Wire pad design of connection pads in prelam inlay of smart card, prelam inlay, smart card, method of forming wire pad design, and method of forming smart card

Abstract

In various aspects, the present invention relates to a wire pad design of a connection pad in a prelam inlay of a smart card, a prelam inlay having at least one such connection pad embedded in a substrate, a smart card comprising such a prelam inlay, a method of forming a wire pad design of a connection pad in a prelam inlay of a smart card, and a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam inlay of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed from a plurality of wire portions extending in a contact pad plane, and a bridging wire portion extending at least partially outside the contact pad plane. The bridging wire portion electrically and mechanically connects at least some of the plurality of wire portions to one another.

Description

Technical Field

[0001] The present invention relates to a wire pad design for a connector pad in a pre-laminated insert of a smart card, a pre-laminated insert having at least one such connector pad embedded in a substrate, a smart card including such a pre-laminated insert, a method for designing a wire pad for a connector pad in a pre-laminated insert of a smart card, and a method for forming a smart card. Background Technology

[0002] Typically, a smart card is a credit card-sized plastic card with electrical interconnects between one or more internal chip modules and / or contacts to external chip modules. By integrating different modules into the body of the smart card, it can perform at least some of a variety of functions, such as functions for transmitting, storing, and / or processing data. For example, a smart card may be equipped with a memory chip and / or a processor and / or an antenna module capable of wireless communication with the card, as well as optional external contacts for contacting the smart card via an external contact mechanism.

[0003] The limited available space within a card for implementing different functions and the need to meet various ISO / IEC standards impose constraints on smart cards and their components, making the task of increasing smart card functionality increasingly complex. For example, when using chip modules with multiple input / output (I / O) terminals to integrate more and more functions into a smart card, the required number of internal contact terminals within the card body increases, and it becomes increasingly difficult to place the required number of contact terminals for the chip module in a dense manner among other components within the card body without compromising the proper functioning of the contact terminals.

[0004] A common approach is to provide internal contact terminals, serving as a contact interface, between the internal interconnection section of the card body and the module embedded in the card body, using a connection pad in the form of a wire pad. Typically, the wire pad is provided such that the ends of the wires are laid out in the card body in the form of a regional wire pattern to form a connection pad covering a sufficient area to achieve reliable contact between the wire pad and the corresponding terminal of the module to be contacted, taking into account the size tolerances of the corresponding terminal to be contacted and possible placement errors during module placement.

[0005] In view of the above, it is desirable to provide a wire pad design for the connector pads in a pre-laminated insert of a smart card, which can increase the density of the connector pads without degrading any contact between the connector pads and the corresponding module terminals. Furthermore, it is desirable to provide a pre-laminated insert of a smart card having connector pads with such a wire pad design, as well as a method for forming the wire pad design and a method for forming a smart card having such a wire pad design. Summary of the Invention

[0006] In a first aspect of this disclosure, a wire pad design for a connection pad in a pre-laminated insert of a smart card is provided. According to an illustrative embodiment of the first aspect, the wire pad design includes a connection pad wiring pattern formed by a plurality of wire portions extending in a contact pad plane, and bridging wire portions extending at least partially outside the contact pad plane. The bridging wire portions electrically and mechanically connect at least some of the plurality of wire portions to each other.

[0007] In this disclosure, the term "pre-laminated inlay" as used herein is understood to refer to a body pre-laminated with one or more layers of insulating material (such as PVC, PC, or some other suitable thermoplastic polymer). Specifically, the term "pre-laminated inlay" can mean an inlay formed from a single layer that is inserted as an inlay (provided at a suitable size) into a recess in a body, such as an inlay inserted into a smart card. Alternatively, the term "pre-laminated inlay" can mean multiple layers pre-laminated together. In any case, a pre-laminated body can be considered as an intermediate product obtained during the manufacture of a smart card. For example, an illustrative pre-laminated inlay formed from multiple layers can be obtained by melting different layers of thermoplastic material together to form a single homogeneous sheet body, thereby forming a monolithic substrate body. In some illustrative embodiments, the pre-laminated inlay, i.e., the substrate body (or base substrate), may have at least one contact and / or interconnect embedded therein, and optionally one or more electronic modules integrated into the substrate body and electrically connected to at least one contact and / or interconnect of the substrate body.

[0008] In the wire pad design of the first aspect, if the wire portions of the connecting pad wiring pattern are disconnected when the module is integrated into the pre-laminated insert, the connecting pad wiring pattern remains electrically connected via bridging wire portions. That is, the bridging wire portions maintain the electrical connection between the wire portions connected via the bridging wire portions. In some specific illustrative embodiments herein, the bridging wire portions extend outside the contact pad plane in such a way that all wire portions of the connecting pad wiring pattern in the contact pad plane are electrically connected to each other, such that when the connecting pad wiring pattern is partially removed, the remaining wiring portions are electrically connected to each other, thereby maintaining the functionality of the wire pad.

[0009] According to some illustrative embodiments of the first aspect, at least some of the wire portions can extend partially parallel, allowing for a high density of wire portions in a compact design. According to some specific illustrative embodiments herein, turning portions can be located between every two parallel wire portions, and bridging wire portions extend substantially across the parallel wire portions. Therefore, an electrical connection between the parallel wire portions can be easily established by bridging wire portions. For example, bridging wire portions can be arranged on a first side of the connecting pad wiring pattern near the turning portion, such that the wire portions remain electrically connected when the turning portion at a second side opposite to the first side is removed.

[0010] According to some illustrative embodiments of the first aspect, the wiring pattern of the connector pad can be a spiral-shaped ribbon cable pattern, a zigzag ribbon cable pattern, or a pattern of multiple circular shapes that partially overlap each other. Therefore, different advantageous forms of wiring patterns can be achieved to best match the terminals of the module to be contacted.

[0011] According to some illustrative embodiments of the first aspect, the wiring density of the connector pad wiring pattern can be locally varied. For example, the wiring density can be given by multiple wire portions in a given region of the pre-laminated insert. Locally varied wiring densities can locally enhance the connectivity of the terminals of the modules to be connected via the wire pad design.

[0012] According to some illustrative embodiments of the first aspect, the ratio of wire diameter to wire spacing in the wire portion of the connector pad wiring pattern can be in the range of about 0.3 to about 0.95, thereby enabling advantageous connectability. According to some specific illustrative embodiments herein, the connector pad wiring pattern can have at least one first portion with a ratio in the range of about 0.3 to about 0.8 and at least one second portion with a ratio greater than 0.8 and less than or equal to about 0.95, thereby readily enabling connector pad wiring patterns with locally varying densities.

[0013] In some illustrative embodiments of the first aspect, the plurality of wire portions may have a wire pitch of at least 300 μm, preferably at least 200 μm, more preferably at least 100 μm, and may have a diameter in the range of about 50 μm to about 300 μm, preferably in the range of about 50 μm to about 200 μm, or in the range of about 80 μm to about 300 μm, more preferably in the range of about 80 μm to about 200 μm.

[0014] According to the illustrative embodiment of the first aspect, the wire portion may be made of copper, copper alloy or copper-tin alloy or aluminum or aluminum alloy, and preferably at least some of the multiple wires may be at least partially covered by an insulating coating or may not be covered.

[0015] In a second aspect of this disclosure, a pre-laminated insert is provided. According to an illustrative embodiment of the second aspect, the pre-laminated insert has a substrate having at least one connection pad embedded therein, the at least one connection pad being formed according to the wire pad design of the first aspect.

