Computer device monitoring apparatus and method

Abstract

The application provides a computer equipment monitoring device and method, the device comprises a flexible pressure sensor unit, a contact pressure data acquisition unit and a monitoring unit, wherein: the flexible pressure sensor unit is arranged in each monitoring area of the computer equipment, and is used for measuring the stress condition generated by each monitoring area, and obtaining the stress deformation information corresponding to each monitoring area; the contact pressure data acquisition unit is used for generating the contact pressure data generated by the monitoring area according to the stress deformation information; the monitoring unit is used for determining the current target monitoring area from the multiple monitoring areas according to the power-on state information of the computer equipment, and judging whether the monitoring area is an abnormal contact pressure area according to the contact pressure data of the target monitoring area, and if yes, taking the contact pressure data corresponding to the abnormal contact pressure area as the contact pressure monitoring abnormal data. The application realizes monitoring of the failure of the computer equipment caused by the contact pressure.

Description

Technical Field

[0001] This invention relates to the field of computer monitoring technology, and in particular to a computer equipment monitoring device and method. Background Technology

[0002] Currently, contact pressure monitoring for computer equipment, such as circuit boards, chips, and connectors in servers, is a blank area. There is a lack of contact pressure monitoring for highly integrated, large-size chips related to graphics processing units (GPUs), field-programmable gate arrays (FPGAs), and PCIe switches. Furthermore, contact pressure monitoring for high-speed cable plug assemblies (such as Mini Cool Edge IO, MCIO) and 16-way pluggable connector cables is also lacking. Because existing servers do not implement contact pressure monitoring for circuit boards, critical chips, and critical high-speed connectors, damage from pressure or improper interface contact can easily cause server malfunctions, leading to poor server stability.

[0003] Therefore, there is an urgent need for a computer equipment monitoring device and method to solve the above problems. Summary of the Invention

[0004] To address the problems existing in the prior art, the present invention provides a computer equipment monitoring device and method.

[0005] This invention provides a computer equipment monitoring device, comprising a flexible pressure sensor unit, a contact pressure data acquisition unit, and a monitoring unit, wherein:

[0006] The flexible pressure sensor unit is installed in each monitoring area of ​​the computer device to measure the force generated in each monitoring area and obtain the force deformation information corresponding to each monitoring area.

[0007] The contact pressure data acquisition unit is used to generate contact pressure data generated in the monitoring area based on the force deformation information.

[0008] The monitoring unit is configured to determine the current target monitoring area from multiple monitoring areas based on the power-on status information of the computer device, and to determine whether the monitoring area is a contact pressure abnormal area based on the contact pressure data of the target monitoring area. If so, the contact pressure data corresponding to the contact pressure abnormal area is used as contact pressure monitoring abnormal data.

[0009] According to a computer equipment monitoring device provided by the present invention, the flexible pressure sensor unit is disposed in a plurality of monitoring areas in the computer equipment, wherein the plurality of monitoring areas include at least a first monitoring area, a second monitoring area, and a third monitoring area, wherein:

[0010] The first monitoring area is the contact surface area between the chip heat sink and the chip in the computer device;

[0011] The second monitoring area is the inner wall of the interface and the snap-fit ​​area of ​​each connector in the computer device;

[0012] The third monitoring area is the stress area of ​​the printed circuit board in the computer equipment during the handling process.

[0013] According to a computer equipment monitoring device provided by the present invention, the contact pressure data acquisition unit is provided with multiple voltage divider circuits, and a corresponding mapping relationship is established between the flexible pressure sensor unit provided in each monitoring area and each voltage divider circuit. The contact pressure data acquisition unit is further used to obtain the contact pressure data generated in the corresponding monitoring area by means of voltage change data in the voltage divider circuit according to the mapping relationship.

[0014] According to the present invention, a computer equipment monitoring device is provided, wherein the monitoring unit includes a microcontroller monitoring subunit and a baseboard management controller monitoring subunit, wherein:

[0015] The monitoring unit determines whether the computer device is powered on at the current moment based on the power-on status information.

[0016] If it is determined that the computer device is not powered on at the current time, the microcontroller monitoring subunit monitors the first monitoring area and / or the third monitoring area to obtain the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area collected by the contact pressure data acquisition unit.

[0017] The microcontroller monitoring subunit compares the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area with a first preset contact pressure threshold. If the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area is greater than or equal to the first preset contact pressure threshold, the first monitoring area and / or the third monitoring area are determined to be contact pressure abnormal areas. The contact pressure data corresponding to the contact pressure abnormal areas is stored as contact pressure monitoring abnormal data, and the stored contact pressure monitoring abnormal data is displayed after the computer device is powered on. The first preset contact pressure threshold includes the preset contact pressure threshold corresponding to the first monitoring area and the preset contact pressure threshold corresponding to the third monitoring area.

[0018] If it is determined that the computer device is powered on at the current time, the second monitoring area is monitored by the baseboard management controller monitoring subunit, and the contact pressure data corresponding to the second monitoring area collected by the contact pressure data acquisition unit is obtained;

[0019] The substrate controller monitoring subunit compares the contact pressure data corresponding to the second monitoring area with a second preset contact pressure threshold. If the contact pressure data corresponding to the second monitoring area is greater than or equal to the second preset contact pressure threshold, the second monitoring area is determined to be the contact pressure abnormal area. The contact pressure data of the second monitoring area that has been determined to be the contact pressure abnormal area is displayed as the contact pressure monitoring abnormal data.

