terminal equipment

CN117750666BActive Publication Date: 2026-08-14REALME MOBILE TELECOMM SHENZHEN CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-09-14
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

[0003]本申请实施例提供一种终端设备,以解决中框和盖板的点胶过程中容易发生溢胶现象的问题

Benefits of technology

[0008]上述终端设备,在盖板的第一表面上设置支撑结构以对盖板起到支撑作用,使得中框无需额外设置结构来支撑盖板,有利于简化中框的设置工序,降低终端设备的制造成本;同时,通过设置支撑结构使得点胶空间形成于侧壁和支撑结构之间,使得点胶时胶水在盖板、支撑结构以及侧壁之间有足够的延伸空间,能够有效避免溢胶现象;另外,将点胶空间限制于侧壁和支撑结构之间,有利于胶水充分填充盖板、支撑结构以及侧壁之间的间隙,从而有利于提升中框和盖板之间的密封效果,进而有利于提升终端设备的防水性能。

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Abstract

This application relates to a terminal device. The terminal device includes a middle frame, a cover plate, and a support structure. The middle frame has side walls and a bottom wall, which together form a step. The cover plate has a first surface and a second surface opposite to the side walls, with a portion of the first surface opposite the bottom wall. The support structure is disposed on the first surface and at least partially abuts against the bottom wall, and a dispensing space is formed between the side walls, the bottom wall, and the support structure. In the above-described terminal device, the support structure can replace the protruding structure on the middle frame to support the cover plate, while defining the dispensing space. This simplifies the middle frame installation process, prevents glue overflow during dispensing, and improves the bonding strength and sealing performance between the middle frame and the cover plate.
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Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a terminal device. Background Technology

[0002] Terminal devices typically include a mid-frame and a cover plate. The mid-frame provides structural support, while the cover plate protects the internal components and serves as a display window. During assembly, the mid-frame and cover plate are usually bonded together using adhesive. However, current terminal devices are prone to adhesive overflow during the adhesive application process for the mid-frame and cover plate. Summary of the Invention

[0003] This application provides a terminal device to solve the problem of glue overflow that easily occurs during the dispensing process of the middle frame and cover plate.

[0004] A terminal device, comprising:

[0005] The middle frame has side walls and a bottom wall, the side walls and the bottom wall together forming a step;

[0006] A cover plate having a first surface and a second surface opposite the sidewall, a portion of the first surface opposite the bottom wall; and,

[0007] A support structure is disposed on the first surface and at least partially abuts against the bottom wall, and a dispensing space is formed between the side wall, the bottom wall and the support structure.

[0008] The aforementioned terminal device features a support structure on the first surface of the cover plate to support it, eliminating the need for an additional structure in the middle frame to support the cover plate. This simplifies the middle frame installation process and reduces the manufacturing cost of the terminal device. Simultaneously, the support structure creates a dispensing space between the sidewall and the support structure, allowing sufficient space for the adhesive to extend between the cover plate, support structure, and sidewall during dispensing, effectively preventing adhesive overflow. Furthermore, confining the dispensing space to the sidewall and support structure ensures that the adhesive fully fills the gaps between the cover plate, support structure, and sidewall, thereby improving the sealing effect between the middle frame and the cover plate and ultimately enhancing the waterproof performance of the terminal device. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 These are schematic diagrams of the terminal device in some embodiments;

[0011] Figure 2 This is a cross-sectional schematic diagram showing the location where the terminal device has a support structure in some embodiments;

[0012] Figure 3 This is a cross-sectional view of a location in some embodiments where the terminal device does not have a support structure;

[0013] Figure 4 This is a cross-sectional view of the middle frame in some embodiments.

[0014] Figure label:

[0015] 10. Terminal equipment; 11. Mid-frame; 111. Step; 1111. Side wall; 1112. Adhesive tank; 1113. Bottom surface; 1114. Side; 1115. Bottom wall; 12. Cover plate; 121. First surface; 122. Second surface; 13. Support structure; 14. Adhesive dispensing space; 15. Adhesive solidification; 16. Display component. Detailed Implementation

[0016] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0017] As used herein, "terminal equipment" refers to, but is not limited to, devices capable of receiving and / or transmitting communication signals connected via any one or more of the following connection methods:

[0018] (1) Via wired connection, such as via Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, or direct cable connection;

[0019] (2) Via wireless interface, such as cellular network, wireless local area network (WLAN), digital television network such as DVB-H network, satellite network, AM-FM broadcast transmitter.

