Inlet nozzle assembly for abatement apparatus

Abstract

An inlet nozzle assembly, abatement apparatus, and method are disclosed. The inlet nozzle assembly is for use in an abatement apparatus for processing an effluent stream from a semiconductor processing tool, the inlet nozzle assembly comprising: an inlet nozzle configured to deliver the effluent stream to an abatement chamber; a head defining an orifice for receiving the inlet nozzle; and an insulating mount configured to hold the inlet nozzle within the orifice. In this way, a thermal path between the inlet nozzle and the head is interrupted by the insulating mount, which helps to prevent the inlet nozzle from being cooled by the head, thereby helping to prevent condensate from building up on the inlet nozzle as powder or particulate.

Description

Technical Field

[0001] The present invention relates to inlet nozzle assemblies, attenuation devices, and methods. Background Technology

[0002] Mitigation devices, such as radiant burners or other types of mitigation equipment, are known and are typically used to treat effluent gas streams from manufacturing tools used, for example, in the semiconductor or flat panel display manufacturing industry. During such manufacturing, residual perfluorinated compounds (PFCs) and other compounds are present in the effluent gas stream pumped from the processing tools. PFCs are difficult to remove from the effluent gas, and their release into the environment is undesirable because they are known to have relatively high greenhouse activity.

[0003] Known radiant burners utilize combustion to remove PFCs and other compounds from the effluent gas stream, as described in EP0694735. Typically, the effluent gas stream is a nitrogen stream containing PFCs and other compounds. The effluent stream is conveyed into a combustion chamber laterally surrounded by the outlet surface of a porous gas burner. In some cases, a treatment material, such as fuel gas, may be mixed with the effluent gas stream before entering the combustion chamber. Fuel gas and air are simultaneously supplied to the porous burner to influence combustion at the outlet surface. Combustion products from the porous burner react with the effluent stream mixture to burn off the compounds in the effluent stream.

[0004] Although there are existing arrangements of abatement devices, each has its own drawbacks. Therefore, it is desirable to provide an improved arrangement for abatement devices. Summary of the Invention

[0005] According to a first aspect, an inlet nozzle assembly is provided for a reduction device used to process outflow from a semiconductor processing tool, the inlet nozzle assembly comprising: an inlet nozzle configured to deliver the outflow to a reduction chamber; a head defining an orifice for receiving the inlet nozzle; and an insulating mount configured to hold the inlet nozzle within the orifice.

[0006] The first aspect recognizes that a problem with existing inlet assemblies is their potentially short operational lifespan, which impacts performance and reduces the time between maintenance cycles. In particular, particles or powder can accumulate on the inlet nozzle assembly, potentially affecting fluid flow and even causing blockages.

[0007] Accordingly, an inlet nozzle assembly is provided. The inlet nozzle assembly can be used in a settling apparatus. The settling apparatus can handle effluent from semiconductor processing tools. The inlet assembly may include an inlet nozzle. The inlet nozzle may be configured to deliver or transfer the effluent into a settling chamber. The inlet nozzle assembly may include a head. The head may define an orifice for receiving the inlet nozzle. The inlet nozzle assembly may include an insulating mount. The insulating mount may be configured or arranged to hold the inlet nozzle within the orifice. In this way, the thermal path between the inlet nozzle and the head is interrupted by the insulating mount, which helps prevent the inlet nozzle from being cooled by the head, thus helping to prevent the formation of deposits of condensable material on the cooler portion of the inlet nozzle.

[0008] The insulating mount can be configured to surround or enclose the inlet nozzle. The insulating mount can be inserted or positioned between the inlet nozzle and the head.

[0009] Insulating mounts can be constructed or arranged to space the inlet nozzle from or position it away from the head. Spacing it from the head helps to suppress the heat path.

[0010] Insulating mounts may include multiple protrusions, members, or fingers configured or arranged to contact the inlet nozzle. Protrusions help reduce the contact area, which helps suppress heat paths.

