A spherical bearing leveling error detection device and method

Abstract

The application provides a spherical bearing leveling error detection device and method, and relates to the field of precision manufacturing. The detection device comprises a base frame, an upper adhering block, a lower adhering block and a linear driving part, and further comprises at least three displacement sensors. The base frame can be fixedly arranged with a spherical bearing to be detected. The upper adhering block can be fixedly connected to a movable ball. The lower surface of the upper adhering block is an upper adhering surface. The mounting part of the linear driving part is fixedly mounted on the base frame, and the lower adhering block is fixedly connected to the driving part of the linear driving part. The upper surface of the lower adhering block is a lower adhering surface, and the linear driving part can drive the lower adhering block and make the lower adhering surface adhere to the upper adhering surface. The displacement sensors are fixedly mounted on the base frame and located in the same plane, and the arrangement of at least three displacement sensors is not collinear, which is used for detecting the position of the upper adhering surface under different adhering conditions. The error between the upper adhering surface and the reference plane under different adhering conditions is the leveling error of the spherical bearing to be detected under different adhering conditions.

Description

Technical Field

[0001] This invention relates to the field of precision manufacturing technology, and more specifically, to a device and method for detecting leveling errors in spherical bearings. Background Technology

[0002] Chip bonding is the electrical connection that secures the leads of a chip to a substrate, enabling the intended design function. It is a crucial process in integrated circuit packaging. Chip bonding involves precise alignment and bonding between the chip and the substrate, requiring excellent parallelism between their surfaces. Excessive parallelism can cause leads on one side of the chip to contact the substrate while leads on the other side remain significantly away, leading to incomplete solder wetting and bonding failure. Furthermore, excessive non-parallelism can cause uneven stress distribution during bonding, resulting in cracks or even chip breakage.

[0003] Existing thermoforming bonding machines with micron-level alignment precision use spherical bearings to achieve precise parallelism adjustment, controlling the parallelism error to within ±2μm within a 10mm dimensional range. Specifically, the spherical bearing is mounted on the bonding head to support free rotation of the bonding head and the carried chip around the bearing's center. After the bonding head is pressed against a reference surface and appropriate pressure is applied, the spherical bearing automatically adjusts the bonding surface of the bonding head to be parallel to the reference surface. Using this principle, the parallelism between the chip and the substrate can be adjusted to the required range. Therefore, the spherical bearing, as a core component for parallelism adjustment, requires careful quality control in its manufacturing and assembly to ensure the leveling effect meets requirements. However, existing technologies lack devices or methods for accurately evaluating the leveling effect of spherical bearings. Summary of the Invention

[0004] The first objective of this invention is to provide a spherical bearing leveling error detection device to solve the technical problem in the prior art that the leveling effect of spherical bearings cannot be accurately evaluated.

[0005] The spherical bearing leveling error detection device provided by the present invention includes a base frame, an upper bonding block, a lower bonding block, and a linear drive component, and further includes at least three displacement sensors. The base frame can fixably mount the fixed ball socket of the spherical bearing to be tested, and the movable ball of the spherical bearing to be tested is rotatably mounted in the fixed ball socket. The upper bonding block can be fixedly connected to the movable ball. The lower surface of the upper bonding block is the upper bonding surface. The mounting part of the linear drive component is fixedly mounted on the base frame, and the lower bonding block is fixedly connected to the driving part of the linear drive component. The upper surface of the lower bonding block is the lower bonding surface, and the linear drive component can drive the lower bonding block and make the lower bonding surface fit with the upper bonding surface. The displacement sensors are all fixedly mounted on the base frame, located in the same plane, and at least three of the displacement sensors are not collinear, used to detect the position of the upper bonding surface under different bonding conditions, so as to calculate the leveling error of the spherical bearing to be tested under different bonding conditions.

[0006] Furthermore, the lower surface of the lower bonding block is provided with a receiving groove; the spherical bearing leveling error detection device also includes a shim, which can be partially accommodated in the receiving groove, and the portion of the shim protruding from the receiving groove can cause the lower bonding block to tilt away from the receiving groove.

[0007] Furthermore, the number of displacement sensors is four, and all four displacement sensors are located directly below the upper bonding surface and arranged in a rectangular pattern.

