) Figures 1-3 The following further elaborates on the technical solutions provided by the embodiments of this disclosure.

[0052] Figure 4 The schematic diagram illustrates the contact between a grinding apparatus and a slip ring according to some embodiments of the present disclosure; Figure 5 Some embodiments of this disclosure are illustrated schematically. Figure 4 A cross-sectional view along line AA in the middle; Figure 6 The illustrations illustrate some embodiments of this disclosure. Figure 5 A schematic diagram of the grinding device viewed from the C-direction; Figure 7 Some embodiments of this disclosure are illustrated schematically. Figure 6 A cross-sectional view along line BB.

[0053] In some embodiments, refer to Figures 1-7 The polishing device 3 for the slip ring 1 includes: a body 306; a connector 305 mounted on the body 306, wherein the connector 305 is configured to connect the body 306 to a computed tomography device having the slip ring 1; and N polishing elements 304 mounted on the body 306, wherein each polishing element 304 is configured to contact the conductive ring 101 of the slip ring 1 and polish the contacted conductive ring 101 during relative movement with the slip ring 1, where N is an integer greater than or equal to 1.

[0054] The body 306 is the mechanical support structure for all functional elements of the grinding device 3. The connector 305 is the assembly connecting the body 306 and the computed tomography (CT) scanner, and includes any suitable connecting elements such as protrusions, screws, nuts, or weld points, enabling screw connections, plug-in connections, etc. The grinding component 304 is a part mounted on the body 306 for grinding the conductive ring 101 of the slip ring 1. It can be made of various materials and shapes, depending on the grinding requirements and application scenario of the conductive ring 101 surface; for example, a cylindrical oilstone can be used.

[0055] The relative movement includes movement of at least one of the grinding element 304 and the slip ring 1. For example, the grinding element 304 may move about the surface of the conductive ring 101, or rotate along the conductive ring 101 for grinding; or both the grinding element 304 and the slip ring 1 may move. In other embodiments, each grinding element 304 is configured to grind the contacted conductive ring 101 as the slip ring 1 rotates, and remains stationary during the rotation of the slip ring 1. Automatic grinding can be achieved using the drive system and motion of the slip ring 1 itself.

[0056] When wear appears on the surface of the conductive ring 101 of the slip ring 1 in a computed tomography (CT) scanner, the polishing device 3 can be used to repair it, ensuring the surface smoothness and conductivity of the conductive ring 101, and guaranteeing the normal operation of the CT scanner. This allows for quick and efficient maintenance of the slip ring 1, improving work efficiency and production effectiveness.

[0057] In some embodiments, each polishing element 304 is aligned with the conductive ring 101 it contacts, for example, aligning the axis of the cylindrical oilstone with the normal to the end face of the conductive ring 101, such that one end of the oilstone is centered on the end face of the conductive ring 101, and the relative position remains stable. This ensures precise alignment between the cylindrical and annular end faces, achieving accuracy and stability during the polishing process. In other embodiments, the contact surfaces between each polishing element 304 and the conductive ring 101 it contacts are in close contact, for example, ensuring that one end of the oilstone completely overlaps with the end face of the conductive ring 101, placing them on the same plane and maintaining a gapless contact.

[0058] In some embodiments, for any conductive ring 101 of slip ring 1, one or more of the N grinding elements 304 simultaneously contact the conductive ring 101. This allows the number of grinding elements 304 to be set according to the grinding requirements of the conductive ring 101.

[0059] In some embodiments, N grinding elements 304 are configured to contact the N conductive rings 101 of the slip ring 1 in a one-to-one correspondence. For example, when N is 1, a single grinding element 304 grinds one conductive ring 101 at a time. When N is 2, two conductive rings 101 are ground simultaneously. This allows all grinding elements 304 to grind the conductive rings 101 simultaneously during one rotation of the slip ring 1, improving work efficiency.

[0060] In some embodiments, when N is greater than or equal to 2, at least two of the N grinding elements 304 contact the same conductive ring 101 of the slip ring 1, wherein the number of grinding elements contacting any conductive ring is different from the number of grinding elements contacting the remaining at least one conductive ring. At least two grinding elements 304 contact different positions on the same conductive ring 101, and grinding occurs simultaneously during the rotation of the slip ring 1, increasing the number of grinding passes and further improving grinding efficiency.