[0011] The protrusion can extend from the facing surface of the insulating mount to space the inlet nozzle away from or position it away from the facing surface.

[0012] Insulating mounting elements can define purge ducts. These ducts can be constructed or arranged to transfer or deliver purge gas from a purge gas feeder to a purge gas filling chamber in the head. Therefore, insulating mounting elements can serve a dual purpose.

[0013] The inlet nozzle may include an outflow nozzle for conveying or transferring outflow material. The inlet nozzle may also include a concentric combustion reagent nozzle for conveying or transferring combustion reagent. An insulating mounting may define a combustion reagent conduit. The combustion reagent conduit may be configured to transfer or deliver combustion reagent from a combustion reagent feeding device to the concentric combustion reagent nozzle.

[0014] The concentric combustion reagent nozzle can surround the outflow material nozzle.

[0015] The inlet nozzle may include an upstream inlet portion. The upstream inlet portion may define an inlet chamber. The inlet chamber may receive the outflow material. The inlet nozzle may include a downstream conveying portion. The downstream conveying portion may define a conveying chamber. The conveying chamber may convey or transfer the outflow material to a reduction chamber. The upstream inlet portion may be configured to be spaced apart from or located away from the head. Spaced apart from the head helps to suppress the heat path.

[0016] The upstream inlet section can be configured to be spaced apart from or located away from the head by an insulating mounting.

[0017] The upstream inlet portion can be constructed or arranged to be spaced apart from or located away from the upstream surface of the head.

[0018] Insulating mounting components may include thermally insulating materials.

[0019] Insulating mounting components can have a lower thermal conductivity than the inlet nozzle and / or head.

[0020] According to the second aspect, a reduction device including the inlet nozzle assembly of the first aspect is provided.

[0021] The reduction equipment may include the features of the inlet nozzle assembly described above.

[0022] According to a third aspect, a method is provided, comprising: defining an orifice in a head for receiving an inlet nozzle for conveying outflow material into a reduction chamber; and securing the inlet nozzle within the orifice using an insulating mounting member.

[0023] The method may include surrounding the inlet nozzle with an insulating mounting.

[0024] The method may include inserting an insulating mounting element between the inlet nozzle and the head.

[0025] The method may include using an insulating mounting to space the inlet nozzle from the head.

[0026] The method may include contacting the inlet nozzle with multiple protrusions of the insulating mounting.

[0027] The method may include extending a protrusion from the facing surface of the insulating mount to space the inlet nozzle from the facing surface.

[0028] The method may include defining a purge duct in the mounting, the purge duct being configured to transfer purge gas from a purge gas feeder to a purge gas filling chamber in the head.

[0029] The method may include: providing an effluent nozzle for conveying an effluent stream and a concentric combustion reagent nozzle for conveying a combustion reagent to an inlet nozzle; and defining a combustion reagent conduit configured to transfer the combustion reagent from a combustion reagent feeding device to the concentric combustion reagent nozzle.

[0030] The method may include surrounding the outflow nozzle with concentric burning reagent nozzles.

[0031] The method may include: defining an inlet chamber for receiving outflow material using an upstream inlet portion of an inlet nozzle and a conveying chamber for conveying outflow material into a reduction chamber using a downstream conveying portion of the inlet nozzle; and spaced the upstream inlet portion from the head.

[0032] The method may include using insulating mounting elements to space the upstream inlet portion from the head.

[0033] The method may include separating the upstream inlet portion from the upstream surface of the head.

[0034] The method may include forming an insulating mounting component from a thermally insulating material.

[0035] The method may include selecting an insulating mounting element that has a lower thermal conductivity than at least one of the inlet nozzle and the head.

[0036] Further specific and preferred aspects are set forth in the appended independent and dependent claims. Features of the dependent claims may be suitably combined with features of the independent claims, and in combinations other than those expressly set forth in the claims.

