Cable temperature field determination method and apparatus, computer device, and storage medium

Abstract

The application relates to a cable temperature field determination method and device, computer equipment and a storage medium, and belongs to the technical field of power transmission equipment. The method comprises the following steps: in response to a temperature field determination request for a target cable, the current surface temperature of the target cable is acquired. The current surface temperature of the target cable is input into a thermal network topology model of the target cable to obtain the current cable conductor current of the target cable. The current cable conductor current is input into a target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; wherein the target temperature field analysis model is obtained by processing the cable structure of the target cable. In the application, the thermal network topology model is adopted, the current cable conductor current can be determined based on the current surface temperature of the target cable, and the current cable conductor current is input into the target temperature field analysis model of the target cable. Therefore, the temperature of the cable conductor of the target cable can be accurately obtained, and the current temperature field of the target cable can also be obtained.

Description

Technical Field

[0001] This application relates to the field of power transmission equipment technology, and in particular to a method, apparatus, computer equipment, and storage medium for determining the temperature field of a cable. Background Technology

[0002] With the continuous improvement of urban construction standards, power cables are gradually replacing overhead lines and becoming an important power transmission equipment for the main grid and distribution network in the power system.

[0003] When current flows through a cable, the conductor generates Joule heat based on Ohm's law, causing the temperature of the cable itself and the surrounding environment to rise. Taking cross-linked polyethylene cables as an example, when the conductor temperature exceeds 90°C, the service life of the cable insulation will be reduced by half. Therefore, the national standard also uses a conductor temperature of 90°C as the threshold for the current carrying capacity (the maximum power frequency current that can be allowed to flow continuously inside the cable conductor).

[0004] However, due to the special nature of cable structure, there is currently no effective method to obtain the temperature of cable conductors, let alone an effective measure to obtain the temperature field of cables. Summary of the Invention

[0005] Therefore, it is necessary to provide a method, apparatus, computer equipment, and storage medium for determining the cable temperature field that can accurately determine the cable temperature field, in order to address the above-mentioned technical problems.

[0006] Firstly, this application provides a method for determining the temperature field of a cable. The method includes:

[0007] In response to a request to determine the temperature field of the target cable, the current surface temperature of the target cable is obtained;

[0008] The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable.

[0009] The current conductor current of the target cable is input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0010] In one embodiment, the material information includes each material layer and the layer parameters of each material layer. Processing the material information and environmental parameters of the target cable includes:

[0011] Based on each material layer and its layer parameters, determine the thermal resistance and thermal capacity of each material layer in the target cable; the layer parameters include thermal resistivity and specific heat capacity.

[0012] Based on the environmental parameters of the target cable, determine the environmental thermal resistance and environmental thermal capacity of the target cable; wherein, the environmental parameters include at least one of air humidity, soil moisture content, wind speed and ambient temperature;

[0013] Based on the environmental thermal resistance and thermal capacity, as well as the material thermal resistance and thermal capacity of each material layer, a thermal network topology model of the target cable is constructed.

[0014] In one embodiment, the cable structure of the target cable is processed, including:

[0015] Based on the cable structure of the target cable, a physical simulation model of the target cable is constructed.

[0016] Based on finite element analysis software and physical simulation models, a target temperature field analysis model for the target cable is constructed.

[0017] In one embodiment, based on finite element analysis software and a physical simulation model, a target temperature field analysis model of the target cable is constructed, including:

[0018] The physical simulation model is imported into the finite element analysis software to obtain the initial temperature field analysis model of the target cable.

[0019] Constraints are configured for the initial temperature field analysis model, and a target temperature field analysis model for the target cable is constructed based on the initial temperature field analysis model with configured constraints. The constraints include the environmental conditions and boundary conditions of the target cable, and the boundary conditions include the convective heat transfer coefficient.

[0020] In one embodiment, based on the initially selected temperature field analysis model with configured constraints, a target temperature field analysis model for the target cable is constructed, including:

[0021] The initial temperature field analysis model with configured constraints is meshed to obtain the candidate temperature field analysis model for the target cable.

[0022] The test cable conductor current corresponding to the test surface temperature of the target cable is input into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0023] Determine the temperature difference between the predicted surface temperature and the test surface temperature corresponding to the test temperature field;

[0024] Determine if the temperature difference is less than the difference threshold;

[0025] If so, the candidate temperature field analysis model will be used as the target temperature field analysis model for the target cable.

[0026] In one embodiment, the method further includes:

[0027] If the temperature difference is not less than the difference threshold, the boundary conditions are adjusted according to the preset step size to update the candidate temperature field analysis model. Based on the updated candidate temperature field analysis model, the process returns to input the test cable conductor current corresponding to the test surface temperature of the target cable into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0028] Secondly, this application also provides a cable temperature field determination device. The device includes:

[0029] The acquisition module is used to acquire the current surface temperature of the target cable in response to a request to determine the temperature field of the target cable.