[0061] In some embodiments, N polishing elements 304 are configured to contact a corresponding number of polishing elements 304 according to the wear degree of each conductive ring 101 of the slip ring 1, with the number being positively correlated with the wear degree.

[0062] The more worn the conductive ring 101, the more grinding parts 304 it comes into contact with, ensuring the uniformity and effectiveness of the wear. For example, if conductive ring A has a high degree of wear, five grinding parts will contact it simultaneously, while conductive ring B has a low degree of wear, only one grinding part will contact it. During each rotation of the slip ring 1, conductive ring A is equivalent to undergoing five grinding processes, resulting in more thorough grinding and achieving the purpose of repairing and restoring the surface of conductive ring 101.

[0063] In some embodiments, the polishing device 3 further includes N damping elements 302, which correspond one-to-one with N polishing elements 304. Each damping element 302 is further away from the slip ring 1 than the polishing element 304 it contacts, and is used to provide buffering for the polishing element 304 it contacts during the polishing process.

[0064] Damping element 302 includes components with a buffering function to reduce or absorb impacts or vibrations during the grinding process. For example, damping element 302 can be an elastic element, such as a spring, a gasket or washer made of rubber or elastic material, etc.

[0065] The collaboration between the grinding element 304 and the damping element 302 makes the grinding process smoother, reduces damage to the grinding element 304 or the conductive ring 101, and improves the grinding effect. By providing a buffering effect, the damping element 302 can better protect the grinding element 304 and the conductive ring, extending their service life.

[0066] In some embodiments, the grinding device 3 further includes N adjusting members 303 that correspond one-to-one with N damping members 302, wherein each adjusting member 303 is further away from the slip ring 1 than the damping member 302 it contacts, and is used to adjust the pressure of the corresponding grinding member 304 on the contacting conductive ring 101.

[0067] Adjusting element 303 is a specific part used to adjust the pressure between the grinding element 304 and the contact conductive ring 101. For example, adjusting element 303 can be an adjusting screw. By rotating the adjusting screw, the pressure applied by the grinding element 304 to the conductive ring 101 can be changed, thereby adjusting the grinding force and effect.

[0068] In some embodiments, the pressure applied by the polishing member 304 to the conductive ring 101 can be adjusted according to the degree of wear of the conductive ring 101, so that the pressure of the polishing member 304 on each conductive ring 101 is the same or different.

[0069] In some embodiments, the grinding device 3 further includes N first sleeves 307 and N second sleeves 301. N grinding elements 304 are installed one-to-one within the N first sleeves 307; the N first sleeves 307 are installed one-to-one within the N second sleeves 301; one end of each grinding element 304 that contacts the conductive ring 101 of the slip ring 1 extends out of the corresponding first sleeve 307 and second sleeve 301.

[0070] Exemplarily, the first sleeve 307 provides a mounting position for the grinding element 304 and connects the grinding element 304 to the second sleeve 301. The second sleeve 301 positions and supports the first sleeve 307 and provides guidance for the grinding element 304 throughout the grinding process, ensuring that the grinding element 304 can be accurately positioned and perform effective grinding operations. The mounting structure of the first sleeve 307 and the second sleeve 301 ensures the stability and reliability of the entire grinding device 3.

[0071] In some embodiments, N damping elements 302 are installed in N second sleeves 301 in a one-to-one correspondence; wherein each damping element 302 is in contact with a first sleeve 307 installed in the same second sleeve 301, and is further away from the slip ring 1 than the first sleeve 307, the first sleeve 307 being movably installed in the same second sleeve 301.

[0072] For example, the damping element 302 can provide a damping effect, slowing down or controlling the movement speed or force of the first sleeve 307. During the grinding process, the grinding element 304 contacts the conductive ring 101, and the grinding element 304 is fixedly connected to the first sleeve 307, so the frictional force is transmitted through the grinding element 304 to the first sleeve 307. Since the first sleeve 307 and the damping element 302 are installed inside the second sleeve 301, the first sleeve 307 transmits force to the damping element 302 along the axial direction of the second sleeve 301. Therefore, the contact between the damping element 302 and the first sleeve 307 provides a damping effect, further enhancing the stability and controllability of the grinding process.

