Diamond wire bonding apparatus and method

Abstract

This invention provides a diamond wire bonding device and method, belonging to the field of wire welding technology, and solves the problem of poor finished product quality of diamond wire bonded in the prior art. The invention includes a substrate; clamping assemblies, at least two sets of which are disposed above the substrate for clamping diamond wire; each set of clamping assemblies includes: clamping bodies, at least two of which are clamping bodies; a clamping drive mechanism that drives the clamping bodies to move closer or further apart; a cutting assembly having a cutting area disposed between at least two sets of clamping assemblies to cut the diamond wire clamped by the clamping assemblies; a detection assembly disposed outside the clamping assemblies for acquiring the cross-sectional information of the diamond wire; and a centering assembly disposed below the clamping assemblies, which can drive at least one set of clamping assemblies to move and center with the other clamping assemblies based on the cross-sectional information of the diamond wire.

Description

Technical Field

[0001] This invention belongs to the field of wire welding technology, and more specifically, relates to a diamond wire welding device and a welding method. Background Technology

[0002] Diamond wire is widely used in the photovoltaic field, especially for cutting hard and brittle materials such as crystalline silicon. However, diamond wire is prone to breakage during the cutting process. After a breakage, wire bonding equipment is needed to reconnect the broken wire so that the cutting operation can continue.

[0003] Currently, diamond wire welding machines generally use resistance welding. This method requires clamping two diamond wires together, with the clamping material itself serving as the electrode material. The drive mechanism brings the ends of the two diamond wires together, applies current and upsetting force, and uses the heat generated by the high resistance at the contact point of the diamond wires to melt and weld them together.

[0004] The existing wire bonding process is as follows: First, the ends of two diamond wires are trimmed to make the end faces flat. Then, the two diamond wires are manually placed into the clamping slots respectively. The position of the diamond wires is observed on the display screen. After adjusting the position, the handle is turned down to make the upper pressure block press the diamond wires. The clamping mechanisms on both sides can be manually adjusted through the moving platform to make the ends of the two diamond wires collide. However, in the above process, the length of the diamond wires extending beyond the clamping block is difficult to control when manually placing them. If it extends too far, it is easily affected by the upsetting force during welding and will bend, resulting in a high probability of welding failure. Even if the welding is successful, the tensile strength of the welded diamond wires will be greatly reduced. If it extends too short, it is difficult to butt the two diamond wires together or to provide a suitable welding space.

[0005] Based on the above, the technical problem to be solved by this application is: how to improve the finished product quality of diamond wire bonding wire. Summary of the Invention

[0006] The purpose of this invention is to address the aforementioned problems in the prior art by proposing a diamond wire bonding device and method, thereby solving the problem of poor finished product quality in existing diamond wire bonding technologies. The technical effect of this application is that it can improve the finished product quality of diamond wire bonding.

[0007] The objective of this invention can be achieved through the following technical solution: a diamond wire bonding device, comprising a substrate; clamping assemblies, wherein the clamping assemblies are disposed above the substrate and there are at least two sets for clamping diamond wire, each set of clamping assemblies comprising: clamping bodies, wherein there are at least two clamping bodies; a clamping driving mechanism, wherein the clamping driving mechanism drives the clamping bodies to move closer or further apart from each other; a cutting assembly, wherein the cutting assembly has a cutting area, wherein the cutting area is disposed between at least two sets of clamping assemblies to cut the diamond wire clamped by the clamping assemblies; a detection assembly, wherein the detection assembly is disposed outside the clamping assemblies for acquiring the cross-sectional information of the diamond wire; and a centering assembly, wherein the centering assembly is disposed below the clamping assemblies and can drive at least one set of clamping assemblies to move and center with the remaining clamping assemblies according to the cross-sectional information of the diamond wire.