[0020] According to a computer equipment monitoring device provided by the present invention, the computer equipment monitoring device further includes a monitoring data storage unit. The monitoring data storage unit is used to store the contact pressure data monitored by the monitoring unit from the first monitoring area and / or the third monitoring area when the computer equipment is not powered on, and to send the stored contact pressure data to the substrate management controller monitoring subunit after the computer equipment is powered on, so that the substrate management controller monitoring subunit can generate a corresponding monitoring report based on the contact pressure data.

[0021] According to a computer equipment monitoring device provided by the present invention, the computer equipment monitoring device further includes a power supply unit, which is connected to the flexible pressure sensor unit, the contact pressure data acquisition unit and the monitoring unit respectively, and is used to supply power to the flexible pressure sensor unit, the contact pressure data acquisition unit and the monitoring unit when the computer equipment is not powered on.

[0022] The present invention also provides a method for monitoring computer equipment, comprising:

[0023] By using flexible pressure sensor units installed in various monitoring areas of the computer device, the force conditions generated in each monitoring area are measured, and the force deformation information corresponding to each monitoring area is obtained.

[0024] Based on the stress deformation information, contact pressure data generated in the monitoring area is generated;

[0025] Based on the power-on status information of the computer device, the current target monitoring area is determined from multiple monitoring areas, and based on the contact pressure data of the target monitoring area, it is determined whether the monitoring area is a contact pressure abnormal area. If so, the contact pressure data corresponding to the contact pressure abnormal area is taken as contact pressure monitoring abnormal data.

[0026] According to a computer device monitoring method provided by the present invention, the step of determining a current target monitoring area from multiple monitoring areas based on the power-on status information of the computer device, and determining whether the monitoring area is a contact pressure abnormal area based on the contact pressure data of the target monitoring area, and if so, taking the contact pressure data corresponding to the contact pressure abnormal area as contact pressure monitoring abnormal data, includes:

[0027] Based on the power-on status information, determine whether the computer device is currently powered on;

[0028] If it is determined that the computer device is not powered on at the current time, the first monitoring area and / or the third monitoring area are monitored to obtain the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area;

[0029] The contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area are compared with a first preset contact pressure threshold. If the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area are greater than or equal to the first preset contact pressure threshold, the first monitoring area and / or the third monitoring area are determined to be contact pressure abnormal areas. The contact pressure data corresponding to the contact pressure abnormal areas are stored as contact pressure monitoring abnormal data, and the stored contact pressure monitoring abnormal data are displayed after the computer device is powered on. The first preset contact pressure threshold includes the preset contact pressure threshold corresponding to the first monitoring area and the preset contact pressure threshold corresponding to the third monitoring area.

[0030] If it is determined that the computer device is powered on at the current time, the second monitoring area is monitored to obtain the contact pressure data corresponding to the second monitoring area;

[0031] The contact pressure data corresponding to the second monitoring area is compared with a second preset contact pressure threshold. If the contact pressure data corresponding to the second monitoring area is greater than or equal to the second preset contact pressure threshold, the second monitoring area is determined to be the contact pressure abnormal area. The contact pressure data of the second monitoring area that has been determined to be the contact pressure abnormal area is displayed as the contact pressure monitoring abnormal data.

[0032] The computer device is provided with multiple monitoring areas, including at least a first monitoring area, a second monitoring area, and a third monitoring area. The first monitoring area is the contact surface area between the chip heat sink and the chip in the computer device; the second monitoring area is the inner wall of the interface and the snap-fit ​​area of ​​each connector in the computer device; and the third monitoring area is the stress area of ​​the printed circuit board in the computer device during transportation.

[0033] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the computer device monitoring method described above.

[0034] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the computer device monitoring method as described above.

[0035] The computer equipment monitoring device and method provided by the present invention measures the force generated in each monitoring area of ​​the computer equipment by using flexible pressure sensor units installed in each monitoring area. Based on the force deformation information of each monitoring area, corresponding contact pressure data is obtained. Then, based on the power-on status information of the computer equipment, the contact pressure data of the target monitoring area determined in multiple monitoring areas is judged, and abnormal contact pressure monitoring data is determined based on the judgment result. This enables the monitoring of faults caused by contact pressure in the computer equipment and improves the operational stability of the computer equipment after power-on. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0037] Figure 1 A schematic diagram of the structure of the computer equipment monitoring device provided by the present invention;

[0038] Figure 2 A schematic diagram of the server equipment monitoring device provided by the present invention;

[0039] Figure 3 A schematic diagram of the circuit structure of the contact pressure data acquisition unit provided by the present invention;

[0040] Figure 4 A schematic diagram of the circuit structure of the monitoring unit provided by the present invention;

[0041] Figure 5 A schematic diagram of the circuit structure of the power supply unit provided by the present invention;

[0042] Figure 6 An overall architecture diagram of a computer device based on a flexible pressure sensor provided by the present invention;

[0043] Figure 7 A flowchart illustrating the computer equipment monitoring method provided by the present invention;

[0044] Figure 8 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0046] Artificial Intelligence (AI) servers, requiring powerful computing capabilities, typically utilize acceleration chips such as GPUs, FPGAs, and Application Specific Integrated Circuits (ASICs). These chips are highly integrated, large in size, and consume significant power, necessitating external heat sinks for cooling. However, these heat sinks are large and heavy; improper handling during transport can cause them to compress the chip, leading to internal cracks or solder pad damage. Since current servers lack internal hardware to monitor the contact pressure on the chip, such damage is often difficult to detect, resulting in the chip failing to function properly when the server is powered on.

