A silver alloy wire, its preparation method and application

Abstract

The present application relates to the technical field of packaging materials, and particularly to a silver alloy bonding wire, a preparation method and application thereof.The silver alloy bonding wire comprises a core material, and the core material comprises the following components in terms of mass percentage: Al 0.5wt%-0.7wt%, Ce 0.6wt%-1wt%, carbon nanotubes 1wt%-3wt%, Sb 0.3wt%-0.5wt%, and the balance is Ag.The silver alloy bonding wire improves the mechanical properties, processing properties, corrosion resistance and electron migration resistance of the silver alloy bonding wire through the mutual cooperation of the elements, and can meet the packaging requirements of micro-wire diameter processing and high-density lead LED devices when used in electronic packaging.

Description

Technical Field

[0001] This invention relates to the field of packaging materials technology, and in particular to a silver alloy bonding wire, its preparation method and application. Background Technology

[0002] Wire bonding is the most common and important interconnection method in microelectronic packaging. Bonding wires are internal leads used in packaging, serving as solder leads between the chip and the substrate. They connect pins and silicon wafers and transmit electrical signals, undertaking the critical electrical connection function between the chip and external circuits. They are one of the essential raw materials in the repackaging manufacturing of integrated circuits, discrete semiconductor devices, and LED light source devices. Bonding wires mainly include gold wire, silver wire, aluminum wire, and copper wire. Among them, silver wire has good mechanical properties, can reduce high-frequency noise and heat generation in devices, and has a significant price advantage compared to gold wire.

[0003] As semiconductor packaging moves towards higher density and integration, bonding reliability becomes particularly critical. However, silver wires suffer from problems such as low connection strength, susceptibility to electron migration, and metal corrosion and sulfidation, which reduce reliability and significantly limit their applications.

[0004] In view of this, this invention is hereby proposed. Summary of the Invention

[0005] The primary objective of this invention is to provide a silver alloy bonding wire with excellent mechanical properties and corrosion resistance.

[0006] The second objective of this invention is to provide a method for preparing silver alloy bonding wires, which improves the mechanical properties and corrosion resistance of the bonding wires.

[0007] The third objective of this invention is to provide an application of silver alloy bonding wire in electronic packaging, which improves bonding reliability.

[0008] In order to achieve the above-mentioned objectives of the present invention, the following technical solution is adopted:

[0009] This invention provides a silver alloy bonding wire, comprising a core material;

[0010] The core material, by mass percentage, comprises the following components:

[0011] Al 0.5wt%–0.7wt%, Ce 0.6wt%–1wt%, carbon nanotubes 1wt%–3wt%, Sb 0.3wt%–0.5wt%, with the balance being Ag.

[0012] Furthermore, in the core material, the sum of the mass percentages of Al and Sb is 1%;

[0013] And / or, in the core material, the sum of the mass percentages of Al, Ce, carbon nanotubes and Sb is ≤3.5%.

[0014] Furthermore, the carbon nanotubes include single-walled carbon nanotubes;

[0015] And / or, the carbon nanotubes have a diameter ≤2nm and a length ≤50nm.

[0016] Furthermore, the silver alloy bonding wire also includes a protective layer disposed on the surface of the core material;

[0017] And / or, the protective layer, by weight, comprises the following components: 3-5 parts film-forming agent, 1-3 parts surfactant, and 1-3 parts cosolvent.

[0018] Furthermore, the film-forming agent includes at least one of vinyl glycol ether, polyacrylate, and polyvinyl ester;

[0019] The surfactant includes at least one of fatty acid polyethylene glycol ester, sodium lauryl sulfate, and sodium dodecylbenzene sulfonate;

[0020] The co-solvent includes at least one of p-aminobenzoic acid, acetone, and methanol.

[0021] Furthermore, the diameter of the core material is 15–40 μm;

[0022] And / or, the thickness of the protective layer is 1.5 to 4 μm.

[0023] The present invention also provides a method for preparing the silver alloy bonding wire as described above, comprising the following steps:

[0024] S1. After melting and casting Ag / Ce master alloy, Sb raw material, Al foil and carbon nanotubes in sequence, a rod is obtained;

[0025] S2. The rod is extruded and drawn in sequence to obtain the core material.

[0026] Furthermore, in step S2, the extrusion temperature is 700–750°C;

[0027] And / or, the extrusion ratio of the extrusion is 3 to 4.5.

