Cushioning member and packaged article

Abstract

The present invention provides a cushion and a package, the cushion being a cushion of a multilayer structure, characterized by comprising: a first layer having a strength with respect to a first direction being stronger than a strength with respect to a second direction, the first direction being a direction in which the cushion extends, the second direction being a direction in which the cushion extends and being a direction opposite to the first direction; and a second layer having a strength with respect to the second direction being stronger than a strength with respect to the first direction.

Description

Technical Field

[0001] This invention relates to cushioning components and packaging materials. Background Technology

[0002] Buffering devices are known to cushion external forces applied to the contents of a package. For example, Patent Document 1 discloses a technology related to a buffering device formed by stacking multiple buffer sheets.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2010-274936

[0004] However, in the case where a buffer is composed of multiple buffer sheets with the same structure as in the prior art, the buffer may sometimes be distorted in a certain direction due to the application of external force to the buffer. Summary of the Invention

[0005] To solve the above technical problems, the buffer of the present invention is a multi-layered buffer, characterized in that it includes: a first layer, the strength of which is stronger relative to a first direction than relative to a second direction, wherein the first direction is the direction in which the buffer extends and the second direction is the direction in which the buffer extends and is opposite to the first direction; and a second layer, the strength of which is stronger relative to the second direction than relative to the first direction.

[0006] Furthermore, the packaging product of the present invention is characterized by having a packaging box composed of a multi-layered cushioning member; and contents packaged in the packaging box, the multi-layered structure comprising: a first layer having a strength relative to a first direction greater than its strength relative to a second direction, the first direction being the direction in which the cushioning member extends, and the second direction being the direction in which the cushioning member extends and is opposite to the first direction; and a second layer having a strength relative to the second direction greater than its strength relative to the first direction.

[0007] Furthermore, the packaging product of the present invention is characterized by comprising: a packaging box; contents packaged in the packaging box; and a cushioning member housed in the packaging box and supporting the contents inside the packaging box. The cushioning member is a multi-layer structure comprising a first layer and a second layer, wherein the strength of the first layer relative to a first direction is greater than its strength relative to a second direction, the first direction being the direction in which the cushioning member extends, and the second direction being the direction in which the cushioning member extends and being opposite to the first direction, and the strength of the second layer relative to the second direction being greater than its strength relative to the first direction. Attached Figure Description

[0008] Figure 1 This is an exploded perspective view showing an example of the structure of the packaging 1 according to the first embodiment of the present invention.

[0009] Figure 2 This is a cross-sectional view showing an example of the structure of the buffer K.

[0010] Figure 3 This is a cross-sectional view showing an example of the structure of the buffer sheet QA.

[0011] Figure 4 This is a cross-sectional view showing an example of the structure of the buffer QB.

[0012] Figure 5 This is a cross-sectional view showing an example of the structure of the buffer KT involved in the scale.

[0013] Figure 6 This is a cross-sectional view showing an example of the structure of the buffer QT.

[0014] Figure 7 This is an explanatory diagram used to illustrate the deformation of the buffer component KT.

[0015] Figure 8 This is an explanatory diagram used to illustrate the deformation of the buffer component K.

[0016] Figure 9 This is a cross-sectional view showing an example of the structure of the buffer KC.

[0017] Figure 10 This is a cross-sectional view showing an example of the structure of a buffer QC.

[0018] Figure 11 This is a cross-sectional view showing an example of the structure of the buffer QD.

[0019] Figure 12 This is an exploded perspective view showing an example of the configuration of the buffer KE according to the second embodiment of the present invention.

[0020] Figure 13 This is a cross-sectional view showing an example of the structure of the buffer QE.

[0021] Figure 14 This is an explanatory diagram used to illustrate the deformation of the buffer component KE.

[0022] Figure 15 This is a cross-sectional view showing an example of the structure of the buffer KE.

[0023] Figure 16 This is a cross-sectional view showing an example of the structure of the buffer QET.

[0024] Figure 17 This is an exploded perspective view showing an example of the configuration of the buffer KF according to the third embodiment of the present invention.

[0025] Figure 18This is a cross-sectional view showing an example of the structure of a buffer QFS.

[0026] Figure 19 This is a cross-sectional view showing an example of the structure of the QFM buffer.

[0027] Figure 20 This is a cross-sectional view showing an example of the structure of the buffer QFH.

[0028] Figure 21 This is a cross-sectional view showing an example of the structure of the buffer KF.

[0029] Figure 22 This is an exploded perspective view showing an example of the composition of package 1F.

[0030] Explanation of reference numerals in the attached figures

[0031] 1…Packaging, 2…Packaging box, 100…Electronic equipment, K…Cushion, LA1…Rinse, LA2…Rinse, Q…Cushion, RA…Core, S…Support. Detailed Implementation

[0032] Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In these drawings, the dimensions and scales of the various parts are appropriately made different from the actual dimensions and scales. Furthermore, the embodiments described below are preferred examples of the present invention, and therefore various technically preferred limitations are imposed; however, unless otherwise specifically stated in the following description to limit the present invention, the scope of the present invention is not limited to these embodiments.

[0033] A. First Implementation Method

[0034] The following describes the packaging 1 that houses the electronic device 100.

[0035] A.1. Overall Overview of the Packaging

[0036] Figure 1 This is an exploded perspective view showing the composition of package 1.

[0037] like Figure 1 As shown, the packaging 1 houses the electronic device 100. Specifically, the packaging 1 includes a case 2 capable of housing the electronic device 100 and multiple support members S for supporting the electronic device 100 housed in the case 2.

[0038] Here, electronic device 100, such as a printing apparatus, television, refrigerator, washing machine, microwave oven, or personal computer, which can be stored in packaging box 2, is an example of "contents". Furthermore, in this embodiment, electronic device 100 is described as "contents", but the present invention is not limited to this method. "Contents" can be any item that can be stored in packaging box 2. "Contents" can be, for example, ceramic items such as tableware or decorative items, or wooden products such as furniture.

[0039] In addition, the contents of package 1 and electronic device 100 contained in package 1 are sometimes referred to as "packaged goods" in the following context.

[0040] like Figure 1 As shown, in this embodiment, it is assumed that the packaging 1 has four support members S-1 to S-4. In this embodiment, the electronic device 100 and the four support members S-1 to S-4 are inserted into the interior of the packaging box 2 through the opening 20, and then the opening 20 is closed by the top cover 200 connected to the side 21 of the packaging box 2, thereby being stored in the packaging box 2.

[0041] For ease of explanation, a packaging box coordinate system ΣW, fixed to the packaging box 2, is introduced below. The packaging box coordinate system ΣW is an orthogonal coordinate system with three axes: a ZW axis extending along the ZW1 direction, an XW axis extending along the XW1 direction (orthogonal to the ZW1 direction), and a YW axis extending along the YW1 direction (orthogonal to both the ZW1 and XW1 directions). The ZW1 direction is from the bottom surface of the packaging box 2 towards the opening 20. Furthermore, in this embodiment, the XW, YW, and ZW axes are shown as being orthogonal to each other, but the present invention is not limited to this arrangement. The XW, YW, and ZW axes may simply intersect each other. Additionally, the direction opposite to the XW1 direction will be referred to as the XW2 direction, the direction opposite to the YW1 direction as the YW2 direction, and the direction opposite to the ZW1 direction as the ZW2 direction.

[0042] like Figure 1 As shown, support member S-1 is a support member S that holds the lower end of the electronic device 100 in the ZW2 direction and the XW2 direction of the electronic device 100 when the electronic device 100 and the four support members S-1 to S-4 are stored in the packaging box 2. Figure 1 As shown, support member S-2 is a support member S that holds the lower end of the electronic device 100 in the ZW2 direction and the XW1 direction of the electronic device 100 when the electronic device 100 and the four support members S-1 to S-4 are stored in the packaging box 2. Figure 1As shown, support member S-3 is a support member S that holds the lower end of the electronic device 100 in the ZW1 direction and the XW2 direction of the electronic device 100 when the electronic device 100 and the four support members S-1 to S-4 are stored in the packaging box 2. Figure 1 As shown, support member S-4 is a support member S that holds the lower end of electronic device 100 in the ZW1 direction and the XW1 direction of electronic device 100 when electronic device 100 and four support members S-1 to S-4 are stored in packaging box 2.

[0043] like Figure 1 As shown, the support member S has multiple buffers K for cushioning external forces applied to the electronic device 100 housed in the packaging box 2. Specifically, in this embodiment, as an example, it is assumed that the support member S has four buffers K-1 to K-4. Furthermore, in this embodiment, it is assumed that the four buffers K-1 to K-4 provided on the support member S are each made of corrugated cardboard.

[0044] For ease of explanation, the following describes a buffer coordinate system ΣK fixed to the buffer K. The buffer coordinate system ΣK is an orthogonal coordinate system with mutually orthogonal X-axis, Y-axis, and Z-axis. Here, the Z-axis extends along the Z1 direction when the support S with the buffer K is housed together with the electronic device 100 in the packaging box 2. The Z1 direction is from the surface of the buffer K that contacts the packaging box 2 towards the surface that contacts the electronic device 100. The X-axis extends along the X1 direction, which is orthogonal to the Z1 direction and extends along the buffer K. The Y-axis extends along the Y1 direction, which is orthogonal to both the Z1 and X1 directions and extends along the buffer K.