[0037] When a device feature is described as operable to provide a function, it should be understood that this includes device features that provide that function or are adapted or constructed to provide that function. Attached Figure Description

[0038] Embodiments of the present invention will now be described in further detail with reference to the accompanying drawings, in which:

[0039] Figure 1 It passes through the front cross-section of the inlet component for the reduction device according to one embodiment;

[0040] Figure 2 Is it through Figure 1 The side cross-section of the inlet component;

[0041] Figure 3 Is it through Figure 1 Exploded perspective view of the front cross section of the entrance component;

[0042] Figure 4 It is through the front cross-section of the inlet assembly for the reduction device according to one embodiment; and

[0043] Figure 5 Is it through Figure 4 A perspective view of the front cross-section of the entrance component.

[0044] Figure Labels

[0045] Equipment 10; 10A

[0046] Installation part 50

[0047] Downstream surface 55

[0048] Inlet nozzle 60; 60A

[0049] Entrance section 63

[0050] Flange 65; 835

[0051] Conveying section 67

[0052] Reagent nozzle 830; 830A

[0053] Insulating mounting parts 900; 900A

[0054] Inlet port 910

[0055] 915A protrusion

[0056] Upstream section 920

[0057] Downstream section 930

[0058] Upstream top plate 940

[0059] Upstream holding edge 960; 980

[0060] 970 protrusions

[0061] Reagent inlet 990

[0062] Purge inlet 993

[0063] Reagent tubing 995

[0064] Circular Corridor 997 Detailed Implementation

[0065] Before discussing the embodiments in more detail, an overview will first be provided. Some embodiments provide an arrangement that thermally insulates the outflow inlet nozzle (and typically the reagent inlet nozzle) from the mount or head to reduce the cooling effect of the mount or head on the inlet nozzle, thereby helping to prevent the accumulation of condensate, powder, or particles on the inlet nozzle. In particular, the head or mount typically has a high thermal mass, which would otherwise tend to cool the inlet nozzle, potentially causing compounds in the outflow to condense near the inlet nozzle. This results in the accumulation of particulate material or powder, which may affect fluid flow in the inlet nozzle and / or downstream combustion chamber and / or may cause bridging or blockage, thus affecting the performance of the decompression device. Providing an insulating mount that interrupts or reduces the thermal path between the inlet nozzle and the head or mount helps to reduce the cooling effect of the head or mount on the inlet nozzle. Typically, the insulating mount is formed of a thermally insulating material having a lower thermal conductivity than the outflow inlet and / or the head or mount. In addition, insulating mounts are typically shaped or sized to space the inlet nozzle components from the head or mount in order to avoid direct contact between these components and / or reduce the contact area between these components and the insulating mount.

[0066] Entry Components - First Layout

[0067] Figure 1 It is the front cross section passing through the inlet component of the reduction device 10 according to one embodiment. Figure 2 It is the side cross-section passing through the inlet component. Figure 3 This is an exploded perspective view through the front cross-section of the inlet assembly. A mounting member 50 is provided, which is attached to the housing (not shown) of the combustion chamber module on its downstream surface 55. The combustion chamber module typically includes a porous sleeve housed within the housing. The porous sleeve within the housing defines the combustion chamber. The mounting member 50 defines an inlet orifice 910 for receiving an inlet nozzle 60. In this embodiment, the inlet nozzle 60 has an elongated oval cross-section. However, it should be understood that other shapes of the inlet nozzle 60 are also possible, such as inlet nozzles with circular or other cross-sections. The inlet nozzle 60 has an upstream inlet portion 63 attached to an effluent source and a downstream delivery portion 67 for conveying the effluent to the combustion chamber.

