A method, device and storage medium for measuring height by a scribe machine

Abstract

The application provides a dicing machine height measuring method, device and storage medium, comprising: obtaining a new blade height value by implementing new blade height measurement; setting a low-speed point height of first height measurement; implementing first height measurement based on the low-speed point height of first height measurement; calculating a first stage cutter wear amount according to the first height value and the new blade height value; calculating a low-speed point height of second height measurement according to the low-speed point height of first height measurement and the first stage cutter wear amount; setting i as 2; executing i-th height measurement, comprising: implementing height measurement based on the low-speed point height of i-th height measurement; calculating an i-stage cutter wear amount according to the i-th height value and the i-1-th height value; calculating a low-speed point height of i+1-th height measurement according to the low-speed point height of i-th height measurement and the i-stage cutter wear amount; setting i+1, and continuing to execute the steps of i-th height measurement. The low-speed moving distance of the cutter in each height measurement is corrected according to the cutter wear amount, and the height measurement efficiency will not be significantly reduced with the cutter wear.

Description

Technical Field

[0001] This application relates to the field of semiconductor device manufacturing, specifically a method, equipment, and storage medium for measuring the height of a dicing machine. Background Technology

[0002] The dicing process is a crucial step in the actual semiconductor device manufacturing process. It is performed using a dicing machine, which includes components such as a spindle, cutters, and a dicing table. Figure 1 As shown, the dicing process of the dicing machine is as follows: the spindle drives the high-speed rotating cutter 1 to descend and contact the wafer on the dicing stage 2. The spindle then drives the cutter 1 to move closely to the wafer along a predetermined dicing path, thereby dicing the wafer into several dies with predetermined sizes. Because the cutter 1 will continuously wear down during use, its radius will continuously decrease. Therefore, it is necessary to perform height measurement operations in a timely manner to correct the height of the cutter, thereby ensuring that the cutter 1 can cut through the wafer.

[0003] To ensure that the cutter 1 can contact the surface of the dicing stage 2 during height measurement, and to prevent high-intensity collisions between the cutter 1 and the dicing stage 2, which could damage the cutter or the surface of the dicing stage 2, the following measures are taken: Figure 1 As shown, a feasible solution is to pre-determine a low-speed moving distance h (e.g., 2-5 mm). Before each height measurement, the spindle controls the center point D of the cutter 1 to move at high speed to the low-speed point height, making the distance between the cutter 1 and the dicing table 2 equal to the moving distance h. Then, the spindle controls the cutter 1 to slowly descend until the cutter 1 contacts the dicing table 2, completing the height measurement operation. Figure 1 As shown, the low-speed point height LOW_D = absolute height of the dicing stage + low-speed travel distance h + cutter radius.

[0004] In the existing height measurement operation, for ease of operation, the low-speed point height LOW_D remains constant after it is determined. Before each height measurement, the center point D of the cutter 1 is first moved at high speed to the low-speed point height LOW_D by controlling the spindle. Then, the cutter 1 is slowly lowered until it contacts the surface of the dicing stage 2, completing the height measurement operation. In other words, the low-speed point height used for each height measurement is the same.

[0005] However, as those skilled in the art know, the cutter 1 will wear down during use, causing the cutter radius to continuously decrease, and correspondingly, the low-speed travel distance h to continuously increase. The resulting problem is that the time required for height measurement becomes longer and the efficiency of height measurement becomes lower. Summary of the Invention

[0006] To solve the above-mentioned technical problems, this application provides a method for measuring the height of a cutting tool, which adopts the following technical solution:

[0007] A method for measuring the height of a dicing machine, comprising:

[0008] After the tool change, the height of the new tool is measured to obtain the height value of the new tool;

[0009] Set the height of the low-speed point for the first height measurement so that the low-speed movement distance is a predetermined value;

[0010] The first height measurement is performed based on the height of the low-speed point in the first height measurement, and the first height measurement value is obtained.