[0030] The first determining module is used to input the current surface temperature of the target cable into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; wherein, the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable;

[0031] The second determining module is used to input the current conductor current of the current cable into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; wherein, the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0032] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to perform the following steps:

[0033] In response to a request to determine the temperature field of the target cable, the current surface temperature of the target cable is obtained;

[0034] The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable.

[0035] The current conductor current of the target cable is input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0036] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, performs the following steps:

[0037] In response to a request to determine the temperature field of the target cable, the current surface temperature of the target cable is obtained;

[0038] The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable.

[0039] The current conductor current of the target cable is input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0040] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0041] In response to a request to determine the temperature field of the target cable, the current surface temperature of the target cable is obtained;

[0042] The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable.

[0043] The current conductor current of the target cable is input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0044] The aforementioned cable temperature field determination method, apparatus, computer equipment, and storage medium, in response to a request to determine the temperature field of a target cable, acquire the current surface temperature of the target cable. The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current cable conductor current. The current cable conductor current is then input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; wherein, the target temperature field analysis model is obtained by processing the cable structure of the target cable. In this application, a thermal network topology model is used. Based on the current surface temperature of the target cable, the current cable conductor current can be determined. Then, the current cable conductor current is input into the target temperature field analysis model of the target cable, which not only accurately obtains the temperature of the cable conductor of the target cable but also the current temperature field of the target cable. Attached Figure Description

[0045] Figure 1 This is a diagram illustrating the application environment of the cable temperature field determination method provided in this embodiment.

[0046] Figure 2 This is a flowchart illustrating the first method for determining the cable temperature field provided in this embodiment;

[0047] Figure 3 This is a schematic diagram illustrating the process of constructing the thermal network topology model of the target cable in this embodiment;

[0048] Figure 4 This is a schematic diagram of the thermal network topology of the target cable provided in this embodiment;

[0049] Figure 5 This is a schematic diagram of the process for constructing the target temperature field analysis model of the target cable provided in this embodiment;

[0050] Figure 6 This is a flowchart illustrating the second method for determining the cable temperature field provided in this embodiment;

[0051] Figure 7 This is a structural block diagram of a cable temperature field determination device provided in this embodiment;

[0052] Figure 8 This is an internal structural diagram of the computer device provided in this embodiment. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0054] The cable temperature field determination method provided in this application embodiment can be applied to, for example... Figure 1 In the application environment shown, server 104, in response to a request to determine the temperature field of a target cable, acquires the current surface temperature of the target cable through detection device 102. Server 104 inputs the current surface temperature of the target cable into the thermal network topology model of the target cable to obtain the current conductor current of the target cable. The thermal network topology model is obtained by processing the material information and environmental parameters of the target cable. Server 104 inputs the current conductor current into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable. The target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0055] Server 104 can be implemented using a standalone server or a server cluster consisting of multiple servers. Detection device 102 is a temperature detection device, such as a temperature sensor or thermocouple.

[0056] In one embodiment, such as Figure 2 As shown, a method for determining the temperature field of a cable is provided, which can be applied to... Figure 1 Taking the server in the example, the following steps are included:

[0057] S201, in response to a request to determine the temperature field of the target cable, obtain the current surface temperature of the target cable.

[0058] The target cable refers to the cable whose temperature field needs to be determined. A temperature field determination request is a request sent to the server when there is a need to determine the temperature field of the target cable. Current surface temperature refers to the current surface temperature information of the target cable.

[0059] An optional implementation of this embodiment is as follows: In response to a request to determine the temperature field of the target cable, a temperature acquisition request is sent to the detection device so that the detection device can provide feedback on the current surface temperature of the target cable, thereby obtaining the current surface temperature of the target cable.

[0060] Another optional implementation of this embodiment is as follows: In response to a request to determine the temperature field of the target cable, the current surface temperature of the target cable is retrieved from a temperature monitoring database. The temperature monitoring database stores the current surface temperature of the target cable.

[0061] S202, the current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable. The thermal network topology model is obtained by processing the material information and environmental parameters of the target cable.

[0062] The thermal network topology model is constructed based on the material information and environmental parameters of the target cable. The mathematical expression for the thermal network topology model is T = f(I) or I = f(T), where T is the surface temperature of the target cable and I is the conductor current of the target cable. The function to be achieved based on the thermal network topology model is to determine the conductor current of the target cable using its surface temperature. The current conductor current refers to the current value of the conductors inside the target cable. The material information mainly includes the material layers of the target cable and the corresponding layer parameters. The environmental parameters refer to the information about the environment in which the target cable exists.

