Apparatus and method for characterizing the impact resistance of a semiconductor package

Abstract

Disclosed are an apparatus and a method of characterizing an impact resistance of a semiconductor package. The apparatus includes a mobile terminal including a semiconductor package, a periphery of the mobile terminal having a connection portion; a fixing unit disposed above the mobile terminal; a flexible unit connected between the fixing unit and the connection portion of the mobile terminal to allow the mobile terminal to be in a suspended state when at rest; an impact unit disposed below the mobile terminal; and a driving unit configured to drive the impact unit in a vertical direction such that the impact unit collides with the mobile terminal at a certain speed, wherein the flexible unit is configured to adjust a suspended posture of the mobile terminal by changing a first connection position with the fixing unit and a second connection position with the connection portion of the mobile terminal, thereby setting a collision posture when the mobile terminal collides with the impact unit.

Description

Technical Field

[0001] Embodiments of this disclosure relate to the field of semiconductor packaging testing, and more specifically, to apparatus and methods for characterizing the shock resistance of semiconductor packages. Background Technology

[0002] Existing mobile phone drop tests are generally set to a free fall of 1 meter or 1.5 meters, simulating the situation where a phone slips from a pocket or hand during use. To comprehensively test the drop performance of mobile phones under various postures, control the drop angle, and evaluate the impact resistance of semiconductor packages or other components included in the phone, existing patents propose several solutions.

[0003] Figure 1 A schematic diagram of a drop testing device in the prior art (Chinese patent application CN109506871A) is shown. See also Figure 1 The drop test device 10 includes: a drag module 101, a release module 102, an adsorption module 103, a sensor module 104, and a control module. The adsorption module 103, the sensor module 104, and the control module 105 are used to control the release angle of the mobile phone.

[0004] Figure 2 A schematic diagram illustrating the testing process of a drop testing device in the prior art (Chinese patent authorization CN110231136B) is shown. See also Figure 2 The carrier unit 10 is connected to the mobile phone 40, and the carrier unit driver chip 20 controls the initial release angle of the mobile phone 40 by controlling the attitude of the carrier unit 10.

[0005] Figure 3 A schematic diagram of the overall structure of a drop testing machine in the prior art (Chinese patent application CN109470443A) is shown. See also Figure 3 The drop test machine uses a robotic arm to hold the mobile phone to control the initial release angle.

[0006] It is evident that while existing solutions control the initial release angle of the phone during the drop, they neglect the phone's rotation in the air, failing to guarantee the final impact posture. Since the severity of the impact is directly related to factors such as the impact posture and speed, and current drop tests can only control the release angle, introducing randomness and uncertainty, they cannot quantitatively assess the impact resistance of the phone's internal components.

[0007] The information disclosed in this background section is only intended to enhance the understanding of the background of the embodiments of this disclosure. Therefore, the above information may contain information that does not constitute prior art known to those skilled in the art in this country. Summary of the Invention

[0008] This disclosure provides an apparatus and a method for characterizing the impact resistance of semiconductor packages. The embodiments of this disclosure can accurately control the collision posture of a mobile terminal, simulate the process of multiple impacts during a drop, and automatically reset the mobile terminal after the test. This provides a feasible solution for quantitatively evaluating the impact resistance of semiconductor packages included in a mobile terminal.

[0009] According to one aspect of this disclosure, an apparatus for characterizing the impact resistance of a semiconductor package is provided. The apparatus includes: a mobile terminal including a semiconductor package, the mobile terminal having a connecting portion on its periphery; a fixing unit disposed above the mobile terminal; a flexible unit connected between the fixing unit and the connecting portion of the mobile terminal to suspend the mobile terminal when stationary; an impact unit disposed below the mobile terminal; and a driving unit configured to drive the impact unit vertically, causing the impact unit to impact the mobile terminal at a certain speed. The flexible unit is configured to adjust the suspension posture of the mobile terminal by changing a first connection position with the fixing unit and a second connection position with the connecting portion of the mobile terminal, thereby setting the collision posture of the mobile terminal when it collides with the impact unit.

