A semiconductor laser coating jig and a use method

Abstract

The application discloses a kind of semiconductor laser coating tool and use method, it is characterized by: including support base, vacuum suction base is provided on support base, detachably connected with the chin strip frame of U shape on vacuum suction base, chin strip frame is equipped with U-shaped rim;The bottom of the U-shaped rim is equipped with the chin strip frame of U shape, the chin strip frame is fixed with the upper bar of U shape above, and the U-shaped mouth of upper bar is provided with inclined surface along its rim;The lower portion of both ends of the upper bar is provided with rectangular mouth;Rectangular mouth and the cavity formed by U-shaped rim are provided with outer block inner pressure mechanism, and the cavity between outer block inner pressure mechanism and chin strip frame is used to place bar strip.The application can be compatible with different specifications of bar strip, the speed of upper bar can be improved, and the coating efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of laser coating technology, and in particular to a fixture for coating semiconductor lasers. Background Technology

[0002] In the field of optics, various coatings are applied to optoelectronic chips and devices to adjust optical properties such as transmittance and reflectivity. Coating fixtures are used to support and maintain the stability of optical components, ensuring the stability and reliability of optical surface coatings. Currently, due to inconsistent specifications, laser chips often require the use of multiple different fixtures during the coating process. Furthermore, human error frequently leads to inconsistent coating depths and often contaminates the N-pole bottom surface, resulting in decreased coating efficiency and poor yield. Summary of the Invention

[0003] The purpose of this invention is to provide a fixture and method for using it for semiconductor laser coating. This invention is compatible with different specifications of laser bars, and can increase the speed of loading the laser bar, thereby improving coating efficiency.

[0004] The technical solution of the present invention: A fixture for semiconductor laser coating includes a support base, on which a vacuum adsorption base is disposed. A U-shaped lower jaw strip is detachably connected to the vacuum adsorption base, and the lower jaw strip has a U-shaped edge. A U-shaped middle jaw strip is disposed at the bottom of the U-shaped edge, and a U-shaped upper jaw strip is fixed above the middle jaw strip. The upper jaw strip has a bevel along its edge at the U-shaped opening. Rectangular openings are provided at the bottom of both ends of the upper jaw strip. An outer baffle and inner pressure mechanism is disposed in the cavity formed by the rectangular opening and the U-shaped edge. The cavity between the outer baffle and inner pressure mechanism and the middle jaw strip is used to place the jaw strip.

[0005] In the aforementioned fixture for semiconductor laser coating, the vacuum adsorption base is connected to a plug via a sealing ring, and the plug is connected to an air tube.

[0006] In the aforementioned fixture for semiconductor laser coating, the chin strip frame and the vacuum adsorption base are connected and fixed by a plurality of first screws.

[0007] In the aforementioned fixture for semiconductor laser coating, the lower chin strip and the middle chin strip are connected and fixed by a plurality of second screws.

[0008] The aforementioned fixture for semiconductor laser coating includes an outer stop block fixedly connected to the U-shaped edge, and multiple springs on the outer stop block. The front ends of the springs are connected to an inner pressure block via connecting posts.

[0009] In the aforementioned fixture for semiconductor laser coating, the outer stop block and the U-shaped edge are fixedly connected by multiple third screws.

[0010] The aforementioned fixture for semiconductor laser coating also includes multiple movable blocks of varying sizes between the outer baffle inner pressure mechanism and the middle bus frame.

[0011] The aforementioned method of using the fixture for semiconductor laser coating involves placing the support base, placing the vacuum adsorption base stably on the support base and connecting an external vacuum generator, fixing the lower jaw strip frame on the vacuum adsorption base, and simultaneously installing the middle jaw strip frame; then turning on the vacuum generator, placing the auxiliary strip and the jaw strip in the middle jaw strip frame, and then using the external baffle internal pressure mechanism to internally press the auxiliary strip and the jaw strip, and finally covering and fixing the upper jaw strip frame to complete the installation.

[0012] In the aforementioned method of using the fixture for semiconductor laser coating, if it is found that the number of auxiliary strips or bar strips is insufficient during the process of placing the auxiliary strips and bar strips in the middle bar frame, movable blocks are placed until the entire middle bar frame is filled.