[0011] Based on the first height measurement and the new blade height measurement, calculate the blade wear amount for the first stage: Blade wear amount for the first stage = new blade height measurement - first height measurement;

[0012] Based on the low-speed point height of the first height measurement and the cutter wear in the first stage, the low-speed point height of the second height measurement is calculated. The low-speed point height of the second height measurement = the low-speed point height of the first height measurement - the cutter wear in the first stage.

[0013] Set the initial value of i to 2;

[0014] Performing the i-th altimeter includes:

[0015] Based on the height of the low-speed point in the i-th height measurement, the height measurement value of the i-th height measurement is obtained.

[0016] Based on the height measurement value of the i-th time and the height measurement value of the (i-1)-th time, calculate the cutter wear amount in the i-th stage. Cutter wear amount in the i-th stage = height measurement value of the (i-1)-th time - height measurement value of the i-th time.

[0017] Based on the low-speed point height of the i-th height measurement and the cutter wear amount in the i-th stage, the low-speed point height of the (i+1)-th height measurement is calculated. The low-speed point height of the (i+1)-th height measurement = the low-speed point height of the i-th height measurement - the cutter wear amount.

[0018] Increment i by 1 and continue with the steps for the i-th height measurement.

[0019] The height measurement method for a dicing machine provided in this application calculates the wear value of the cutter after each height measurement and modifies the low-speed point height based on the cutter wear value to obtain the low-speed point height for the next measurement. This ensures that the low-speed movement distance of the cutter remains constant during each height measurement, resulting in the following technical effects: the measurement time remains constant, and the measurement efficiency does not gradually decrease with cutter wear.

[0020] In some embodiments, the predetermined value is 2-5 mm.

[0021] In some embodiments, height measurement is performed based on the low-speed point height of the i-th height measurement, including: pre-determining a height measurement area on a scribe line; performing anomaly detection on the height measurement area to identify and locate abnormal areas within the height measurement area, wherein the abnormal areas protrude upwards from or are recessed downwards from the scribe line; the cutter, controlled by the spindle to rotate, contacts several height measurement points within the height measurement area to obtain several height measurement values, wherein the contacted height measurement points avoid abnormal areas; calculating the difference between the maximum and minimum values ​​among the several height measurement values; if the difference is less than a preset threshold, calculating the average of the several height measurement values ​​as the i-th height measurement value; if the difference is greater than or equal to the preset threshold, performing a damage detection on the cutter; if the cutter is damaged, replacing the cutter; otherwise, re-performing the height measurement on the cutter.

[0022] To ensure accurate height measurement, the cutter is typically driven to contact multiple measuring points on the dicing table to obtain multiple height values. The average of these values ​​is then used as the final height measurement. However, if abnormal areas (such as recessed or raised areas) exist on the dicing table, and one or more measurements fall within these areas, the final height measurement will have a significant error. Therefore, avoiding abnormal areas on the dicing table during the measurement process ensures accuracy. Furthermore, by calculating the difference between the maximum and minimum values ​​among the measured heights, cutter damage detection can be implemented to prevent the use of a damaged cutter value as the final height measurement.

[0023] In some embodiments, before the cutter controlled by the spindle to rotate comes into contact with several height measuring points in the height measuring area, the method further includes: pre-determining N height measuring points in the height measuring area, with the N height measuring points evenly distributed in the height measuring area; and removing the height measuring points located in abnormal areas from the N height measuring points to obtain several height measuring points.

[0024] With N height measurement points evenly distributed within the measurement area, the accuracy of height measurement can be further improved. Anomaly detection is performed only once before measurement, removing all height measurement points located in abnormal areas. During subsequent height measurement, no further anomaly detection is required; the cutter directly bypasses all height measurement points located in abnormal areas, thereby improving measurement efficiency.

[0025] In some embodiments, a cutter controlled by a spindle rotates and contacts several height measurement points within a height measurement area to obtain several height measurement values. This includes: determining a height measurement stepping path within the height measurement area; controlling the cutter to step along the height measurement stepping path via the spindle; and after each step: determining whether the current height measurement point directly below the cutter is located in an abnormal area; if so, controlling the cutter to step above the next height measurement point via the spindle; otherwise, controlling the cutter to descend and contact the current height measurement point via the spindle to obtain a height measurement value.

