Electronic component holding member and endoscope

Abstract

An electronic component holding member (M1) includes a first substrate (1) having an electronic component (3), a first resin molded product (11), and a first metal pattern formed in a non-planar manner with a signal pattern (12, 13) and a ground pattern (14); a second substrate (2) disposed on the first substrate (1) and having a second resin molded product (21) and a second metal pattern (22) formed in a non-planar manner so as to overlap at least a portion of the first metal pattern; and a ground wiring (23) connecting the ground pattern (14) and the second metal pattern (22).

Description

Technical Field

[0001] The present invention relates to an electronic component holding member for holding electronic components on a resin molded article and an endoscope equipped with an electronic component holding member. Background Technology

[0002] Previously, electronic component holding components for holding electronic components on resin molded articles were proposed and commercialized.

[0003] For example, Japanese Patent No. 4055028 describes the following technology: Circuit wiring is formed on a resin film, and a groove for accommodating the circuit wiring is formed on a metal substrate. Shielding is achieved by using a metal cap, different from the metal substrate, to separate the resin film. An antenna is formed on the back side of the metal substrate, integrating the millimeter-wave antenna with the processing unit. By overlapping and pressing other resin films onto this formed component, a microstrip line, similar to a conventional printed wiring substrate, is realized. Here, the microstrip line, for example, has a structure in which a linear conductor foil is formed on the surface of a plate-shaped dielectric substrate, and the conductor foil is formed on the back side of the plate-shaped dielectric substrate. This microstrip line is the transmission path for transmitting electromagnetic waves.

[0004] However, it is difficult to apply the structure described in Japanese Patent No. 4055028 to three-dimensional structures such as the camera module of an endoscope, and even if it could be applied, the camera module would be large.

[0005] The present invention was made in view of the above circumstances, and its object is to provide a three-dimensional electronic component holding member with strong noise resistance and capable of high-speed signal transmission, and an endoscope equipped with the electronic component holding member. Summary of the Invention

[0006] Methods for solving problems

[0007] An electronic component holding member according to one aspect of the present invention comprises: a first substrate having an electronic component, a first metal pattern, and a first resin molded article holding the electronic component, the first metal pattern being formed on a non-planar surface of the first resin molded article, the first metal pattern including a grounding pattern and a signaling pattern for signal transmission with the electronic component; a second substrate having a second metal pattern and a second resin molded article disposed on the first substrate, the second metal pattern being formed on a non-planar surface of the second resin molded article in such a way that it overlaps at least a portion of the first metal pattern through the second resin molded article; and a grounding wiring connecting the grounding pattern and the second metal pattern.

[0008] An endoscope according to one aspect of the present invention is equipped with an electronic component holding member, the electronic component holding member comprising: a first substrate having an electronic component, a first metal pattern, and a first resin molded article holding the electronic component, the first metal pattern being formed on a non-planar surface of the first resin molded article, the first metal pattern including a grounding pattern and a signaling pattern for signal transmission with the electronic component; a second substrate having a second metal pattern and a second resin molded article disposed on the first substrate, the second metal pattern being formed on the non-planar surface of the second resin molded article in such a way that it overlaps at least a portion of the first metal pattern through the second resin molded article; and a grounding wiring connecting the grounding pattern and the second metal pattern. Attached Figure Description

[0009] Figure 1 This is a perspective view showing the first substrate and the second substrate in the electronic component holding member according to the first embodiment of the present invention, in an exploded view.

[0010] Figure 2 This is a perspective view showing the electronic component holding member of the first embodiment described above.

[0011] Figure 3 This is a cross-sectional view showing an example of a structure in the first embodiment described above where wiring is provided at the corner of the first substrate.

[0012] Figure 4 This is a schematic diagram illustrating the structure in the first embodiment described above, in which a grounding pattern is connected to a DC power line containing a ground wire.

[0013] Figure 5 This is a perspective view showing the first substrate and the second substrate in the electronic component holding member according to the second embodiment of the present invention, in an exploded view.

[0014] Figure 6 This is a perspective view showing the electronic component holding member of the second embodiment described above.

[0015] Figure 7 This schematically illustrates the structure of the grounding wiring connecting the grounding pattern and the second metal pattern in the electronic component holding member of the second embodiment described above. Figure 8 Sectional view 7-7.

[0016] Figure 8 This schematically illustrates the structure of the grounding wiring connecting the grounding pattern and the second metal pattern in the electronic component holding member of the second embodiment described above. Figure 7 Sectional view 8-8.

[0017] Figure 9This is a perspective view showing the structure in which a cable is connected to the electronic component holding member of the second embodiment described above.

[0018] Figure 10 This is a partially enlarged perspective view showing the cable connection portion in the electronic component holding member of the second embodiment described above.

[0019] Figure 11 This is a perspective view showing the first and second substrates in the electronic component holding member according to the third embodiment of the present invention, in an exploded view.

[0020] Figure 12 This is a perspective view showing the electronic component holding member of the third embodiment described above.

[0021] Figure 13 This is an exploded perspective view showing a structural example in which a bonding metal pattern for bonding with a second substrate is provided on a first substrate in the fourth embodiment of the present invention.

[0022] Figure 14 This is a diagram illustrating an example of an endoscope system equipped with an endoscope that has the electronic component holding member described in the above embodiments. Detailed Implementation

[0023] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below.

