一种抛光液供给系统及抛光设备
By designing a self-circulating flow and rotating nozzle unit for the polishing slurry supply system, the problem of wafer scratches caused by polishing slurry crystallization was solved, improving the quality of polished products and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2023-12-07
- Publication Date
- 2026-07-17
AI Technical Summary
In existing polishing slurry supply systems, the polishing slurry is prone to crystallization during use, which can cause wafer scratches and affect quality. At the same time, regularly cleaning the slurry tank increases labor and time costs.
Design a polishing slurry supply system, including a storage container, a supply pipeline and a return pipeline. The supply pipeline supplies slurry to the polishing device, and the return pipeline enables the polishing slurry to circulate itself. Combined with a rotating nozzle unit and stirring blades, the flowability of the polishing slurry is enhanced and crystal precipitation is reduced.
By utilizing the self-circulating flow of the polishing slurry, crystal precipitation is reduced, the risk of wafer scratches is lowered, the concentration of the polishing slurry is kept stable, and the cost of the raw material and manpower input are reduced.
Smart Images
Figure CN117718893B_ABST