[0010] Preferably, the connecting portion may include multiple connecting members respectively disposed on the top, bottom and opposite sides of the mobile terminal.

[0011] Preferably, the fixing unit may have a rod-shaped shape that extends in the horizontal direction.

[0012] Preferably, the flexible unit may include a plurality of retractable elements having a strip shape, one end of each of the plurality of retractable elements being fixedly disposed on one of the plurality of connecting members to define the second connection position, and the other end of each of the plurality of retractable elements being movably disposed on the fixed unit to define the first connection position.

[0013] Preferably, the impact unit may have a flat plate shape.

[0014] Preferably, the collision posture can be defined by the angle between the mobile terminal and the impact unit at the time of the collision.

[0015] Preferably, the drive unit can be configured to drive the impact unit to stop moving after the first collision.

[0016] Preferably, the flexible unit can be configured to cause the mobile terminal to bounce upward after the first collision, so that the mobile terminal will collide with the stationary impact unit a second or more times under the action of gravity.

[0017] Preferably, the driving unit can be configured to drive the impact unit to move up and down at a certain speed, thereby causing multiple collisions with the mobile terminal.

[0018] Preferably, the flexible unit can be configured to automatically reset the mobile terminal after the test is completed.

[0019] According to another aspect of this disclosure, a method for characterizing the impact resistance of a semiconductor package is provided. The method includes: connecting a flexible unit to a mobile terminal at a second connection position, the mobile terminal including a semiconductor package, the mobile terminal having a connecting portion on its periphery, the connecting portion being disposed at the second connection position; connecting the flexible unit to a fixed unit at a first connection position, the flexible unit being connected between the fixed unit and the connecting portion of the mobile terminal so that the mobile terminal is in a suspended state when stationary; changing the first connection position and the second connection position to adjust the suspension posture of the mobile terminal to set the collision posture when the mobile terminal collides with the impact unit; and driving the impact unit disposed below the mobile terminal in a vertical direction by a driving unit, so that the impact unit impacts the mobile terminal at a certain speed.

[0020] Preferably, the connecting portion may include multiple connecting members respectively disposed on the top, bottom and opposite sides of the mobile terminal.

[0021] Preferably, the fixing unit may have a rod-shaped shape that extends in the horizontal direction.

[0022] Preferably, the flexible unit may include a plurality of retractable elements having a strip shape, and the step of connecting the flexible unit to the mobile terminal further includes: fixing one end of each of the plurality of retractable elements on one of the plurality of connecting members to define the second connection position, and the step of connecting the flexible unit to the fixed unit further includes: movably fixing the other end of each of the plurality of retractable elements on the fixed unit to define the first connection position.

[0023] Preferably, the impact unit may have a flat plate shape.

[0024] Preferably, the collision posture can be defined by the angle between the mobile terminal and the impact unit at the time of the collision.

[0025] Preferably, the driving unit can drive the impact unit to stop moving after the first collision.

[0026] Preferably, the flexible unit can cause the mobile terminal to bounce upward after the first collision, so that the mobile terminal will collide with the stationary impact unit a second or more times under the action of gravity.

[0027] Preferably, the driving unit can drive the impact unit to move up and down at a certain speed, thereby causing multiple collisions with the mobile terminal.

[0028] Preferably, the flexible unit can automatically reset the mobile terminal after the test is completed. Attached Figure Description

[0029] The features and advantages of this disclosure above and in other aspects will become clear from the following detailed description of embodiments of this disclosure in conjunction with the accompanying drawings.

[0030] Figure 1 A schematic diagram of the structure of a prior art drop test device is shown.

[0031] Figure 2 A schematic diagram of the testing process of a drop testing device of the prior art is shown.

[0032] Figure 3 A schematic diagram of the overall structure of a drop test machine in the prior art is shown.

[0033] Figure 4 A schematic diagram of an apparatus for characterizing the shock resistance of a semiconductor package according to an embodiment of the present disclosure is shown.

[0034] Figure 5 A schematic diagram of the suspension posture of an apparatus for adjusting the shock resistance of a semiconductor package according to an embodiment of the present disclosure is shown.

