A method for manufacturing an anti-shake assembly

Abstract

The embodiment of the application discloses a preparation method of an anti-shake assembly, comprising the following steps: providing a substrate; the substrate comprises a first carrier sheet and a support layer which are arranged in a stack; preparing a wiring structure on a first surface of the support layer; bonding a second carrier sheet on a side of the wiring structure away from the substrate, and removing the first carrier sheet to expose a second surface of the support layer; the second surface is arranged opposite to the first surface; patterning the support layer to obtain a support structure; the support structure covers a projection of the wiring structure on a plane where the second carrier sheet is located; and removing the second carrier sheet to expose the wiring structure. By using the technical scheme, the anti-shake assembly with a relatively thin thickness can be prepared, so that the electrical performance and heat dissipation performance of the anti-shake assembly can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a method for preparing an image stabilization component. Background Technology

[0002] Image stabilization components are widely used in smartphones and other electronic devices. Taking optical image stabilization (OIS) as an example, OIS is a technology that uses fine-tuning of optical elements to counteract camera shake. It can provide clearer and more stable images, thereby solving the problem of camera shake when shooting handheld.

[0003] At present, due to the rapid development of portable devices, the consumer market has put forward higher requirements for the overall thickness and performance of devices. Due to the need for packaging size and assembly space, the demand for ultra-thin packaging is relatively strong.

[0004] Therefore, how to achieve a thinner design for optical image stabilization components while meeting the performance requirements of optical image stabilization devices has become an urgent problem to be solved. Summary of the Invention

[0005] This invention provides a method for preparing a stabilization component, thereby obtaining a thinner stabilization component and improving its electrical and heat dissipation performance.

[0006] This invention provides a method for preparing an image stabilization component, comprising:

[0007] A substrate is provided; the substrate includes a first carrier sheet and a support layer stacked together.

[0008] A wiring structure is fabricated on the first surface of the support layer;

[0009] A second carrier sheet is bonded to the side of the wiring structure away from the substrate, and the first carrier sheet is removed to expose a second surface of the support layer; the second surface is disposed opposite to the first surface.

[0010] The support layer is patterned to obtain a support structure; the orthographic projection of the support structure onto the plane where the second carrier sheet is located covers the orthographic projection of the wiring structure onto the plane where the second carrier sheet is located.

[0011] Remove the second carrier piece to expose the wiring structure.

[0012] Optionally, the support layer is patterned to obtain a support structure, including:

[0013] A photoresist is fabricated on the side of the support layer away from the second carrier sheet, and the photoresist overlaps with the wiring structure;

[0014] The support layer is etched to obtain the support structure.

[0015] Optionally, a wiring structure is fabricated on the first surface of the support layer, including:

[0016] A first insulating layer is prepared on one side of the support layer;

[0017] A seed structure is prepared on the side of the first insulating layer away from the supporting layer;

[0018] A wiring structure is prepared on the side of the seed structure away from the support layer, and the wiring structure is in contact with the seed structure.

[0019] Optionally, before preparing the seed structure on the side of the first insulating layer away from the support layer, the method further includes:

[0020] The first insulating layer is patterned to form at least one cutout, the cutout exposing the support layer;

[0021] A seed structure is prepared on the side of the first insulating layer away from the supporting layer, including:

[0022] A seed structure is prepared at least on the surface of the hollow portion, and the seed structure is in contact with the support layer.

[0023] Optionally, a seed structure is prepared at least on the surface of the hollowed-out portion, including:

[0024] A seed layer is prepared on the side of the first insulating layer away from the support layer;

[0025] The seed layer is patterned to obtain the seed structure.

[0026] Optionally, after fabricating the wiring structure on the first surface of the support layer, the method further includes:

[0027] A second insulating layer is prepared on the side of the wiring structure away from the support layer, the second insulating layer exposing at least a portion of the wiring structure.

[0028] Optionally, after removing the second carrier piece to expose the wiring structure, the method further includes:

[0029] A conductive structure is prepared on one side of the wiring structure, and the conductive structure is electrically connected to the wiring structure.