[0028] Furthermore, it includes at least one of the following features (1) to (3);

[0029] (1) The method for preparing the silver alloy bonding wire further includes: sequentially cleaning, annealing and soaking the core material to obtain the silver alloy bonding wire;

[0030] (2) The annealing temperature is 450-500℃;

[0031] (3) The immersion treatment includes: immersing the annealed core material in a protective agent to obtain a protective layer;

[0032] The protective agent, by weight, comprises the following components:

[0033] 3-5 parts film-forming agent, 1-3 parts surfactant, 1-3 parts co-solvent, and 70-80 parts solvent.

[0034] The present invention also provides the application of silver alloy bonding wires prepared by the above-described method or the silver alloy bonding wires prepared by the above-described method in electronic packaging.

[0035] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0036] 1. The silver alloy bonding wire of the present invention improves the mechanical properties, processing properties, electron migration resistance and corrosion resistance of the silver alloy bonding wire by adding Sb element and carbon nanotube to the silver alloy and cooperating with Ce element and Al element; it can meet the packaging requirements of micro-diameter processing and high-density leaded LED devices.

[0037] 2. The silver alloy bonding wire of the present invention can further improve the corrosion resistance of the silver alloy bonding wire by adding a protective layer to the surface of the core material, thus avoiding sulfidation corrosion of the core material.

[0038] 3. The method for preparing silver alloy bonding wire of the present invention improves the density and strength of silver alloy bonding wire through processes such as melting, casting and extrusion. Attached Figure Description

[0039] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0040] Figure 1 Corrosion resistance curves of silver alloy bonding wires 1# to 11# provided in Embodiment 1 and Comparative Example 1 of the present invention. Detailed Implementation

[0041] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of the present invention, but not all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0042] In some embodiments of the present invention, a silver alloy bonding wire is provided, comprising a core material;

[0043] The core material, by weight percentage, comprises the following components:

[0044] Al 0.5wt%–0.7wt%, Ce 0.6wt%–1wt%, carbon nanotubes 1wt%–3wt%, Sb 0.3wt%–0.5wt%, with the balance being Ag.

[0045] The silver alloy bonding wire provided by this invention solves the problems of low connection strength, easy electron migration, and metal corrosion and sulfidation of silver wires. The silver alloy bonding wire of this invention has excellent mechanical properties, processing performance, resistance to electron migration, and resistance to sulfidation corrosion; it can meet the packaging requirements of micro-diameter processing and high-density leaded LED devices.

[0046] In the silver alloy bonding wire of this invention, Al is added to form a dense protective layer on the silver surface, which passivates the surface and improves the corrosion resistance of the silver alloy wire; Ce is added to improve corrosion resistance, reduce the growth and diffusion rate of IMC at the Ag / Al interface, and enhance bonding reliability; carbon nanotubes are added to improve thermal conductivity, reduce electron mobility, and as a nano-reinforcing phase, promote the non-spontaneous nucleation of silver molten metal to increase nucleation sites, thereby refining the grains and improving the bonding wire strength; Sb is added, which can deposit at grain boundaries, reduce diffusion along grain boundaries, and improve strength and resistance to electron migration.

[0047] In some embodiments of the present invention, typically but not limitingly, for example, the mass percentage of Al in the core material can be 0.5 wt%, 0.55 wt%, 0.6 wt%, 0.65 wt%, 0.7 wt%, or any combination thereof; the mass percentage of Ce can be 0.6 wt%, 0.65 wt%, 0.7 wt%, 0.75 wt%, 0.8 wt%, 0.85 wt%, 0.9 wt%, 0.95 wt%, 1 wt%, or any combination thereof. The mass percentage of carbon nanotubes can be 1 wt%, 1.2 wt%, 1.4 wt%, 1.6 wt%, 1.8 wt%, 2 wt%, 2.2 wt%, 2.4 wt%, 2.6 wt%, 2.8 wt%, 3 wt%, or any combination thereof; the mass percentage of Sb can be 0.3 wt%, 0.35 wt%, 0.4 wt%, 0.45 wt%, 0.5 wt%, or any combination thereof.

[0048] In order to improve the mechanical properties and corrosion resistance of silver alloy bonding wires, the present invention further optimizes the composition of the core material in silver alloy bonding wires.

[0049] In some embodiments of the present invention, the core material, by mass percentage, comprises the following components:

[0050] Al 0.55wt%–0.65wt%, Ce 0.75wt%–0.85wt%, carbon nanotubes 1.1wt%–1.3wt%, Sb 0.3wt%–0.5wt%, with the balance being Ag.

