A slicing device for chip multilayer ceramic capacitors

Abstract

The application relates to a chip multilayer ceramic capacitor cutting device and relates to the field of electronic component processing equipment. The device comprises a supporting assembly, a placing assembly, a cleaning assembly and a cutting assembly. The supporting assembly comprises a supporting table and a working bin. The working bin is fixed to the top of the supporting table. An operation opening is arranged in the sidewall of the working bin. The placing assembly comprises a rotating disc, a cutting table for placing the chip multilayer ceramic capacitor and a first lifting piece. The rotating disc comprises a first rotating plate and a second rotating plate. The first rotating plate is connected to the supporting table. The second rotating plate is connected to the side, away from the supporting table, of the first rotating plate. A lifting groove for the cutting table to pass through is arranged in the second rotating plate. The first lifting piece is used for driving the cutting table to move. The cleaning assembly comprises at least one cleaning piece and at least one sliding piece. The cleaning piece is used for cleaning the surface of the cutting table. The sliding piece is used for driving the cleaning piece to move. The cutting assembly is used for cutting the chip multilayer ceramic capacitor. The application has the effect of improving the cleaning of the surface of the cutting table.

Description

Technical Field

[0001] This application relates to the field of electronic component processing equipment, and in particular to a chip multilayer ceramic capacitor cutting device. Background Technology

[0002] The rapid development of the electronics industry has led to the widespread application of surface-mount electronic components in various industries. The emergence of a large number of new electronic components (especially surface-mount components) has required more advanced processing equipment and higher technical requirements for various electronic components. In the manufacturing process of surface-mount electronic components, cutting is an important process that can cut stacked and isostatically pressed ceramic sheets into many microelectronic components with precise dimensions and good consistency.

[0003] In related technologies, application document CN1544216A discloses a multi-layer ceramic capacitor-inductor cutting machine, which consists of a machine frame, a worktable, a cutting mechanism, a camera device, and a control system. The camera device is mounted on the machine frame and is always aligned with the upper surface of the worktable. The cutting mechanism, which can perform vertical cutting, is located above the worktable and connected to the machine frame. The worktable, which can rotate in the horizontal plane and move in the forward and backward directions, is controlled by the control system. The camera device provides image information to the control system. The cutting mechanism is controlled by the control system. The cutting plate is mounted on the upper surface of the worktable. The camera device collects the position information of the cutting plate. The control system adjusts the position of the worktable so that the screen printing line on the cutting plate is aligned with the cutting blade in the cutting mechanism. Then, the control system commands the cutting blade to cut down to complete the processing task.

[0004] Regarding the aforementioned technologies, by mounting the bar sheet on the worktable, the control system adjusts the worktable to a suitable position, and then the control system controls the cutter to complete the processing task. However, when the cutter cuts the bar sheet, waste chips are generated and fall onto the surface of the carrier plate, making it difficult to clean the surface of the carrier plate. Summary of the Invention

[0005] To address the problem of difficulty in cleaning the surface of the carrier plate, this application provides a chip-type multilayer ceramic capacitor cutting device.

[0006] The technical solution of the multi-layer ceramic capacitor cutting device provided in this application is as follows: A multilayer ceramic capacitor cutting device includes a support assembly, a placement assembly, a cleaning assembly, and a cutting assembly. The support assembly includes a support platform and a working chamber. The working chamber is fixed to the top of the support platform and is hollow. An operation port is provided on the side wall of the working chamber. The placement assembly is located on the side of the working chamber near the support platform. The placement assembly includes a turntable, a cutting table for placing the multilayer ceramic capacitor, and a first lifting component. The turntable includes a first rotating plate and a second rotating plate. The first rotating plate is connected to the support platform, and the second rotating plate is connected to the side of the first rotating plate away from the support platform. A receiving cavity is formed between the first rotating plate and the second rotating plate for accommodating the cutting table. A lifting groove is provided on the second rotating plate for the cutting table to pass through. The cutting table is slidably disposed on the second rotating plate and can move towards or away from the first rotating plate. The first lifting component is connected to the first rotating plate and is used to drive the cutting table to move. The cleaning assembly includes at least one cleaning component and at least one sliding component. The cleaning component is slidably connected to the second rotating plate on the side near the first rotating plate. The sliding direction of the cleaning component is perpendicular to the setting direction of the first rotating plate and the second rotating plate. The cleaning component is used to clean the surface of the cutting table. The sliding component is connected to the second rotating plate and is used to drive the cleaning component to move. The cutting assembly is fixed to the working chamber and is used to cut multilayer ceramic capacitors.

