Chip test recipe management method, system, storage medium and device

Abstract

The application discloses a kind of chip test recipe management method, system, storage medium and equipment, it is related to semiconductor integrated circuit technical field, the method includes: according to LED chip test electric parameter and light parameter, establishes several recipes on chip testing machine;All LED chips are classified;Based on electric parameter and light parameter, the different recipes of the LED chip of same category are associated, the correlation coefficient of different recipe is obtained and the reference data of different recipe;LED correction chip is tested with corresponding recipe, and the test data of LED correction chip is obtained;Based on the difference between test data and reference data, corresponding recipe is modified;Based on difference and the correlation coefficient of different recipes of same category, the compensation coefficient of different recipe is obtained, to modify and compensate other recipes, to obtain the different recipe correction of LED chip of same category, the present application can solve the technical problems that too many program recipe files in prior art, correction recipe time is long, efficiency is low and error-prone.

Description

Technical Field

[0001] This invention relates to the field of semiconductor integrated circuit technology, and specifically to a chip test recipe management method, system, storage medium, and device. Background Technology

[0002] A recipe (process method) refers to the process flow in industrial automated manufacturing. A recipe can include the following information: multiple steps in the material processing, the values ​​of various process parameters in each step, and the termination conditions of each step, etc.

[0003] As the LED product market and manufacturing volume gradually increase, chip testing is an essential process. Chip testing machines need to be calibrated daily for different product recipes, and production can only begin after the calibration is confirmed to be error-free.

[0004] However, with the increasing market growth and product models, the number of program recipe files running on the machine is too large. Therefore, the number of recipes that need to be calibrated is also increasing. Each model's recipe needs to be calibrated daily, which leads to frequent calibration of the chip tester, easily causing calibration errors, resulting in abnormal calibrated recipes, abnormal test data of LED products, and affecting the yield of LED products. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide a chip test recipe management method, system, storage medium and device, which aims to solve the technical problems of excessive number of program recipe files, long correction time, low efficiency and easy error in the prior art.

[0006] A first aspect of the present invention is to provide a chip test recipe management method, the method comprising:

[0007] Based on the electrical and optical parameters of the LED chip test, several recipes of different models and sizes were created on the chip testing machine;

[0008] All LED chips are preprocessed to classify them.

[0009] Based on the electrical parameters and the optical parameters, different recipes for LED chips of the same category are correlated to obtain the correlation coefficients of different recipes and the baseline data of different recipes.

[0010] The LED correction chip is tested according to the corresponding recipe to obtain the test data of the LED correction chip;

[0011] Based on the difference between the test data and the baseline data of the corresponding recipe, the corresponding recipe is corrected;

[0012] Based on the differences and the correlation coefficients of different recipes in the same category, compensation coefficients for different recipes are obtained to correct and compensate other recipes in the same category, thereby obtaining different recipe corrections for LED chips of the same category.

[0013] Compared with existing technologies, the beneficial effects of this invention are as follows: The chip testing recipe management method provided by this invention can effectively shorten calibration time and reduce error rate. Specifically, based on the electrical and optical parameters of LED chip testing, several recipes of different models and sizes are established on the chip testing machine; all LED chips are preprocessed to classify them; based on the electrical and optical parameters, different recipes for LED chips of the same category are associated to obtain the correlation coefficients and baseline data of different recipes. The calculation of the correlation coefficients effectively links different recipes, and the correlation of one recipe can be used to regulate other recipes, greatly reducing the workload of manual calibration; the LED calibration chips are tested according to the corresponding recipes to obtain the test count of the LED calibration chips. According to the method, based on the difference between the test data and the baseline data of the corresponding recipe, the corresponding recipe is corrected, which can effectively improve the accuracy of recipe testing. Based on the difference and the correlation coefficient of different recipes in the same category, the compensation coefficient of different recipes is obtained to correct and compensate other recipes in the same category, thereby obtaining different recipe corrections for LED chips of the same category. According to the difference value of one recipe and the correlation coefficient with other recipes, other recipes are adjusted, which can effectively improve the accuracy of other recipe corrections, shorten the correction time, improve the correction efficiency, reduce the correction workload, reduce correction errors, and improve the yield of LED products. This solves the technical problems of too many program recipe files, long correction time, low efficiency and easy error in the prior art.