[0045] For example, Figure 1 The diagram illustrates the buffer coordinate system ΣK-4, which represents the buffer component K-4 extending along the XW1 and YW1 directions among the buffer components K-1 to K-4 fixed to the support component S-1. For example... Figure 1 As shown, the buffer coordinate system ΣK-4 is fixed to the buffer K-4 with the X1 direction parallel to the YW1 direction, the Z1 direction parallel to the ZW1 direction, and the Y1 direction parallel to the XW2 direction.

[0046] Furthermore, in this embodiment, the X-axis, Y-axis, and Z-axis are shown to be orthogonal to each other, but the present invention is not limited to this arrangement. The X-axis, Y-axis, and Z-axis may simply intersect each other. Additionally, the direction opposite to the X1 direction will be referred to as the X2 direction, the direction opposite to the Y1 direction as the Y2 direction, and the direction opposite to the Z1 direction as the Z2 direction.

[0047] A.2. Overview of Buffering Components

[0048] The following is for reference Figures 2 to 4 The buffer K involved in this embodiment will be described.

[0049] Figure 2 This is a cross-sectional view of the buffer component K when it is cut by a plane with the Y1 direction as the normal direction.

[0050] like Figure 2 As shown, the buffer K has a configuration formed by stacking multiple buffer sheets QA and multiple buffer sheets QB. Here, buffer sheet QA is a buffer sheet Q whose strength relative to the X2 direction is stronger than its strength relative to the X1 direction when an external force is applied to an object such as the electronic device 100 located in the Z1 direction as viewed from buffer sheet QA. Similarly, buffer sheet QB is a buffer sheet Q whose strength relative to the X1 direction is stronger than its strength relative to the X2 direction when an external force is applied to an object such as the electronic device 100 located in the Z1 direction as viewed from buffer sheet QB.

[0051] like Figure 2 As shown, in this embodiment, it is assumed, as an example, that the buffer K has a configuration in which multiple buffer sheets QA and multiple buffer sheets QB are alternately stacked. However, the present invention is not limited to this configuration. For example, a buffer sheet Q, such as the buffer sheet QT described later, which is different from buffer sheets QA and QB, may be stacked between one buffer sheet QA among multiple buffer sheets QA and one buffer sheet QB closest to one buffer sheet QA among multiple buffer sheets QB.

[0052] Furthermore, in this embodiment, it is assumed, as an example, that the number of buffer sheets QA included in the buffer K is equal to the number of buffer sheets QB included in the buffer K. However, the present invention is not limited to this arrangement. For example, the buffer K may also have a configuration in which one or more buffer sheets QA are stacked together with one or more buffer sheets QB. Additionally, for example, the buffer K may be composed of one or more buffer sheets QA and a plurality of buffer sheets QB with a number greater than the number of buffer sheets QA, or it may be composed of a plurality of buffer sheets QA and a plurality of buffer sheets QB with a number less than the number of buffer sheets QA.

[0053] Figure 3 This is a cross-sectional view of buffer sheet QA when it is cut with a plane whose normal direction is Y1.

[0054] like Figure 3 As shown, the buffer sheet QA has a liner LA1, a liner LA2, and a core RA.

[0055] Liner LA1 is a flat component made of paper. Liner LA2 is a flat component made of paper and is disposed in the Z1 direction of liner LA1.

[0056] The core RA is a wave-shaped component formed from paper, supporting the liners LA1 and LA2 between them. Specifically, the core RA has multiple wave sections NA arranged periodically.

[0057] The waveform section NA includes a support body MA1 and a support body MA2. Support body MA1 is fixed to the liner LA1 at a connecting part PA1, and fixed to the liner LA2 at a connecting part PA2 located further in the X1 direction than the connecting part PA1, thereby supporting the liner LA1 and LA2. Support body MA2 is fixed to the liner LH1 at a connecting part PA2, and fixed to the liner LH2 at a connecting part PA3 located further in the X1 direction than the connecting part PA2, thereby supporting the liner LH1 and liner LH2.

[0058] In this embodiment, the waveform portion NA is formed such that the length of the support MA1 is different from the length of the support MA2.

[0059] Specifically, in this embodiment, as an example, it is assumed that the waveform portion NA is formed such that the length of the support MA1 is shorter than the length of the support MA2. That is, in this embodiment, as an example, it is assumed that the waveform portion NA is formed such that the front end portion of the waveform portion NA is biased towards the X2 direction.

[0060] Furthermore, in this embodiment, as an example, it is assumed that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction as seen from the buffer plate QA, the strength of the waveform portion NA relative to the external force in the X2 direction is stronger than the strength of the waveform portion NA relative to the external force in the X1 direction. Therefore, in this embodiment, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction as seen from the buffer plate QA, the waveform portion NA is more likely to tilt in the X1 direction compared to the X2 direction.

[0061] Furthermore, in this embodiment, it is assumed that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QA, the strength of the buffer plate QA relative to the X2 direction is stronger than the strength of the buffer plate QA relative to the X1 direction. However, the present invention is not limited to this configuration. The buffer plate QA may also be configured such that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QA, the strength of the buffer plate QA relative to the X1 direction is stronger than the strength of the buffer plate QA relative to the X2 direction. In other words, the buffer plate QA only needs to be configured such that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QA, the strength of the buffer plate QA relative to the X1 direction is different from the strength of the buffer plate QA relative to the X2 direction. In other words, as long as the object such as the electronic device 100 located in the Z1 direction from the buffer plate QA is subjected to an external force, the probability that the waveform section NA will tilt in one of the X1 and X2 directions is higher than the probability that the waveform section NA will tilt in the other direction, the buffer plate QA can be formed in a way that controls the tilting direction of the waveform section NA.

[0062] Figure 4 This is a cross-sectional view of buffer sheet QB when it is cut by a plane with the Y1 direction as the normal direction.

[0063] like Figure 4 As shown, the buffer sheet QB has a liner LB1, a liner LB2, and a core RB.

[0064] Liner LB1 is a flat component made of paper. Liner LB2 is a flat component made of paper and is disposed in the Z1 direction of liner LB1.

[0065] The core RB is a wave-shaped component formed of paper, supporting the liner plates LB1 and LB2 between them. Specifically, the core RB has multiple wave sections NB arranged periodically.

[0066] The waveform section NB includes a support body MB1 and a support body MB2. Support body MB1 is fixed to the liner LB1 at a connecting point PB1, and fixed to the liner LB2 at a connecting point PB2 located further in the X1 direction than the connecting point PB1, thereby supporting the liner LB1 and liner LB2. Support body MB2 is fixed to the liner LB2 at a connecting point PB2, and fixed to the liner LB1 at a connecting point PB3 located further in the X1 direction than the connecting point PB2, thereby supporting the liner LB1 and liner LB2.

[0067] In this embodiment, the waveform portion NB is formed such that the length of the support MB1 is different from the length of the support MB2.

[0068] Specifically, in this embodiment, as an example, it is assumed that the waveform portion NB is formed such that the length of the support MB1 is longer than the length of the support MB2. That is, in this embodiment, as an example, it is assumed that the waveform portion NA is formed such that the front end portion of the waveform portion NB is biased towards the X1 direction.

[0069] Furthermore, in this embodiment, as an example, it is assumed that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction as viewed from the buffer plate QB, the strength of the waveform portion NB relative to the external force in the X1 direction is stronger than the strength of the waveform portion NB relative to the external force in the X2 direction. Therefore, in this embodiment, as an example, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction as viewed from the buffer plate QB, the waveform portion NB is more likely to tilt in the X2 direction compared to the X1 direction.

[0070] Furthermore, in this embodiment, it is assumed that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QB, the strength of the buffer plate QB relative to the X1 direction is stronger than the strength of the buffer plate QB relative to the X2 direction. However, the present invention is not limited to this configuration. The buffer plate QB may also be configured such that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QB, the strength of the buffer plate QB relative to the X2 direction is stronger than the strength of the buffer plate QB relative to the X1 direction. In other words, the buffer plate QB only needs to be configured such that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QB, the strength of the buffer plate QB relative to the X1 direction is different from the strength of the buffer plate QB relative to the X2 direction. In other words, the buffer sheet QB can be formed in such a way that, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer sheet QB, the probability that the waveform portion NB tilts in one of the X1 or X2 directions is higher than the probability that the waveform portion NB tilts in the other direction, and the tilting direction of the waveform portion NB can be controlled. Specifically, the tilting direction of the waveform portion NB can be controlled in such a way that, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer sheet QB, the waveform portion NB tilts in the opposite direction to the waveform portion NA. For example, the buffer sheet QB can also be formed by flipping a sheet with the same structure as the buffer sheet QA in the X-axis direction. Furthermore, the buffer member K can, for example, be stacked in an order in which the buffer sheets QA and QB are interchanged.

[0071] A.3. Summary of the buffer components involved in the comparison.

[0072] The following is for reference Figures 5 to 7 The buffer component KT involved in the comparative example is explained.

[0073] Figure 5This is a cross-sectional view of the buffer component KT when it is cut with a plane whose normal direction is Y1.

[0074] like Figure 5 As shown, the buffer KT has a configuration in which multiple buffer sheets QT are stacked. Here, the buffer sheet QT is a buffer sheet Q whose strength relative to the X1 direction is approximately the same as its strength relative to the X2 direction when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer sheet QT.