[0013] Compared with existing technologies, this invention consists of a vacuum adsorption assembly and a bar fixing assembly. The vacuum adsorption base allows for large-scale manual installation of bars in a short time. The hollowed-out design of the lower, middle, and upper bar frames allows for simultaneous coating of both optical surfaces with the equipment, increasing the speed of bar installation and coating efficiency. Furthermore, the external baffle and internal pressure mechanism allows for compatibility with bars of different specifications and simultaneous coating of different laser specifications, ensuring stability and reliability, significantly improving the consistency and reliability of the coated bars, saving time, and increasing production efficiency. In addition, the specific angle of the vacuum adsorption base ensures that the bars do not scatter due to minor airflow or vibration during installation. The spring structure design of the external baffle and internal pressure mechanism effectively ensures controllable pressure for each batch of compressed bars, avoiding the risk of bar damage due to varying external forces. Verification shows that the different structures and tolerances of this invention ensure coating depth control between 15 and 20 μm, reducing coating errors and improving yield. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention;

[0015] Figure 2 Exploded view of the fixture base;

[0016] Figure 3 Exploded view of the bar strip coating fixture;

[0017] Figure 4 The front view and sectional view of the chin support frame;

[0018] Figure 5 The images show the front view and sectional view of the China-Bus frame.

[0019] Figure 6 The images show the front view and sectional view of the upper bar frame.

[0020] Figure 7 This is the front view and sectional view of the active block;

[0021] Figure 8 This is a front view and a sectional view of the inner stop block;

[0022] Figure 9 These are the front view and sectional view of the outer block.

[0023] Figure Labels

[0024] 1. Vacuum adsorption base; 2. Support base; 3. Air tube; 4. Plug; 5. Sealing ring; 6. First screw; 7. Second screw; 8. Third screw; 9. Connecting column; 10. Spring; 11. Outer stop block; 12. Inner pressure block; 13. Movable block A; 14. Movable block B; 15. Movable block C; 16. Middle chin frame; 17. Lower chin frame; 18. Upper chin frame; 19. U-shaped edge; 20. Rectangular opening; 21. Sloping surface. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, but this should not be construed as limiting the present invention.

[0026] Example 1: A fixture for semiconductor laser coating, such as Figure 1-3As shown, the device includes a support base 2, on which a vacuum adsorption base 1 is mounted. A U-shaped chin strip frame 17 is detachably connected to the vacuum adsorption base 1, and the chin strip frame 17 has a U-shaped edge 19. A U-shaped middle chin strip frame 16 is located at the bottom of the U-shaped edge 19, and a U-shaped upper chin strip frame 18 is fixed above the middle chin strip frame 16. The upper chin strip frame 18 has a bevel 21 along its U-shaped opening, and rectangular openings 20 are provided at the bottom of both ends of the upper chin strip frame 18. An external baffle and internal pressure mechanism is provided in the cavity formed by the rectangular openings 20 and the U-shaped edge 19. The cavity between the external baffle and internal pressure mechanism and the middle chin strip frame 16 is used to place the chin strip. The vacuum adsorption base 1 is connected to a plug 4 via a sealing ring 5, and the plug 4 is connected to an air pipe 3. The adsorption surface of the vacuum adsorption base 1 is a bevel 21. The chin support frame 17 is connected and fixed to the vacuum adsorption base 1 by four first screws 6, which are located at the four corners. The chin support frame 17 is connected and fixed to the mid-section support frame 16 by two second screws 7, which are located on both sides of the chin support frame 17. The outer stop and inner pressure mechanism includes an outer stop block 11 fixedly connected to the U-shaped edge 19. The outer stop block 11 is provided with multiple springs 10, and the front end of each spring 10 is connected to an inner pressure block 12 via a connecting post 9. The outer stop block 11 is fixedly connected to the U-shaped edge 19 by two third screws 8, which are located on both sides of the U-shaped edge 19.In this embodiment, the vacuum adsorption base 1 also has a boss. The boss is surface-treated to ensure that the chip cross-section is not damaged. The large-capacity opening inside ensures sufficient and stable airflow. The design of the inclined surface 21 ensures neatness and consistency during chip loading. The height of the boss needs to be 15-20 μm smaller than the bottom of the chin strip holder 17. The support base 2 is used to support the vacuum adsorption base 1 and enhance the stability of the manual chip loading process. The air pipe 3 is used to connect to an external vacuum generator. The plug 4 is used to connect the air pipe 3 and the vacuum adsorption base 1. The sealing ring 5 seals the vacuum adsorption base 1 under the pressure of the plug 4. The first screw 6 is used to connect the chin strip holder 17 and the vacuum adsorption base 1, effectively avoiding the risk of damage to the strip caused by external vibration during the chip loading process. The second screw 7 is used to connect the middle strip holder 16 and the chin strip holder. The frame 17; the third screw 8 is used to limit the outer stop 11, ensuring that the outer stop 11 is positioned consistently each time; the connecting column 9 is used to connect the inner pressure block 12, and the three connecting columns 9 can ensure the uniformity of external force, and at the same time, can limit the deformation direction of the spring 10 as needed; the spring 10 is sleeved on the connecting column 9, providing a certain elastic pressure; the outer stop 11 is used to compress the spring 10 to transmit elastic force and fix the bar strip; the inner pressure block 12 receives the elastic pressure of the spring 10 and acts directly on the bar strip or other objects; the middle bar strip frame 16 is used to match bar strips of different lengths and limit the horizontal position of the bar strip; the lower bar strip frame 17 is the support base of the entire coating fixture, and its structural design can greatly improve the efficiency of manual bar strip loading; the upper bar strip frame 18 is connected by the second screw 7, which can limit the vertical position of the bar strip.