[0007] By adopting the above technical solution, when cutting multilayer ceramic chip capacitors, firstly, the capacitor to be cut is placed on the cutting table. Then, the turntable is moved to a suitable position. During the turntable's movement, the cutting table moves synchronously with it until it reaches the appropriate position. Subsequently, the cutting assembly is activated, enabling it to cut the multilayer ceramic chip capacitor. After cutting is complete, personnel remove the cut capacitor through the operating port. Following these steps, the remaining multilayer ceramic chip capacitors can be cut. Waste chips generated during cutting fall onto the cutting table. When cleaning the cutting table is required, the first lifting mechanism is activated. The first lifting component drives the cutting table to move towards the side closer to the first rotating plate until the cutting table is located in the receiving cavity. Then, the sliding component is activated, which drives the cleaning component to move. During the movement of the cleaning component, the cleaning component can clean the surface of the cutting table. Compared with related technologies, this application can cut multilayer ceramic chip capacitors through the cutting component. The waste generated after cutting the multilayer ceramic chip capacitors falls onto the cutting table. The first lifting component moves the cutting table into the receiving cavity, and the sliding component drives the cleaning component to clean the surface of the cutting table. This facilitates the cleaning of the cutting table surface, helps to reduce the contamination of the remaining uncut multilayer ceramic chip capacitors, and helps to improve the problem of not being able to clean the surface of the cutting table.

[0008] Optionally, the cleaning assembly further includes at least one cleaning plate, the cleaning plate being horizontally arranged, the cleaning component being slidably disposed on the second rotating plate, the sliding direction of the cleaning plate being consistent with that of the cleaning component, the cleaning plate being connected to the sliding component, the cleaning component being connected to the side of the cleaning plate near the first rotating plate, the cutting table being located within the receiving cavity, and the cleaning plate being used to open or close the lifting groove.

[0009] By adopting the above technical solution, when it is necessary to cut a multilayer ceramic chip capacitor, firstly, the sliding component is activated, which drives the cleaning plate to move. The cleaning plate opens the lifting slot. Then, the first lifting component is activated, which drives the cutting table to move away from the first rotating plate. The cutting table passes through the lifting slot until it is moved to a suitable position. The multilayer ceramic chip capacitor to be cut is then placed on the cutting table, and the cutting assembly cuts the multilayer ceramic chip capacitor. When it is necessary to clean the surface of the cutting table, firstly, the first lifting component is activated, which drives the cutting table to move closer to the first rotating plate until the cutting table moves into the receiving cavity. Then, the sliding component is activated, which drives the cleaning plate to move. The cleaning plate can close the lifting groove. During the movement of the cleaning plate, the cleaning component moves with the cleaning plate and can clean the cutting table. By setting the cleaning plate, on the one hand, when the cleaning plate moves, the cleaning component is connected to the cleaning plate and moves with the cleaning plate. The cleaning component cleans the surface of the cutting table, which helps to reduce the shaking of the cleaning component during cleaning and facilitates the cleaning of the cutting table surface. On the other hand, when there is no need to cut the multilayer ceramic capacitor, the cutting table is located in the receiving cavity, and the cleaning plate can close the lifting groove, which helps to reduce the amount of dust falling onto the surface of the cutting table through the lifting groove.

[0010] Optionally, a protective component is also included, which includes a protective door installed at the operating port and used to open or close the operating port.

[0011] By adopting the above technical solution and setting up a protective door, the operating port can be closed when there is no need to cut the multilayer ceramic capacitor, which helps to reduce the entry of dust into the lifting slot.

[0012] Optionally, a heating assembly is also included, comprising a heating plate and a temperature controller. The heating plate is fixed to the support platform near the working chamber. The heating plate is used to heat the multilayer ceramic capacitor and the cutting table. The temperature controller is fixed to the working chamber and is electrically connected to the heating plate.

[0013] By adopting the above technical solution, when it is necessary to cut a multilayer ceramic chip capacitor, firstly, the temperature of the heating stage is set by the temperature controller, and then the multilayer ceramic chip capacitor to be cut is placed on the heating plate. Since the outer surface of the multilayer ceramic chip capacitor to be cut is covered with ceramic, it is heated before cutting to soften the ceramic on its surface, making it easier to cut. After heating is completed, the multilayer ceramic chip capacitor is placed on the cutting stage for cutting. At the same time, the heating plate will also heat up the cutting stage. In this way, the multilayer ceramic chip capacitor maintains its temperature throughout the entire cutting process and remains in a heated and softened state, making the cutting process easier.

[0014] Optionally, the cleaning component includes a sponge connected to the cleaning plate, the sponge being used to clean the surface of the cutting table.