[0075] Here, "approximately the same" is a concept that includes not only cases where they are completely identical, but also cases where errors can be considered identical. In this embodiment, "approximately the same" means a concept that includes, for example, cases where errors of about 1% can be considered identical.

[0076] Figure 6 This is a cross-sectional view of the buffer sheet QT when it is cut with a plane whose normal direction is Y1.

[0077] like Figure 6 As shown, the buffer sheet QT has a liner LT1, a liner LT2, and a core RT.

[0078] Liner LT1 is a flat component formed of paper. Liner LT2 is a flat component formed of paper and is disposed in the Z1 direction of liner LT1.

[0079] The core RT is a wave-shaped component formed from paper, supporting the liner LT1 and liner LT2 between the liner LT1 and liner LT2. Specifically, the core RT has multiple wave sections NT arranged periodically.

[0080] The waveform section NT includes a support body MT1 and a support body MT2. Support body MT1 is fixed to the liner LT1 at a connecting part PT1, and fixed to the liner LT2 at a connecting part PT2 located further in the X1 direction than the connecting part PT1, thereby supporting the liner LT1 and the liner LT2. Support body MT2 is fixed to the liner LT2 at a connecting part PT2, and fixed to the liner LT1 at a connecting part PT3 located further in the X1 direction than the connecting part PT2, thereby supporting the liner LT1 and the liner LT2.

[0081] The waveform section NT is formed such that the length of the support MT1 is approximately the same as the length of the support MT2. That is, in the comparative example, it is assumed that the waveform section NT is formed in a roughly symmetrical shape such that the front end of the waveform section NT is not biased towards the X1 or X2 directions. In other words, in the comparative example, it is assumed that when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QT, the strength of the waveform section NT relative to the external force in the X1 direction is approximately the same as the strength of the waveform section NT relative to the external force in the X2 direction. Therefore, in the comparative example, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QT, the probability of the waveform section NT tilting towards the X1 or X2 direction is fixed. In other words, in the comparative example, when an object such as the electronic device 100 located in the Z1 direction from the buffer QT is subjected to an external force, the possibility of the waveform part NT tilting in one of the X1 and X2 directions is roughly the same as the possibility of the waveform part NT tilting in the other direction, making it difficult to control the tilting direction of the waveform part NT.

[0082] Figure 7 This is an explanatory diagram illustrating the deformation of the buffer KT when an object such as an electronic device 100 located in the Z1 direction, viewed from the buffer KT, applies an external force to the buffer KT. Furthermore, in Figure 7 In the diagram, time t1 is the time before the external force is applied to the buffer KT, and time t2 is the time after the external force is applied to the buffer KT, causing the buffer KT to become flattened.

[0083] When an object such as an electronic device 100 located in the Z1 direction, viewed from the buffer KT, applies an external force to the buffer KT, causing the buffer KT to become flattened, the multiple buffer pieces QT constituting the buffer KT will tilt in one of the X1 or X2 directions with a fixed probability. Furthermore, when one of the buffer pieces QT constituting the buffer KT tilts in one of the X1 or X2 directions, the other buffer pieces QT constituting the buffer KT may also tilt in one of the X1 or X2 directions. That is, in the comparative example, there is a possibility that the multiple buffer pieces QT constituting the buffer KT will tilt in one of the X1 or X2 directions. For example, as... Figure 7 As shown in the comparative example, there is a possibility that the multiple buffer pieces QT constituting the buffer KT may tilt in the X1 direction. In this case, the buffer KT, which is flattened as a result of the applied external force, becomes a distorted shape in the X1 direction, and compared with the buffer KT before the external force was applied, the width in the X1 direction increases by the amount dXKT.

[0084] Figure 8This is an explanatory diagram illustrating the deformation of the buffer member K when an object such as an electronic device 100 located in the Z1 direction, viewed from the buffer member K according to this embodiment, applies an external force to the buffer member K. Furthermore, in Figure 8 In the diagram, time t1 is the time before the external force is applied to the buffer K, and time t2 is the time after the external force is applied to the buffer K, causing the buffer K to become flattened.

[0085] like Figure 8 As shown, in this embodiment, when an object such as an electronic device 100 located in the Z1 direction, viewed from the buffer member K, applies an external force to the buffer member K, the buffer piece QA tilts in the X1 direction, and the buffer piece QB tilts in the X2 direction. Therefore, the buffer member K, which becomes flattened as a result of the applied external force, becomes a stacked state of multiple buffer pieces QA tilting in the X1 direction and multiple buffer pieces QB tilting in the X2 direction. In this case, compared to the buffer member K before the external force was applied, the width of the flattened buffer member K in the X1 direction increases by a change dXK. Here, the change dXK is determined by one or both of the change in width of the buffer piece QA in the X1 direction caused by the tilting of the buffer piece QA in the X1 direction and the change in width of the buffer piece QB in the X1 direction caused by the tilting of the buffer piece QB in the X2 direction. For example, the change dXK can be made approximately the same as the larger of the change in width of buffer QA in the X1 direction caused by QA tilting towards X1 and the change in width of buffer QB in the X1 direction caused by QB tilting towards X2.

[0086] according to Figure 7 and Figure 8 It is also clearly known that the change in width dXK is less than the change in width dXKT. That is, the change in width dXK of the buffer component K in the X1 direction after being flattened, based on the width of the buffer component K before flattening in the X1 direction, is less than the change in width dXKT of the buffer component KT in the X1 direction after being flattened by external force, based on the width of the buffer component KT before flattening in the X1 direction. In other words, the extent to which the width of the buffer component KT expands in the X1 direction due to flattening is greater than the extent to which the width of the buffer component K expands in the X1 direction due to flattening.

[0087] Furthermore, in cases where the width of the cushioning element KT expands significantly in the X1 direction due to flattening, as in the comparative example, the portion of the cushioning element KT that expands in the X1 direction due to flattening may sometimes come into contact with the packaging box 2 containing the cushioning element KT, the electronic device 100 contained in the packaging box 2 along with the cushioning element KT, or other cushioning elements K that are different from the cushioning element KT among the multiple cushioning elements K contained in the packaging box 2. Therefore, in cases where the width of the cushioning element KT expands significantly in the X1 direction due to flattening, as in the comparative example, the packaging box 2 containing the cushioning element KT, the electronic device 100 contained in the packaging box 2 along with the cushioning element KT, or other cushioning elements K that are different from the cushioning element KT among the multiple cushioning elements K contained in the packaging box 2 may sometimes be damaged due to the influence of the portion of the cushioning element KT that expands in the X1 direction due to flattening.

[0088] In contrast, the buffer K according to this embodiment exhibits a smaller degree of width expansion in the X1 direction due to flattening compared to the buffer KT in the comparative example. Therefore, according to this embodiment, compared to the comparative example, the likelihood of damage to the packaging box 2 containing the buffer K, the electronic device 100 stored in the packaging box 2 along with the buffer K, or other buffers K different from the buffer K among the multiple buffers K stored in the packaging box 2 when the buffer K is flattened can be reduced. This becomes particularly significant if the buffer K comprises more layers.

[0089] A.4. Summary of the First Implementation Method

[0090] As described above, the buffer K involved in this embodiment is a multi-layered buffer K, characterized in that it includes a buffer sheet QA and a buffer sheet QB. The strength of the buffer sheet QA in the X2 direction relative to the buffer sheet Q is stronger than its strength in the X1 direction opposite to the X2 direction, and the strength of the buffer sheet QB in the X1 direction is stronger than its strength in the X2 direction.

[0091] Furthermore, in this embodiment, buffer QA is an example of a "first layer", buffer QB is an example of a "second layer", the X2 direction is an example of a "first direction", and the X1 direction is an example of a "second direction".

[0092] Thus, in this embodiment, the buffer member K includes a buffer sheet QA whose strength relative to the X2 direction is greater than its strength relative to the X1 direction, and a buffer sheet QB whose strength relative to the X1 direction is greater than its strength relative to the X2 direction. Therefore, according to this embodiment, it is possible to prevent the buffer member K from becoming significantly distorted in either the X1 or X2 direction when it is flattened by an external force. Consequently, according to this embodiment, it is possible to prevent damage to objects or other objects disposed around the buffer member K due to significant distortion of the buffer member K in either the X1 or X2 direction.

[0093] Furthermore, the buffer K involved in this embodiment is a buffer K formed by stacking multiple buffer sheets Q extending along the X1 direction along the Z1 direction, which intersects the X1 direction. Its characteristic may also be that the multiple buffer sheets Q include buffer sheet QA extending along the X1 direction and buffer sheet QB extending along the X1 direction. Buffer sheet QA includes a flat plate LA1 extending along the X1 direction, a flat plate LA2 located in the Z1 direction and extending along the X1 direction as viewed from the liner LA1, and a core RA supporting the liner LA1 and liner LA2 between the liner LA1 and the liner LA2. QB has a flat plate LB1 extending along the X1 direction, a flat plate LB2 located in the Z1 direction and extending along the X1 direction as viewed from the LB1, and a core RB supporting the LB1 and LB2 between the LB1 and LB2. The core RB is stronger in the X2 direction relative to the external force applied from the LB2 than in the X1 direction relative to the external force applied from the LB2, and the core RB is stronger in the X1 direction relative to the external force applied from the LB2 than in the X2 direction relative to the external force applied from the LB2.