[0030] Optionally, the conductive structure is at least partially embedded within the wiring structure; or, the conductive structure is located on the side of the wiring structure away from the supporting structure.

[0031] Optionally, after patterning the support layer to obtain the support structure, the method further includes:

[0032] A protective layer is prepared on the side of the support structure away from the wiring structure.

[0033] Optionally, a substrate may be provided, including:

[0034] A master substrate is provided; the master substrate includes a first carrier sheet master and multiple support layers; the first carrier sheet master and the support layers are stacked together.

[0035] A second carrier sheet is bonded to the side of the wiring structure away from the substrate, and the first carrier sheet is removed to expose the second surface of the support layer, including;

[0036] A second carrier plate is bonded to the side of the wiring structure away from the master plate substrate, and the first carrier plate is removed to expose the second surface of the support layer.

[0037] Removing the second carrier piece to expose the wiring structure includes:

[0038] The second carrier plate motherboard is cut along the cutting line to obtain multiple anti-shake components to be removed;

[0039] Remove the second carrier plate master from the image stabilization component to be removed to obtain a plurality of image stabilization components.

[0040] The technical solution of this invention involves preparing a wiring structure on the first surface of a support layer; bonding a second carrier sheet to the side of the wiring structure away from the substrate and removing the first carrier sheet to expose the second surface of the support layer; the second surface being disposed opposite to the first surface; patterning the support layer to obtain a support structure; the orthographic projection of the support structure onto the plane where the second carrier sheet is located covering the orthographic projection of the wiring structure onto the plane where the second carrier sheet is located; and removing the second carrier sheet to expose the wiring structure. This process allows for the fabrication of a stabilization component with a relatively thin thickness, which is beneficial for improving the electrical and heat dissipation performance of the stabilization component. Attached Figure Description

[0041] Figure 1 A schematic flowchart illustrating a method for preparing a stabilization component according to an embodiment of the present invention;

[0042] Figure 2 for Figure 1 A schematic diagram of the manufacturing process of a corresponding image stabilization component;

[0043] Figure 3 A schematic flowchart illustrating another method for preparing an image stabilization component according to an embodiment of the present invention;

[0044] Figure 4 This is a schematic diagram of the structure of a stabilization component provided in an embodiment of the present invention;

[0045] Figure 5This is a schematic diagram of another image stabilization component provided in an embodiment of the present invention;

[0046] Figure 6 A schematic flowchart illustrating another method for preparing an image stabilization component according to an embodiment of the present invention;

[0047] Figure 7 This is a top view schematic diagram of a stabilization component to be removed, provided in an embodiment of the present invention. Detailed Implementation

[0048] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0049] Figure 1 This is a schematic flowchart illustrating a method for preparing an image stabilization component according to an embodiment of the present invention. Figure 2 for Figure 1 A schematic diagram of the manufacturing process of a corresponding image stabilization component, such as... Figure 1 and Figure 2 As shown, the method for manufacturing this image stabilization component includes:

[0050] S101, Provide a substrate; the substrate includes a first carrier sheet and a support layer stacked together.

[0051] refer to Figure 2 In step a, the substrate 10 includes a first carrier sheet 101 and a support layer 102 stacked together. To meet the performance requirements of the image stabilization component, the support layer 102 can be made of a high-strength alloy substrate. For example, the alloy substrate used in the support layer 102 can have extremely high tensile strength, stable mechanical properties, and good conductivity. At the same time, the uniformity of the thickness of the support layer 102 needs to be maintained within ±2%, which helps to ensure the reliability and stability of the image stabilization component.

[0052] The method for preparing the anti-shake component provided in this embodiment of the invention can use an ultra-thin support layer 102. In order to ensure the stable operation of the support layer 102, a bonding material 103 can be used to bond the support layer 102 to the first carrier sheet 101 using a temporary bonding or patching method, so as to ensure the convenience of product operation. The first carrier sheet 101 can be made of materials such as glass substrate or silicon substrate.