[0016] In the pre-laminated insert of the second aspect, when these wire portions of the connector pad wiring pattern are disconnected when an opening for integrating the module into the pre-laminated insert is formed in the pre-laminated insert, the connector pad wiring pattern remains electrically connected via bridging wire portions. That is, the bridging wire portions maintain the electrical connection between the wire portions connected via the bridging wire portions. In some specific illustrative embodiments herein, the bridging wire portions extend outside the contact pad plane in such a way that all wire portions of the connector pad wiring pattern in the contact pad plane are electrically connected to each other, such that when the connector pad wiring pattern is partially removed, the remaining wiring portions are electrically connected to each other, thereby maintaining the function of the wire pad.

[0017] According to some illustrative embodiments of the second aspect, the pre-laminated insert may further include a first recess formed in the substrate below the connector pad wiring pattern, the first recess extending at least partially into the substrate along the thickness direction of the substrate. Thus, the bridging wire portion may advantageously be located below the connector pad wiring pattern in the substrate, or the recess may be used to compensate for substrate material displacement during the embedding of the connector pad wiring pattern into the substrate.

[0018] According to an illustrative embodiment of this aspect, the bridging wire portion can be accommodated in the first recess, thereby enabling the bridging wire portion to be arranged in the substrate below the connection pad wiring pattern. Therefore, when the connection pad wiring pattern in the pre-laminated insert is exposed, the bridging wire portion can be protected from accidental removal.

[0019] According to an illustrative embodiment of the second aspect, the pre-laminated insert may further include a second recess formed in the substrate below the connector pad wiring pattern, the connector pad wiring pattern spanning at least a portion of the second recess. For example, the second recess may be formed in the layer in which the wire is embedded, or the recess may be formed in a layer below the layer in which the wire is embedded. The second recess avoids localized accumulation of substrate material in the pad region when the connector pad wiring pattern is embedded in the substrate, thereby ensuring a uniform thickness at the connector pad wiring pattern in the pre-laminated insert.

[0020] In a third aspect of this disclosure, a smart card is provided. According to an illustrative embodiment of the third aspect, the smart card includes a pre-laminated insert of the second aspect and a module integrated into the pre-laminated insert. The module has at least one I / O terminal for electrical connection to at least one connection pad (meaning an input / output terminal for supplying electrical signals and / or electrical power to and / or receiving electrical signals from the module). The module is accommodated in a cavity disposed in the pre-laminated insert adjacent to at least one connection pad, such that at least one I / O terminal is in electrical contact with at least one connection pad.

[0021] In the third aspect of the smart card, even when these wire portions of the connection pad wiring pattern are disconnected due to module integration into the pre-laminated embedding, the connection pad wiring pattern remains electrically connected via bridging wire portions. That is, the bridging wire portions maintain the electrical connection between the wire portions connected via the bridging wire portions. In some specific illustrative embodiments herein, the bridging wire portions extend beyond the contact pad plane in such a way that all wire portions of the connection pad wiring pattern in the contact pad plane are electrically connected to each other, such that when the connection pad wiring pattern is partially removed, the remaining wiring portions remain electrically connected to each other, thereby maintaining the functionality of the wire pad.

[0022] According to some illustrative embodiments of the third aspect, the electrical contact between at least one I / O terminal and at least one connection pad is formed by at least one of solder interconnection, adhesive interconnection using anisotropic conductive film (ACF) or anisotropic conductive paste (ACP), and adhesive interconnection using isotropic conductive film or paste (ICP). Therefore, reliable electrical interconnection between the connection pad and the module can be easily achieved.

[0023] According to some illustrative embodiments of the third aspect, a cavity may be formed on one side of at least one connecting pad, which faces away from the side of the connecting pad where the bridging wire portion is formed. Therefore, the risk of damaging the bridging wire connection is reduced when integrating the module into the smart card.

[0024] According to some illustrative embodiments of the third aspect, at least one turning portion can be removed. Therefore, increased space can be provided for the recess at the wire pad design and / or the wire pad design can be formed closer to the recess formed in the pre-laminated insert.

[0025] According to some illustrative embodiments of the third aspect, the pre-laminated insert may be rectangular in shape in a top view, having a length dimension along the length direction and a width dimension smaller than the length dimension along a width direction perpendicular to the length direction, wherein the wire portion is oriented at an angle ranging from about 45° to about 90° relative to the width dimension. This allows for a compact wire pad design.

[0026] In a fourth aspect of this disclosure, a method is provided for a wire pad design for forming a connection pad in a pre-laminated insert of a smart card. According to an illustrative embodiment of the fourth aspect, the method includes: providing a substrate for the pre-laminated insert; forming a connection pad wiring pattern as a contact pad plane from a plurality of wire portions on a surface of the substrate; and forming a bridging wire portion extending at least partially outside the contact pad plane, wherein the bridging wire portion is electrically and mechanically connected to at least some of the plurality of wire portions.

[0027] According to the method of the fourth aspect, in the formed wire pad design, even when these wire portions of the connecting pad wiring pattern are disconnected when the module is integrated into the pre-laminated insert, the connecting pad wiring pattern remains electrically connected via bridging wire portions. That is, the bridging wire portions maintain the electrical connection between the wire portions connected via the bridging wire portions. In some specific illustrative embodiments herein, the bridging wire portions extend outside the contact pad plane in such a way that all wire portions of the connecting pad wiring pattern in the contact pad plane are electrically connected to each other, such that when the connecting pad wiring pattern is partially removed, the remaining wiring portions are electrically connected to each other, thereby maintaining the functionality of the wire pad.

[0028] According to some illustrative embodiments of the fourth aspect, the bridging wire portion may be formed to extend at least partially above the connector pad wiring pattern. Alternatively, the method may further include forming a first recess in the substrate prior to forming either the connector pad wiring pattern or the bridging wire portion, and subsequently forming the bridging wire portion by receiving the wire portion into the first recess, followed by forming the connector pad wiring pattern on a surface outside the first recess of the substrate.

[0029] According to some illustrative embodiments of the fourth aspect, the method may further include forming a second recess in the substrate, the second recess being at least partially located below the connector pad wiring pattern, with a wire portion extending across the second recess. For example, the second recess may be formed in the layer in which the wire is embedded, or the recess may be formed in a layer below the layer in which the wire is embedded. The second recess avoids localized accumulation of substrate material in the pad region when the connector pad wiring pattern is embedded in the substrate, thereby ensuring uniform thickness at the connector pad wiring pattern in the pre-laminated insert.

[0030] In a fifth aspect of this disclosure, a method for forming a smart card is provided. According to an illustrative embodiment of the fifth aspect, the method includes: providing a card body formed from a pre-laminated insert having at least one connection pad embedded therein, the at least one connection pad being provided by a wire pad design formed according to the method of the fifth fourth aspect; forming a cavity in the card body by milling a cavity into the card body in a manner that exposes the at least one connection pad; and receiving a module having at least one I / O terminal into the cavity adjacent to the at least one connection pad, such that the at least one I / O terminal is in electrical contact with the at least one connection pad.

[0031] According to the method of the fifth aspect, a smart card is formed such that even when the wire portions of the connecting pad wiring pattern are disconnected during module integration into the card body, the connecting pad wiring pattern remains electrically connected via bridging wire portions. That is, the bridging wire portions maintain the electrical connection between the wire portions connected via the bridging wire portions. In some specific illustrative embodiments herein, the bridging wire portions extend outside the contact pad plane in such a way that all wire portions of the connecting pad wiring pattern in the contact pad plane are electrically connected to each other, such that when the connecting pad wiring pattern is partially removed, the remaining wiring portions remain electrically connected to each other, thereby maintaining the functionality of the wire pad. Attached Figure Description

[0032] Various illustrative embodiments and other advantages of each aspect will become apparent from the detailed description of the accompanying drawings presented below.