[0008] Furthermore, the displacement sensor is a laser confocal sensor.

[0009] Furthermore, the base frame is fixedly provided with a mounting bracket, and the displacement sensor is fixedly installed on the mounting bracket and its position is adjustable along the height direction.

[0010] Furthermore, the upper bonding block is made of aluminum alloy or stainless steel, and the upper bonding surface is precision machined; and / or, the lower bonding block is made of aluminum alloy or stainless steel, and the lower bonding surface is precision machined.

[0011] Furthermore, the linear drive component is one of a cylinder, a hydraulic cylinder, or an electric motor.

[0012] The spherical bearing leveling error detection device provided by this invention can produce the following beneficial effects:

[0013] The spherical bearing leveling error detection device provided by this invention involves fixing the fixed ball socket of the spherical bearing to be tested to a base frame and fixing the upper bonding block to the movable ball of the bearing. After adjusting the bonding conditions, such as adjusting the tilt angle of the lower bonding surface, a linear drive is used to drive the lower bonding block upward with a preset bonding pressure, ensuring stable bonding between the lower and upper bonding surfaces. The plane where the upper bonding surface is located, as measured by a displacement sensor, can be used as a reference plane. By changing the bonding conditions, such as changing the bonding pressure applied by the linear drive or the tilt angle of the lower bonding surface of the lower bonding block, the position of the upper bonding surface is detected again. By calculating and comparing with the reference plane, the leveling error of the spherical bearing under different bonding conditions can be obtained. In other words, using the spherical bearing leveling error detection device provided by this invention, the leveling effect of the spherical bearing can be detected quantitatively, thus enabling a more accurate evaluation of the leveling effect.

[0014] The second objective of this invention is to provide a method for detecting the leveling error of spherical bearings, so as to solve the technical problem that the leveling effect of spherical bearings cannot be accurately evaluated in the prior art.

[0015] The spherical bearing leveling error detection method provided by this invention uses the aforementioned spherical bearing leveling error detection device for detection. The detection method includes the following steps:

[0016] Determine the reference plane and its position: Unlock the spherical bearing to be tested, and drive the lower bonding block to rise to fit with the upper bonding block using the rated pressure that the spherical bearing to be tested can withstand as the bonding pressure. Use the upper bonding surface in this bonding state as the reference plane S. 基准 The heights h1, h2, ..., h of each detection point on the mating surface are measured. n n is the number of displacement sensors;

[0017] Change the bonding conditions and detect the position of the upper bonding surface: Change the tilt angle of the lower bonding block, and at the same tilt angle, change the magnitude of the bonding pressure F, and detect the height h of each detection point on the upper bonding surface under different bonding pressures F. F-1 h F-2 , ..., h F-n ;

[0018] Calculate the leveling error of the spherical bearing under different mating conditions: Based on the coordinates of the projections of each displacement sensor onto the horizontal plane (x1, y1), (x2, y2), ..., (x... n ,y n The height values ​​of each detection point on the upper bonding surface measured under different bonding conditions are used to calculate the positional error between the upper bonding surface and the reference plane under different bonding conditions, which is used as the leveling error of the spherical bearing under test under different bonding conditions.

[0019] Optionally, the parallelism error between the upper bonding surface and the reference plane under different bonding conditions can be used as the leveling error of the spherical bearing to be tested.

[0020] Optionally, the angle between the upper bonding surface and the reference plane under different bonding conditions can be used as the leveling error of the spherical bearing to be tested.

[0021] The spherical bearing leveling error detection method provided by the present invention uses the above-mentioned spherical bearing leveling error detection device and has all the advantages of the above-mentioned spherical bearing leveling error detection device, so it will not be described again here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0023] Figure 1 This is a simplified schematic diagram of the spherical bearing leveling error detection device provided in an embodiment of the present invention;

[0024] Figure 2 This is a three-dimensional structural schematic diagram of the spherical bearing leveling error detection device provided in an embodiment of the present invention;

[0025] Figure 3 This is a front view schematic diagram of the spherical bearing leveling error detection device provided in an embodiment of the present invention;

[0026] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0027] Figure 5 This is a cross-sectional structural schematic diagram of the spherical bearing leveling error detection device provided in an embodiment of the present invention.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100 - Base frame; 110 - Bottom plate; 120 - Frame; 130 - Top plate;