[0053] S102. Fabricate a wiring structure on the first surface of the support layer.

[0054] For details, please refer to Figure 2In steps b, c, d, and e, the wiring structure 107 can be understood as a metal circuit, and an electroplating process can be used to prepare the wiring structure to complete the rewiring. Further, a first insulating layer 104 is prepared on the side of the support layer 102 away from the first carrier sheet 101. Then, a seed structure 105 and a wiring structure 107 are sequentially prepared on one side of the first insulating layer 104. Detailed steps for preparing the wiring structure on the first surface of the support layer will be described in subsequent embodiments.

[0055] S103. A second carrier sheet is bonded on the side of the wiring structure away from the substrate, and the first carrier sheet is removed to expose the second surface of the support layer; the second surface is disposed opposite to the first surface.

[0056] For details, please refer to Figure 2 In steps f and g, a second carrier 108 is bonded to the side of the wiring structure 107 away from the substrate 10 to transfer the wiring structure 107. It is understood that the second carrier 108 can be temporarily bonded using bonding material 103. The first carrier 101 can be removed by a debonding process, which exposes the second surface of the support layer 102.

[0057] S104. The patterned support layer obtains the support structure; the orthographic projection of the support structure onto the plane of the second carrier sheet covers the orthographic projection of the wiring structure onto the plane of the second carrier sheet.

[0058] For details, please refer to Figure 2 In steps h and i, photoresist 106 is laid on the second surface of the support layer 102. For example, the photoresist 106 can be laid by spin coating, printing, or spraying. It is understood that the photoresist 106 has strong corrosion resistance and good adhesion to the support layer 102.

[0059] Furthermore, the desired pattern is prepared on the support layer 102 by exposure and development. The non-photoresist area on the second surface of the support layer 102 is etched and hollowed out by using an etching solution. The remaining photoresist is removed by a special descaling solution, thus completing the patterning of the support layer 102 and obtaining the support structure 1021.

[0060] Specifically, the support structure 1021 serves as the support arm of the image stabilization component, playing a load-bearing role. The orthographic projection of the support structure 1021 onto the plane where the second support plate 108 is located covers the orthographic projection of the wiring structure 107 onto the plane where the second support plate 108 is located. This can improve the reliability of the wiring structure 107 and help realize the function of the image stabilization component.

[0061] S105. Remove the second carrier piece to expose the wiring structure.

[0062] For details, please refer toFigure 2 In steps h and j, the second carrier sheet 108 is removed using a debonding process to expose the wiring structure 107, thus obtaining the anti-shake component.

[0063] The method for fabricating a stabilization component provided in this invention involves: fabricating a wiring structure on the first surface of a support layer; bonding a second carrier sheet to the side of the wiring structure away from the substrate and removing the first carrier sheet to expose the second surface of the support layer; the second surface being disposed opposite to the first surface; patterning the support layer to obtain a support structure; the orthographic projection of the support structure onto the plane where the second carrier sheet is located covering the orthographic projection of the wiring structure onto the plane where the second carrier sheet is located; and removing the second carrier sheet to expose the wiring structure. This method allows for the fabrication of a stabilization component with a relatively thin thickness, which is beneficial for improving the electrical and heat dissipation performance of the stabilization component.

[0064] Optional, Figure 3 This is a schematic flowchart illustrating another method for preparing an image stabilization component according to an embodiment of the present invention. Figure 3 Based on the above embodiments, the operation of fabricating a wiring structure on the first surface of the support layer will be described in detail, referring to... Figure 2 and Figure 3 The method for manufacturing this image stabilization component includes:

[0065] S201, Provide a substrate; the substrate includes a first carrier sheet and a support layer stacked together.

[0066] For details, please refer to Figure 2 In step a, the first carrier sheet 101 and the support layer 102 are bonded together by bonding material 103 to form a substrate 10.

[0067] S202. Prepare a first insulating layer on one side of the support layer.