[0008] Understandably, the substrate is used to mount structures such as clamping components and alignment components. The clamping components serve as a fixing structure before diamond wire bonding. The operator manually or a robotic arm automatically places the diamond wire onto one of the clamping bodies. Then, a clamping drive mechanism drives one clamping body closer to another clamping body in the same clamping assembly until the two clamping bodies abut against each other, thus clamping and fixing the diamond wire. After the clamping components have clamped and fixed the diamond wire, the wire is cut by a cutting component. It is important to ensure that the cut end face of the diamond wire is flat to facilitate subsequent butt welding. After the cutting component completes the cutting, a detection component detects the diamond wire to obtain the cut surface information, which includes at least the position and inclination of the cut surface. Understandably, the alignment component and the detection component are electrically or communicatively connected, or information is processed and exchanged through a processor. After obtaining the cut surface information, the alignment component performs the alignment operation. It should be noted that after the diamond wire is cut, a portion will still protrude beyond the clamping body, and this protruding portion will shift in a certain direction due to the cutting action. Therefore, the centering component has at least two degrees of freedom of movement, and in some embodiments, three degrees of freedom of movement, to facilitate adjustment of the clamping component's position, i.e., adjusting the position of one of the diamond wires, thereby ensuring that the cut surfaces of the two diamond wires to be welded are aligned, improving the parallelism during welding, and resulting in a welded diamond wire with high tensile strength. In some embodiments, the cutting component uses contact cutting, such as cutting with a hard object; in other embodiments, the cutting component uses non-contact cutting, such as laser cutting.

[0009] In the aforementioned diamond wire bonding equipment, each set of clamping components has at least two wire grooves, the at least two wire grooves are independently arranged, and the extending direction of the wire grooves is towards the adjacent clamping components.

[0010] It is understandable that the purpose of setting two wire slots in each clamping assembly is that a single wire slot can hold one diamond wire, each clamping assembly can hold two diamond wires, and the two clamping assemblies can clamp two parts of the two diamond wires at the same time.

[0011] In the aforementioned diamond wire bonding equipment, a clamping groove is provided between the clamping bodies of each set of clamping components. A positioning block is provided in the clamping groove, and the positioning block is provided with the wire groove. The positioning block protrudes from the clamping groove, and the width of the wire groove gradually shrinks or expands in the clamping direction of the clamping body. The bottom of the wire groove is basically flush with the clamping surface of the clamping body.

[0012] Understandably, the wire grooves primarily serve to position the diamond wire radially, preventing it from shifting radially when held by the clamping body. The wire grooves are preferably V-shaped, as this guides the diamond wire, making placement and positioning easier. Multiple parallel wire grooves can be provided on each positioning block, the number determined by the number of wires to be bonded. In some embodiments, the wire grooves can also be adapted to be U-shaped, Y-shaped, etc. By configuring the top of the positioning block to protrude from the clamping surface of the clamping body, wire placement and positioning are facilitated, and the bottom of the wire groove is flush with the clamping surface to prevent bending of the diamond wire portion held within the clamping body. Furthermore, by providing clamping grooves within the clamping body to embed the positioning blocks, it is convenient to separately and independently process the uneven positioning blocks and clamping body, ensuring processing accuracy and avoiding affecting the shape of the diamond wire in its clamped state.

[0013] In the aforementioned diamond wire bonding equipment, the wire cutting assembly includes: a tool holder; a cutter hinged to the tool holder, forming the cutting area between the tool holder and the cutter; and a tool moving mechanism acting on the tool holder to move the tool holder closer to or away from the clamping assembly.

[0014] Understandably, the tool holder supports the cutter and provides a stable cutting platform. Hinging the cutter to the tool holder ensures a stable cutting path, and the cutting zone between the tool holder and the cutter is largely controllable. The tool shifting mechanism drives the tool holder to move, ensuring that during the dicing stage, the cutting zone between the cutter and the tool holder is located between the two clamping components. After dicing, the two clamping components need to move closer together to allow the two diamond wires to be joined for wire bonding. The tool shifting mechanism moves the tool holder and cutter to make room for wire bonding.