[0014] According to one aspect of the above technical solution, the step of preprocessing all LED chips to classify them specifically includes:

[0015] Obtain the model and size of all LED chips;

[0016] LED chips of similar models and sizes are grouped into the same category.

[0017] According to one aspect of the above technical solution, the step of associating different recipes of LED chips of the same category based on the electrical parameters and the optical parameters to obtain the correlation coefficients of different recipes and the reference data of different recipes includes:

[0018] Within the same category of LED chips, obtain the electrical and optical parameters of several LED chips with different recipes to obtain a set of recipes with different recipes;

[0019] The data from different recipe sets is filtered to remove outliers, and then the data is analyzed and compared to obtain the correlation coefficient between each recipe and other recipes.

[0020] The baseline data for each recipe is obtained by averaging the different sets of recipes.

[0021] According to one aspect of the above technical solution, the step of correcting the corresponding recipe based on the difference between the test data and the baseline data of the corresponding recipe specifically includes:

[0022] The test results are compared with the baseline data of the corresponding recipe to obtain a difference coefficient. Based on the difference coefficient, the corresponding recipe is corrected.

[0023] According to one aspect of the above technical solution, based on the differences and the correlation coefficients of different recipes of the same category, compensation coefficients for different recipes are obtained to correct and compensate other recipes of the same category, thereby obtaining the step of correcting different recipes for LED chips of the same category. Specifically, this includes:

[0024] Multiply the difference coefficient and the correlation coefficient between the corresponding recipe and other recipes to obtain the compensation coefficient for different recipes;

[0025] Based on the compensation coefficient, different recipes are corrected and compensated to obtain different recipe corrections for LED chips of the same category.

[0026] According to one aspect of the above technical solution, the method further includes:

[0027] After different recipes for LED chips of the same category have been calibrated, the LED chips of the same category are tested to obtain the test data of the calibrated LED chips.

[0028] According to one aspect of the above technical solution, the electrical parameters include forward voltage parameters at different coordinates on the LED chip, and the optical parameters include light output parameters and wavelength parameters at different coordinates on the LED chip.

[0029] A second aspect of the present invention is to provide a chip test recipe management system, the chip test recipe management system being used to implement the above-described chip test recipe management method, the system comprising:

[0030] The Recipe creation module is used to create several different models and sizes of recipes on the chip testing machine based on the electrical and optical parameters of the LED chip test.

[0031] The chip sorting module is used to preprocess all LED chips to classify them.

[0032] The recipe association module is used to associate different recipes of the same type of LED chip based on the electrical parameters and the optical parameters, so as to obtain the association coefficients of different recipes and the baseline data of different recipes.

[0033] The calibration chip testing module is used to perform corresponding recipe tests on the LED calibration chip and obtain the test data of the LED calibration chip.

[0034] The Recipe Correction Module is used to correct the corresponding recipe based on the difference between the test data and the baseline data of the corresponding recipe.

[0035] The Recipe Compensation Module is used to obtain compensation coefficients for different recipes based on the differences and the correlation coefficients of different recipes in the same category, so as to correct and compensate other recipes in the same category, thereby obtaining different recipe corrections for LED chips of the same category.

[0036] A third aspect of the present invention is to provide a readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the chip test recipe management method described above.

[0037] A fourth aspect of the present invention is to provide an apparatus comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the chip test recipe management method as described above. Attached Figure Description

[0038] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0039] Figure 1 This is a flowchart of the chip test recipe management method in the first embodiment of the present invention;

[0040] Figure 2 This is a structural block diagram of the chip test recipe management system in the second embodiment of the present invention;

[0041] Component symbol explanation in the attached diagram:

[0042] Recipe creation module 100, chip classification module 200, Recipe association module 300, chip calibration and testing module 400, Recipe correction module 500, and Recipe compensation module 600. Detailed Implementation

[0043] To make the objectives, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Several embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be more thorough and complete.

[0044] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and similar expressions used herein are for illustrative purposes only and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0045] In this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0046] Example 1

[0047] Please see Figure 1 The image shows a chip test recipe management method provided in the first embodiment of the present invention, the method comprising steps S10-S15:

[0048] Step S10: Based on the electrical and optical parameters of the LED chip test, create several recipes of different models and sizes on the chip testing machine;

[0049] Specifically, the chip tester needs to calibrate the packaged components to the correct position when establishing the recipe; the packaged calibration refers to sending the chip to the tester to test its electrical and optical parameters after packaging, and calibrating the packaged data onto the chip tester platform to achieve the correct position.