[0047] On the other hand, high-speed signals between boards and between boards and PCIe external expansion cards within an AI server are typically connected via various high-speed cables and connectors on the boards, and there are quite a few of these cables. During server production, high-speed signals within the server are primarily based on the PCIe protocol. PCIe devices are usually connected to each other using high-speed cables and connectors such as MCIO cables, CDFP cables (16-channel pluggable connector cables), and OCP (Open Compute Project) cables. However, assemblers often miss or improperly connect cables, making the inspection of these cable connections particularly important.

[0048] In addition, as server performance continues to improve, server boards, especially motherboards or GPU baseboards, are becoming larger and heavier. During installation and transportation, they may deform, causing excessive stress on the printed circuit board (PCB). This can lead to components breaking or chip pads cracking due to excessive stress.

[0049] Current server health monitoring technologies only include stress test information such as temperature and power supply, lacking monitoring of contact pressure on chips or connectors. Currently, the relevant computer equipment in servers does not monitor the contact pressure of key chips and key high-speed connectors, which is a blank area.

[0050] This invention, based on flexible pressure sensor technology, designs a contact pressure monitoring device for computer equipment. It monitors and alarms for contact pressure on circuit boards, chips, and high-speed connectors, improving server reliability. Specifically, before the server leaves the factory, flexible sensors are added to the monitoring areas of the corresponding computer equipment, such as the contact surface between the chip heatsink and the chip, the inner walls and latching areas of various connectors, and the stress areas of the printed circuit board. This allows for contact pressure monitoring at the factory, enabling timely detection of hardware damage caused by abnormal contact pressure.

[0051] Figure 1 This is a schematic diagram of the structure of the computer equipment monitoring device provided by the present invention, as shown below. Figure 1 As shown, the present invention provides a computer equipment monitoring device, including a flexible pressure sensor unit 101, a contact pressure data acquisition unit 102, and a monitoring unit 103, wherein:

[0052] The flexible pressure sensor unit 101 is installed in each monitoring area of ​​the computer device to measure the force generated in each monitoring area and obtain the force deformation information corresponding to each monitoring area.

[0053] In this invention, the flexible pressure sensor unit 101 is made of flexible material, which can adapt to monitoring areas of different shapes and sizes. It has the characteristics of high sensitivity and high precision, and can accurately sense and measure the contact pressure on the monitoring area.

[0054] By measuring the stress on each monitoring area of ​​each computer device, the flexible pressure sensor unit 101 can acquire the stress deformation information corresponding to each monitoring area. This stress deformation information can be used to monitor the contact pressure of the computer device in real time. For example, by placing the flexible pressure sensor unit 101 on the contact surface between the heat sink and the chip, it can be used to monitor the contact pressure of the heat sink on the chip; by placing the flexible pressure sensor 101 on the inner wall and latch of the connector, it can be used to monitor whether there is poor contact or missing insertion when connecting high-speed cable connectors; by placing the flexible pressure sensor 101 in the area of ​​the PCB board with large deformation stress, it can monitor whether there is excessive stress on the PCB board during transportation, which may damage PCB board components or cause chip pad breakage.

[0055] The contact pressure data acquisition unit 102 is used to generate contact pressure data generated in the monitoring area based on the stress deformation information.

[0056] In this invention, the flexible pressure sensor unit 101 can monitor the contact pressure on each monitoring area in real time and convert it into force deformation information. This force deformation information needs to be processed by the contact pressure data acquisition unit 102 before corresponding contact pressure data can be generated. The contact pressure data acquisition unit 102 can analyze and calculate the force deformation information to obtain the contact pressure data generated in each monitoring area, so that the monitoring unit 103 can monitor the contact pressure of the computer equipment based on the contact pressure data.

[0057] The monitoring unit 103 is used to determine the current target monitoring area from multiple monitoring areas based on the power-on status information of the computer device, and to determine whether the monitoring area is a contact pressure abnormal area based on the contact pressure data of the target monitoring area. If so, the contact pressure data corresponding to the contact pressure abnormal area is taken as contact pressure monitoring abnormal data.

[0058] In this invention, the monitoring unit 103 needs to determine the monitoring area (i.e., the target monitoring area) for a given period based on the current power-on status of the computer device. For example, when the computer device is not powered on, the monitoring mainly focuses on the contact surface area between the chip heat sink and the chip, as well as the stress area of ​​the printed circuit board. After the computer device is powered on, the monitoring mainly focuses on the inner walls of the interfaces and the snap-fit ​​areas of the various connectors in the computer device. When the monitoring unit 103 determines that the target monitoring area is an area of ​​abnormal contact pressure, that is, the contact pressure data of the monitoring area exceeds the normal range or changes abnormally, the monitoring unit 103 will mark the contact pressure data corresponding to that area as abnormal contact pressure monitoring data. This abnormal data can be used for subsequent fault diagnosis, predictive maintenance, and other operations, as well as to provide alarms or notifications to system administrators.

[0059] Figure 2 This is a schematic diagram of the server equipment monitoring device provided by the present invention, which can be referred to. Figure 2 As shown, the server equipment monitoring device of the present invention monitors the contact pressure of the server equipment in two main application scenarios: pressure monitoring when the server is powered on and pressure monitoring when the server is not powered on (mainly referring to the transportation process scenario).