[0015] By adopting the above technical solution, when the surface of the cutting table needs to be cleaned, the sliding component is activated, which drives the cleaning plate to move. At this time, the sponge moves with the cleaning plate and can clean the surface of the cutting table. By setting the sponge, on the one hand, the sponge helps to reduce the wear and tear on the cutting table during cleaning; on the other hand, after the cutting of the multilayer ceramic capacitor is completed, the cutting table stops heating and is located in the receiving cavity. The surface of the cutting table may be covered with moisture due to cooling, and the sponge can absorb the water.

[0016] Optionally, a first baffle is fixed to the side of the first rotating plate near the second rotating plate, a second baffle is fixed to the side of the second rotating plate near the first rotating plate, an insertion frame is fixed to the side of the second baffle on the second rotating plate near the first rotating plate, and a slot for inserting the insertion frame is provided on the side of the first baffle on the first rotating plate near the second rotating plate. The sponge is detachably connected to the cleaning plate.

[0017] By adopting the above technical solution, when the sponge needs to be replaced, firstly, the operator pulls the second rotating plate. At this time, the second rotating plate moves away from the first rotating plate, and the insertion frame separates from the slot. During the movement of the second rotating plate, the sliding part moves with the second rotating plate. Then, the sponge on the cleaning plate is removed, the sponge to be replaced is fixed to the cleaning plate, and then the second rotating plate is connected to the first rotating plate. The insertion frame is inserted into the slot, which facilitates the replacement of the sponge and makes it easier to clean the surface of the cutting table.

[0018] Optionally, a control component is also included, comprising two cameras, a main control board, and a display screen. The two cameras are each located near the two side walls opposite the cutting table. The cameras are connected to the working chamber and are used to capture the edge lines of the chip ceramic capacitor. The main control board and the display screen are both fixed to the working chamber and are electrically connected to the main control board. The first lifting component, the sliding component, and the cutting component are all electrically connected to the main control board.

[0019] By adopting the above technical solution, the multilayer ceramic chip capacitor to be cut is placed on the cutting table, the control component is activated, and the camera is adjusted to a suitable position so that the edge line of the multilayer ceramic chip capacitor to be cut can be clearly identified. This confirms that the position of the multilayer ceramic chip capacitor to be cut is the appropriate cutting position. The camera can capture the edge line of the ceramic chip capacitor after preprocessing. The captured image is transmitted and displayed on the display screen of the main control mechanism. Based on the position data collected by the camera, the cutting process of the multilayer ceramic chip capacitor can also be simulated by the control component, reducing the possibility of subsequent cutting deviations from the expected position due to partial deviations in position adjustment, thus reducing workpiece damage. By setting up the control component, the first lifting component, the sliding component, and the cutting component can be moved simply by operating the control component.

[0020] Optionally, the cutting table is provided with a plurality of positioning holes, which are arranged in a matrix and penetrate the cutting table along the thickness direction.

[0021] By adopting the above technical solution and setting positioning holes, on the one hand, the multilayer ceramic chip capacitor to be cut is placed on the cutting table. The positioning holes allow the multilayer ceramic chip capacitor to be cut to be placed in a suitable position, which is convenient for placing the multilayer ceramic chip capacitor to be cut. On the other hand, when the sponge cleans the surface of the cutting table, some of the waste can fall off the cutting table through the positioning holes, which helps to reduce the accumulation of waste on the cutting table.

[0022] Optionally, the placement assembly further includes a platform, a drive unit, and a rotating unit. The platform is slidably disposed on the support platform and moves from the operation port to one side of the working chamber cavity. The drive unit is connected to the support platform and is used to drive the platform to move. The first rotating plate is rotatably connected to the platform. The rotating unit is connected to the platform and is used to drive the first rotating plate to move. Both the drive unit and the rotating unit are connected to the main control board.

[0023] By adopting the above technical solution, when it is necessary to cut multilayer ceramic chip capacitors, the position of the platform is adjusted and corrected by operating the main control board, so that the platform moves from the operating port to the inner cavity of the working chamber. The first rotating plate can move the platform, and the cutting table moves synchronously with the first rotating plate. Then, the multilayer ceramic chip capacitor is cut by the cutting assembly. During the cutting process, the platform moves according to the set cutting parameters. The cutting assembly completes one cut. The platform moves one end towards the cutting assembly by a pre-set cutting distance to complete the next cut. After the cutting in this direction is completed, the main control board controls the rotating component, which drives the first rotating plate to rotate 90° to perform a cut perpendicular to this direction. Through the cooperation of the platform, the driving component and the rotating component, it is convenient to cut multilayer ceramic chip capacitors.