[0050] The electrical parameters include the forward voltage parameters at different coordinates on the LED chip, and the optical parameters include the light output parameters and wavelength parameters at different coordinates on the LED chip.

[0051] Step S11: Preprocess all LED chips to classify them.

[0052] Specifically, this involves obtaining the model and size of all LED chips;

[0053] LED chips of similar models and sizes are grouped into the same category.

[0054] Examples, not limitations, can be categorized by model, such as red LED chips, red-yellow LED chips, blue-green LED chips, etc., or by size, such as red LED chips, red Mini LED chips, red Micro LED chips, etc.

[0055] It should be noted that classifying LED chips by model and size means that within the same category, the electrical and optical parameters are not significantly different, and the magnitude of their increase or decrease is similar. This allows for effective control of other recipes by leveraging the correlation of one recipe, thereby reducing the workload of operators and minimizing the error rate caused by manually adjusting different recipes one by one.

[0056] Step S12: Based on the electrical parameters and the optical parameters, associate different recipes of LED chips of the same category to obtain the association coefficients of different recipes and the baseline data of different recipes.

[0057] Specifically, within the same category of LED chips, the electrical and optical parameters of several LED chips with different recipes are obtained to obtain a set of recipes with different recipes;

[0058] The data from different recipe sets is filtered to remove outliers, and then the data is analyzed and compared to obtain the correlation coefficient between each recipe and other recipes.

[0059] It should be noted that the calculation of correlation coefficients can effectively link different recipes together, and the correlation of one recipe can be used to regulate other recipes, greatly reducing the workload of manual correction.

[0060] The baseline data for each recipe is obtained by averaging the different sets of recipes.

[0061] Step S13: Perform the corresponding recipe test on the LED correction chip to obtain the test data of the LED correction chip;

[0062] Step S14: Based on the difference between the test data and the baseline data of the corresponding recipe, the corresponding recipe is corrected;

[0063] Specifically, the test is compared with the baseline data of the corresponding recipe to obtain a difference coefficient, and the corresponding recipe is corrected based on the difference coefficient.

[0064] By comparing the data with benchmark data to obtain the difference coefficient, and then correcting the corresponding recipe based on the difference coefficient, the accuracy of recipe testing can be effectively improved.

[0065] Step S15: Based on the differences and the correlation coefficients of different recipes in the same category, compensation coefficients for different recipes are obtained to correct and compensate other recipes in the same category, thereby obtaining different recipe corrections for LED chips of the same category.

[0066] Specifically, the difference coefficient and the correlation coefficient between the corresponding recipe and other recipes are multiplied to obtain the compensation coefficient for different recipes;

[0067] Based on the compensation coefficient, different recipes are corrected and compensated to obtain different recipe corrections for LED chips of the same category.

[0068] It should be noted that by adjusting other recipes based on the difference value of one recipe and its correlation coefficient with other recipes, the accuracy of other recipe calibration can be effectively improved, the calibration workload can be reduced, calibration errors can be reduced, and the yield of LED products can be improved.

[0069] Compared with existing technologies, the chip test recipe management method in this embodiment has the following advantages: The chip test recipe management method provided by this invention can effectively shorten calibration time and reduce error rate. Specifically, based on the electrical and optical parameters of the LED chip test, several recipes of different models and sizes are established on the chip testing machine; all LED chips are preprocessed to classify them; based on the electrical and optical parameters, different recipes for LED chips of the same category are associated to obtain the correlation coefficients and baseline data of different recipes. The calculation of the correlation coefficients effectively links different recipes, and the correlation of one recipe controls other recipes, greatly reducing the workload of manual calibration; the LED calibration chip is tested according to the corresponding recipe to obtain the LED... The test data of the D-calibration chip; based on the difference between the test data and the baseline data of the corresponding recipe, the corresponding recipe is corrected, which can effectively improve the accuracy of recipe testing; based on the difference and the correlation coefficient of different recipes of the same category, the compensation coefficient of different recipes is obtained to correct and compensate other recipes of the same category, thereby obtaining different recipe calibrations for LED chips of the same category. According to the difference value of one recipe and the correlation coefficient with other recipes, other recipes are adjusted, which can effectively improve the accuracy of other recipe calibration, shorten calibration time, improve calibration efficiency, reduce calibration workload, reduce calibration errors, and improve the yield of LED products. This solves the technical problems of too many program recipe files, long calibration time, low efficiency and easy error in the prior art.