[0024] Furthermore, in the accompanying drawings, identical or corresponding elements are appropriately labeled with the same reference numerals. It should also be noted that the drawings are schematic; for the sake of simplification, the length relationships, length ratios, and quantities of elements within a drawing may sometimes differ from reality. Moreover, among multiple drawings, there may sometimes be sections where the length relationships or ratios differ from each other.

[0025] [First Implementation Method]

[0026] Figures 1 to 4 This represents the first embodiment of the present invention. Figure 1 This is a perspective view showing the first substrate 1 and the second substrate 2 in the electronic component holding member M1, exploded. Figure 2 This is a three-dimensional view of the electronic component holding member M1.

[0027] The electronic component holding member M1 includes a first substrate 1 and a second substrate 2. The first substrate 1 and the second substrate 2 are molded components formed using Molded Interconnect Devices (MID) technology. MIDs are three-dimensional molded circuit components in which wiring for circuitry is integrally formed on the surface of a three-dimensional molded article, such as an injection-molded article. By using MID technology, unlike conventional two-dimensional circuits, wiring for circuitry can be formed on inclined surfaces, vertical surfaces, curved surfaces, and through-holes within the molded body.

[0028] In this embodiment, for example, a first substrate 1 is formed using a single MID (Made-in-Depth) technique, and a second substrate 2 is disposed on the first substrate 1 by applying the MID technique a second time. However, it is not limited to this; the second substrate 2 can also be formed on the first substrate 1 using a two-color MID technique.

[0029] Therefore, the first resin molded article 11 constituting the first substrate 1 and the second resin molded article 21 constituting the second substrate 2 can be formed from the same resin material or from different resin materials. Hereinafter, the two-stage MID technology and the two-color molding MID technology used in this embodiment will be referred to as two-stage MID.

[0030] The first substrate 1 has an electronic component, a first resin molded article 11 holding the electronic component, and a first metal pattern formed on the non-planar surface of the first resin molded article 11.

[0031] In this embodiment, the electronic component is, for example, a direct-view camera module 3 (camera unit) equipped with an image sensor. The camera module 3 is, for example, a module obtained by integrating the camera optical system and the image sensor into one unit and modularizing them.

[0032] The first resin molded article 11 is formed into a three-dimensional component by injection molding. In this injection molding, a resin material containing a metal catalyst is heated to soften it, and injection pressure is applied to press the resin material into a first mold. In this embodiment, the first resin molded article 11 is generally cylindrical in shape and has an L-shaped cutout 11a for accommodating the camera module 3, a semi-circular recessed step portion 11b formed on the base end side of the L-shaped cutout 11a, and a disc-shaped portion 11c formed on the front end side of the L-shaped cutout 11a. A first metal pattern is formed on the surface of the semi-circular recessed step portion 11b, including the cylindrical surface (non-planar).

[0033] The surface of the first resin molded article 11 is patterned and the metal catalyst is activated by irradiating it with a laser. Electroless plating is then performed to metallize only the activated portion (for example, by providing a nickel plating layer on a copper plating layer), forming a first metal pattern. In this embodiment, the first metal pattern includes signal patterns 12 and 13 for signal transmission with the camera module 3 and a grounding pattern 14. Hereinafter, the signal patterns 12 and 13 and the grounding pattern 14 will be appropriately referred to together as the first metal patterns 12, 13, and 14.

[0034] In the illustrated example, signal pattern 12 is a single-line pattern, and signal pattern 13 is a multi-line pattern, comprising a first pattern 13a and a second pattern 13b. Signal pattern 12 is used, for example, to transmit a single-ended signal. Signal pattern 13 is used, for example, to transmit a differential signal. Furthermore, for simplicity, only one signal pattern 12 and one set of signal patterns 13 are illustrated here, but in practice, multiple patterns or sets are provided, with grounding patterns 14 positioned between them. The same simplification or further simplification is applied in other embodiments described below.

[0035] First metal patterns 12, 13, and 14 extend from the semi-circular recessed step portion 11b into the L-shaped cutout 11a, and the camera module 3 is mounted on the pads (not shown) at the ends of the first metal patterns 12, 13, and 14. Thus, the first resin molded article 11 holds the camera module 3. Furthermore, a hole is provided in the disc-shaped portion 11c, through which light from the inspected object enters the camera module 3.

[0036] A first substrate 1, on which the first metal patterns 12, 13, and 14 are formed and a camera module 3 is installed, is placed into a second mold, and a second resin molded article 21 is injection molded. In the injection molding of the second resin molded article 21, a resin material containing a metal catalyst is heated to soften it, and injection pressure is applied to press the resin material into the second mold, filling the L-shaped cut 11a and the semi-circular concave step portion 11b to form a three-dimensional shape.

[0037] The L-shaped cutout 11a and the semi-circular recessed step portion 11b of the first substrate 1, on which the second resin molded article 21 is disposed, are covered, and the first substrate 1 is generally cylindrical. It should be noted that in Figure 1 In the illustration, for ease of illustration, the portion 2b corresponding to the L-shaped cutout 11a and the portion 2a corresponding to the semi-circular concave step portion 11b of the second substrate 2 are shown separately, but in reality, the portions 2a and 2b are integrally formed.