[0030] 200-Upper bonding block;

[0031] 300-lower bonding block;

[0032] 400 - Displacement sensor; 410 - Mounting bracket;

[0033] 500 - Linear drive unit; 510 - Mounting part; 520 - Drive unit;

[0034] 600-gasket;

[0035] 700 - Spherical bearing; 710 - Fixed ball socket; 720 - Moving ball. Detailed Implementation

[0036] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0037] In chip bonding processes, to achieve lead bonding between the chip and the substrate, it is necessary to ensure good parallelism between the chip and the substrate during bonding. Spherical bearings 700 are typically used in such parallel bonding operations to achieve passive leveling of the bonding surfaces. To test the leveling performance of the spherical bearing 700, this embodiment provides a spherical bearing leveling error detection device and method.

[0038] Figure 1 This embodiment shows a simplified structure of the spherical bearing leveling error detection device. Figure 2 The three-dimensional structure of the spherical bearing leveling error detection device provided in this embodiment is shown. Figure 3 The side view of the spherical bearing leveling error detection device provided in this embodiment is shown. Figure 4 Enlarged display Figure 3 The structure at point A in the middle, Figure 5 The cross-sectional structure of the spherical bearing leveling error detection device provided in this embodiment is shown. Figure 5 As shown, in this embodiment, a spherical air bearing is used as the spherical bearing 700 to be tested. The fixed ball socket 710 has a throttling orifice, or a porous material is used. After compressed air is introduced, a uniformly thick air film will be formed between the fixed ball socket 710 and the movable ball 720, allowing the movable ball 720 to rotate with almost no friction, thus achieving an automatic leveling function. After adjustment, the compressed air supply is stopped, and the relative position between the movable ball 720 and the fixed ball socket 710 is locked mechanically, electromagnetically, or in a vacuum manner, so that the ball no longer rotates.

[0039] The spherical bearing leveling error detection device provided in this embodiment includes a frame 100, an upper bonding block 200, a lower bonding block 300, and a linear drive 500. It also includes at least three displacement sensors 400. The frame 100 can fix the fixed ball socket 710 of the spherical bearing 700 to be tested, and the movable ball 720 of the spherical bearing 700 to be tested is rotatably disposed in the fixed ball socket 710. The upper bonding block 200 can be fixedly connected to the movable ball 720. The lower surface of the upper bonding block 200 is the upper bonding surface. The mounting portion 5 of the linear drive 500... The lower bonding block 300 is fixedly installed on the base frame 100 and fixedly connected to the driving part 520 of the linear drive 500. The upper surface of the lower bonding block 300 is the lower bonding surface. The linear drive 500 can drive the lower bonding block 300 and make the lower bonding surface fit with the upper bonding surface. The displacement sensors 400 are all fixedly installed on the base frame 100 and located in the same plane. At least three displacement sensors 400 are arranged non-collinearly to detect the position of the upper bonding surface under different bonding conditions, so as to calculate the leveling error of the spherical bearing 700 under different bonding conditions.

[0040] The spherical bearing leveling error detection device provided in this embodiment is used by fixing the fixed ball socket 710 of the spherical bearing 700 to be tested to the base frame 100, and fixing the upper bonding block 200 to the movable ball 720 of the spherical bearing 700 to be tested, simulating the state of the spherical bearing 700 in equipment such as a bonding machine; after adjusting the bonding conditions, such as adjusting the tilt angle of the lower bonding surface, the linear drive 500 can be used to drive the lower bonding block 300 to rise with a preset bonding pressure, so that the lower bonding surface and the upper bonding surface are stably bonded. At this time, the plane where the upper bonding surface is located, measured by the displacement sensor 400, can be used as the reference plane; by changing the bonding conditions, such as changing the bonding pressure applied by the linear drive 500 or the tilt angle of the lower bonding surface of the lower bonding block 300, the position of the upper bonding surface is detected again. By calculating and comparing with the reference plane, the leveling error of the spherical bearing 700 under different bonding conditions can be obtained. That is, by using the spherical bearing leveling error detection device provided in this embodiment, the leveling effect of the spherical bearing 700 can be detected in a quantitative way, so the leveling effect of the spherical bearing 700 can be evaluated more accurately.