[0024] Optionally, the placement assembly further includes a plurality of fasteners distributed circumferentially along the first baffle frame, the fasteners being connected to the first baffle frame and used to fix the first baffle frame and the insertion frame.

[0025] By adopting the above technical solution, when the sponge needs to be replaced, firstly, multiple fasteners are activated in sequence to separate the fasteners from the insertion frame, and then the second rotating plate is separated from the first rotating plate. After the sponge is replaced, the second rotating plate is connected to the first rotating plate, and then multiple fasteners are activated in sequence. The fasteners can fix the first stop frame and the insertion frame, which helps to increase the stability of the connection between the first rotating plate and the second rotating plate.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. Compared with related technologies, this application can cut multilayer ceramic chip capacitors using a cutting assembly. The waste generated after cutting the multilayer ceramic chip capacitors falls onto the cutting table. The first lifting component moves the cutting table into the receiving cavity, and the sliding component drives the cleaning component to clean the surface of the cutting table. This facilitates the cleaning of the cutting table surface, reduces the contamination of the remaining uncut multilayer ceramic chip capacitors, and helps to improve the problem of not being able to clean the surface of the cutting table. 2. By setting up a cleaning plate, on the one hand, it helps to reduce the shaking of the cleaning parts during cleaning, making it easier to clean the surface of the cutting table; on the other hand, the cleaning plate can close the lifting groove, which helps to reduce the amount of dust falling onto the surface of the cutting table through the lifting groove. 3. The cutting process of multilayer ceramic capacitors is simulated by the control component to reduce the workpiece loss caused by the subsequent cutting deviation due to partial deviation in position adjustment; by setting the control component, the first lifting component, the sliding component and the cutting component can be moved by simply operating the control component. Attached Figure Description

[0027] Figure 1 This is a structural schematic diagram from the first perspective in this embodiment; Figure 2 This is a cross-sectional view of this embodiment; Figure 3 This is a schematic diagram of the structure in which the components are placed in this embodiment; Figure 4 This is an exploded view of the components placed in this embodiment; Figure 5 This is a schematic diagram of the cutting table in this embodiment; Figure 6 This is a schematic diagram of the cleaning component in this embodiment; Figure 7 This is a structural schematic diagram from the second perspective in this embodiment.

[0028] Explanation of reference numerals in the attached drawings: 1. Support assembly; 11. Support platform; 111. Placement slot; 112. Insertion slot; 12. Working chamber; 121. Operating port; 122. Guide rail; 123. First protective slot; 124. Second protective slot; 2. Placement assembly; 21. Platform; 211. Sliding seat; 22. Driving component; 221. Drive motor; 222. Screw; 223. Guide rod; 23. Turntable; 231. First rotating plate; 2311. First stop frame; 2312. Slot; 232. Second rotating plate; 2321. Second stop frame; 2322. Insertion frame; 2323. Lifting slot; 2324. Slide groove; 24. Fixing component; 2 5. Rotating component; 26. Cutting table; 261. Positioning hole; 27. First lifting component; 3. Cleaning assembly; 31. Cleaning plate; 311. Slide rail; 32. Cleaning component; 321. Sponge; 33. Sliding component; 4. Cutting assembly; 41. Cutting blade; 42. Second lifting component; 5. Heating assembly; 51. Heating plate; 52. Temperature controller; 6. Control assembly; 61. Camera component; 611. Camera; 612. Support rod; 613. Linear motor; 614. Fill light; 62. Main control board; 63. Display screen; 64. Alarm; 65. Emergency stop switch; 7. Protective assembly; 71. Protective door; 72. Handle. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail.

[0030] This application discloses a cutting device for multilayer ceramic capacitors. (Refer to...) Figure 1 and Figure 2 A multilayer ceramic capacitor cutting device includes a support component 1 and a placement component 2, with the placement component 2 disposed on the support component 1.

[0031] Reference Figure 1The support assembly 1 includes a support platform 11 and a working chamber 12. In this embodiment, the support platform 11 is a rectangular platform and is fixed to the ground by screws. The working chamber 12 is located on top of the support platform 11. In this embodiment, the working chamber 12 is hollow and has an opening on the side of the working chamber 12 closest to the support platform 11. The working chamber 12 and the support platform 11 are integrated. The support platform 11 can support the working chamber 12. The working chamber 12 has an operation port 121 on one of its vertically oriented side walls, and the operation port 121 communicates with the interior of the working chamber 12.

