A self-circulating spray cooling device

Abstract

The application discloses a self-circulation type spray cooling device, which comprises a box assembly, a heat exchange assembly and a liquid return assembly.

Description

Technical Field

[0001] This invention relates to the technical field of cooling and heat dissipation devices, and more particularly to a self-circulating spray cooling device. Background Technology

[0002] In recent years, high heat flux density dissipation technology has attracted widespread attention due to its applications in numerous engineering fields, including electronic systems, nuclear power generation, aerospace, and laser weapons. Traditional cooling technologies, such as forced air convection cooling and single-phase liquid heat transfer, no longer meet the heat dissipation requirements of devices. Among cooling technologies involving phase change, spray cooling utilizes pressure differences or liquid momentum to generate intense gas-liquid disturbances that break the coolant into tiny droplets. The significantly increased surface area of ​​these droplets greatly improves cooling efficiency. Therefore, spray cooling can be an effective solution due to its high heat dissipation capacity, low coolant consumption, uniform temperature distribution, and, most importantly, precise temperature control, reliability, and economic efficiency.

[0003] Spray cooling, with its rapid thermal response and low flow consumption, is a common and effective thermal management method in high-power electronic systems. Typically, reducing the wettability of the target surface lowers the surface energy barrier for bubble nucleation, thereby promoting nucleated boiling and improving the heat transfer coefficient of spray cooling. However, bubble coalescence and vapor film formation have limitations in further increasing the critical heat flux. Therefore, maximizing the heat transfer coefficient and critical heat flux of spray cooling on the same heating surface can be mutually exclusive.

[0004] Traditional spray cooling systems typically require pumps to circulate fluid, which results in an excessive number of components in the system. Furthermore, the kinetic energy of the high-temperature steam generated during evaporation is not utilized, leading to significant energy loss. Summary of the Invention

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0006] In view of the problems existing in the above-mentioned self-circulating spray cooling devices, the present invention is proposed.

[0007] Therefore, the object of the present invention is to provide a self-circulating spray cooling device.

[0008] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a self-circulating spray cooling device, comprising: a housing assembly including a constant temperature water tank, a spray chamber disposed at the lower end of the constant temperature water tank, and a base disposed at the lower end of the spray chamber; a heat exchange assembly including a base housing, a heat exchange surface disposed within the base housing, and a heating copper column disposed below the heat exchange surface, wherein a liquid return component is disposed within the base housing; and a liquid return assembly disposed within the housing assembly.

[0009] In a preferred embodiment of the self-circulating spray cooling device of the present invention, the liquid return component includes a liquid return chamber formed within the base housing, a flow channel communicating with the liquid return chamber, and a liquid outlet formed on the base housing communicating with the flow channel; the heating copper column is disposed within the liquid return chamber. The liquid outlet is provided with two outlets, and a connecting flange is provided at the end of each outlet.

[0010] As a preferred embodiment of the self-circulating spray cooling device of the present invention, the heat exchange surface is provided with a plurality of micro-pillar structures, an array of the plurality of micro-pillar structures is provided on the heat exchange surface, a gap is formed between the micro-pillar structures, a plurality of copper micro-mesh is provided on the micro-pillar structure, and interconnecting components are provided between the copper micro-mesh.

[0011] As a preferred embodiment of the self-circulating spray cooling device of the present invention, the copper micromesh is provided with three layers, and the surface of the copper micromesh is provided with a nano-grass structure, which is generated by etching on the surface of the copper micromesh using a chemical etching method.

[0012] As a preferred embodiment of the self-circulating spray cooling device of the present invention, the base housing is provided with a pipeline component, the pipeline component including an inlet pipe disposed in the base housing, a pump body connected to the inlet pipe, and a spray pipe connected to the lower end of the inlet pipe, the base housing is provided with a lower adjusting rod, the spray pipe is connected to the lower end of the lower adjusting rod, and a nozzle is disposed at the lower end of the lower adjusting rod.

[0013] As a preferred embodiment of the self-circulating spray cooling device of the present invention, the liquid return assembly includes a liquid return pipe connected to the liquid outlet, a liquid return pipe connected to the liquid return pipe, and a liquid outlet disposed at the upper end of the liquid return pipe. The liquid outlet is connected to a constant temperature water tank, and a rubber component is disposed on the liquid outlet.