[0063] Optionally, in this embodiment, the current surface temperature of the target cable is preprocessed, and the preprocessed current surface temperature is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable. Preprocessing methods include cleaning, correction, and form transformation. It should be noted that the current surface temperature may include surface temperatures from multiple locations (i.e., different positions) of the target cable. Form transformation can be used to convert the current surface temperature into a temperature matrix, which can then be used as the input parameter of the thermal network topology model.

[0064] Optionally, in this embodiment, a communication interface between the thermal network topology model and the temperature monitoring database can be constructed so that when there is a need to determine the temperature field, the thermal network topology model can directly obtain the current surface temperature of the target cable from the temperature monitoring database.

[0065] S203: Input the current conductor current of the target cable into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable. The target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0066] The target temperature field analysis model refers to a finite element analysis model constructed based on the cable structure of the target cable to analyze its temperature field. The current temperature field refers to the current global temperature distribution data of the target cable, which includes not only the temperature data of the cable conductor.

[0067] An optional implementation of this embodiment is as follows: obtain the current cable conductor current for the target cable from the thermal network topology model, and input the current cable conductor current into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable.

[0068] Another optional implementation of this embodiment is to construct a communication interface between the thermal network topology model and the target temperature field analysis model. This allows the thermal network topology model to determine the current conductor current of the target cable and directly input it into the target temperature field analysis model, thereby obtaining the current temperature field of the target cable. Specifically, processing software (e.g., MATLAB) is used to coded the thermal network topology model, and a communication interface is established between the processing software and the software containing the target temperature field analysis model. This allows the current conductor current of the target cable obtained from the thermal network topology model to be directly input into the target temperature field analysis model, resulting in a faster acquisition of the current temperature field of the target cable.

[0069] The aforementioned method for determining the cable temperature field, in response to a request to determine the temperature field of a target cable, acquires the current surface temperature of the target cable. The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current cable conductor current. The current cable conductor current is then input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; wherein, the target temperature field analysis model is obtained by processing the cable structure of the target cable. In this application, a thermal network topology model is used. Based on the current surface temperature of the target cable, the current cable conductor current can be determined. Then, the current cable conductor current is input into the target temperature field analysis model of the target cable, which not only accurately obtains the temperature of the cable conductor of the target cable but also the current temperature field of the target cable.

[0070] In one embodiment, to make the cable conductor current of the target cable determined by the thermal network topology model more accurate, such as Figure 3 As shown, an optional implementation method for processing the material information and environmental parameters of the target cable in S202 includes:

[0071] S301, based on each material layer and its layer parameters, determine the material thermal resistance and material heat capacity of each material layer in the target cable. The layer parameters include thermal resistivity and specific heat capacity.

[0072] In this context, "material layers" refers to the various structural layers of the target cable. For example, from the inside out, these layers include the cable conductor, conductor shield, insulation layer, insulation shield, water-blocking tape, aluminum sheath, and outer sheath (i.e., outer jacket). Layer parameters primarily include the thermal resistivity and specific heat capacity of each layer. Material thermal resistance refers to the ease with which heat is transferred from the material. Material heat capacity refers to the ratio of the heat exchanged between the material and its environment to the resulting temperature change.

[0073] Optionally, in this embodiment, the thermal resistance and specific heat capacity of each material layer in the target cable can be determined using the calculation formula in IEC (International Electrotechnical Commission) 60287 standard, based on the thermal resistivity and specific heat capacity of each material layer.

[0074] S302, determine the environmental thermal resistance and environmental heat capacity of the target cable based on the environmental parameters of the target cable. These environmental parameters include at least one of air humidity, soil moisture content, wind speed, and ambient temperature.

[0075] Among them, environmental parameters refer to indicators that are closely related to thermal resistance and thermal resistance, mainly including at least one of air humidity, soil moisture content, wind speed and ambient temperature.

[0076] Optionally, in this embodiment, the environmental thermal resistance and environmental thermal capacity of the target cable can be determined based on the environmental parameters of the target cable and the calculation formula in the IEC 60853 standard.

[0077] S303. Based on the environmental thermal resistance and thermal capacity, as well as the material thermal resistance and thermal capacity of each material layer, a thermal network topology model of the target cable is constructed.

[0078] Optionally, in this embodiment, a mathematical expression for the thermal network and a thermal network topology are constructed based on the ambient thermal resistance and ambient heat capacity, as well as the material thermal resistance and material heat capacity of each material layer. Based on the mathematical expression for the thermal network and the thermal network topology, a thermal network topology model of the target cable is constructed.