[0038] The surface of the second resin molded article 21, including the non-planar part, is patterned by irradiating with a laser and the metal catalyst is activated. Electroless plating is then performed, and only the activated part is metallized (for example, a nickel plating layer is provided on a copper plating layer) to form a second metal pattern 22. In this embodiment, the second metal pattern 22 is configured to shield the ground layer (GND layer) of the first metal patterns 12, 13, and 14.

[0039] The second metal pattern 22, which is in the form of a surface, is formed to overlap at least a portion of the first metal patterns 12, 13, and 14 through the second resin molded article 21.

[0040] Specifically, in the width direction of the wiring of the first metal patterns 12, 13, 14 (in this embodiment, the circumferential direction of the cylindrical electronic component holding member M1), the second metal pattern 22 is set to the width of the entire overlap between the wiring of the second resin molded article 21 and the wiring of the first metal patterns 12, 13, 14.

[0041] Furthermore, in the wiring direction of the first metal patterns 12, 13, 14 (in the example of this embodiment, the axial direction of the cylindrical electronic component holding member M1), the second metal pattern 22 is set to a length that overlaps with at least a portion of the first metal patterns 12, 13, 14 across the second resin molded article 21.

[0042] That is, it can also be, for example, Figure 2 As shown, a second metal pattern 22 is formed in a manner that does not overlap with the ends of the first metal patterns 12, 13, and 14 at their base ends, and is connected to the ends of the first metal patterns 12, 13, and 14 by a signal cable or the like (see also...). Figure 9 , Figure 10 wait).

[0043] Alternatively, if the connection between the first metal patterns 12, 13, 14 and the signal cable, etc., is made through another connector, the second metal pattern 22 can also be formed in such a way that it completely overlaps with the first metal patterns 12, 13, 14.

[0044] Thus, the second substrate 2 has a second resin molded article 21 and a second metal pattern 22.

[0045] Grounding pattern 14 and second metal pattern 22 are connected via grounding wiring 23. Figure 2 In the structural example shown, the grounding wiring 23 is formed as part of the second metal pattern 22 on the surface of the second resin molded article 21 and is integral with the second substrate 2. The grounding wiring 23 is connected to the grounding pattern 14 by plating the second metal pattern 22, which has different layers, in a manner that overlaps with the grounding pattern 14 when the second metal pattern 22 is formed.

[0046] However, it is not limited to this structure. The grounding wiring 23 can be constructed by soldering or by wiring. Therefore, the grounding wiring 23 can also be separate from the second substrate 2.

[0047] Figure 3 This is a cross-sectional view showing an example of a structure in which wiring is provided at the corner 11x of the first substrate 1.

[0048] A metal pattern 12x is provided at the corner 11x of the first resin molded article 11 in the first substrate 1, and a metal pattern 12y is provided at the flat portion 11y of the first resin molded article 11. The metal patterns 12x and 12y on the first resin molded article 11 are formed simultaneously using a single MID (Made in Distributed Identification) technique. In this way, by using the MID technique, it is possible to provide the metal pattern 12x at the corner 11x, which is difficult to do in conventional printed wiring boards.

[0049] Furthermore, by using MID technology a second time, a second substrate 2 having a second resin molded article 21 and a second metal pattern 22 is formed on the first substrate 1. The second metal pattern 22 is formed on the surface of the second resin molded article 21, including the corner portion 21, in a manner that overlaps with the metal patterns 12x and 12y, separated from the second resin molded article 21.

[0050] The metal pattern 12x and the second metal pattern 22, which are opposite each other and separated by the second resin molded article 21, constitute a first capacitor, and the metal pattern 12y and the second metal pattern 22, which are opposite each other and separated by the second resin molded article 21, constitute a second capacitor.

[0051] Adjusting the metal pattern 12x using MID technology Figure 3 The width of the first capacitor (the area of ​​the metal pattern 12x when viewed in three dimensions) and the thickness of the second resin molded article 21 (the distance between the metal pattern 12x and the second metal pattern 22) can control the capacitance of the first capacitor.

[0052] Similarly, by utilizing MID technology to adjust the 12y of the metal pattern Figure 3 The width of the second capacitor (the area of ​​the metal pattern 12y when viewed in three dimensions) and the thickness of the second resin molded article 21 (the distance between the metal pattern 12y and the second metal pattern 22) can control the capacitance of the second capacitor.

[0053] In addition, Figure 1 and Figure 2 In this case, the thickness of the second resin molded article 21 corresponds to the thickness of the portion 2a of the second substrate 2 that corresponds to the semi-circular recessed step portion 11b. At this time, by further adjusting the relative permittivity of the resin material used for the second resin molded article 21, the capacitance of the first capacitor and the second capacitor can be controlled with a wider adjustment range.

[0054] In this way, the electronic component holding member M1 formed by the two-stage MID can perform impedance control on wiring (e.g., wiring based on the metal pattern 12x set at the corner 11x) located outside the plane (curved surface, etc.) of the three-dimensional structure, which is impossible to achieve in conventional printed wiring boards and also impossible to achieve by one-stage MID. As a result, the signal transmission characteristics can be controlled and signal degradation can be suppressed.

[0055] for Figure 1 and Figure 2 The camera module 3 shown is used appropriately. Figure 3 The diagram shows the structure and impedance control technique for wiring at the corner 11x.

