Method and system for intelligent selection of material applications

Abstract

A method and system for applying materials to electronic devices can include generating an electromagnetic (EM) map of a device. The EM map can indicate locations of EM radiation emitted from the electronic device. The method can also include generating a thermal map of the electronic device, which can indicate locations of thermal energy emitted from the device. The method can also include generating a shielding map from the EM thermal map. The shielding map can include instructions for controlling a shielding apparatus, including locations on the electronic device for applying EM shielding materials and thermal materials. The method can also include controlling the shielding apparatus to apply the EM shielding materials and thermal materials to the electronic device according to the shielding map. The EM shielding materials and thermal materials can be applied to varying depths on the electronic device.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of Provisional U.S. Patent Application No. 63 / 213,553, filed June 22, 2021, entitled “METHOD AND SYSTEM FOR INTELLIGENT SELECTIVITY OF MATERIAL APPLICATION”, the entire disclosure of which is incorporated herein by reference for all purposes, as fully set forth herein. Technical Field

[0003] This disclosure generally relates to methods and systems for providing electromagnetic shielding and thermal materials to electronic devices. More specifically, this disclosure describes techniques for selecting and selectively layering materials on electronic devices to provide protection against electromagnetic interference, enhance security, and achieve predetermined threshold thermal performance. Background Technology

[0004] Electronic devices may require electromagnetic shielding for reasons such as safety, noise reduction, and interference prevention. Since electromagnetic shielding can be provided for a variety of reasons, a material used for one reason may not be suitable for another. Furthermore, various thermal properties may be involved in these electronic devices, which may require yet another type of material. Summary of the Invention

[0005] In some embodiments, a method for applying material to an electronic device may include generating an electromagnetic (EM) map of the electronic device. The EM map may indicate the location of EM radiation emitted from the electronic device. The method may also include generating a thermal map of the electronic device, which may indicate the location of heat energy emitted from the electronic device. The method may also include generating a shielding map from the EM map and the thermal map. The shielding map may include instructions for controlling shielding equipment, including locations on the electronic device for applying EM shielding material and locations for applying thermal material. The method may also include controlling the shielding equipment to apply EM shielding material and thermal material to the electronic device according to the shielding map.

[0006] In some embodiments, a non-transitory computer-readable medium includes instructions that cause one or more processors to perform operations. Operations may include receiving an EM map of an electronic device indicating the location of EM radiation generated on the electronic device. Operations may also include receiving a thermal map of the electronic device indicating the location of heat energy generated on the electronic device. Operations may also include generating a shielding map from the EM map and the thermal map, the shielding map including instructions for controlling a shielding device. The shielding map may include locations on the electronic device for applying EM shielding material and / or thermal material. Operations may also include providing the shielding map to a shielding device to apply EM shielding material and / or thermal material.

[0007] In some embodiments, a system may include a shielding device that can deposit EM shielding material and thermal material on an electronic device. The system may include one or more processors and one or more memory devices. The memory devices may include instructions that cause the one or more processors to perform operations. Operations may include receiving an EM map of the electronic device indicating the location of EM radiation generated by the electronic device. Operations may also include receiving a thermal map of the electronic device indicating the location of heat energy generated on the electronic device. Operations may also include generating a shielding map from the EM map and the thermal map, the shielding map including instructions for controlling the shielding device. The shielding map may include locations on the electronic device for applying EM shielding material and / or thermal material. Operations may also include providing the shielding map to the shielding device to apply EM shielding material and / or thermal material.

[0008] In some embodiments, generating an EM map may include simulating a model of an electronic device to measure EM radiation. Generating an EM map may also include determining the location of EM radiation on the electronic device and creating a mapping of those locations. Generating an EM map may also include determining the EM shielding material to be applied at the locations on an EM shielding device. In some embodiments, generating an EM map may include generating a model of the electronic device. Generating an EM map may also include identifying locations on the electronic device vulnerable to EM attacks, such as accidental antennas.

[0009] In all embodiments, generating a thermal map may also include simulating a model of the electronic device to measure its thermal behavior. Generating a thermal map may also include determining the location of heat energy on the electronic device and creating a thermal map of the electronic device. Generating a thermal map may further include determining the thermal material to be applied at the location on the electronic device.

[0010] In some embodiments, generating EM maps and thermal maps may include receiving data from a prototype of the probe electronics. Generating EM maps and thermal maps may also include receiving EM scan and / or thermal scan data from the prototype. Generating EM maps and thermal maps may also include a map showing the location of EM radiation on the electronics and a thermal map of the electronics. EM maps and thermal maps may also include (x, y, z) coordinates.

[0011] In all embodiments, the shielding device may apply EM shielding material and thermal material via sputtering and / or electroplating. The shielding device may deposit at least one layer of EM shielding material to a shielding depth that varies with the wavelength of EM radiation. The shielding device may deposit a layer of thermal material to a material depth. The EM shielding material may include a layer of Cu for high-frequency EM shielding and a layer of NiFe for low-frequency shielding. The EM shielding material may include an alloy for providing shielding against both high-frequency and low-frequency EM radiation, keeping it within a predetermined threshold. The electronic device may include one or more integrated circuit packages mounted on a substrate made of glass or organic material. Attached Figure Description

[0012] Figure 1A Examples of electronic devices according to some embodiments are shown, wherein various components may emit electromagnetic (EM) radiation.

[0013] Figure 1B A view is shown of a trace 101b that may include an unexpected antenna according to some embodiments.

[0014] Figure 2 An electronic device emitting EM radiation and thermal energy according to some embodiments is shown.

[0015] Figure 3 A lookup table (LUT) according to some embodiments is shown.

[0016] Figure 4 An example of a graph showing EM radiation emitted by a model of an electronic device according to some embodiments is shown.

[0017] Figure 5 A top-down thermal map of thermal energy emitted by an electronic device according to some embodiments is shown.

[0018] Figure 6 A data sheet is shown that can be used to select materials based on a combination of shielding diagrams, according to some embodiments.

[0019] Figure 7 A data sheet is shown, according to some embodiments, that can be used to select materials for shielding of specific geometries.

[0020] Figure 8 An electronic device having a material selectively applied via sputtering is shown according to some embodiments.

[0021] Figure 9 A flowchart illustrating a method for selectively applying materials to an electronic device according to some embodiments is shown.

[0022] Figure 10A flowchart of a method for generating a composite shielding diagram according to some embodiments is shown.

[0023] Figure 11 An exemplary computer system in which various embodiments may be implemented is shown. Detailed Implementation

[0024] Electronic systems face challenges in mitigating factors such as thermal performance, noise, electromagnetic interference (EMI), and security. EMI can damage components within an electronic device, regardless of whether it originates from other components within the same device or from an external source. Electromagnetic noise (sometimes referred to as "noise") can have a similar effect on components of an electronic device. Furthermore, noise can lead to security issues. Noise leaking from an electronic device can sometimes be used in side-channel attacks. Noise may originate from components intentionally carrying information within the device or may originate from an unintended antenna. Therefore, effective electromagnetic shielding may be necessary to protect electronic devices from EMI and enhance security. Additionally, thermal management of electronic devices is a concern for processors and other advanced electronic equipment. However, materials providing optimal thermal properties may be a poor choice for EMI shielding. Similarly, suitable materials for EMI shielding may have undesirable thermal properties. Therefore, materials need to be selectively applied to various areas of the electronic device to achieve appropriate EMI shielding and thermal properties.

[0025] The embodiments described herein selectively apply EM shielding materials and / or thermal materials to address these problems. Locations on the electronic device that require EM shielding at certain frequencies can be identified. Similarly, the thermal properties of these locations on the electronic device can be identified. By combining locations on the electronic device that may require EM shielding with those that may require thermal materials to conduct heat away from the electronic device, a shielding map can be generated that controls the shielding device to selectively apply various materials to the electronic device.

[0026] Electronic devices and components may emit and receive inappropriate electromagnetic (EM) radiation. When an electronic device includes an antenna that broadcasts information via radio waves or other forms of EM radiation, accidental reception and emission of EM radiation may cause problems related to the integrity of the information to be transmitted or received.

[0027] Electromagnetic interference (EMI) occurs when an external emitter of EM radiation affects an electronic device through various means, including induction, conduction, or electrostatic coupling. EMI can prevent signals from being broadcast or received by an electronic device, or it can interfere with other circuitry within the device. Therefore, devices may need to be shielded against EMI to protect them from interference and / or limit their ability to interfere with other nearby electronic devices.

[0028] Electronic devices and / or their components generate noise. A common type of noise is thermal noise. Thermal noise is caused by the excitation of charge carriers within the components of an electronic device. This noise may cause the components of the electronic device to emit EM radiation within a certain frequency band. Noise generated by the components of the electronic device itself may have undesirable effects on other components of the electronic device (especially receiving components).

[0029] One possible effect is called desensitization, which is a reduction in the sensitivity of the receiving component to the desired signal caused by noise from the receiving device itself. The noise does not need to have the same EM frequency as the desired signal. Because desensitization reduces the device's ability to receive signals, normal operation of the electronic device may be affected, as it may no longer be able to receive signals at the desired frequency. When even a momentary loss of signal reception occurs, the electronic device may experience packet loss, thus reducing processing power and data rates, as well as decreasing range.

[0030] Noise can also pose a security risk to electronic devices and any data processed by them. "Side-channel attacks" encompass various methods of using noise generated by electronic devices to gain access to transmitted information or control the device itself. By receiving unintended EM radiation generated by various components, including paths such as traces, attackers may be able to obtain cryptographic keys, intercept information, or gain control of the electronic device.

[0031] In side-channel attacks, attackers can scan a device to find noise generated by one or more components of the target device. After identifying a signal emitted as EM radiation as noise from a particular component, the signal can be analyzed. Data can be extracted and subsequently decoded using various techniques. In some cases, interception of this cipher information or data can lead to other forms of damage to the electronic device itself.

[0032] Figure 1A Examples of electronic devices according to some embodiments are shown, wherein individual components may emit inappropriate EM radiation. Figure 1A It can represent only a few parts of a larger device; for example, it can only represent the wireless and display modules of a larger system. Figure 1A Provided by way of example only and not intended to be limiting; other electronic devices mentioned herein may have all, some, or none of these features. Figure 1A The components shown.

[0033] A High-Definition Multimedia Interface (HDMI) connector 102 can be connected to the vision processing unit (main processor) 104 via trace 101a on the substrate 120. A Universal Serial Bus (USB) port 106 and a memory device 108 can similarly be connected to the main processor 104 via traces 101b and 101c. Although not directly connected to the main processor 104, a radio unit 110 can be mounted on the substrate 120. The radio unit 110 can be used to transmit and receive data via radio waves, which may be a source of EM radiation or interference.

