A fixing mechanism, sample preparation device and method

Abstract

This disclosure provides a fixing mechanism, a sample preparation apparatus, and a method. The fixing mechanism includes a carrier and a connector. The top edge of the first end of the carrier forms a second reference edge, and a slot extends inward from a first inclined surface or a second inclined surface to form a slot. A sample is fixed to one side of the connector, and a first reference edge is formed on one edge of the sample. The connector is inserted into the slot, and the sample on the connector protrudes from the first inclined surface or the second inclined surface. The projections of the first reference edge and the second reference edge on the horizontal plane are collinear. In this way, the sample is first fixed to the connector with a larger volume, and then the connector is inserted into the slot, so that the sample protrudes from the first inclined surface or the second inclined surface, and the first reference edge on the sample that needs to be aligned with the first inclined surface or the second inclined surface is exposed. It also makes the first reference edge easier to approach the second reference edge, so that the operator can align the first reference edge with the second reference edge.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing technology, and in particular to a fixing mechanism, sample preparation apparatus and method. Background Technology

[0002] When analyzing the relationship between the resistivity and depth of a semiconductor, the test sample (typically 2-3 mm wide and 4-5 mm long) is first attached to an inclined surface with a certain angle in a carrier. Then, the carrier is installed on an adjustment bracket and placed on a horizontally set grinding disc. The height and level of the carrier with the sample are adjusted by the adjustment bracket. Next, one side of the sample is ground into an inclined surface with a certain angle using the grinding disc. Finally, the resistivity is measured and collected along the inclined surface by two probes of an extended resistance tester with uniform step lengths. The collected data are then plotted into a curve showing the relationship between depth and resistivity.

[0003] To meet the requirements for fabricating smaller volume samples (sample side length less than 1 mm), existing technologies first adhere the smaller volume sample to a carrier, and then attach the carrier carrying the sample to the inclined surface of the support. The larger volume carrier is more conducive to hand operation, making it easier to align the straight edge of the sample with the reference edge of the inclined surface of the support, thus making it easier to successfully bond the sample.

[0004] However, when it is necessary to produce a sample with a smaller tilt angle (close to 0°) on the surface to be tested, the tilt angle of the required carrier surface is also very small (close to 0°). At this time, the height of the reference edge on the inclined surface is also very low, which reduces the recognition of the reference edge. At the same time, the distance between the straight edge of the sample bonded to the carrier and the reference edge on the carrier is relatively large, making it difficult for the straight edge of the sample to be aligned with the reference edge on the inclined surface of the carrier, increasing the difficulty of sample bonding and thus reducing the yield of sample preparation. Summary of the Invention

[0005] This disclosure provides a fixing mechanism, a sample preparation apparatus and method to at least solve the problem of low yield rate of small-sized samples prepared on a test surface with a small tilt angle in the prior art.

[0006] To achieve the above objectives, this disclosure provides the following technical solution: a fixing mechanism for fixing a sample, wherein a first reference edge is formed on one edge of the sample, and the fixing mechanism includes:

[0007] The support member has a first inclined surface and a second inclined surface at its first end. The first inclined surface and the second inclined surface both form an angle with the horizontal plane. The first inclined surface and the second inclined surface intersect to form a protrusion. The top edge of the protrusion forms a second reference edge. A slot is formed by extending inward from the first inclined surface or the second inclined surface.

[0008] A connector, wherein the sample is fixed on one side of the connector, the connector is inserted into the slot, and the sample on the connector protrudes from the first inclined surface or the second inclined surface, and the projections of the first reference edge and the second reference edge on the horizontal plane are collinear.

[0009] In one embodiment, the connector is fixedly connected to the slot by an adhesive.

[0010] In one embodiment, the cross-section of the connector and the cross-section of the slot are both trapezoidal structures, and the connector and the slot are interference-fitted.