[0026] Each time the cutter reaches above a height measurement point, an anomaly detection is applied to that point to determine if it falls within an abnormal area. Targeted anomaly detection improves the accuracy of anomaly detection.

[0027] In some embodiments, anomaly detection in the height measurement area includes: acquiring an image of the height measurement area; performing image analysis on the image of the height measurement area to determine and locate abnormal areas within the height measurement area.

[0028] Because the reflective properties of protruding or recessed abnormal areas are significantly different from those of normal smooth horizontal areas, abnormal areas can be accurately identified and located by acquiring images of the dicing table surface and analyzing the images of the height measurement area using image analysis technology.

[0029] This application also provides a height measuring device for a dicing machine, which includes a memory and a processor. The memory stores at least one program instruction, and the processor loads and executes at least one program instruction to implement the height measuring method for the dicing machine as described in any of the above claims.

[0030] This application also provides a computer storage medium storing at least one program instruction, which is loaded and executed by a processor to implement the height measurement method of the dicing machine described in any of the above claims. Attached Figure Description

[0031] Figure 1 A schematic diagram of the dicing machine before height measurement;

[0032] Figure 2 This is a flowchart illustrating the execution of the height measurement method for the dicing machine in the embodiments of this application;

[0033] Figure 3 This is a diagram showing the distribution of the height measurement area and height measurement points in the first embodiment of this application;

[0034] Figure 4 This is a diagram showing the distribution of the height measurement area and height measurement points in the second embodiment of this application;

[0035] Figure 5 This is a diagram showing the distribution of the height measurement area and height measurement points in the third embodiment of this application. Detailed Implementation

[0036] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0039] like Figure 1 As shown, the cutter 1 is generally circular, with its center point D mounted on the drive end of the spindle (or spindle drive center) and located above the dicing stage 2. The spindle can drive the cutter to rise and fall to adjust its height, and it can also drive the cutter 1 to rotate and translate at high speed to dic the wafer.

[0040] like Figure 1 As shown, the dicing machine control system generally uses a predetermined horizontal plane as a reference plane L with zero height. The low-speed point height, the absolute height value of the dicing table, the measured height value, etc. in this application are all height values ​​relative to this reference plane L.

[0041] As described in the background section above, in order to facilitate operation, after the low-speed point height LOW_D is determined, the center point D of the cutter 1 is first moved at high speed to the low-speed point height LOW_D by the spindle control before each height measurement. Then, the cutter 1 is driven to change the blade and descend from the low-speed point height LOW_D to contact the table surface of the dicing stage 2 and perform the height measurement.

[0042] However, as those skilled in the art know, the cutter 1 will wear down during use, causing its radius to decrease and the corresponding low-speed travel distance h to increase. This results in longer and less efficient height measurement.

[0043] To address this issue, this application provides a height measurement method for a dicing machine, which ensures that the height measurement efficiency does not gradually decrease with the wear of the cutting blade.

[0044] Such as 1 and Figure 2 As shown, the height measurement method for a dicing machine provided in this application includes the following steps:

[0045] S1. Perform a height measurement of the new tool after tool replacement to obtain the height measurement value of the new tool.

[0046] The low-speed point height used for measuring the height of a new cutting tool can be selected based on experience. Theoretically, the height measurement value of a new cutting tool = the absolute height of the worktable + the radius of the new cutting tool.

[0047] S2. Set the height of the low-speed point for the first height measurement so that the low-speed movement distance is a predetermined value.

[0048] The low-speed travel distance can be selected based on factors such as the materials of the cutter and the dicing table, and the speed at which the spindle drives the cutter 1 to descend from the low-speed point height to contact the dicing table 2. For example, the low-speed travel distance is 2-5mm. The low-speed point height for the first measurement is set accordingly based on the low-speed travel distance.