[0014] As a preferred embodiment of the self-circulating spray cooling device of the present invention, the base housing is provided with a height adjustment component, the height adjustment component includes an upper adjustment rod provided on the constant temperature water tank, an adjustment knob provided on the adjustment rod, and an adjustment cavity provided at the end of the adjustment rod that extends into the spray chamber. The adjustment cavity is connected to the lower adjustment rod and the adjustment cavity is connected to the spray chamber. The upper adjustment rod is provided with an external thread, and the adjustment knob is provided with an internal thread that mates with the external thread.

[0015] In a preferred embodiment of the self-circulating spray cooling device of the present invention, a pressure sensor is provided on the cavity wall of the spray chamber.

[0016] The beneficial effects of this invention are as follows: the operator sprays water from the constant temperature water tank into the spray chamber, and after the water flows downward into the heat exchange surface, some of the liquid forms a vapor state. The liquid is then refluxed through the pressure change inside the spray chamber. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the self-circulating spray cooling device of the present invention.

[0018] Figure 2 This is a cross-sectional front view of the overall structure of the self-circulating spray cooling device of the present invention.

[0019] Figure 3 The self-circulating spray cooling device of the present invention Figure 2 Enlarged diagram of part A in the middle.

[0020] Figure 4 The self-circulating spray cooling device of the present invention Figure 2 Enlarged schematic diagram of part B in the middle.

[0021] Figure 5 This is a schematic diagram of the internal structure of the self-circulating spray cooling device of the present invention.

[0022] Figure 6 The self-circulating spray cooling device of the present invention Figure 5 Enlarged schematic diagram of section C.

[0023] Figure 7This is a line graph showing the effect of the number of copper mesh layers on the surface heat transfer flux (a) and heat transfer coefficient (b) of the self-circulating spray cooling device of the present invention.

[0024] Figure 8 This is a schematic diagram illustrating the phenomenon and evolution of liquid capillary evaporation heat transfer on copper mesh capillary core structures with different layers as the heat transfer flux increases, as described in the self-circulating spray cooling device of the present invention.

[0025] Figure 9 This is a line graph showing the effect of using a pressure sensor to test the internal pressure in the self-circulating spray cooling device of the present invention. Detailed Implementation

[0026] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0029] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0030] Example 1 Reference Figure 1-2 This invention discloses a self-circulating spray cooling device, including a housing assembly 100. In this embodiment, the housing assembly 100 includes a constant temperature water tank 101. The constant temperature water tank 101 has a hollow structure and maintains a constant internal temperature for storing water. A spray chamber 102 is provided at the lower end of the constant temperature water tank 101. The spray chamber 102 is made of transparent glass for visibility. The overall structure is completely sealed, and all connections are also sealed. A base 103 is provided at the lower end of the spray chamber 102. The base 103 also has a housing structure with an internal cavity.

[0031] Furthermore, the present invention also includes a heat exchange assembly 200. In this embodiment, the heat exchange assembly 200 includes a base 103 housing. A heat exchange surface 202 is provided inside the base 103 housing. The heat exchange surface 202 is generally in the shape of a flat circular plate and is located in the center of the base 103 housing in a horizontal direction. A heating copper column 203 is provided at the lower end of the heat exchange surface 202. An electric heating wire is provided on the outside of the heating copper column 203. The electric heating wire is connected to an external power source. The heating copper column 203 is heated by the electric heating wire, thereby heating the liquid film formed on the heat exchange surface 202 and evaporating the liquid film into a steam state. Furthermore, a liquid return component 204 is provided inside the base 103 housing. The liquid return component 204 collects excess liquid and returns the liquid to the constant temperature water tank 101.

[0032] Furthermore, the present invention also includes a liquid return component 500, which is disposed inside the housing component 100. The liquid return component uses the pressure change inside the spray chamber 102 to drive the excess liquid to return.

[0033] Operation process: The operator sprays the water in the constant temperature water tank 101 into the spray chamber 102. After the water flows downward into the heat exchange surface 202, some of the liquid forms a vapor state. The liquid is returned through the pressure change inside the spray chamber 102.