[0034] As discussed above, the USB port 106, HDMI connector 102, and memory device 108 can emit EM radiation as noise. In some cases, the noise emitted by these components may be of the same frequency. In other cases, the noise emitted by each component may be at a different frequency than that emitted by any of the other components.

[0035] Figure 1B A view of a trace 101b, which may include an unexpected antenna, is shown according to some embodiments. Although trace 101b is illustrated as an example, any trace can be used as an antenna. Additionally, substrate 120 may have additional traces (not shown) that can also be used as unexpected antennas. Radio wave 116 is illustrated as an electromagnetic field. In some embodiments, radio wave 116 may be transmitted via electronic device 100 through radio unit 110. First trace arm 117 and second trace arm 118 are illustrated as having equal lengths, approximately half the wavelength of radio wave 116. First trace arm 117 and second trace arm 118 are joined by resistor 119, wherein the length of resistor 119 is significantly less than the lengths of first trace arm 117 and second trace arm 118. In some electronic devices, first trace arm 117 and second trace arm 118 may be different segments of the same trace connected by some components. The first trace arm 117 and the second trace arm 118 may be multiple portions of a separate trace that are intentionally or unintentionally connected by an insert layer or component.

[0036] Since trace 101b is an electrical conductor, the first trace arm 117 and the second trace arm 118 are also conductors. Due to the interaction of radio wave 116 with the first trace arm 117 and the second trace arm 118, a voltage is generated across the length of the two trace arms. As radio wave 116 oscillates, the voltage across the first trace arm 117 and the second trace arm 118 oscillates at the same frequency. Because of the voltage across the length of the trace arms and the fact that the trace arms are connected by resistors, current flows back and forth, and noise oscillating at the same or near frequency as radio wave 116 can be generated. Therefore, trace 101b acts as an accidental antenna for broadcasting radio wave 116. This configuration is not the only possible configuration for an accidental antenna. Those skilled in the art will recognize many different configurations that allow for the accidental broadcasting of radio wave 116.

[0037] One way to mitigate EMI and noise is to shield "noisy" components, thereby limiting their accidental EM radiation emissions below a certain threshold. Similarly, accidental antennas can also be mitigated by EM shielding. However, electronic devices may include many noisy components, and it may be necessary to shield different frequencies of EM radiation at different locations on the same electronic device.

[0038] The material can be selected as the EM shielding material for a specific noisy component based on the frequency of the EM radiation emitted by that component. In some embodiments, different EM shielding materials can be selected to shield EM radiation of different frequencies in different regions. Furthermore, the EM shielding material can be applied at different depths or thicknesses to attenuate inappropriate EM radiation below a certain threshold. However, the thermal performance of the electronic device can be affected by the application of the EM shielding material.

[0039] Figure 2 An electronic device 200 emitting EM radiation and thermal energy according to some embodiments is illustrated. Example components that can be mounted on a substrate 210 are shown for the electronic device 200. The substrate 210 can be a printed circuit board, a silicon substrate, an interposer layer, and / or any other type of substrate on which integrated circuits can be mounted. A cryptographic processor 208 can be connected to a main processor 202 via trace 212. Memory 204 and one or more converters 206 can also be mounted on the substrate 210. Although memory 204 and converters 206 are not illustrated as being connected to any other components, those skilled in the art will recognize that these components can be connected to any or all of the other components illustrated via internal or hidden traces.

[0040] To perform cryptographic operations, the main processor 202 can retrieve the cryptographic key generated by the cryptographic processor 208. The cryptographic processor 208 can send the cryptographic key to the main processor 202 via traces 212, which extend between the cryptographic processor 208 and the main processor 202 via a substrate 210. Figure 2As shown, these traces can expose and / or otherwise make them vulnerable to physical attacks. For example, traces on the surface of substrate 210 can be detected using voltage probes or other sensors (not shown). For traces extending on the inner layers of substrate 210, a skilled attacker could carefully remove multiple portions of substrate 210 to expose these traces. Because trace 212 extends between cryptographic processor 208 and main processor 202, it is vulnerable to such attacks.

[0041] In other embodiments, such as Figure 1B As shown, due to the accidental nature of the antenna, trace 212 may emit inappropriate EM radiation 214a. Figure 2 The device in the diagram may be part of a larger system (not shown), including a wireless radio transmitter, such as radio unit 110. Inappropriate EM radiation 214a may be a signal broadcast by the wireless radio transmitter. To attenuate inappropriate EM radiation 214a, a first EM shielding material selected based on the frequency of the inappropriate EM radiation 214a may be required.

[0042] The main processor 202 may emit EM noise 214b. EM noise 214b and inappropriate EM radiation 214a may be EM radiation of the same or different frequencies. Therefore, a second EM shielding material may be required to appropriately attenuate the EM noise 214b. In some embodiments, the second EM shielding material may be the same as the first EM shielding material. Alternatively, the second EM shield may be a different material from the first EM shielding material.

[0043] The main processor 202 can also radiate heat energy 216a. Applying a second EM shielding material can affect the thermal behavior of the main processor 202 by preventing the proper dissipation of heat energy 216a. The depth of the second EM shielding material can also affect the dissipation of heat energy 216a. Thus, the main processor 202 may also require the application of thermal material to dissipate heat energy 216a, thereby allowing the thermal properties of the main processor 202 to be maintained within a predetermined threshold. In some embodiments, the depth of the thermal material and the depth of the second EM shielding material can be determined such that noise 214b and heat energy 216a are kept within a predetermined threshold.

[0044] Similarly, memory 204 can radiate heat energy 216b. In some embodiments, heat energy 216b may be equivalent to heat energy 216a, thus requiring a considerable depth of thermal material. In other embodiments, the amount of heat energy 216b may differ from the amount of heat energy 216a, thus requiring thermal material of different thicknesses.

[0045] It should be understood that Figure 2 The components shown emitting EM radiation and thermal energy are merely examples and are not intended to be limiting. Figure 2 Any of the components in it may emit heat and / or EM radiation. Furthermore, although... Figure 1A , Figure 1B and Figure 2 The embodiments illustrated in the diagram emit EM radiation. Electronic devices 100, 200, and their associated components can benefit from EM shielding to prevent undue EM radiation from affecting the devices or their components. Undue EM radiation may originate from other components on the same device or may originate from external sources.

[0046] Similarly, electronic devices 100 and 200 and their associated components may require shielding rather than heat dissipation. Converter 206 may have a narrow thermal threshold. Thermal material may be applied to converter 206 to mitigate the effects of heat energy 216b on converter 206. In some embodiments, electronic device 200 may require shielding to isolate external sources of heat energy while having localized areas where heat energy can be dissipated or redirected.

[0047] Figures 1A to 2 Different materials may need to be selectively applied to different locations on an electronic device. In some embodiments, multiple locations may require one or more EM shielding or thermal materials. Identifying these locations after manufacturing can be expensive and inefficient, necessitating the construction and testing of multiple prototypes before these locations are properly identified and shielded. Therefore, identifying locations before manufacturing to selectively apply EM shielding or thermal materials to the electronic device can lead to greater efficiency and reduced costs in the design process.

[0048] In some embodiments, an electronic device can be modeled. The model can be generated and / or simulated using software running on a computing device. The model may include a representation of an integrated circuit, a chiplet on a substrate, a flip-chip package, or any other type of electronic device. The model may include a 3D representation of the model.

[0049] The model may include information about the materials used in its manufacture and any included components. The model may describe the substrate material, such as glass, organic materials, or other suitable materials. The model may also describe any number of components, including processors, volatile memory, non-volatile memory, clocks, I / O interfaces, or other suitable components. The model may include information about all characteristics of the components included thereon, including operating voltage, current, frequency, tolerances, and other electronic information.

[0050] A coordinate graph can be generated from the model. The coordinate graph can be two-dimensional or three-dimensional. In some embodiments, the coordinate graph includes (x, y, z) coordinates. The coordinate graph may also include the positions of components on the model.

[0051] The model may include the desired calorific value of the electronic device and its components. The desired calorific value may include the junction coefficient (θjc), coefficient of thermal expansion (CTE), resistance to thermal expansion (R), or other thermal properties. Different locations on the model may include different calorific values. These differences may vary depending on the components of the model and / or the materials chosen for the substrate or other components. In some embodiments, the calorific value may be generated by a computing device or entered by a user.

[0052] Figure 3 A lookup table (LUT) 300, according to some embodiments, is shown that can be used to associate parameters with coordinates on a model. The LUT 300 may contain information including the (x,y,z) coordinates of the model, the λ / 4 point of a known emitter at certain EM radiation frequencies, thermal R-values, junction coefficients (θjc), and other information describing the EM or thermal characteristics of the electronic device.

[0053] As discussed below, the LUT 300 can be iteratively updated to include model-based EM and thermal scan information. This information may include thermal radiation values, magnetic field strength (magnetic components Hx, Hy, and Hz current density – mA / mm²). 2 The LUT 300 may include: S21 coupling (leakage energy – dB / mm) value, spectral value (horizontal spurious level from spectral scan), S11 (backhaul loss (dB) or impedance (ohms Ω) of an undesirable / unwanted antenna, which helps determine the λ / 4 (maximum) and λ / 10 (minimum) radiation point and operating frequency of a given noise source), and other relevant data for each location on the model. The LUT 300 may also include locations vulnerable to EM attacks, locations of accidental antennas, and other information.

[0054] After modeling the electronic device, the computing device can perform a simulation operation of the model. In some embodiments, the simulation operation may include a simulation model using desired operating voltages and currents applied to various components of the modeled electronic device. The simulation may also use the desired operating frequencies of components such as radio units or antennas. The simulation may include external factors, such as EMI or thermal energy from external sources. These sources may be the result of other electronic devices within a larger system or from other nearby devices. External factors may also include sources of thermal energy and EM radiation from typical operating environments.

[0055] During the simulation of the model, the computing device can perform simulated measurements of EM radiation at various locations on the electronic device via virtual scanning. During the simulation, the electronic device can be virtually scanned by the computing device. As discussed above, there may be multiple EM radiation frequencies emitted from various locations on the electronic device. Therefore, multiple frequencies at various locations on the model can be scanned. In some embodiments, the high frequency of EM radiation can be higher than 1 GHz. The low frequency of EM radiation can be in the range of 100-800 MHz. Based on the results of the virtual scanning, the computing device can virtually apply EM shielding material to the model, then perform the simulation and repeat the virtual scanning to observe the simulated effect of the EM shielding material.