[0049] S3. Based on the height of the low-speed point in the first height measurement, perform the first height measurement to obtain the first height measurement value.

[0050] S4. Calculate the cutter wear amount in the first stage based on the first height measurement value and the new cutter height measurement value. The cutter wear amount in the first stage = new cutter height measurement value - first height measurement value.

[0051] S5. Based on the low-speed point height of the first measurement and the cutter wear in the first stage, calculate the low-speed point height of the second measurement. The low-speed point height of the second measurement = the low-speed point height of the first measurement - the cutter wear in the first stage.

[0052] S6. Set the initial value of i to 2.

[0053] S7. Perform the i-th altitude measurement, including:

[0054] Based on the height of the low-speed point in the i-th height measurement, the height measurement value of the i-th height measurement is obtained.

[0055] Based on the height measurement value of the i-th time and the height measurement value of the (i-1)-th time, calculate the cutter wear amount in the i-th stage. Cutter wear amount in the i-th stage = height measurement value of the (i-1)-th time - height measurement value of the i-th time.

[0056] Based on the low-speed point height of the i-th height measurement and the cutter wear amount of the i-th stage, calculate the low-speed point height of the (i+1)-th height measurement. The low-speed point height of the (i+1)-th height measurement = the low-speed point height of the i-th height measurement - the cutter wear amount of the i-th stage.

[0057] S8. Increase i by 1 and execute the height measurement operation of S7 again.

[0058] To enable those skilled in the art to more clearly understand the technical solution of this application, the following will describe in more detail the specific implementation process of the dicing machine height measurement method of this application through a specific embodiment.

[0059] In this embodiment, as Figure 1 As shown, the absolute height G of the dicing stage 2 is 13mm, and the radius R of the newly replaced cutter 1 is 27mm. The specific implementation process of the dicing machine height measurement method in this embodiment is as follows:

[0060] After the blade replacement, the height of the new blade was measured, and the measured value H_0 was obtained, which is 40mm. It can be seen that this measured value H_0 is equal to the sum of the absolute height G of the dicing stage and the radius R of the newly replaced blade, indicating that the height measurement accuracy of the dicing machine's measurement program meets the requirements.

[0061] Set the height of the low-speed point LOW_D1 for the first height measurement to 42mm.

[0062] After the cutter has been in use for the predetermined time, the first height measurement will be performed, as follows:

[0063] The height measurement operation is performed based on the low-speed point height LOW_D1 of the first height measurement to obtain the first height measurement value H_1, which is 38mm. The height measurement operation process is as follows: the center point D of the cutter is moved to a height of 42mm by the spindle, and then the cutter 1 is controlled to slowly descend until the cutter 1 contacts the surface of the dicing stage 2 to obtain the height measurement point data.

[0064] Based on the first height measurement value H_1 and the new blade height measurement value H_0, calculate the blade wear amount in the first stage: Blade wear amount in the first stage = new blade height measurement value H_0 - first height measurement value H_1 = 40mm - 38mm = 2mm. The blade wear amount in the first stage is the blade wear amount from blade change to the first height measurement.

[0065] Based on the low-speed point height LOW_D1 of the first height measurement and the cutter wear in the first stage, the low-speed point height LOW_D2 of the second height measurement is calculated. The low-speed point height LOW_D2 of the second height measurement = the low-speed point height LOW_D1 of the first height measurement - the cutter wear in the first stage = 42mm - 2mm = 40mm.

[0066] In other words, the low-speed point height used in the subsequent second height measurement has been corrected based on the cutter wear in the first stage.

[0067] After the cutter has been used for the predetermined time, a second height measurement will be performed, as follows:

[0068] The height measurement operation is performed based on the low-speed point height LOW_D2 of the second height measurement to obtain the second height measurement value H_2, which is 36mm. Specifically, the center point D of the cutter is moved to a height of 40mm by the spindle, and then the cutter 1 is controlled to slowly descend until the cutter 1 contacts the surface of the dicing stage 2 to obtain the height measurement point data.