[0035] Figure 6 A flowchart is shown of a method for characterizing the shock resistance of a semiconductor package according to an embodiment of the present disclosure.

[0036] Figure 7 A, Figure 7 B and Figure 7 C illustrates a schematic diagram of a method for characterizing the shock resistance of a semiconductor package according to an embodiment of the present disclosure.

[0037] Figure 8 A schematic diagram of multiple impacts is shown for an apparatus for simulating the impact resistance of a semiconductor package according to an embodiment of the present disclosure. Detailed Implementation

[0038] The present disclosure will now be described more fully with reference to the accompanying drawings, which illustrate some embodiments. However, the present disclosure may be implemented in many different forms and should not be construed as limiting itself to the embodiments set forth herein. Rather, these embodiments are provided so that the description will be thorough and complete, and these embodiments will convey the scope of the present disclosure to those skilled in the art. In the drawings, the dimensions of layers and regions may be exaggerated for clarity.

[0039] For ease of description, spatial relative terms such as “below,” “under,” “below,” “above,” and “above” may be used herein to describe the relationship of an element as shown in the accompanying drawings to other elements. In addition to the orientations shown in the drawings, spatial relative terms also include different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as “below” or “below” other elements will subsequently be oriented “above” said other elements. Therefore, the term “below” can include both “above” and “below” orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations) and the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0040] Figure 4 A schematic diagram of an apparatus for characterizing the shock resistance of a semiconductor package according to an embodiment of the present disclosure is shown. Figure 4 As shown, an apparatus for characterizing the impact resistance of a semiconductor package according to an embodiment of the present disclosure includes: a mobile terminal 110 including a semiconductor package PKG, the mobile terminal 110 having a connecting portion 111 on its periphery; a fixing unit 120 disposed above the mobile terminal 110; a flexible unit 130 connected between the fixing unit 120 and the connecting portion 111 of the mobile terminal 110, so that the mobile terminal 110 is in a suspended state when stationary; an impact unit 140 disposed below the mobile terminal 110; and a driving unit 150 configured to drive the impact unit 140 in a vertical direction, so that the impact unit 140 impacts the mobile terminal 110 at a certain speed.

[0041] In this embodiment, the mobile terminal 110 can be any mobile or portable communication terminal such as a smartphone, tablet computer, or multimedia player. The semiconductor package PKG included in the mobile terminal can be an IC package such as a memory chip or logic chip, manufactured using various packaging processes. For example, the semiconductor package PKG can be a package for various chips such as CPUs, GPUs, DRAMs, or Flash Memory based on various packaging processes such as COB, BGA, and Flip-chip. By conducting drop tests on the mobile terminal, the impact resistance of the semiconductor package PKG included in the mobile terminal can be evaluated and characterized.

[0042] According to embodiments of this disclosure, the flexible unit 130 can be configured to adjust the suspension posture of the mobile terminal 110 by changing the first connection position with the fixed unit 120 and the second connection position with the connection portion 111 of the mobile terminal 110, thereby setting the collision posture of the mobile terminal 110 when it collides with the impact unit 140. Hereinafter, in conjunction with... Figure 4 and Figure 5 The present disclosure describes in detail the elements included in an apparatus for characterizing the shock resistance of a semiconductor package according to embodiments thereof.

[0043] In one embodiment, the mobile terminal 110 has a connecting portion 111 on its periphery. For example, the connecting portion 111 may include a plurality of connecting members 110U, 110B, and 110S respectively disposed on the top, bottom, and opposite sides of the mobile terminal 110. For example, the plurality of connecting members 110U, 110B, and 110S may be holes typically present on the outer casing of the mobile terminal, such as headphone jacks or charging ports. They are disposed at different locations on the periphery of the mobile terminal. In other embodiments, some of the connecting members may be disposed on the back or front of the mobile terminal.

[0044] In this embodiment, the fixing unit 120 is disposed above the mobile terminal 110. For example, the fixing unit 120 may have a rod-shaped form extending horizontally. The fixing unit 120 may be stationary relative to the mobile terminal 110 to serve as a support point for the mobile terminal 110 during a drop test. However, the embodiments of this disclosure are not limited thereto; the fixing unit may have any shape, and its height and lateral positions may be adjusted before and after the drop test to facilitate changes in relevant process conditions for the next test.