[0060] In this invention, the server device monitoring device includes the flexible pressure sensor unit 101 and the contact pressure data acquisition unit 102 (i.e., Figure 2In addition to the pressure data acquisition unit and monitoring unit 103, it may also include a monitoring data storage unit and a power supply unit. The flexible pressure sensor unit 101 mainly consists of flexible pressure sensors distributed in various monitoring areas, such as on server boards; the contact pressure data acquisition unit 102 mainly consists of an analog-to-digital converter (ADC) chip, which is mainly used to collect the resistance changes of the flexible pressure sensors caused by changes in contact pressure; the monitoring unit 103 is mainly used to process the contact pressure data collected by the ADC and perform corresponding alarm monitoring. In this invention, the monitoring unit 103 includes a microcontroller monitoring subunit and a Baseboard Management Controller (BMC) monitoring subunit. The microcontroller monitoring subunit is used for contact pressure monitoring when the server is not powered on, and the BMC monitoring unit is used for contact pressure detection during server operation. The monitoring data storage unit is mainly an electrically erasable programmable read-only memory (EEPROM) chip, which is mainly used to store abnormal pressure data monitored by the microcontroller monitoring subunit when the server is not powered on.

[0061] The computer equipment monitoring device provided by this invention measures the force generated in each monitoring area of ​​the computer equipment by using flexible pressure sensor units installed in each monitoring area. Based on the force deformation information of each monitoring area, it obtains the corresponding contact pressure data. Then, based on the power-on status information of the computer equipment, it judges the contact pressure data of the target monitoring area determined in multiple monitoring areas, and determines abnormal contact pressure monitoring data based on the judgment result. This enables the monitoring of faults caused by contact pressure in the computer equipment and improves the operational stability of the computer equipment after power-on.

[0062] Based on the above embodiments, the flexible pressure sensor unit is disposed in multiple monitoring areas of the computer device, wherein the multiple monitoring areas include at least a first monitoring area, a second monitoring area, and a third monitoring area, wherein:

[0063] The first monitoring area is the contact surface area between the chip heat sink and the chip in the computer device;

[0064] The second monitoring area is the inner wall of the interface and the snap-fit ​​area of ​​each connector in the computer device;

[0065] The third monitoring area is the stress area of ​​the printed circuit board in the computer equipment during the handling process.

[0066] In this invention, flexible pressure sensors are installed in various areas of the server equipment that require contact pressure. When the flexible pressure sensor is compressed, its contact resistance changes, and the pressure magnitude can be measured through a specific pressure-resistance relationship.

[0067] In this invention, the flexible pressure sensor unit mainly consists of flexible sensors distributed on the PCB board (generally located in the stress area of ​​the PCB board during transportation), the chip (generally located on the contact surface between the chip and the heat sink), and the connector. Because of its small size and customizable shape, the flexible pressure sensor can monitor scenarios such as PCB deformation, chip-heat sink contact pressure, and high-speed connector contact pressure. It can be customized according to the specific structure of the monitored point to achieve accurate pressure monitoring. For large circuit boards, deformation during PCB installation on trays or chassis can cause component pads to crack. Therefore, flexible pressure sensors can be placed in stress-sensitive areas based on structural stress simulation data. For the chip-heatsink interface, flexible pressure sensors can be placed at the four corners of the contact surface to monitor the contact pressure between the heatsink and the chip during server transport or installation. For high-speed connectors, flexible pressure sensors can be attached to the inner wall of the connector. When the cable connector and board connector are mated, the flexible pressure sensor monitors the mating pressure to determine if the high-speed connector is properly connected, preventing installation workers from missing high-speed connectors. Additionally, in this invention, sensors can also be placed in other areas of the computer equipment, such as the contact pressure between hard drive trays and hard drives, depending on actual contact pressure monitoring needs.

[0068] Based on the above embodiments, the contact pressure data acquisition unit is provided with multiple voltage divider circuits, and a corresponding mapping relationship is established between the flexible pressure sensor unit provided in each monitoring area and each voltage divider circuit. The contact pressure data acquisition unit is also used to obtain the contact pressure data generated by the corresponding monitoring area through the voltage change data in the voltage divider circuit according to the mapping relationship.

[0069] Figure 3 A schematic diagram of the circuit structure of the contact pressure data acquisition unit provided by the present invention can be referred to. Figure 3As shown, the contact pressure data acquisition unit provided by the present invention consists of an ADC chip and multiple voltage divider circuits. For a flexible pressure sensor, when the contact pressure it receives changes, its internal resistance will change. Therefore, in order to acquire the resistance change when the contact pressure is generated, the contact pressure data acquisition unit of the present invention is equipped with a voltage divider circuit in its circuit structure. The voltage value of the voltage divider circuit at different resistance values ​​reflects the pressure change of the flexible pressure sensor.

[0070] Specifically, the voltage values ​​of each voltage divider circuit can be sampled by the ADC chip, and then the monitoring unit processes and judges the changes in the voltage data collected by the ADC chip. (See reference...) Figure 3 As shown, resistors R1, R2, R3, ..., Rn are fixed pull-up resistors, and their resistance values ​​can be set to a reasonable fixed value. Rx1, Rx2, Rx3, ..., Rxn represent the resistance values ​​obtained by the flexible pressure sensor in each monitoring area after being subjected to contact pressure. Each pull-up resistor and its corresponding pull-down resistor form a voltage divider circuit, generating different voltages connected to the ADC chip, thereby forming different monitoring channels to realize the change in pressure-resistance-voltage, reflecting the magnitude of the contact pressure. In addition, the multiple monitoring channels formed in each ADC chip can map the monitoring point position corresponding to the flexible pressure sensor to the channel number. For example, if the contact pressure data collected by ADC channel 1 is abnormal, the mapped monitoring point can be located, realizing the location monitoring of the abnormal pressure point and more quickly determining the abnormal contact pressure area.

[0071] Based on the above embodiments, the monitoring unit includes a microcontroller monitoring subunit and a baseboard management controller monitoring subunit, wherein:

[0072] The monitoring unit determines whether the computer device is powered on at the current moment based on the power-on status information.