[0079] In this embodiment, the input parameter of the thermal network mathematical expression is the current surface temperature (e.g., temperature matrix). The weighting coefficients (e.g., coefficient matrix) that make up the thermal network mathematical expression are constructed based on the ambient thermal resistance and ambient heat capacity, as well as the material thermal resistance and material heat capacity of each material layer. The output parameter of the thermal network mathematical expression is the cable conductor current of the target cable (e.g., conductor current matrix). The thermal network mathematical expression is constructed based on the input parameters, weighting coefficients, and output parameters.

[0080] In this embodiment, the thermal network topology is as follows: Figure 4 As shown, Figure 4 In this context, T1, T2, T3, and T4 represent the surface temperatures at different locations on the target cable, R1, R2, and R3 represent the thermal resistances of each material layer and the environment, and P1, P2, and P3 represent the heat capacities of each material layer and the environment. Figure 4 The power supply symbol indicates power loss.

[0081] In this embodiment, the thermal resistance and thermal capacity of each material layer in the target cable are determined based on each material layer and its layer parameters. The layer parameters include thermal resistivity and specific heat capacity. The environmental thermal resistance and environmental thermal capacity of the target cable are determined based on its environmental parameters, including at least one of air humidity, soil moisture content, and wind speed. Based on the environmental thermal resistance and environmental thermal capacity, as well as the thermal resistance and thermal capacity of each material layer, a more accurate thermal network topology model of the target cable can be constructed, leading to a more accurate determination of the cable conductor current by the thermal network topology model.

[0082] In one embodiment, in order to accurately construct the target temperature field analysis model and make the determined temperature field of the target cable more accurate, such as... Figure 4 As shown, one optional implementation of the cable structure processing of the target cable in S203 of the above embodiment includes:

[0083] S501, based on the cable structure of the target cable, construct a physical simulation model of the target cable.

[0084] The cable structure refers to the cable's geometric structure, which, from the inside out, includes the cable conductor, conductor shield, insulation layer, insulation shield, water-blocking tape, aluminum sheath, and outer sheath. The physical simulation model refers to a simulation model corresponding to the target cable, constructed based on its cable structure.

[0085] Optionally, in this embodiment, a physical simulation model of the target cable can be constructed based on the cable structure of the target cable and in conjunction with model building software. The model building software may include, but is not limited to, SOLIDWORK, UG, or other model building software.

[0086] S502, based on finite element analysis software, constructs a target temperature field analysis model for the target cable according to the physical simulation model.

[0087] The finite element analysis software can be, but is not limited to, COMSOL analysis software.

[0088] Optionally, in this embodiment, the physical simulation model is imported into finite element analysis software to obtain a preliminary temperature field analysis model of the target cable. Constraints are configured for the preliminary temperature field analysis model, and based on the configured preliminary temperature field analysis model, a target temperature field analysis model of the target cable is constructed. The constraints include the environmental conditions and boundary conditions of the target cable; the boundary conditions include at least the convective heat transfer coefficient; the environmental conditions mainly include the surrounding environment, such as soil, tunnels, or exposure to air.

[0089] Based on the initial temperature field analysis model with configured constraints, the optional implementation methods for constructing the target temperature field analysis model for the target cable are as follows:

[0090] The initial temperature field analysis model with configured constraints is meshed (e.g., using tetrahedral meshing) to obtain a candidate temperature field analysis model for the target cable. The test cable conductor current corresponding to the test surface temperature of the target cable is input into the candidate temperature field analysis model to obtain the test temperature field of the target cable. The temperature difference between the predicted surface temperature and the test surface temperature corresponding to the test temperature field is determined. It is then determined whether the temperature difference is less than a threshold value. If so, the candidate temperature field analysis model is used as the target temperature field analysis model for the target cable. If the temperature difference is not less than the threshold value (e.g., 0.1K), the boundary conditions are adjusted according to a preset step size to update the candidate temperature field analysis model. Based on the updated candidate temperature field analysis model, the process is repeated, inputting the test cable conductor current corresponding to the test surface temperature of the target cable into the candidate temperature field analysis model to obtain the test temperature field of the target cable. This process is iterated until the temperature difference is less than the threshold value, thus obtaining the target temperature field analysis model.

[0091] In this embodiment, a physical simulation model of the target cable is constructed based on its cable structure. This physical simulation model is then imported into finite element analysis software to obtain a preliminary temperature field analysis model for the target cable. Constraints are configured for this preliminary temperature field analysis model, and a mesh is generated to obtain candidate temperature field analysis models for the target cable. These candidate temperature field analysis models are then iteratively trained, with the flow heat transfer coefficient continuously adjusted to improve the accuracy of the output results, until a target temperature field analysis model with satisfactory accuracy is obtained.

[0092] In one embodiment, such as Figure 6As shown, one possible implementation of the cable temperature field determination method is as follows:

[0093] S601, based on each material layer and its layer parameters, determines the material thermal resistance and material heat capacity of each material layer in the target cable. The layer parameters include thermal resistivity and specific heat capacity.