[0045] Figure 5 A schematic diagram of the suspension posture of an apparatus for adjusting the shock resistance of a semiconductor package according to an embodiment of the present disclosure is shown.

[0046] In one embodiment, the flexible unit 130 is connected between the fixed unit 120 and the connection portion 111 of the mobile terminal 110, so that the mobile terminal 110 is in a suspended state when stationary. For example, the mobile terminal 110 can swing up and down or left and right based on the elasticity of the flexible unit 130 during a drop test and remain stationary based on gravity after the test.

[0047] In an embodiment, such as Figure 5As shown, the flexible unit 130 may include a plurality of retractable elements 130U, 130B, and 130S having a strip shape. One end of each of the plurality of retractable elements 130U, 130B, and 130S may be fixedly disposed on one of the plurality of connecting members 110U, 110B, and 110S to define a second connection position, and the other end of each of the plurality of retractable elements 130U, 130B, and 130S may be movably disposed on the fixing unit 120 to define a first connection position.

[0048] In one embodiment, the other end of each of the plurality of retractable elements 130U, 130B, and 130S may include a connecting ring. The plurality of retractable elements 130U, 130B, and 130S can be movably connected to the fixed unit 120 via the connecting ring.

[0049] In an embodiment, each of the plurality of retractable elements 130U, 130B, and 130S may be an elastic member such as a spring or rubber band, having a retractable elastic force in a certain direction. In an embodiment, the plurality of retractable elements 130U, 130B, and 130S may have the same or different lengths and / or elastic forces to control different collision postures of the mobile terminal 110.

[0050] For example, the first retractable element 130U can be connected to the connecting member 110U of the mobile terminal 110 and has a shorter length. The second retractable element 130B can be connected to the connecting member 110B of the mobile terminal 110 and has a longer length. Multiple third retractable elements 130S can be configured and connected to the connecting members 110S on the left and right sides of the mobile terminal 110, respectively. The length of the third retractable element 130S can be longer than the length of the first retractable element 130U but shorter than the length of the second retractable element 130B. In this case, the second connection position can include the top, bottom, and opposite sides of the mobile terminal 110. By changing the first connection position of the first retractable element to each of the third retractable elements 130U, 130B, and 130S, the suspension posture of the mobile terminal 110 can be adjusted, thereby setting the collision posture when the mobile terminal 110 collides with the impact unit 140.

[0051] See back Figure 4 The impact unit 140 is disposed below the mobile terminal 110. In one embodiment, the impact unit 140 may have a flat plate shape. However, embodiments of this disclosure are not limited thereto, and the impact unit may have any shape that conforms to simulated drop and collision conditions.

[0052] According to embodiments of this disclosure, during a drop test, the drive unit 150 is configured to drive the impact unit 140 vertically, causing the impact unit 140 to impact the mobile terminal 110 at a certain speed. In embodiments, the drive unit 150 may be a motor. For example, the drive unit 150 may include a connecting rod connected to the impact unit 140 to control the vertical movement of the impact unit 140.

[0053] According to embodiments of this disclosure, the mobile terminal 110 can collide with the impact unit 140 in a predetermined collision posture. For example, the collision posture can be defined by the angle between the mobile terminal 110 and the impact unit 140 at the time of the collision.

[0054] The following will combine Figure 6 , Figure 7 A, Figure 7 B. Figure 7 C and Figure 8 This document describes in detail a method for characterizing the shock resistance of a semiconductor package according to embodiments of the present disclosure.

[0055] Figure 6 A flowchart is shown of a method for characterizing the shock resistance of a semiconductor package according to an embodiment of the present disclosure. Figure 7 A, Figure 7 B and Figure 7 C illustrates a schematic diagram of a method for characterizing the shock resistance of a semiconductor package according to an embodiment of the present disclosure. Figure 7 A, Figure 7 B and Figure 7 The device shown in C, which characterizes the impact resistance of a semiconductor package, can be the one described above. Figure 4 The device shown.