[0056] Figure 4 This is a schematic diagram illustrating the structure connecting grounding pattern 14 to the DC power supply line 36 containing ground (GND). Electronic component holding member M1 is as follows... Figure 2 It is cylindrical in shape as shown, but... Figure 4 In the middle, it is displayed schematically in a planar manner.

[0057] As described above, the grounding pattern 14 and the second metal pattern 22 are connected by the grounding wiring 23, and then connected to the DC power line 36 containing the ground wire (GND).

[0058] Grounding patterns 14a and 14b are provided on the surface of the first resin molded article 11, separated by the first metal pattern 12. Furthermore, grounding patterns 14b and 14c are provided on the surface of the first resin molded article 11, separated by the first metal pattern 13. This suppresses crosstalk between the first signal transmitted in the first metal pattern 12 and the second signal transmitted in the first metal pattern 13.

[0059] Furthermore, the second metal pattern 22 is formed to overlap with the first metal patterns 12, 13, and 14 through the second resin molded article 21. The first signal transmitted in the first metal pattern 12 and the second signal transmitted in the first metal pattern 13 are propagated through capacitive coupling between the first metal pattern 12 and the first metal pattern 13 and the second metal pattern 22 connected to the ground wire, etc., thus reducing the radiated noise from the first metal pattern 12 and the first metal pattern 13.

[0060] Furthermore, the first signal transmitted in the first metal pattern 12 and the second signal transmitted in the first metal pattern 13 exhibit increased resistance to noise from external factors, i.e., higher immunity. This allows for signal transmission at a higher clock speed, increasing the amount of information transmitted per unit time and enabling high-speed signal transmission.

[0061] An electronic component holding member M1, on which the aforementioned camera module 3 is mounted, is, for example, suitable for the front end 52a of the endoscope 51 (see reference). Figure 14 ).

[0062] According to this first embodiment, first metal patterns 12, 13, and 14 are formed on the non-planar surface of the first resin molded article 11, and a second resin molded article 21 is disposed on the first substrate 1. A second metal pattern 22 is formed on the non-planar surface of the second resin molded article 21 in such a way that it overlaps with at least a portion of the first metal patterns 12, 13, and 14. The grounding pattern 14 and the second metal pattern 22 are connected by a grounding wiring 23. Therefore, a three-dimensional electronic component holding member M1 with strong noise immunity and high-speed signal transmission capability can be obtained.

[0063] Furthermore, by fully overlapping the second metal pattern 22 with the first metal patterns 12, 13, and 14, the interference immunity can be further improved.

[0064] When the grounding wiring 23 is formed as part of the second metal pattern 22 on the surface of the second resin molded article 21 and becomes integral with the second substrate 2, no additional wiring connection process is required, which can reduce manufacturing costs.

[0065] Furthermore, by setting the electronic component mounted on the electronic component holding member M1 as the camera module 3, a small electronic component holding member M1 can be obtained, which is capable of high-speed transmission of signals suitable for the camera module 3 and has strong noise immunity.

[0066] [Second Implementation]

[0067] Figures 5 to 10 This represents the second embodiment of the present invention. Figure 5 This is a perspective view showing the first substrate 1A and the second substrate 2A in the electronic component holding member M2, as exploded. Figure 6 This is a perspective view showing the electronic component holding member M2. In this second embodiment, the same reference numerals are used for the parts that are the same as in the first embodiment, and descriptions are appropriately omitted; mainly, only the differences are described.

[0068] The electronic component holding member M2 includes a first substrate 1A and a second substrate 2A formed by a two-stage MID (Multi-Installation and Deposition) technology, with the second substrate 2A disposed on the first substrate 1A. The shape of the electronic component holding member M2 in this embodiment differs from that of the electronic component holding member M1 in the first embodiment.

[0069] The first substrate 1A has an electronic component, a first resin molded article 11A holding the electronic component, and a first metal pattern formed on the non-planar surface of the first resin molded article 11A.

[0070] The first resin molded article 11A is formed into a three-dimensional shape by injection molding, having a first semi-cylindrical cutout 11Aa for accommodating a camera module 3A (camera unit), a disc-shaped portion 11Ac formed at the base end of the first semi-cylindrical cutout 11Aa, and a second semi-cylindrical cutout 11Ab formed at the base end of the disc-shaped portion 11Ac. The first semi-cylindrical cutout 11Aa is a shape obtained by cutting off, for example, the left half of a cylinder, and the second semi-cylindrical cutout 11Ab is a shape obtained by cutting off, for example, the upper half of a cylinder. The axially parallel cut plane 11Aa1 of the first semi-cylindrical cutout 11Aa and the axially parallel cut plane 11Ab1 of the second semi-cylindrical cutout 11Ab are, for example, perpendicular to each other.

[0071] A camera module 3A (electronic component) equipped with an image sensor and an image optics system is installed in the first semi-cylindrical cutout 11Aa. The camera module 3A in this embodiment can be a direct-view type, but it can also be a side-view type equipped with a reflective optics system, for example.

[0072] A first metal pattern electrically connected to the camera module 3A is formed on the surface of the first resin molded article 11A. Furthermore, in this embodiment, the illustration of the signal pattern 13 is omitted compared to the first embodiment; instead, the signal pattern 12 and the grounding pattern 14 are illustrated as the first metal patterns. However, the signal pattern 13 can certainly be provided. Hereinafter, the signal pattern 12 and the grounding pattern 14 will be appropriately referred to together as the first metal patterns 12 and 14.