[0027] Furthermore, a number of movable blocks of different sizes are provided between the outer stop inner pressure mechanism and the mid-bus frame 16. The movable blocks include movable block A13, movable block B14 and movable block C15, whose size decreases in sequence. The three blocks can be reasonably matched and used according to different production needs.

[0028] Example 2: Based on the method of using the fixture for semiconductor laser coating in Example 1, first place the support base 2, place the vacuum adsorption base 1 stably on the support base 2, install the sealing ring 5 on the vacuum adsorption base 1 with the plug 4, and put the air tube 3 through it. The air tube 3 is connected to the vacuum generator.

[0029] Fix the lower jaw strip holder 17 to the vacuum adsorption base 1 using the first screw 6, and install the middle jaw strip holder 16 at the same time. Turn on the vacuum generator. At this time, you can place the auxiliary strips and jaw strips. If it is found that the number of auxiliary strips or jaw strips is insufficient, you can install the movable block until the entire middle jaw strip holder 16 is filled. At this time, cover the upper jaw strip holder 18 and fix it with the second screw 7. Then, install the three threaded posts on the inner pressure block 12 in advance and press them tightly. At the same time, put on the spring 10. Then push the inner pressure block 12 into the previously installed fixture and install the third screw 8 to complete the installation. After the installation is completed, remove the first screw 6 and you can put it into the equipment for coating operation.

[0030] Furthermore, the technical solution of the present invention will be described using dimensional analysis, such as... Figure 4-9 As shown, the process is as follows:

[0031] a. For example, if a bar strip with a length of 15mm, a width of 1.03mm, and a thickness of 0.11mm needs to be coated, the accompanying bar should have a length of 32mm, a width of 1mm, and a thickness of 0.4mm.

[0032] b. Determine the length of the 16L1 bar rack based on the number of wafer dicings and the designed laser chip thickness of 0.11mm. Here, the size of L1 is selected as 2mm, which can generally support 20 to 200 bar racks.

[0033] c. The base material of the selected coating fixture is SUS304L, which can ensure sufficient strength and hardness. Considering the influence of coating depth, the size of the lower bar bracket 17H7 is designed to be 4.1mm. At the same time, the difference between the height H8 of the vacuum adsorption base 1 and H7 in the machining and design is 15μm, and both are machined to a positive tolerance (0, +0.005). Considering the thickness of the auxiliary piece, the middle bar bracket 16H3 is selected to be 1.1mm. In order to ensure the maximum amount of coating and strength requirements of the bar strip, the W of the middle bar bracket 16 is 50.2mm.

[0034] d. The size of the 18W1 upper bar frame is selected as 30mm to ensure that the 30mm long bar can be hollowed out and coated from the top and bottom;

[0035] e. The dimensions of the 16W2 minibus side frame are selected as 32.2mm, with a 0.1mm installation allowance on each side of the side frame;

[0036] f. The size of the active block W3 should be the same as that of the auxiliary strip, which can replace the auxiliary strip when the number of auxiliary strips is small;

[0037] g. The dimensions of the 16H3 minibus frame should be referenced from the dimensions of the auxiliary frame, with a negative tolerance of (0, -0.05) mm.