[0033] Figure 1 The wire pad design of the connection pad according to some illustrative embodiments of the present disclosure is schematically shown.

[0034] Figure 2 The wire pad design of the connection pad according to some other illustrative embodiments of this disclosure is schematically shown.

[0035] Figure 3 The wire pad design of the connection pad according to some other illustrative embodiments of this disclosure is schematically shown.

[0036] Figure 4 The wire pad design of the connection pad according to some other illustrative embodiments of this disclosure is schematically shown.

[0037] Figure 5 The wire pad design of the connection pad according to some other illustrative embodiments of this disclosure is schematically shown.

[0038] Figure 6 The wire pad design of the connection pad according to some other illustrative embodiments of this disclosure is schematically shown.

[0039] Figure 7 A pre-laminated insert of a connector pad designed with a connector pad according to some illustrative embodiments of the present disclosure is shown schematically.

[0040] Figure 8 Schematic illustration along Figure 7 The sectional view of line aa in the diagram.

[0041] Figure 9 A pre-laminated insert according to some illustrative embodiments of the present disclosure is schematically shown.

[0042] Figure 10 An enlarged view schematically illustrates a portion of a pre-laminated inlay according to some other illustrative embodiments of the present disclosure.

[0043] Figure 11 The wire pad design of the connection pad according to some other illustrative embodiments of this disclosure is schematically shown.

[0044] Figure 12 Schematic illustration along Figure 11 The sectional view of line bb in the middle.

[0045] The accompanying drawings are provided only to illustrate some of the concepts of this disclosure and do not show all possible details of specific embodiments and are not drawn to scale. Detailed Implementation

[0046] refer to Figure 1The wire pad design of the connection pad 1 in the pre-laminated insert (not shown) of a smart card (not shown) is schematically illustrated according to some illustrative embodiments of the present disclosure. The wire pad design includes a connection pad wiring pattern 3 and bridging wire portions 5. The connection pad wiring pattern 3 is formed by a plurality of wire portions 7a, 7b, 7c, 7d, 7e, 7f, 7g, 7h, 7i and 7j extending in the contact pad plane. Multiple wire sections 7a to 7j are connected by turning sections 9a, 9b, 9c, 9d, 9e and turning sections 11a, 11b, 11c, 11d in the following manner: turning section 9a extends between wire sections 7a and 7b; turning section 11a connects sections 7b and 7c; turning section 9b connects wire sections 7c and 7d; turning section 11b connects wire sections 7d and 7e; turning section 9c connects wire sections 7e and 7f; turning section 11c connects wire sections 7f and 7g; turning section 9d connects wire sections 7g and 7h; turning section 11d connects wire sections 7h and 7i; and turning section 9e connects wire sections 7i and 7j. Turning sections 9a to 9e are located on one side 13 of the connecting pad wiring pattern 3, and turning sections 11a to 11d are formed on the side 15 opposite to side 13 in the direction of extension of each of the wire sections 7a to 7j. Generally, wire portions 7a to 7j extend between turning portions 9a to 9e and turning portions 11a to 11d, that is, from the side 13 where turning portions 9a to 9e are located to the side 15 formed by turning portions 11a to 11d. Although Figure 1 The illustration clearly shows the bridging wire portion 5 formed on side 15, but this does not constitute any limitation, and alternatively, the bridging wire portion 5 may be located on side 13.

[0047] Continue to refer to Figure 1 The diagram shows wire end portions 17a and 17b, indicating the end portions of the wire forming the connecting pad 1. Although wire end portions 17a and 17b are... Figure 1 The end portion is shown as the end in the diagram, but this does not constitute any limitation on the wire forming the connecting pad 1, and at least one of the wire end portions 17a and 17b can extend to another connecting pad (not shown) or another internal interconnect interface (not shown) in the pre-laminated insert (not shown). According to some illustrative embodiments, Figure 1 The cable pad design shown can be formed by routing the cables to initially provide cable end portion 17a, then forming the connecting pad wiring pattern 3, then forming the bridging cable portion 5, and then providing the cable end portion 17b. In this document, the bridging cable portion 5 can be formed across the connecting pad wiring pattern 3. Alternatively, Figure 1The cable pad design shown can be formed by routing the cable to initially provide the cable end portion 17b, then forming the bridging cable portion 5, then forming the connecting pad wiring pattern 3, and then providing the cable end portion 17b. In this document, the connecting pad wiring pattern 3 can be formed across the bridging cable portion 5, or in other words, the bridging cable portion 5 extends below the connecting pad wiring pattern 3.

[0048] exist Figure 1 In the illustration, wire portions 7a to 7j extend substantially parallel to each other, while turning portions 9a to 9e and turning portions 11a to 11d extend substantially in a manner that causes wire portions 7a to 7j to extend obliquely. Figure 1 In the explicit illustration, steering portions 9a to 9e and steering portions 11a to 11d are shown as substantially parallel to each other. However, this is not a limitation, and those skilled in the art will understand that only steering portions 9a to 9e may be parallel to each other, and only steering portions 11a to 11d may be parallel to each other, or alternatively, only subsets of the steering portions may be parallel.

[0049] According to some illustrative implementation methods, such as Figure 1 The bridging wire portion 5 shown extends beyond the contact pad plane in a manner that allows it to extend above or below the plurality of wire portions 7a to 7j. Figure 1 In the top view, the bridging wire portion 5 intersects with the wire portions 7a to 7j at multiple intersection points 8 where the bridging wire portion 5 is electrically and mechanically connected to the wire portions 7a to 7j. This does not constitute any limitation on this disclosure, and those skilled in the art will understand that the bridging wire portion 5 may only have electrical and mechanical contact with some of the wire portions 7a to 7j.

[0050] refer to Figure 1 The connecting pad 1 has a wire pad design in the form of a zigzag wire pattern, in which the wire portions 7a to 7j and the turning portions 9a to 9e are arranged in a roughly Z-shape with the turning portions 11a to 11d.

[0051] Continue to refer to Figure 1The wire portions 7a to 7j of the connecting pad wiring pattern 3 are formed of wires having a spacing of at least 300 μm, preferably at least 200 μm, and more preferably at least 100 μm. Without limitation, the turning portions 9a to 9e and the turning portions 11a to 11d may also have the same spacing. Additionally or alternatively, the diameter of the wire portions may be in the range of about 50 μm to about 300 μm, preferably in the range of about 50 μm to about 200 μm, or in the range of about 80 μm to about 300 μm, more preferably in the range of about 80 μm to 200 μm. Similarly, the turning portions 9a to 9e and the turning portions 11a to 11d may also have the same diameter.

[0052] According to some illustrative embodiments, wire portions 7a to 7j and / or bridging wire portion 5 may be made of copper, copper alloy, copper-tin alloy, aluminum, or aluminum alloy. Preferably, at least some of the wire portions 7a to 7j and / or bridging wire portion 5 may be at least partially covered by an insulating coating, or may be without any covering, such as copper wire with a flash of silver or ordinary copper wire. Generally, any conductive material, preferably metallic, that can be configured as metal wire, conductor track, or strip may be used for at least one of the wire portions 7a to 7j and / or bridging wire portion 5.

[0053] Based on some illustrative embodiments of this disclosure and continuing to refer to... Figure 1 , Figure 1 The wiring density of the connector pad 1, given by the ratio of wire diameter to wire spacing in the connector pad wiring pattern 3, can be in the range of approximately 0.3 to 0.95.

[0054] refer to Figure 2 The wire pad design of the connection pad 20 in the pre-laminated insert (not shown) of the smart card (not shown) is schematically shown in the top view.