[0073] The first metal patterns 12 and 14 are formed such that the portion of the pad (not shown) on which the camera module 3A is mounted in the first semi-cylindrical cut 11Aa passes through the peripheral surface 11Ac1 of the disc-shaped portion 11Ac and the peripheral surface 11Ab2 of the second semi-cylindrical cut 11Ab to the cutting plane 11Ab1 of the second semi-cylindrical cut 11Ab.

[0074] The second substrate 2A has a second resin molded article 21A and a second metal pattern 22A.

[0075] The second resin molded article 21A is formed by injection molding into a curved plate shape, becoming a three-dimensional shape covering the following portions: the portion of the first metal patterns 12, 14 formed on the peripheral surface 11Ac1 of the disc-shaped portion 11Ac; the portion of the first metal patterns 12, 14 formed on the peripheral surface 11Ab2 of the second semi-cylindrical cutout 11Ab; and at least a portion of the cut plane 11Ab1 of the second semi-cylindrical cutout 11Ab.

[0076] On the outer surface of the second resin molded article 21A, a second metal pattern 22A is formed in such a way that it overlaps with the first metal patterns 12 and 14 covered by the second resin molded article 21A. The second metal pattern 22A is configured as a grounding layer that shields at least a portion of the first metal patterns 12 and 14.

[0077] Figure 7 This schematically illustrates the structure of the grounding wiring 23 in the electronic component holding member M2, which connects the grounding pattern 14 and the second metal pattern 22A. Figure 8 Sectional view 7-7, Figure 8 This schematically illustrates the structure of the grounding wiring 23 in the electronic component holding member M2, which connects the grounding pattern 14 and the second metal pattern 22A. Figure 7 Sectional view 8-8.

[0078] Grounding pattern 14 and second metal pattern 22A are connected via grounding wiring 23. Figure 7 and Figure 8 In the illustrated structural example, the grounding wiring 23 is formed as part of the second metal pattern 22A on the side 21A1 of the second resin molded article 21A in the thickness direction, and is integral with the second substrate 2. The grounding wiring 23 is connected to the second metal pattern 22A and the grounding pattern 14, which have different layers, by plating the second metal pattern 22A in a manner that overlaps with the grounding pattern 14 during the formation of the second metal pattern 22A. However, as described in the first embodiment, the grounding wiring 23 can be constructed by soldering or by wiring.

[0079] Figure 9 This is a perspective view showing the structure in which the electronic component retaining member M2 is connected to a cable. Figure 10 This is a partially enlarged perspective view of the cable connection portion in the electronic component holding member M2.

[0080] The signal pattern 12 and the grounding pattern 14 extend from the circumferential surface 11Ab2 to the cut plane 11Ab1 on the surface of the second semi-cylindrical cut 11Ab. After being arranged along the width direction of the cut plane 11Ab1, they bend axially to reach the axial end edge of the cut plane 11Ab1 of the second semi-cylindrical cut 11Ab.

[0081] Grounding pattern 14 may have, for example, a wide grounding pattern 14a and a grounding pattern 14b that is narrower than grounding pattern 14a but wider than signal pattern 12. Signal pattern 12 is located between grounding pattern 14a and grounding pattern 14b on each surface of the wiring path, namely the peripheral surface 11Ac1, the peripheral surface 11Ab2, and the cut plane 11Ab1.

[0082] At the axial end edge of the grounding pattern 14a, a conductor 41a consisting of a single wire is electrically connected, for example by welding.

[0083] At the axial end edge of the signal pattern 12, the core wire 42a (inner conductor) of the coaxial cable 42 is electrically connected, for example, by welding. Additionally, at the axial end edge of the grounding pattern 14b, the shield wire 42b (outer conductor) of the coaxial cable 42 is electrically connected, for example, by welding.

[0084] If a single-wire grounding wire 41 is used, the impedance can be reduced compared to using only a coaxial cable 42 for the shield wire 42b, resulting in a stable grounding potential. In this embodiment, the shield wire 42b is connected to the grounding wire 41 via the grounding pattern 14b, the grounding wire 23, the second metal pattern 22A, the grounding wire 23, and the grounding pattern 14a. Therefore, the grounding potential of the shield wire 42b is also stable. The grounding wire 41 and the shield wire 42b constitute... Figure 4 The DC power supply line 36 is shown.

[0085] An electronic component holding member M2, on which the aforementioned camera module 3A is mounted, is, for example, suitable for the front end 52a of the endoscope 51 (see reference). Figure 14 ). In the electronic component holding member M2, it is applied Figure 14 In the case of the endoscope system 5 shown, the grounding wiring 41 and the coaxial cable 42 are combined into one as the signal cable 40, and are connected to the signal processing processor 57 via the insertion part 52, the operation part 53 and the universal cable 54 of the endoscope 51 (see reference). Figure 14 ).