[0051] In some embodiments of the present invention, the sum of the mass percentages of Al and Sb in the core material is 1%.

[0052] In some embodiments of the present invention, the sum of the mass percentages of Al, Ce, carbon nanotubes and Sb in the core material is ≤3.5%.

[0053] In some embodiments of the present invention, carbon nanotubes include single-walled carbon nanotubes.

[0054] In some embodiments of the present invention, the diameter of the carbon nanotubes is ≤2nm and the length is ≤50nm.

[0055] When carbon nanotubes are of the above-mentioned size, they can be uniformly distributed in the alloy. However, when the bonding wires are drawn to an extremely fine state, the size of the carbon nanotubes becomes too large, which is not conducive to the deformation and drawing of the alloy, resulting in a deterioration in mechanical properties.

[0056] In some embodiments of the present invention, the bonding wire further includes a protective layer disposed on the surface of the core material.

[0057] In some embodiments of the present invention, the protective layer comprises, by weight, the following components: 3 to 5 parts of film-forming agent, 1 to 3 parts of surfactant, and 1 to 3 parts of cosolvent.

[0058] In some embodiments of the present invention, the film-forming agent includes, but is not limited to, at least one of vinyl glycol ether, polyacrylate, and polyvinyl ester.

[0059] In some embodiments of the present invention, the surfactant includes, but is not limited to, at least one of fatty acid polyethylene glycol esters, sodium dodecyl sulfate, and sodium dodecylbenzene sulfonate.

[0060] In some embodiments of the present invention, the co-solvent includes, but is not limited to, at least one of p-aminobenzoic acid, acetone, and methanol. p-Aminobenzoic acid can act as a descaling and corrosion inhibitor.

[0061] The protective layer of this invention can prevent sulfide corrosion of the silver alloy bonding wire core material without affecting the bonding process of the silver alloy bonding wire.

[0062] In some embodiments of the present invention, the protective layer comprises, by weight, the following components: 3-5 parts of vinyl glycol ether, 1-3 parts of fatty acid polyethylene glycol ester, and 1-3 parts of para-aminobenzoic acid.

[0063] In some embodiments of the present invention, the diameter of the core material is 15 to 40 μm; typically, but not limitingly, for example, the diameter of the core material can be a range of 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm or any combination thereof; the thickness of the protective layer is 1.5 to 4 μm; typically, but not limitingly, for example, the thickness of the protective layer can be a range of 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm or any combination thereof.

[0064] In some embodiments of the present invention, the breaking force of the silver alloy bonding wire is 9 to 10 g.

[0065] In some embodiments of the present invention, the elongation of the silver alloy bonding wire is 9% to 12%; preferably 10.5% to 12%.

[0066] In some embodiments of the present invention, a method for preparing the above-mentioned silver alloy bonding wire is also provided, comprising the following steps:

[0067] S1. After melting and casting Ag / Ce master alloy, Sb raw material, Al foil and carbon nanotubes in sequence, a rod is obtained;

[0068] S2. The above-mentioned rods are extruded and drawn in sequence to obtain the core material.

[0069] The method for preparing silver alloy bonding wires of the present invention improves the density and strength of silver alloy bonding wires through processes such as melting, casting and extrusion.

[0070] In some embodiments of the present invention, step S1, the method for preparing the Ag / Ce master alloy, includes:

[0071] Ag and Ce raw materials were weighed according to the specified ratio and placed in a crucible inside a vacuum furnace. The furnace door was closed and a vacuum of 3 × 10⁻⁶ was drawn. -2 The pressure is increased to 0.1–0.3 Pa by argon gas, and the temperature is raised to 600–800 °C. The vacuuming and argon gas filling process is repeated three times. Then, the temperature is raised to 1200–1250 °C, stirred for 3–5 min, and refined for 10–15 min to complete the degassing process. The furnace is then cooled to obtain the Ag / Ce master alloy. Preferably, the purity of the Ag and Ce raw materials is greater than 99.99%.

[0072] In some embodiments of the present invention, in step S1, the Ag / Ce master alloy, Sb raw material, Al foil and carbon nanotubes are placed in a vacuum melting furnace, and the vacuum is drawn to 2×10⁻⁶. -2 Pa, then argon gas is introduced to 0.1-0.3 Pa. The vacuuming and argon filling operations are repeated three times. Then the temperature is raised to 1250-1300℃, and magnetic stirring is used for 15-20 minutes. When the temperature is lowered to 1150-1200℃, it is cast into a bar with a diameter of 30-50 mm.