[0094] Alternatively, the buffer K involved in this embodiment may also be characterized by including multiple buffer plates QA and multiple buffer plates QB, with buffer plates QA and buffer plates QB being arranged alternately in the buffer K.

[0095] Therefore, according to this embodiment, it is possible to prevent the buffer K from becoming significantly distorted in one of the X1 and X2 directions when it is flattened by an external force.

[0096] Additionally, the buffer member K in this embodiment may also be characterized in that the buffer sheet QA has a flat plate LA1 extending in the X1 direction, a flat plate LA2 extending in the X1 direction, and a core RA disposed between the plate LA1 and the plate LA2. The core RA has a support body MA1 and a support body MA2. The support body MA1 is connected to the plate LA1 at the connection part PA1 and to the plate LA2 at the connection part PA2 located further in the X1 direction than the connection part PA1. The support body MA2 is connected to the plate LA2 at the connection part PA2 and to the plate LA1 at the connection part PA3 located further in the X1 direction than the connection part PA2. The length of the support body MA1 is different from the length of the support body MA2.

[0097] Furthermore, in this embodiment, the liner LA1 is an example of a "first flat plate portion", the liner LA2 is an example of a "second flat plate portion", the core RA is an example of a "support portion", the support MA1 is an example of a "first support body", the support MA2 is an example of a "second support body", the connecting part PA1 is an example of a "first connecting part", the connecting part PA2 is an example of a "second connecting part", and the connecting part PA3 is an example of a "third connecting part".

[0098] Thus, according to this embodiment, the length of support MA1 is different from the length of support MA2. Therefore, according to this embodiment, the strength of buffer sheet QA relative to the X1 direction can be different from the strength of buffer sheet QA relative to the X2 direction. Consequently, according to this embodiment, when an external force is applied to buffer sheet QA, the tilting direction of the core RA can be controlled.

[0099] Additionally, the buffer member K in this embodiment may also be characterized in that the buffer sheet QA has a flat plate LA1 extending in the X1 direction, a flat plate LA2 extending in the X1 direction, and a core RA disposed between the plate LA1 and the plate LA2. The core RA alternately has a support body MA1 and a support body MA2. The support body MA1 connects the plate LA1 and the plate LA2, and the support body MA2 connects the plate LA1 and the plate LA2 and has a different length than the support body MA1.

[0100] Therefore, according to this embodiment, the strength of the buffer sheet QA relative to the X1 direction can be different from the strength of the buffer sheet QA relative to the X2 direction. Thus, according to this embodiment, when an external force is applied to the buffer sheet QA, the tilting direction of the core RA can be controlled.

[0101] In addition, the buffer K involved in this embodiment may also be characterized in that the number of buffer sheets QA included in the multilayer structure is equal to the number of buffer sheets QB.

[0102] Therefore, according to this embodiment, compared to a method where the number of buffer sheets QA and the number of buffer sheets QB included in the buffer K are different, the degree of expansion of the buffer K in the X1 direction when the buffer K is flattened can be suppressed to a smaller extent. Thus, according to this embodiment, damage to objects disposed around the buffer K can be prevented due to significant distortion of the buffer K in either the X1 or X2 direction.

[0103] A.5. Variations of the first embodiment

[0104] The various methods illustrated in the first embodiment can be modified in a wide variety of ways. Specific modifications are illustrated below. Two or more methods selected from the above embodiments and the following examples can be appropriately combined within a mutually compatible framework.

[0105] Variation A1

[0106] In the first embodiment described above, an example was given of controlling the tilting direction of the buffer sheet QA, which includes the supports MA1 and MA2, by making the lengths of the supports MA1 and MA2 different. However, the present invention is not limited to this method. The buffer sheet may also be formed of other structures. For example, the tilting direction of the buffer sheet Q may also be controlled by making the materials of the two supports of each of the plurality of wave portions included in the core constituting the buffer sheet Q different.

[0107] Figure 9 This is a cross-sectional view of the buffer KC involved in this modified example, taken by cutting with a plane whose normal direction is Y1. Furthermore, the buffer KC is used to replace... Figure 1 The buffer K in the middle forms the support S.

[0108] like Figure 9 As shown, the buffer KC has a configuration formed by stacking multiple buffer plates QC and multiple buffer plates QD. Here, buffer plate QC is a buffer plate Q whose strength relative to the X1 direction is stronger than its strength relative to the X2 direction when an external force is applied to an object such as the electronic device 100 located in the Z1 direction as viewed from buffer plate QC. Similarly, buffer plate QD is a buffer plate Q whose strength relative to the X2 direction is stronger than its strength relative to the X1 direction when an external force is applied to an object such as the electronic device 100 located in the Z1 direction as viewed from buffer plate QD.

[0109] like Figure 9 As shown, in this modified example, it is assumed that the buffer KC has a configuration in which multiple buffer sheets QC and multiple buffer sheets QD are alternately stacked. However, the present invention is not limited to this configuration. For example, a buffer sheet Q, such as a buffer sheet QT, which is different from the buffer sheets QC and QD, may be stacked between one of the buffer sheets QC and one of the buffer sheets QD closest to the buffer sheet QC.

[0110] Furthermore, in this modified example, it is assumed, as an example, that the number of buffer sheets QC included in the buffer member KC is equal to the number of buffer sheets QD included in the buffer member KC. However, the present invention is not limited to this arrangement. For example, the number of buffer sheets QC included in the buffer member KC and the number of buffer sheets QD included in the buffer member KC may be different.

[0111] Figure 10 This is a cross-sectional view of the buffer sheet QC when it is cut with a plane whose normal direction is Y1.

[0112] like Figure 10As shown, the buffer QC has a liner LC1, a liner LC2, and a core RC.

[0113] Liner LC1 is a flat sheet component formed from paper. Liner LC2 is a flat sheet component formed from paper and is disposed in the Z1 direction of liner LC1.

[0114] The core RC is a wave-shaped component formed from paper that is rolled in a manner with periodic variations in thickness, supporting the liner plates LC1 and LC2 between them. Furthermore, the core RC is not limited to thickness variations as long as the strength varies periodically; materials other than thickness, such as the concentration of additives, can also be varied. In this embodiment, the core RC, for example, has multiple wave sections NC arranged periodically.

[0115] The waveform section NC includes a support body MC1 and a support body MC2. Support body MC1 is fixed to the liner LC1 at the connecting part PC1, and fixed to the liner LC2 at the connecting part PC2, which is located further in the X1 direction than the connecting part PC1, thereby supporting the liner LC1 and LC2. Support body MC2 is fixed to the liner LC2 at the connecting part PC2, and fixed to the liner LC1 at the connecting part PC3, which is located further in the X1 direction than the connecting part PC2, thereby supporting the liner LC1 and LC2.

[0116] In this modified example, the wave section NC is formed such that the strength of the support MC1 differs from that of the support MC2. Specifically, in this modified example, it is assumed that the wave section NC is formed with the support MC2 being thicker than the support MC1. Therefore, in this modified example, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer QC, the strength of the wave section NC relative to the external force in the X1 direction is stronger than the strength of the wave section NC relative to the external force in the X2 direction. Therefore, in this modified example, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer QC, the wave section NC is more likely to tilt in the X2 direction compared to the X1 direction. That is, in this modified example, the buffer QC is configured such that when an external force is applied to an object such as an electronic device 100 located in the Z1 direction from the buffer QC, the waveform part NC is more likely to tilt in one of the X1 and X2 directions than in the other direction, thereby enabling control over the tilting direction of the waveform part NC.

[0117] Figure 11 This is a cross-sectional view of the buffer sheet QD when it is cut with a plane whose normal direction is Y1.

[0118] like Figure 11 As shown, the buffer sheet QD has a liner LD1, a liner LD2, and a core RD.

[0119] Liner LD1 is a flat component made of paper. Liner LD2 is a flat component made of paper and is disposed in the Z1 direction of liner LD1.

[0120] The core RD is a wave-shaped component formed from paper that is periodically varied in thickness, supporting the liner plates LD1 and LD2 between the liner plates LD1 and LD2. Furthermore, the core RD is not limited to thickness variation as long as the strength varies periodically; materials other than thickness, such as the concentration of additives, can also be varied. In this embodiment, the core RD, for example, has multiple wave sections ND arranged periodically.

[0121] The waveform section ND includes support bodies MD1 and MD2. Support body MD1 is fixed to the liner LD1 at the connection point PD1, and fixed to the liner LD2 at the connection point PD2, which is located further in the X1 direction than the connection point PD1, thereby supporting the liner LD1 and the liner LD2. Support body MD2 is fixed to the liner LD2 at the connection point PD2, and fixed to the liner LD1 at the connection point PD3, which is located further in the X1 direction than the connection point PD2, thereby supporting the liner LD1 and the liner LD2.

[0122] In this modified example, the waveform portion ND is formed such that the strength of the support MD1 is different from the strength of the support MD2. Specifically, in this modified example, it is assumed that the waveform portion ND is formed such that the thickness of the support MD1 is greater than the thickness of the support MD2. Therefore, in this modified example, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QD, the strength of the waveform portion ND relative to the external force in the X2 direction is stronger than the strength of the waveform portion ND relative to the external force in the X1 direction. Therefore, in this modified example, when an external force is applied to an object such as the electronic device 100 located in the Z1 direction from the buffer plate QD, the waveform portion ND is more likely to tilt in the X1 direction compared to the X2 direction. That is, in this modified example, the buffer QD is configured such that when an external force is applied to an object such as an electronic device 100 located in the Z1 direction from the buffer QD, the waveform part ND is more likely to tilt in one of the X1 and X2 directions than in the other direction, thereby enabling control over the tilting direction of the waveform part ND.