[0073] If it is determined that the computer device is not powered on at the current time, the microcontroller monitoring subunit monitors the first monitoring area and / or the third monitoring area to obtain the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area collected by the contact pressure data acquisition unit.

[0074] The microcontroller monitoring subunit compares the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area with a first preset contact pressure threshold. If the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area is greater than or equal to the first preset contact pressure threshold, the first monitoring area and / or the third monitoring area are determined to be contact pressure abnormal areas. The contact pressure data corresponding to the contact pressure abnormal areas is stored as contact pressure monitoring abnormal data, and the stored contact pressure monitoring abnormal data is displayed after the computer device is powered on. The first preset contact pressure threshold includes the preset contact pressure threshold corresponding to the first monitoring area and the preset contact pressure threshold corresponding to the third monitoring area.

[0075] If it is determined that the computer device is powered on at the current time, the second monitoring area is monitored by the baseboard management controller monitoring subunit, and the contact pressure data corresponding to the second monitoring area collected by the contact pressure data acquisition unit is obtained;

[0076] The substrate controller monitoring subunit compares the contact pressure data corresponding to the second monitoring area with a second preset contact pressure threshold. If the contact pressure data corresponding to the second monitoring area is greater than or equal to the second preset contact pressure threshold, the second monitoring area is determined to be the contact pressure abnormal area. The contact pressure data of the second monitoring area that has been determined to be the contact pressure abnormal area is displayed as the contact pressure monitoring abnormal data.

[0077] Figure 4 A schematic diagram of the circuit structure of the monitoring unit provided by the present invention can be referred to. Figure 4 As shown, the monitoring unit is mainly divided into a microcontroller monitoring section and a BMC monitoring section. Figure 4 The dashed line represents the monitoring process when the server is not powered on, mainly handled by the microcontroller. The solid line represents the monitoring process when the server is powered on, mainly handled by the BMC (Browser Control Center). The microcontroller monitoring section primarily monitors the contact pressure data when the server is not powered on. Due to the simple peripheral circuitry and low power consumption of the microcontroller, it is used for data monitoring when the server is not powered on. When the microcontroller detects an abnormal contact pressure value in a certain monitoring area during the server's power-off period, it records the data in the data storage unit (EEPROM chip). The microcontroller and the EEPROM chip communicate via an I2C (Inter-Integrated Circuit) interface.

[0078] When the server is powered on, the microcontroller no longer needs to operate. At this time, the contact pressure is mainly monitored by the BMC. The BMC monitoring section monitors the contact pressure during the server's operation (mainly the contact pressure of connector insertion). After the server is powered on, it reads the contact pressure data recorded by the microcontroller during the server's power-off period stored in the EEPROM chip. (To reduce storage space usage, the BMC only needs to acquire abnormal contact pressure data during the power-off period. These abnormal contact pressure data are mainly generated by the contact pressure between the chip and the heat sink, as well as the contact pressure of the PCB board's stress areas during handling.) This allows users to view the historical contact pressure values ​​of the chip, heat sink, or other stress areas recorded by the server.

[0079] In this invention, a corresponding preset contact pressure threshold can be set according to different monitoring areas. This allows for the comparison of contact pressure data generated in different monitoring areas with the corresponding preset contact pressure threshold when the server is powered on in different states. This enables a quick determination of whether there is an abnormal contact pressure in the current monitoring area, facilitating timely troubleshooting by relevant personnel.

[0080] Based on the above embodiments, the computer equipment monitoring device further includes a monitoring data storage unit. The monitoring data storage unit is used to store the contact pressure data monitored by the monitoring unit from the first monitoring area and / or the third monitoring area when the computer equipment is not powered on, and to send the stored contact pressure data to the substrate management controller monitoring subunit after the computer equipment is powered on, so that the substrate management controller monitoring subunit can generate a corresponding monitoring report based on the contact pressure data.

[0081] In this invention, the monitoring data storage unit is mainly used to store the contact pressure change data collected by the monitoring unit when the server is not powered on. Its main purpose is that after the server is powered on, the BMC can access the monitoring data storage unit to quickly obtain the contact pressure changes collected by the flexible pressure sensor during the server's power-off period. This allows monitoring to determine whether there is significant contact pressure in the stress area of ​​the PCB board or the contact surface between the chip and the heat sink during the server's power-off period. If a monitoring area with significant contact pressure data is found, the BMC will record it and issue an alarm, prompting the user to pay close attention to whether the chip or device at the alarm point has any abnormal operation.

[0082] Based on the above embodiments, the computer equipment monitoring device further includes a power supply unit, which is connected to the flexible pressure sensor unit, the contact pressure data acquisition unit and the monitoring unit respectively, and is used to supply power to the flexible pressure sensor unit, the contact pressure data acquisition unit and the monitoring unit when the computer equipment is not powered on.

[0083] Figure 5 A schematic diagram of the circuit structure of the power supply unit provided by the present invention can be referred to. Figure 5 As shown, the present invention provides a solution for monitoring server contact pressure in two scenarios: when the server is not powered on and when it is powered on. When the server is not powered on, a portable power source is required, typically a small rechargeable lithium battery, to power the flexible pressure sensor unit, contact pressure data acquisition unit, monitoring unit, and pressure data storage unit. When the server is powered on, the lithium battery power supply is cut off via a switch control circuit to prevent battery drain, and the power is supplied by the board. In this invention, the single-pole double-throw power switch can be selected via the BMC's ENABLE_SIGNAL signal, allowing the BMC to switch the power source from the lithium battery to the motherboard power supply when the server is powered on. Figure 6 This is an overall architecture diagram of the computer device based on a flexible pressure sensor provided by the present invention. The specific structure of the computer device provided by the present invention can be found in the following reference. Figure 6 As shown, in this invention, the lithium battery can also be equipped with a charging circuit. When the server is powered on and running, the lithium battery can be charged through the lithium battery charging circuit to ensure that the lithium battery has sufficient power.