[0068] An insulating mount 900 is located within the inlet orifice 910. The insulating mount is made of a material with a lower thermal conductivity than the inlet nozzle 60 and / or mount 50. The insulating mount 900 has an upstream portion 920 and a downstream portion 930. The upstream portion 920 abuts against the upstream top plate 940 of the mount 50. The insulating mount 900 is held in place against the upstream top plate 940 by a retainer 950. The upstream portion 920 defines an upstream holding edge 960 extending radially within the orifice 910. The upstream portion 920 may be wetted by the processing and is therefore typically chemically compatible, and may be made of filled PTFE (glass-filled or mica-filled) with an operating temperature up to 260°C. The downstream portion 930 does not require chemical compatibility and may be made of polyamide-imide (PAI) or polyetheretherketone (PEEK). The retaining edge 960 mates with the radially extending flange 65 on the conveying section 67 to hold the inlet nozzle 60 in place within the mounting 50. An annular protrusion 970, erected from the upstream surface of the upstream section 920, spacees the radially outer surface of the conveying section 67 from the radially inner surface of the orifice 910. Furthermore, the conveying section 67 and the insulating mounting 900 are dimensioned to prevent contact between the downstream surface of the inlet section 63 and the upstream surface of the mounting 50. In other words, the inlet section is slightly raised to provide a clearance between the inlet section 63 and the mounting 50.

[0069] Therefore, it can be seen that the insulating mounting 900 prevents contact between the inlet nozzle 60 and the mounting 50, and a low thermal conductivity material is inserted between the inlet nozzle 60 and the mounting 50. This helps to reduce the thermal path between the inlet nozzle 60 and the mounting 50, which helps to prevent the inlet nozzle 60 from being cooled by the mounting 50 and reduces the accumulation of condensate on the inlet nozzle 60.

[0070] The downstream portion 930 also has a radially extending upstream retaining edge 980 that receives a radially extending flange 835 at the upstream end of the reagent nozzle 830 (extending to the exhaust port of the delivery portion 67), the flange 835 surrounding a portion of the outer surface of the delivery portion 67. This spacees the reagent nozzle 830 from the inlet nozzle 60 and prevents contact between the reagent nozzle 830 and the mounting member 50, where a low thermal conductivity material is inserted. This helps to reduce the thermal path between the reagent nozzle 830 and the mounting member 50, which helps to prevent the reagent nozzle 830 from being cooled by the mounting member 50 and reduces the accumulation of condensate on the reagent nozzle 830.

[0071] The insulating mount 900 has a reagent inlet 990 that receives reagents and transfers them via a reagent conduit 995 to an annular channel 997 in fluid communication with the upstream end of the reagent nozzle 830. Therefore, any reagent to be supplied to the combustion chamber is transferred through the insulating mount 900 to the reagent nozzle 830 for delivery into the combustion chamber, surrounding the outflow stream.

[0072] The insulating mounting 900 has a purge inlet 993 that receives purge gas and transmits it to the mounting 50 to provide positive pressure within the mounting 50 using inert gas, thereby preventing gas backflow into the mounting 50.

[0073] Entrance Components - Second Layout

[0074] Figure 4 and Figure 5 The illustration shows an inlet assembly for a heat reduction device 10A according to one embodiment, which is similar to the arrangement described above. In this arrangement, an insulating mount 900A is provided, which receives an inlet nozzle 60A and supports a concentric reagent nozzle 830A. In this arrangement, the insulating mount 900A has a set of protrusions 915A that contact the inlet nozzle 60A and space it from the insulating mount 900A to further reduce the contact between the inlet nozzle 60A and the insulating mount 900A, thereby further weakening the heat path. It should be understood that similar protrusions can be incorporated into the above references. Figures 1 to 3 The layout is described.