[0034] Example 2 Reference Figure 3-8 This is the second embodiment of the present invention. The difference between this embodiment and the previous embodiment is that in this embodiment, the liquid return component 204 includes a base 103 housing. The base 103 housing is generally box-shaped and hollow inside. A liquid return cavity 204a is formed on the bottom surface of the base 103 housing. The liquid return cavity 204a is located below the heat exchange surface 202 and is generally round. The liquid return cavity 204a is located at the lowest point of the base 103 housing. This arrangement allows the remaining liquid to flow into the liquid return cavity 204a for convenient liquid return. Furthermore, a flow channel 204b is formed inside the base 103 housing. The flow channel 204b is connected to the liquid return cavity 204a. The flow channel 204b is opened laterally to connect the liquid return cavity 204a with the outside. An outlet 204c is formed at the connection between the flow channel 204b and the base 103 housing.

[0035] Preferably, in this embodiment, there are two liquid outlets 204c, which are arranged adjacent to each other. Each liquid outlet 204c is provided with an outlet pipe made of copper. Several annular protrusions are provided on the outer circumferential surface of the outlet pipe to facilitate subsequent connection. At the same time, a connecting flange is provided near the base 103 housing of the liquid outlet 204c.

[0036] Furthermore, in this embodiment, a plurality of micro-pillar structures 300 are provided on the upper surface of the heat exchange surface 202. The micro-pillar structures 300 are arranged in an equidistant array on the heat exchange surface 202, and the shape of the micro-pillar structure 300 is rectangular block. When viewed from directly above, a cross-shaped retention gap 301 is formed between every four adjacent micro-pillar structures 300, and the retention gap 301 is used for liquid flow.

[0037] Furthermore, a copper micromesh 302 is disposed on the micropillar structure 300. The copper micromesh 302 has several layers, preferably four layers in this embodiment. A nano-grass structure is formed on the copper micromesh 302 by a simple chemical etching method. The steps of the chemical etching method are as follows: 1. Surface treatment: First, the surface of the copper micromesh needs to be pretreated by ultrasonic cleaning to remove any possible contaminants and oxides.

[0038] 2. Preparation of grass template: To prepare the grass template, copper oxide precursor materials (Cu(NO3)2·3H2O, CuCl2), appropriate amounts of solvent (deionized water), reducing agent (citric acid), and auxiliary agent (polyvinylpyrrolidone (PVP)) are selected. Preparation Steps: Preparation of Copper Oxide Precursor Solution: Add an appropriate amount of copper oxide precursor material to the solvent and stir thoroughly until the precursor is completely dissolved. Addition of Auxiliary Agents: Add an appropriate amount of auxiliary agent, such as PVP or CTAB, to the solution as needed. These auxiliary agents can provide a template effect, facilitating the formation of nanograss-like structures. Reduction Reaction: Add a reducing agent to the solution and stir appropriately to trigger the reduction reaction. The choice of reducing agent depends on the specific experimental conditions, such as sucrose or citric acid. Nucleation and Growth: The reduction reaction leads to the nucleation and growth of copper oxide nanocrystals, forming nanograss-like structures. The reaction time can be controlled as needed. Separation and Cleaning: Separate the prepared copper oxide nanograss using methods such as centrifugation or filtration, and clean with an appropriate solvent to remove impurities and residual reagents. This results in the spontaneous formation of a regularly arranged array of nanoparticles on the surface of the copper micromesh, serving as a grass template.

[0039] 3. Chemical Etching: The grass template is immersed in a reaction system containing a suitable chemical solution for chemical etching. Commonly used etching solutions include ammonia and hydrogen peroxide. During the etching process, the nanoparticles on the grass template are gradually etched away, forming nano-grass.

[0040] 4. Residue Removal: After etching, the sample is cleaned using ultrasound to remove etching products and residues from the original grass template.

[0041] Furthermore, the interconnected channels of the copper micromesh 302 can transport the cooling medium to the heat exchange surface 202 through capillary action, wherein a uniform thin liquid film is formed between the micromesh and the micropillars. The micropores between the micropillars, the mesh, and the nanograss are used as nucleation points to improve the initiation point of nucleation boiling and promote liquid film boiling. Since the bubble nucleation size is in the micrometer range, the width, spacing, and height of the copper micromesh 302 and the micropillars are all in the micrometer range, and interconnected components are provided between each layer of copper micromesh 302.

[0042] The interconnecting gaps between the multiple layers of copper mesh provide numerous low-resistance channels for capillary flow of the liquid, and the microporous structure on the surface of the copper mesh further enhances the liquid supply capacity of the copper mesh capillary wick by improving surface wettability. The microporous structure covering the top layer of copper mesh on the capillary wick greatly expands the gas-liquid interface and increases the effective evaporative heat transfer area.