[0069] Based on the second height measurement value H_2 and the first height measurement value H_1, the cutter wear amount in the second stage is calculated as follows: cutter wear amount in the second stage = first height measurement value H_1 - second height measurement value H_2 = 38mm - 36mm = 2mm.

[0070] Based on the low-speed point height LOW_D2 of the second height measurement and the cutter wear in the second stage, the low-speed point height LOW_D3 of the third height measurement is calculated. LOW_D3 of the third height measurement = LOW_D2 of the second height measurement - cutter wear in the second stage = 40mm - 2mm = 38mm. The cutter wear in the second stage is the cutter wear during the period from the first height measurement to the second height measurement.

[0071] In other words, the low-speed point height used in the subsequent third height measurement has been corrected based on the cutter wear in the second stage.

[0072] After the cutter has been used for the predetermined time, the third height measurement will be performed:

[0073] The height measurement operation is performed based on the low-speed point height LOW_D3 of the third height measurement to obtain the third height measurement value H_3. The third height measurement value H_2 is 34mm. Specifically, the center point D of the cutter is moved to a height of 38mm by the spindle, and then the cutter 1 is controlled to slowly descend until the cutter 1 contacts the surface of the dicing stage 2 to obtain the height measurement point data.

[0074] Based on the third height measurement value H_3 and the second height measurement value H_2, the cutter wear in the third stage is calculated as follows: Cutter wear in the third stage = Second height measurement value H_2 - Third height measurement value H_3 = 36 - 34 mm = 2 mm. The cutter wear in the third stage is the cutter wear during the period from the second height measurement to the third height measurement.

[0075] Based on the low-speed point height LOW_D3 of the third height measurement and the cutter wear in the third stage, the low-speed point height LOW_D4 of the fourth height measurement is calculated. The low-speed point height LOW_D4 of the fourth height measurement = the low-speed point height LOW_D3 of the third height measurement - the cutter wear in the third stage = 38mm - 2mm = 36mm.

[0076] In other words, the low-speed point height used in the subsequent fourth height measurement has been corrected based on the cutter wear in the third stage.

[0077] Repeat the same steps for the 4th, 5th, ... nth height measurement until the tool is replaced.

[0078] As is known to those skilled in the art, in order to ensure the accuracy of height measurement, each height measurement operation generally requires the spindle to drive the cutter 1 to contact multiple height measurement points on the dicing stage 2 to obtain multiple height measurement values, and finally the average of the multiple height measurement values ​​is used as the final height measurement value.

[0079] However, when there are abnormal areas (such as recessed or raised areas) on the grading stage 2, if one or more height measurements fall within the abnormal area, it will lead to a large error in the final height measurement value.

[0080] Therefore, this application embodiment also provides an improved height measurement method. Specifically, the height measurement based on the low-speed point height of the i-th height measurement in this application embodiment includes the following steps:

[0081] S11. Pre-determine the height measurement area on the marking platform.

[0082] The height measurement area in this application is generally set as a rectangle.

[0083] The elevation measurement area can be flexibly selected based on the actual structure of the marking platform and specific elevation measurement requirements. For example, such as Figure 3 As shown, the entire surface of the grading platform 2 can be defined as the height measurement area.

[0084] For example Figure 4 As shown, one side of the marking platform 2 is defined as the height measurement area. Of course, a rectangular area of ​​a predetermined size at the center of the marking platform 2 can also be defined as the height measurement area.

[0085] S12. Perform anomaly detection on the height measurement area to identify and locate abnormal areas within the height measurement area. Abnormal areas may protrude upwards from the marking platform or be recessed downwards from the marking platform.

[0086] As those skilled in the art know, after prolonged use, the dicing stage 2 may wear down, resulting in recessed or raised areas, i.e., abnormal areas, appearing on its surface. If one or more measuring points fall within these abnormal areas, it will lead to a significant error in the final measured height.

[0087] Since the reflective properties of protruding or recessed abnormal areas are significantly different from those of normal smooth horizontal areas, abnormal areas can be accurately identified and located by acquiring images of the surface of the dicing stage 2 and analyzing the images of the height measurement area using image analysis technology.