[0056] Figure 4 An example of a graph showing EM radiation emitted by a model generated by a computing device is shown. EM frequency graph 400 plots simulated measurements of EM radiation at a given frequency. EM frequency graph 400 may include measurements along the modeled electronic device (such as...) Figure 1A Measurements were performed in multiple orientations of the model of the described electronic device. The Hx value 401 can be represented along... Figure 1A The simulation measurement of EM radiation propagating along the x-axis is shown. Therefore, the Hy value of 403 can be represented along... Figure 1A The diagram shows a simulated measurement of EM radiation propagating along the y-axis. In some embodiments, the EM frequency diagram 400 may include two orientations. In other embodiments, the EM frequency diagram 400 may include a third orientation, such as a Hz value (not shown).

[0057] The EM frequency map 400 can be characterized by regions with higher levels of EM radiation at a specified frequency. A first region 402 can represent a region with lower levels of EM radiation at the specified frequency. A second region 404 can have a higher level of EM radiation at the specified frequency compared to the first region 402. In some embodiments, the level of EM radiation at the specified frequency in the second region 404 may be below a predetermined threshold. In other embodiments, the second region 404 can be identified as a location where EM shielding material at the specified frequency is required.

[0058] The third region 406 may have EM radiation at a specified frequency that is at a higher level than that of the second region 402. The computing device may identify the third region 406 as a location where EM shielding material is required for the specified frequency. For example, the third region 406 may include an incident antenna. The third region 406 may also be identified by the computing device as a specific component.

[0059] The fourth region 408 may have even higher values ​​of EM radiation at a specified frequency. The computing device may identify the fourth region 408 as a specific component of the model. In some embodiments, the specific component may be an intentional emitter of EM radiation, such as an antenna, and therefore no EM shielding material is required for the specified frequency. In other embodiments, the specific component may emit inappropriate EM radiation, and EM shielding material at the specified frequency may be used.

[0060] After simulating EM radiation on the electronic device, the computing device can determine the locations of resonant points on the electronic device. For example, the computing device can determine the location of the EM radiation emitter at a certain frequency. The computing device can then identify multiple resonant points on the electronic device as distances from the EM radiation emitter, which are multiples of λ / 4, where λ is the wavelength of the frequency. The computing device can temporarily store these regions in LUT 300 and / or on Figure 400.

[0061] After simulating EM radiation on the electronic device, the computing device can calculate the locations of eddy currents generated by the skin effect within conductors included in the electronic device. The conductors can be components, traces, and / or other conductive materials. The eddy currents can be strong enough to dominate any intentional current in the conductors and emit EM radiation. The computing device can determine the locations on the electronic device that require shielding due to the eddy currents. The computing device can also identify distances from the locations including the eddy currents, these distances being multiples of λ / 4, where λ is the wavelength of the frequency emitted due to the eddy currents. The computing device can temporarily store these regions in LUT 300 and / or on Figure 400.

[0062] The computing device can also determine other EM measurements during simulation operation. Other EM measurements may include the magnitude of EM radiation at various frequencies, magnetic field strength (magnetic components Hx, Hy), and Hz current density – mA / mm². 2 The data includes S21 coupling (leakage energy – dB / mm) value, spectral value (horizontal spurious level from spectral scan), S11 (backhaul loss (dB) or impedance (ohms Ω) of an undesirable / unwanted antenna, which helps determine the λ / 4 (maximum) and λ / 10 (minimum) radiation point and operating frequency of a given noise source), and other relevant data for each location on the model. The computing device can temporarily store these regions in the LUT 300 and on the EM frequency map 400.

[0063] The computing device can also identify locations on the model that are vulnerable to EM attacks, such as side-channel attacks. This location on the electronic device may include an unintended antenna that broadcasts EM radiation at a specified frequency. The location may also include specific components of the electronic device that are vulnerable to EM attacks via EM radiation at a specified frequency. The computing device may temporarily store this location in the LUT 300 and / or on the EM frequency map 400. For example, the coordinates of the cryptographic processor 208 and the main processor 202, along with the trace 212 between these two components, can be identified by coordinates as requiring EM shielding to prevent unintended broadcasting of cryptographic material.

[0064] Multiple iterations of the EM frequency map 400 can be generated by a computing device to simulate measurements of EM radiation at different frequencies. In some embodiments, the iterations of the EM frequency map 400 may overlap with certain locations of band radiation across the EM radiation frequency range. In other embodiments, depending on the frequency being measured, the iterations of the EM frequency map 400 may plot varying values ​​of EM radiation. At each iteration, measurements can be performed again. This information may include magnetic field strength (magnetic components Hx, Hy, and Hz current density – mA / mm²). 2 The calculation device can then store the measurements in the LUT 300 and / or on the EM frequency graph 400. The measurements include: S21 coupling (leakage energy – dB / mm), spectral values ​​(horizontal spur level from the spectral scan), S11 (backhaul loss (dB) or impedance (ohms Ω) of an undesirable / unwanted antenna, which helps determine the λ / 4 (maximum) and λ / 10 (minimum) radiation point and operating frequency of a given noise source), and other EM data.

[0065] The computing device can iteratively combine the EM frequency maps 400 into a single EM map and update all measurements in the LUT 300. Based on the LUT 300, the computing device can then determine the EM shielding material and the shielding depth at each location on the electronics.

[0066] Certain EM shielding materials are suitable for high-frequency EM shielding, such as Cu. Other EM shielding materials are suitable for low-frequency EM shielding, such as NiFe. Alloys can be used to provide both high-frequency and low-frequency shielding. Suitable EM shielding materials may include Cu, NiFe, TiV, CoFe69, Ag, and Au. One or more EM shielding materials may be selected. The materials in this list are not exhaustive and are provided only by way of example. Those skilled in the art who benefit from this disclosure will recognize many suitable materials that can be used as appropriate EM shielding materials.

[0067] Suitable EM shielding materials can be listed in a database accessible by a computing device. The database may include information about each EM shielding material, such as shielding effectiveness at a given frequency of EM radiation, thermal properties, cost, and other information.

[0068] The computing device can determine which one or more EM shielding materials from a database are suitable for a given location by calculating and balancing the properties of various potential EM shielding materials. In some embodiments, a first potential EM material and a second potential EM material can be determined to effectively shield EM radiation at a specific frequency. The computing device can then evaluate other factors associated with the first and second potential EM shielding materials. These factors may include permittivity, permeability, dielectric constant, loss tangent of the substrate, coefficient of thermal expansion (CTE) value, thermal R value, or other relevant factors.

[0069] The computing device can determine, based on the EM frequency map 400, that locations on the model require shielding of one or more frequencies of EM radiation. The computing device can determine that a first EM shielding material and a second EM shielding material are optimal to achieve EM performance within predetermined thresholds, while keeping cost and other considerations within given parameters. In some embodiments, the computing device can determine that a first layer of the first potential EM shielding material and a second layer of the second potential EM shielding material are appropriate. The computing device can utilize criteria such as CTE mismatch, relative permeability (μr), skin depth (δ), and relative skin effect between potential EM shielding layers. In some embodiments, a dielectric layer may be used between the first and second potential EM shielding layers.

[0070] In some embodiments, the computing device may determine that an alloy listed in a database is a suitable EM shielding material. The alloy may have properties that allow EM shielding of a wide bandwidth at EM frequencies. The computing device may determine that the alloy provides appropriate EM shielding across the EM frequency band and offers additional benefits over layering multiple EM shielding materials.

[0071] The computing device can determine the shielding depth of each type of EM shielding material at every location on the model. The shielding depth can be determined in each orientation. In other words, the shielding depth can be the three-dimensional volume of the material applied at a location on the model.

[0072] Shielding depth can be based on the shielding effectiveness (SE) of the potential EM shielding material, the thermal properties of the EM shielding material, and other relevant criteria. The SE of the potential EM shielding material can be calculated to attenuate EM radiation at a certain frequency below a predetermined threshold. The computing device can determine that at least one EM shielding material applied to an associated shielding depth will improperly attenuate EM radiation within a predetermined threshold. The SE of the EM shielding material can be compared with the thermal properties of the EM shielding material. A shielding depth that achieves the desired attenuation at a certain frequency while simultaneously achieving a threshold of thermal effectiveness at a certain location on the electronic device can be determined.

[0073] The computing device can determine locations on the model, such as those described above for multiple frequencies. The EM shielding material can be determined for each location on the model, and the model can be updated for each frequency at each location. The computing device can then run simulations using the updated model. This process can be repeated until all simulated measurements of the EM radiation at all scan frequencies are below a predetermined threshold. Once all scan frequencies are below a certain threshold, the computing device can combine the iterations of Figure 300 (including information about the EM shielding material and associated shielding depth) into a final EM diagram and / or thereby update LUT 300.

[0074] The computing device can also generate thermal maps of modeled electronic devices. The computing device can generate thermal maps during the simulated operation of the electronic device, thus mapping the desired thermal behavior at various locations within the model. The computing device can perform simulated temperature measurements at each location within the model.

[0075] Figure 5 A top-down thermal map of the heat energy emitted by an electronic device is shown. Thermal map 500 can be for electronic devices (such as...) Figure 1A A heatmap of the descriptor. Although heatmap 500 only charts one orientation of the model, other heatmaps can be generated from other orientations, such as from... Figure 1A The x-axis and y-axis are shown.

[0076] During the simulation of the model, the computing device can perform simulated measurements of thermal energy on the model. The computing device can then generate a heat map 500 of the model, thereby characterizing multiple regions of the model by temperature. Regions of the heat map 500 can be indicated by color or other visual aids. Regions of the heat map 500 can also be labeled with temperature or temperature range. Multiple regions can also be represented by graphs or tables.

[0077] The first region 502 can be characterized by a lower temperature, thus indicating low thermal activity. The first region 502 can therefore be below a certain temperature threshold. Relative to the first region 502, the second region 504 can be a region with a higher temperature. Similarly, the third region 506 can be a location with even higher temperatures. The fourth region 508 and the fifth region 510 can be locations with even higher temperatures, exceeding the temperature threshold and requiring the application of heating material.

[0078] The computing device can correlate the heatmap 500 with the coordinate graph of the model and / or thereby update the LUT 300. The computing device can then determine the thermal material and the material depth at each location on the electronics. The material depth can be determined in each orientation. In other words, the material depth can be the three-dimensional volume of material applied at a location on the model.

[0079] The computing device can also determine the location on the back side of the electronic device where backside metallization (BSM) is required. The location may require BSM to improve thermal performance and / or electrical connectivity. In some embodiments, the computing device can determine that the entire electronic device requires BSM. In other embodiments, BSM may be applied selectively. The computing device can determine the material depth for BSM at each location on the electronic device.