[0020] A terminal device configured to communicate via a wireless interface can be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0021] (1) Satellite phone or cellular phone;

[0022] (2) A personal communications system (PCS) terminal that can combine cellular radio telephone with data processing, fax and data communication capabilities;

[0023] (3) Radio telephone, pager, Internet / intranet access, web browser, notepad, calendar, personal digital assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0024] (4) Conventional above-knee and / or palm-sized receivers;

[0025] (5) Conventional knee-mounted and / or handheld wireless telephone transceivers, etc.

[0026] In traditional terminal devices, spaced protrusions are typically installed on the bottom wall of the mid-frame step to support the cover plate. The gap formed by the protrusions and the bottom wall on the side opposite to the mid-frame step serves as the adhesive dispensing space. This design requires additional machining processes to create the protrusions, increasing the mid-frame's manufacturing time and costs. Furthermore, the adhesive dispensing space is confined to the gap at the bottom wall edge, limiting adhesive extension and making it prone to overflowing into the bottom wall. Additionally, the spaced protrusions hinder adhesive extension, making it difficult for the adhesive to cover the gap between the mid-frame and the cover plate, thus reducing the seal between them and affecting the terminal device's waterproof performance.

[0027] To address the aforementioned issues, this application provides a terminal device.

[0028] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the terminal device 10 in some embodiments. Figure 2This is a cross-sectional schematic diagram of the terminal device 10 in some embodiments. In some embodiments, the terminal device 10 includes a mid-frame 11, a cover plate 12, and a display component 16. The display component 16 can be a liquid crystal module, an LED module, or other module with display or light adjustment functions. The terminal device 10 is equipped with the display component 16 to realize the display function. The display component 16 and other components of the terminal device 10 can be housed in the mid-frame 11, which can support and protect the components inside the terminal device 10. The cover plate 12 can be placed inside the mid-frame 11 and can protect and shield the components inside the terminal device 10. The cover plate 12 can be a light-transmitting glass plate, and the light-emitting surface of the display component 16 can be opposite to the cover plate 12. In other words, the cover plate 12 can serve as a light-emitting window for the display component 16. Of course, in other embodiments, the cover plate 12 can also be the back cover of the terminal device 10, in which case the cover plate 12 is located on the side of the display component 16 away from the display surface.

[0029] Furthermore, in some embodiments, the middle frame 11 has a step 111, which is formed by a side wall 1111 and a bottom wall 1115. The cover plate 12 can be mounted on the bottom wall 1115 of the step 111. The step 111 can be understood as a notch on the inner edge of the middle frame 11. The shape of the step 111 is not limited and can be set according to the design of the terminal device 10 and the shape of the cover plate 12. For example, in some embodiments, the side wall 1111 and the bottom wall 1115 can be perpendicular to each other, then the middle frame 11 has a right-angled step 111. Of course, the side wall 1111 can also be inclined to the bottom wall 1115.

[0030] In some embodiments, the cover plate 12 has a first surface 121 and a second surface 122 opposite to the sidewall 1111. A portion of the first surface 121 is opposite to the bottom wall 1115; for example, the edge region of the first surface 121 is opposite to the bottom wall 1115. The terminal device 10 may also include a support structure 13 disposed on the first surface 121. For example, the support structure 13 is integrally formed with the cover plate 12, or it is disposed on the first surface 121 of the cover plate 12 by processes such as adhesive bonding or printing. The support structure 13 is fixed relative to the cover plate 12. In some embodiments, a dispensing space 14 is formed between the sidewall 1111, the bottom wall 1115, and the support structure 13. (Reference) Figure 2 As shown, Figure 2This is a cross-sectional view of the cover plate 12 and the middle frame 11 of the terminal device 10 after adhesive application. The solidified adhesive 15 is located between the side wall 1111, the bottom wall 1115, and the support structure 13. Of course, the solidified adhesive 15 may also partially extend between the second surface 122 and the side wall 1111. It is understood that in this application, the cover plate 12 is bonded to the middle frame 11 by applying adhesive through the adhesive application space 14. The cover plate 12 is mounted on the bottom wall 1115 of the step 111 of the middle frame 11, and the support structure 13 is at least partially in contact with the bottom wall 1115.