[0094] S602, determine the environmental thermal resistance and environmental heat capacity of the target cable based on the environmental parameters of the target cable. These environmental parameters include at least one of air humidity, soil moisture content, and wind speed.

[0095] S603, based on the environmental thermal resistance and thermal capacity, as well as the material thermal resistance and thermal capacity of each material layer, constructs the thermal network topology model of the target cable.

[0096] S604, based on the cable structure of the target cable, construct a physical simulation model of the target cable.

[0097] S605 imports the physical simulation model into the finite element analysis software to obtain the initial temperature field analysis model of the target cable.

[0098] S606 configures constraints for the initial temperature field analysis model. These constraints include the environmental and boundary conditions of the target cable; the boundary conditions include the convective heat transfer coefficient.

[0099] S607, mesh the initial temperature field analysis model after configuring the constraints to obtain the candidate temperature field analysis model of the target cable.

[0100] S608 inputs the test cable conductor current corresponding to the test surface temperature of the target cable into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0101] S609, determine the temperature difference between the predicted surface temperature and the test surface temperature corresponding to the test temperature field.

[0102] S6010, determine whether the temperature difference is less than the difference threshold. If yes, proceed to S6011; otherwise, proceed to S6012.

[0103] S6011 uses the candidate temperature field analysis model as the target temperature field analysis model for the target cable.

[0104] S6012, adjust the boundary conditions according to the preset step size to update the candidate temperature field analysis model, and return to execute S608 based on the updated candidate temperature field analysis model.

[0105] S6013, in response to a request to determine the temperature field of the target cable, obtains the current surface temperature of the target cable.

[0106] S6014 inputs the current surface temperature of the target cable into the thermal network topology model of the target cable to obtain the current conductor current of the target cable.

[0107] S6015 inputs the current cable conductor current into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable.

[0108] In this embodiment, upon receiving a request to determine the temperature field of the target cable, the current surface temperature of the target cable is obtained. The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current cable conductor current. The current cable conductor current is then input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; wherein, the target temperature field analysis model is obtained by processing the cable structure of the target cable. This application uses a thermal network topology model, which, based on the current surface temperature of the target cable, can determine the current cable conductor current. By inputting the current cable conductor current into the target temperature field analysis model, not only can the temperature of the cable conductor of the target cable be accurately obtained, but also the current temperature field of the target cable can be obtained.

[0109] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0110] Based on the same inventive concept, this application also provides a cable temperature field determining device for implementing the cable temperature field determining method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the cable temperature field determining device provided below can be found in the limitations of the cable temperature field determining method described above, and will not be repeated here.

[0111] In one embodiment, such as Figure 7 As shown, a cable temperature field determination device 1 is provided, comprising: an acquisition module 10, a first determination module 20, and a second determination module 30, wherein:

[0112] The acquisition module 10 is used to acquire the current surface temperature of the target cable in response to a temperature field determination request for the target cable.

[0113] The first determining module 20 is used to input the current surface temperature of the target cable into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; wherein, the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable;

[0114] The second determining module 30 is used to input the current conductor current of the current cable into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; wherein, the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0115] In one embodiment, for the upper Figure 7 The first determining module 20 is also specifically used for:

[0116] Based on each material layer and its layer parameters, determine the thermal resistance and thermal capacity of each material layer in the target cable; the layer parameters include thermal resistivity and specific heat capacity.

[0117] Based on the environmental parameters of the target cable, determine the environmental thermal resistance and environmental heat capacity of the target cable; wherein, the environmental parameters include at least one of air humidity, soil moisture content and wind speed;

[0118] Based on the environmental thermal resistance and thermal capacity, as well as the material thermal resistance and thermal capacity of each material layer, a thermal network topology model of the target cable is constructed.

[0119] In one embodiment, for the upper Figure 7 The second determining module 30 is also specifically used for:

[0120] Based on the cable structure of the target cable, a physical simulation model of the target cable is constructed.

[0121] Based on finite element analysis software and physical simulation models, a target temperature field analysis model for the target cable is constructed.

[0122] In one embodiment, for the upper Figure 7 The second determining module 30 is also specifically used for:

[0123] The physical simulation model is imported into the finite element analysis software to obtain the initial temperature field analysis model of the target cable.

[0124] Constraints are configured for the initial temperature field analysis model, and a target temperature field analysis model for the target cable is constructed based on the initial temperature field analysis model with configured constraints. The constraints include the environmental conditions and boundary conditions of the target cable, and the boundary conditions include the convective heat transfer coefficient.