[0073] In some embodiments, N adjusting members 303 are installed one-to-one within N second sleeves 301; wherein, for the first sleeve 307, damping member 302, and adjusting member 303 installed within the same second sleeve 301, the first sleeve 307 is installed at the end of the second sleeve 301 closer to the slip ring 1 in the axial direction, the adjusting member 303 is installed at the other end of the second sleeve 301 further away from the slip ring 1 in the axial direction, and the damping member 302 is positioned between the first sleeve 307 and the adjusting member 303. For example, the adjusting member 303 may include a part that moves axially within the second sleeve 301, such as a screw, rod, etc. For example, the rod head may penetrate a certain distance into the second sleeve 301 and then be fixed to the sleeve wall, or be abutted from the rear to fix its position.

[0074] The second sleeve 301 provides space for mounting the first sleeve 307, damping element 302, and adjusting element 303, and provides a guiding function for the first sleeve 307, damping element 302, and adjusting element 303 during the grinding and adjustment processes to guide the direction of force transmission.

[0075] In some embodiments, each adjustment element 303 is configured to adjust the pressure of the corresponding grinding element 304 on the contacting conductive ring 101 by moving closer or further away from the first sleeve 307 within the installed second sleeve 301.

[0076] For example, the adjusting element 303 is a screw, and the end of the second sleeve 301 further axially from the slip ring 1 has internal threads. The screw can be installed inside the second sleeve 301 by engaging with the threads. The first sleeve 307 is at least partially placed inside the second sleeve 301, located at the end of the second sleeve 301 further axially from the slip ring 1, so that the grinding element 304 contacts the conductive ring 101. By rotating the screw, the distance the screw penetrates into the second sleeve 301 is changed. For example, when the screw rotates inward, it compresses the spring acting as damping element 302, bringing it closer to the first sleeve 307. The force is transmitted to the first sleeve 307 through the spring, causing the grinding element 304 to apply greater pressure to the contacted conductive ring 101, increasing the grinding force and effect. When the screw rotates outward, it releases the spring acting as damping element 302, moving it further away from the first sleeve 307, causing the grinding element 304 to apply less pressure to the contacted conductive ring 101. Therefore, by continuously adjusting the rotation direction and angle of the screw, the pressure of the grinding part 304 on the conductive ring 101 can be dynamically adjusted.

[0077] In some embodiments, the body 306 includes a plate-shaped member, which includes a first end and a second end opposite to each other; wherein a connector 305 is installed at the first end, and a second sleeve 301 is installed at the second end, with the axial direction of the second sleeve 301 perpendicular to the plate surface of the plate-shaped member.

[0078] For example, the plate-like member includes a component with an overall shape similar to a flat plate, having a planar surface and a certain thickness, such as a rectangular flat plate. An opening is located at a second end of the plate-like member, extending through it. The diameter of a second sleeve 301 matches the diameter of the opening on the plate-like member, allowing it to be inserted into the opening.

[0079] In some embodiments, the plate-like member further includes an elongated hole disposed between the first end and the second end, the elongated hole extending in the length direction toward the first end and the second end; wherein, a connector 305 is disposed within the elongated hole, the connector 305 being configured to change the conductive ring 101 contacted by each polishing member 304 by being closer to the first end or closer to the second end within the elongated hole.

[0080] The connector 305 can be moved and adjusted within the elongated hole. The position adjustment of the connector 305 within the elongated hole can precisely control the position of each grinding part 304, thereby adjusting the contacting conductive ring 101 and achieving precise grinding of a certain conductive ring 101.

[0081] Specifically, first, the plate-shaped piece is placed in the appropriate position, and the second sleeve 301 is inserted into the opening on the plate-shaped piece, ensuring that the second sleeve 301 does not move relative to the plate-shaped piece during the grinding process. Next, a screw is used as a connector 305, and its position within the elongated hole is determined. By rotating the head of the screw, it passes through the first end of the plate-shaped piece and connects to the fixing bracket 700. Then, each grinding element 304 is aligned with the conductive ring 101 it is responsible for grinding, and the pressure applied to the conductive ring 101 is adjusted using the adjusting element 303. Finally, the slip ring 1 is rotated to perform automatic grinding using the grinding elements 304.

[0082] The friction between the grinding part 304 and the conductive ring 101 generates conductive dust. In some embodiments of this disclosure, a dust collection box 4 is provided on the grinding device 3 to collect the dust generated by grinding.