[0031] The aforementioned terminal device 10 has a support structure 13 provided on the first surface 121 of the cover plate 12. When the cover plate 12 is mounted on the bottom wall 1115 of the step 111 of the middle frame 11, the support structure 13 can support the cover plate 12, preventing the cover plate 12 from colliding with the middle frame 11 and being damaged. Furthermore, the middle frame 11 does not need to form an additional structure to support the cover plate 12, which simplifies the processing steps of the middle frame 11, saves processing time and costs, and thus helps reduce the manufacturing cost of the terminal device 10. Simultaneously, the support structure 13 defines the dispensing space 14, allowing the dispensing space 14 to be formed between the side wall 1111 and the support structure 13. This ensures that the adhesive extends sufficiently along the cover plate 12, the support structure 13, and the side wall 1111 during dispensing, effectively preventing adhesive overflow. In addition, the support structure 13 restricts the dispensing space 14 between the side wall 1111 and the support structure 13, which can limit the extension direction of the adhesive and allow the adhesive to fully fill the gap between the cover plate 12, the support structure 13 and the side wall 1111. This helps to improve the sealing effect of the adhesive curd 15 on the gap between the middle frame 11 and the cover plate 12, and thus helps to improve the waterproof performance of the terminal device 10.

[0032] It should be noted that the shape of the middle frame 11 and the shape of the cover plate 12 can be set according to the appearance and design requirements of the terminal device 10. The cover plate 12 may have multiple edges, and some or all of the edges of the cover plate 12 can be bonded to the middle frame 11 by adhesive application. Figure 1 and Figure 2The illustrated embodiment only shows the case where one edge of the cover plate 12 is adhered to the middle frame 11. For example, in some embodiments, the cover plate 12 may be generally square and have four edges. The cover plate 12 may then have four sequentially connected second surfaces 122. The steps 111 of the middle frame 11 are arranged around the edge of the cover plate 12. The steps 111 of the middle frame 11 may include four sequentially connected sidewalls 1111, each sidewall 1111 opposite to one of the second surfaces 122. The cover plate 12 may be glued to only two opposite edges of the middle frame 11, or all four edges may be glued to the middle frame 11. Correspondingly, the steps 111 of the middle frame 11 may have four sequentially connected bottom walls 1115, and the first surface 121 may have four sequentially connected edge regions. The four edge regions of the first surface 121 may have only two opposite edge regions with supporting structures 13, or all four edge regions may have supporting structures 13.

[0033] It is understood that in the edge region where the support structure 13 is provided on the first surface 121, the support structure 13 can cover the entire edge region. In some embodiments, the terminal device 10 may have multiple support structures 13, which are spaced apart in the edge region of the first surface 121. (See reference...) Figure 1 As shown, in some embodiments, four support structures 13 are provided on one edge region of the first surface 121, and the support structures 13 are spaced apart along the extending direction of the bottom wall 1115. The multiple spaced support structures 13 can also form an adhesive application area between adjacent support structures 13. In other words, the adhesive can extend into the space between the support structures 13 and bond the first surface 121 to the bottom wall 1115. This helps to increase the adhesion area between the adhesive solidified product 15 and the cover plate 12 and the middle frame 11, thereby improving the connection strength between the cover plate 12 and the middle frame 11, as well as the sealing effect between the cover plate 12 and the middle frame 11.

[0034] Combination Figure 2 and Figure 3 As shown, Figure 2 This can be understood as a cross-sectional view of the location where the terminal device 10 is located and the supporting structure 13 is located. Figure 3 This can be understood as a cross-sectional view of the terminal device 10 where the support structure 13 is not present, such as a cross-sectional view of the gap between two adjacent support structures 13. Figure 2 and Figure 3 As can be seen, in the position where the first surface 121 is covered by the support structure 13, the glue solidified 15 is confined between the support structure 13 and the side wall 1111 by the support structure 13, while in the position where the first surface 121 is not covered by the support structure 13, the glue solidified 15 is partially located between the first surface 121 and the bottom wall 1115 to bond the first surface 121 and the bottom wall 1115 together.