[0123] In this modified example, when an object such as electronic device 100 located in the Z1 direction from the buffer KC applies an external force to the buffer KC, the buffer plate QC tilts in the X2 direction, and the buffer plate QD tilts in the X1 direction. Therefore, according to this modified example, the change in width of the buffer KC in the X1 direction after being flattened by an external force, based on the width of the buffer KC before being flattened, can be less than the change in width of the buffer KT in the X1 direction after being flattened by an external force, dXKT, based on the width of the buffer KT in the X1 direction before being flattened. That is, compared with the buffer KT in the comparative example, the buffer KC involved in this modified example has a smaller degree of expansion of the width of the buffer KC in the X1 direction caused by flattening. Therefore, according to this modified example, compared with the comparative example, the possibility of damage to the packaging box 2 containing the cushioning component KC, the electronic device 100 stored in the packaging box 2 together with the cushioning component KC, or other cushioning components K different from the cushioning component KC among the multiple cushioning components K stored in the packaging box 2 when the cushioning component KC is flattened can be reduced. As long as the tilting direction of the cushioning sheet can be controlled in this way, other methods can also be used to form the cushioning sheet. For example, a cushioning sheet that begins to tilt in the X1 direction can also be formed by applying a force in the X1 direction to the liner LT1 of the cushioning sheet QT while simultaneously applying a force in the Z1 direction. In other words, the cushioning sheet of this modified example is formed by intentionally inducing a so-called "stepped flow".

[0124] Variation A2

[0125] In the first embodiment and its variations described above, the method in which the support member S formed by the cushioning member K or the cushioning member KC is housed in the packaging box 2 has been illustrated, but the present invention is not limited to this method. The packaging box 2 may also be constructed by including one or both of the cushioning member K and the cushioning member KC.

[0126] That is, the packaging product involved in this modified example is characterized by having a packaging box 2 composed of a multi-layered cushioning member K and an electronic device 100 packaged in the packaging box 2. The multi-layered structure constituting the packaging box 2 includes a cushioning sheet QA and a cushioning sheet QB. The strength of the cushioning sheet QA in the X2 direction relative to the cushioning member K is stronger than its strength in the X1 direction, and the strength of the cushioning sheet QB in the X1 direction is stronger than its strength in the X2 direction. The X1 direction is the opposite direction to the X2 direction.

[0127] Therefore, according to this modified example, it is possible to prevent the packaging box 2 from becoming significantly distorted in one of the X1 and X2 directions when it is flattened by an external force.

[0128] Variation A3

[0129] Furthermore, in the first embodiment and its variations described above, buffer sheets QA, whose strength in the X2 direction relative to the buffer member K is stronger than that in the X1 direction (opposite to the X2 direction), and buffer sheets QB, whose strength in the X1 direction is stronger than that in the X2 direction, are alternately stacked, but this is not a limitation. For example, buffer sheets QA may be stacked two layers consecutively, followed by two layers of buffer sheets QB consecutively. Additionally, the number of buffer sheets QA included in the buffer member K may differ from the number of buffer sheets QB. If the difference in number is small, the overall distortion of the buffer member K is also small; therefore, for example, a five-layer structure may be formed, stacked in the order of buffer sheets QA, QB, QA, QB, and QA. Similarly, a portion of the buffer member K may include buffer sheets QT of the existing type. Regardless of how the buffer sheets QT are tilted, the tilting direction of the buffer sheets QA and QB constituting other parts can be controlled, thereby preventing the overall shape from becoming significantly distorted.

[0130] B. Second Implementation Method

[0131] The following is for reference Figures 12 to 16 The buffer element according to the second embodiment will be described. Furthermore, for elements in the various embodiments illustrated below that have the same function or effect as those in the first embodiment, the reference numerals used in the description of the first embodiment will be retained, and detailed descriptions of each will be omitted as appropriate.

[0132] B.1. Overview of the buffer involved in the second embodiment

[0133] Figure 12 This is a cross-sectional view of the buffer member KE according to the second embodiment, when cut with a plane whose normal direction is Y1. Furthermore, the buffer member KE is used to replace... Figure 1 The buffer K in the middle forms the support S.

[0134] like Figure 12 As shown, the buffer KE has a configuration formed by stacking multiple buffer sheets QET. Here, the buffer sheet QET is composed of the buffer sheet QT and buffer sheet QE described in the comparative example above. Specifically, the buffer sheet QET includes: a buffer sheet QT disposed in region AT1 in the X1 direction; a buffer sheet QT disposed in region AT2 located further in the X1 direction than region AT1; and a buffer sheet QE disposed in region AE between region AT1 and region AT2, connecting the buffer sheet QT disposed in region AT1 and the buffer sheet QT disposed in region AT2. Furthermore, in this embodiment, the strength of the buffer sheet QE relative to the Z1 direction is weaker than the strength of the buffer sheet QT relative to the Z1 direction.

[0135] Figure 13This is a cross-sectional view of the buffer sheet QE when it is cut by a plane with the Y1 direction as the normal direction.

[0136] like Figure 13 As shown, the buffer sheet QE has a liner LE1, a liner LE2, and a core RE.

[0137] Liner LE1 is a flat component made of paper. Liner LE2 is a flat component made of paper and is disposed in the Z1 direction of liner LE1.

[0138] The core RE is a wave-shaped component formed from paper, supporting the liner LE1 and liner LE2 between the liner LE1 and liner LE2. Specifically, the core RE has multiple wave sections NE arranged periodically.

[0139] The waveform section NE includes a support body ME1 and a support body ME2. Support body ME1 is fixed to the liner LE1 at the connecting part PE1, and fixed to the liner LE2 at the connecting part PE2, which is located further in the X1 direction than the connecting part PE1, thereby supporting the liner LE1 and the liner LE2. Support body ME2 is fixed to the liner LE2 at the connecting part PE2, and fixed to the liner LE1 at the connecting part PE3, which is located further in the X1 direction than the connecting part PE2, thereby supporting the liner LE1 and the liner LE2.

[0140] Furthermore, in this embodiment, the waveform portion NE is formed such that the length of the support ME1 is approximately the same as the length of the support ME2. However, the waveform portion NE may also be formed such that the length of the support ME1 is different from the length of the support ME2.

[0141] Furthermore, in this embodiment, it is assumed that the strength of the paper forming the core RE of the buffer sheet QE is weaker than the strength of the paper forming the core RT of the buffer sheet QT. Specifically, in this embodiment, it is assumed that the thickness of the paper forming the core RE is thinner than the thickness of the paper forming the core RT. Therefore, in this embodiment, the strength of the buffer sheet QE is weaker than the strength of the buffer sheet QT.

[0142] Figure 14 This is an explanatory diagram illustrating the deformation of the buffer KI when an object such as an electronic device 100 located in the Z1 direction, viewed from the buffer KI, applies an external force to the buffer KI. Furthermore, in Figure 14 In the diagram, time t1 is the time before the external force is applied to the buffer KE, and time t2 is the time after the external force is applied to the buffer KE, resulting in the buffer KE being flattened.

[0143] When an object such as an electronic device 100 located in the Z1 direction, viewed from the buffer KE, applies an external force to the buffer KE, the weaker buffer QE among the multiple buffer pieces QET constituting the buffer KE is preferentially flattened than the stronger buffer QT. Therefore, the buffer QT disposed in region AT1 is flattened in a shape tilted in the X1 direction by being dragged by the buffer QE flattened by the external force, and the buffer QT disposed in region AT2 is flattened in a shape tilted in the X2 direction by being dragged by the buffer QE flattened by the external force.

[0144] Specifically, before the buffer member KE is flattened, the buffer piece QT disposed in region AT1 is flattened in region AT1t, which is expanded in the X1 direction by an amount d×KE compared to region AT1. Similarly, before the buffer member KE is flattened, the buffer piece QT disposed in region AT2 is flattened in region AT2t, which is expanded in the X2 direction by an amount d×KE compared to region AT2. However, the end of region AT1t in the X2 direction remains at approximately the same position as the end of region AT1 in the X2 direction, and the end of region AT2t in the X1 direction remains at approximately the same position as the end of region AT2 in the X1 direction. In other words, in this embodiment, the width of the buffer member KE in the X1 direction before being flattened by the external force is approximately the same as the width of the buffer member KE in the X1 direction after being flattened by the external force.

[0145] As described above, in this embodiment, the extent to which the width of the buffer KE expands in the X1 direction due to being flattened by an external force is smaller than the extent to which the width of the buffer KT expands in the X1 direction due to being flattened by an external force. Therefore, according to this embodiment, compared with the comparative example, the possibility of damage to the packaging box 2 containing the buffer KE, the electronic device 100 stored together with the buffer KE in the packaging box 2, or other buffers K different from the buffer KE among the multiple buffers K stored in the packaging box 2 when the buffer KE is flattened can be reduced.

[0146] B.2. Summary of the Second Implementation Method

[0147] As described above, the buffer sheet QET involved in this embodiment is a buffer sheet QET, characterized in that it includes a buffer sheet QE and a buffer sheet QT, the buffer sheet QE is disposed in region AE, and the buffer sheet QT is disposed in regions AT1 and AT2 and has a stronger strength than the buffer sheet QE.