[0088] Based on this consideration, the specific implementation process of anomaly detection in step S12 can be optionally as follows:

[0089] Images of the height measurement area are acquired using a high-resolution industrial camera.

[0090] Then, image analysis technology is used to analyze the images of the height measurement area to identify and locate abnormal areas within the height measurement area.

[0091] Of course, other anomaly detection methods, such as using a laser rangefinder to perform a full scan of the dicing stage 2, can also be used to detect and locate abnormal areas.

[0092] To improve the efficiency of height measurement, an anomaly detection can be performed only once before the initial height measurement. Subsequent height measurements at each point can then use the location information of the anomaly area obtained from this initial detection as a reference to avoid those areas. Alternatively, to improve the accuracy of anomaly detection, an anomaly detection can be performed before each contact height measurement at every point.

[0093] S13. The cutter, controlled by the spindle, contacts several height measurement points within the height measurement area to obtain several height measurement values. Among these, the contacted height measurement points avoid abnormal areas.

[0094] The following section will provide an exemplary description of how to avoid abnormal areas when measuring elevation points.

[0095] The first implementation method;

[0096] Step 1: Predetermine N height measurement points within the height measurement area, and arrange the N height measurement points evenly within the height measurement area.

[0097] For example Figure 3 As shown, 100 elevation measurement points are pre-determined within the elevation measurement area. These 100 points are distributed in 10 rows and 10 columns within the area, and the spacing between points in the same row and between points in the same column are set to the same predetermined value. For example... Figure 4 As shown, 10 height measurement points are pre-determined within the height measurement area. These 10 height measurement points are distributed in 1 row and 10 columns within the height measurement area, and the spacing between the 10 height measurement points is set to be equal.

[0098] Step 2: Remove the elevation measurement points located in abnormal areas from the N elevation measurement points to obtain a number of elevation measurement points.

[0099] Since step S12 above has already located the abnormal areas within the altimeter area, it is possible to determine whether each of the N altimeter points is located within an abnormal area. This allows for the elimination of altimeter points located in abnormal areas, thus obtaining the required number of altimeter points for contact altimeter measurement.

[0100] For example Figure 3 As shown, four of the pre-determined 100 altimeter points (the black dots in the figure) were removed because they were located in an abnormal area, resulting in 96 usable altimeter points. For example... Figure 4 As shown, two of the 10 pre-determined height measurement points were removed because they were located in an abnormal area (as shown by the black dots in the figure), resulting in 8 usable height measurement points.

[0101] After determining several height measurement points that avoid abnormal areas, step S13 can be formally implemented, in which the spindle controls the cutter to contact several height measurement points within the height measurement area, thereby obtaining several height measurement values.

[0102] The second implementation method;

[0103] Step 1: Determine the height measurement stepping path within the height measurement area.

[0104] Optional, such as Figure 5 As shown, the height measurement path includes four straight paths: the first straight path L1, the second straight path L2, the third straight path L3, and the fourth straight path L4. These four straight paths connect to the height measurement area ( Figure 5 The length or width direction of the area containing the dashed box in the text is parallel.

[0105] Step 2: Control the cutter to move along the height measurement stepping path via the spindle. Each stepping operation completes:

[0106] Determine whether the current height measurement point directly below the cutter is in an abnormal area. If so, control the cutter to step above the next height measurement point via the spindle. Otherwise, control the cutter to descend via the spindle and contact the current height measurement point to obtain a height measurement value.

[0107] In other words, in this embodiment, it is not necessary to predetermine the height measurement point. Instead, the cutter is controlled to move within the height measurement area (or traverse the height measurement area) through a preset height measurement stepping path. After each step, the point directly below the cutter is identified as a potential height measurement point. If the point is not in an abnormal area, it is determined as a usable height measurement point, and contact height measurement is performed to obtain a height value. If the point is in an abnormal area, it is abandoned, and the cutter is controlled to move above the next potential height measurement point.