[0084] Figure 7 This is a flowchart illustrating the computer equipment monitoring method provided by the present invention, as shown below. Figure 7 As shown, the present invention provides a computer device monitoring method, comprising:

[0085] Step 701: The force conditions generated in each monitoring area are measured by flexible pressure sensor units installed in each monitoring area of ​​the computer device, and the force deformation information corresponding to each monitoring area is obtained.

[0086] Step 702: Generate contact pressure data generated in the monitoring area based on the stress deformation information;

[0087] Step 703: Based on the power-on status information of the computer device, determine the current target monitoring area from multiple monitoring areas, and based on the contact pressure data of the target monitoring area, determine whether the monitoring area is a contact pressure abnormal area. If so, take the contact pressure data corresponding to the contact pressure abnormal area as contact pressure monitoring abnormal data.

[0088] In this invention, the flexible pressure sensor unit is made of flexible material, which can adapt to monitoring areas of different shapes and sizes. It features high sensitivity and high precision, enabling accurate sensing and measurement of the contact pressure experienced by the monitoring area. By measuring the force on each monitoring area of ​​various computer devices using the flexible pressure sensor unit, the corresponding stress deformation information of each monitoring area can be obtained. This stress deformation information can be used to monitor the contact pressure of computer devices in real time. For example, the flexible pressure sensor unit can be placed on the contact surface between the heat sink and the chip to monitor the contact pressure of the heat sink on the chip; the flexible pressure sensor can be placed on the inner wall and latch of the connector to monitor for poor contact and missing insertion during high-speed cable connector connection; the flexible pressure sensor can be placed in areas of high deformation stress on the PCB board to monitor the stress of the PCB board during transportation.

[0089] Furthermore, in this invention, a flexible pressure sensor unit monitors the contact pressure on each monitoring area in real time and converts it into stress deformation information. This stress deformation information is then processed to generate corresponding contact pressure data. In this invention, a contact pressure data acquisition unit analyzes and calculates the stress deformation information to obtain the contact pressure data generated in each monitoring area, thereby enabling subsequent contact pressure monitoring of the computer equipment.

[0090] Furthermore, in this invention, it is necessary to determine the monitoring area (i.e., the target monitoring area) for a given period based on the current power-on status of the computer equipment. For example, when the computer equipment is not powered on, the monitoring mainly focuses on the contact surface area between the chip heat sink and the chip, as well as the stress area of ​​the printed circuit board. After the computer equipment is powered on, the monitoring mainly focuses on the inner walls of the interfaces and the snap-fit ​​areas of the various connectors in the computer equipment. When the target monitoring area is determined to be an area of ​​abnormal contact pressure, that is, the contact pressure data in the monitoring area exceeds the normal range or changes abnormally, the contact pressure data corresponding to that area is marked as abnormal contact pressure monitoring data. This abnormal data can be used for subsequent fault diagnosis, predictive maintenance, and other operations, as well as to provide alarms or notifications to system administrators.

[0091] The computer equipment monitoring method provided by this invention measures the force generated in each monitoring area of ​​the computer equipment by using flexible pressure sensor units installed in each monitoring area. Based on the force deformation information of each monitoring area, corresponding contact pressure data is obtained. Then, based on the power-on status information of the computer equipment, the contact pressure data of the target monitoring area determined in multiple monitoring areas is judged, and abnormal contact pressure monitoring data is determined based on the judgment result. This enables the monitoring of faults caused by contact pressure in the computer equipment and improves the operational stability of the computer equipment after power-on.

[0092] Based on the above embodiments, the step of determining the current target monitoring area from multiple monitoring areas according to the power-on status information of the computer device, and determining whether the monitoring area is a contact pressure abnormality area based on the contact pressure data of the target monitoring area, and if so, taking the contact pressure data corresponding to the contact pressure abnormality area as contact pressure monitoring abnormal data, includes:

[0093] Based on the power-on status information, determine whether the computer device is currently powered on;

[0094] If it is determined that the computer device is not powered on at the current time, the first monitoring area and / or the third monitoring area are monitored to obtain the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area;

[0095] The contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area are compared with a first preset contact pressure threshold. If the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area are greater than or equal to the first preset contact pressure threshold, the first monitoring area and / or the third monitoring area are determined to be contact pressure abnormal areas. The contact pressure data corresponding to the contact pressure abnormal areas are stored as contact pressure monitoring abnormal data, and the stored contact pressure monitoring abnormal data are displayed after the computer device is powered on. The first preset contact pressure threshold includes the preset contact pressure threshold corresponding to the first monitoring area and the preset contact pressure threshold corresponding to the third monitoring area.

[0096] If it is determined that the computer device is powered on at the current time, the second monitoring area is monitored to obtain the contact pressure data corresponding to the second monitoring area;

[0097] The contact pressure data corresponding to the second monitoring area is compared with a second preset contact pressure threshold. If the contact pressure data corresponding to the second monitoring area is greater than or equal to the second preset contact pressure threshold, the second monitoring area is determined to be the contact pressure abnormal area. The contact pressure data of the second monitoring area that has been determined to be the contact pressure abnormal area is displayed as the contact pressure monitoring abnormal data.