[0055] like Figure 2As shown, the connector pad 20 has a wire pad design including a connector pad wiring pattern 23 and a bridging wiring portion 25. The connector pad wiring pattern 23 is given by a spiral-shaped ribbon cable pattern having multiple wire portions represented by circular wire portions, which are concentrically wound in a spiral form from the inner smallest diameter to the outer largest diameter. The connector pad wiring pattern 23 defines a contact pad plane by the multiple wire portions of the connector pad wiring pattern 23 wound in a planar arrangement. The bridging wiring portion 25 extends at least partially outside the contact pad plane, such that the bridging wiring portion 25 extends above or below the connector pad wiring pattern 23 in the area of ​​the wire portions of the connector pad wiring pattern 23. The wire ends 27a and 27b of the connector pad 20 may be arranged within the contact pad plane, or at least one of the wire ends 27a and 27b may be located outside the connector pad plane.

[0056] According to some illustrative embodiments, Figure 2 The wire pad design can be formed by routing the wires starting from the wire end 27a to achieve a spiral shape corresponding to the connection pad wiring pattern 23, and further routing the wires below or above the wire portion of the connection pad wiring pattern 23 so that the wire portion crosses the connection pad wiring pattern 23 or travels below the connection pad wiring pattern 23.

[0057] According to some illustrative embodiments, the spacing of the wire portions of the connector pad wiring pattern 23 can be in the range of about 100 μm to about 300 μm, for example, from about 150 μm to about 200 μm, such as 160 μm. The minimum diameter can be in the range of about 0.1 mm to about 0.8 mm, for example, about 0.5 mm. The outer diameter of the connector pad 20 can be in the range of about 1 mm to about 3 mm, for example, about 2 mm.

[0058] Continue to refer to Figure 2 The wire portion of the connecting pad wiring pattern 23 is formed of wire having a spacing of at least 300 μm, preferably at least 200 μm, and more preferably at least 100 μm. Alternatively or additionally, the diameter of the wire portion may be in the range of about 50 μm to about 300 μm, preferably in the range of about 50 μm to about 200 μm, or in the range of about 80 μm to about 300 μm, more preferably in the range of about 80 μm to 200 μm.

[0059] According to some illustrative embodiments, the wire portions and / or bridging wire portions 25 of the connector pad wiring pattern 23 may be made of copper, copper alloy, copper-tin alloy, aluminum, or aluminum alloy. Preferably, at least some of the wire portions and / or bridging wire portions 25 of the connector pad wiring pattern 23 may be at least partially covered by an insulating coating, or may be without any covering, such as copper wire with silver or ordinary copper wire. Generally, any conductive and preferably metallic material that can be configured as metal wire, conductor track, or strip may be used for at least one of the wire portions and / or bridging wire portions 25.

[0060] Based on some illustrative embodiments of this disclosure and continuing to refer to... Figure 2 The wiring density of the connector pad 20, given by the ratio of wire diameter to wire spacing in the connector pad wiring pattern 23, can be in the range of approximately 0.3 to 0.95.

[0061] refer to Figure 3 The wire pad design of the connection pad 30 in the pre-laminated insert (not shown) of the smart card (not shown) is schematically shown in the top view.

[0062] like Figure 3 As shown, the connector pad 30 has a wire pad design including a connector pad wiring pattern 33 and a bridging wiring portion 35. The connector pad wiring pattern 33 is given by a spiral-shaped ribbon cable pattern having a plurality of wire portions represented by rectangular wire portions arranged in a concentric spiral from the inside to the outside of the rectangular shape of the connector pad wiring pattern 33. The outer rectangular shape is given by a length, such as about 6 mm, in the range of about 1 mm to about 10 mm, preferably from about 3 mm to about 8 mm, more preferably from about 5 mm to about 7 mm, and a width (less than the length), such as about 2 mm, in the range of about 0.5 mm to about 5 mm, preferably from about 1 mm to about 3 mm.

[0063] According to the illustrative embodiment, a plurality of wire portions of the connecting pad wiring pattern 33 are wound in a planar arrangement, and the connecting pad wiring pattern 33 defines a contact pad plane. Bridging wire portions 35 extend at least partially outside the contact pad plane, such that the bridging wire portions 35 extend above or below the connecting pad wiring pattern 33 in the region of the wire portions of the connecting pad wiring pattern 33. The wire ends 37a and 37b of the connecting pad 30 may be arranged within the contact pad plane, or at least one of the wire ends 37a and 37b may be located outside the connecting pad plane.

[0064] According to some illustrative embodiments, Figure 3 The wire pad design can be formed by arranging the wires starting from wire end 37a to achieve the corresponding... Figure 3The connecting pad wiring pattern 33 shown has a spiral rectangular shape, and the wires are further routed below or above the wire portion of the connecting pad wiring pattern 33 so that they cross the connecting pad wiring pattern 33 or travel below the connecting pad wiring pattern 33 at the wire portion.

[0065] According to some illustrative embodiments, the spacing of the wire portions of the connector pad wiring pattern 33 can be in the range of about 100 μm to about 300 μm, for example, from about 150 μm to about 200 μm, such as 160 μm.

[0066] Continue to refer to Figure 3 The wire portion of the connecting pad wiring pattern 33 is formed of wire having a spacing of at least 300 μm, preferably at least 200 μm, and more preferably at least 100 μm. Alternatively or additionally, the diameter of the wire portion may be in the range of about 50 μm to about 300 μm, preferably in the range of about 50 μm to about 200 μm, or in the range of about 80 μm to about 300 μm, more preferably in the range of about 80 μm to 200 μm.

[0067] According to some illustrative embodiments, the wire portions and / or bridging wire portions 35 of the connector pad wiring pattern 33 may be made of copper, copper alloy or copper-tin alloy or aluminum or aluminum alloy. Preferably, at least some of the wire portions and / or bridging wire portions 35 of the plurality of wire portions of the connector pad wiring pattern 33 may be at least partially covered by an insulating coating, or may not be covered.

[0068] Based on some illustrative embodiments of this disclosure and continuing to refer to... Figure 3 The wiring density of the connector pad 30, given by the ratio of wire diameter to wire spacing in the connector pad wiring pattern 33, can be in the range of approximately 0.3 to 0.95.

[0069] Although Figure 3 A connector pad wiring pattern 30 in the form of a helical coiled rectangle with rectangular wire portions is shown, but this does not constitute any limitation to this disclosure, and those skilled in the art will understand that a connector pad wiring pattern in the form of a helical coiled square with square wire portions can be provided, wherein the length and width of the connector pad wiring pattern are equal.

[0070] refer to Figure 4 The wire pad design of the connection pad 40 in the pre-laminated insert (not shown) of the smart card (not shown) is schematically shown in the top view.

[0071] like Figure 4As shown, the connector pad 40 has a wire pad design including a connector pad wiring pattern 43 and bridging wiring portions 45. The connector pad wiring pattern 43 is given by a spiral-shaped ribbon cable pattern having multiple wire portions represented by triangular wire portions arranged in a concentric spiral from the inner to the outer triangular shape of the connector pad wiring pattern 43. The outer triangular shape is given by a side length, such as about 4 mm, in the range of about 1 mm to about 10 mm, preferably from about 2 mm to about 8 mm, more preferably from about 3 mm to about 5 mm. In a particularly illustrative and non-limiting embodiment, the triangles may be equilateral triangles with equal side lengths.

[0072] According to the illustrative embodiment, multiple wire portions of the connector pad wiring pattern 43 are wound in a planar arrangement, and the connector pad wiring pattern 43 defines a contact pad plane. Bridging wire portions 45 extend at least partially outside the contact pad plane, such that the bridging wire portions 45 extend above or below the connector pad wiring pattern 43 in the region of the wire portions of the connector pad wiring pattern 43. The wire ends 47a and 47b of the connector pad 40 may be arranged within the contact pad plane, or at least one of the wire ends 47a and 47b may be located outside the connector pad plane.