[0056] See Figure 6 and Figure 7 A, a method for characterizing the impact resistance of a semiconductor package according to an embodiment of the present disclosure includes: first, performing step S100, connecting the flexible unit 130 to the mobile terminal 110 at a second connection location. As previously mentioned... Figure 4 As described, the mobile terminal 110 includes a semiconductor package PKG, and the periphery of the mobile terminal 110 has a connection portion 111, which is disposed at a second connection position.

[0057] Next, step S200 is performed, connecting the flexible unit 130 to the fixed unit 120 at the first connection position. For example... Figure 7 As shown in Figure A, the flexible unit 130 is connected between the fixed unit 120 and the connection portion 111 of the mobile terminal 110, so that the mobile terminal 110 is in a suspended state when stationary.

[0058] Next, step S300 is executed to change the first connection position and the second connection position to adjust the suspension posture of the mobile terminal 110, so as to set the collision posture when the mobile terminal 110 collides with the impact unit 140.

[0059] Next, see Figure 6 and Figure 7 B. Execute step S400, where the driving unit 150 drives the impact unit 140 located below the mobile terminal 110 in the vertical direction, so that the impact unit 140 impacts the mobile terminal 110 at a certain speed.

[0060] In the embodiments, see Figure 7 C. The driving unit 150 can drive the impact unit 140 to stop moving after the first collision. In this case, the flexible unit 130 can cause the mobile terminal 110 to bounce upward after the first collision, so that the mobile terminal 110 will collide with the stationary impact unit 140 a second or more times under the action of gravity.

[0061] Figure 8 A schematic diagram of multiple impacts is shown for an apparatus for simulating the impact resistance of a semiconductor package according to an embodiment of the present disclosure.

[0062] like Figure 8 As shown, the impact unit 140, under the action of the drive unit 150, impacts the mobile terminal 110 at a certain speed and stops immediately after the impact. After being impacted, the flexible unit 130 is instantly in a stress-free state, causing the mobile terminal 110 to rebound and then, under the action of gravity, to impact the impact unit 140 a second or more times, in order to simulate the free fall process of the mobile terminal 110.

[0063] In an embodiment, the drive unit 150 controls the impact unit 140 such that the second vertical distance between the position where the impact unit 140 stops and the fixed unit 120 is less than the first distance between the fixed unit 120 and the lowest position of the mobile terminal 110 when it is suspended, so as to ensure that a second or more impacts can occur.

[0064] In one embodiment, after each impact, the first connection position of the flexible unit 130 on the fixed unit 120 can change horizontally. This change can be measured, and the measured value can be used as a criterion for evaluating the impact resistance of the semiconductor package included in the mobile terminal. However, embodiments of this disclosure are not limited thereto; the first connection position can remain fixed regardless of the number of impacts.

[0065] Although not shown, in this embodiment, the drive unit 150 can drive the impact unit 140 to move up and down at a certain speed, thereby causing multiple collisions with the mobile terminal 110. The process of each collision and rebound can be basically the same as the cases discussed above.

[0066] In this embodiment, the flexible unit 130 can be configured to automatically reset the mobile terminal 110 after the test. After the collision, the drive unit 150 can return to its original position, and the mobile terminal 110 can automatically return to its initial suspension state when the force exerted by the flexible unit 130 and gravity reach equilibrium.

[0067] By summarizing and reviewing, the apparatus and method for characterizing the impact resistance of semiconductor packages provided by the embodiments of this disclosure can accurately control the collision posture of a mobile terminal, simulate the process of multiple collisions during a drop, and automatically reset the mobile terminal after the test, providing a feasible solution for quantitatively evaluating the impact resistance of semiconductor packages included in a mobile terminal.

[0068] While embodiments of the present disclosure have been shown and described herein, it will be apparent to those skilled in the art that various modifications and variations may be made without departing from the spirit and scope of the disclosure as defined by the claims.