[0032] Reference Figure 2 and Figure 3 and Figure 4 The placement component 2 is located on the support platform 11 near the working chamber 12. The placement component 2 includes a platform 21, a drive component 22, a turntable 23, multiple fixing components 24, a rotating component 25, a cutting table 26, and a first lifting component 27. The support platform 11 has a placement slot 111 on the side near the working chamber 12, and the placement slot 111 is positioned from the opening of the working chamber 12 towards the interior of the working chamber 12. The platform 21 is located within the placement slot 111 and is slidably mounted on the support platform 11. The sliding direction of the platform 21 is consistent with the setting direction of the placement slot 111. The top of the platform 21 is flush with the top of the support platform 11. In this embodiment, the drive component 22 includes a drive motor 221, a screw 222, and a guide rod 223. The drive motor 221 is located on the side of the support platform 11 away from the opening of the working chamber 12. The housing of the drive motor 221 is fixedly connected to the support platform by screws. 11. Both screw 222 and guide rod 223 are located at the bottom of placement groove 111. Screw 222 and guide rod 223 are horizontally and parallel to each other. The setting direction of screw 222 is consistent with the setting direction of placement groove 111. The distribution direction of screw 222 and guide rod 223 is perpendicular to the setting direction of placement groove 111. Both ends of screw 222 are rotatably connected to the side wall of placement groove 111. Both ends of guide rod 223 are welded to the side wall of placement groove 111. The output shaft of drive motor 221 passes through support platform 11 and is coaxially fixedly connected to one end of screw 222 through coupling. Drive motor 221 can drive screw 222 to rotate. Two sliding seats 211 are welded to the side of platform 21 near the bottom wall of placement groove 111. One sliding seat 211 is threaded to screw 222, and the other sliding seat 211 is slidably connected to guide rod 223.

[0033] Reference Figure 2 , Figure 3 and Figure 4In this embodiment, the turntable 23 is rectangular and located on the side of the platform 21 away from the placement slot 111. The turntable 23 includes a first rotating plate 231 and a second rotating plate 232. The second rotating plate 232 is located on the side of the first rotating plate 231 away from the platform 21. The first rotating plate 231 is rotatably connected to the platform 21. A first baffle 2311 is welded to the side of the first rotating plate 231 near the second rotating plate 232, forming a first slot. A second baffle 2321 is welded to the side of the second rotating plate 232 near the first rotating plate 231, forming a second slot. The second rotating plate 232 and the second baffle 2321 form a second slot. The second rotating plate 232 is located near the second baffle 2321 near the first rotating plate 231. An insertion frame 2322 is welded to one side of the rotating plate 231. The first rotating plate 231 has a slot 2312 for inserting the insertion frame 2322 on the side of the first stop frame 2311 near the second rotating plate 232. Multiple fasteners 24 are located on the first stop frame 2311 and are distributed around the first stop frame 2311. In this embodiment, the fasteners 24 are screws. After passing through the first stop frame 2311, the fasteners 24 extend into the slot 2312 and abut against the insertion frame 2322. The fasteners 24 are threaded to the first stop frame 2311. The fasteners 24 can fix the first rotating plate 231 and the second rotating plate 232. The first rotating plate 231 and the second rotating plate 232 form a receiving cavity.

[0034] Reference Figure 3 , Figure 4 and Figure 5 The rotating component 25 includes a rotary motor located on the side of the platform 21 near the placement slot 111. The motor housing is fixedly connected to the platform 21 by screws. The output shaft of the rotary motor passes through the platform 21 and is welded to the first rotating plate 231. The output shaft of the rotary motor is rotatably connected to the platform 21. The rotary motor drives the turntable 23 to rotate. The cutting table 26 is located on the side of the turntable 23 away from the platform 21. The cutting table 26 can be circular or rectangular. In this embodiment, the cutting table 26 is rectangular. The cutting table 26 has multiple positioning holes 261 arranged in a matrix. The positioning holes 261 are along the thickness of the cutting table 26. A cutting table 26 is provided, which has a cutting area and can hold a multilayer ceramic chip capacitor. A lifting groove 2323 is provided on the second rotating plate 232, which is connected to the receiving cavity. A first lifting component 27 is located in the receiving cavity. The first lifting component 27 is a driving cylinder, which is vertically set. The cylinder body of the driving cylinder is fixedly connected to the first rotating plate 231 by screws. The piston rod of the driving cylinder faces the cutting table 26 and is welded to the cutting table 26. The driving cylinder can drive the cutting table 26 to move closer to or away from the first rotating plate 231, and the cutting table 26 can be located in the receiving cavity.

[0035] Reference Figure 4 and Figure 6 A multi-layer ceramic capacitor cutting device also includes a cleaning component 3, which is disposed on the placement component 2.