[0011] In one embodiment, the fixing mechanism further includes an adjustment component detachably connected to the carrier. The adjustment component is used to adjust the carrier to move in a direction perpendicular to the horizontal plane and drive the connector and the sample to move synchronously with the carrier so that the sample is always pressed against the external grinding element.

[0012] In one possible implementation, the adjustment component includes:

[0013] A movable component, detachably connected to the support component;

[0014] A guide member is slidably connected to the movable member in a direction perpendicular to the horizontal plane to guide the movable member to move in a direction perpendicular to the horizontal plane, and to cause the sample fixed by the carrier member to press against the external grinding member under the gravity of the movable member.

[0015] In one possible implementation, the movable element includes:

[0016] The movable body is slidably connected to the guide member in a direction perpendicular to the horizontal plane;

[0017] A connector, which passes through the movable body, and one end of the connector is threaded to the threaded section of the bearing member;

[0018] The handle is connected to the other end of the connector.

[0019] This disclosure also provides the following technical solution: a sample preparation apparatus, comprising:

[0020] The aforementioned fixed mechanism;

[0021] A grinding component, wherein the grinding component is provided with a horizontally arranged grinding surface, the grinding surface being used to support the fixing mechanism and to grind the sample fixed by the fixing mechanism;

[0022] This disclosure also provides the following technical solution: a sample preparation method, applied to the above-mentioned sample preparation apparatus, the sample preparation method comprising:

[0023] Prepare a silicon wafer as a sample;

[0024] Secure the sample to one side of the connector;

[0025] The connector with the sample fixed to it is inserted into the slot so that the sample fixed to the connector protrudes from the first inclined surface or the second inclined surface, and the projection of the first reference edge of the sample and the second reference edge on the first end of the carrier on the horizontal plane are collinear.

[0026] The carrier, the connector, and the sample are moved in a direction perpendicular to the horizontal plane so that the sample is pressed against the horizontally set grinding surface at a fixed angle.

[0027] The grinding element drives the grinding surface to rotate and grind the sample, so that the sample is ground to have a test surface with the same tilt angle as the first tilt surface or the second tilt surface.

[0028] In one embodiment, the silicon wafer is prepared by using a diamond pen to cleave the silicon wafer along the direction of the cleavage plane, forming a silicon wafer 2-3 mm wide and 4-5 mm long as a sample.

[0029] In one possible embodiment, the step of fixing the sample to the connector involves: first, coating one side of the sample with molten adhesive, then attaching the sample to the connector, and finally cooling the molten adhesive to bond the sample to the connector.

[0030] In one possible embodiment, the step of inserting the connector with the sample fixed to it into the carrier involves: firstly coating the side of the connector opposite to the side with the sample fixed to it with molten adhesive, then inserting the connector into the slot, and then cooling the molten adhesive to allow the connector to be inserted into the slot.

[0031] In one embodiment, during grinding, a grinding fluid is also placed on the grinding surface, and the grinding element grinds the sample with the grinding fluid.

[0032] In one embodiment, the grinding disc of the grinding element is made of horizontally arranged frosted glass, and the upper end surface of the grinding disc forms the grinding surface.

[0033] In the aforementioned fixing mechanism, the sample is first fixed to one side of the connector, and then the connector with the fixed sample is inserted into the slot on the carrier, so that the sample protrudes from the first or second inclined surface, and the projections of the first and second reference edges on the horizontal plane are collinear, thereby fixing the sample. In this way, the sample is first fixed to the connector with a larger volume to facilitate hand operation by the operator, and then the connector is inserted into the slot so that the sample protrudes from the first or second inclined surface, and the first reference edge on the sample that needs to be aligned with the first or second inclined surface is completely exposed. Moreover, it makes it easier for the first reference edge of the sample to approach the second reference edge, so that the operator can more easily observe and align the first and second reference edges, that is, the projections of the first and second reference edges on the horizontal plane are collinear. This improves the success rate of fixing small-sized samples (sample side length less than 1 mm) on the first or second inclined surface with a small inclination angle (close to 0°), and thus improves the yield of small-sized samples on the test surface with a small inclination angle.