[0073] In some embodiments of the present invention, in step S1, the Al foil and carbon nanotubes are added by spreading carbon nanotube powder on the Al foil, holding it between two Al foils, and then folding it to add the powder.

[0074] In some embodiments of the present invention, in step S2, the extrusion temperature is 700-750°C; the extrusion ratio is 3-4.5; preferably, the extrusion includes: placing the bar in the ingot cylinder of the extruder, heating it to 700-750°C and holding it for 2 hours, the bar extrusion speed is 3-4 mm / s, the extrusion ratio is 3-4.5, the extrusion roller speed is 5-7 r / min, and a bar with a diameter of 5-10 mm is obtained after extrusion.

[0075] This invention improves density and strength by degassing, refining, and casting the bars. Instead of continuous casting, the bars are extruded after peeling, which further increases density.

[0076] In some embodiments of the present invention, drawing includes at least two wire drawing processes, and heat treatment is required after each wire drawing process before the next wire drawing process is performed; preferably, drawing includes: performing a first wire drawing process, heat treatment, and a second wire drawing process in sequence.

[0077] In some embodiments of the present invention, step S2 includes the following steps: drawing the extruded bar into a wire with a diameter of 0.8 to 1.1 mm using a wire drawing machine; the shrinkage rate per extrusion pass is 15% to 18%, and the wire drawing speed is 1.2 to 1.8 m / s.

[0078] In some embodiments of the present invention, step S2 includes heat treatment comprising: placing a wire with a diameter of 0.8 to 1.1 mm in a vacuum annealing furnace, and annealing it at a vacuum degree of 3 × 10⁻⁶. -2 ~5×10 -2 Under Pa, the temperature is increased to 350-400℃ at a rate of 2-3.5℃ / s for 3-5 hours, and then furnace cooled to below 80℃.

[0079] In some embodiments of the present invention, step S2, the second wire drawing process includes: drawing the heat-treated wire through a multi-die wire drawing machine to reduce its diameter, and then drawing it through fine wire to reduce its diameter again, to obtain a core material with a wire diameter of 15 to 40 μm; preferably, during the wire reduction drawing process through the multi-die wire drawing machine, the shrinkage rate per pass is 10% to 13%, and the wire drawing speed is 2 to 2.5 m / s; during the wire drawing reduction process, the diameter reduction rate is 15% to 18%, and the wire drawing speed is 3 to 5 m / s.

[0080] In some embodiments of the present invention, the method for preparing silver alloy bonding wire further includes: sequentially cleaning, annealing and soaking the core material to obtain silver alloy bonding wire.

[0081] In some embodiments of the present invention, annealing includes: passing the cleaned core material through an online annealing apparatus equipped with an anti-oxidation liquid dripping device; the passing speed is 2.5 to 3 m / s, and the annealing temperature is 450 to 500°C.

[0082] Annealing can eliminate the work hardening of previous processes, improve the stability and reliability of bonded wires, improve the mechanical strength of bonded wires, and enable them to withstand greater tensile forces. The resistivity and conductivity of bonded wires are closely related to their crystal structure and lattice defects. Annealing can promote grain growth and repair of lattice defects, thereby improving the electrical and conductive properties of bonded wires.

[0083] In some embodiments of the present invention, the immersion treatment includes: immersing the annealed core material in a protective agent to obtain a protective layer;

[0084] The protective agent, by weight, comprises the following components:

[0085] 3-5 parts film-forming agent, 1-3 parts surfactant, 1-3 parts co-solvent, and 70-80 parts solvent.

[0086] In some embodiments of the present invention, the solvent includes, but is not limited to, ethanol.

[0087] In some embodiments of the present invention, the soaking time is 20 to 25 minutes and the soaking temperature is 40 to 50°C.

[0088] In some embodiments of the present invention, cleaning includes: immersing the core material in deionized water and using ultrasonic vibration for 5 to 10 minutes to remove surface dirt.

[0089] In some embodiments of the present invention, the soaking treatment further includes: rinsing with deionized water, ultrasonic vibration for 15-20 minutes, drying with nitrogen, and winding the wire onto a coil.

[0090] In some embodiments of the present invention, the application of the above-described silver alloy bonding wire or the silver alloy bonding wire prepared by the above-described method is also provided in electronic packaging.

[0091] Example 1

[0092] This embodiment provides a method for preparing silver alloy bonding wires. The core material composition and content (mass percentage) of the prepared silver alloy bonding wires are shown in Table 1.