[0041] Specifically, in this embodiment, the lower surface of the lower bonding block 300 is provided with a receiving groove; the spherical bearing leveling error detection device also includes a shim 600, which can be partially accommodated in the receiving groove, and the portion of the shim 600 protruding from the receiving groove allows the lower bonding block 300 to tilt away from the receiving groove. More specifically, in actual manufacturing, a concave stepped surface can be provided at the edge of the lower surface of the lower bonding block 300 to form the receiving groove, which is a relatively simple process. Of course, receiving grooves can also be provided at other positions on the lower surface of the lower bonding block 300, as long as a portion of the shim 600 can be accommodated in the receiving groove so that the portion of the shim 600 protruding from the receiving groove can accurately adjust the tilt angle of the lower bonding block 300, thereby accurately adjusting the tilt angle of the lower bonding surface.

[0042] Specifically, in this embodiment, there are four displacement sensors 400, all of which are located directly below the upper mating surface and arranged in a rectangular pattern. It should be noted that in other embodiments of this application, the number of displacement sensors 400 is not limited to four, but can also be other numbers, such as three or five.

[0043] Specifically, in this embodiment, the displacement sensor 400 can be a laser confocal sensor (cable and controller not shown), which has a measurement accuracy better than 1μm.

[0044] Specifically, in this embodiment, the base frame 100 is fixedly provided with a mounting bracket 410, and the displacement sensor 400 is fixedly mounted on the mounting bracket 410 with an adjustable position along the height direction. Because the range of the laser confocal sensor is relatively small, approximately 3mm, the mounting bracket 410 and the adjustable position of the displacement sensor 400 along the height direction allow for convenient adjustment of the position of the displacement sensor 400, ensuring that the upper contact surface is within the detection distance of the displacement sensor 400.

[0045] Specifically, in this embodiment, to ensure that the displacement sensor 400 has sufficient measurement space, the external dimensions of the upper bonding block 200 can be appropriately increased, and its length or diameter can be greater than the outer diameter of the mounting surface of the spherical bearing 700. For example... Figure 5 As shown, because the body of the spherical bearing 700 is relatively small while the displacement sensor 400 is relatively large, the lower dimension of the upper bonding block 200 is expanded outward in order to provide installation space for the lower bonding block 300 and the linear drive component 500.

[0046] Specifically, in this embodiment, both the upper bonding block 200 and the lower bonding block 300 are made of aluminum alloy, and both the upper bonding surface of the upper bonding block 200 and the lower bonding surface of the lower bonding block 300 are precision-machined. Using aluminum alloy reduces deformation of the bonding blocks under pressure loads; polishing ensures good flatness of the bonding surfaces, thus guaranteeing the leveling effect. Of course, in other embodiments of this application, the materials of the upper bonding block 200 and the lower bonding block 300 are not limited to aluminum alloy. For example, the upper bonding block 200 and the lower bonding block 300 can also be made of stainless steel or other materials, as long as they are not easily deformed within the bonding pressure range. After precision machining, the upper and lower bonding surfaces have good flatness and surface roughness. After bonding, they can be considered to overlap, and even after the linear drive 500 separates them by a short distance, they still maintain good parallelism. Thus, no large error is introduced into the measurement results of the leveling error.

[0047] Specifically, in this embodiment, the linear drive 500 is a cylinder. More specifically, in this embodiment, the cylinder mounting part, i.e., the cylinder body, is fixedly mounted on the base frame 100; the cylinder also has a guide structure, such as a guide rod arranged parallel to the cylinder's drive part, i.e., the cylinder rod; the outer ends of the cylinder rod and the guide rod are also provided with a connecting platform, the upper side of the connecting platform and the lower bonding block 300 are fixedly connected. When the lower bonding block 300 and the upper bonding block 200 are not in contact, the cylinder causes the lower bonding block 300 to rise and fall vertically while maintaining a constant tilt angle; after the lower bonding block 300 contacts the upper bonding block 200, the bonding pressure (i.e., the axial load on the spherical bearing) can be changed by changing the cylinder's air supply pressure.