[0083] Figure 8 The schematic diagram illustrates the structure of the dust collection box 4 according to some embodiments of the present disclosure;

[0084] In some embodiments, the polishing device 3 further includes a dust collection box 4, which is connected to a computed tomography device having a slip ring 1; wherein the dust collection box 4 includes a box body 401 with an opening, and N polishing parts 304 are placed on one side of the opening of the box body 401.

[0085] The opening of the dust collection box 4 allows the polishing part 304 to be easily placed within the dust collection box 4 area where dust is collected, while also facilitating the collection of generated dust inside the box body 401, preventing it from scattering into the surrounding environment and maintaining environmental cleanliness.

[0086] In some embodiments, the dust collection box 4 further includes a suction pipe 402 installed on the non-opening side of the box body 401, configured to allow external airflow to pass through in order to suck away the dust generated inside the box due to grinding.

[0087] Reference Figures 1-8 The dust collection box 4 includes a base plate, a box body 401, connecting screws 403, and a suction pipe 402. The base plate is placed at the bottom, and the screws connect one bent end of the base plate to the fixed bracket 700, while the other end of the base plate is connected to the box body 401. The grinding component 304 is placed above the base plate and located on one side of the opening of the box body 401. The suction pipe 402 is located on the side wall of the box body 401 and passes through the side wall. The suction pipe 402 can be a tubular structure with openings at both ends, one end facing the inside of the box body 401, and the other end connected to the vacuum cleaner. When the vacuum cleaner starts working and the fan is activated, a negative pressure is created inside the box body 401 and the vacuum cleaner, thereby sucking the dust generated by grinding out of the dust collection box 4.

[0088] According to the embodiments of this disclosure, the dust generated during grinding can be automatically sucked out of the dust collection box 4 to prevent conductive dust from scattering inside the CT equipment, causing short circuits, and affecting the normal operation of the slip ring 1 system.

[0089] Figure 9 A flowchart illustrating a method for polishing slip rings according to some embodiments of the present disclosure is shown.

[0090] like Figure 9 As shown, the grinding method for slip rings according to an embodiment of this disclosure includes:

[0091] When operating the S910, connect the grinding device to a computed tomography (CT) scanner with a slip ring.

[0092] During operation S920, each grinding component of the grinding device is brought into contact with the conductive ring of the slip ring;

[0093] In operation of S930, in the non-scanning state of the computed tomography (CT) scanner, each grinding element grinds the contacting conductive ring as it moves relative to the slip ring.

[0094] In some embodiments, grinding each grinding element on the contacted conductive ring during relative movement with the slip ring includes: driving the slip ring to rotate, fixing each grinding element in place; and grinding each grinding element on the contacted conductive ring during the rotation of the slip ring.

[0095] In some embodiments, N damping elements corresponding one-to-one with the N grinding elements may also be provided, each damping element being further away from the slip ring than the grinding element it contacts, in order to provide buffering for the grinding element it contacts during the grinding process.

[0096] In some embodiments, N adjusting members may be provided that correspond one-to-one with the N damping members, wherein each adjusting member is further away from the slip ring than the damping member it contacts, and is used to adjust the pressure of the corresponding grinding member on the contacting conductive ring.

[0097] In some embodiments, N first sleeves and N second sleeves may be provided, with N grinding parts installed one-to-one in the N first sleeves and N first sleeves installed one-to-one in the N second sleeves. Each grinding part has one end of its contact slip ring extending out of the corresponding first and second sleeves.

[0098] In some embodiments, N damping elements are installed one-to-one in N second sleeves; wherein each damping element contacts a first sleeve installed in the same second sleeve and is further away from the slip ring than the first sleeve, and the first sleeve is movably installed in the same second sleeve.

[0099] In some embodiments, N adjusting members are installed in N second sleeves in a one-to-one correspondence; wherein, for the first sleeve, damping member and adjusting member installed in the same second sleeve, the first sleeve is installed at the end of the second sleeve that is closer to the slip ring in the axial direction, the adjusting member is installed at the other end of the second sleeve that is further away from the slip ring in the axial direction, and the damping member is placed between the first sleeve and the adjusting member.

[0100] In some embodiments, each adjustment element is moved closer to or further away from the first sleeve within the installed second sleeve to adjust the pressure of the corresponding grinding element on the contacting conductive ring.