[0086] In addition, Figure 5 , Figure 6 , Figure 9 as well as Figure 10 The illustration shows the second substrate 2A covering a portion of the cut plane 11Ab1 of the second semi-cylindrical cut 11Ab in the width direction. However, this is for ease of understanding to represent the shape of the portion of the first metal patterns 12 and 14 that is bent axially from the width direction. Preferably, the first metal patterns 12 and 14 are covered by the second resin molded article 21A and the second metal pattern 22A until... Figure 10 The portion shown by the dashed line (excluding the portion where the grounding wiring 41 and the coaxial cable 42 are welded) constitutes the second substrate 2A.

[0087] According to this second embodiment, it is possible to achieve roughly the same effect as the first embodiment described above, and to obtain a three-dimensional electronic component holding member M2 with strong noise resistance and high-speed signal transmission capability, which is different from the electronic component holding member M1 structure described above.

[0088] In this way, when using the two-stage MID technology, a first metal pattern can be formed on a first substrate of various three-dimensional shapes, and a second substrate with a second metal pattern can be disposed on the first substrate.

[0089] [Third Implementation Method]

[0090] Figure 11 as well as Figure 12 This represents the third embodiment of the present invention. Figure 11 This is a perspective view showing the first substrate 1C and the second substrate 2C in the electronic component holding member MC, as exploded. Figure 12 This is a perspective view showing the electronic component holding member MC. In this third embodiment, the same reference numerals are used for the same parts as in the first and second embodiments described above, and descriptions are appropriately omitted; mainly, only the differences are described.

[0091] In this embodiment, the electronic component holding member MC does not mount the camera modules 3 and 3A of the above embodiments, but instead mounts an IC (Integrated Circuit) 4, such as a CPU (Central Processing Unit), MCU (Micro Controller Unit), GPU (Graphics Processing Unit), RAM (Random Access Memory), or ROM (Read Only Memory), as an electronic component. The electronic component holding member MC can also be mounted, for example, on... Figure 14 The endoscope 51 shown is located in the operation section 53, but is not limited thereto; it can be mounted on portable communication devices and various other electronic devices.

[0092] The electronic component holding member MC has a first substrate 1C and a second substrate 2C formed by two-stage MID technology, with the second substrate 2C disposed on the first substrate 1C.

[0093] The first substrate 1C has an IC4 as an electronic component; a first resin molded article 11C holding the IC4; and a first metal pattern formed on the non-planar surface of the first resin molded article 11C.

[0094] The first resin molded article 11C is formed into a three-dimensional shape by injection molding, having a rectangular convex portion 11Ca, a first shoulder portion 11Cb, a first lower step portion 11Cc, a side portion 11Cd, a second lower step portion 11Ce, and a second shoulder portion 11Cf.

[0095] The rectangular convex portion 11Ca is a rectangular portion that protrudes from the upper surface of the first resin molded article 11C.

[0096] The first shoulder 11Cb and the second shoulder 11Cf are planar parts located on both sides of the rectangular convex portion 11Ca, which are lower than the rectangular convex portion 11Ca.

[0097] The first lower step portion 11Cc and the second lower step portion 11Ce are stepped parts, having stepped side surfaces perpendicular to the first shoulder portion 11Cb and the second shoulder portion 11Cf respectively, and stepped planes parallel to the first shoulder portion 11Cb and the second shoulder portion 11Cf respectively and one level lower.

[0098] The side portion 11Cd is a side part that connects the first lower step portion 11Cc and the second lower step portion 11Ce on a side that is lower than the first lower step portion 11Cc, the rectangular convex portion 11Ca and the second lower step portion 11Ce.

[0099] The first metal pattern includes, for example, a signal pattern 12 with a single wire, a signal pattern 13 with two wires as a group, and a grounding pattern 14.

[0100] The first metal patterns 12, 13, and 14 have pads formed on the first shoulder 11Cb, and wiring extends from the pads to the first lower step 11Cc, the side portion 11Cd, the second lower step 11Ce, and the second shoulder 11Cf. IC4 is mounted on the pads of the first shoulder 11Cb.

[0101] The second substrate 2C has a second resin molded article 21C and a second metal pattern 22C.

[0102] A second resin molded article 21C is formed by injection molding on at least a portion of the first metal patterns 12, 13, 14 provided on the first shoulder portion 11Cb, the first metal patterns 12, 13, 14 provided on the first lower step portion 11Cc, the side portion 11Cd and the second lower step portion 11Ce, and at least a portion of the first metal patterns 12, 13, 14 provided on the second shoulder portion 11Cf.

[0103] Thus, the second resin molded article 21C has a first portion 21Cb disposed on the first shoulder portion 11Cb, a second portion 21Cc disposed on the first lower step portion 11Cc, a third portion 21Cd disposed on the side portion 11Cd, a fourth portion 21Ce disposed on the second lower step portion 11Ce, and a fifth portion 21Cf disposed on the second shoulder portion 11Cf.

[0104] The second metal pattern 22C is formed on the surface of the first portion 21Cb to the fifth portion 21Cf of the second resin molded article 21C in such a way that it overlaps with the first metal patterns 12 and 14 through the second resin molded article 21C.

[0105] According to this third embodiment, it can achieve roughly the same effect as the first to second embodiments described above, and can obtain a three-dimensional electronic component holding member MC that has strong noise resistance and can transmit signals at high speed while holding electronic components other than the camera module.