[0048] However, in other embodiments of this application, the linear drive 500 is not limited to a cylinder. For example, the linear drive 500 can also be a hydraulic cylinder or a motor, as long as it can drive the lower bonding block 300 to rise and fall according to the required bonding pressure. When a hydraulic cylinder is used as the linear drive 500, the bonding pressure can be changed by changing the oil supply pressure of the hydraulic cylinder. When a motor is used as the linear drive 500, a force sensor can be used to assist in adjusting the pressure during bonding.

[0049] Specifically, in this embodiment, the base frame 100 includes a base plate 110, a frame 120, and a top plate 130. The bottom end of the frame 120 is fixedly installed on the base plate 110, and the top plate 130 is fixedly installed on the top of the frame 120. The structure is robust, enabling the device to be stably and vertically placed on the test platform. The mounting brackets 410 for the cylinder and the displacement sensor 400 are both fixedly installed on the base plate 110, while the spherical bearing 700 to be tested is installed on the top plate 130.

[0050] This embodiment also provides a method for detecting the leveling error of a spherical bearing, using the aforementioned spherical bearing leveling error detection device. The detection method includes the following steps:

[0051] S110, Determine the reference plane and its position: Unlock the spherical bearing 700 to be tested from its locking state; drive the lower bonding block 300 to rise and bond with the upper bonding block 200 using the rated pressure that the spherical bearing 700 to be tested can withstand as the bonding pressure; use the upper bonding surface in this bonding state as the reference plane S. 基准 The heights h1, h2, ..., h of each detection point on the mating surface are measured. n n is the number of displacement sensors 400;

[0052] S120, Change the bonding conditions and detect the position of the upper bonding surface: Change the tilt angle of the lower bonding block 300, and at the same tilt angle, change the magnitude of the bonding pressure F, and detect the height h of each detection point on the upper bonding surface under different bonding pressures F. F-1 h F-2 , ..., h F-n ;

[0053] S130, calculate the leveling error of the spherical bearing 700 under different mating conditions: based on the coordinates of the projections of each displacement sensor 400 onto the horizontal plane (x1, y1), (x2, y2), ..., (x... n ,y n The height values ​​of each detection point on the upper bonding surface measured under different bonding conditions are used to calculate the positional error between the upper bonding surface and the reference plane under different bonding conditions, which is used as the leveling error of the spherical bearing 700 under different bonding conditions.

[0054] Specifically, the maximum leveling error obtained by changing the bonding pressure when the lower bonding block 300 is at a certain tilt angle can be taken as the leveling error of the spherical bearing at that tilt angle; the maximum leveling error obtained by repeated testing at different tilt angles can be taken as the leveling error of the spherical bearing under all possible application conditions.

[0055] Specifically, in this embodiment, the parallelism error between the upper bonding surface and the reference plane under different bonding conditions is used as the leveling error of the spherical bearing 700 to be tested. Based on the coordinates (x1, y1), (x2, y2), ..., (x...) projected onto the horizontal plane by the displacement sensor 400... n ,y n By determining the area of ​​the upper contact surface covered by the measuring point of the displacement sensor 400, and within this area, when the contact pressure (i.e., the axial load) is F, the parallelism error between the upper contact surface and the reference plane (i.e., the parallelism error e of the leveling of the spherical bearing 700) can be calculated. pF It can be estimated as follows:

[0056]

[0057] As can be seen from the above calculation formula, what is actually being calculated is the position of the upper bonding surface of the upper bonding block 200 relative to the reference plane under different bonding conditions. The installation error of the displacement sensor 400 will not affect the relative difference h between the two measurements. n -h F-n Therefore, it will not affect the parallelism error e. pF The evaluation accuracy, namely the parallelism error of the spherical bearing 700 leveling, is independent of the installation accuracy of the displacement sensor 400. Therefore, using the parallelism error as the leveling error can effectively avoid the influence of the installation error of the displacement sensor 400 on the test results and can well ensure the accuracy of the test results.

[0058] In addition, in other embodiments of this application, the angle between the upper bonding surface and the reference plane under different bonding conditions can also be used as the leveling error of the spherical bearing 700 to be tested.