[0073] According to some illustrative embodiments, Figure 4 The wire pad design can be formed by arranging the wires starting from wire end 47a to achieve the corresponding... Figure 4 The connecting pad wiring pattern 43 shown has a spiral triangular shape, and the wires are further routed below or above the wire portion of the connecting pad wiring pattern 43 so that they cross the connecting pad wiring pattern 43 or travel below the connecting pad wiring pattern 43 at the wire portion.

[0074] According to some illustrative embodiments, the spacing of the wire portions of the connector pad wiring pattern 43 can be in the range of about 100 μm to about 300 μm, for example, from about 150 μm to about 200 μm, such as 160 μm.

[0075] Continue to refer to Figure 4 The wire portion of the connecting pad wiring pattern 43 is formed of wire having a spacing of at least 300 μm, preferably at least 200 μm, and more preferably at least 100 μm. Alternatively or additionally, the diameter of the wire portion may be in the range of about 50 μm to about 300 μm, preferably in the range of about 50 μm to about 200 μm, or in the range of about 80 μm to about 300 μm, more preferably in the range of about 80 μm to 200 μm.

[0076] According to some illustrative embodiments, the wire portions and / or bridging wire portions 45 of the connector pad wiring pattern 43 may be made of copper, copper alloy, copper-tin alloy, aluminum, or aluminum alloy. Preferably, at least some of the wire portions and / or bridging wire portions 45 of the plurality of wire portions of the connector pad wiring pattern 43 may be at least partially covered by an insulating coating, or may be without any covering, such as copper wire with silver or ordinary copper wire. Generally, any conductive and preferably metallic material that can be configured as metal wire, conductor track, or strip may be used for at least one of the wire portions and / or bridging wire portions 45.

[0077] Based on some illustrative embodiments of this disclosure and continuing to refer to... Figure 4 The wiring density of the connector pad 40, given by the ratio of wire diameter to wire spacing in the connector pad wiring pattern 43, can be in the range of about 0.3 to 0.95.

[0078] refer to Figure 5 The wire pad design of the connection pad 50 in the pre-laminated insert (not shown) of the smart card (not shown) is schematically shown in the top view.

[0079] like Figure 5 As shown, the connector pad 50 has a wire pad design including a connector pad wiring pattern 53 and bridging wiring portions 55. The connector pad wiring pattern 53 is given by circularly shaped wire portions, wherein the center of each circular wire portion is displaced relative to the other wire portions such that the connector pad wiring pattern 53 is given by a series of partially overlapping wire portions. The length of the connector pad wiring pattern 53 can be in the range of about 1 mm to about 10 mm, preferably from about 3 mm to about 8 mm, such as about 4 mm, and the width (less than the length) is in the range of about 0.5 mm to about 5 mm, preferably from about 1 mm to about 3 mm, such as about 2 mm. For example, when a series of wire portions are displaced such that the centers of the wire portions are in a straight line, the width can correspond to the diameter of the circular wire portions.

[0080] According to the illustrative embodiment, a plurality of wire portions of a connector pad wiring pattern 53 are wound in a planar arrangement, and the connector pad wiring pattern 53 defines a contact pad plane. A bridging wire portion 55 extends at least partially outside the contact pad plane, such that the bridging wire portion 55 extends above or below the connector pad wiring pattern 53 in the region of the wire portions of the connector pad wiring pattern 53. The wire ends 57a and 57b of the connector pad 50 may be arranged within the contact pad plane, or at least one of the wire ends 57a and 57b may be located outside the connector pad plane.

[0081] According to some illustrative embodiments, Figure 5The wire pad design can be formed by arranging the wires starting from wire end 57a to achieve the corresponding... Figure 5 The shape of the partially overlapping circular portion of the connector pad wiring pattern 53 is shown, and the wires are further routed below or above the wire portion of the connector pad wiring pattern 53 so as to cross the connector pad wiring pattern 53 or travel below the connector pad wiring pattern 53 at the wire portion.

[0082] According to some illustrative embodiments, the spacing of the wire portions of the connector pad wiring pattern 53 can be in the range of about 100 μm to about 300 μm, for example, from about 150 μm to about 200 μm, such as 160 μm.

[0083] Continue to refer to Figure 5 The wire portion of the connecting pad wiring pattern 53 is formed of wire having a spacing of at least 300 μm, preferably at least 200 μm, and more preferably at least 100 μm. Alternatively or additionally, the diameter of the wire portion may be in the range of about 50 μm to about 300 μm, preferably in the range of about 50 μm to about 200 μm, or in the range of about 80 μm to about 300 μm, more preferably in the range of about 80 μm to 200 μm.

[0084] According to some illustrative embodiments, the wire portions and / or bridging wire portions 55 of the connector pad wiring pattern 53 may be made of copper, copper alloy or copper-tin alloy or aluminum or aluminum alloy. Preferably, at least some of the wire portions and / or bridging wire portions 55 of the plurality of wire portions of the connector pad wiring pattern 53 may be at least partially covered by an insulating coating, or may be without any covering.

[0085] Based on some illustrative embodiments of this disclosure and continuing to refer to... Figure 5 The wiring density of the connector pad 50, given by the ratio of wire diameter to wire spacing in the connector pad wiring pattern 53, can be in the range of about 0.3 to 0.95.

[0086] Although the above reference Figure 2 and Figure 5 The wire portions of the described connector pad wiring patterns 20 and 50 are described as circular, but this does not necessarily mean that the shape of the wiring portion is similar to a circle, but can be elliptical or a shape that can be obtained by continuously deforming a circle.

[0087] refer to Figure 6 The diagram illustrates the wire pad design of the connector pad 60, which has a connector pad wiring pattern 63 and a bridging wire portion 65. (See diagram for reference.) Figure 6The connector pad wiring pattern shown is a zigzag ribbon pattern, but with an irregular shape. In other words, the wire portions of the connector pad wiring pattern are not parallel or concentric with each other, but at most partially parallel (i.e., parts of some wire portions may be parallel). Alternatively or additionally, the wire portions of the connector pad wiring pattern can have different length dimensions, thus providing an irregular shape, such as... Figure 6 The top view shows the trapezoidal shape of the connector pad wiring pattern 63. Since the wire portions of the connector pad wiring pattern 63 are not parallel to each other, the wiring density of the connector pad wiring pattern 63 may be locally different; that is, the density variation at different locations of the connector pad wiring pattern 63 may be different.

[0088] According to some illustrative embodiments, the wire portions of the connector pad wiring pattern 60 may be curved portions, and a connector pad wiring pattern 63 with varying wiring density can be achieved. Wiring density can be understood as representing the number of wire portions in a given area, or wire density can be characterized by the ratio of wire spacing to wire diameter or the ratio of wire diameter to wire spacing.

[0089] According to the illustrative embodiment, a plurality of wire portions of a connector pad wiring pattern 63 are wound in a planar arrangement, and the connector pad wiring pattern 63 defines a contact pad plane. A bridging wire portion 65 extends at least partially outside the contact pad plane, such that the bridging wire portion 65 extends above or below the connector pad wiring pattern 63 in the region of the wire portions of the connector pad wiring pattern 63. The wire ends 67a and 67b of the connector pad 60 may be arranged within the contact pad plane, or at least one of the wire ends 67a and 67b may be located outside the connector pad plane.