[0034] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0035] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:

[0036] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0037] Figure 1 An exploded view of the carrier, connector, and sample according to an embodiment of this application is shown;

[0038] Figure 2 A top view schematic diagram of the carrier, connector, and sample according to an embodiment of this application is shown;

[0039] Figure 3 An exploded view of the fixing mechanism and sample according to an embodiment of this application is shown;

[0040] Figure 4 A cross-sectional schematic diagram of the fixing mechanism and sample according to an embodiment of this application is shown;

[0041] Figure 5 A schematic diagram of the sample preparation apparatus in an embodiment of this application is shown.

[0042] Explanation of the labels in the diagram:

[0043] In the figure: 10, sample preparation device; 11, fixing mechanism; 111, carrier; 1111, first inclined surface; 1112, second reference edge; 1113, slot; 1114, second inclined surface; 112, plug-in component; 113, adjustment component; 1131, movable component; 1131a, movable body; 1131b, connector; 1131c, handle; 1132, guide component; 1132a, guide hole; 1132b, groove; 12, grinding component; 121, grinding surface; 20, sample; 21, first reference edge. Detailed Implementation

[0044] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0045] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this disclosure can be achieved, and this is not limited herein.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0047] This embodiment provides a fixing mechanism 11.

[0048] Figure 1 This is an exploded view of the carrier, connector, and sample according to an embodiment of this application. Please refer to [the diagram]. Figure 1 As shown, the fixing mechanism 11 is used to fix the sample 20; for example, the sample 20 can be an extended resistance test sample 20.

[0049] The fixing mechanism 11 includes a support member 111, which is generally cylindrical in shape. The cross-section of the cylindrical structure can be circular or polygonal. The first end of the support member 111 is formed by a first inclined surface 1111 and a second inclined surface 1114. Both the first inclined surface 1111 and the second inclined surface 1114 form an angle with the horizontal plane. The angle between the first inclined surface 1111 and the horizontal plane and the angle between the second inclined surface 1114 and the horizontal plane are the same. The first inclined surface 1111 and the second inclined surface 1114 intersect to form a protrusion. The top edge of the protrusion forms a second reference edge 1112. A slot 1113 is formed by extending inward from the first inclined surface or the second inclined surface. When the first inclined surface 1111 extends inward to form the slot 1113, one end of the slot 1113 passes through the second inclined surface 1114. When the second inclined surface 1114 extends inward to form the slot 1113, one end of the slot 1113 passes through the first inclined surface 1111.

[0050] Furthermore, the carrier 111 is set into multiple groups, and each group of carriers 111 has a first inclined surface 1111 or a second inclined surface 1114 with different tilt angles. The tilt angles are continuously set between 0° and 90°, so that carriers 111 with different tilt angles of the first inclined surface 1111 and the second inclined surface 1114 can be selected according to the processing requirements, thereby processing samples 20 with different tilt angles to be tested to meet the production requirements.

[0051] Furthermore, the angle between the first inclined surface 1111 and the horizontal plane and the angle between the second inclined surface 1114 and the horizontal plane can also be set differently.

[0052] The fixing mechanism 11 also includes a connector 112, on one side of which a sample 20 is bonded by an adhesive. The connector 112 is inserted into a slot 1113, and the sample 20 on the connector 112 protrudes from the first inclined surface 1111 or the second inclined surface 1114.

[0053] Furthermore, the cross-section of the connector 112 and the cross-section of the slot 1113 are both trapezoidal structures. The connector 112 is fixedly connected to the slot 1113 by an adhesive. There is a clearance fit between the connector 112 and the slot 1113 to allow space for the adhesive to bond. For example, the adhesive can be paraffin wax. In addition, the connector 112 and the slot 1113 can also be interference-fitted so that the connector 112 can be inserted into and fixed in the slot 1113.