[0059] Specifically, taking four displacement sensors 400 as an example, a spatial rectangular coordinate system is established with the center of the bottom surface of the detection device as the origin. The coordinates (x1, y1), (x2, y2), (x3, y3), and (x4, y4) of the projection of each displacement sensor 400 on the horizontal plane are determined by means of caliper measurement, etc.

[0060] First, calculate the normal vector [x, y, z] of the reference plane, because it satisfies...

[0061]

[0062] so,

[0063]

[0064] Similarly, calculate the normal vector [x] of the upper mating surface when the axial load is F. F ,y F ,z F ],get:

[0065]

[0066] The leveling error of the spherical bearing 700 can be determined by the angle θ between the two normal vectors mentioned above. pF Or its supplementary angle can be used to represent:

[0067]

[0068] It should be noted that due to differences in the installation height of the laser sensors (e.g., a maximum height difference of 0.5mm), the laser sensors are not actually located on the same plane. This will cause a deviation between the normal vector of the plane obtained by the above calculation method and the actual result, thus introducing errors in the leveling error estimation. To improve the accuracy of the detection results, calipers can be used to measure the installation height of each sensor, determine the difference in sensor installation height, and subtract this difference from the distance measured by the sensors, effectively transforming the situation into the case where all sensors are installed at the same height. Of course, if all sensors can be ensured to be as close to the same height as possible during installation, with an error not exceeding 0.5mm, under small angle approximation conditions, the installation height difference of the displacement sensor 400° will affect the leveling error θ. pF The impact on the accuracy of the assessment can also be ignored.

[0069] When using the spherical bearing leveling error detection device and method provided in this embodiment for detection, the following steps can be followed:

[0070] S210, release the locking state of the spherical bearing 700, adjust the height of the laser sensor so that the mating surface of the upper mating block 200 is within the measurement range of the laser sensor.

[0071] S220, drive the lower bonding block 300 to rise, so that the lower bonding block 300 and the upper bonding block 200 come into contact until the bonding pressure is appropriate. After the spherical bearing 700 rotates under this pressure load and reaches a stable position, it can be considered that in the stable position, the bonding surface of the upper bonding block 200 is parallel to the bonding surface of the lower bonding block 300. The measurement data of the laser sensor at this time is used as the reference for the bonding surface of the upper bonding block 200 in the leveling state. The distance or height values ​​measured by the four laser sensors are recorded as: h1, h2, h3, h4.

[0072] S230, keeping the spherical bearing 700 locked, drive the lower bonding block 300 to rise, so that the bonding pressure reaches the set pressure F. At this time, the measurement data of the laser sensor includes the planar position of the bonding surface of the upper bonding block 200 when the axial load is F. The measurement values ​​of the four laser sensors are recorded as: h F-1 ,h F-2 ,h F-3 ,h F-4 ;

[0073] Repeat this step by changing the set pressure to obtain the planar position of the mating surface of the upper mating block 200 under different axial loads. To detect when the mating pressure is zero, i.e., when there is no axial load, keep the spherical bearing 700 locked and drive the lower mating block 300 to lower away from the upper mating block 200. At this time, the measurement data of the laser sensor includes the planar position of the mating surface of the upper mating block 200 when there is no axial load. The measurement values ​​of the four laser sensors are recorded as: h0-1 ,h 0-2 ,h 0-3 ,h 0-4 .

[0074] S240, Calculate the leveling error of the spherical bearing 700 based on the measurement results obtained in the preceding steps.

[0075] The above tests measured the leveling error of the spherical bearing 700 under different contact pressures. To test the error of the spherical bearing 700 when the lower contact surface is at different tilt angles, the lower contact block 300 needs to be lowered, a shim 600 inserted into the gap under the stepped surface of the lower contact block 300, and the lower contact block 300 reinstalled and tightened to release the locking state of the spherical bearing 700. Steps S220 to S240 are then repeated. By using shims 600 of different heights, the leveling effect of the spherical bearing 700 at different tilt angles of the lower contact surface can be obtained.

[0076] In summary, this embodiment provides a spherical bearing leveling error detection device and method, which can quantitatively evaluate the leveling error of the spherical bearing 700 under different leveling angles and axial loads. This allows for a comprehensive evaluation of the leveling effect or performance of the spherical bearing 700, and also reduces the impact of the installation error of the displacement sensor 400 on the measurement results, resulting in high detection accuracy.