[0080] Material depth can be determined based on predetermined thresholds for thermal performance. These thresholds can include thermal conduction, absorption, or radiation. Suitable thermal materials include graphene, graphite, Ag, Cu, Au, CuZn, Ti, NiV, and Al. Alloys of one or more thermal materials may also be suitable. This list is not exhaustive and is not intended to be restrictive. Suitable materials can be included in a database of thermal materials, accessible by a computing device, to achieve one or more predetermined thresholds for thermal performance.

[0081] The database of thermal materials can include the EM properties of the thermal materials. The computing device can select thermal materials based on one or more properties contained in the database. Furthermore, different locations of the modeled electronic device may include different thresholds of thermal efficiency, and therefore require different thermal materials to be applied to different material depths.

[0082] For example, in some embodiments, the computing device may determine large differences in simulated measurements of thermal temperature between multiple regions, similar to the difference between a first region 502 and a second region 504. The computing device may then determine that because a higher temperature is found in the second region 504 (such as regions 506-510), the boundary between the first region 502 and the second region 504 may include components such as… Figure 1A The main processor 104 or Figure 2 The main processor 202 in it.

[0083] The computing device can determine the need for thermal material to conduct heat away from the fifth region 510. The computing device can further determine whether a heat sink is formed in the first region 502 due to low thermal activity, its location on the model, and other parameters. The computing device can then determine one or more thermal materials to be applied to regions 502-510 such that heat is conducted away from the fifth region 510 and radiated via the heat sink or other structures in the first region 502. The computing device can update the model and / or LUT 300 using the thermal material and run the simulation again. This process can occur until all locations on the model are below a predetermined threshold for thermal performance.

[0084] Structure 512 may be a component identified by the computing device during previous simulation operations of the model. During previous operations, the computing device may determine that structure 512 is a specific component of the model. The computing device may also determine that the thermal energy radiated from regions 504-510 exceeds a predetermined threshold for thermal performance, thereby affecting the operability of structure 512. The computing device may then determine the location (including structure 512) where thermal material will act as a thermal shield and where thermal material will be selectively applied to the electronic device at a material depth, such that structure 512 achieves the thermal performance threshold. The computing device may update the model and / or LUT 300. The computing device may then run the simulation operation again.

[0085] The computing device can run simulation operations and iteratively update the model and / or LUT 300 until every location on the model is associated with thermal material and material depth, such that every location on the model achieves a predetermined threshold of thermal performance. The computing device can repeat this process to generate iterative heatmap 500 and / or update LUT 300 at the end of each process until all locations on the model achieve the threshold of thermal performance. The computing device can combine the iterative heatmap 500 (including information about the thermal material and associated material depth) into a final heatmap and / or update LUT 300.

[0086] The model can be updated using the final thermal map and final EM map, as well as the LUT 300, including the location of the EM shielding material, the associated shielding depth, thermal material, and material depth. A prototype of the electronic device can then be manufactured. The prototype may include all components integrated into the model. The prototype can then have the EM shielding material applied to the shielding depth using a shielding device based on the final EM map. Similarly, the prototype can have thermal material applied to the material depth using a shielding device based on the final thermal map. The shielding device may include equipment operable to deposit material by electroplating. As described below, the shielding device may also include equipment operable to deposit material via sputtering.

[0087] After the prototype has been manufactured, further testing may be conducted on the EM shielding material applied to the shielding depth and the thermal material applied to the material depth. During further testing, the prototype is operated under normal operation. Normal operation may include the desired operating voltage and current applied to the various components of the prototype. This may also include the intentional emission of EM radiation at the operating frequency by components (such as radio units or antennas). Further testing may also include subjecting the prototype to simulated conditions, such as external heat sources or EMI.

[0088] During further testing, the final EM plot can be verified. A coordinate plot of the prototype can be generated and verified using a coordinate plot of the model. EM scans can be performed on the prototype and measure any EM radiation emitted from it, as well as other measurements temporarily stored in the LUT 300. EM scans can be performed using a computing device. A scan can examine each location on the prototype and measure the magnitude of the EM radiation emitted by the prototype at that location. Multiple scans can be performed at multiple frequencies of EM radiation and can measure other EM parameters, such as the magnitude of EM radiation at each frequency, magnetic field strength (magnetic components Hx, Hy, and Hz current density – mA / mm²), S21 coupling (leakage energy – dB / mm) value, spectral values ​​(level spurious levels from the spectral scan), S11 (backhaul loss (dB) or impedance (ohms Ω) of an undesirable / unwanted antenna, which helps determine the λ / 4 (maximum) and λ / 10 (minimum) radiation point and operating frequency of a given noise source), and other information about the EM characteristics of the prototype.

[0089] EM scans can then be combined and compared with a coordinate plot of the prototype's EM plot, thus illustrating the magnitudes of multiple frequencies of EM radiation and other EM parameters at all locations on the prototype. The prototype's EM plot can be compared with the final EM plot. If discrepancies are found between the prototype's EM plot and the simulated final EM plot, the EM scan can be repeated. The model simulation can also be repeated, and the EM frequency plot 400 and / or LUT 300 can be updated using the EM scan results. Once the prototype's EM plot is validated using the final EM plot, the final EM plot can be exported as a shielding diagram.

[0090] During further testing, thermal scanning can be performed on the prototype. Temperature measurements can be taken to measure the heat energy emitted at all locations on the prototype. Thermal scanning can be performed using a computing device equipped with thermal imaging equipment. The results of the thermal scan are then correlated with a coordinate graph of the prototype to generate a thermal map of the prototype. The thermal map can then be compared with a final thermal map. If a difference is found between the prototype's thermal map and the final thermal map, the thermal scan can be repeated. Simulation operations of the model can also be repeated, and thermal map 500 and / or LUT 300 can be updated using the results of the thermal scan. Once the prototype's thermal map has been verified with the final thermal map, the final thermal map can be exported as a shielding diagram.

[0091] The final thermal image and the final EM image can be combined to form a shielding diagram. In some embodiments, the LUT 300 can be combined with the final thermal image and the final EM image to generate a shielding diagram. The shielding diagram may include a coordinate graph of a model or information about the EM radiation emitted from the electronic device, such as magnetic field strength (magnetic components Hx, Hy, and Hz current density – mA / mm²). 2The data may include: S21 coupling (leakage energy – dB / mm) value, spectral value (horizontal spurious level from spectral scan), S11 (backhaul loss (dB) or impedance (ohms Ω) of the undesirable / unwanted antenna, which helps determine the radiating point λ / 4 (maximum) and λ / 10 (minimum) and operating frequency of a given noise source), and other relevant EM data. The shielding diagram may also include thermal data such as coefficient of thermal expansion (CTE), thermal resistance (R), junction-shell thermal resistance (θjc), and other relevant thermal data.

[0092] The shielding diagram may also include data, including the EM shielding material and associated shielding depth at each location on the electronic device. Based on factors such as the frequency of the corresponding EM radiation, the intensity of the corresponding EM radiation, the type of information included in the EM radiation, and / or other characteristics of the EM radiation or the component generating the EM radiation, the shielding depth of each EM shielding material may be consistent across all locations on the electronic device or may vary at each location on the electronic device.

[0093] Similarly, the shielding diagram may include data on the thermal material and associated material depth at each location on the electronic device. Based on factors such as the amount of heat generated at each location, the sensitivity of surrounding components, proximity to heat sinks and other heat conductors, and / or other characteristics of the heat or heat-generating components, the material depth of each thermal material may be consistent across all locations on the electronic device or may vary at each location on the electronic device.

[0094] As described above, the final shielding pattern may include materials applied to provide EM shielding, together with materials applied to provide heat dissipation. In some embodiments, these materials may be applied as alternating layers over electronic components on the electronic device. In other embodiments, materials providing both EM shielding and heat dissipation properties may be selected. Thus, single materials or alternating layers of materials may be deposited on the electronic device to provide EM shielding and heat dissipation as specified by design.

[0095] Figure 6 A data sheet 600, according to some embodiments, is shown for selecting materials based on a combination of shielding diagrams. In this example, the shielding effectiveness or isolation of multiple different shielding material configurations can be stored. Furthermore, the shielding effectiveness of each material (e.g., measured in dB) can be stored at different frequencies, which can be represented in an EM diagram. For example, the shielding diagram may include the intensity of EM emission and / or the frequencies associated with EM radiation. Different shielding thicknesses and / or materials may have varying levels of effectiveness at different operating frequencies.

[0096] In this example, five different materials are presented as options in data table 600. However, it should be understood that data table 600 may include many different materials, layers, and / or material configurations not specifically listed in data table 600. Thus, the materials described in data table 600 are provided only by way of example regarding how to select materials, and these materials are not intended to be limiting.

[0097] Column 602 includes the shielding effectiveness of electrical conductors with a specified thickness (such as a 5 μm layer of Cu). This column is used when a shielding diagram specifies areas where EM shielding is primarily required. A specified operating frequency can be used as input to datasheet 600 to identify the type and / or thickness of the conductor that can be used as a shielding layer to provide the specified EM shielding. For example, if the operating frequency is approximately 2 GHz and the design specifies at least 75 dB of isolation, column 602 indicates that a 5 μm layer of Cu will provide an appropriate level of shielding effectiveness (e.g., 83 dB). Other columns in datasheet 600 can also be compared with column 602 to identify other materials and / or thicknesses that perform better. For example, multiple columns representing different conductive materials with different thicknesses can be compared to identify the maximum shielding effectiveness available for a given frequency within the designed shielding thickness range.

[0098] Column 604 illustrates different constructions for providing EM shielding. Specifically, 5 μm layers of alternating electrical and magnetic conductors can be used to provide EM shielding. For example, alternating layers of Cu and cobalt alloys (e.g., CoNiFe) can be stockpiled and compared with other alternatives in Data Sheet 600 as described above. Note that these materials are provided by way of example only and are not intended to be limiting. Other entries in Data Sheet 600 may include other combinations of electrical and magnetic conductors using different materials with similar properties. For example, other magnetic conductors can be used with high ferromagnetic resonance (FMR). Alternating electrical / magnetic conductors can provide a high level of EM shielding, particularly at lower frequencies. As frequency increases, the preference may shift from electrical / magnetic conductor layers to a single conductor layer in Column 602. Multilayer stacks of alternating electrical and magnetic conductors can provide additional improvements in shielding effectiveness due to multiple reflections between heterogeneous impedances of the material layers.