[0093] Table 1

[0094]

[0095]

[0096] Specifically, the preparation method of the above-mentioned silver alloy bonding wire includes the following steps:

[0097] S1. Select Ag raw materials with a purity greater than 99.99% and Ce raw materials with a purity greater than 99.9%, place them in the crucible of a vacuum melting furnace, close the furnace door, and evacuate the vacuum to 2×10⁻⁶. -2 Pa, purging with argon to 0.1-0.3 Pa, repeating the vacuuming and argon purging operation three times, then heating the furnace to 1200-1250℃, stirring for 3-5 min, and holding at the temperature for 10-15 min to complete the degassing operation, then cooling the furnace to room temperature to obtain the Ag / Ce master alloy.

[0098] S2, Ag / Ce master alloy, Sb raw material with a purity of 99.99%, and carbon nanotubes (single-walled carbon nanotubes, diameter ≤2nm, length ≤50nm) coated with Al foil (Al foil purity 99.99%, carbon nanotube powder is laid flat on Al foil, sandwiched between two Al foils, and then folded and added) are mixed according to the formula ratio and added to a vacuum melting furnace. The vacuum is then reduced to 2×10⁻⁶. -2Pa, then argon gas is introduced to 0.1-0.3 Pa. The vacuum extraction and argon gas introduction operation is repeated three times. Then the temperature is raised to 1250-1300℃, and magnetic stirring is used for 15-20 minutes. When the temperature is lowered to 1150℃-1200℃, it is cast into a bar with a diameter of 30-50 mm.

[0099] S3. Place a bar with a diameter of 30-50mm in the billet cylinder of the extruder, heat it to 700-750℃ and keep it at that temperature for 2 hours. The bar extrusion speed is 3-4mm / s, the extrusion ratio is 3-4.5, and the extrusion roller speed is 5-7r / min. After extrusion, cut off the head and tail to obtain a bar with a diameter of 5-10mm.

[0100] S4. The bar with a diameter of 5-10mm is drawn into a wire with a diameter of 0.8-1.1mm by a wire drawing machine. The shrinkage rate per pass is 15%-18%, and the wire drawing speed is 1.2-1.8m / s.

[0101] S5. Place the wire with a diameter of 0.8–1.1 mm in a vacuum annealing furnace, and anneal it at a vacuum degree of 3 × 10⁻⁶. -2 ~5×10 -2 Under Pa, heat the furnace at a rate of 2-3.5℃ / s to 350-400℃ for 3-5 hours, then cool it in the furnace to below 80℃ before removing it from the furnace.

[0102] S6. The heat-treated wire is drawn to a diameter of no more than 0.1 mm using a multi-die wire drawing machine. The shrinkage rate per pass is 10% to 13%, and the drawing speed is 2 to 2.5 m / s.

[0103] S7. The wire with a diameter of no more than 0.1 mm is reduced by drawing a fine wire to obtain a core material with a diameter of 15 μm. The reduction rate is 15% to 18%, and the drawing speed is 3 to 5 m / s.

[0104] S8. Immerse the core material in deionized water and use ultrasonic vibration for 5-10 minutes to remove surface dirt.

[0105] S9. The cleaned core material is annealed in an online annealing system equipped with an anti-oxidation liquid dripping device; the linear velocity is 2.5-3 m / s, and the annealing temperature is 450-500℃.

[0106] S10. Immerse the annealed core material in the protective agent and soak it at 40-50°C for 20-25 minutes. Then clean it with deionized water and ultrasonically vibrate it for 15-20 minutes. Dry it with nitrogen and wind it onto a coil to obtain a silver alloy bonding wire. The protective agent, by weight, includes the following components: 4 parts vinyl glycol ether, 2 parts fatty acid polyethylene glycol ester, 2 parts para-aminobenzoic acid and 75 parts ethanol.

[0107] Comparative Example 1

[0108] This comparative example provides a method for preparing silver alloy bonding wires. The core material composition and content (mass percentage) of the prepared silver alloy bonding wires are shown in Table 2.

[0109] Table 2

[0110] 6# / 0.65 0.35 1.8 margin 7# 0.6 / 0.35 1.8 margin 8# 0.6 0.65 / 1.8 margin 9# 0.6 0.65 0.35 / margin 10# / / 0.35 1.8 margin 11# 0.6 0.65 / / margin

[0111] The preparation method of the above-mentioned silver alloy bonding wire is described in Example 1.