[0077] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0078] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to the embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A spherical bearing leveling error detection device, characterized in that, include: The base frame (100) can fix the fixed ball socket (710) of the spherical bearing (700) to be tested, and the movable ball (720) of the spherical bearing (700) to be tested is rotatably disposed in the fixed ball socket (710); The upper bonding block (200) can be fixedly connected to the movable sphere (720); the lower surface of the upper bonding block (200) is the upper bonding surface; The lower bonding block (300) and the linear drive (500) are provided. The mounting part (510) of the linear drive (500) is fixedly mounted on the base frame (100), and the lower bonding block (300) is fixedly connected to the driving part (520) of the linear drive (500). The upper surface of the lower bonding block (300) is the lower bonding surface, and the linear drive (500) can drive the lower bonding block (300) and make the lower bonding surface fit with the upper bonding surface. At least three displacement sensors (400) are fixedly installed on the base frame (100) and located in the same plane. At least three of the displacement sensors (400) are not collinear. They are used to detect the position of the upper bonding surface under different bonding conditions, so as to calculate the leveling error of the spherical bearing (700) under different bonding conditions.

2. The spherical bearing leveling error detection device according to claim 1, characterized in that, The lower surface of the lower bonding block (300) is provided with a receiving groove; the spherical bearing leveling error detection device also includes a shim (600), which can be partially accommodated in the receiving groove.

3. The spherical bearing leveling error detection device according to claim 1, characterized in that, The number of displacement sensors (400) is four, and all four displacement sensors (400) are located directly below the upper bonding surface and arranged in a rectangular pattern.

4. The spherical bearing leveling error detection device according to claim 1, characterized in that, The displacement sensor (400) is a laser confocal sensor.

5. The spherical bearing leveling error detection device according to claim 4, characterized in that, The base frame (100) is fixedly provided with a mounting bracket (410), and the displacement sensor (400) is fixedly installed on the mounting bracket (410) and its position is adjustable along the height direction.

6. The spherical bearing leveling error detection device according to claim 1, characterized in that, The upper bonding block (200) is made of aluminum alloy or stainless steel, and the upper bonding surface is precision machined; and / or, the lower bonding block (300) is made of aluminum alloy or stainless steel, and the lower bonding surface is precision machined.

7. The spherical bearing leveling error detection device according to claim 1, characterized in that, The linear drive (500) is one of a cylinder, a hydraulic cylinder, or an electric motor.

8. A method for detecting leveling error in spherical bearings, characterized in that, The spherical bearing leveling error detection device according to any one of claims 1-7 is used for detection, and the detection method includes the following steps: Determine the reference plane and its position: Unlock the spherical bearing to be tested, and drive the lower bonding block to rise to fit with the upper bonding block using the rated pressure that the spherical bearing to be tested can withstand as the bonding pressure. Use the upper bonding surface in this bonding state as the reference plane S. 基准 The heights h1, h2, ..., h of each detection point on the mating surface are measured. n n is the number of displacement sensors; Change the bonding conditions and detect the position of the upper bonding surface: Change the tilt angle of the lower bonding block, and at the same tilt angle, change the magnitude of the bonding pressure F, and detect the height h of each detection point on the upper bonding surface under different bonding pressures F. F-1 h F-2 , ..., h F-n ; Calculate the leveling error of the spherical bearing under different mating conditions: Based on the coordinates of the projections of each displacement sensor onto the horizontal plane (x1, y1), (x2, y2), ..., (x... n ,y n The height values ​​of each detection point on the upper bonding surface measured under different bonding conditions are used to calculate the positional error between the upper bonding surface and the reference plane under different bonding conditions, which is used as the leveling error of the spherical bearing under test under different bonding conditions.

9. The method for detecting leveling error of a spherical bearing according to claim 8, characterized in that, The parallelism error between the upper bonding surface and the reference plane under different bonding conditions is used as the leveling error of the spherical bearing to be tested.

10. The method for detecting leveling error of a spherical bearing according to claim 8, characterized in that, The angle between the upper bonding surface and the reference plane under different bonding conditions is used as the leveling error of the spherical bearing to be tested.

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