[0099] Columns 606, 608, and 610 illustrate the primary materials used to provide heat dissipation. Data sheet 600 can store its EM shielding effectiveness when used for heat dissipation. Materials (such as graphene [1 / 2 / 3]) can be used as shielding materials for regions in a shielding diagram indicating high levels of thermal energy and low levels of EM emission. In some embodiments, different combinations of thermal and EM shielding materials can be used as alternating layers to provide adjustable levels of EM shielding and heat dissipation. For example, column 612 indicates the shielding effectiveness of alternating 5 μm layers of thermal material (e.g., graphene) and magnetic conductors (e.g., CoNiFe). Higher frequencies benefit from alternating layers of thermal and electrical conductors. The processes described above can be used to identify materials or combinations of materials in data sheet 600 that match the thermal and EM requirements from the shielding diagram.

[0100] Figure 7 A data sheet 700 is shown, according to some embodiments, for selecting materials for shielding of specific geometries. In addition to the type of shielding material used, the geometry or shape of the shielding material can also directly affect shielding effectiveness and the level of heat dissipation. For example, Figure 6 The data sheet 600 may include data on the first shielding structure (e.g., the shielding shape covering the top and / or sides of the electronic component). Figure 7 Data sheet 700 may include data on a second shielding configuration (e.g., the shielding shape that completely encloses electronic components on an electronic device). Therefore, in addition to selecting material combinations and thicknesses from data sheets 600 and 700, some embodiments may also determine the geometry or configuration of shielding materials used for different areas on an electronic device.

[0101] A shielding pattern can be provided to a shielding device. The shielding device is operable to receive the shielding pattern via USB, WiFi, Ethernet, EtherCAT, or other suitable communication methods. A computing device having one or more processors may be included in the shielding device, which is operable to control the application of material to an electronic device. The computing device may also include one or more memory devices. The shielding pattern may include commands that, when read by the computing device, control the shielding device to deposit material onto the electronic device. The shielding device is operable to apply material to a die, wafer, or other substrate, which may include integrated circuit (IC) packages, chiplet assemblies, flip chips, or other electronic devices.

[0102] Electroplating can be used to apply materials to electronic devices. In other embodiments, physical vapor deposition (PVD) sputtering can be used to apply materials to electronic devices. Sputtering can include ion beam sputtering, reactive sputtering, ion-assisted deposition, high target utilization sputtering, high-power pulsed magnetron sputtering, and gas flow sputtering.

[0103] The shielding device may first deposit a molding layer on the electronic device. The molding layer may be deposited to encapsulate an integrated circuit (IC) or other package. The materials used may be plastic, metal, or ceramic. In some embodiments, the molding layer may include structures designed to enhance thermal efficiency, such as finned heat sinks. The molding layer may be applied uniformly to the electronic device.

[0104] The shielding device can then be deposited uniformly onto an adhesive layer in the electronic device. The adhesive layer can increase the amount of material deposited in subsequent layers. It can also reduce the occurrence of fractures in subsequent layers, thereby reducing the number of manufacturing defects. The adhesive layer may include Ti, stainless steel, or other suitable materials.

[0105] Figure 8 An electronic device having a material selectively applied via sputtering is shown according to certain embodiments. The electronic device 800 may be similar to... Figure 2 Electronic device 200. Shielding equipment can thus deposit thermal material and / or EM shielding material on electronic device 200 according to a shielding diagram, thereby producing electronic device 800. Figure 8 The sputtered layers shown are merely representative. In other embodiments, all layers, some layers, or no layers may be present.

[0106] Blanket sputtering (where a single layer of material is deposited across a location or the entire electronic device) can be supported by selectively accumulating material depth in problem areas. This technique, “using supported blanket sputtering,” can reduce manufacturing costs by simplifying the sputtering process using a single material. Supported blanket sputtering can also reduce manufacturing and operational problems attributable to CTEs (Conditions of Traceability) caused by mismatches between the EM shield and thermal layer and the electronic device and associated components.

[0107] Thermal material layers 801a-801c illustrate examples of using supported blanket sputtering over a portion of an electronic device 800. (See also: [link to relevant documentation]) Figure 2 The memory 204 is labeled as radiant heat energy 216b. The shielding diagram associated with the electronic device 200 can guide the application of thermal material by the shielding device to mitigate the effect of heat energy 216b. Return to Figure 8The thermal material layer 801a illustrates a first thermal material deposited to a uniform depth across memory 804 and one or more converters 806. The first thermal material may have reduced thermal energy 214 below a predetermined threshold, thus eliminating the need for an additional layer of thermal material.

[0108] Although thermal material layer 801a is only illustrated as being applied to memory 804 and one or more converters 806, in other embodiments, thermal material layer 801a may be applied to every location of electronic device 800. In some embodiments, certain locations may require a greater material depth than that deposited in thermal material layer 801a. Thermal material layers 801b and 801c may include a first thermal material as thermal material layer 801a. According to the shielding diagram, more first thermal material is deposited in thermal material layers 801b and 801c via sputtering. The greater material depth illustrated in thermal material layers 801b and 801c may be deposited in subsequent sputtering processes. The shielding diagram may not include a greater material depth on memory 804 than that on one or more converters 806, and thus, the shielding device may not deposit any more first thermal material.

[0109] Although thermal material layers 801a to 801c comprise a first thermal material, other embodiments may employ blanket sputtering supported by an EM shielding material. (See also: [link to previous section]) Figure 2 The main processor 202 is emitting noise 214b and the trace 212 is emitting inappropriate EM radiation 214a. Return to Figure 8 In response to the shielding pattern, the shielding device may apply EM shielding layers 803a and 803b. Similar to thermal layers 801a-801c, the shielding pattern may apply a first EM shielding material to trace 212 and main processor 202 to achieve different shielding depths, thereby producing EM shielding layers 803a and 803b. In some embodiments, the shielding depths of 803a and 803b are determined by the frequency of noise 214b and inappropriate EM radiation 214a. As discussed below, due to subsequent material layers, the necessary shielding depth of EM shielding layer 803b may be less than the shielding depth of EM shielding layer 803a.

[0110] The EM shielding layer 803a attenuates inadequate EM radiation 214a, resulting in weaker EM radiation 814a. In some embodiments, the weaker EM radiation 814a may be below a predetermined threshold and determined to be acceptable. In other embodiments, the EM shielding layer 803a may be supported to a greater shielding depth. The EM shielding layer 803b may attenuate noise 214b, making the noise undetectable (and thus not detected in...). Figure 8 (See the image above).

[0111] EM shielding layer 803b, additional layer 805, and EM shielding layer 807 demonstrate layering technology to shield EM radiation over a wide frequency range and achieve a predetermined threshold for thermal performance. Layering multiple materials reduces the necessary shielding depth of EM shielding layer 803b to attenuate specific frequencies below a predetermined threshold.

[0112] See back Figure 2 The main processor 202 is labeled as emitted noise 214b and thermal energy 216a. In response to the measurement of noise 214b, the shielding diagram may contain instructions that cause the shielding device to apply... Figure 8 The EM shielding layer 803b in the middle can eliminate or reduce noise 214b to below a predetermined threshold and thus not in the... Figure 8 The diagram in the middle is shown.

[0113] The main processor 202 may require thermal materials to mitigate heat 216b. See now. Figure 8 ,exist Figure 2 In the view, the shielding pattern may contain instructions that cause material to be deposited in the EM shielding layer 803b, which attenuates the frequency of noise 214b and reduces heat energy 216a, enabling the main processor 202 to achieve a predetermined threshold of thermal performance. In other embodiments, the additional layer 805 may be a thermal material deposited in response to heat energy 216b.

[0114] When determining the EM shielding material to be used to shield the main processor 202 during simulation operation, the computing device may decide that the additional layer 805 should be a dielectric layer, and that the EM shielding layer 807 should include a material that shields frequencies different from those shielded by the EM shielding layer 803b. The additional layer 805 may be needed to isolate EM effects, such as conduction or induction, in order to mitigate the interaction between the EM shielding layer 803b and the EM shielding layer 807. The computing device may also decide that the additional layer 805 is needed to mitigate CTE mismatch between the EM shielding layer 803b and the EM shielding layer 807.

[0115] The second EM shielding layer 807 may be an EM shielding material that attenuates EM radiation at frequencies different from noise 214b. In some embodiments, the second EM shielding material may be applied to shield EMI emitted from the main processor 802 or from an external source. The second EM shielding material may also shield noise of a second frequency emitted from the main processor 802.

[0116] The third EM shielding layer 809 is marked as applied to the cryptographic processor 808. Figure 2 In this design, the cryptographic processor 808 is not depicted as emitting EM radiation or heat. During simulation operation, the computing device can determine that the cryptographic processor is vulnerable to EM attacks, and other components of the electronic device 800 do not share the same vulnerability. Figure 8In this process, the third EM shielding layer may have been selectively deposited onto the cryptographic processor to shield against EM attacks. The third EM shielding layer 809 may include the same material as EM shielding layers 803a and b and the second EM shielding material 807, as well as different EM shielding materials.

[0117] Several different techniques for selectively applying materials to electronic devices have been illustrated according to some embodiments of the present invention. It should be understood that any or all of the illustrated techniques (such as using supported blanket sputtering, layering, and selective material deposition) can be applied to a single electronic device. Furthermore, Figure 8 The technology shown can be used for back-side metallization (BSM). Figure 8 The techniques illustrated are not exhaustive and are not intended to be limiting. Those skilled in the art will recognize many variations and possibilities in utilizing the benefits of this disclosure. Furthermore, Figure 8 The layers described herein are for illustrative purposes only and are not intended to be limiting. In alternative embodiments, any layer may be of any material. For example, thermal material layers 801a-801c may be replaced by, or in addition to, thermal material, EM shielding material and thus constitute an EM shielding layer. In other words, any layer may include any suitable material for any purpose, as determined by the computing device during the simulation operation of the model, and may be included in the shielding diagram.

[0118] Figure 8 The techniques described herein can be applied in several situations. In some embodiments, since there is no thermal performance issue, only EM shielding material may be required. In other embodiments, since there is no EM radiation issue, only thermal material may be required to achieve a predetermined threshold of thermal performance. In still other embodiments, both thermal material and EM shielding material may be required. Furthermore, the EM shielding material may be determined in part by its thermal properties. Similarly, thermal material may be selected in part by its thermal properties. Materials may also be determined to cover a wide range of EM radiation frequencies.