[0125] In one embodiment, for the upper Figure 7 The second determining module 30 is also specifically used for:

[0126] The initial temperature field analysis model with configured constraints is meshed to obtain the candidate temperature field analysis model for the target cable.

[0127] The test cable conductor current corresponding to the test surface temperature of the target cable is input into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0128] Determine the temperature difference between the predicted surface temperature and the test surface temperature corresponding to the test temperature field;

[0129] Determine if the temperature difference is less than the difference threshold;

[0130] If so, the candidate temperature field analysis model will be used as the target temperature field analysis model for the target cable.

[0131] In one embodiment, for the upper Figure 7 The cable temperature field determination device 1 further includes:

[0132] The adjustment module is used to adjust the boundary conditions according to a preset step size if the temperature difference is not less than the difference threshold, so as to update the candidate temperature field analysis model. Based on the updated candidate temperature field analysis model, it returns to the process of inputting the test cable conductor current corresponding to the test surface temperature of the target cable into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0133] Each module in the aforementioned cable temperature field determination device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0134] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 8As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores relevant data about the target cable. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When executed by the processor, the computer program implements a method for determining the cable temperature field.

[0135] Those skilled in the art will understand that Figure 8 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0136] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0137] In response to a request to determine the temperature field of the target cable, the current surface temperature of the target cable is obtained;

[0138] The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable.

[0139] The current conductor current of the target cable is input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0140] In one embodiment, when the processor executes the computer program, it further performs the following steps: processing the material information, including each material layer and layer parameters of each material layer, on the material information and environmental parameters of the target cable, including:

[0141] Based on each material layer and its layer parameters, determine the thermal resistance and thermal capacity of each material layer in the target cable; the layer parameters include thermal resistivity and specific heat capacity.

[0142] Based on the environmental parameters of the target cable, determine the environmental thermal resistance and environmental heat capacity of the target cable; wherein, the environmental parameters include at least one of air humidity, soil moisture content and wind speed;

[0143] Based on the environmental thermal resistance and thermal capacity, as well as the material thermal resistance and thermal capacity of each material layer, a thermal network topology model of the target cable is constructed.

[0144] In one embodiment, when the processor executes the computer program, it further performs the following steps: processing the cable structure of the target cable, including:

[0145] Based on the cable structure of the target cable, a physical simulation model of the target cable is constructed.

[0146] Based on finite element analysis software and physical simulation models, a target temperature field analysis model for the target cable is constructed.

[0147] In one embodiment, when the processor executes the computer program, it further performs the following steps: based on finite element analysis software and according to the physical simulation model, constructing a target temperature field analysis model for the target cable, including:

[0148] The physical simulation model is imported into the finite element analysis software to obtain the initial temperature field analysis model of the target cable.

[0149] Constraints are configured for the initial temperature field analysis model, and a target temperature field analysis model for the target cable is constructed based on the initial temperature field analysis model with configured constraints. The constraints include the environmental conditions and boundary conditions of the target cable, and the boundary conditions include the convective heat transfer coefficient.

[0150] In one embodiment, when the processor executes the computer program, it further performs the following steps: based on the initially selected temperature field analysis model after configuring constraints, constructing a target temperature field analysis model for the target cable, including:

[0151] The initial temperature field analysis model with configured constraints is meshed to obtain the candidate temperature field analysis model for the target cable.

[0152] The test cable conductor current corresponding to the test surface temperature of the target cable is input into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0153] Determine the temperature difference between the predicted surface temperature and the test surface temperature corresponding to the test temperature field;

[0154] Determine if the temperature difference is less than the difference threshold;

[0155] If so, the candidate temperature field analysis model will be used as the target temperature field analysis model for the target cable.

[0156] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0157] If the temperature difference is not less than the difference threshold, the boundary conditions are adjusted according to the preset step size to update the candidate temperature field analysis model. Based on the updated candidate temperature field analysis model, the process returns to input the test cable conductor current corresponding to the test surface temperature of the target cable into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0158] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0159] In response to a request to determine the temperature field of the target cable, the current surface temperature of the target cable is obtained;

[0160] The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable.

[0161] The current conductor current of the target cable is input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0162] In one embodiment, when the computer program is executed by a processor, it further performs the following steps: processing the material information, including each material layer and layer parameters of each material layer, on the material information and environmental parameters of the target cable, including:

[0163] Based on each material layer and its layer parameters, determine the thermal resistance and thermal capacity of each material layer in the target cable; the layer parameters include thermal resistivity and specific heat capacity.

[0164] Based on the environmental parameters of the target cable, determine the environmental thermal resistance and environmental heat capacity of the target cable; wherein, the environmental parameters include at least one of air humidity, soil moisture content and wind speed;

[0165] Based on the environmental thermal resistance and thermal capacity, as well as the material thermal resistance and thermal capacity of each material layer, a thermal network topology model of the target cable is constructed.