[0106] [Fourth Implementation Method]

[0107] Figure 13 This diagram illustrates a fourth embodiment of the present invention and is an exploded perspective view showing a structural example of a metal pattern 16 for bonding with a second substrate 2 provided on a first substrate 1. In this fourth embodiment, the same reference numerals are used to label the same parts as in the first to third embodiments described above, and descriptions are appropriately omitted; mainly, only the differences are described.

[0108] The electronic component holding member M3 of this embodiment is basically constructed in the same way as the electronic component holding member M1 of the first embodiment described above, but it is also provided with a metal pattern 16 for bonding.

[0109] In the two-stage MID technology, when the second substrate 2 is placed on the first substrate 1 formed by the first MID technology in the second application of MID technology, the bonding strength of the contact interface is sometimes weak and the contact interface may peel off, depending on the combination of the resin material forming the first resin molded article 11 and the resin material forming the second resin molded article 21.

[0110] Therefore, in this embodiment, the first substrate 1 is further provided with a bonding metal pattern 16, which is not a wiring, on the surface of the first resin molded article 11 where the first metal patterns 12, 13, and 14 are not formed. The bonding metal pattern 16 is a part used to achieve an anchoring effect by utilizing the roughness and chemical properties of the metal surface to more firmly bond the first substrate 1 and the second substrate 2.

[0111] In addition, the surfaces of the first resin molded article 11 with the first metal patterns 12, 13, and 14 already have an anchoring effect due to the roughness and chemical properties of the metal surface, so the contact interface will basically not peel off.

[0112] In addition to the bonding metal pattern 16, the surface of the first substrate 1 that contacts the second substrate 2 can be roughened by processes such as sandblasting to form fine irregularities on the surface of the first substrate 1, thereby achieving an anchoring effect. Alternatively, the bonding metal pattern 16 can be replaced by simply roughening the surface of the first substrate 1.

[0113] Alternatively, one or both of the following can be applied to the structure of the first to third embodiments described above: setting a bonding metal pattern on the surface of the first resin molded article and roughening the surface of the first substrate.

[0114] According to this fourth embodiment, since at least one of setting the bonding metal pattern 16 on the surface of the first resin molded article 11 and roughening the surface of the first substrate 1 is performed, the bonding strength between the first substrate 1 and the second substrate 2 can be improved while achieving the same impedance control as in the first to third embodiments described above.

[0115] then, Figure 14 This is a diagram showing an example of an endoscope system 5 equipped with an endoscope, which is equipped with electronic component holding members M1 to M3 and MC of the above embodiments.

[0116] like Figure 14 As shown, the endoscope system 5 includes an endoscope 51, a processor 57, a light source device 58, and a monitor 59.

[0117] The endoscope 51 includes an elongated insertion section 52 that is inserted into a subject, an operating section 53 that is continuously disposed at the base of the insertion section 52, and a universal cable 54 extending from the operating section 53. Furthermore, the subject into which the insertion section 52 is inserted can be a living organism such as a human or animal, or a non-living object such as machinery or a building.

[0118] The insertion part 52 is provided with a front end 52a, a bending part 52b and a flexible tube part 52c in sequence from the front end side to the base end side.

[0119] The endoscope 51 is configured as an electronic endoscope, and its front end 52a is provided with any one of the electronic component holding members M1 to M3 of the above embodiments, which are equipped with an image module. When the insertion part 52 is inserted into the body cavity of the subject, the image module of the electronic component holding member M1 to M3 captures an image of the body cavity of the subject and outputs an image signal.

[0120] The bending portion 52b is configured to be able to bend in two directions or in four directions: up, down, left, and right. The bending portion 52b bends due to the bending operation in the operating portion 53. When the bending portion 52b bends, the direction of the front end portion 52a changes, and the observation direction of the camera module of the electronic component holding members M1 to M3 changes. Furthermore, the bending portion 52b is also bent to improve the insertability of the insertion portion 52 within the subject. While an endoscope 51 with the bending portion 52b is given here as an example, the endoscope 51 may also be of a type without the bending portion 52b.

[0121] The flexible tube portion 52c is a soft tube portion that flexes according to the shape of the subject into which the insertion portion 52 is inserted. Here, as an example of endoscope 51, a flexible endoscope having the flexible tube portion 52c is described, but endoscope 51 can also be a rigid endoscope having a non-flexible, rigid tube portion. ISO 8600-1:2015 defines, for example, rigid and flexible endoscopes in the medical field.

[0122] The operating section 53 is continuously disposed on the base end side of the insertion section 52, and is the part used for various operations related to the endoscope 51 by hand. The operating section 53 includes, for example, a bending operating lever for bending the bending section 52b, an air / water supply button, a suction button, and a push-button switch, among other operating buttons. The air / water supply button, for example, is used to supply gas or liquid through an air / water supply channel (not shown) and from a nozzle located at the front end 52a to a glass cover located at the front end of the camera module. The suction button, for example, is used to suction from the front end 52a side through a treatment instrument channel. The push-button switch, for example, is mainly used for operations related to imaging.

[0123] Furthermore, a treatment instrument insertion port 53a is provided at the front end of the operating section 53. The treatment instrument insertion port 53a is an opening at the base end of the treatment instrument channel, and an opening at the front end of the treatment instrument channel (not shown) is provided at the front end 52a. Treatment instruments such as biopsy forceps and high-frequency snares are inserted into the treatment instrument channel to treat the subject.