[0075] Some embodiments provide an arrangement for reducing heat transfer between the inlet system and the head of a heat / combustion reduction system to minimize the deposition of condensable byproducts. In such a heat / combustion-based reduction system, the gas to be treated typically enters the combustion chamber via one or more nozzles (with an inlet assembly on top). Some components may include flow control devices and / or auxiliary inlets. Some processes (e.g., aluminum etching, LPCVD nitride, PECVD nitride) may produce condensable byproducts such as AlCl3, NH4Cl, and (NH4)2SiF6. The nozzles are typically housed in a register in the head or mount, and similarly, the inlet structure is typically fixed to the head or mount. Thus, if the inlet structure is in mechanical and therefore thermal contact with the head or mount, which can be used as a radiator, this can cool these structures to a point where condensation can occur. Therefore, in some embodiments, the head is designed to minimize thermal contact with the nozzle(s). In some embodiments, independent registration features made of a material with the lowest thermal conductivity are provided. In some embodiments, the registration features are modified to reduce contact with the nozzles. In some embodiments, a combination of a low thermal conductivity insulating mount and a long thermal path is used to increase the overall resistance to heat transfer. The inlet assembly is typically designed not to directly contact the head, but rather to reside within the locator and be held in place by a retainer of the insulating mount. The mating surfaces of the inlet assembly are supported on an elastomer for sealing and directly on the top surface of the nozzle to limit compression of the elastomer seal. Typically, the nozzle is made of a corrosion-resistant material such as Inconel 600 or ANC16, both of which have relatively low thermal conductivity than other nozzle materials (although these materials still have higher thermal conductivity than the insulating mount). The inlet temperature can be further increased by replacing the nozzle with one having higher thermal conductivity (e.g., copper). The nozzle can be connected to the inlet assembly, for example, by brazing. The nozzle can be protected from corrosion by electroplating (e.g., electroless nickel plating). The plating thickness can be between 25 μm and 75 μm, for example, 50 μm.

[0076] Although illustrative embodiments of the invention have been disclosed in detail herein with reference to the accompanying drawings, it should be understood that the invention is not limited to the precise embodiments, and that various changes and modifications can be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims and their equivalents.

Claims

1. An inlet nozzle assembly for a reduction device for processing outflow material from semiconductor processing tools, the inlet nozzle assembly comprising: An inlet nozzle, wherein the inlet nozzle includes an upstream inlet portion and a downstream conveying portion, the upstream inlet portion defining an inlet chamber for receiving the outflow material, and the downstream conveying portion defining a conveying chamber for conveying the outflow material into a reduction chamber; Head mount (50), which defines an orifice (910) for receiving the inlet nozzle; and An insulating mounting element (900) is configured to hold the inlet nozzle within the orifice; The insulating mounting element is configured to surround the inlet nozzle and be inserted between the inlet nozzle and the head mounting element, and the upstream inlet portion is configured to be spaced apart from the head mounting element by the insulating mounting element, the insulating mounting element comprising thermally insulating material.

2. The inlet nozzle assembly according to claim 1, wherein, The insulating mounting includes a plurality of protrusions configured to contact the inlet nozzle.

3. The inlet nozzle assembly according to claim 2, wherein, The protrusion extends from the facing surface of the insulating mount to space the inlet nozzle from the facing surface.

4. The inlet nozzle assembly according to any one of claims 1 to 3, wherein, The insulating mounting defines a purge conduit configured to transfer purge gas from a purge gas feeder to a purge gas filling chamber in the head mounting.

5. The inlet nozzle assembly according to any one of claims 1 to 3, wherein, The inlet nozzle includes an effluent nozzle for conveying the effluent stream and a concentric combustion reagent nozzle for conveying the combustion reagent, and the insulating mounting defines a combustion reagent conduit configured to transfer the combustion reagent from the combustion reagent feeder to the concentric combustion reagent nozzle.

6. The inlet nozzle assembly according to claim 5, wherein, The concentric combustion reagent nozzle surrounds the outflow material nozzle.

7. The inlet nozzle assembly according to any one of claims 1 to 3, wherein, The upstream inlet portion is configured to be spaced apart from the upstream surface of the head mount.

8. The inlet nozzle assembly according to any one of claims 1 to 3, wherein, The insulating mounting component has a lower thermal conductivity than at least one of the inlet nozzle and the head mounting component.

9. A reduction device comprising an inlet nozzle assembly according to any one of claims 1 to 8.

10. A method for forming an inlet nozzle assembly according to any one of claims 1 to 8, comprising: An orifice is defined in the head assembly for receiving an inlet nozzle, the inlet nozzle being used to convey the outflow material into the reduction chamber; and The inlet nozzle is held in place within the orifice using an insulating mounting device.

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