[0166] In one embodiment, when the computer program is executed by a processor, it further performs the following steps: processing the cable structure of the target cable, including:

[0167] Based on the cable structure of the target cable, a physical simulation model of the target cable is constructed.

[0168] Based on finite element analysis software and physical simulation models, a target temperature field analysis model for the target cable is constructed.

[0169] In one embodiment, when the computer program is executed by a processor, it further performs the following steps: based on finite element analysis software and according to a physical simulation model, constructing a target temperature field analysis model for the target cable, including:

[0170] The physical simulation model is imported into the finite element analysis software to obtain the initial temperature field analysis model of the target cable.

[0171] Constraints are configured for the initial temperature field analysis model, and a target temperature field analysis model for the target cable is constructed based on the initial temperature field analysis model with configured constraints. The constraints include the environmental conditions and boundary conditions of the target cable, and the boundary conditions include the convective heat transfer coefficient.

[0172] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: based on the initially selected temperature field analysis model after configuring constraints, constructing a target temperature field analysis model for the target cable, including:

[0173] The initial temperature field analysis model with configured constraints is meshed to obtain the candidate temperature field analysis model for the target cable.

[0174] The test cable conductor current corresponding to the test surface temperature of the target cable is input into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0175] Determine the temperature difference between the predicted surface temperature and the test surface temperature corresponding to the test temperature field;

[0176] Determine if the temperature difference is less than the difference threshold;

[0177] If so, the candidate temperature field analysis model will be used as the target temperature field analysis model for the target cable.

[0178] In one embodiment, when the computer program is executed by a processor, it further performs the following steps:

[0179] If the temperature difference is not less than the difference threshold, the boundary conditions are adjusted according to the preset step size to update the candidate temperature field analysis model. Based on the updated candidate temperature field analysis model, the process returns to input the test cable conductor current corresponding to the test surface temperature of the target cable into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0180] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0181] In response to a request to determine the temperature field of the target cable, the current surface temperature of the target cable is obtained;

[0182] The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable.

[0183] The current conductor current of the target cable is input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; the target temperature field analysis model is obtained by processing the cable structure of the target cable.

[0184] In one embodiment, when the computer program is executed by a processor, it further performs the following steps: processing the material information, including each material layer and layer parameters of each material layer, on the material information and environmental parameters of the target cable, including:

[0185] Based on each material layer and its layer parameters, determine the thermal resistance and thermal capacity of each material layer in the target cable; the layer parameters include thermal resistivity and specific heat capacity.

[0186] Based on the environmental parameters of the target cable, determine the environmental thermal resistance and environmental heat capacity of the target cable; wherein, the environmental parameters include at least one of air humidity, soil moisture content and wind speed;

[0187] Based on the environmental thermal resistance and thermal capacity, as well as the material thermal resistance and thermal capacity of each material layer, a thermal network topology model of the target cable is constructed.

[0188] In one embodiment, when the computer program is executed by a processor, it further performs the following steps: processing the cable structure of the target cable, including:

[0189] Based on the cable structure of the target cable, a physical simulation model of the target cable is constructed.

[0190] Based on finite element analysis software and physical simulation models, a target temperature field analysis model for the target cable is constructed.

[0191] In one embodiment, when the computer program is executed by a processor, it further performs the following steps: based on finite element analysis software and according to a physical simulation model, constructing a target temperature field analysis model for the target cable, including:

[0192] The physical simulation model is imported into the finite element analysis software to obtain the initial temperature field analysis model of the target cable.

[0193] Constraints are configured for the initial temperature field analysis model, and a target temperature field analysis model for the target cable is constructed based on the initial temperature field analysis model with configured constraints. The constraints include the environmental conditions and boundary conditions of the target cable, and the boundary conditions include the convective heat transfer coefficient.

[0194] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: based on the initially selected temperature field analysis model after configuring constraints, constructing a target temperature field analysis model for the target cable, including:

[0195] The initial temperature field analysis model with configured constraints is meshed to obtain the candidate temperature field analysis model for the target cable.

[0196] The test cable conductor current corresponding to the test surface temperature of the target cable is input into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0197] Determine the temperature difference between the predicted surface temperature and the test surface temperature corresponding to the test temperature field;

[0198] Determine if the temperature difference is less than the difference threshold;

[0199] If so, the candidate temperature field analysis model will be used as the target temperature field analysis model for the target cable.