[0036] Reference Figure 4 and Figure 6 The cleaning component 3 is located within the receiving cavity. The cleaning component 3 includes at least one cleaning plate 31, at least one cleaning element 32, and at least one sliding element 33. In this embodiment, there are two cleaning plates 31, two cleaning elements 32, and two sliding elements 33. The two cleaning plates 31 are located on the two side walls opposite to the lifting groove 2323. Two sliding grooves 2324 are formed on the side of the second rotating plate 232 near the first rotating plate 231, and each sliding groove 2324 is located on the two side walls opposite to the lifting groove 2323. The sliding grooves 2324 extend from the first baffle 2311 to one side of the lifting groove 2323. In this embodiment, the longitudinal section of the sliding groove 2324 is T-shaped. The cleaning plate 31 is slidably disposed on the second rotating plate 232. A slide rail 311 is welded to the side of the cleaning plate 31 near the second rotating plate 232. In this embodiment, the longitudinal section of the slide rail 311 is T-shaped, and the slide rail 311 is located within the sliding groove 2323. Within 324, the slide rail 311 can slide along the length of the slide groove 2324. One cleaning component 32 corresponds to one cleaning plate 31. In this embodiment, the cleaning component 32 includes a sponge 321. The sponge 321 is located on the side of the cleaning plate 31 away from the second rotating plate 232. The sponge 321 is detachably connected to the cleaning plate 31 by Velcro. In this embodiment, the sliding component 33 is a cleaning cylinder. The cleaning cylinder is horizontally set, and the setting direction of the cleaning cylinder is consistent with the setting direction of the slide groove 2324. The cylinder body of the cleaning cylinder is fixedly connected to the second baffle 2321 by screws. The piston rod of the cleaning cylinder faces the cleaning plate 31. The piston rod of the cleaning cylinder is welded to the cleaning plate 31. When the cutting table 26 is located in the receiving cavity, the cleaning cylinder pushes the cleaning plate 31 to move, and the sponge 321 can contact the cutting table 26 to clean the surface of the cutting table 26.

[0037] Reference Figure 7 A multi-layer ceramic capacitor cutting device further includes a cutting component 4, a heating component 5, a control component 6, and a protective component 7, all of which are mounted on a support component 1.

[0038] Reference Figure 7The cutting assembly 4 is located on the top of the working chamber 12. The cutting assembly 4 includes a cutting blade 41 and a second lifting component 42. The cutting blade 41 is slidably disposed on the cutting table 26. The cutting blade 41 can move towards or away from the cutting table 26. The cutting blade 41 can cut multilayer ceramic capacitors. In this embodiment, the second lifting component 42 is a lifting cylinder. The lifting cylinder is vertically disposed. The cylinder body of the lifting cylinder is fixedly connected to the top of the working chamber 12 by screws. The piston rod of the lifting cylinder faces the platform 21. The piston rod of the lifting cylinder is welded to the cutting blade 41. The lifting cylinder drives the cutting blade 41 to move.

[0039] Reference Figure 7 The heating assembly 5 includes a heating plate 51 and a temperature controller 52. The heating plate 51 is located on the side of the support platform 11 near the working chamber 12. The support platform 11 has a groove 112, in which the heating plate 51 is embedded. The heating plate 51 is fixedly connected to the support platform 11 by screws. The heating plate 51 can heat the multilayer ceramic capacitor. The temperature controller 52 is fixedly connected to the outside of the working chamber 12 by screws. The temperature controller 52 is electrically connected to the heating plate 51. The heating plate 51 is electrically connected to the carrier platform 21. The heating plate 51 can heat the carrier platform 21, thereby heating the cutting table 26. During the entire cutting process, the multilayer ceramic capacitor is kept in a heated and softened state.

[0040] Reference Figure 7 The control component 6 includes two cameras 61, a main control board 62, a display screen 63, an alarm 64, and an emergency stop switch 65. The two cameras 61 are located near the two side walls directly opposite the platform 21. Each camera 61 includes a camera 611, a support rod 612, a linear motor 613, and a supplementary light 614. The camera 611 is fixedly connected to the support rod 612 with screws. The camera 611 can capture the edge line of the chip ceramic capacitor. The support rod 612 is inclined upwards from the platform 21 towards the top of the work chamber 12. The side wall of the working chamber 12 is welded to the guide rail 122. The guide rail 122 is horizontally set and located on the side wall directly opposite the opening of the working chamber 12. The setting direction of the guide rail 122 is perpendicular to the direction from the opening of the working chamber 12 to the inner cavity of the working chamber 12. The linear motor 613 is slidably set on the guide rail 122. The linear motor 613 can slide on the guide rail 122 along the length direction of the guide rail 122. The linear motor 613 is welded to the higher end of the support rod 612. The fill light 614 is fixedly connected to the end of the support rod 612 near the camera 611 by screws. The fill light 614 is used for illumination.