[0101] In some embodiments, the body includes a plate-like member having opposing first and second ends. A connector is mounted on the first end, and a second sleeve is mounted on the second end, the axial direction of the second sleeve being perpendicular to the surface of the plate-like member.

[0102] In some embodiments, the plate-like member further includes an elongated hole disposed between the first end and the second end, the elongated hole extending in the length direction toward the first end and the second end; a connector is placed in the elongated hole so that the connector is closer to the first end or closer to the second end within the elongated hole to change the conductive ring contacted by each polishing member.

[0103] In some embodiments, a dust collection box is provided, which is connected to a computed tomography device with a slip ring; wherein the dust collection box includes a box body with an opening, and N grinding elements are placed on one side of the opening of the box body.

[0104] In some embodiments, the dust collection box further includes a suction pipe. The suction pipe is mounted on the non-opening side of the box and configured to allow external airflow to pass through in order to remove dust generated during grinding from inside the box.

[0105] In some embodiments, for any conductive ring of a slip ring, one or more of the N grinding elements are simultaneously in contact with the conductive ring.

[0106] In some embodiments, the N grinding elements are made to contact the N conductive rings of the slip ring in a one-to-one correspondence.

[0107] In some embodiments, when N is greater than or equal to 2, at least two of the N grinding elements are brought into contact with the same conductive ring of the slip ring, wherein the number of grinding elements in contact with any conductive ring is different from the number of grinding elements in contact with at least one other conductive ring.

[0108] In some embodiments, the wear degree of each conductive ring is detected, and a corresponding number of grinding parts are contacted according to the wear degree of each conductive ring of the slip ring, with the number being positively correlated with the wear degree.

[0109] Reference Figures 1-8The slip ring 1 is mounted on the rotating bracket 800 and can be rotated by a motor. The grinding device 3 and the dust collection box 4 are mounted on the fixed bracket 700. Several conductive rings 101 are arranged on the slip ring 1. During grinding, the position of the grinding device 3 is adjusted to ensure that the grinding part 304 is aligned with the conductive ring to be ground. The powder generated during grinding is collected by the dust collection box 4.

[0110] In some embodiments, the grinding device 3 includes an outer sleeve (i.e., the second sleeve 301), a spring (i.e., a damping element 302), an adjusting screw (i.e., an adjusting element 303), a grinding element 304, a base plate (body 306), a screw (connector 305), and an inner sleeve (first sleeve 307). The grinding device 3 is fixed to the fixed bracket 700 by the connecting element 305. The grinding element can be adjusted to align with the conductive rings on different slides through the elongated hole. The grinding element 304 is installed inside the inner sleeve, and the inner sleeve and spring are installed inside the outer sleeve. The pressure of the grinding element on the conductive ring of the slip ring is adjusted by compressing the spring with the adjusting screw.

[0111] The dust collection box consists of a box body 401, a suction pipe 402, and connecting screws 403. The box body 401 can collect the dust generated during grinding, and the suction pipe 402 can be connected to a vacuum cleaner to suck up the grinding dust while grinding.

[0112] The grinding device is used as follows:

[0113] 1) Power off the equipment, install the grinding device, and connect the dust collection box and suction pipe of the grinding device to the vacuum cleaner;

[0114] 2) Adjust the adjusting screw on the grinding device to ensure appropriate pressure.

[0115] 3) The slip ring is driven by a motor to rotate at a low speed, in the following direction: Figure 4 As shown, the dust generated during polishing falls into the dust collection box and is then sucked away by a vacuum cleaner.

[0116] It can effectively solve abnormalities such as unevenness, grooves, and scratches caused by uneven wear of the conductive ring during long-term use of slip rings, avoiding unstable current and signal transmission, and even arcing that could damage equipment components, greatly reducing the waste of manpower, material resources, and financial resources. At the same time, it can effectively reduce equipment operating noise.

[0117] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.