[0015] In the aforementioned diamond wire bonding equipment, a mating structure is provided between the tool holder and the clamping body. The mating structure includes: a first mating part disposed on the clamping body; and a second mating part disposed on the tool holder. The tool holder is movable to allow the second mating part to engage and abut against the first mating part.

[0016] It is understandable that by providing a mating structure between the tool holder and the clamping body, the tool holder can engage with the clamping body when it moves to a certain position. Specifically, the shapes of the first mating part and the second mating part are matched, and their connection relationship can be coupling, meshing, or fitting. In some embodiments, the first mating part and the second mating part are provided with guiding arc surfaces or planes. When the first mating part and the second mating part engage and abut, the spacing between adjacent clamping bodies of adjacent clamping assemblies can be kept stable and controllable, thereby improving the positioning accuracy of the tangential position.

[0017] In the aforementioned diamond wire bonding equipment, the cutter has a first working part and a second working part on each of its two sides. The first working part and the second working part can simultaneously grind against their respective adjacent clamping bodies to cut the diamond wire. It is understood that by providing the first and second working parts on the two sides of the cutter, the cutter can simultaneously cut at least two end faces in one rotation, and the length of the cut diamond wire segment is substantially equal to the distance between the first and second working parts. In some embodiments, the first and second working parts are integrally connected; in other embodiments, a gap exists between the first and second working parts.

[0018] In the aforementioned diamond wire bonding equipment, the detection component includes: a first imaging unit, which is aligned with the diamond wire in a first direction to take an image; and a second imaging unit, which is aligned with the diamond wire in a second direction to take an image; wherein the first direction is substantially perpendicular to the clamping surface of the clamping body, and the second direction is substantially parallel to the clamping surface of the clamping body.

[0019] Understandably, the first and second imaging units capture images of the diamond wire at different positions. The acquired images allow for analysis of the cross-sectional position and tilt information. Both the first and second directions point radially towards the diamond wire, and the images captured by both units are along the length of the diamond wire. Both the first and second imaging units have micrometer-level precision.

[0020] In the aforementioned diamond wire bonding equipment, the alignment component includes: a first driving mechanism disposed on the substrate, the first driving mechanism having an operating direction parallel to the substrate; a second driving mechanism disposed on the first driving mechanism, the second driving mechanism having an operating direction parallel to the substrate and perpendicular to the operating direction of the first driving mechanism; and a third driving mechanism disposed on the second driving mechanism, the third driving mechanism having an operating direction perpendicular to the substrate; wherein at least one set of clamping components is disposed on the third driving mechanism.

[0021] It is understandable that the first drive mechanism, the second drive mechanism, and the third drive mechanism are all linear drive mechanisms, preferably cylinders or electric cylinders.

[0022] Another object of the present invention is to provide a diamond wire bonding method, which uses the diamond wire bonding equipment described above and includes the following steps: a clamping component clamps and fixes at least two diamond wires; a cutting component cuts the clamped and fixed diamond wires; a detection component detects and obtains the cross-sectional information of the cut diamond wires; a centering component adjusts the position of the clamping component so that the cross-sections of at least two diamond wires are aligned; and the at least two diamond wires with aligned cross-sections are bonded together.

[0023] It is important to note that the diamond wire welding method of this invention differs significantly from existing diamond wire welding methods in its process. Existing methods employ a method of cutting first, then clamping and centering. The extension length of the diamond wire placed in the clamp is difficult to control stably by the operator's visual judgment. If the extension length is too large, it is easily bent due to the force of the energized forging section; if the extension length is too short, it increases the welding difficulty. In contrast, this invention uses a process of clamping first, then cutting and centering. The cutting component maintains a standard set gap with the clamping component beforehand, ensuring that the length of the diamond wire extending from the clamping component after cutting is within 0.3mm. When the cut surfaces of the two diamond wires touch and are welded, they will not bend due to the energized forging force, effectively improving the welding success rate and the strength of the welded product.

