一种小型化高频四边无引线陶瓷外壳及其加工工艺
By optimizing the high-frequency CQFN housing through a hanging hole structure and a secondary lamination process, the conflict between miniaturization and high-performance transmission is resolved. This enables the non-planar transmission of high-frequency signals in a miniaturized ceramic housing and low-cost processing, ensuring excellent signal transmission performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
- Filing Date
- 2023-12-12
- Publication Date
- 2026-07-17
AI Technical Summary
Existing high-frequency four-sided leadless ceramic housings (CQFNs) suffer from problems such as large space occupation due to coaxial structure, large parasitic inductance, large processing error and poor signal transmission performance during miniaturization. Especially when the frequency band reaches Ku and above, it is difficult to achieve both miniaturization and high performance.
A hanging hole structure is adopted to replace the coaxial structure. Combined with the secondary stacking semi-finished product process, a coplanar waveguide structure and compensation capacitor are designed to optimize impedance matching. Shielding holes are set to realize high-frequency signal heterogeneous transmission, and the bonding strength is improved by electroplating gold.
It achieves high-frequency signal transmission in a 1.5mm×1.5mm cavity with a 3mm×3mm outer dimension, reduces the signal transmission channel area, reduces processing errors, ensures signal transmission performance and low cost of packaging components, and supports backward compatibility of frequency bands.
Smart Images
Figure CN117715338B_ABST