[0041] Reference Figure 7The main control board 62 is fixedly connected to the outside of the working chamber 12 by screws. The display screen 63 is fixedly connected to the outside of the working chamber 12 by screws. The main control board 62 and the display screen 63 are electrically connected. The camera 611 is electrically connected to the main control board 62. The camera 611 transmits the captured image to the main control board 62, and then displays the image on the display screen 63. The drive motor 221, rotary motor, drive cylinder, cleaning cylinder, lifting cylinder and linear motor 613 are all electrically connected to the main control board 62. The main control board 62 can adjust the position of the cutting table 26 and the camera 611. The alarm 64 is fixedly connected to the outside of the working chamber 12 by screws. The alarm 64 is electrically connected to the main control board 62. When an abnormality occurs in the cutting process, such as the edge line of the capacitor to be cut is not clearly captured or the cutting distance exceeds the preset range, the alarm 64 will sound an alarm and flash. The emergency stop switch 65 is fixedly connected to the outside of the working chamber 12 by screws. The emergency stop switch 65 is electrically connected to the main control board 62.

[0042] Reference Figure 7 The protective component 7 includes a protective door 71 and a handle 72. The working chamber 12 has a first protective groove 123 on one side wall adjacent to the operating port 121. The protective groove 123 is arranged along the side from the working chamber 12 to the support platform 11. The working chamber 12 has a second protective groove 124 on the side wall opposite to the first protective groove 123. One end of the protective door 71 extends into the first protective groove 123 and can extend into the second protective groove 124. The protective door 71 can open or close the operating port 121. The handle 72 is welded to the side of the protective door 71 away from the inner cavity of the working chamber 12.

[0043] The implementation principle of the multi-layer ceramic capacitor cutting device in this application embodiment is as follows: When it is necessary to cut the multi-layer ceramic capacitor, firstly, the protective component 7 is opened, and the ceramic capacitor to be cut is heated by the heating component 5 to soften the ceramic capacitor. After the heating is completed, the control component 6 is started. The control component 6 controls the cleaning component 32, and the cleaning component 32 opens the lifting groove 2323. Then, the first lifting component 27 is started, and the first lifting component 27 adjusts the cutting table 26 to a suitable position. The heated ceramic capacitor is placed on the cutting table 26. The control component 6 adjusts the placement component 2 to a suitable position, and then the cutting component 4 is started to cut the ceramic capacitor until the ceramic capacitor is cut.

[0044] When the cutting component 4 needs to cut the ceramic capacitor, the camera 611 can clearly capture the edge image of the ceramic capacitor to be cut. After setting the cutting parameters on the main control board 62, a simulated cutting is performed. If there are no problems, the cutting component 4 cuts the ceramic capacitor. During the cutting process, the cutting table 26 moves according to the set cutting parameters. The cutting blade 41 descends to complete one cut. The platform 21 moves in the direction of the cutting blade 41 by a pre-set cutting distance to complete the next cut. After the cutting in this direction is completed, the main control board 62 controls the rotary motor to drive the turntable 23 to rotate 90° to perform cutting in the direction perpendicular to this direction until the cutting is completed.

[0045] After the cutting is completed, the cut ceramic capacitor is removed from the cutting table 26. Then, the first lifting component 27 is controlled by the main control board 62. The first lifting component 27 drives the cutting table 26 into the receiving cavity. Then, the two cleaning components 32 are activated. The two cleaning cylinders push the two cleaning plates 31 to move towards each other, close the lifting groove 2323, and then close the protective component 7.