[0035] Of course, the number of support structures 13 provided on a certain edge region of the first surface 121 is not limited, and can be designed according to the bonding requirements and the size of the cover plate 12. For example, three, five, six or other numbers of support structures 13 may be provided on one edge of the first surface 121. In some embodiments, the multiple support structures 13 can be evenly distributed along the extension direction of the bottom wall 1115, that is, the gap between two adjacent support structures 13 is equal. This is beneficial for providing uniform bonding force to the cover plate 12 and the middle frame 11, thereby improving the bonding strength and sealing performance.

[0036] The shape and arrangement of the middle frame 11 and the cover plate 12 are not limited. In some embodiments, the first surface 121 may be perpendicular to the second surface 122, the side wall 1111 may be perpendicular to the bottom wall 1115, the first surface 121 may be parallel to the bottom wall 1115, and the second surface 122 may be parallel to the side wall 1111, thereby adapting the shape of the cover plate 12 and the step 111 of the middle frame 11 to each other, and the cover plate 12 may be effectively mounted on the middle frame 11. In some embodiments, the side of the cover plate 12 opposite to the first surface 121 may protrude from the middle frame 11 or be flush with the middle frame 11, which may be set according to the appearance and design requirements of the terminal device 10.

[0037] Furthermore, the size of the support structure 13 is not limited, as long as it can effectively support the cover plate 12 and define the dispensing space 14. In some embodiments, the display component 16 is located inside the step 111 of the middle frame 11, and part of the support structure 13 abuts against the bottom wall 1115, while another part is located between the bottom wall 1115 and the display component 16. In other words, part of the support structure 13 is located between the first surface 121 and the bottom wall 1115 to support the cover plate 12, while the other part is located inside the step 111 and outside the display component 16. By increasing the size of the support structure 13, so that part of the support structure 13 is located outside the step 111, a larger protective area can be provided for the cover plate 12 during the assembly process, effectively preventing the cover plate 12 from being damaged by collision. At the same time, limiting the size of the support structure 13 so that the support structure 13 is located outside the display component 16 can also prevent the support structure 13 from scratching the display component 16 during the assembly process, thus preventing damage to the display component 16. It should be noted that in this application, the display component 16 is located inside the middle frame 11. Therefore, describing the inside of a component can be understood as the side of the component facing the display component 16, and describing the outside of a component can be understood as the side of the component facing away from the display component 16.

[0038] Furthermore, refer to Figure 1 and Figure 2As shown, in some embodiments, the dimension of the support structure 13 in the first direction is greater than or equal to 0.5 mm and less than or equal to 0.9 mm. For example, the dimension of the support structure 13 in the first direction can be 0.7 mm. The first direction is parallel to the first surface 121. Figure 1 The X-axis direction shown can be understood as the first direction. With this configuration, the dimension of the support structure 13 in the first direction will not be too small, reducing the manufacturing difficulty of the support structure 13 and preventing insufficient support from the support structure 13 for the improved performance. Simultaneously, the dimension of the support structure 13 in the first direction will not be too large, ensuring sufficient gaps between the support structures 13 for the glue curd 15 to fill, which is beneficial for improving the adhesion strength and sealing performance between the cover plate 12 and the middle frame 11. In some embodiments, the dimension of the support structure 13 in the second direction is greater than or equal to 0.3 mm and less than or equal to 0.7 mm; for example, the dimension of the support structure 13 in the second direction can be 0.7 mm. The second direction is perpendicular to the first direction, for example, Figure 1 The Y-axis direction shown can be understood as the second direction. With this setting, the size of the support structure 13 in the second direction will not be too small, which can also reduce the manufacturing difficulty of the support structure 13. At the same time, the size of the support structure 13 in the second direction will not be too large, which can effectively prevent the support structure 13 from scratching the display component 16 during assembly.

[0039] In some embodiments, the thickness of the support structure 13, i.e., the dimension of the support structure 13 in the direction perpendicular to the bottom wall 1115, is greater than or equal to 0.1 mm and less than or equal to 0.2 mm, for example, it can be 0.12 mm. This setting ensures that the thickness of the support structure 13 is not too small, which is beneficial for the manufacturing of the support structure 13, and also provides sufficient support for the cover plate 12. At the same time, the thickness of the support structure 13 is not too large, which is beneficial for compressing the size of the terminal device 10.