[0054] It should be noted that the cross-section of the connector 112 can also be a polygonal structure other than the trapezoidal structure, such as a rectangular structure, a pentagonal structure or a hexagonal structure. The connector 112 can also be fixed in the slot 1113 in other ways, such as by magnetic attraction.

[0055] Thus, the sample 20 is first fixed to the connector 112 with a larger volume to facilitate hand operation by the operator. Then, the connector 112 is inserted into the slot 1113 so that the sample 20 protrudes from the first inclined surface 1111 or the second inclined surface 1114, and the first reference edge 21 on the sample 20 that needs to be aligned with the first inclined surface 1111 or the second inclined surface 1114 is fully exposed. Moreover, it makes the first reference edge 21 of the sample 20 easier to approach the second reference edge 1112, so that the operator can more easily observe and align the first reference edge 21 and the second reference edge 1112, that is, the projections of the first reference edge 21 and the second reference edge 1112 on the horizontal plane are collinear. This improves the success rate of fixing small-sized (sample 20 side length less than 1 mm) samples 20 on the first inclined surface 1111 or the second inclined surface 1114 with a small tilt angle (close to 0°), thereby improving the yield of small-sized samples 20 on the test surface with a small tilt angle.

[0056] Figure 2 This is a top view of the carrier 111, connector 112, and sample 20 according to an embodiment of this application. Please refer to... Figure 2 As shown, a first reference edge 21 is formed on one edge of the sample 20. After the connector 112, on which the sample 20 is fixed, is inserted into the slot 1113, the projections of the first reference edge 21 and the second reference edge 1112 on the horizontal plane are collinear.

[0057] Figure 3 This is an exploded view of the fixing mechanism 11 and sample 20 according to an embodiment of this application. Figure 4 This is a cross-sectional schematic diagram of the fixing mechanism 11 and sample 20 according to an embodiment of this application. Please refer to... Figure 3 and Figure 4 As shown, the fixing mechanism 11 also includes an adjustment component 113, which is detachably connected to the carrier 111 to facilitate the replacement of carriers 111 of different specifications, thereby processing samples 20 with different tilt angles to be tested. The adjustment component 113 is used to adjust the carrier 111 to move in a direction perpendicular to the horizontal plane, and to drive the connector 112 and the sample 20 to move synchronously with the carrier 111, so that the sample 20 is always pressed against the external grinding part 12. A guide hole 1132a is opened in the middle of the adjustment component 113, and the guide hole 1132a passes through the guide hole 1132a in a direction perpendicular to the horizontal plane. In addition, the adjustment component 113 can also be guided by a slide rail.

[0058] The adjustment assembly 113 includes a movable component 1131, which includes a movable body 1131a, a connecting body 1131b, and a handle 1131c. It is slidably connected to the guide component 1132 in a direction perpendicular to the horizontal plane. The connecting body 1131b passes through the movable body 1131a, and one end of the connecting body 1131b is provided with a threaded section that is threaded to the carrier component 111 to facilitate quick assembly and disassembly of the carrier component 111. The handle 1131c is connected to the other end of the connecting body 1131b.

[0059] The adjustment assembly 113 also includes a guide member 1132, which is slidably connected to the movable member 1131 in a direction perpendicular to the horizontal plane to guide the movable member 1131 to move in a direction perpendicular to the horizontal plane, and to make the sample 20 fixed by the support member 111 press against the external grinding member 12 under the gravity of the movable member 1131; the lower end face of the guide member 1132 has a groove 1132b, which passes through the guide member 1132 in a direction parallel to the horizontal plane and communicates with the guide member 1132. The inside and outside of the hole 1132a allow air in the guide hole 1132a to be discharged along the groove 1132b during the downward movement of the movable body 1131a, and keep the air pressure inside and outside the guide hole 1132a consistent, so that the movable body 1131a, the carrier 111, the plug 112 and the sample 20 can move more smoothly when they move downward under their own gravity. Specifically, there are multiple grooves 1132b, which are circumferentially spaced around the center line of the guide 1132.