[0119] Figure 9 A flowchart 900 illustrates a method for controlling the selective application of materials to an electronic device. Method 900 may include generating an EM map indicating the locations of EM radiation emitted from the electronic device and locations for applying EM shielding material to the electronic device (902). Locations may be antennas intentionally emitting EM radiation, components of the electronic device emitting EM radiation noise, accidental antennas generated by traces on a substrate, or other sources of EM radiation. The EM map may be a thermal map, such as... Figure 3 As shown. EM diagrams include information from two dimensions, or may include information from three dimensions. EM diagrams may also include information about multiple frequencies of EM radiation. EM diagrams may include a coordinate graph of models and information regarding: EM radiation emitted from electronic devices, magnetic field strength (magnetic components Hx, Hy, and Hz current density – mA / mm²).2 S21 coupling (leakage energy – dB / mm) value, spectral value (level spurious level from spectral scan), S11 (backhaul loss (dB) or impedance (ohms Ω) of an undesirable / unwanted antenna, which helps determine the radiating point λ / 4 (maximum) and λ / 10 (minimum) and operating frequency of a given noise source), and information describing the EM or thermal characteristics of the electronic device.

[0120] EM shielding materials can be selected based on the identification of specific components. Specific components may require shielding to mitigate noise generated by the component, thereby reducing EMI emitted or received by the component, for protection against EM attacks, or any other suitable cause. EM shielding materials can be determined based on criteria such as CTE mismatch, relative permeability (μr), skin depth (δ), and the relative skin effect of one or more EM shielding materials.

[0121] An EM diagram may also include the shielding depth associated with each EM shielding material at each location on the electronic device. This depth may be determined by criteria such as the shielding effectiveness (SE) of the potential EM shielding material, the thermal properties of the EM shielding material, and other relevant criteria. In some embodiments, the EM diagram may not include information about the EM shielding material or the shielding depth.

[0122] Method 900 may also include generating a thermal map indicating the location of thermal energy emitted from the electronic device (904). The thermal map may include regions characterized by temperature. The thermal map may also include thermal material to be applied at each location of the electronic device, determining a predetermined threshold for achieving thermal performance at each location of the electronic device.

[0123] Thermal materials can be selected based on the identification of specific components requiring a particular thermal performance. Alternatively, they can be selected based on factors such as CTE mismatch, thermal resistance (R), or other relevant criteria. Thermal materials can be applied to redirect heat energy, radiate heat energy, or shield heat energy.

[0124] In some embodiments, the thermal map may also include the material depth associated with each type of thermal material at each location on the electronic device. This depth may be determined by a threshold of thermal performance required at each location of the electronic device or other relevant criteria. In other embodiments, the thermal map may not include information about the thermal material or the material depth.

[0125] Method 900 may also include generating a shielding diagram from EM maps and thermal maps, including instructions (906) for controlling the shielding equipment to apply EM shielding material and thermal material to the electronic device. The shielding diagram may include a coordinate graph of a model and information about the EM radiation emitted from the electronic device, such as magnetic field strength (magnetic components Hx, Hy, and Hz current density – mA / mm²). 2 The data may include: S21 coupling (leakage energy – dB / mm) value, spectral value (horizontal spurious level from spectral scan), S11 (backhaul loss (dB) or impedance (ohms Ω) of the undesirable / unwanted antenna, which helps determine the λ / 4 (maximum) and λ / 10 (minimum) of the radiating point of a given noise source and the operating frequency), and other EM data. The shielding diagram may also include thermal data such as thermal resistance (R), junction-shell thermal resistance (θjc), and other relevant thermal data.

[0126] The shielding diagram may also include data, including the EM shielding material and associated shielding depth for each location on the electronic device. The shielding depth for each EM shielding material may be consistent across all locations on the electronic device or may vary at each location on the electronic device. The EM shielding material may differ at each location on the electronic device or may be consistent across the electronic device. In some embodiments, the EM shielding material is determined by a computing device when the shielding diagram is generated. In other embodiments, the EM shielding material is included in the EM diagram.

[0127] Similarly, a shielding map may include data on the thermal material and associated material depth at each location on the electronic device. The material depth for each thermal material may be consistent across all locations on the electronic device or may vary at each location on the electronic device. The thermal material may differ at each location on the electronic device or may be consistent across the electronic device. In some embodiments, the thermal material is determined by a computing device when the shielding map is generated. In other embodiments, the thermal material is included in the thermal map.

[0128] Method 900 may also include controlling a shielding device to apply EM shielding material and thermal material to an electronic device using a shielding pattern (908). The shielding device may be operable to deposit material onto the electronic device via electroplating or physical vapor deposition (PVD) sputtering to apply material to the electronic device. Sputtering may include ion beam sputtering, reactive sputtering, ion-assisted deposition, high target utilization sputtering, high-power pulsed magnetron sputtering, and gas flow sputtering.

[0129] In response to the shielding pattern, the shielding pattern can be deposited on an electronic device using techniques described herein, such as supported blanket sputtering, layering, or selective application. Those skilled in the art will recognize many different variations and possibilities for utilizing the benefits of this disclosure.

[0130] It should be understood that Figure 9 The specific steps illustrated provide specific methods for assembling circuit components according to various embodiments. Other sequences of steps may also be performed according to alternative embodiments. For example, alternative embodiments may perform the steps outlined above in a different order. Furthermore, Figure 9 The individual steps shown may include multiple sub-steps, which may be executed in a sequence suitable for the individual steps. Furthermore, additional steps may be added or removed depending on the specific application. Many variations, modifications, and substitutions also fall within the scope of this disclosure.

[0131] Figure 10 A flowchart illustrating a method 1000 for generating a composite shielding diagram using a computing device is provided. The method may include generating a model using information about the geometry, materials, and components of the model. The model may include a substrate made of glass, organic compounds, a PCB, or any other suitable material. The model may include a representation of an integrated circuit, a chip on a substrate, a flip-chip package, or any other type of electronic device. The model may include a 3D representation of the model.

[0132] Method 1000 may also include performing simulated operation on the model electronic device (1004). Simulation operation may include running the model at desired levels. Desired levels may include desired operating voltages and currents applied to various components of the modeled electronic device. Desired levels may also include desired operating frequencies of components (such as radio units or antennas). Simulation may include external factors. External factors may include EMI or thermal energy from external sources. These sources may be the result of other electronic devices within a larger system or from other devices isolated from the larger system. External factors may also include sources of thermal energy and EM radiation from typical operating environments.

[0133] Method 1000 may also include measuring and mapping hotspots, EM hotspots, λ / 4 points, accidental antennas, CTE values, thermal R values, and θjc values ​​(1006). EM hotspots may include the magnitudes of various frequencies of EM radiation and the strength of the magnetic field. λ / 4 points can be measured from accidental antennas and components intentionally emitting EM radiation.

[0134] Method 1000 may also include generating EM and heat maps stored in a LUT, including a coordinate and parameter matrix (1008). This LUT may include (x,y,z) coordinates of the model, EM hotspots, λ / 4 points, unexpected antennas, CTE values, thermal R values, and θjc values. The coordinate and parameter matrix can correlate data from thermal and EM measurements with each location on the electronic device.

[0135] Method 1000 may also include determining, by means of a computing device, an EM shielding material and its associated shielding depth, a thermal material and its associated material depth, and updating the model (1010). The computing device may determine that locations on the model require shielding against EM radiation of one or more frequencies. The computing device may utilize criteria such as CTE mismatch, relative permeability (μr), skin depth (δ), and relative skin effect between potential EM shielding layers. The computing device may determine that various alloys are suitable EM shielding materials. In some embodiments, the computing device may determine that a first layer of a first potential EM shielding material and a second layer of a second potential EM shielding material are appropriate. A dielectric layer may be used between the first and second potential EM shielding layers.

[0136] The computing device can select thermal materials and determine the material depth at each location on the electronic device based on predetermined thresholds for thermal performance. The thresholds for thermal performance can include heat conduction, absorption, or radiation. A database containing various thermal materials can be accessed by the computing device to achieve one or more predetermined thresholds for thermal performance. Furthermore, different locations on the modeled electronic device can include different thresholds for thermal performance, thus requiring the application of various thermal materials to various material depths.

[0137] Iteratively repeat blocks 1004-1010 until all locations on the model achieve the predetermined threshold for EM radiative effectiveness. Iteratively repeat blocks 1004-1010 until all locations on the model achieve the predetermined threshold for thermal effectiveness. Updates can be made after each iteration. Figure 4 LUT and block 1008 in the middle.

[0138] Method 1000 may include verifying EM maps and thermal maps by performing EM scans and thermal scans of a prototype device. EM scans may be performed using a computing device. The scans may examine each location on the prototype and measure the amount of EM radiation emitted by the prototype at that location. Multiple scans may be performed for multiple frequencies of EM radiation.

[0139] EM scans can then be combined and correlated with a coordinate graph of the prototype to generate an EM map of the prototype, thereby illustrating the magnitudes of EM radiation at multiple frequencies at all locations on the prototype. The prototype's EM map can be compared with the final EM map. If differences are found between the prototype's EM map and the final EM map, the EM scan can be repeated or correlated with the model.

[0140] Thermal scanning can be performed using a computing device equipped with thermal imaging equipment. The results of the thermal scan are then correlated with the coordinate graph of the prototype to generate a thermal image of the prototype. The thermal image of the prototype can then be compared with the thermal image. If differences are found between the thermal images of the prototype, the thermal scan can be repeated. Simulation operations of the model or model corrections can also be repeated.

[0141] Method 1000 may also include generating a comprehensive shielding diagram using a computing device, including EM shielding materials and thermal materials. The shielding diagram may include a coordinate graph of a model of EM radiation emitted from the electronic device, such as magnetic field strength (magnetic components Hx, Hy, and Hz current density – mA / mm²). 2 The data may include: S21 coupling (leakage energy – dB / mm) value, spectral value (horizontal spur level from spectral scan), S11 (backhaul loss (dB) or impedance (ohms Ω) of the undesirable / unwanted antenna, which helps determine the radiating point λ / 4 (maximum) and λ / 10 (minimum) and operating frequency of a given noise source), and other relevant EM data. The shielding diagram may also include thermal data such as thermal resistance (R), junction-shell thermal resistance (θjc), and other relevant thermal data.

[0142] The shielding diagram may also include data, including the EM shielding material and associated shielding depth for each location on the electronic device. The shielding depth for each EM shielding material may be consistent across all locations on the electronic device or may vary at each location on the electronic device. The EM shielding material may differ at each location on the electronic device or may be consistent across the electronic device.

[0143] Similarly, the shielding diagram may include data on the thermal material and associated material depth at each location on the electronic device. The material depth for each thermal material may be consistent across all locations on the electronic device or may vary at each location on the electronic device. The thermal material may differ at each location on the electronic device or may be consistent across the electronic device.