[0090] According to some illustrative embodiments, Figure 6 The wire pad design can be formed by arranging the wires starting from wire end 67a to achieve the corresponding... Figure 6 The irregular shape of the connector pad wiring pattern 63 is shown, and the wires are further routed below or above the wire portion of the connector pad wiring pattern 63 so that they cross the connector pad wiring pattern 63 or travel below the connector pad wiring pattern 63 at the wire portion.

[0091] According to some illustrative embodiments, the spacing of the wire portions of the connector pad wiring pattern 63 can be in the range of about 100 μm to about 300 μm, for example, from about 150 μm to about 200 μm, such as 160 μm.

[0092] Continue to refer to Figure 6The wire portion of the connecting pad wiring pattern 63 is formed of wire having a spacing of at least 300 μm, preferably at least 200 μm, and more preferably at least 100 μm. Alternatively or additionally, the diameter of the wire portion may be in the range of about 50 μm to about 300 μm, preferably in the range of about 50 μm to about 200 μm, or in the range of about 80 μm to about 300 μm, more preferably in the range of about 80 μm to 200 μm.

[0093] According to some illustrative embodiments, the wire portions and / or bridging wire portions 65 of the connector pad wiring pattern 63 may be made of copper, copper alloy, copper-tin alloy, aluminum, or aluminum alloy. Preferably, at least some of the wire portions and / or bridging wire portions 65 of the connector pad wiring pattern 63 may be at least partially covered by an insulating coating, or may be without any covering, such as copper wire with silver or ordinary copper wire. Generally, any conductive, preferably metallic, material that can be configured as metal wire, conductor track, or strip may be used for at least one of the wire portions and / or bridging wire portions 65.

[0094] Based on some illustrative embodiments of this disclosure and continuing to refer to... Figure 6 The wiring density of the connector pad 60, given by the ratio of wire diameter to wire spacing in the connector pad wiring pattern 63, can be in the range of about 0.3 to 0.95.

[0095] refer to Figure 7 A portion of the card body formed from a pre-laminated insert is schematically shown in the enlarged top view. The card body can be provided by subjecting the pre-laminated insert to further processing to form a card body that can be used for further manufacturing of a smart card. In the embodiments described below, the card body may include a substrate 100.

[0096] According to such Figure 7 In the illustrative embodiment shown, connection pads 70 and 80 are embedded in the substrate 100 to contact the terminals (not shown) of the module (not shown) to be integrated into the card body. Figure 7 As shown, both connecting pads 70 and 80 are implemented in a manner similar to Figure 1 The connecting pad 1 is shown. In the illustrated embodiment, Figure 7 Both connecting pads 70 and 80 are provided with a zigzag ribbon pattern. However, this does not constitute any limitation on this disclosure, and alternatively, at least one of connecting pads 70 and 80 may be provided with a ribbon pattern according to... Figures 2 to 6 Replace the connecting pad shown.

[0097] Continue to refer to Figure 7The diagram illustrates cavity 101 and an optional cavity 102. Cavity 101 is configured to accommodate a module (not shown) to be integrated into the card body. Those skilled in the art will understand that, depending on the module to be integrated into the substrate 100, a cavity 102 may be required in addition to cavity 101. Therefore, cavity 102 is optional.

[0098] like Figure 7 As shown, cavity 101 has dimensions in the X and Y directions indicated by double arrows X-P2 and Y-P1. Therefore, the dimension of cavity 101 along the X direction is given by dimension X-P1, while the dimension of cavity 101 along the Y direction is given by dimension Y-P1. Similarly, the dimensions of cavity 102 are given by dimension X-P2 indicating the dimension along the X direction and dimension Y-P2 indicating the dimension along the Y direction. It is noteworthy that the directions X and Y corresponding to the respective dimensions X-P1 / X-P2 and Y-P1 / Y-P2 correspond to the X and Y directions of the card body, which, considering the correct orientation of the smart card given by its length dimension (corresponding to the maximum length dimension) and width dimension (corresponding to the dimension smaller than the length dimension), are consistent with the corresponding orientation of the finished smart card.

[0099] According to the illustrative embodiments and as such Figure 7 As shown, the wire portions of the wiring patterns 73 and 83 of corresponding connector pads 70 and 80 are oriented substantially perpendicular to the Y direction, and the angle between the wire portions and the Y direction can range from approximately 45° to 90°. Because as... Figure 7 The orientation of the connecting pads 70 and 80 shown can increase the number of connecting pads without them interfering with each other due to the limited space of cavity 101.

[0100] Continue to refer to Figure 7 Both connecting pads 70 and 80 have corresponding bridging wire portions 75 and 85, which respectively connect multiple wire portions of the connecting pad wiring patterns 78 and 88.

[0101] refer to Figure 8 This schematically shows along Figure 7 The cross-sectional view along line aa indicates that the connecting pads 70 and 80 are embedded in the substrate 100 of the pre-laminated intercalation. Specifically, Figure 8 It shows Figure 7 The card body is in the stage where cavities 101 and 102 are formed in the substrate 100 during processing. Cavity 101 is formed in such a way that wire portions 78 and 88 within cavity 101 are exposed, such that these wire portions can contact corresponding terminals (not shown) of the module (not shown) to be accommodated in cavity 101. Figure 8 As shown, cavity 101 is through Figure 7The connecting pads 70 and 80 are formed by milling into the substrate 101 at their locations, thereby exposing the upper surface areas of the wire portions 78 and 88. For example, the wire portions 78 and 88 are partially removed during milling. The wire portions of the connecting pads 70 and 80 lie in a common plane, thereby defining, as... Figure 8 Reference numeral 89 in the accompanying drawings indicates the contact pad plane. Referring to the contact pad plane 89, the bridging wire portions 75 and 85 are located outside the contact pad plane, for example, on top of the wire portions, and make electrical and mechanical contact with the wire portions of the connecting pads 70 and 80. Alternatively, the bridging wire portions 75 and 85 may be located below the contact pad plane 89, although this is less likely to cause problems. Figure 8 It is not explicitly shown in the text.

[0102] Continue to refer to Figure 7 and Figure 8 Cavity 102 is milled into substrate 100, thereby potentially removing portions of the wiring patterns 73 and 83 of the connection pads, as shown by cut edges 76 and 86 aligned with the cavity edges 102a and 102b of cavity 102. Cut edges 76 and 86 can completely remove the corresponding... Figure 1 The turning portions 9a to 9e of the connecting pad 1 are shown. Regardless of the specific shape of the connecting pad wiring patterns 73 and 83, the formation of cavity 102 can remove a portion of the wire, potentially causing the wire to break at the cut edges 76 and 86. It is thus readily apparent that the presence of bridging wire portions 75 and 85 provides an electrical connection between the wire portions of connecting pad wiring patterns 73 and 83. Therefore, bridging wire portions 175 and 185 can prevent the wire portions of the connecting pad from breaking when the connecting pad is formed immediately adjacent to cavity 102.

[0103] refer to Figure 9 A schematic top view of the layout of smart card 200, obtained from X-ray imaging of smart card 200, is shown. Smart card 200 is shown in a stage during manufacturing before any modules have been implanted into smart card 200. According to... Figure 9 As shown in the layout, the smart card 200 has a card body 201, wherein connection pads 210 and 220 are formed at internal contact areas 251 and 252. For example, contact area 251 may have eight connection pads formed in the card body, while contact area 252 may have six connection pads formed at the card body 201. The connection pads can be used to interconnect modules to be arranged at connection areas 251 and 252 with each other, and to interconnect antenna module 299 with at least one of the modules (not shown). Between contact areas 251 and 252, an interconnection portion 270 may extend to interconnect the connection pads of different contact areas. The connection pads can be configured as follows: Figure 1The wire pad design shown is formed by a wire portion 211 and a turning portion 213. This does not constitute any limitation on this disclosure, and at least one connecting pad can be formed by, for example... Figures 2 to 6 One of the designs shown is a wire pad design.