Claims

1. An apparatus for characterizing the impact resistance of a semiconductor package, comprising: A mobile terminal, including a semiconductor package, wherein the periphery of the mobile terminal has a connecting portion; A fixing unit is disposed above the mobile terminal; A flexible unit is connected between the fixed unit and the connection portion of the mobile terminal so that the mobile terminal is suspended when stationary; An impact unit is disposed below the mobile terminal; The driving unit is configured to drive the impact unit vertically, causing the impact unit to strike the mobile terminal at a certain speed. The flexible unit is configured to adjust the suspension posture of the mobile terminal by changing the first connection position with the fixed unit and the second connection position with the connection part of the mobile terminal, thereby setting the collision posture when the mobile terminal collides with the impact unit.

2. The apparatus according to claim 1, wherein, The connecting part includes multiple connecting components respectively disposed on the top, bottom and opposite sides of the mobile terminal.

3. The apparatus according to claim 2, wherein, The fixing unit has a rod-shaped shape that extends horizontally.

4. The apparatus according to claim 3, wherein, The flexible unit includes multiple stretchable elements with a strip shape. One end of each of the plurality of retractable elements is fixedly disposed on one of the plurality of connecting members to define the second connection position, and The other end of each of the plurality of retractable elements is movably disposed on the fixed unit to define the first connection position.

5. The apparatus according to claim 1, wherein, The impact unit has a flat plate shape.

6. The apparatus according to claim 5, wherein, The collision posture is defined by the angle between the mobile terminal and the impact unit at the time of the collision.

7. The apparatus according to claim 1, wherein, The drive unit is configured to drive the impact unit to stop moving after the first collision.

8. The apparatus according to claim 7, wherein, The flexible unit is configured to cause the mobile terminal to bounce upwards after the first collision, so that the mobile terminal will collide with the stationary impact unit a second or more times under the action of gravity.

9. The apparatus according to claim 1, wherein, The driving unit is configured to drive the impact unit to move up and down at a certain speed, thereby causing multiple collisions with the mobile terminal.

10. The apparatus according to claim 1, wherein, The flexible unit is configured to automatically reset the mobile terminal after the test is completed.

11. A method for characterizing the impact resistance of a semiconductor package, comprising: The flexible unit is connected to the mobile terminal at the second connection position. The mobile terminal includes a semiconductor package and has a connection part on its periphery. The connection part is disposed at the second connection position. The flexible unit is connected to the fixed unit at the first connection position, and the flexible unit is connected between the fixed unit and the connection part of the mobile terminal so that the mobile terminal is in a suspended state when it is stationary. The suspension posture of the mobile terminal is adjusted by changing the first connection position and the second connection position, so as to set the collision posture when the mobile terminal collides with the impact unit. An impact unit located below the mobile terminal is driven vertically by a drive unit, causing the impact unit to strike the mobile terminal at a certain speed.

12. The method according to claim 11, wherein, The connecting part includes multiple connecting components respectively disposed on the top, bottom and opposite sides of the mobile terminal.

13. The method according to claim 12, wherein, The fixing unit has a rod-shaped shape that extends horizontally.

14. The method according to claim 13, wherein, The flexible unit includes multiple stretchable elements with a strip shape. The step of connecting the flexible unit to the mobile terminal further includes: fixing one end of each of the plurality of retractable elements to one of the plurality of connecting members to define the second connection position, and The step of connecting the flexible unit to the fixed unit further includes: movably disposing the other end of each of the plurality of retractable elements on the fixed unit to define the first connection position.

15. The method according to claim 11, wherein, The impact unit has a flat plate shape.

16. The method according to claim 15, wherein, The collision posture is defined by the angle between the mobile terminal and the impact unit at the time of the collision.

17. The method according to claim 11, wherein, The driving unit drives the impact unit to stop moving after the first collision.

18. The method according to claim 17, wherein, After the first collision, the flexible unit causes the mobile terminal to bounce upwards, so that the mobile terminal, under the action of gravity, collides with the stationary impact unit a second or more times.

19. The method according to claim 11, wherein, The driving unit drives the impact unit to move up and down at a certain speed, thereby causing multiple collisions with the mobile terminal.

20. The method according to claim 11, wherein, The flexible unit automatically resets the mobile terminal after the test is completed.

Images