[0144] It should be understood that Figure 10 The specific steps illustrated provide specific methods for protecting communication between two processors according to various embodiments. Other sequences of steps may also be performed according to alternative embodiments. For example, alternative embodiments may perform the steps outlined above in a different order. Furthermore, Figure 10 The individual steps shown may include multiple sub-steps, which may be adapted to be executed in a sequence of individual steps. Furthermore, additional steps may be added or removed depending on the specific application. Many variations, modifications, and substitutions also fall within the scope of this disclosure.

[0145] Each of the methods described herein can be implemented by a computer system. Each step of these methods can be performed automatically by the computer system and / or may involve input / output involving a user. For example, a user can provide input for each step of the method, and each of these inputs can respond to a specific output requested for that input, wherein the output is generated by the computer system. Each input can be received in response to a corresponding requested output. Furthermore, input can be received from a user, received as a data stream from another computer system, retrieved from a memory location, retrieved on a network, requested from a network service, and / or the like. Similarly, output can be provided to a user, provided as a data stream to another computer system, stored in a memory location, transmitted on a network, provided to a network service, and / or the like. In short, each step of the methods described herein can be performed by a computer system and can involve any number of inputs, outputs, and / or requests to and from a computer system that may or may not involve a user. Those steps that do not involve a user can be considered to be performed automatically by the computer system without human intervention. Therefore, it will be understood that, in view of this disclosure, each step of each method described herein may be modified to include inputs and outputs to and from the user, or may be performed automatically by a computer system without human intervention, wherein any decision may be made by a processor. Furthermore, some embodiments of each of the methods described herein may be implemented as a set of instructions stored on a tangible, non-transitory storage medium to form a tangible software product.

[0146] Figure 11 An exemplary computer system 1100 in which various embodiments can be implemented is shown. System 1100 can be used to implement any of the computer systems described above. As shown, computer system 1100 includes a processing unit 1104 that communicates with a plurality of peripheral subsystems via a bus subsystem 1102. These peripheral subsystems may include a processing acceleration unit 1106, an I / O subsystem 1108, a storage subsystem 1118, and a communication subsystem 1124. Storage subsystem 1118 includes a physical computer-readable storage medium 1122 and system memory 1110.

[0147] Bus subsystem 1102 provides mechanisms for enabling the various components and subsystems of computer system 1100 to communicate with each other as desired. Although bus subsystem 1102 is schematically illustrated as a single bus, alternative embodiments of the bus subsystem may utilize multiple buses. Bus subsystem 1102 may be any of several types of bus architectures, including memory buses or memory controllers, peripheral buses, or local buses using any of various bus architectures. For example, such architectures may include Industry Standard Architecture (ISA) buses, MicroChannel Architecture (MCA) buses, Enhanced ISA (EISA) buses, Video Electronics Standards Association (VESA) local buses, and Peripheral Component Interconnect (PCI) buses, which may be implemented as Mezzanine buses constructed according to the IEEE P1386.1 standard.

[0148] A processing unit 1104, which may be implemented as one or more integrated circuits (e.g., a conventional microprocessor or microcontroller), controls the operation of a computer system 1100. One or more processors may be included in the processing unit 1104. These processors may include single-core or multi-core processors. In some embodiments, the processing unit 1104 may be implemented as one or more independent processing units 1132 and / or 1134, each including a single-core or multi-core processor. In other embodiments, the processing unit 1104 may also be implemented as a quad-core processing unit formed by integrating two dual-core processors into a single chip.

[0149] In various embodiments, processing unit 1104 can execute various programs in response to program code and can maintain multiple concurrently executing programs or processes. At any given time, some or all of the program code to be executed can reside in processor 1104 and / or storage subsystem 1118. Through appropriate programming, processor 1104 can provide the various functions described above. Computer system 1100 may additionally include processing acceleration unit 1106, which may include digital signal processor (DSP), special application processor, and / or the like.

[0150] I / O subsystem 1108 may include user interface input devices and user interface output devices. User interface input devices may include keyboards, pointing devices (such as mice or trackballs), touchpads or touchscreens integrated into displays, scroll wheels, click wheels, dial pads, buttons, switches, keypads, audio input devices with voice command recognition systems, microphones, and other types of input devices. User interface input devices may include, for example, those from Microsoft... Motion sensors are motion sensing and / or gesture recognition devices that enable users to control and interact with input devices via a natural user interface using gestures and verbal commands, such as Microsoft input devices. 360 Game Controller. User interface input devices may also include, for example, Google... Blink detectors are eye gesture recognition devices that detect eye movements from a user (e.g., blinking when taking a photo and / or making menu selections) and translate the eye gestures into an input device (e.g., Google). Input in the context of voice commands and speech recognition systems. Additionally, user interface input devices may include those enabling users to input via voice commands and speech recognition systems (e.g., (Navigation device) Interactive voice recognition sensing device.

[0151] User interface input devices may also include, but are not limited to, 3D mice, joysticks or pointers, gaming keyboards and drawing tablets, as well as audio / visual devices such as speakers, digital cameras, digital portable cameras, portable media players, webcams, image scanners, fingerprint scanners, barcode readers, 3D scanners, 3D printers, laser rangefinders, and eye-tracking devices. Furthermore, user interface input devices may include, for example, medical imaging input devices, such as computational tomography, magnetic resonance imaging, positional emission tomography, and medical ultrasound examination devices. User interface input devices may also include, for example, audio input devices, such as MIDI keyboards, digital musical instruments, and the like.

[0152] User interface output devices may include a display subsystem, indicator lights, or non-visual displays such as audio output devices. Display subsystems may be cathode ray tubes (CRTs), flat panel devices (such as those using liquid crystal displays (LCDs) or plasma displays), projection devices, touch screens, and the like. Generally, the term "output device" is intended to include all possible types of means and mechanisms for outputting information from computer system 1100 to the user or other computers. For example, user interface output devices may include, but are not limited to, various display devices that visually convey text, graphics, and audio / video information, such as monitors, printers, speakers, headsets, automatic navigation systems, plotters, voice output devices, and modems.

[0153] Computer system 1100 may include storage subsystem 1118, which includes software elements, denoted as those currently located in system memory 1110. System memory 1110 may store program instructions that are loadable and executable on processing unit 1104, as well as data generated during the execution of these programs.

[0154] Depending on the architecture and type of the computer system 1100, system memory 1110 may be volatile (such as random access memory (RAM)) and / or non-volatile (such as read-only memory (ROM), flash memory, etc.). RAM typically contains data and / or program modules that can be immediately accessed by processing unit 1104 and / or are currently being operated and executed by processing unit 1104. In some embodiments, system memory 1110 may include various types of memory, such as static random access memory (SRAM) or dynamic random access memory (DRAM). In some embodiments, a basic input / output system (BIOS) containing basic routines, such as those that facilitate the transfer of information between components within the computer system 1100 during startup, may typically be stored in ROM. For example, and without limitation, system memory 1110 also includes application 1112 (which may include client applications, web browsers, mid-level applications, relational database management systems (RDBMS), etc.), program data 1114, and operating system 1116. For example, operating system 1116 may include various versions of Microsoft... Apple and / or Linux operating system, various commercially available... Or a UNIX-like operating system (including, without restriction, various GNU / Linux operating systems, Google...) OS, and similar) and / or mobile operating systems, such as iOS, Phone OS 10OS and OS operating system.

[0155] Storage subsystem 1118 may also provide a tangible computer-readable storage medium for storing basic programming and data construction that provide functionality according to some embodiments. Software (programs, code modules, instructions) that provides the functions described above when executed by a processor may be stored in storage subsystem 1118. These software modules or instructions may be executed by processing unit 1104. Storage subsystem 1118 may also provide a repository for storing data used according to some embodiments.

[0156] Storage subsystem 1100 may also include computer-readable storage medium reader 1120, which may be further connected to computer-readable storage medium 1122. Together with and, where appropriate, in conjunction with system memory 1110, computer-readable storage medium 1122 may collectively represent remote, local, fixed, and / or removable storage devices plus storage media for temporarily and / or more permanently containing, storing, transmitting, and retrieving computer-readable information.

[0157] The computer-readable storage medium 1122 containing code, or portions thereof, may also include any suitable medium, including storage and communication media, such as, but not limited to, volatile and non-volatile, removable and non-removable media implemented in any method or technique for storing and / or transmitting information. This may include tangible computer-readable storage media, such as RAM, ROM, electronically erasable programmable ROM (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile disk (DVD), or other optical storage, cassette tape, magnetic tape, disk storage or other magnetic storage devices, or other tangible computer-readable media. This may also include non-tangible computer-readable media, such as data signals, data transmissions, or any other medium that can be used to transmit desired information and is accessible by the computing system 1100.

[0158] For example, computer-readable storage medium 1122 may include a hard disk drive that reads from or writes to a non-removable non-volatile magnetic medium, a disk drive that reads from or writes to a removable non-volatile disk, and a removable non-volatile optical disc drive (such as a CD-ROM, DVD, etc.). An optical disc drive that reads or writes to a removable, non-volatile optical disc (or other optical media). Computer-readable storage medium 1122 may include, but is not limited to, […]. Disk drives, flash memory cards, universal serial bus (USB) flash drives, secure digital (SD) cards, DVD disks, digital video tapes, and the like. Computer-readable storage media 1122 may also include: solid-state drives (SSDs) based on non-volatile memory, such as flash-based SSDs, enterprise flash drives, solid-state ROMs, and the like; volatile memory-based SSDs, such as solid-state RAM, dynamic RAM, static RAM, DRAM-based SSDs, magnetoresistive RAM (MRAM) SSDs; and hybrid SSDs using a combination of DRAM and flash-based SSDs. Disk drives and their associated computer-readable media provide non-volatile storage for computer-readable instructions, data structures, program modules, and other data for computer system 1100.

[0159] The communication subsystem 1124 provides an interface to other computer systems and networks. The communication subsystem 1124 serves as an interface for receiving data from and sending data to other systems from computer system 1100. For example, the communication subsystem 1124 enables computer system 1100 to connect to one or more devices via the Internet. In some embodiments, the communication subsystem 1124 may include radio frequency (RF) transceiver components (e.g., using cellular phone technology, advanced data network technologies such as 3G, 4G, or EDGE (Global Evolution Enhanced Data Rate)), WiFi (IEEE 802.11 family of standards, or other mobile communication technologies, or any combination thereof), global positioning system (GPS) receiver components, and / or other components for accessing wireless voice and / or data networks. In some embodiments, in addition to or instead of a wireless interface, the communication subsystem 1124 may provide wired network connectivity (e.g., Ethernet).

[0160] In some embodiments, the communication subsystem 1124 may also receive input communications in the form of structured and / or unstructured data feeds 1126, event streams 1128, event updates 1130, and the like on behalf of one or more users who may use the computer system 1100.