[0112] Experimental Example 1

[0113] The mechanical properties of the silver alloy bonding wires with a diameter of 20 μm prepared in Example 1 and Comparative Example 1 were tested, and the results are shown in Table 3.

[0114] The tensile strength and elongation tests are performed in accordance with the IPC-9702 standard.

[0115] Table 3

[0116] 1# 9.8 10.8 2# 9.4 10.6 3# 9.8 11.1 4# 9.3 9.7 5# 9.7 10.3 6# 8.3 8.4 7# 8.1 7.3 8# 7.6 7.7 9# 7.1 6.6 10# 7.8 6.2 11# 6.8 6.1

[0117] As can be seen from Table 3, compared with Comparative Example 1, the silver alloy bonding wire of the present invention has superior tensile strength and elongation.

[0118] The corrosion resistance of silver alloy bonding wires 1# to 11# in Example 1 and Comparative Example 1 was tested, and the results are as follows: Figure 1 As shown.

[0119] The corrosion resistance test method is as follows: the silver alloy bonding wire is immersed in a 0.1 mol / L sodium sulfide aqueous solution at room temperature, and the corrosion resistance data is recorded for 200 hours to obtain the corrosion resistance performance curve.

[0120] from Figure 1 It can be seen that the corrosion rate of the silver alloy bonding wire in Example 1 remained at a low level for 200 hours, much lower than that in Comparative Example 1, and the corrosion resistance of silver alloy bonding wire #3 was better.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A silver alloy bonding wire, characterized in that, Includes core material; The core material, by mass percentage, comprises the following components: Al 0.5wt%~0.7wt%, Ce 0.6wt%~1wt%, carbon nanotubes 1wt%~3wt%, Sb 0.3wt%~0.5wt%, with the balance being Ag.

2. The silver alloy bonding wire according to claim 1, characterized in that, In the core material, the sum of the mass percentages of Al and Sb is 1%; And / or, in the core material, the sum of the mass percentages of Al, Ce, carbon nanotubes and Sb is ≤3.5%.

3. The silver alloy bonding wire according to claim 1, characterized in that, The carbon nanotubes include single-walled carbon nanotubes; And / or, the carbon nanotubes have a diameter ≤2nm and a length ≤50nm.

4. The silver alloy bonding wire according to claim 1, characterized in that, The silver alloy bonding wire also includes a protective layer disposed on the surface of the core material.

5. The silver alloy bonding wire according to claim 4, characterized in that, The protective layer comprises, by weight, the following components: 3-5 parts film-forming agent, 1-3 parts surfactant, and 1-3 parts cosolvent.

6. The silver alloy bonding wire according to claim 5, characterized in that, The film-forming agent includes at least one of vinyl glycol ether, polyacrylate and polyvinyl ester; The surfactant includes at least one of fatty acid polyethylene glycol ester, sodium lauryl sulfate, and sodium dodecylbenzene sulfonate; The co-solvent includes at least one of p-aminobenzoic acid, acetone, and methanol.

7. The silver alloy bonding wire according to claim 4, characterized in that, The diameter of the core material is 15~40μm; And / or, the thickness of the protective layer is 1.5~4μm.

8. The method for preparing silver alloy bonding wire according to any one of claims 1 to 7, characterized in that, Includes the following steps: S1. After melting and casting Ag / Ce master alloy, Sb raw material, Al foil and carbon nanotubes in sequence, a rod is obtained; S2. The rod is extruded and drawn in sequence to obtain the core material.

9. The method for preparing silver alloy bonding wire according to claim 8, characterized in that, In step S2, the extrusion temperature is 700~750℃; And / or, the extrusion ratio of the extrusion is 3 to 4.

5.

10. The method for preparing silver alloy bonding wire according to claim 8, characterized in that, The method for preparing the silver alloy bonding wire further includes: sequentially cleaning, annealing and soaking the core material to obtain the silver alloy bonding wire.

11. The method for preparing silver alloy bonding wire according to claim 10, characterized in that, The annealing temperature is 450~500℃.

12. The method for preparing silver alloy bonding wire according to claim 10, characterized in that, The immersion treatment includes: immersing the annealed core material in a protective agent to obtain a protective layer; The protective agent, by weight, comprises the following components: Film-forming agent 3-5 parts, surfactant 1-3 parts, cosolvent 1-3 parts and solvent 70-80 parts.

13. The application of silver alloy bonding wires prepared by the method of preparing silver alloy bonding wires according to any one of claims 1 to 7 or claims 8 to 12 in electronic packaging.

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