[0098] The computer device is provided with multiple monitoring areas, including at least a first monitoring area, a second monitoring area, and a third monitoring area. The first monitoring area is the contact surface area between the chip heat sink and the chip in the computer device; the second monitoring area is the inner wall of the interface and the snap-fit ​​area of ​​each connector in the computer device; and the third monitoring area is the stress area of ​​the printed circuit board in the computer device during transportation.

[0099] In this invention, data monitoring when the server is not powered on is performed by a microcontroller. When the microcontroller detects an abnormal contact pressure value in a certain monitoring area during the server's power-off period, it records the data to the data storage unit. When the server is powered on and running, the microcontroller no longer needs to operate, and the contact pressure is mainly monitored by the BMC (Browser Controlled Components). The BMC monitoring section monitors the contact pressure during the server's power-on operation (mainly the contact pressure of connector insertion). Furthermore, after the server is powered on, it reads the contact pressure value data recorded by the microcontroller during the server's power-off period stored in the EEPROM chip (to reduce storage space usage, the BMC only needs to acquire abnormal contact pressure data during the power-off period; this abnormal contact pressure data is mainly generated by the contact pressure between the chip and the heat sink, as well as the contact pressure of the PCB board's stress areas during handling). This allows users to view the historical contact pressure values ​​of the chip, heat sink, or other stress areas recorded by the server.

[0100] In this invention, a corresponding preset contact pressure threshold can be set according to different monitoring areas. This allows for the comparison of contact pressure data generated in different monitoring areas with the corresponding preset contact pressure threshold when the server is powered on in different states. This enables a quick determination of whether there is an abnormal contact pressure in the current monitoring area, facilitating timely troubleshooting by relevant personnel.

[0101] Figure 8 This is a schematic diagram of the structure of the electronic device provided by the present invention, such as... Figure 8As shown, the electronic device may include: a processor 801, a communication interface 802, a memory 803, and a communication bus 804, wherein the processor 801, the communication interface 802, and the memory 803 communicate with each other through the communication bus 804. The processor 801 can call logical instructions in the memory 803 to execute a computer device monitoring method, which includes: measuring the force conditions generated in each monitoring area by using flexible pressure sensor units installed in each monitoring area of ​​the computer device to obtain force deformation information corresponding to each monitoring area; generating contact pressure data generated in the monitoring area based on the force deformation information; determining the current target monitoring area from multiple monitoring areas based on the power-on status information of the computer device, and determining whether the monitoring area is a contact pressure abnormal area based on the contact pressure data of the target monitoring area; if so, taking the contact pressure data corresponding to the contact pressure abnormal area as contact pressure monitoring abnormal data.

[0102] Furthermore, the logical instructions in the aforementioned memory 803 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0103] On the other hand, the present invention also provides a computer program product, the computer program product including a computer program stored on a non-transitory computer-readable storage medium, the computer program including program instructions, when the program instructions are executed by a computer, the computer is able to execute the computer device monitoring method provided by the above methods, the method including: measuring the force generated in each monitoring area by means of flexible pressure sensor units disposed in each monitoring area of ​​the computer device, and obtaining force deformation information corresponding to each monitoring area; generating contact pressure data generated in the monitoring area according to the force deformation information; determining the current target monitoring area from multiple monitoring areas according to the power-on status information of the computer device, and determining whether the monitoring area is a contact pressure abnormal area according to the contact pressure data of the target monitoring area, if so, taking the contact pressure data corresponding to the contact pressure abnormal area as contact pressure monitoring abnormal data.

[0104] In another aspect, the present invention also provides a non-transitory computer-readable storage medium storing a computer program thereon. When executed by a processor, the computer program is implemented to perform the computer device monitoring method provided in the above embodiments. The method includes: measuring the force conditions generated in each monitoring area by means of flexible pressure sensor units disposed in each monitoring area of ​​the computer device, and obtaining force deformation information corresponding to each monitoring area; generating contact pressure data generated in the monitoring area based on the force deformation information; determining the current target monitoring area from among the multiple monitoring areas based on the power-on status information of the computer device, and determining whether the monitoring area is a contact pressure abnormal area based on the contact pressure data of the target monitoring area. If so, the contact pressure data corresponding to the contact pressure abnormal area is taken as contact pressure monitoring abnormal data.

[0105] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0106] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A computer equipment monitoring device, characterized in that, It includes a flexible pressure sensor unit, a contact pressure data acquisition unit, and a monitoring unit, wherein: The flexible pressure sensor unit is installed in each monitoring area of ​​the computer device to measure the force generated in each monitoring area and obtain the force deformation information corresponding to each monitoring area. The contact pressure data acquisition unit is used to generate contact pressure data generated in the monitoring area based on the force deformation information. The monitoring unit is used to determine the current target monitoring area from multiple monitoring areas based on the power-on status information of the computer device, and to determine whether the monitoring area is a contact pressure abnormal area based on the contact pressure data of the target monitoring area. If so, the contact pressure data corresponding to the contact pressure abnormal area is taken as contact pressure monitoring abnormal data. The flexible pressure sensor unit is disposed in multiple monitoring areas within the computer device, wherein the multiple monitoring areas include at least a first monitoring area, a second monitoring area, and a third monitoring area, wherein: The first monitoring area is the contact surface area between the chip heat sink and the chip in the computer device; The second monitoring area is the inner wall of the interface and the snap-fit ​​area of ​​each connector in the computer device; The third monitoring area is the stress area of ​​the printed circuit board in the computer equipment during the handling process.

2. The computer equipment monitoring device according to claim 1, characterized in that, The contact pressure data acquisition unit is provided with multiple voltage divider circuits. A corresponding mapping relationship is established between the flexible pressure sensor unit set in each monitoring area and each voltage divider circuit. The contact pressure data acquisition unit is also used to obtain the contact pressure data generated by the corresponding monitoring area through the voltage change data in the voltage divider circuit according to the mapping relationship.