[0070] Example 2

[0071] Please see Figure 2 The image shows a chip test recipe management system provided in the second embodiment of the present invention. The system includes:

[0072] The Recipe creation module 100 is used to create several recipes of different models and sizes on the chip testing machine based on the electrical and optical parameters of the LED chip test.

[0073] Among them, the chip tester needs to calibrate the packaged components to the correct position when establishing the recipe; the packaged calibration refers to sending the chip to the tester to test the electrical and optical parameters after packaging, and calibrating the packaged data onto the chip tester platform to achieve the correct position.

[0074] The electrical parameters include the forward voltage parameters at different coordinates on the LED chip, and the optical parameters include the light output parameters and wavelength parameters at different coordinates on the LED chip.

[0075] The chip sorting module 200 is used to preprocess all LED chips to sort them.

[0076] This involves obtaining the model and size of all LED chips, and classifying LED chips with similar models and sizes into the same category.

[0077] Recipe association module 300 is used to associate different recipes of the same type of LED chip based on the electrical parameters and the optical parameters, so as to obtain the association coefficients of different recipes and the baseline data of different recipes.

[0078] Within the same category of LED chips, obtain the electrical and optical parameters of several LED chips with different recipes to obtain a set of recipes with different recipes;

[0079] The data from different recipe sets is filtered to remove outliers, and then the data is analyzed and compared to obtain the correlation coefficient between each recipe and other recipes.

[0080] The baseline data for each recipe is obtained by averaging the different sets of recipes.

[0081] The calibration chip test module 400 is used to perform corresponding recipe tests on the LED calibration chip and obtain test data of the LED calibration chip.

[0082] Recipe correction module 500 is used to correct the corresponding recipe based on the difference between the test data and the baseline data of the corresponding recipe;

[0083] The test results are compared with the baseline data of the corresponding recipe to obtain a difference coefficient. Based on the difference coefficient, the corresponding recipe is corrected.

[0084] The Recipe Compensation Module 600 is used to obtain compensation coefficients for different recipes based on the differences and the correlation coefficients of different recipes of the same category, so as to correct and compensate other recipes of the same category, thereby obtaining different recipe corrections for LED chips of the same category.

[0085] Multiply the difference coefficient and the correlation coefficient between the corresponding recipe and other recipes to obtain the compensation coefficient for different recipes;

[0086] Based on the compensation coefficient, different recipes are corrected and compensated to obtain different recipe corrections for LED chips of the same category.

[0087] Compared with existing technologies, the chip test recipe management system in this embodiment has the following advantages: The chip test recipe management system provided by this invention can effectively shorten calibration time and reduce error rate. Specifically, it classifies all LED chips through a chip classification module; based on the electrical and optical parameters, it associates different recipes for LED chips of the same category through a recipe association module, obtaining association coefficients and baseline data for different recipes. The calculation of association coefficients effectively links different recipes, allowing the correlation of one recipe to control other recipes, greatly reducing the workload of manual calibration; and it further reduces errors through a recipe correction module. The corresponding recipe correction can effectively improve the accuracy of recipe testing. By obtaining compensation coefficients for different recipes through the recipe supplementation module, other recipes of the same category can be corrected and compensated, thereby obtaining different recipe corrections for LED chips of the same category. Based on the difference value of a recipe and its correlation coefficient with other recipes, other recipes can be adjusted, which can effectively improve the accuracy of other recipe corrections, shorten correction time, increase correction efficiency, reduce correction workload, reduce correction errors, and increase the yield of LED products. This solves the technical problems of excessive number of program recipe files, long correction time, low efficiency, and easy error in the prior art.

[0088] Example 3

[0089] The third embodiment of the present invention provides a computer-readable storage medium having computer instructions stored thereon, which, when executed by a processor, implement the steps of the method described in the first embodiment.

[0090] Example 4

[0091] The fourth embodiment of the present invention provides a device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the steps of the method described in the first embodiment.