[0124] The universal cable 54 is a connecting cable used to connect the endoscope 51 to the light source device 58 and the processor 57. A connector 54a is provided at the extended end of the universal cable 54. The universal cable 54 is connected to the light source device 58 using the connector 54a.

[0125] A coiled cable 54b extends from connector 54a, and connector 54c, located at the extension end of cable 54b, is connected to processor 57.

[0126] Furthermore, a signal cable 40, including the aforementioned grounding wiring 41 and coaxial cable 42, is connected to the camera module of the electronic component holding members M1 to M3 within the front end 52a. The signal cable 40 is connected to the processor 57 and the light source device 58 via the insertion part 52, the operation part 53, and the universal cable 54 (including connector 54a, cable 54b, and connector 54c). The processor 57 sends drive signals for driving the camera module via the signal cable 40. The camera signal output from the camera module is sent to the processor 57 via the signal cable 40.

[0127] Alternatively, an electronic component holding member MC, which houses the aforementioned IC4, can be installed within, for example, the operation section 53 of the endoscope 51. In this case, the signal cable 40 is also connected to the IC4 of the electronic component holding member MC, and the IC4 is connected to the processor 57 and the light source device 58.

[0128] Furthermore, a light guide (not shown) is provided within the insertion section 52, operation section 53, and universal cable 54 of the endoscope 51. The light guide transmits illumination light emitted from the light source device 58 to an illumination optical system provided at the front end 52a of the insertion section 52. The illumination optical system illuminates the subject with illumination light.

[0129] The processor 57 controls the endoscope system 5 as a whole, and processes the camera signals received via the signal cable 40 to generate displayable image signals and output them to the monitor 59.

[0130] Monitor 59 displays endoscopic images based on image signals output from processor 57.

[0131] Furthermore, the processor 57 and the light source device 58 are not limited to being separate components, but can also be integrated as one unit. Additionally, the structure is not limited to emitting illumination light from the light source device 58; it can also be a structure in which a light-emitting element such as an LED is provided at the front end 52a of the insertion portion 52, and illumination light is emitted from the light-emitting element by supplying power.

[0132] Furthermore, the present invention is not limited to the original embodiments described above, and can be further modified and embodied by adapting the constituent elements without departing from its spirit during the implementation phase. In addition, various inventive methods can be formed by appropriately combining the multiple constituent elements disclosed in the above embodiments. For example, several constituent elements may be deleted from all the constituent elements shown in the embodiments. Furthermore, constituent elements of different embodiments may be appropriately combined. Thus, various modifications and applications are naturally possible without departing from the spirit of the invention.

Claims

1. An electronic component holding member, characterized in that, The electronic component holding member includes: A first substrate having an electronic component, a first metal pattern, and a first resin molded article holding the electronic component, the first metal pattern being formed on a non-planar surface of the first resin molded article, the first metal pattern including a grounding pattern and a signal pattern for signal transmission with the electronic component. A second substrate having a second metal pattern and a second resin molded article disposed on the first substrate, the second metal pattern being formed on a non-planar surface of the second resin molded article in such a way that it overlaps at least a portion of the first metal pattern with the second resin molded article, and the first metal pattern and the second metal pattern overlapping each other with the second resin molded article forming a capacitor structure with the second resin molded article as the dielectric; and A grounding wiring connection is provided, which connects the grounding pattern and the second metal pattern.

2. The electronic component holding member according to claim 1, characterized in that, The second substrate is configured such that the second metal pattern completely overlaps with the first metal pattern.

3. The electronic component holding member according to claim 1, characterized in that, The grounding wiring is formed on the surface of the second resin molded article as part of the second metal pattern and is integral with the second substrate.

4. The electronic component holding member according to claim 1, characterized in that, The first substrate also has a bonding metal pattern, which is disposed on the surface of the first resin molded article where the first metal pattern is not formed, to bond the first substrate to the second substrate.

5. The electronic component holding member according to claim 1, characterized in that, The electronic component is a camera module with an imaging element.

6. An endoscope, characterized in that, The endoscope is equipped with an electronic component holding member, which includes: A first substrate having an electronic component, a first metal pattern, and a first resin molded article holding the electronic component, the first metal pattern being formed on a non-planar surface of the first resin molded article, the first metal pattern including a grounding pattern and a signal pattern for signal transmission with the electronic component. A second substrate having a second metal pattern and a second resin molded article disposed on the first substrate, the second metal pattern being formed on a non-planar surface of the second resin molded article in such a way that it overlaps at least a portion of the first metal pattern with the second resin molded article, and the first metal pattern and the second metal pattern overlapping each other with the second resin molded article forming a capacitor structure with the second resin molded article as the dielectric; and A grounding wiring connection is provided, which connects the grounding pattern and the second metal pattern.

7. The endoscope according to claim 6, characterized in that, The second substrate is configured such that the second metal pattern completely overlaps with the first metal pattern.

8. The endoscope according to claim 6, characterized in that, The grounding wiring is formed on the surface of the second resin molded article as part of the second metal pattern and is integral with the second substrate.

9. The endoscope according to claim 6, characterized in that, The first substrate also has a bonding metal pattern, which is disposed on the surface of the first resin molded article where the first metal pattern is not formed, to bond the first substrate to the second substrate.

10. The endoscope according to claim 6, characterized in that, The electronic component is a camera module with an imaging element.

Images