[0161] For example, the communication subsystem 1124 may be configured to receive data feeds 1126 in real time from users of social networks and / or other communication services, such as feed, Updates, web feeds (such as Rich Site Summary (RSS) feeds) and / or real-time updates from one or more third-party information sources.

[0162] Furthermore, the communication subsystem 1124 may also be configured to receive data in the form of a continuous data stream, which may include an event stream 1128 of real-time events and / or event updates 1130 that may be continuous or boundless without a definite end. Examples of applications that generate continuous data may include, for example, sensor data applications, financial instruments, network performance measurement tools (e.g., network monitoring and traffic management applications), point-and-click stream analysis tools, automatic traffic monitoring, and the like.

[0163] The communication subsystem 1124 may also be configured to output structured and / or unstructured data feeds 1126, event streams 1128, event updates 1130, and the like to one or more databases that can communicate with one or more streaming data source computers coupled to the computer system 1100.

[0164] Computer system 1100 can be one of various types, including handheld portable devices (e.g., Cellular phone Computing tablets, PDAs), and wearable devices (e.g., Google). Head-mounted displays, PCs, workstations, mainframes, public information kiosks, server racks, or any other data processing systems.

[0165] Due to the ever-changing nature of computers and networks, the description of the computer system 1100 depicted in the figures is intended only as a concrete example. Many other configurations with more or fewer components than the system depicted in the figures are possible. For example, custom hardware and / or specific components may be implemented in hardware, firmware, software (including small applications), or a combination thereof. Additionally, connections to other computing devices (such as network input / output devices) may be employed. Other ways and / or methods of implementing the various embodiments should be apparent based on the disclosure and teaching provided herein.

[0166] As used herein, the terms “about,” “approximately,” or “substantially” may be interpreted as being within the range expected by a person of ordinary skill in accordance with this specification.

[0167] In the foregoing description, several specific details are set forth for illustrative purposes in order to provide a thorough understanding of the various embodiments. However, it will be apparent that some embodiments may be practiced without some of these specific details. In other instances, well-known structures and apparatuses are illustrated in block diagram form.

[0168] The above description provides exemplary embodiments only and is not intended to limit the scope, applicability, or construction of this disclosure. Rather, the above description of the various embodiments is intended to provide an enabling disclosure for implementing at least one embodiment. It should be understood that various changes can be made to the function and arrangement of the elements without departing from the spirit and scope of some of the embodiments set forth in the appended claims.

[0169] Specific details are set forth in the foregoing description to provide a thorough understanding of this disclosure. However, it will be understood that embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be illustrated as components in the form of block diagrams so as not to obscure the embodiments with unnecessary details. In other instances, well-known circuits, processes, algorithms, structures, and technologies may be illustrated without unnecessary details in order to avoid obscuring the embodiments.

[0170] Furthermore, it should be noted that independent embodiments can be described as processes, which are depicted as flowcharts, flow diagrams, data flow diagrams, structure diagrams, or block diagrams. Although a flowchart can describe operations as a continuous process, many operations can be performed in parallel or simultaneously. Furthermore, the order of operations can be rearranged. A process may terminate when its operations are completed, but may have additional steps not included in the diagram. A process may correspond to a method, function, program, subroutine, subroutine, etc. When a process corresponds to a function, its termination may correspond to the function returning to the calling function or the main function.

[0171] The term "computer-readable medium" includes, but is not limited to, portable or fixed storage devices, optical storage devices, wireless channels, and various other media capable of storing, containing, or carrying instructions and / or data. A code segment or machine-executable instruction can represent any combination of programs, functions, subroutines, routines, subroutines, modules, software packages, classes, or instructions, data structures, or program statements. A code segment can be coupled to another code segment or hardware circuit by passing and / or receiving information, data, arguments, parameters, or memory contents. Information, arguments, parameters, data, etc., can be passed, forwarded, or transmitted via any suitable means, including memory sharing, message passing, symbol passing, network transmission, etc.

[0172] Furthermore, embodiments may be implemented using hardware, software, firmware, middleware, microcode, hardware description languages, or any combination thereof. When implemented in software, firmware, middleware, or microcode, program code or code segments for performing the necessary tasks may be stored in a machine-readable medium. The processor can then perform the necessary tasks.

[0173] In the foregoing description, features are described with reference to specific embodiments thereof; however, it should be understood that not all embodiments are limited thereto. Various features and aspects of some embodiments may be used independently or in combination. Furthermore, embodiments may be utilized in any number of environments and applications beyond those described herein without departing from the broader spirit and scope of the specification. The specification and drawings are therefore to be considered illustrative rather than restrictive.

[0174] Furthermore, for illustrative purposes, the methods are described in a specific order. It should be understood that in alternative embodiments, the methods may be performed in a different order than described. It should also be understood that the methods described above may be executed by hardware components or may be embodied in a sequence of machine-executable instructions that can be used to cause a machine (such as a general-purpose or special-purpose processor or logic circuit) to perform the methods. These machine-executable instructions may be stored on one or more machine-readable media, such as a CD-ROM or other types of optical disks, floppy disks, ROM, RAM, EPROM, EEPROM, magnetic cards or optical cards, flash memory, or other types of machine-readable media suitable for storing electronic instructions. Alternatively, the methods may be executed by a combination of hardware and software.

Claims

1. A method for controlling a manufacturing process for applying materials to an electronic device, the method comprising the steps of: Generate an electromagnetic (EM) diagram of an electronic device, the EM diagram indicating the location of EM radiation emitted from the electronic device; Generate a thermal map of the electronic device, the thermal map indicating the location of thermal energy emitted from the electronic device; A shielding diagram is generated from the EM image and the heat map. The shielding diagram includes instructions for controlling the shielding device, which include: The location on the electronic device for applying EM shielding material; and The location on the electronic device for applying heat material; and The shielding diagram is used to control the shielding device to apply the EM shielding material and the thermal material to the electronic device.

2. The method of claim 1, wherein the step of generating the EM image further comprises the following steps: A model of the electronic device was simulated to measure EM radiation; Determine the location of the EM radiation on the electronic device; A mapping of the location of the EM radiation on the electronic device; as well as The location on the electronic device to be applied with EM shielding material is determined.

3. The method of claim 2, further comprising the following steps: Generate a model of the electronic device.

4. The method of claim 1, wherein the step of generating the heatmap comprises the following steps: A model of the electronic device was simulated to measure its thermal behavior. Determines the location of thermal energy on the electronic device; Generate a thermal image of the electronic device; as well as The location on the electronic device to be heated is determined.

5. The method of claim 1, wherein the step of generating the EM image further comprises the following steps: Receive data from a prototype that detects the electronic device; Measure the EM radiation scanned from the electronic device; Determine the location of the EM radiation generated on the electronic device; as well as A diagram showing the location of the EM radiation generated on the electronic device.

6. The method of claim 1, wherein the step of generating the heatmap further comprises the following steps: Receive data from a prototype that detects the electronic device; Receive thermal scan data from the electronic device; Determine the location of thermal energy on the electronic device; and A thermal image of the electronic device is generated.

7. The method of claim 1, wherein the EM map and the heatmap comprise (x,y,z) coordinates.

8. The method of claim 1, wherein the step of generating the EM map comprises the step of: identifying locations vulnerable to EM attacks.

9. The method of claim 8, wherein the step of identifying the vulnerable EM attack location comprises the step of identifying the location of the antenna.

10. A non-transitory computer-readable medium comprising instructions that, when executed by one or more processors, cause the one or more processors to perform operations comprising: A receiving electronic device electromagnetic (EM) graph, the EM graph indicating the location of EM radiation generated on the electronic device; Receive a thermal image of the electronic device, the thermal image indicating the location of heat generated on the electronic device; and A shielding diagram is generated from the EM image and the heat map. The shielding diagram includes instructions for controlling the shielding device, which include: The location on the electronic device for applying EM shielding material; and The location on the electronic device for applying heat material; and The shielding diagram is provided to the shielding device to apply the EM shielding material and the thermal material to the electronic device.

11. The non-transitory computer-readable medium of claim 10, wherein generating the masking diagram further comprises: One or more EM shielding materials to be applied to each location are determined based on one or more frequencies; and The depth of each type of thermal material to be applied to each location is determined based on the magnitude of each frequency.

12. The non-transitory computer-readable medium of claim 10, wherein generating the masking diagram further comprises: Map one or more thermal materials to each location based on a predetermined threshold of thermal efficiency; and The shielding depth of each thermal material is mapped to each location based on the amount of thermal energy.

13. The non-transitory computer-readable medium of claim 10, wherein providing the shielding pattern comprises sending the shielding pattern from a first computing device to a shielding device operable to deposit EM shielding material and thermal material on the electronic device.

14. The non-transitory computer-readable medium of claim 10, wherein providing the shielding diagram includes causing multiple components of a computing device to execute commands, the commands controlling a shielding device operable to deposit EM shielding material and thermal material on the electronic device.

15. A system comprising: Shielding equipment operable to deposit electromagnetic (EM) shielding materials and thermal materials on electronic devices; One or more processors; as well as One or more memory devices containing instructions that, when executed by the one or more processors, cause the one or more processors to perform operations including: A receiving electronic device electromagnetic (EM) graph, the EM graph indicating the location of EM radiation generated on the electronic device; Receive a thermal image of the electronic device, the thermal image indicating the location of heat energy generated on the electronic device; A shielding diagram is generated from the EM image and the heat map. The shielding diagram includes instructions for controlling the shielding device, which include: The location on the electronic device for applying EM shielding material; and The location on the electronic device for applying heat material; and The shielding diagram is provided to the shielding device to apply the EM shielding material and the thermal material to the electronic device.

16. The system of claim 15, wherein the shielding device is operable to apply the EM shielding material and the thermal material via electroplating according to the shielding pattern.

17. The system of claim 15, wherein the shielding device is operable to apply the EM shielding material and the thermal material via sputtering according to the shielding pattern, wherein the shielding device is further operable to deposit at least one layer of EM shielding material to a first shielding depth varying with the frequency of EM radiation and to deposit a layer of thermal material to the material depth.

18. The system of claim 17, wherein the at least one EM shielding material comprises an electrical conductor for high-frequency EM shielding and a magnetic conductor for low-frequency shielding.

19. The system of claim 17, wherein the at least one EM shielding material comprises an alloy layer that provides high-frequency EM shielding and low-frequency EM shielding within a predetermined threshold.

20. The system of claim 15, wherein the electronic device comprises one or more integrated circuit packages mounted on a substrate made of glass or organic material.

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