3. The computer equipment monitoring device according to claim 1, characterized in that, The monitoring unit includes a microcontroller monitoring subunit and a baseboard management controller monitoring subunit, wherein: The monitoring unit determines whether the computer device is powered on at the current moment based on the power-on status information. If it is determined that the computer device is not powered on at the current time, the microcontroller monitoring subunit monitors the first monitoring area and / or the third monitoring area to obtain the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area collected by the contact pressure data acquisition unit. The microcontroller monitoring subunit compares the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area with a first preset contact pressure threshold. If the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area is greater than or equal to the first preset contact pressure threshold, the first monitoring area and / or the third monitoring area are determined to be contact pressure abnormal areas. The contact pressure data corresponding to the contact pressure abnormal areas is stored as contact pressure monitoring abnormal data, and the stored contact pressure monitoring abnormal data is displayed after the computer device is powered on. The first preset contact pressure threshold includes the preset contact pressure threshold corresponding to the first monitoring area and the preset contact pressure threshold corresponding to the third monitoring area. If it is determined that the computer device is powered on at the current time, the second monitoring area is monitored by the baseboard management controller monitoring subunit, and the contact pressure data corresponding to the second monitoring area collected by the contact pressure data acquisition unit is obtained; The substrate management controller monitoring subunit compares the contact pressure data corresponding to the second monitoring area with a second preset contact pressure threshold. If the contact pressure data corresponding to the second monitoring area is greater than or equal to the second preset contact pressure threshold, the second monitoring area is determined to be the contact pressure abnormal area. The contact pressure data of the second monitoring area that has been determined to be the contact pressure abnormal area is displayed as the contact pressure monitoring abnormal data.

4. The computer equipment monitoring device according to claim 3, characterized in that, The computer equipment monitoring device further includes a monitoring data storage unit. The monitoring data storage unit is used to store the contact pressure data monitored by the monitoring unit from the first monitoring area and / or the third monitoring area when the computer equipment is not powered on, and to send the stored contact pressure data to the substrate management controller monitoring subunit after the computer equipment is powered on, so that the substrate management controller monitoring subunit can generate a corresponding monitoring report based on the contact pressure data.

5. The computer equipment monitoring device according to any one of claims 1 to 3, characterized in that, The computer equipment monitoring device also includes a power supply unit, which is connected to the flexible pressure sensor unit, the contact pressure data acquisition unit and the monitoring unit respectively, and is used to supply power to the flexible pressure sensor unit, the contact pressure data acquisition unit and the monitoring unit when the computer equipment is not powered on.

6. A method for monitoring computer equipment, characterized in that, include: By using flexible pressure sensor units installed in various monitoring areas of the computer device, the force conditions generated in each monitoring area are measured, and the force deformation information corresponding to each monitoring area is obtained. Based on the stress deformation information, contact pressure data generated in the monitoring area is generated; Based on the power-on status information of the computer device, the current target monitoring area is determined from multiple monitoring areas, and based on the contact pressure data of the target monitoring area, it is determined whether the monitoring area is a contact pressure abnormal area. If so, the contact pressure data corresponding to the contact pressure abnormal area is taken as contact pressure monitoring abnormal data. The flexible pressure sensor unit is disposed in multiple monitoring areas within the computer device, wherein the multiple monitoring areas include at least a first monitoring area, a second monitoring area, and a third monitoring area, wherein: The first monitoring area is the contact surface area between the chip heat sink and the chip in the computer device; The second monitoring area is the inner wall of the interface and the snap-fit ​​area of ​​each connector in the computer device; The third monitoring area is the stress area of ​​the printed circuit board in the computer equipment during the handling process.

7. The computer equipment monitoring method according to claim 6, characterized in that, The step of determining the current target monitoring area from multiple monitoring areas based on the power-on status information of the computer device, and determining whether the monitoring area is a contact pressure abnormality area based on the contact pressure data of the target monitoring area, and if so, taking the contact pressure data corresponding to the contact pressure abnormality area as contact pressure monitoring abnormal data, includes: Based on the power-on status information, determine whether the computer device is currently powered on; If it is determined that the computer device is not powered on at the current time, the first monitoring area and / or the third monitoring area are monitored to obtain the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area; The contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area are compared with a first preset contact pressure threshold. If the contact pressure data corresponding to the first monitoring area and / or the contact pressure data corresponding to the third monitoring area are greater than or equal to the first preset contact pressure threshold, the first monitoring area and / or the third monitoring area are determined to be contact pressure abnormal areas. The contact pressure data corresponding to the contact pressure abnormal areas are stored as contact pressure monitoring abnormal data, and the stored contact pressure monitoring abnormal data are displayed after the computer device is powered on. The first preset contact pressure threshold includes the preset contact pressure threshold corresponding to the first monitoring area and the preset contact pressure threshold corresponding to the third monitoring area. If it is determined that the computer device is powered on at the current time, the second monitoring area is monitored to obtain the contact pressure data corresponding to the second monitoring area; The contact pressure data corresponding to the second monitoring area is compared with the second preset contact pressure threshold. If the contact pressure data corresponding to the second monitoring area is greater than or equal to the second preset contact pressure threshold, the second monitoring area is determined to be the contact pressure abnormal area. The contact pressure data of the second monitoring area that has been determined to be the contact pressure abnormal area is displayed as the contact pressure monitoring abnormal data.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the computer device monitoring method as described in any one of claims 6 to 7.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the computer device monitoring method as described in any one of claims 6 to 7.

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