[0068] For details, please refer to Figure 2 In step b, a first insulating layer 104 is prepared on one side of the support layer 102. The first insulating layer 104 can be made of polyimide material with good insulation effect.

[0069] Furthermore, the first insulating layer 104 is patterned to form at least one cutout portion 1041, which exposes the support layer 102.

[0070] It should be noted that multiple hollow portions 1041 with different patterns can be formed by patterning the first insulating layer 104. The embodiments of the present invention do not specifically limit the number and shape of the hollow portions 1041.

[0071] S203. Prepare a seed structure on the side of the first insulating layer away from the support layer.

[0072] Specifically, as one possible implementation method, please refer to [reference]. Figure 2 In step c, the seed structure 105 can be directly prepared on the side of the first insulating layer 104 away from the support layer 102. Further, a seed layer is prepared on the side of the first insulating layer 104 away from the support layer 102; the seed layer is patterned to obtain the seed structure 105. That is, the entire seed layer can be prepared by metal sputtering, and the seed structure 105 can be formed by etching the seed layer through a patterning process.

[0073] As another feasible implementation method, please refer to Figure 2 In step c, when the first insulating layer 104 includes a hollow portion 1041, a seed structure 105 is prepared at least on the surface of the hollow portion 1041, and the seed structure 105 is in contact with the support layer 102.

[0074] S204. Prepare a wiring structure on the side of the seed structure away from the support layer, and make contact with the seed structure.

[0075] For details, please refer to Figure 2 In step d, a photoresist 106 is fabricated on the side of the seed structure 105 away from the support layer 102 to reserve an area for fabricating the wiring structure 107. Then, the wiring structure 107 is fabricated in the reserved area, i.e., the area not covered by the photoresist 106. The wiring structure 107 can be understood as a metal circuit, i.e., the seed structure 105 can be thickened by electroplating metal.

[0076] As one feasible implementation, when the first insulating layer 104 is not patterned, metal can be directly electroplated on the upper surface of the seed structure 105 to form a wiring structure 107. As another feasible implementation, when the first insulating layer 104 is patterned to form a cutout portion 1041, a seed structure 107 is prepared on the surface of the cutout portion 1041, and metal is electroplated on the upper surface of the seed structure 107 to form a wiring structure 107.

[0077] Further reference Figure 2 In step e, after the wiring structure 107 is prepared, the photoresist 106 is removed using a special adhesive remover, and an etching solution is used to etch the entire surface of the wiring structure 107 away from the support layer 102. By using the different thickness differences on the surface of the support layer 102, the areas that have not been thickened by electroplating are etched away, and the rewiring is completed, which prepares for the subsequent circuit connection between the image stabilization component and the photosensitive chip.

[0078] Optional, continue to refer to Figure 2After fabricating the wiring structure 107 on the first surface of the support layer 102, the method further includes: fabricating a second insulating layer on the side of the wiring structure 107 away from the support layer 102, wherein the second insulating layer exposes at least a portion of the wiring structure 107. This allows the wiring structure 107 to be protected by the second insulating layer, and at least a portion of the wiring structure 107 to be exposed by the second insulating layer, so as to fabricate a conductive structure on the surface of the wiring structure 107 and make electrical connections with other components through the conductive structure to realize the function of the anti-shake device.

[0079] S205. A second carrier sheet is bonded to the side of the wiring structure away from the substrate, and the first carrier sheet is removed to expose the second surface of the support layer; the second surface is disposed opposite to the first surface.

[0080] For details, please refer to Figure 2 In step f, the second carrier piece 108 is bonded to the side of the wiring structure 107 away from the substrate 10, as shown in reference. Figure 2 In step g, the first carrier piece 101 is removed to expose the second surface of the support layer 102; the second surface is disposed opposite to the first surface.

[0081] S206. A patterned support layer is used to obtain a support structure; the orthographic projection of the support structure onto the plane of the second carrier sheet covers the orthographic projection of the wiring structure onto the plane of the second carrier sheet.