[0024] In the above-described diamond wire bonding method, in the step of clamping and fixing at least two diamond wires by the clamping components, at least two diamond wires are arranged in parallel to each other, and both ends of at least two diamond wires are clamped by two sets of clamping components.

[0025] Understandably, in some implementations, there are two diamond wires, which are placed in parallel and clamped together. Each diamond wire passes through two clamping components in the length direction. This ensures that when the wire cutting component cuts, it can cut two diamond wires at the same time. Furthermore, since the clamping force provided by the two clamping components is more stable, it is easier to cut the wires. Compared with clamping by a single clamping mechanism, it is less likely to cause a situation like the wires being cut but still connected.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. By implementing a process of clamping before cutting and centering, the cutting component and the clamping component are pre-set to maintain a standard gap, thereby ensuring that the length of the diamond wire extending out of the clamping component after cutting is within 0.3mm. When the cut surfaces of the two diamond wires are touched and welded, they will not bend due to the influence of the current forging force, and the welding success rate and the strength of the welded product can be effectively improved.

[0028] 2. By setting a first mating part and a second mating part that can cooperate and abut, the distance between adjacent clamping bodies of adjacent clamping components is kept stable and controllable, thereby improving the positioning accuracy of the tangent position;

[0029] 3. By configuring the top of the positioning block to protrude from the clamping surface of the clamping body, it is convenient to position the wire and make the bottom of the wire groove flush with the clamping surface to prevent the diamond wire clamped in the clamping body from bending and reducing the tensile strength.

[0030] 4. By coordinating various modules, the entire wire bonding process is automated, improving wire bonding efficiency. Attached Figure Description

[0031] Figure 1 This is a three-dimensional structural diagram of the diamond wire bonding equipment of the present invention. Figure 1 ;

[0032] Figure 2 This is a three-dimensional structural diagram of the diamond wire bonding equipment of the present invention. Figure 2 ;

[0033] Figure 3 This is a three-dimensional structural schematic diagram of the centering component of the present invention;

[0034] Figure 4 This is a three-dimensional structural schematic diagram of the clamping component of the present invention;

[0035] Figure 5 yes Figure 4 A schematic diagram of the 3D structure after concealing some parts of the structure;

[0036] Figure 6 This is a three-dimensional structural schematic diagram of the tangent component of the present invention;

[0037] Figure 7 This is a three-dimensional structural diagram of the cutter and blade holder of the present invention;

[0038] Figure 8 This is a three-dimensional structural diagram of the diamond wire bonding equipment of the present invention during wire cutting;

[0039] Figure 9 yes Figure 8 A schematic diagram of the 3D structure after concealing some parts of the structure;

[0040] Figure 10 This is a schematic diagram of the image captured by the detection component of the present invention after the tangent line is captured;

[0041] Figure 11 This is a schematic flowchart of the wire bonding method of the present invention;

[0042] In the figure, 100 is the substrate; 200 is the clamping assembly; 210 is the clamping body; 211 is the clamping surface; 220 is the clamping drive mechanism; 230 is the clamping groove; 240 is the positioning block; 241 is the wire groove; 300 is the tangent assembly; 310 is the cutting area; 320 is the blade holder; 330 is the cutter; 331 is the first actuating part; 332 is the second actuating part; 340 is the blade moving mechanism; 400 is the detection assembly; 410 is the first imaging unit; 420 is the second imaging unit; 500 is the centering assembly; 510 is the first drive mechanism; 520 is the second drive mechanism; 530 is the third drive mechanism; 600 is the mating structure; 610 is the first mating part; 620 is the second mating part. Detailed Implementation