[0043] More importantly, the microporous structure covering the copper mesh provides a large number of effective nucleation sites to promote nucleated boiling heat transfer on the capillary wick. The nucleated bubbles not only further increase the gas-liquid interface area, which helps liquid evaporation, but also effectively disturb the liquid film to reduce the liquid film thermal resistance.

[0044] A layer of copper oxide nanostructures was formed on a copper mesh using a simple chemical etching method, further improving the surface capillary capacity and thus enhancing the liquid transport capacity of the copper mesh structure. Finally, the copper oxide nanostructures were removed using chemical cleaning, forming a large number of microporous structures on the copper mesh surface, which helps to simultaneously improve the surface liquid transport capacity and increase the number of effective nucleation sites on the surface.

[0045] As the number of copper mesh layers increases, the liquid transport capacity of the capillary wick structure increases, manifested as an increase in capillary velocity and liquid volumetric flow rate. For capillary wicks with the same number of copper mesh layers, both nanograss and micropores can enhance the surface liquid transport capacity, because the rough structure on the copper wires can induce capillary action along the copper mesh lines. Furthermore, compared to dense nanograss, microporous structures can improve liquid transport capacity by reducing liquid flow resistance.

[0046] Figure 7 This demonstrates the effect of the number of copper mesh layers on the evaporation / boiling heat transfer process. The testing method here is as follows: heat flux is calculated and statistically analyzed for copper micromesh with different numbers of layers. 1. Pretreatment: Before conducting the experiment, the copper mesh needs to be pretreated by cleaning and polishing to ensure that its surface is free of impurities or dirt and is smooth and flat.

[0047] 2. Install the heat flow meter or thermocouple: Mount the heat flow meter or thermocouple onto the copper mesh and connect it to an external measuring device using wires. Heat flow meters are typically glued directly to the surface of the copper mesh, while thermocouples require inserting a probe into the copper mesh to measure the internal temperature. In this solution, a heat flow meter is used.

[0048] 3. Heating the copper mesh: Divide the copper mesh into single-layer, double-layer, triple-layer, four-layer, and five-layer groups. Then, heat several groups of copper mesh to the required temperature and maintain it for a period of time to reach thermal equilibrium. In this scheme, the copper mesh needs to be heated to 200°C, 203°C, 206°C, 209°C, 212°C, 215°C, and 218°C.

[0049] After the copper mesh is heated to a steady state at each temperature, the operator places a sealed box over the copper mesh and weighs each group of copper meshes and the sealed box separately. Then, water is sprayed onto the surface of the copper mesh, with a fixed total amount of water sprayed onto each group of copper meshes. A second weighing is then performed.

[0050] 4. Record data: After the copper mesh reaches a steady state, you can start recording the temperature and heat flow data at each time point.

[0051] 5. Then, the operator begins to record the total weight at this time, which is recorded as three weighings. Then, the difference between the second and third weighings is calculated, the weight loss is calculated, and the weight loss values ​​are compared.

[0052] Furthermore, such as Figure 7 As shown, for thin capillary wick structures (number of layers < 2), capillary evaporation occurs only on the surface until the heated area is burned dry. For thicker capillary wick structures (number of layers > 3), as the surface superheat increases, nucleate boiling can lead to a sudden decrease in superheat, thereby improving the evaporation / boiling heat transfer efficiency.

[0053] And from Figure 8 (a) It can be seen that when the number of layers is 2, the decrease in superheat caused by nucleus boiling only begins to change gradually in the later stage, while the overall change is less pronounced when the number of layers is 4. Figure 8 (b) As shown, the change in superheat caused by nucleus boiling begins in the early to middle stage, and the change becomes most obvious in the later stage, which leads to the minimum point of superheat reduction. Therefore, at this layer number, the evaporation / boiling heat transfer efficiency is the highest. Therefore, this layer number is selected in this embodiment.

[0054] The advantage of choosing four layers is that with four layers, pressure sensors can be used to test the internal pressure, and then obtain... Figure 9 , Figure 9In the middle, from bottom to top, the pressure inside the spray chamber is as follows: pressure inside the spray chamber when there are 2 copper mesh layers, pressure inside the spray chamber when there are 3 copper mesh layers, pressure inside the spray chamber when there are 4 copper mesh layers, and pressure inside the spray chamber when there are 5 copper mesh layers. Figure 9 It is evident that when the number of layers exceeds 3, the pressure inside the spray chamber gradually increases over time. In this design, however, the pressure inside the spray chamber is 50m³. 3 -60m 3 At that time, the maximum pressure that the whole can withstand is 220-250Mpa (the data is known from actual measurement and the characteristics of the low carbon steel material used in the spray chamber). So when the number of layers reaches 4, the rate of pressure increase is basically the same as the rate of liquid backflow, and when the liquid spray volume is fixed, the highest pressure will not exceed 220Mpa.