[0118] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of this disclosure is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. A grinding device for slip rings, characterized in that, include: ontology; A connector is mounted on the body, wherein the connector is configured to connect the body to a computed tomography apparatus having the slip ring; N grinding components are mounted on the main body, wherein each grinding component is configured to contact the conductive ring of the slip ring and grinds the contacted conductive ring during relative movement with the slip ring, where N is an integer greater than or equal to 1. There are N damping elements, each corresponding to one of the N grinding elements. Each damping element is further away from the slip ring than the grinding element it contacts, and is used to provide buffering for the grinding element it contacts during the grinding process. N adjusting elements are in contact with N damping elements in a one-to-one correspondence, wherein each adjusting element is further away from the slip ring than the damping element it contacts; N first sleeves, wherein N grinding parts are installed in the N first sleeves in a one-to-one correspondence; N second sleeves, wherein N damping elements, N adjusting elements and N first sleeves are installed in the N second sleeves in a one-to-one correspondence; wherein one end of the conductive ring of each grinding element that contacts the slip ring extends out of the corresponding first sleeve and second sleeve; During the grinding process, the grinding element contacts the conductive ring, and the frictional force is transmitted through the grinding element to the first sleeve. Along the axial direction of the second sleeve, the force is transmitted through the first sleeve to the damping element. Each of the adjustment elements is configured to move closer to or further away from the first sleeve by rotating axially within the second sleeve to compress or release the damping element. The pressure applied to the conductive ring by the grinding element is adjusted according to the degree of wear of the conductive ring, so that the pressure of the grinding element on each conductive ring is the same or different.

2. The polishing device according to claim 1, characterized in that, Each of the aforementioned grinding elements is configured to grind the contacted conductive ring as the slip ring rotates, and remains stationary during the rotation of the slip ring.

3. The polishing device according to claim 1, characterized in that, Each of the damping elements contacts a first sleeve mounted within the same second sleeve and is further away from the slip ring than the first sleeve, which is movably mounted within the same second sleeve.

4. The polishing device according to claim 3, characterized in that, For the first sleeve, damping element and adjusting element installed in the same second sleeve, the first sleeve is installed at one end of the second sleeve that is closer to the slip ring in the axial direction, the adjusting element is installed at the other end of the second sleeve that is further away from the slip ring in the axial direction, and the damping element is placed between the first sleeve and the adjusting element.

5. The polishing apparatus according to claim 3 or 4, characterized in that, The body includes: A plate-shaped member, including a first end and a second end opposite to each other; The connector is installed at the first end, the second sleeve is installed at the second end, and the axial direction of the second sleeve is perpendicular to the surface of the plate-shaped member.

6. The polishing apparatus according to claim 5, characterized in that, The plate-shaped member also includes: An elongated hole is positioned between the first end and the second end, and the length of the elongated hole extends toward the first end and the second end; The connector is placed within the elongated hole and is configured to change the conductive ring contacted by each polishing element by moving it closer to the first end or closer to the second end within the elongated hole.

7. The polishing apparatus according to claim 1, characterized in that, Also includes: A dust collection box is connected to a computed tomography (CT) scanner having the slip ring described above; The dust collection box includes a box body with an opening, and N of the grinding parts are placed on one side of the opening of the box body.

8. The polishing apparatus according to claim 7, characterized in that, The dust collection box also includes: A suction pipe, installed on the non-opening side of the housing, is configured to allow external airflow to pass through in order to suck away dust generated during grinding inside the housing.

9. The polishing apparatus according to claim 1, characterized in that, For any conductive ring of the slip ring, one or more of the N grinding elements are in contact with the conductive ring simultaneously.

10. The polishing apparatus according to claim 9, characterized in that, The N grinding elements are configured to contact the N conductive rings of the slip ring in a one-to-one correspondence.

11. The polishing apparatus according to claim 9, characterized in that, When N is greater than or equal to 2, at least two of the N grinding elements are in contact with the same conductive ring of the slip ring.

12. The polishing apparatus according to claim 9, characterized in that, N of the aforementioned grinding elements are configured to contact a corresponding number of grinding elements according to the wear degree of each conductive ring of the slip ring, wherein the number is positively correlated with the wear degree.

13. A grinding method for slip rings, characterized in that, include: Connect the grinding apparatus according to any one of claims 1 to 12 to a computed tomography (CT) scanner having the slip ring; Each grinding element of the grinding device is brought into contact with the conductive ring of the slip ring; In the non-scanning state of the computed tomography device, each of the grinding elements grinds the conductive ring it contacts while moving relative to the slip ring.

14. A slip ring system, characterized in that, include: A slip ring having at least one conductive ring disposed thereon, the slip ring being mounted on a computed tomography (CT) scanner; as well as The polishing apparatus according to any one of claims 1 to 12.

15. A computed tomography (CT) scanning device, characterized in that, Includes the slip ring system as described in claim 14.

Images