[0043] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0044] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0047] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0049] Please refer to the attached diagram in the instruction manual. Figure 1 and Figure 2The diamond wire bonding equipment of this application specifically includes a substrate 100, a clamping assembly 200, a detection assembly 400, and a centering assembly 500. The clamping assemblies 200 are disposed above the substrate 100 and there are at least two sets for clamping diamond wire. Each set of clamping assemblies 200 includes at least two clamping bodies 210 and at least one clamping drive mechanism 220, which drives the clamping bodies 210 to move closer or further apart. The cutting assembly 300 has a cutting area 310, which is disposed between at least two sets of clamping assemblies 200 to cut the diamond wire clamped by the clamping assemblies 200. The detection assembly 400 is disposed outside the clamping assemblies 200 and is used to acquire the cross-sectional information of the diamond wire. The centering assembly 500 is disposed below the clamping assemblies 200 and can drive at least one set of clamping assemblies 200 to move and center with the other clamping assemblies 200 according to the cross-sectional information of the diamond wire.

[0050] Understandably, the substrate 100 is used to mount structures such as the clamping assembly 200 and the centering assembly 500. The clamping assembly 200 serves as a fixing structure before diamond wire bonding. The operator manually or a robotic arm automatically places the diamond wire onto one of the clamping bodies 210. Then, the clamping drive mechanism 220 drives one of the clamping bodies 210 to move closer to the other clamping body 210 in the same clamping assembly 200 until the two clamping bodies 210 abut against each other, thus clamping and fixing the diamond wire. After the clamping assembly 200 clamps and fixes the diamond wire, the wire cutting assembly 300 cuts the clamped and fixed diamond wire. It is important to ensure that the cut end face of the diamond wire is flat to facilitate subsequent butt welding. After the wire cutting assembly 300 completes the cutting, the detection assembly 400 detects the diamond wire to obtain the cut surface information, which includes at least the position and inclination of the cut surface. It is understood that the centering component 500 and the detection component 400 are electrically or communicatively connected, or information processing and exchange are achieved through a processor. After obtaining the cut surface information, the centering component 500 will perform the centering operation. It should be noted that after the diamond wire is cut, a portion will still extend beyond the clamping body 210, and this extended portion will shift in a certain direction due to the cutting action. Therefore, the centering component 500 has at least two degrees of freedom of movement, and in some embodiments, three degrees of freedom of movement, to facilitate adjustment of the position of the clamping component 200, i.e., adjusting the position of one of the diamond wires, thereby ensuring that the cut surfaces of the two diamond wires to be welded are aligned, improving the parallelism during welding, and resulting in a diamond wire with high tensile strength. In some embodiments, the cutting component 300 performs contact cutting, such as cutting with hard objects; in other embodiments, the cutting component 300 performs non-contact cutting, such as laser cutting.

[0051] Continue to refer to Figure 1 and Figure 2The detection component 400 includes a first imaging unit 410 and a second imaging unit 420. The first imaging unit 410 captures images of the diamond wire in a first direction, and the second imaging unit 420 captures images of the diamond wire in a second direction. The first direction is substantially perpendicular to the clamping surface 211 of the clamping body 210, and the second direction is substantially parallel to the clamping surface 211 of the clamping body 210. It is understood that the first imaging unit 410 and the second imaging unit 420 capture images of the diamond wire at different positions, and the position and inclination information of the cross-section can be analyzed from the acquired images. Both the first and second directions point radially towards the diamond wire, and the images captured by the first imaging unit 410 and the second imaging unit 420 are images along the length of the diamond wire. The precision of both the first imaging unit 410 and the second imaging unit 420 is at the micrometer level.

[0052] See Figure 3 The centering component 500 includes: a first driving mechanism 510, disposed on the substrate 100, with its operating direction parallel to the substrate 100; a second driving mechanism 520, disposed on the first driving mechanism 510, with its operating direction parallel to the substrate 100 and perpendicular to the operating direction of the first driving mechanism 510; and a third driving mechanism 530, disposed on the second driving mechanism 520, with its operating direction perpendicular to the substrate 100; wherein at least one set of clamping components 200 is disposed on the third driving mechanism 530. It is understood that the first driving mechanism 510, the second driving mechanism 520, and the third driving mechanism 530 are all linear driving mechanisms, preferably pneumatic or electric cylinders.