[0092] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] Those skilled in the art will understand that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequential list of executable instructions for implementing logical functions, and can be embodied in any computer-readable storage medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable storage medium" can mean any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0094] More specific examples (a non-exhaustive list) of computer-readable storage media include: electrical connections (electronic devices) having one or more wires, portable computer disk drives (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Furthermore, computer-readable storage media can even be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory.

[0095] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0096] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0097] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A chip test recipe management method, characterized in that, The method includes: Based on the electrical and optical parameters of the LED chip test, several recipes of different models and sizes were created on the chip testing machine; All LED chips are preprocessed to classify them. Based on the electrical parameters and the optical parameters, different recipes for LED chips of the same category are correlated to obtain the correlation coefficients of different recipes and the baseline data of different recipes. The LED correction chip is tested according to the corresponding recipe to obtain the test data of the LED correction chip; Based on the difference between the test data and the baseline data of the corresponding recipe, the corresponding recipe is corrected; Based on the differences and the correlation coefficients of different recipes in the same category, compensation coefficients for different recipes are obtained to correct and compensate other recipes in the same category, thereby obtaining different recipe corrections for LED chips of the same category.

2. The chip test recipe management method according to claim 1, characterized in that, The preprocessing of all LED chips, specifically the step of classifying them, includes: Obtain the model and size of all LED chips; LED chips of similar models and sizes are grouped into the same category.

3. The chip test recipe management method according to claim 1, characterized in that, The steps for associating different recipes of the same type of LED chip based on the electrical parameters and optical parameters to obtain the correlation coefficients of different recipes and the baseline data of different recipes include: Within the same category of LED chips, obtain the electrical and optical parameters of several LED chips with different recipes to obtain a set of recipes with different recipes; The data from different recipe sets is filtered to remove outliers, and then the data is analyzed and compared to obtain the correlation coefficient between each recipe and other recipes. The baseline data for each recipe is obtained by averaging the different sets of recipes.

4. The chip test recipe management method according to claim 1, characterized in that, The step of correcting the corresponding recipe based on the difference between the test data and the baseline data of the corresponding recipe specifically includes: The test results are compared with the baseline data of the corresponding recipe to obtain a difference coefficient. Based on the difference coefficient, the corresponding recipe is corrected.

5. The chip test recipe management method according to claim 4, characterized in that, Based on the aforementioned differences and the correlation coefficients between different recipes within the same category, compensation coefficients for different recipes are obtained to correct and compensate for other recipes within the same category. This process, which involves correcting different recipes for LED chips of the same category, specifically includes: Multiply the difference coefficient and the correlation coefficient between the corresponding recipe and other recipes to obtain the compensation coefficient for different recipes; Based on the compensation coefficient, different recipes are corrected and compensated to obtain different recipe corrections for the same type of LED chips.

6. The chip test recipe management method according to claim 1, characterized in that, The method further includes: After different recipes for LED chips of the same category have been calibrated, the LED chips of the same category are tested to obtain the test data of the calibrated LED chips.

7. The chip test recipe management method according to claim 1, characterized in that, The electrical parameters include the forward voltage parameters at different coordinates on the LED chip, and the optical parameters include the light output parameters and wavelength parameters at different coordinates on the LED chip.

8. A chip test recipe management system, characterized in that, The chip test recipe management system is used to implement the chip test recipe management method according to any one of claims 1-7, the system comprising: The Recipe creation module is used to create several different models and sizes of recipes on the chip testing machine based on the electrical and optical parameters of the LED chip test. The chip sorting module is used to preprocess all LED chips to classify them. The recipe association module is used to associate different recipes of the same type of LED chip based on the electrical parameters and the optical parameters, so as to obtain the association coefficients of different recipes and the baseline data of different recipes. The calibration chip testing module is used to perform corresponding recipe tests on the LED calibration chip and obtain the test data of the LED calibration chip. The Recipe Correction Module is used to correct the corresponding recipe based on the difference between the test data and the baseline data of the corresponding recipe. The Recipe Compensation Module is used to obtain compensation coefficients for different recipes based on the differences and the correlation coefficients of different recipes in the same category, so as to correct and compensate other recipes in the same category, thereby obtaining different recipe corrections for LED chips of the same category.

9. A readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the chip test recipe management method as described in any one of claims 1-7.

10. An apparatus comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the chip test recipe management method as described in any one of claims 1-7.

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