[0200] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0201] If the temperature difference is not less than the difference threshold, the boundary conditions are adjusted according to the preset step size to update the candidate temperature field analysis model. Based on the updated candidate temperature field analysis model, the process returns to input the test cable conductor current corresponding to the test surface temperature of the target cable into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

[0202] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0203] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0204] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for determining the temperature field of a cable, characterized in that, The method includes: In response to a request to determine the temperature field of a target cable, the current surface temperature of the target cable is obtained; The current surface temperature of the target cable is input into the thermal network topology model of the target cable to obtain the current conductor current of the target cable. The thermal network topology model is obtained by processing the material information and environmental parameters of the target cable. The material information includes each material layer and its layer parameters. Processing the material information and environmental parameters of the target cable includes: determining the material thermal resistance and material heat capacity of each material layer in the target cable based on the material layers and their layer parameters; wherein the layer parameters include thermal resistivity and specific heat capacity; determining the environmental thermal resistance and environmental heat capacity of the target cable based on the environmental parameters; wherein the environmental parameters include at least one of air humidity, soil moisture content, wind speed, and ambient temperature; and constructing the thermal network topology model of the target cable based on the environmental thermal resistance and environmental heat capacity, as well as the material thermal resistance and material heat capacity of each material layer. The current conductor current of the current cable is input into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; wherein, the target temperature field analysis model is obtained by processing the cable structure of the target cable.

2. The method according to claim 1, characterized in that, The processing of the cable structure of the target cable includes: Based on the cable structure of the target cable, a physical simulation model of the target cable is constructed; Based on the finite element analysis software and the physical simulation model, a target temperature field analysis model for the target cable is constructed.

3. The method according to claim 2, characterized in that, The method of constructing a target temperature field analysis model for the target cable based on the physical simulation model using finite element analysis software includes: The physical simulation model is imported into the finite element analysis software to obtain the initial temperature field analysis model of the target cable. Constraints are configured for the initial temperature field analysis model, and a target temperature field analysis model for the target cable is constructed based on the initial temperature field analysis model with configured constraints; wherein, the constraints include the environmental conditions and boundary conditions of the target cable; the boundary conditions include the convective heat transfer coefficient.

4. The method according to claim 3, characterized in that, The initial temperature field analysis model based on the configured constraints is used to construct the target temperature field analysis model for the target cable, including: The initial temperature field analysis model with configured constraints is meshed to obtain the candidate temperature field analysis model of the target cable. The test cable conductor current corresponding to the test surface temperature of the target cable is input into the candidate temperature field analysis model to obtain the test temperature field of the target cable; Determine the temperature difference between the predicted surface temperature and the test surface temperature corresponding to the test temperature field; Determine whether the temperature difference is less than a difference threshold; If so, the candidate temperature field analysis model shall be used as the target temperature field analysis model for the target cable.

5. The method according to claim 4, characterized in that, The method further includes: If the temperature difference is not less than the difference threshold, the boundary conditions are adjusted according to the preset step size to update the candidate temperature field analysis model. Based on the updated candidate temperature field analysis model, the process returns to inputting the test cable conductor current corresponding to the test surface temperature of the target cable into the candidate temperature field analysis model to obtain the test temperature field of the target cable.

6. A device for determining the temperature field of a cable, characterized in that, include: An acquisition module is used to acquire the current surface temperature of the target cable in response to a request to determine the temperature field of the target cable. The first determining module is used to input the current surface temperature of the target cable into the thermal network topology model of the target cable to obtain the current conductor current of the target cable; wherein, the thermal network topology model is obtained by processing the material information and environmental parameters of the target cable; the material information includes each material layer and the layer parameters of each material layer; the processing of the material information and environmental parameters of the target cable includes: determining the material thermal resistance and material thermal capacity of each material layer in the target cable according to each material layer and the layer parameters of each material layer; wherein, the layer parameters include thermal resistivity and specific heat capacity; determining the environmental thermal resistance and environmental thermal capacity of the target cable according to the environmental parameters of the target cable; wherein, the environmental parameters include at least one of air humidity, soil moisture content, wind speed and ambient temperature; and constructing the thermal network topology model of the target cable according to the environmental thermal resistance and the environmental thermal capacity, as well as the material thermal resistance and material thermal capacity of each material layer. The second determining module is used to input the current cable conductor current into the target temperature field analysis model of the target cable to obtain the current temperature field of the target cable; wherein, the target temperature field analysis model is obtained by processing the cable structure of the target cable.

7. The apparatus according to claim 6, characterized in that, The second determining module is further specifically used for: Based on the cable structure of the target cable, a physical simulation model of the target cable is constructed; Based on the finite element analysis software and the physical simulation model, a target temperature field analysis model for the target cable is constructed.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the cable temperature field determination method according to any one of claims 1 to 5.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the cable temperature field determination method according to any one of claims 1 to 5.

10. A computer program product, comprising a computer program, characterized in that, When executed by a processor, the computer program implements the steps of the cable temperature field determination method according to any one of claims 1 to 5.

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