[0082] For details, please refer to Figure 2 In steps h and i, a photoresist 106 is prepared on the side of the support layer 102 away from the second carrier sheet 108, i.e., a photoresist 106 is prepared on the second surface of the support layer 102. The photoresist 106 overlaps with the wiring structure 107, which ensures that the support structure 1021 obtained after patterning the support layer 102 covers the wiring structure 107, thereby ensuring the stability of the wiring structure 107. The support layer 102 is etched to obtain the support structure 1021, i.e., the support layer 102 is patterned by exposure and development to obtain the support structure 1021. The orthographic projection of the support structure 1021 onto the plane where the second carrier sheet 108 is located covers the orthographic projection of the wiring structure 107 onto the plane where the second carrier sheet 108 is located. This improves the reliability of the wiring structure 107 and is beneficial to realizing the function of the image stabilization component.

[0083] Optionally, after the patterned support layer obtains the support structure, it also includes: preparing a protective layer on the side of the support structure away from the wiring structure, thereby improving the service life and anti-oxidation performance of the support structure and helping to ensure the performance of the anti-shake component.

[0084] For example, the protective layer could be a nickel-gold layer.

[0085] S207. Remove the second carrier piece to expose the wiring structure.

[0086] For details, please refer to Figure 2 In step j, the second carrier piece 108 is removed to expose the wiring structure 107, and the anti-shake component can be obtained.

[0087] It is understood that two different wiring structures of anti-shake components can be obtained in step j. It should be noted that multiple different anti-shake components can be obtained through the above steps a-j. The embodiments of the present invention do not specifically limit the number of anti-shake components obtained in the end.

[0088] Optional, Figure 4 This is a schematic diagram of the structure of a stabilization component provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of another image stabilization component provided in an embodiment of the present invention, as shown below. Figure 4 and Figure 5 As shown, after removing the second carrier piece to expose the wiring structure, the method further includes: preparing a conductive structure 109 on one side of the wiring structure 107, wherein the conductive structure 109 is electrically connected to the wiring structure 107.

[0089] As one possible implementation method, please refer to [reference]. Figure 4 A conductive structure 109 is prepared on one side of the wiring structure 107. The conductive structure can be a solder ball 1091. The solder ball 1091 is electrically connected to the wiring structure 107. Through the solder ball 1091, electrical connection with other components can be achieved, thereby realizing the function of the anti-shake device.

[0090] As another feasible implementation method, please refer to Figure 5 A conductive structure 109 is prepared on one side of the wiring structure 107. The conductive structure 109 can be a metal bump 1092. The metal bump 1092 is electrically connected to the wiring structure 107. Through the metal bump 1092, it can be electrically connected to other components, thereby realizing the function of the anti-shake device.

[0091] Further reference Figure 4 and Figure 5 The conductive structure 109 is at least partially embedded within the wiring structure 107; or, the conductive structure 109 is located on the side of the wiring structure 107 away from the support structure 1021. That is, the conductive structure 109 can be as follows: Figure 4 and Figure 5 The solder ball 1091 or metal bump 1092 shown can also be a metal recess in the conductive structure 109. That is, the metal recess can be partially embedded in the wiring structure 107. In this way, on the one hand, the conductive structure 109 can be designed in a variety of ways, and on the other hand, it can be electrically connected to the component through the conductive structure 109 to realize the function of the anti-shake device.

[0092] For example, the image stabilization device can be an optical image stabilization device, that is, the image stabilization component can be electrically connected to the photosensitive chip through a conductive structure.

[0093] Understandably, continue to refer to Figure 4 and Figure 5 After removing the second carrier piece to expose the wiring structure 107, a protective layer 110 can be prepared on the side of the wiring structure 107 away from the support structure 1021. Alternatively, after obtaining the support structure 1021 by patterning the support layer, a protective layer 110 can be prepared on the side of the support structure 1021 away from the wiring structure 107. This can extend the service life of the support structure 1021 and the wiring structure 107 through the protective layer, thereby ensuring the working performance and reliability of the anti-shake component.