[0108] Continue with Figure 5 Taking the illustrated embodiment as an example, the spindle controls the cutter to perform step height measurement on the first straight path L1, the second straight path L2, the third straight path L3, and the fourth straight path L4 in sequence.

[0109] Specifically, for each straight path, first determine the starting point of the step along the straight path (e.g., ...). Figure 5 The point located at the left end in the middle), the step endpoint (such as...) Figure 5 The point located at the right end of the line and the step distance value for each step. Then, the spindle controls the cutter to step from the starting point to the ending point until the height measurement of the straight path is completed. For example... Figure 5 As shown:

[0110] Stepping 9 times on the first straight path L1, 8 valid height measurements were obtained. Stepping 9 times on the second straight path L2, 10 valid height measurements were obtained. Stepping 9 times on the third straight path L3, 9 valid height measurements were obtained. Stepping 9 times on the fourth straight path L4, 9 valid height measurements were obtained.

[0111] Figure 5 In the example, 36 height measurements were finally obtained.

[0112] S14. Calculate the difference between the maximum and minimum values ​​among several height measurement values: If the difference is less than a preset threshold, calculate the average value of several height measurement values ​​and use it as the i-th height measurement value.

[0113] The most typical type of damage to a cutting blade is a notch on the edge. The blade radius at the notch location will be significantly smaller than the blade radius at other locations. During contact height measurement, the cutting blade rotates, so the position where the blade contacts the measuring point varies each time. The location of the notch (especially when the notch is long or numerous) will generally also contact the measuring point and obtain the corresponding height value, which will be significantly smaller than the blade radius at other locations.

[0114] Therefore, if the difference between the maximum and minimum values ​​among several height measurements is less than a preset threshold, the cutter can be considered undamaged. Otherwise, the cutter may be damaged. The preset threshold can be set according to specific circumstances. For example, in some embodiments, the preset threshold is set to 10 micrometers, meaning that when the difference between the maximum and minimum values ​​among several height measurements is less than 10 micrometers, the cutter can be considered undamaged.

[0115] Assuming the cutter is not damaged, calculate the average of several height measurements as the final height value. For example, Figure 3 The average of the 96 height measurements in the example, Figure 4 The average of the eight height measurements in the example, Figure 5 The average of the 36 height measurements in the example is the final height measurement.

[0116] S15. If the difference is greater than or equal to the preset threshold, perform a damage detection on the cutter. If the cutter is damaged, replace the cutter; otherwise, re-measure the height of the cutter.

[0117] As described earlier, if the difference between the maximum and minimum values ​​of several calculated cutter heights is greater than or equal to a preset threshold (e.g., 10 micrometers), the cutter may be damaged. Alternatively, it's possible that during the height measurement process, the cutter failed to actually contact the measurement points. Therefore, a damage detection test is necessary to determine if the cutter is damaged.

[0118] If the cutter is found to be damaged after damage inspection, it needs to be replaced with a new one. If the cutter is found to be undamaged after damage inspection, it indicates that some height measurement points failed, and the height measurement operation on the cutter needs to be repeated.

[0119] In addition, this application embodiment also provides a dicing machine height measurement device, which includes a memory and a processor. The memory stores at least one program instruction, and the processor loads and executes at least one program instruction to implement the dicing machine height measurement method as described in any of the above embodiments.

[0120] In addition, this application also provides a computer storage medium storing at least one program instruction, which is loaded and executed by a processor to implement the dicing machine height measurement method as described in any of the above embodiments.

[0121] The foregoing has provided a sufficiently detailed and specific description of this application. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within the protection scope of this application. The scope of protection claimed in this application is defined by the claims, and not by the above descriptions in the embodiments.