[0148] Furthermore, in this embodiment, buffer QE is an example of a "first part", buffer QT is an example of a "second part", region AT1 is an example of a "first region", and regions AT1 and AT2 are examples of a "second region".

[0149] Thus, in this embodiment, the buffer sheet QET comprises a buffer sheet QE and a buffer sheet QT, which is stronger than the buffer sheet QE. Therefore, according to this embodiment, when the buffer member KE, which is composed of the buffer sheet QET, is flattened by an external force, it can be prevented from becoming distorted significantly in one of the X1 and X2 directions. Therefore, according to this embodiment, damage to objects disposed around the buffer member K can be prevented due to significant distortion of the buffer member KE in one of the X1 and X2 directions.

[0150] Alternatively, the buffer sheet QET according to this embodiment may also be characterized in that the buffer sheet QE has a flat liner LE1 and a core RE mounted on the liner LE1, and the buffer sheet QT has a flat liner LT1 and a core RT mounted on the liner LT1. The liner LT1 extends in the plane in which the liner LE1 is provided, the core RE is formed of paper, and the core RT is formed of paper different from the paper that forms the core RE.

[0151] Furthermore, in this embodiment, the liner LE1 is an example of a "first flat plate portion", the liner LT1 is an example of a "second flat plate portion", the core RE is an example of a "first support portion", the core RT is an example of a "second support portion", the plane extending from the liner LE1 is an example of a "first plane", the paper forming the core RE is an example of a "first component", and the paper forming the core RT is an example of a "second component".

[0152] Thus, according to this embodiment, the paper used to form the core RE of the buffer sheet QE is different from the paper used to form the core RT of the buffer sheet QT. Therefore, according to this embodiment, the strength of the buffer sheet QE and the strength of the buffer sheet QT can be set to different strengths.

[0153] In addition, the buffer sheet QET involved in this embodiment may also be characterized in that regions AT1 and AT2 are regions closer to the end of the buffer sheet QET than region AE.

[0154] Therefore, according to this embodiment, when the buffer member KE composed of buffer sheet QET is flattened by an external force, the buffer sheet QT provided in region AT1 and the buffer sheet QT provided in region AT2 are flattened in a manner that tilts towards the region AE in which the buffer sheet QE is formed. Thus, according to this embodiment, when the buffer member KE composed of buffer sheet QET is flattened by an external force, it is possible to prevent the buffer member KE from becoming distorted significantly in one of the X1 and X2 directions.

[0155] B.3. Variations of the Second Embodiment

[0156] The various methods illustrated in the second embodiment can be modified in a wide variety of ways. Specific modifications are illustrated below. Two or more methods selected from the above embodiments and the following examples can be appropriately combined within a non-contradictory framework.

[0157] Variation B1

[0158] In the second embodiment described above, the case in which the buffer KE is composed of multiple buffer sheets QET was illustrated. However, the buffer KE may also be composed of buffer sheets QET and buffer sheets Q other than buffer sheets QET.

[0159] Figure 15 This is a cross-sectional view of the buffer KE involved in this modified example, taken by cutting it with a plane whose normal direction is Y1. Furthermore, the buffer KE involved in this modified example is used to replace... Figure 1 The buffer K in the middle forms the support S.

[0160] like Figure 15 As shown, the buffer KE involved in this modified example has a structure formed by stacking multiple buffer sheets QET and multiple buffer sheets QT.

[0161] In this modified example, the buffer KE is also constructed by including the buffer sheet QET. Therefore, according to this modified example, it is possible to prevent the buffer KE from becoming significantly distorted in one of the X1 and X2 directions when it is flattened by an external force.

[0162] Variation B2

[0163] In the second embodiment and its variations described above, the case where the paper of the core RE of the buffer sheet QE included in the buffer sheet QET is different from the paper of the core RT of the buffer sheet QT included in the buffer sheet QET was illustrated, but the present invention is not limited to this method. The paper of the core RE of the buffer sheet QE included in the buffer sheet QET and the paper of the core RT of the buffer sheet QT included in the buffer sheet QET may also be the same paper.

[0164] Figure 16 This is a cross-sectional view of the buffer QET involved in this modified example when it is cut with a plane whose normal direction is Y1.

[0165] like Figure 16As shown, in this modified example, the buffer sheet QET includes buffer sheets QE and QT. Buffer sheet QE has a core RE supporting liners LE1 and LE2, and buffer sheet QT has a core RT supporting liners LT1 and LT2. In this modified example, the core RE and core RT are formed from the same paper. Furthermore, in this modified example, the width of the waveform portion NE in the X1 direction of the core RE is wider than the width of the waveform portion NT in the X1 direction of the core RT. In other words, in this modified example, the core RE and core RT are formed such that the waveform of the paper forming the core RT has a higher density than the waveform of the paper forming the core RE. The density of the core can be constant in portions of the core RT and the core RE, or it can gradually decrease from the portion of the core RT to the portion of the core RE. In this case, when the density of the core is represented by the vertical axis and the position in the X1 direction by the horizontal axis, the density can be continuously varied in a wavy manner.

[0166] Furthermore, in this modified example, liner LE1 and liner LT1 can also be formed from the same paper. Additionally, in this modified example, liner LE2 and liner LT2 can also be formed from the same paper.

[0167] As described above, the buffer sheet QET involved in this modified example is characterized in that the buffer sheet QE has a flat liner LE1 and a core RE mounted on the liner LE1, and the buffer sheet QT has a flat liner LT1 and a core RT mounted on the liner LT1. The liner LT1 extends in the plane in which the liner LE1 is provided, the core RE is formed of a thin sheet of paper or the like bent into a wave shape, and the core RT is formed of a thin sheet of paper or the like bent into a wave shape with a higher density than the core RE.

[0168] Therefore, according to this modified example, the strength of the buffer plate QT can be made stronger than that of the buffer plate QE, which can prevent the buffer member KE, which is composed of the buffer plate QET, from becoming significantly distorted in one of the X1 and X2 directions when it is flattened by an external force.

[0169] In addition, in the buffer QET involved in this variation, the core RE and core RT can also be set to gradually increase in density from the core RE toward the core RT.

[0170] In addition, the buffer sheet QET involved in this variation may also be characterized in that the sheet forming the core RE is the same sheet as the sheet forming the core RT.

[0171] Variation B3

[0172] In the second embodiment and its variations described above, the method of housing the support member S formed by the cushioning member KE in the packaging box 2 was illustrated, but the present invention is not limited to this method. The packaging box 2 may also be constructed using the cushioning member KE.

[0173] For example, the packaging product involved in this modification may also be characterized by having a packaging box 2 formed by bending a cushioning sheet QET and an electronic device 100 packaged in the packaging box 2, wherein the cushioning sheet QET has a cushioning sheet QE and a cushioning sheet QT with a strength stronger than the cushioning sheet QE, and the packaging box 2 is formed by bending the cushioning sheet QET in the portion formed by the cushioning sheet QT.

[0174] C. Third Implementation Method

[0175] The following is for reference Figures 17 to 22 The buffer element according to the third embodiment will be described. Furthermore, for elements in the various embodiments illustrated below that have the same function or effect as those in the first or second embodiment, the reference numerals used in the description of the first or second embodiment will be retained, and detailed descriptions of each will be appropriately omitted.

[0176] C.1. Overview of the buffer involved in the third embodiment

[0177] Figure 17 This is a cross-sectional view of the buffer KF according to the third embodiment, when cut with a plane whose normal direction is Y1. Furthermore, the buffer KF is used to replace... Figure 1 The buffer K in the middle forms the support S.

[0178] like Figure 17 As shown, the buffer KF has a configuration consisting of a buffer sheet QFS, a buffer sheet QFM with a strength higher than the buffer sheet QFS, and a buffer sheet QFH with a strength higher than the buffer sheet QFM. Specifically, in this embodiment, the buffer sheet QFS of the buffer KF is stacked between the buffer sheet QFM and the buffer sheet QFH.

[0179] Figure 18 This is a cross-sectional view of the buffer sheet QFS when it is cut by a plane with the Y1 direction as the normal direction.

[0180] like Figure 18 As shown, the buffer sheet QFS has a liner LS1, a liner LS2, and a core RS.

[0181] Liner LS1 is a flat component made of paper. Liner LS2 is a flat component made of paper and is disposed in the Z1 direction of liner LS1.

[0182] The core RS is a wave-shaped component formed from paper, supporting the liner LS1 and liner LS2 between the liner LS1 and liner LS2. Specifically, the core RS has multiple wave sections NS arranged periodically.

[0183] The waveform section NS includes a support body MS1 and a support body MS2. Support body MS1 is fixed to the liner LS1 at a connection point PS1, and fixed to the liner LS2 at a connection point PS2 located further in the X1 direction than the connection point PS1, thereby supporting the liner LS1 and the liner LS2. Support body MS2 is fixed to the liner LS2 at a connection point PS2, and fixed to the liner LS1 at a connection point PS3 located further in the X1 direction than the connection point PS2, thereby supporting the liner LS1 and the liner LS2.

[0184] Figure 19 This is a cross-sectional view of the buffer sheet QFM when it is cut with a plane whose normal direction is Y1.