[0046] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A multi-layer ceramic capacitor cutting device, characterized in that: The system includes a support assembly (1), a placement assembly (2), a cleaning assembly (3), and a cutting assembly (4). The support assembly (1) includes a support platform (11) and a working chamber (12). The working chamber (12) is fixed to the top of the support platform (11) and is hollow. An operation port (121) is provided on the side wall of the working chamber (12). The placement assembly (2) is located on the side of the working chamber (12) near the support platform (11). The placement assembly (2) includes a turntable (23), a cutting table (26) for placing multilayer ceramic capacitors, and a first lifting component (27). The turntable (23) includes a first rotating plate (231) and a second rotating plate (232). The first rotating plate (231) The second rotating plate (232) is connected to the support platform (11) and the first rotating plate (231) is connected to the side away from the support platform (11). A receiving cavity is formed between the first rotating plate (231) and the second rotating plate (232) for the cutting table (26) to be accommodated. The second rotating plate (232) is provided with a lifting groove (2323) for the cutting table (26) to pass through. The cutting table (26) is slidably disposed on the second rotating plate (232). The cutting table (26) can move toward the side closer to or away from the first rotating plate (231). The first lifting member (27) is connected to the first rotating plate (231) and is used to drive the cutting table (26) to move. The cleaning component (3) includes at least one cleaning element (32) and at least one sliding element (33). The cleaning element (32) is slidably connected to the side of the second rotating plate (232) near the first rotating plate (231). The sliding direction of the cleaning element (32) is perpendicular to the setting direction of the first rotating plate (231) and the second rotating plate (232). The cleaning element (32) is used to clean the surface of the cutting table (26). The sliding element (33) is connected to the second rotating plate (232). The sliding element (33) is used to drive the cleaning element (32) to move. The cutting component (4) is fixed to the working chamber (12). The cutting component (4) is used to cut multilayer ceramic capacitors. The cleaning assembly (3) further includes at least one cleaning plate (31), the cleaning plate (31) is horizontally arranged, the cleaning component (32) is slidably arranged on the second rotating plate (232), the sliding direction of the cleaning plate (31) is consistent with that of the cleaning component (32), the cleaning plate (31) is connected to the sliding component (33), the cleaning component (32) is connected to the side of the cleaning plate (31) near the first rotating plate (231), the cutting table (26) is located in the receiving cavity, and the cleaning plate (31) is used to open or close the lifting groove (2323); It also includes a protective component (7), which includes a protective door (71) installed at the operating port (121) and is used to open or close the operating port (121); It also includes a heating assembly (5), which includes a heating plate (51) and a temperature controller (52). The heating plate (51) is fixed to the support platform (11) on the side near the working chamber (12). The heating plate (51) is used to heat the multilayer ceramic capacitor and to heat the cutting table (26). The temperature controller (52) is fixed to the working chamber (12) and is electrically connected to the heating plate (51). The cleaning component (32) includes a sponge (321) connected to the cleaning plate (31), and the sponge (321) is used to clean the surface of the cutting table (26).

2. The multi-layer ceramic capacitor cutting device according to claim 1, characterized in that: A first baffle (2311) is fixed to the side of the first rotating plate (231) near the second rotating plate (232), and a second baffle (2321) is fixed to the side of the second rotating plate (232) near the first rotating plate (231). An insertion frame (2322) is fixed to the side of the second baffle (2321) near the first rotating plate (231). A slot (2312) for inserting the insertion frame (2322) is provided on the side of the first baffle (2311) near the second rotating plate (232). The sponge (321) is detachably connected to the cleaning plate (31).

3. The multi-layer ceramic capacitor cutting device according to claim 2, characterized in that: It also includes a control component (6), which includes two cameras (61), a main control board (62), and a display screen (63). The two cameras (61) are each close to the two side walls opposite the cutting table (26). The cameras (61) are connected to the working chamber (12). The cameras (61) are used to photograph the edge lines of the chip ceramic capacitor. The main control board (62) and the display screen (63) are both fixed to the working chamber (12). The cameras (61) and the display screen (63) are both electrically connected to the main control board (62). The first lifting component (27), the sliding component (33), and the cutting component (4) are all electrically connected to the main control board (62).

4. The multi-layer ceramic capacitor cutting device according to claim 1, characterized in that: The cutting table (26) has multiple positioning holes (261) arranged in a matrix, and the positioning holes (261) penetrate the cutting table (26) along the thickness direction of the cutting table (26).

5. The multi-layer ceramic capacitor cutting device according to claim 3, characterized in that: The placement assembly (2) further includes a platform (21), a drive (22), and a rotating component (25). The platform (21) is slidably disposed on the support platform (11). The platform (21) moves from the operation port (121) to one side of the inner cavity of the working chamber (12). The drive (22) is connected to the support platform (11) and is used to drive the platform (21) to move. The first rotating plate (231) is rotatably connected to the platform (21). The rotating component (25) is connected to the platform (21) and is used to drive the first rotating plate (231) to move. Both the drive (22) and the rotating component (25) are connected to the main control board (62).

6. The multi-layer ceramic capacitor cutting device according to claim 2, characterized in that: The placement component (2) further includes a plurality of fasteners (24) which are distributed circumferentially along the first baffle (2311). The fasteners (24) are connected to the first baffle (2311) and are used to fix the first baffle (2311) and the insertion frame (2322).

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