Claims

1. A method for measuring the height of a dicing machine, characterized in that, The height measurement method of the dicing machine includes: S1. Perform height measurement of the new tool after tool replacement to obtain the height measurement value of the new tool; S2. Set the height of the low-speed point for the first height measurement, so that the low-speed movement distance is a predetermined value; S3. Based on the height of the low-speed point in the first height measurement, perform the first height measurement to obtain the first height measurement value; S4. Based on the first height measurement value and the new blade height measurement value, calculate the blade wear amount in the first stage. Blade wear amount in the first stage = new blade height measurement value - first height measurement value; S5. Based on the low-speed point height of the first height measurement and the cutter wear amount in the first stage, calculate the low-speed point height of the second height measurement. The low-speed point height of the second height measurement = the low-speed point height of the first height measurement - the cutter wear amount in the first stage. S6. Set the initial value of i to 2; S7. Perform the i-th altitude measurement, including: Based on the height of the low-speed point in the i-th height measurement, the height measurement value of the i-th height measurement is obtained. Based on the height measurement value of the i-th time and the height measurement value of the (i-1)-th time, calculate the cutter wear amount in the i-th stage. Cutter wear amount in the i-th stage = height measurement value of the (i-1)-th time - height measurement value of the i-th time. Based on the low-speed point height of the i-th height measurement and the cutter wear amount of the i-th stage, the low-speed point height of the (i+1)-th height measurement is calculated. The low-speed point height of the (i+1)-th height measurement = the low-speed point height of the i-th height measurement - the cutter wear amount of the i-th stage. S8. Increase i by 1 and continue with the height measurement steps in S7; The height measurement based on the low-speed point height of the i-th height measurement described in S7 includes: Pre-determine the height measurement area on the marking platform; Anomaly detection is performed on the height measurement area to identify and locate abnormal areas within the height measurement area. The abnormal areas either protrude upwards from the grading platform or are recessed downwards into the grading platform. The cutter, controlled by the spindle, rotates and contacts several height measurement points within the height measurement area to obtain several height measurement values. During the height measurement process, the cutter is in a rotating state. The position of the cutter contacting the height measurement points is different for each height measurement. The contacted height measurement points avoid the abnormal area. Calculate the difference between the maximum and minimum values ​​among the measured heights: If the difference is less than a preset threshold, the cutter is not damaged. Calculate the average of several height measurement values ​​and use it as the i-th height measurement value. If the difference is greater than or equal to the preset threshold, the cutter may be damaged. The cutter is then inspected for damage. If the cutter is damaged, it is replaced; otherwise, the cutter height is measured again.

2. The height measurement method for a dicing machine as described in claim 1, characterized in that, The predetermined value is 2-5mm.

3. The method for measuring the height of a dicing machine as described in claim 1, characterized in that, Before the cutter, whose rotation is controlled by the spindle, contacts the several height measuring points within the height measuring area, the method further includes: N height measurement points are predetermined within the height measurement area, and the N height measurement points are evenly distributed within the height measurement area; By removing the N height measurement points located in abnormal areas, a number of height measurement points are obtained.

4. The method for measuring the height of a dicing machine as described in claim 1, characterized in that, The cutter, whose rotation is controlled by the spindle, contacts several height-measuring points within the height-measuring area to obtain several height-measuring values, including: Determine the height measurement step path within the height measurement area; The cutter is controlled by the spindle to move along the height measurement stepping path. Each step is completed as follows: Determine whether the current height measurement point directly below the cutter is in an abnormal area. If so, control the cutter to step above the next height measurement point via the spindle. Otherwise, control the cutter to descend and contact the current height measurement point via the spindle to obtain a height measurement value.

5. The method for measuring the height of a dicing machine as described in claim 1, characterized in that, The anomaly detection of the height measurement area includes: Acquire an image of the height measurement area; By performing image analysis on the image of the height measurement area, abnormal areas within the height measurement area can be identified and located.

6. A height measuring device for a dicing machine, characterized in that, The dicing machine height measurement device includes a memory and a processor. The memory stores at least one program instruction, and the processor loads and executes at least one program instruction to implement the dicing machine height measurement method as described in any one of claims 1 to 5.

7. A computer storage medium, characterized in that, The computer storage medium stores at least one program instruction, which is loaded and executed by a processor to implement the dicing machine height measurement method as described in any one of claims 1 to 5.

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