[0185] like Figure 19 As shown, the buffer sheet QFM has a liner LM1, a liner LM2, and a core RM.

[0186] Liner LM1 is a flat component formed from paper. Liner LM2 is a flat component formed from paper and is disposed in the Z1 direction of liner LM1.

[0187] The core RM is a wave-shaped component formed from paper, supporting the liner LM1 and liner LM2 between the liner LM1 and liner LM2. Specifically, the core RM has multiple wave sections NM arranged periodically.

[0188] The waveform section NM includes a support body MM1 and a support body MM2. Support body MM1 is fixed to the liner LM1 at the connecting part PM1, and fixed to the liner LM2 at the connecting part PM2, which is located further in the X1 direction than the connecting part PM1, thereby supporting the liner LM1 and the liner LM2. Support body MM2 is fixed to the liner LM2 at the connecting part PM2, and fixed to the liner LM1 at the connecting part PM3, which is located further in the X1 direction than the connecting part PM2, thereby supporting the liner LM1 and the liner LM2.

[0189] Figure 20 This is a cross-sectional view of buffer QFH when it is cut with a plane whose normal direction is Y1.

[0190] like Figure 20 As shown, the buffer sheet QFH has a liner LH1, a liner LH2, and a core RH.

[0191] Liner LH1 is a flat component made of paper. Liner LH2 is a flat component made of paper and is disposed in the Z1 direction of liner LH1.

[0192] The core RH is a wave-shaped component formed of paper, supporting the liners LH1 and LH2 between them. Specifically, the core RH has multiple wave sections NH arranged periodically.

[0193] The waveform section NH includes a support body MH1 and a support body MH2. Support body MH1 is fixed to the liner LH1 at connection point PH1, and fixed to the liner LH2 at connection point PH2, which is located further in the X1 direction than connection point PH1, thereby supporting the liner LH1 and liner LH2. Support body MH2 is fixed to the liner LH2 at connection point PH2, and fixed to the liner LH1 at connection point PH3, which is located further in the X1 direction than connection point PH2, thereby supporting the liner LH1 and liner LH2.

[0194] In this embodiment, by making the thickness of the core RM of the buffer sheet QFM greater than the thickness of the core RS of the buffer sheet QFS, the strength of the buffer sheet QFM is greater than that of the buffer sheet QFS. However, the present invention is not limited to this method. The strength of the buffer sheet QFM can also be greater than that of the buffer sheet QFS by making the density of the waveform portion NM in the core RM of the buffer sheet QFM greater than the density of the waveform portion NS in the core RS of the buffer sheet QFS.

[0195] Furthermore, in this embodiment, by making the thickness of the core RH of the buffer sheet QFH greater than the thickness of the core RM of the buffer sheet QFM, the strength of the buffer sheet QFH is greater than that of the buffer sheet QFM. However, the present invention is not limited to this method. The strength of the buffer sheet QFH can also be greater than that of the buffer sheet QFM by making the density of the waveform portion NH of the core RH of the buffer sheet QFH greater than the density of the waveform portion NM of the core RM of the buffer sheet QFM.

[0196] In this embodiment, it is assumed that the buffer KF is composed of three buffer sheets Q stacked continuously: buffer sheet QFM, buffer sheet QFH stacked in the Z1 direction as viewed from buffer sheet QFM, and buffer sheet QFS stacked between buffer sheets QFM and QFH. However, the present invention is not limited to this configuration. In addition to buffer sheets QFM, QFH, and QFS, the buffer KF may also include other buffer sheets Q, such as buffer sheet QT. In this case, the other buffer sheet Q may be stacked in the Z1 direction as viewed from buffer sheet QFH, or stacked in the Z2 direction as viewed from buffer sheet QFM, or stacked between buffer sheets QFS and QFH, or stacked between buffer sheets QFS and QFM.

[0197] According to this embodiment, when an external force is applied to the cushioning member KF, deformation occurs sequentially from the weakest cushioning piece QFS among the cushioning pieces QFS, QFM, and QFH. Therefore, by visually confirming whether the cushioning piece QFS has deformed after unpacking the package 1, it is possible to subsequently confirm whether an impact was applied to the electronic device 100 packaged in the package containing the cushioning member KF. Furthermore, by visually confirming which cushioning piece deformed, the magnitude of the impact applied to the electronic device 100 packaged in the package containing the cushioning member KF can be subsequently confirmed.

[0198] Furthermore, according to this embodiment, a buffer sheet QFH with a strength stronger than the buffer sheet QFS is provided between the buffer sheet QFS and the electronic device 100. Therefore, according to this embodiment, compared with a method in which no buffer sheet QFH is provided between the buffer sheet QFS and the electronic device 100, it is possible to suppress the buffer sheet QFS from being flattened or deformed by a weak force, and the risk of misjudging that an impact has been applied when no impact has been applied to the electronic device 100 can be reduced.

[0199] C.2. Summary of the Third Implementation Method

[0200] As described above, the buffer KF involved in this embodiment is a multi-layered buffer KF, characterized in that it includes a buffer sheet QFS, a buffer sheet QFM with a strength stronger than the buffer sheet QFS, and a buffer sheet QFH with a strength stronger than the buffer sheet QFM.

[0201] Furthermore, in this embodiment, buffer QFS is an example of a "first layer", buffer QFM is an example of a "second layer", and buffer QFH is an example of a "third layer".

[0202] Thus, in this embodiment, the buffer KF includes a buffer sheet QFS, which is weaker than the buffer sheets QFH and QFM, in addition to the buffer sheets QFH and QFM. Therefore, according to this embodiment, by visually inspecting the deformation or other defects on the buffer sheet QFS, it is possible to determine whether an impact has been applied to the electronic device 100 packaged in the package 1 containing the buffer KF.

[0203] In addition, the buffer KF involved in this embodiment may also be characterized in that the plurality of buffer sheets Q forming the buffer KF include three buffer sheets Q that are continuously stacked and composed of buffer sheet QFS, buffer sheet QFM and buffer sheet QFH.

[0204] Alternatively, the buffer KF involved in this embodiment may also be characterized in that the buffer sheet QFS is stacked between the buffer sheet QFM and the buffer sheet QFH.

[0205] Therefore, according to this embodiment, the risk of misjudging that an impact has been applied when no impact has been applied to the electronic device 100 packaged by the package 1 containing the cushioning element KF can be reduced.

[0206] Additionally, the buffer KF according to this embodiment may also be characterized in that the buffer QFS has a flat plate LS1 and a core RS mounted on the plate LS1 and having a wave portion NS; the buffer QFM has a flat plate LM1 and a core RM mounted on the plate LM1 and having a wave portion NM, wherein the wave portion NM is arranged with a higher density than the wave portion NS; and the buffer QFH has a flat plate LH1 and a core RH mounted on the plate LH1 and having a wave portion NH, wherein the wave portion NH is arranged with a higher density than the wave portion NM.

[0207] Furthermore, in this embodiment, the liner LS1 is an example of a "first flat plate part", the liner LM1 is an example of a "second flat plate part", the liner LH1 is an example of a "third flat plate part", the core RS is an example of a "first support part", the core RM is an example of a "second support part", and the core RH is an example of a "third support part".

[0208] Thus, in this embodiment, the core RM has waveform sections NM arranged at a higher density than the waveform sections NS of the core RS, and the core RH has waveform sections NM arranged at a higher density than the waveform sections NS of the core RM. Therefore, according to this embodiment, the strength of the buffer sheet QFM can be made stronger than that of the buffer sheet QFS, and the strength of the buffer sheet QFH can be made stronger than that of the buffer sheet QFM.

[0209] Additionally, the buffer KF according to this embodiment may also be characterized in that the buffer QFS has a flat plate LS1 and a core RS mounted on the plate LS1 and having a wave portion NS; the buffer QFM has a flat plate LM1 and a core RM mounted on the plate LM1, which is thicker than the core RS and has a wave portion NM; and the buffer QFH has a flat plate LH1 and a core RH mounted on the plate LH1, which is thicker than the core RM and has a wave portion NH.

[0210] Therefore, according to this embodiment, the strength of buffer sheet QFM can be made stronger than that of buffer sheet QFS, and the strength of buffer sheet QFH can be made stronger than that of buffer sheet QFM.

[0211] C.3. Variations of the Third Embodiment

[0212] The various methods illustrated in the third embodiment can be modified in a wide variety of ways. Specific modifications are illustrated below. Two or more methods selected from the above embodiments and the following examples can be appropriately combined within a mutually compatible framework.

[0213] Variation C1

[0214] In the third embodiment described above, an example was given of a buffer KF having a configuration in which a buffer sheet QFS is stacked between buffer sheets QFM and buffer sheets QFH. However, the present invention is not limited to this configuration. For example, the buffer KF may have buffer sheets QFS, QFM, and QFH among the plurality of buffer sheets Q.

[0215] Figure 21 This is a cross-sectional view of the buffer KF involved in this modified example, taken by cutting with a plane whose normal direction is Y1. Furthermore, the buffer KF involved in this modified example is used to replace... Figure 1 The buffer K in the middle forms the support S.

[0216] like Figure 21 As shown, the buffer KF involved in this modified example has a configuration in which three buffer sheets Q are continuously stacked: a buffer sheet QFS, a buffer sheet QFH stacked in the Z1 direction as seen from the buffer sheet QFS, and a buffer sheet QFM stacked between the buffer sheet QFS and the buffer sheet QFH.