[0055] When the number of layers is 5, the evaporation / boiling heat transfer efficiency increases, which in turn causes the pressure to rise faster than the liquid reflux rate. Furthermore, under quantitative spraying conditions, the maximum pressure generated reaches 261 MPa. Obviously, the entire device cannot generate the pressure required for this device. Therefore, in this solution, 4 layers are preferred to avoid extreme pressure changes and excessive pressure that could damage the entire device.

[0056] Furthermore, a pipeline component 400 is provided inside the spray chamber 102. In this embodiment, the pipeline component 400 includes an inlet pipe 401 disposed inside the housing of the base 103. The inlet pipe 401 extends from the side wall of the constant temperature water tank 101 and is connected to the spray chamber 102. The inlet pipe 401 is made of soft material. A pump body 402 is disposed inside the inlet pipe 401. The pump body 402 controls the flow of liquid in the inlet pipe 401. At the same time, a spray pipe 403 is disposed at the end of the inlet pipe 401 that extends into the spray chamber 102. A lower adjusting rod 404 is disposed inside the housing of the base 103. The spray pipe 403 is connected to the lower end of the lower adjusting rod 404. A nozzle 405 is disposed at the lower end of the lower adjusting rod 404. The operator controls the opening and closing of the pump body 402 to deliver liquid to the nozzle 405 and spray the liquid into the spray chamber 102 through the nozzle 405.

[0057] Furthermore, in this embodiment, the liquid return assembly 500 includes a liquid return pipe 501 connected to the liquid outlet 204c, a liquid return pipe 502 connected to the liquid return pipe 501, a liquid return pipe 503 provided at the upper end of the liquid return pipe 502, the liquid return pipe 503 being connected to the constant temperature water tank 101, and a rubber part provided on the liquid return pipe 503.

[0058] In this embodiment, the rubber component includes a connecting sleeve disposed on the liquid outlet 503, and a covering layer is provided on the outside of the connecting sleeve. The covering layer is used to ensure a sealing effect and prevent liquid from flowing out.

[0059] Furthermore, a height adjustment component 504 is provided inside the housing of the base 103. In this embodiment, the height adjustment component 504 includes an upper adjustment rod 505 disposed on the constant temperature water tank 101, an adjustment knob 506 disposed on the adjustment rod, and an adjustment cavity 507 disposed at the end of the adjustment rod that extends into the spray chamber 102. The upper adjustment rod 505 extends downward from the upper end of the constant temperature water tank 101, then passes through the constant temperature water tank 101 and extends downward into the spray chamber 102. In order to ensure the seal between the constant temperature water tank 101 and the spray chamber 102, an upper passage pipe is provided inside the constant temperature water tank 101. The adjustment cavity 507 extends from... The upper wall of the spray chamber 102 extends downward, and its overall shape is cylindrical, which connects the adjusting chamber 507 to the lower adjusting rod 404, and the upper adjusting rod 505 to the lower adjusting rod 404. The movement of the upper adjusting rod 505 will drive the movement of the lower adjusting rod 404, thereby adjusting the height of the nozzle 405. An external thread 508 is provided on the upper adjusting rod 505, and an internal thread that mates with the external thread 508 is provided on the adjusting knob 506. The adjusting knob 506 is rotatably connected to the upper end of the constant temperature water tank 101. When the operator rotates the adjusting knob 506, it will drive the upper adjusting rod 505 to move up and down.

[0060] Preferably, a pressure sensor 509 is provided on the cavity wall of the spray cavity 102 to monitor the internal pressure of the spray cavity 102.

[0061] The rest of the structure is the same as in Example 1.