[0094] The method for preparing the image stabilization component provided in this embodiment of the invention involves patterning a first insulating layer to form at least one hollow portion, preparing a seed structure on at least the surface of the hollow portion, and preparing a wiring structure on the surface of the seed structure. This method can achieve rewiring of the image stabilization component and ultimately obtain various different forms of image stabilization components.

[0095] Optional, Figure 6 This is a schematic flowchart illustrating another method for preparing an image stabilization component according to an embodiment of the present invention. Figure 6 Based on the above embodiments, the operations of providing a substrate, bonding a second carrier sheet to the side of the wiring structure away from the substrate, removing the first carrier sheet to expose the second surface of the support layer, and removing the second carrier sheet to expose the wiring structure will be described in detail, such as... Figure 6 As shown, the method for manufacturing this image stabilization component includes:

[0096] S301. Provide a master substrate; the master substrate includes a first carrier sheet master and multiple support layers; the first carrier sheet master and the support layers are stacked.

[0097] Specifically, the master substrate can be understood as the entire substrate before cutting, and the first carrier sheet master can be understood as the entire first carrier sheet before removal. The master substrate includes multiple support layers to facilitate the fabrication of multiple image stabilization components.

[0098] S302. Fabricate a wiring structure on the first surface of the support layer.

[0099] Specifically, wiring structures of different shapes can be prepared on the first surface of each support layer. That is, multiple cutouts can be formed by patterning the first insulating layer, and the wiring structure at least covers the cutouts.

[0100] S303. Bond the second carrier sheet to the side of the wiring structure away from the mother substrate and remove the first carrier sheet mother to expose the second surface of the support layer.

[0101] Specifically, the second carrier sheet is bonded to the side of the wiring structure away from the mother substrate, which allows the wiring structure to be transferred. The first carrier sheet mother substrate is then removed by debonding, exposing the second surface of the support layer.

[0102] S304. The patterned support layer forms a support structure; the orthographic projection of the support structure onto the plane of the second carrier sheet covers the orthographic projection of the wiring structure onto the plane of the second carrier sheet.

[0103] Specifically, photoresist is laid on the second surface of the support layer. For example, the photoresist can be laid by spin coating, printing, or spraying. It is understood that photoresist has strong corrosion resistance and good adhesion to the support layer.

[0104] Furthermore, the desired pattern is prepared on the support layer by exposure and development. A etching solution is used to etch and hollow out the non-photoresist area on the second surface of the support layer, and a special descaling solution is used to remove the remaining photoresist, thus completing the patterning of the support layer and obtaining the support structure.

[0105] S305. Cut the second carrier plate motherboard along the cutting line to obtain multiple anti-shake components to be removed.

[0106] Specifically, Figure 7 This is a top view schematic diagram of a stabilization component to be removed, provided in an embodiment of the present invention, as shown below. Figure 7 As shown, the image stabilization component to be removed can be understood as the image stabilization component that has not been removed from the second carrier plate master. Figure 7 The intersection of the cutting line M in the diagram represents a debounce component to be removed. Figure 7 Only four anti-shake components to be removed are shown as an example. It is understood that the number of anti-shake components to be removed in this embodiment of the invention is not specifically limited. The second carrier plate mother plate is cut along the cutting line M and then removed. This can prevent phenomena such as cracking due to cutting stress during the cutting process, and further ensure that even if a thin support layer is used, cracking can be prevented during the cutting process, thereby achieving a thinner design for the anti-shake components.

[0107] S306. Remove the second carrier plate master from the image stabilization component to be removed to obtain multiple image stabilization components.

[0108] Specifically, by using a debonding process to remove the second carrier mother plate in the anti-shake component to be removed, multiple anti-shake components can be obtained. In this way, it is not necessary to make multiple frame units for each type of anti-shake component. Multiple anti-shake components of different forms can be obtained at the same time, thereby reducing packaging costs. At the same time, it can avoid the problems of lead frame and substrate misalignment and complicated packaging process that occur when making multiple frame units for each type of anti-shake component in the prior art.