[0053] See Figure 4 and Figure 5 In the diamond wire bonding equipment of this application, each clamping assembly 200 has at least two wire slots 241, which are independently arranged and extend towards the adjacent clamping assembly 200. It is understood that the significance of providing two wire slots 241 in each clamping assembly 200 is that a single wire slot 241 can hold one diamond wire, each clamping assembly 200 can hold two diamond wires, and the two clamping assemblies 200 can simultaneously clamp two parts of two diamond wires.

[0054] Continue to refer to Figure 5In some embodiments, a clamping groove 230 is provided between the clamping bodies 210 of each clamping assembly 200, a positioning block 240 is provided in the clamping groove 230, a wire groove 241 is provided on the positioning block 240, the positioning block 240 protrudes from the clamping groove 230, and the width of the wire groove 241 gradually shrinks or expands in the clamping direction of the clamping body 210, and the bottom of the wire groove 241 is basically flush with the clamping surface 211 of the clamping body 210.

[0055] Understandably, the wire groove 241 primarily serves to position the diamond wire radially, preventing it from shifting radially when held by the clamping body 210. The wire groove 241 is preferably configured in a V-shape, which guides the diamond wire, making placement and positioning easier. Multiple parallel wire grooves 241 can be provided on each positioning block 240, the number of which is determined by the number of wires to be bonded. In some embodiments, the wire groove 241 can also be adapted to be U-shaped, Y-shaped, etc. By configuring the top of the positioning block 240 to protrude from the clamping surface 211 of the clamping body 210, wire placement and positioning are facilitated, and the bottom of the wire groove 241 is flush with the clamping surface 211 to prevent the portion of the diamond wire clamped within the clamping body 210 from bending. In addition, by providing a clamping groove 230 in the clamping body 210, the positioning block 240 is embedded in the clamping groove 230, which facilitates the separate and independent processing of the uneven positioning block 240 and the clamping body 210, ensuring processing accuracy and avoiding affecting the shape of the diamond wire in the clamping state.

[0056] See Figure 6 The tangent assembly 300 includes a tool holder 320, a cutter 330, and a tool moving mechanism 340. The cutter 330 is hinged to the tool holder 320, forming a cutting zone 310 between them. The tool moving mechanism 340 acts on the tool holder 320 to move it closer to or further away from the clamping assembly 200. It is understood that the tool holder 320 supports the cutter 330 and provides a stable cutting platform. Hinging the cutter 330 to the tool holder 320 ensures a stable cutting path for the cutter 330, and the cutting zone 310 formed between the tool holder 320 and the cutter 330 is essentially controllable. The tool shifting mechanism 340 is used to drive the tool holder 320 to move, thereby ensuring that the cutting area 310 between the cutter 330 and the tool holder 320 is located between the two clamping components 200 during the wire cutting stage. After the wire cutting is completed, the two clamping components 200 need to move closer to each other to drive the two diamond wires to connect for wire bonding. The tool shifting mechanism 340 can drive the tool holder 320 and the cutter 330 to move and make room to provide space for wire bonding.

[0057] Reference Figure 7The cutter 330 has a first working portion 331 and a second working portion 332 on its two sides, respectively. The first working portion 331 and the second working portion 332 can simultaneously grind against their respective adjacent clamping bodies 210 to cut diamond wire. It is understood that by providing the first working portion 331 and the second working portion 332 on the two sides of the cutter 330, the cutter 330 can simultaneously cut at least two end faces in one rotation, and the length of the cut diamond wire segment is substantially equal to the distance between the first working portion 331 and the second working portion 332. In some embodiments, the first working portion 331 and the second working portion 332 are integrally connected; in other embodiments, there is a gap between the first working portion 331 and the second working portion 332.