[0038] g. The design height of the inner stop block and the outer stop block 11 meets the difference between H2 and H5;

[0039] h. The outer stop block L4 is designed to be 9mm to take into account the requirements of the lower circular hole and the upper threaded hole;

[0040] i. The dimensions of spring 10 are calculated according to the formula for elastic force ( The selected material is stainless steel spring 10. Considering the tensile strength of the pure silicon wafer, the formula (general formula) is used. The force required to break the silicon wafer can be calculated to be relatively large (approximately 640N), so a spring with greater elasticity, 10, is selected here.

[0041] j. In addition to Figure 3 For the fixture itself, the remaining metal parts are all made of aluminum alloy with surface treatment, taking into account cost and practicality.

[0042] This verifies that the different structures and tolerance designs of the present invention can ensure that the coating depth is controlled between 15 and 20 μm, reduce coating errors, and improve yield.

[0043] In summary, this invention comprises a vacuum adsorption assembly and a bar fixing assembly. The vacuum adsorption base 1 allows for the manual installation of a large number of bars in a short time. The hollowed-out design of the lower bar holder 17, middle bar holder 16, and upper bar holder 18 allows for simultaneous coating of both optical surfaces with the equipment, increasing the speed of bar installation and coating efficiency. Furthermore, the external baffle and internal pressure mechanism allows for compatibility with bars of different specifications and simultaneous coating of different laser specifications, ensuring stability and reliability, significantly improving the consistency and reliability of the coated bars, saving time, and increasing production efficiency. In addition, the specific angle of the adsorption surface of the vacuum adsorption base 1 ensures that the bars do not scatter due to minor airflow or vibration during installation. The external baffle and internal pressure mechanism, through the spring 10 structure, effectively ensures controllable pressure for each batch of compressed bars, avoiding the risk of bar damage due to varying external forces.

Claims

1. A fixture for coating semiconductor lasers, characterized in that: Includes a support base (2), on which a vacuum adsorption base (1) is provided, and a U-shaped chin strip frame (17) is detachably connected to the vacuum adsorption base (1), the chin strip frame (17) having a U-shaped edge (19); a U-shaped middle chin strip frame (16) is provided at the bottom of the U-shaped edge (19), and a U-shaped upper chin strip frame (18) is fixed above the middle chin strip frame (16), the U-shaped opening of the upper chin strip frame (18) having a slope (21) along its edge; rectangular openings (20) are provided at the bottom of both ends of the upper chin strip frame (18); an outer baffle inner pressure mechanism is provided in the cavity formed by the rectangular opening (20) and the U-shaped edge (19), and the cavity between the outer baffle inner pressure mechanism and the middle chin strip frame (16) is used to place the chin strip; The vacuum adsorption base (1) is connected to a plug (4) via a sealing ring (5), and the plug (4) is connected to an air pipe (3). The adsorption surface of the vacuum adsorption base (1) is an inclined surface. The outer stop and inner pressure mechanism includes an outer stop (11) fixedly connected to the U-shaped edge (19), and multiple springs (10) are provided on the outer stop (11). The front end of the springs (10) is connected to an inner pressure block (12) via a connecting post (9).

2. The fixture for semiconductor laser coating according to claim 1, characterized in that: The chin support (17) is connected and fixed to the vacuum adsorption base (1) by a plurality of first screws (6).

3. The fixture for semiconductor laser coating according to claim 1, characterized in that: The chin frame (17) and the mid-bus frame (16) are connected and fixed by a plurality of second screws (7).

4. The fixture for semiconductor laser coating according to claim 1, characterized in that: The outer stop (11) and the U-shaped edge (19) are fixedly connected by multiple third screws (8).

5. The fixture for semiconductor laser coating according to claim 1, characterized in that: There are also multiple movable blocks of different sizes between the outer barrier inner pressure mechanism and the minibus frame (16).

6. The method of using the semiconductor laser coating fixture according to any one of claims 1-5, characterized in that: Place the support base, place the vacuum adsorption base stably on the support base and connect the vacuum generator externally. Fix the lower chin strip frame on the vacuum adsorption base and install the middle chin strip frame at the same time. Then turn on the vacuum generator. At this time, place the auxiliary strip and the chin strip in the middle chin strip frame, and then use the external baffle internal pressure mechanism to internally press the auxiliary strip and the chin strip. Finally, cover and fix the upper chin strip frame to complete the installation.

7. The method of using the fixture for semiconductor laser coating according to claim 6, characterized in that: If, during the process of placing the side bars and bus bars in the minibus bar frame, it is found that the number of side bars or bus bars is insufficient, movable blocks are placed until the entire minibus bar frame is filled.

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