[0217] In this modified example, when an external force is applied to the buffer KF, the weakest of the three buffer sheets, QFS, QFM, and QFH, deforms first. Therefore, by visually confirming whether deformation has occurred on the buffer sheet QFS, it is possible to subsequently confirm whether an impact has been applied to the electronic device 100 packaged in the package containing the buffer KF.

[0218] Variation C2

[0219] In the third embodiment and its variations described above, a buffer member KF is illustrated as being used to form... Figure 1 The supporting member S of the package 1 shown has been described, but the present invention is not limited to this method. The cushioning member KF can also be used to form a package other than the package 1.

[0220] Figure 22 This is an exploded perspective view showing the structure of the package 1F involved in this variation.

[0221] like Figure 22 As shown, package 1F and Figure 1 The difference in the package 1 shown is that it has a package 2F instead of a package 2 and a support SF instead of a support S.

[0222] In this modified example, it is assumed that the package 1F has two support members SF: support member SF-1 and support member SF-2. Here, support member SF-1 is the support member SF that holds the lower end of the electronic device 100 in the ZW2 direction when the electronic device 100 is housed in the package 2F. Support member SF-2 is the support member SF that holds the upper end of the electronic device 100 in the ZW1 direction when the electronic device 100 is housed in the package 2F.

[0223] The support member SF is formed by multiple buffer members KF. In this modified example, it is assumed that the support member SF is composed of four buffer members KF-1 to KF-4 constituting the side surface of the support member SF and one buffer member KF-B constituting the bottom surface of the support member SF.

[0224] Furthermore, in this modified example, it is assumed that the support member SF-1 containing the buffer member KF-B is housed in the packaging box 2F in such a way that the Y-axis of the buffer member coordinate system ΣK, which is fixed to the buffer member KF-B, is parallel to the YW-axis of the packaging box coordinate system ΣW, which is fixed to the packaging member 1F.

[0225] The packaging box 2F has four sides 21-1 to 21-4, a bottom 21-B, and four top covers 200 corresponding to the four sides 21-1 to 21-4. In addition, Figure 22 The illustration of the top cover 200 is omitted.

[0226] like Figure 22 As shown, of the four sides 21-1 to 21-4 of the packaging box 2F, sides 21-1 and 21-2 are sides with the YW1 direction as the normal direction. An opening WF1 is provided on side 21-1. An opening WF2 is provided on side 21-2.

[0227] Specifically, opening WF1 is positioned such that the position of the cushioning sheet QFS of cushioning member KF-B can be visually confirmed when the support member SF-1, including cushioning member KF-B, is stored in the packaging box 2F. Similarly, opening WF2 is positioned such that the position of the cushioning sheet QFS of cushioning member KF-B can be visually confirmed when the support member SF-1, including cushioning member KF-B, is stored in the packaging box 2F. These openings WF1 and WF2 are positioned approximately at the same location with respect to the YW1 and ZW1 directions.

[0228] As described above, the assembly is performed with the Y-axis of the buffer coordinate system ΣK, fixed to the buffer KF-B, parallel to the YW-axis of the packaging box coordinate system ΣW, fixed to the packaging 1F. Therefore, for example, when viewing the packaging 1F from opening WF1 towards opening WF2 along the YW1 direction, if the buffer sheet QFS is not flattened, external light entering from opening WF2 will not be blocked by the core RS of the buffer sheet QFS provided in the buffer KF-B, but will instead pass through the gap of the waveform portion NS of the buffer sheet QFS and exit from opening WF1. Therefore, when viewing the packaging 1F from opening WF1 towards opening WF2 along the YW1 direction, the shape of the waveform of the waveform portion NS of the buffer sheet QFS provided in the buffer KF-B can be visually confirmed using the external light entering from opening WF2.

[0229] Thus, the packaging product involved in this modified example is characterized by having a packaging box 2F, an electronic device 100 packaged in the packaging box 2F, and a multi-layered buffer KF housed in the packaging box 2F and supporting the electronic device 100 inside the packaging box 2F. The buffer KF has a buffer sheet QFS, a buffer sheet QFM with a strength stronger than the buffer sheet QFS, and a buffer sheet QFH with a strength stronger than the buffer sheet QFM. The packaging box 2F is provided with openings WF1 and WF2 that allow visual confirmation of the cross-section of the buffer KF.

[0230] Therefore, according to this modified example, it is possible to know at any time whether an impact has been applied to the electronic device 100 packaged in the package containing the cushioning member KF, and the magnitude of the impact applied to the electronic device 100, without opening the package 1F.

[0231] Variation C3

[0232] In the third embodiment and its variations described above, the method in which the support member SF or support member S formed by the cushioning member KF is housed in the packaging box 2 or packaging box 2F was illustrated, but the present invention is not limited to this method. The packaging box 2 or packaging box 2F may also be constructed using the cushioning member KF.

[0233] For example, the packaging product involved in this modification may also be characterized by having a packaging box 2F composed of a multi-layered cushioning member KF and an electronic device 100 packaged in the packaging box 2F. The cushioning member KF includes a cushioning sheet QFS, a cushioning sheet QFM with a strength stronger than the cushioning sheet QFS, and a cushioning sheet QFH with a strength stronger than the cushioning sheet QFM. The packaging box 2F is configured such that the cross-section of the cushioning sheet QFS in the cushioning member KF constituting the packaging box 2F can be visually confirmed.

[0234] Other variations

[0235] The various embodiments and modifications described in this application can be combined with each other. For example, the cushioning member of the second embodiment can be stacked on the electronic device side of the cushioning member or packaging box of the eleventh embodiment. Furthermore, in the first and second embodiments, the strength of each layer can be varied as in the third embodiment.

[0236] Furthermore, the number of layers contained in the cushioning components and packaging boxes can be increased or decreased as needed. Additionally, the manufacturing method is not limited; for example, each layer can be manufactured separately and then stacked, or the lining and support can be stacked alternately. In the latter case, the portion of the cushioning component or packaging box lining that would otherwise be two layers becomes one layer, serving as both the lower lining of the upper layer and the upper lining of the lower layer.

[0237] In addition, cushioning or packaging boxes are not limited to paper made from trees; they can also be made from various materials such as paper and cloth made from synthetic resins.

[0238] The cushioning element or packaging box may be formed by only one of the cushioning sheets of this application, or by both of the cushioning sheets of this application.

Claims

1. A buffer component, characterized in that, It is a multi-layered buffer, including: The first layer has a stronger strength relative to a first direction than relative to a second direction, where the first direction is the direction in which the buffer extends, and the second direction is the direction in which the buffer extends and is opposite to the first direction; and The second layer has a stronger strength relative to the second direction than its strength relative to the first direction. The first layer has: A flat, first plate portion extends along the first direction; A second plate portion, in the shape of a flat plate, extends along the second direction; and A support portion is disposed between the first flat plate portion and the second flat plate portion. The support portion alternately includes: A first support body, connecting the first flat plate portion and the second flat plate portion; and The second support body connects the first plate portion and the second plate portion, and is made of a different material than the first support body.

2. The buffer element according to claim 1, characterized in that, Includes multiple first layers and multiple second layers, In the buffer, the first layer and the second layer are configured alternately.

3. The buffer element according to claim 1, characterized in that, The first support is connected to the first flat plate at a first connecting portion, and to the second flat plate at a second connecting portion located further in the first direction than the first connecting portion. The second support is connected to the second flat plate at the second connecting portion, and to the first flat plate at the third connecting portion, which is located further in the first direction than the second connecting portion. The length of the first support is different from the length of the second support.

4. The buffer element according to claim 1, characterized in that, The number of sheets in the first layer of the multi-layer structure is equal to the number of sheets in the second layer.

5. A packaging product, characterized in that, have: Packaging boxes consisting of multi-layered cushioning components; as well as The contents packaged in the box, The multi-layer structure includes: The first layer has a stronger strength relative to a first direction than relative to a second direction, where the first direction is the direction in which the buffer extends, and the second direction is the direction in which the buffer extends and is opposite to the first direction; and The second layer has a stronger strength relative to the second direction than its strength relative to the first direction. The first layer has: A flat, first plate portion extends along the first direction; A second plate portion, in the shape of a flat plate, extends along the second direction; and A support portion is disposed between the first flat plate portion and the second flat plate portion. The support portion alternately includes: A first support body connects the first flat plate portion and the second flat plate portion; as well as The second support body connects the first plate portion and the second plate portion, and is made of a different material than the first support body.

6. A packaging product, characterized in that, have: Packing boxes; Contents, packaged in the aforementioned box; and A cushioning element, housed within the packaging box, supports the contents inside the packaging box. The buffer is a multi-layer structure comprising a first layer and a second layer. The first layer is stronger relative to a first direction than relative to a second direction, where the first direction is the direction in which the buffer extends, and the second direction is the direction in which the buffer extends but is opposite to the first direction. The second layer is stronger relative to the second direction than it is relative to the first direction. The first layer has: A flat, first plate portion extends along the first direction; A second plate portion, in the shape of a flat plate, extends along the second direction; and A support portion is disposed between the first flat plate portion and the second flat plate portion. The support portion alternately includes: A first support body connects the first flat plate portion and the second flat plate portion; as well as The second support body connects the first plate portion and the second plate portion, and is made of a different material than the first support body.

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