[0104] refer to Figure 10 Furthermore, depending on the stage during the manufacturing process of the smart card, a portion of the pre-laminated insert of the smart card (in an early stage of manufacturing) or a portion of the card of the smart card (in a further stage of manufacturing) is schematically shown in the enlarged top view, the pre-laminated insert or card body having a substrate 300.

[0105] According to the illustrative embodiment, connector pads 370 and 380 are embedded in substrate 300 to contact terminals (not shown) of a module (not shown) to be integrated into substrate 300. Figure 10 As shown, both connecting pads 370 and 380 are implemented in a manner similar to Figure 1 The connecting pad 1 is shown. In the illustrated embodiment, Figure 10 Both connecting pads 370 and 380 are provided with a zigzag ribbon pattern. However, this does not constitute any limitation on this disclosure, and alternatively, at least one of connecting pads 370 and 380 may be provided with a ribbon pattern according to Figures 2 to 6 Replace the connecting pad shown.

[0106] Continue to refer to Figure 10 The diagram illustrates cavity 301 and an optional cavity 302. Cavity 301 is formed to accommodate a module (not shown) to be integrated into substrate 300. Those skilled in the art will understand that, depending on the module to be integrated into substrate 300, a cavity 302 may be required in addition to cavity 301. Therefore, cavity 302 is optional. The dimensions of cavity 301 (and optional cavity 302) may correspond to those shown above. Figure 7 The X and Y dimensions of cavity 101 (and optional cavity 102) are described, and their disclosure is incorporated herein by reference in its entirety. Specifically (although in...) Figure 10 (Not explicitly shown), cavity 301 has corresponding features in the X and Y directions. Figure 7 The dimensions of cavity 101 with double arrows X-P2 and Y-P1.

[0107] According to the illustrative embodiments and as such Figure 10 As shown, the wire portions of the wiring patterns 373 and 383 of corresponding connector pads 370 and 380 are oriented substantially perpendicular to the Y direction, and the angle between the wire portions and the Y direction can be in the range of approximately 45° to 90°. Because as... Figure 10 The orientation of the connecting pads 370 and 380 shown can increase the number of connecting pads without them interfering with each other due to the limited space of cavity 301.

[0108] Continue to refer to Figure 10 And similar to Figure 7 Both connecting pads 370 and 380 have corresponding bridging wire portions 375 and 385 (similar to...). Figure 7 The corresponding bridging wire portions 75 and 85 in the connection pads are connected to multiple wire portions of the wiring patterns 378 and 388, respectively.

[0109] Furthermore, the cavity 302 is milled into the substrate 300, thereby potentially removing portions of the wiring patterns 373 and 383 of the connection pads, as shown by the cut edges 376 and 386 aligned with the cavity edges 302a and 302b of the cavity 302. Cut edges 376 and 386 can completely remove the corresponding... Figure 1 The turning portions 9a to 9e of the connecting pad 1 are shown. Regardless of the specific shape of the connecting pad wiring patterns 373 and 383, the formation of cavity 302 can remove a portion of the wire, potentially causing the wire to break at the cut edges 376 and 386. It is thus readily apparent that the presence of bridging wire portions 375 and 385 provides an electrical connection between the wire portions of connecting pad wiring patterns 373 and 383. Therefore, bridging wire portions 375 and 385 can prevent the wire portions of the connecting pad from breaking when the connecting pad is formed immediately adjacent to cavity 102.

[0110] Unlike Figure 7 The pre-laminated insert shown, Figure 10 The substrate 300 has a recess 350 formed in the substrate 300. The recess 350 is formed in the substrate 300 below the connection pad wiring pattern 380. In some illustrative embodiments herein, the recess 350 extends at least partially into the substrate 300 along the thickness direction of the substrate. Figure 10 As shown, the bridging wiring portion 385 is received in the recess 350. For example, the recess 350 may extend through the substrate 300 to allow a tool to be inserted into the recess 350 from the back side of the substrate 300 (i.e., the side opposite to the side where the cavity 301 is formed). The tool can then make mechanical and electrical contact between the bridging wiring portion 385 and the connection pad wiring pattern 383 to secure the bridging wiring portion 385 to the connection pad wiring pattern 383. Therefore, tools that damage the substrate 300, such as tools with heated front ends or lasers, can be used to attach the bridging wiring portion 385 to the connection pad wiring pattern 383 via welding, micro-welding, etc.

[0111] According to some illustrative embodiments and such Figure 10As shown, a recess 355 may be additionally or alternatively formed in the substrate 300, and the recess 355 is at least partially located below the connection pad wiring pattern 383. That is, the wire portion of the connection pad wiring pattern 383 may extend across the recess 355. The recess 355 avoids localized accumulation of substrate material in the pad region, which occurs because the connection pad wiring pattern displaces the material of the substrate 300 when embedded in the substrate 300. This means that the displaced material of the substrate 300 accumulates at the connection pad wiring pattern 383 and locally causes variations in the substrate thickness. Due to the recess 355, this localized accumulation of material in the substrate 300 is avoided by compensating for the displaced material, thereby ensuring a uniform thickness at the connection pad wiring pattern 383 in the pre-laminated insert.

[0112] Although recesses 350 and 355 have been described above with reference to connector pad wiring pattern 383, this does not constitute any limitation on this disclosure, and those skilled in the art will understand that one or more corresponding recesses may also be formed at any other connector pad wiring pattern, such as connector pad wiring pattern 373.

[0113] Although only one recess 355 is described above, this does not constitute any limitation, and one or more additional recesses may be formed below the connector pad wiring pattern, such that the wiring portion of the connector pad wiring pattern extends across one or more additional recesses.

[0114] refer to Figure 11 The top view schematically illustrates the wire pad design of the connection pad 401 in the card body of a smart card according to some other illustrative embodiments, while Figure 12 Indicated along Figure 11 The sectional view of line bb in the middle.

[0115] Figure 11 A connecting pad 401 is shown with a connecting pad wiring pattern 403 and a bridging wire portion 405, wherein multiple wire portions 407a and 407b of the connecting pad wiring pattern 403 define a contact pad plane. The bridging wire portion 405 is located outside the contact pad plane.

[0116] refer to Figure 12 The bridging wire portion 405 is embedded in the substrate 402 of the pre-laminated insert. For example, the bridging wire portion 405 can be embedded before the connection pad wiring pattern 403 is formed. Figure 12 In the recess (not shown). Therefore, when forming the connecting pad 401, a recess (not shown) is formed in the substrate 402, and the bridging wire portion 405 is embedded in the recess, as... Figure 12 As shown. Subsequently, a connection pad wiring pattern 403 is formed on the upper surface of the substrate 402 in the connection pad plane, such that the bridging wire portion 405 is located outside the connection pad plane.

[0117] like Figure 11 The wiring pattern 403 shown is not limited to a specific shape, and those skilled in the art will understand that, without departing from this disclosure, the wiring pattern as described above can be used. Figures 1 to 6 Any of the described connector pad wiring patterns 1, 20, 30, 40, and 50 shall replace the explicitly shown connector pad wiring pattern 403. Specifically, refer to... Figures 1 to 6 The disclosure of each of the described connection pad wiring patterns 1, 20, 30, 40 and 50 also applies to the description herein and is incorporated herein by reference in its entirety.

[0118] References to terms modified by approximate language (such as “about,” “approximate,” and “substantially”) in this document are not limited to specified exact values. Approximate language may correspond to the precision of the instrument used to measure the value and, unless related to the precision of the instrument, may indicate + / - 10% of the stated value.