[0060] Furthermore, a guide hole 1132a is provided in the middle of the guide member 1132. The guide hole 1132a extends through the guide member in a direction perpendicular to the horizontal plane. The cross-sectional area and shape of the movable body 1131a are the same as the shape and area of ​​the projection of the guide hole 1132a onto the horizontal plane. Specifically, the cross-sectional shape of the movable body 1131a can be circular, and correspondingly, the shape of the projection of the guide hole 1132a onto the horizontal plane is also circular.

[0061] Furthermore, the outer periphery of the moving part is coated with lubricating oil to make the rotation and sliding of the moving part 1131a smoother, thereby reducing the wear between the moving part 1131 and the hole wall of the guide hole 1132a.

[0062] This embodiment also provides a sample 20 preparation apparatus 10.

[0063] Figure 5 This is a schematic diagram of the sample 20 preparation apparatus 10 in an embodiment of this application. Please refer to it. Figure 5 As shown, the sample 20 preparation apparatus 10 includes the above-mentioned fixing mechanism 11 for fixing the sample 20.

[0064] The sample preparation apparatus 10 also includes a grinding element 12, which has a horizontally arranged grinding surface 121. The grinding surface 121 is used to support the fixing mechanism 11 and to grind the sample 20 fixed by the fixing mechanism 11. For example, the grinding element 12 is a grinder.

[0065] This embodiment also provides a method for preparing sample 20.

[0066] S1. Prepare a silicon wafer as sample 20.

[0067] In this step, the silicon wafer is prepared by using a diamond pen to cleave the silicon wafer along the direction of the cleavage plane, forming a silicon wafer 2-3 mm wide and 4-5 mm long as sample 20, or forming a small silicon wafer with a side length of less than 1 mm.

[0068] S2. Fix the sample 20 to one side of the connector 112.

[0069] In this step, molten adhesive is first applied to one side of the sample 20, and the sample 20 is then attached to the connector 112. The molten adhesive is then cooled so that the sample 20 is bonded to the connector 112. An exemplary adhesive may be paraffin wax.

[0070] S3. Insert the connector 112 with the sample 20 fixed on it into the slot 1113 so that the sample 20 fixed on the connector 112 protrudes from the first inclined surface 1111 or the second inclined surface 1114, and make the projection of the first reference edge 21 of the sample 20 and the second reference edge 1112 on the first end of the carrier 111 collinear on the horizontal plane.

[0071] In this step, molten adhesive is first applied to the side of the connector 112 opposite to the side where the sample 20 is fixed, and the connector 112 is inserted into the slot 1113. Then the molten adhesive is cooled so that the connector 112 is inserted into the slot 1113. For example, the adhesive can be paraffin wax.

[0072] S4. Move the carrier 111, the connector 112 and the sample 20 in a direction perpendicular to the horizontal plane so that the sample 20 is pressed against the horizontally set grinding surface 121 at a fixed angle.

[0073] The grinding disc of the grinding component 12 is made of horizontally set frosted glass, and the upper end surface of the grinding disc forms the grinding surface 121.

[0074] S5. The grinding surface 121 is driven to rotate by the grinding component 12 and the sample 20 is ground so that the sample 20 is ground to have a test surface with the same tilt angle as the first tilt surface 1111 or the second tilt surface 1114.

[0075] During grinding, grinding fluid is also placed on the grinding surface 121, and the grinding workpiece 12 grinds the sample 20 through the grinding fluid.