[0058] See Figure 8 and Figure 9 A mating structure 600 is provided between the tool holder 320 and the clamping body 210. The mating structure 600 includes a first mating part 610 and a second mating part 620. The first mating part 610 is disposed on the clamping body 210, and the second mating part 620 is disposed on the tool holder 320. The tool holder 320 is movable so that the second mating part 620 engages with the first mating part 610. It can be understood that by providing the mating structure 600 between the tool holder 320 and the clamping body 210, the tool holder 320 can be engaged with the clamping body 210 when it moves to a certain position. Specifically, the shapes of the first mating part 610 and the second mating part 620 are matched, and their connection relationship can be coupling, meshing, or fitting. In some embodiments, the first mating part 610 and the second mating part 620 are provided with guiding arc surfaces or planes. When the first mating part 610 and the second mating part 620 are engaged and abutted, the distance between adjacent clamping bodies 210 of adjacent clamping assemblies 200 can be kept stable and controllable, thereby improving the positioning accuracy of the tangent position.

[0059] See Figure 11 The diamond wire bonding method of the present invention specifically includes the following steps: clamping component 200 clamps and fixes at least two diamond wires; cutting component 300 cuts the clamped and fixed diamond wires; detection component 400 detects and obtains the cross-sectional information of the cut diamond wires; centering component 500 adjusts the position of clamping component 200 so that the cross-sections of at least two diamond wires are aligned; and the diamond wires with the cross-sections aligned are bonded together.

[0060] It is important to note that the diamond wire welding method of this invention differs significantly from existing diamond wire welding methods in its process. Existing methods employ a method of cutting first, then clamping and centering. The extension length of the diamond wire placed in the clamp is difficult to control stably by the operator's visual judgment. If the extension length is too large, it is easily bent by the force of the energized forging section; if the extension length is too short, it increases the welding difficulty. In contrast, this invention uses a process of clamping first, then cutting and centering. The cutting component 300 maintains a standard set gap with the clamping component 200 beforehand, ensuring that the length of the diamond wire extending from the clamping component 200 after cutting is within 0.3mm. When the cut surfaces of the two diamond wires touch and are welded, they will not bend due to the energized forging force, effectively improving the welding success rate and the strength of the welded product.

[0061] In the diamond wire bonding method of the present invention, in the step of clamping and fixing at least two diamond wires by the clamping assembly 200, the at least two diamond wires are arranged parallel to each other, and both ends of the at least two diamond wires are clamped by two sets of clamping assemblies 200. It can be understood that in some embodiments, the number of diamond wires is two, the two diamond wires are placed parallel and clamped, and each diamond wire passes through two clamping assemblies 200 in the length direction. This ensures that when the wire cutting assembly 300 cuts, it can cut two diamond wires at the same time. Furthermore, since the clamping and fixing force provided by the two clamping assemblies 200 is more stable, it is easier to cut the wires. Compared with clamping by a single clamping mechanism, it is less likely to cause a situation similar to tangled threads.

[0062] Beneficial effects: This invention employs a process of clamping before cutting and centering. The cutting component 300 maintains a standard set gap with the clamping component 200 beforehand, ensuring that the length of the diamond wire extending out of the clamping component 200 after cutting is within 0.3mm. When the cut surfaces of the two diamond wires are welded together, they will not bend due to the influence of the current forging force, thus effectively improving the welding success rate and the strength of the finished product. By setting a first mating part 610 and a second mating part 620 that can cooperate and abut, the distance between adjacent clamping bodies 210 of adjacent clamping components 200 is kept stable and controllable, thereby improving the positioning accuracy of the cutting position. By configuring the top of the positioning block 240 to protrude from the clamping surface 211 of the clamping body 210, it is convenient for wire placement and positioning. The bottom of the wire groove 241 is flush with the clamping surface 211 to prevent the portion of the diamond wire clamped in the clamping body 210 from bending and reducing the tensile strength.