[0062] Operation process: The cooling medium enters the spray chamber 102 through the inlet pipe 401 and is then sprayed onto the heat exchange surface 202 via the nozzle 405. After heat exchange, it collects in the return chamber 204a, flows out through the flow channel 204b, and is transported back to the constant temperature water tank 101 through the return pipe 501. To achieve self-circulation of the cooling medium back to the constant temperature water tank 101, the spray cooling device of this invention adopts a fully enclosed structure. Simultaneously, a nanostructure is formed on the copper microgrid 302 using a simple chemical etching method. The interconnecting channels of the copper microgrid 302 can... The cooling medium is transported to the heat exchange surface 202 by capillary action, where a uniform thin liquid film is formed between the micro-mesh and micro-columns. The micropores between the micro-columns, the mesh, and the nano-grass are used as nucleation points to improve the initiation point of nucleation boiling and promote liquid film boiling. The spray chamber 102 is in a fully enclosed state. Once a small amount of liquid phase is converted into steam, the pressure in the spray chamber 102 immediately increases sharply. That is, the kinetic energy of the high-temperature steam generated by evaporation during the spray cooling heat exchange process is used to drive the cooling medium to circulate back to the constant temperature water tank 101 through the return liquid pipe 501.

[0063] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0064] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0065] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0066] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A self-circulating spray cooling device, characterized in that: include, The housing assembly (100) includes a constant temperature water tank (101), a spray chamber (102) disposed at the lower end of the constant temperature water tank (101), and a base (103) disposed at the lower end of the spray chamber (102). The heat exchange assembly (200) includes a base (103) housing, a heat exchange surface (202) disposed within the base (103) housing, and a heating copper column (203) disposed below the heat exchange surface (202). A liquid return component (204) is disposed within the base (103) housing. Liquid return assembly (500), wherein the liquid return assembly (500) is disposed within the housing assembly (100); The heat exchange surface (202) is provided with a plurality of micro-pillar structures (300), and an array of the plurality of micro-pillar structures (300) is arranged on the heat exchange surface (202). A gap (301) is formed between the micro-pillar structures (300). A plurality of copper micro-mesh (302) is provided on the micro-pillar structure (300), and interconnecting components are provided between the copper micro-mesh (302). The copper micromesh (302) has three layers, and a nano-grass structure is provided on the surface of the copper micromesh (302). The nano-grass structure is generated by etching on the upper surface of the copper micromesh (302) using a chemical etching method. The spray chamber (102) is a fully enclosed structure.

2. The self-circulating spray cooling device as described in claim 1, characterized in that: The liquid return component (204) includes a liquid return chamber (204a) formed in the housing of the base (103), a flow channel (204b) communicating with the liquid return chamber (204a), and a liquid outlet (204c) formed in the housing of the base (103) communicating with the flow channel (204b). The heating copper column (203) is disposed in the liquid return chamber (204a). There are two liquid outlets (204c), and a connecting flange is provided at the end of each liquid outlet (204c).

3. The self-circulating spray cooling device as described in claim 2, characterized in that: The base (103) housing is provided with a pipeline component (400), which includes an inlet pipe (401) provided in the base (103) housing, a pump body (402) connected to the inlet pipe (401), and a spray pipe (403) connected to the lower end of the inlet pipe (401). The base (103) housing is provided with a lower adjusting rod (404), the spray pipe (403) is connected to the lower end of the lower adjusting rod (404), and a nozzle (405) is provided at the lower end of the lower adjusting rod (404).

4. The self-circulating spray cooling device as described in claim 3, characterized in that: The liquid return assembly (500) includes a liquid return pipe (501) connected to the liquid outlet (204c), a liquid return pipe (502) connected to the liquid return pipe (501), and a liquid outlet (503) provided at the upper end of the liquid return pipe (502). The liquid outlet (503) is connected to the constant temperature water tank (101), and a rubber part is provided on the liquid outlet (503).

5. The self-circulating spray cooling device as described in claim 4, characterized in that: The base (103) housing is provided with a height adjustment component (504). The height adjustment component (504) includes an upper adjustment rod (505) on the constant temperature water tank (101), an adjustment knob (506) on the adjustment rod, and an adjustment cavity (507) at the end of the adjustment rod that extends into the spray chamber (102). The adjustment cavity (507) is connected to the lower adjustment rod (404) and the adjustment cavity (507) is connected to the spray chamber (102). The upper adjustment rod (505) is provided with an external thread (508), and the adjustment knob (506) is provided with an internal thread that mates with the external thread (508).

6. The self-circulating spray cooling device as described in claim 5, characterized in that: A pressure sensor (509) is installed on the wall of the spray chamber (102).

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