[0109] The image stabilization component fabrication method provided in this invention utilizes a wafer-level packaging process, employing a master substrate on which wiring structures and support structures of different shapes are fabricated. This allows for the generation of multiple image stabilization components after dicing, simplifying the production process and increasing packaging efficiency. Furthermore, by employing a second carrier master substrate, the wiring structure can be transferred, preventing chipping during dicing along the dicing line and thus improving the yield rate.

[0110] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for preparing an image stabilization component, characterized in that, include: Provide a base; The substrate includes a first load-bearing sheet and a support layer stacked together; A wiring structure is fabricated on the first surface of the support layer; A second carrier sheet is bonded to the side of the wiring structure away from the substrate, and the first carrier sheet is removed to expose the second surface of the support layer; The second surface is disposed opposite to the first surface; Patterning the support layer yields a support structure; The orthographic projection of the support structure onto the plane where the second carrier plate is located covers the orthographic projection of the wiring structure onto the plane where the second carrier plate is located; Remove the second carrier piece to expose the wiring structure.

2. The preparation method according to claim 1, characterized in that, Patterning the support layer yields a support structure, including: A photoresist is fabricated on the side of the support layer away from the second carrier sheet, and the photoresist overlaps with the wiring structure; The support layer is etched to obtain the support structure.

3. The preparation method according to claim 1, characterized in that, Fabricating a wiring structure on the first surface of the support layer includes: A first insulating layer is prepared on one side of the support layer; A seed structure is prepared on the side of the first insulating layer away from the supporting layer; A wiring structure is prepared on the side of the seed structure away from the support layer, and the wiring structure is in contact with the seed structure.

4. The preparation method according to claim 3, characterized in that, Before preparing the seed structure on the side of the first insulating layer away from the supporting layer, the process further includes: The first insulating layer is patterned to form at least one cutout, the cutout exposing the support layer; A seed structure is prepared on the side of the first insulating layer away from the supporting layer, including: A seed structure is prepared at least on the surface of the hollow portion, and the seed structure is in contact with the support layer.

5. The preparation method according to claim 4, characterized in that, At least on the surface of the hollowed-out portion, a seed structure is prepared, including: A seed layer is prepared on the side of the first insulating layer away from the support layer; The seed layer is patterned to obtain the seed structure.

6. The preparation method according to claim 1, characterized in that, After fabricating the wiring structure on the first surface of the support layer, the method further includes: A second insulating layer is prepared on the side of the wiring structure away from the support layer, the second insulating layer exposing at least a portion of the wiring structure.

7. The preparation method according to claim 1, characterized in that, After removing the second carrier piece to expose the wiring structure, the method further includes: A conductive structure is prepared on one side of the wiring structure, and the conductive structure is electrically connected to the wiring structure.

8. The preparation method according to claim 7, characterized in that, The conductive structure is at least partially embedded within the wiring structure; or the conductive structure is located on the side of the wiring structure away from the supporting structure.

9. The preparation method according to claim 1, characterized in that, After patterning the support layer to obtain the support structure, the method further includes: A protective layer is prepared on the side of the support structure away from the wiring structure.

10. The preparation method according to claim 1, characterized in that, Provide a substrate, including: A master substrate is provided; the master substrate includes a first carrier sheet master and multiple support layers; the first carrier sheet master and the support layers are stacked together. A second carrier sheet is bonded to the side of the wiring structure away from the substrate, and the first carrier sheet is removed to expose the second surface of the support layer, including; A second carrier plate is bonded to the side of the wiring structure away from the master plate substrate, and the first carrier plate is removed to expose the second surface of the support layer. Removing the second carrier piece to expose the wiring structure includes: The second carrier plate motherboard is cut along the cutting line to obtain multiple anti-shake components to be removed; Remove the second carrier plate master from the image stabilization component to be removed to obtain a plurality of image stabilization components.

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