[0076] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A fixing mechanism for fixing a sample, wherein a first reference edge is formed along one edge of the sample, characterized in that, The fixing mechanism includes: The support member has a first inclined surface and a second inclined surface at its first end. The first inclined surface and the second inclined surface both form an angle with the horizontal plane. The first inclined surface and the second inclined surface intersect to form a protrusion. The top edge of the protrusion forms a second reference edge. A slot is formed by extending inward from the first inclined surface or the second inclined surface. A connector, wherein the sample is fixed on one side of the connector, the connector is inserted into the slot, and the sample on the connector protrudes from the first inclined surface or the second inclined surface, the projections of the first reference edge and the second reference edge on the horizontal plane are collinear; the cross-section of the connector and the cross-section of the slot are both trapezoidal structures.

2. The fixing mechanism according to claim 1, characterized in that, The connector is fixedly connected to the slot by an adhesive.

3. The fixing mechanism according to claim 1, characterized in that, The connector and the slot are interference-fitted.

4. The fixing mechanism according to claim 1, characterized in that, The fixing mechanism further includes an adjustment component, which is detachably connected to the carrier. The adjustment component is used to adjust the carrier to move in a direction perpendicular to the horizontal plane, and to drive the connector and the sample to move synchronously with the carrier, so that the sample is always pressed against the external grinding piece.

5. The fixing mechanism according to claim 4, characterized in that, The adjustment component includes: A movable component, detachably connected to the support component; A guide member is slidably connected to the movable member in a direction perpendicular to the horizontal plane to guide the movable member to move in a direction perpendicular to the horizontal plane, and to cause the sample fixed by the carrier member to press against the external grinding member under the gravity of the movable member.

6. The fixing mechanism according to claim 5, characterized in that, The movable component includes: The movable body is slidably connected to the guide member in a direction perpendicular to the horizontal plane; A connector, which passes through the movable body, and one end of the connector is threaded to the threaded section of the bearing member; The handle is connected to the other end of the connector.

7. A sample preparation apparatus, characterized in that, include: The fixing mechanism as described in any one of claims 1 to 6; The grinding component has a horizontally arranged grinding surface, which is used to support the fixing mechanism and to grind the sample fixed by the fixing mechanism.

8. A sample preparation method, characterized in that, The sample preparation method, applied to the sample preparation apparatus as described in claim 7, comprises: Prepare a silicon wafer as a sample; Secure the sample to one side of the connector; The connector with the sample fixed to it is inserted into the slot so that the sample fixed to the connector protrudes from the first inclined surface or the second inclined surface, and the projection of the first reference edge of the sample and the second reference edge on the first end of the carrier on the horizontal plane are collinear. The carrier, the connector, and the sample are moved in a direction perpendicular to the horizontal plane so that the sample is pressed against the horizontally set grinding surface at a fixed angle. The grinding element drives the grinding surface to rotate and grind the sample, so that the sample is ground to have a test surface with the same tilt angle as the first tilt surface or the second tilt surface.

9. The sample preparation method according to claim 8, characterized in that, The silicon wafer is prepared by using a diamond pen to cleave the silicon wafer along the direction of the cleavage plane, forming a silicon wafer 2-3 mm wide and 4-5 mm long as a sample.

10. The sample preparation method according to claim 8, characterized in that, The steps for fixing the sample to the connector are as follows: first, apply molten adhesive to one side of the sample and attach the sample to the connector; then, cool the molten adhesive to bond the sample to the connector.

11. The sample preparation method according to claim 8, characterized in that, The step of inserting the connector with the sample fixed on it into the carrier is as follows: first, apply molten adhesive to the side of the connector opposite to the side with the sample fixed on it, insert the connector into the slot, and then cool the molten adhesive so that the connector is inserted into the slot.

12. The sample preparation method according to claim 8, characterized in that, During grinding, a grinding fluid is also placed on the grinding surface, and the grinding workpiece grinds the sample with the grinding fluid.

13. The sample preparation method according to claim 8, characterized in that, The grinding disc of the grinding component is made of horizontally arranged frosted glass, and the upper end surface of the grinding disc forms the grinding surface.

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