[0063] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A diamond wire bonding device, characterized in that, include: substrate(100); A clamping assembly (200), wherein at least two clamping assemblies (200) are disposed above the substrate (100) for clamping diamond wire, and each set of the clamping assembly (200) includes: Clamping body (210), wherein there are at least two clamping bodies (210); A clamping drive mechanism (220) drives the clamping bodies (210) to move closer to or further away from each other; A wire cutting assembly (300) has a cutting area (310) disposed between at least two sets of clamping assemblies (200) to cut diamond wire held by the clamping assemblies (200). The wire cutting assembly (300) includes a tool holder (320) and a cutter (330) hinged to the tool holder (320). The cutting area (310) is formed between the tool holder (320) and the cutter (330). The cutter (330) has a first working part (331) and a second working part (332) on two sides respectively. The first working part (331) and the second working part (332) can simultaneously interact with their respective adjacent clamping bodies. (210) Grinding to cut diamond wire; and a tool shifting mechanism (340) acting on the tool holder (320) to move the tool holder (320) closer to or away from the clamping assembly (200); a mating structure (600) is provided between the tool holder (320) and the clamping body (210), the mating structure (600) including: a first mating part (610) disposed on the clamping body (210); a second mating part (620) disposed on the tool holder (320); wherein the tool holder (320) is movable such that the second mating part (620) engages with the first mating part (610); A detection component (400), disposed outside the clamping component (200), is used to acquire cross-sectional information of the diamond wire; and A centering component (500) is disposed below the clamping component (200) and can drive at least one set of clamping components (200) to move and center with the other clamping components (200) according to the cross-sectional information of the diamond wire.

2. The diamond wire bonding equipment according to claim 1, characterized in that, Each clamping assembly (200) has at least two wire grooves (241), the at least two wire grooves (241) are arranged independently of each other, and the extending direction of the wire grooves (241) is toward the adjacent clamping assembly (200).

3. The diamond wire bonding equipment according to claim 2, characterized in that, Each clamping assembly (200) has a clamping groove (230) between the clamping bodies (210), a positioning block (240) is provided in the clamping groove (230), a wire groove (241) is provided on the positioning block (240), the positioning block (240) protrudes from the clamping groove (230), and the width of the wire groove (241) gradually shrinks or expands in the clamping direction of the clamping body (210), and the bottom of the wire groove (241) is basically flush with the clamping surface (211) of the clamping body (210).

4. The diamond wire bonding equipment according to claim 1, characterized in that, The detection component (400) includes: The first shooting unit (410) is aligned with the diamond wire in a first direction to take pictures; The second shooting unit (420) is aligned with the diamond wire in a second direction to take pictures; The first direction is substantially perpendicular to the clamping surface (211) of the clamping body (210), and the second direction is substantially parallel to the clamping surface (211) of the clamping body (210).

5. The diamond wire bonding equipment according to claim 1, characterized in that, The centering component (500) includes: A first driving mechanism (510) is disposed on the substrate (100), and the direction of action of the first driving mechanism (510) is parallel to the substrate (100). A second driving mechanism (520) is disposed on the first driving mechanism (510). The operating direction of the second driving mechanism (520) is parallel to the substrate (100) and perpendicular to the operating direction of the first driving mechanism (510). A third driving mechanism (530) is disposed on the second driving mechanism (520), and the working direction of the third driving mechanism (530) is perpendicular to the substrate (100); At least one set of the clamping components (200) is disposed on the third drive mechanism (530).

6. A method for bonding diamond wire, characterized in that, The application of the diamond wire bonding equipment as described in any one of claims 1-5 includes the following steps: The clamping assembly (200) clamps and fixes at least two diamond wires; The tangent assembly (300) cuts the diamond wire that is clamped and fixed in place; The detection component (400) detects and acquires the cross-sectional information of the cut diamond wire; The centering component (500) adjusts the position of the clamping component (200) to bring the tangential surfaces of at least two diamond wires into contact; Weld at least two diamond wires with their cut surfaces joined together.

7. The diamond wire bonding method according to claim 6, characterized in that, In the step of clamping and fixing at least two diamond wires by the clamping assembly (200), at least two diamond wires are arranged in parallel to each other, and both ends of at least two diamond wires are clamped by two sets of clamping assemblies (200).

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