[0119] References to terms such as “vertical” and “horizontal” in this document are exemplary and not restrictive, used to establish a frame of reference. As used herein, the term “horizontal” is defined as a plane parallel to the conventional plane of the semiconductor substrate, regardless of its actual three-dimensional orientation. The terms “vertical” and “normal” refer to directions perpendicular to the horizontal, as just defined. The term “lateral” refers to a direction within the horizontal plane.

[0120] A feature that is “connected” or “linked” to or “attached” to another feature can be directly connected or linked to or connected to other features. Alternatively, one or more intervening features may exist. If no intervening features exist, the feature can be “directly connected” or “directly linked” to or “directly connected” to another feature. If at least one intervening feature exists, the feature can be “indirectly connected” or “indirectly linked” to or “indirectly connected” to another feature. A feature that is “on” or “in contact” with another feature can be directly on or in direct contact with the other feature. Alternatively, one or more intervening features may exist. If no intervening features exist, the feature can be “directly on” or “in direct contact” with the other feature. If at least one intervening feature exists, the feature can be “indirectly on” or “indirectly in contact” with the other feature.

[0121] Various embodiments of the invention have been described for illustrative purposes, but are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terminology used herein has been chosen to best explain the principles of the embodiments, their practical application, or technical improvements based on existing market technology, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A connection pad for a pre-laminated insert of a smart card and having a wire pad design, the wire pad design comprising: A connector pad wiring pattern formed by a plurality of wire portions extending in a contact pad plane, wherein the plurality of wire portions of the connector pad wiring pattern are wound in a planar arrangement, the connector pad wiring pattern defining the contact pad plane; and The bridging wire portion extending at least partially outside the plane of the contact pad, The bridging wire portion electrically and mechanically connects at least some of the plurality of wire portions to each other.

2. The connecting pad according to claim 1, wherein at least some of the wire portions extend partially in parallel.

3. The connecting pad of claim 2, wherein the turning portion is located between every two adjacent wire portions that extend parallel to each other, and the bridging wire portion extends substantially across the parallel wire portions.

4. The connector pad according to any one of claims 1 to 3, wherein the connector pad wiring pattern is a spiral-shaped ribbon cable pattern or a zigzag ribbon cable pattern or a pattern of multiple circular shapes that partially overlap each other.

5. The connector pad according to any one of claims 1 to 3, wherein the wiring density of the connector pad wiring pattern is locally varied.

6. The connector pad according to any one of claims 1 to 3, wherein the ratio of wire diameter to wire spacing in the wiring pattern of the connector pad is in the range of 0.3 to 0.

95.

7. The connector pad according to claim 6, wherein the connector pad wiring pattern has at least one first portion in the range of 0.3 to 0.8 and at least one second portion in the range of greater than 0.8 and less than or equal to 0.

95.

8. The connecting pad according to any one of claims 1 to 3, wherein the plurality of said wire portions have a wire pitch of at least 100 µm, and wherein the plurality of said wire portions have a diameter in the range of 50 µm to 300 µm.

9. The connector pad of claim 8, wherein the plurality of said wire portions have a wire spacing of at least 200µm.

10. The connector pad of claim 8, wherein the plurality of said wire portions have a wire spacing of at least 300µm.

11. The connecting pad of claim 8, wherein the plurality of said wire portions have a diameter in the range of 50µm to 200µm.

12. The connecting pad of claim 8, wherein the plurality of said wire portions have a diameter in the range of 80µm to 300µm.

13. The connecting pad of claim 8, wherein the plurality of said wire portions have a diameter in the range of 80µm to 200µm.

14. The connecting pad according to any one of claims 1 to 3, wherein the wire portion and / or the bridging wire portion is made of copper, a copper alloy or a copper-tin alloy or aluminum or an aluminum alloy.

15. The connector pad of claim 14, wherein at least some of the plurality of wire portions are at least partially covered by an insulating coating or have no covering at all.

16. A pre-laminated insert having a substrate having at least one connection pad embedded therein, wherein the at least one connection pad is a connection pad according to any one of claims 1 to 15.

17. The pre-laminated insert of claim 16, further comprising a first recess formed in the substrate below the wiring pattern of the connection pad, the first recess extending at least partially into the substrate along the thickness direction of the substrate.

18. The pre-laminated insert of claim 17, wherein the bridging wire portion is received in the first recess.

19. The pre-laminated insert of claim 18, further comprising a second recess formed in the substrate below the connector pad wiring pattern, the connector pad wiring pattern spanning at least a portion of the second recess.

20. The pre-laminated insert according to any one of claims 16 to 19, wherein at least some of the wire portions extend partially parallel, a turning portion is located between every two adjacent wire portions extending parallel to each other, and at least one turning portion is removed.

21. The pre-laminated insert according to any one of claims 16 to 19, wherein the pre-laminated insert is rectangular in shape in a top view, the rectangular shape having a length dimension along a length direction and a width dimension smaller than the length dimension along a width direction perpendicular to the length direction, wherein the wire portion is oriented at an angle ranging from 45º to 90º relative to the width direction.

22. A smart card comprising a pre-laminated insert according to any one of claims 16 to 21 and a module integrated into the pre-laminated insert, wherein the module has at least one I / O terminal for electrical connection to at least one of the connection pads, wherein the module is received in a cavity disposed in the pre-laminated insert adjacent to at least one of the connection pads, such that at least one of the I / O terminals is in electrical contact with at least one of the connection pads.

23. The smart card of claim 22, wherein the electrical contact between at least one of the I / O terminals and at least one of the connection pads is formed by at least one of solder interconnection, adhesive interconnection using anisotropic conductive film or anisotropic conductive paste, and adhesive interconnection using isotropic conductive film or isotropic conductive paste.

24. The smart card according to claim 22 or 23, wherein the cavity is formed on one side of at least one of the connecting pads, the side being opposite to the side of the connecting pad where the bridging wire portion is formed.

25. A method for designing a wire pad for forming a connection pad in a pre-laminated insert of a smart card, comprising: A substrate is provided for the pre-laminated insert; A connection pad wiring pattern is formed from a plurality of wire portions on the surface of the substrate, serving as a contact pad plane, wherein the plurality of wire portions of the connection pad wiring pattern are wound in a planar arrangement, and the connection pad wiring pattern defines the contact pad plane; and A bridging wire portion is formed that extends at least partially outside the plane of the contact pad. The bridging wire portion is electrically and mechanically connected to at least some of the plurality of wire portions.

26. The method of claim 25, wherein the bridging wire portion is formed such that it extends at least partially over the wiring pattern of the connecting pad.

27. The method of claim 25, further comprising: A first recess is formed in the substrate before either the connector pad wiring pattern or the bridging wire portion is formed, and the bridging wire portion is then formed by accommodating the wire portion in the first recess, followed by forming the connector pad wiring pattern on the surface outside the first recess of the substrate.

28. The method according to any one of claims 25 to 27, further comprising: A second recess is formed in the substrate, the second recess being at least partially located below the wiring pattern of the connector pad, and the wire portion extends across the second recess.

29. A method for forming a smart card, comprising: A card body is provided, formed of a pre-laminated insert, the card body having at least one connecting pad embedded therein, the at least one connecting pad being provided by a wire pad design formed by the method according to any one of claims 25 to 28; The cavity is formed in the card body by milling the cavity into the card body in a manner that exposes at least one of the connecting pads; as well as A module having at least one I / O terminal is accommodated in a cavity adjacent to at least one of the connection pads, such that at least one of the I / O terminals is in electrical contact with at least one of the connection pads.

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