[0040] In some embodiments, the edge of the support structure 13 is flush with the second surface 122. (Referencing...) Figure 2 As shown, in some embodiments, the shortest distance between the edge of the support structure 13 and the second surface 122 is greater than or equal to 0.1 mm. In other words, there is a gap of at least 0.1 mm between the support structure 13 and the edge of the first surface 121. By leaving a gap at the edge of the first surface 121, the adhesive can extend to the space between the first surface 121 and the bottom wall 1115 located outside the support structure 13 during dispensing, thus bonding the cover plate 12 and the middle frame 11. This further increases the adhesive area of ​​the cover plate 12 and the middle frame 11, thereby improving the bonding strength and sealing performance of the cover plate 12 and the middle frame 11.

[0041] Of course, the material of the support structure 13 and the manner in which it is disposed on the first surface 121 are not limited, as long as it can effectively provide support for the cover plate 12 and define the adhesive dispensing space 14. In some embodiments, the support structure 13 can be a plastic sheet, for example, the material of the support structure 13 can be polyethylene terephthalate (PET). In this embodiment, the support structure 13 can be adhered to the first surface 121 by applying adhesive to the surface. In other embodiments, the support structure 13 is formed on the first surface 121 by screen printing or transfer printing. In this embodiment, the support structure 13 can be an ink layer on the first surface 121, for example, the material of the support structure 13 can be UV ink or epoxy ink. In some other embodiments, the support structure 13 may be formed by applying adhesive to the first surface 121. In this case, the support structure 13 is formed after the adhesive has cured on the first surface 121. In this application, the hardness of the adhesive used to form the support structure 13 is greater than or equal to Shore hardness D60, so that the support structure 13 formed after the adhesive has solidified has sufficient adhesion to the first surface 121 to prevent the support structure 13 from falling off the first surface 121. At the same time, the support structure 13 also has sufficient structural strength to support the cover plate 12.

[0042] See also Figure 2 and Figure 4In some embodiments, the sidewall 1111 has an adhesive receiving groove 1112, which is recessed relative to a portion of the second surface 122 and in a direction away from the cover plate 12. The surface of the adhesive receiving groove 1112 opposite to the cover plate 12 defines the bottom surface of the adhesive receiving groove 1112. The bottom surface 1113 of the adhesive receiving groove 1112 is connected to the bottom wall 1115 and is opposite to the support structure 13 and a portion of the second surface 122. In other words, the adhesive receiving groove 1112 is located on the sidewall 1111 near the bottom wall 1115. The adhesive reservoir 1112 also has a side surface 1114 that connects to the bottom surface 1113. It can be understood that by providing the adhesive reservoir 1112, when dispensing adhesive, the adhesive can fill the adhesive reservoir 1112 and adhere to both the bottom surface 1113 and the side surface 1114 of the adhesive reservoir 1112, thereby increasing the adhesion area between the adhesive solidified product 15 and the middle frame 11, and thus increasing the adhesion strength between the cover plate 12 and the middle frame 11. Furthermore, the glue-receiving groove 1112 is located on the side wall 1111 near the bottom wall 1115, which saves on the transition structure between the glue-receiving groove 1112 and the bottom wall 1115, and also simplifies the processing technology of the glue-receiving groove 1112. It also allows for a smoother transition of the glue between the side wall 1111 and the bottom wall 1115, thus enabling smooth coverage of the bottom surface 1113 and the bottom wall 1115, improving the filling effect of the glue solidified 15 between the cover plate 12 and the middle frame 11, and further improving the sealing performance between the cover plate 12 and the middle frame 11. Moreover, the design of the glue-receiving groove 1112 can also increase the dispensing space 14 between the cover plate 12 and the middle frame 11, allowing the glue to extend sufficiently between the cover plate 12 and the middle frame 11, which also helps prevent glue overflow.

[0043] Furthermore, in some embodiments, the side surface 1114 of the adhesive reservoir 1112 is inclined away from the bottom surface 1113 relative to the bottom surface 1113; in other words, the side surface 1114 and the bottom surface 1113 form an obtuse angle. This configuration is described in reference to... Figure 2 As shown, in the direction perpendicular to the first surface 121 from the bottom wall 1115, the dispensing space 14 between the second surface 122 and the side wall 1111 gradually decreases. While increasing the bonding area between the glue solidified material 15 and the middle frame 11 by means of the glue receiving groove 1112, the design of the side 1114 inclined to the bottom surface 1113 also restricts the dispensing space 14 within the range of the glue receiving groove 1112. The position of the side 1114 away from the bottom wall 1115 can block the glue, preventing the glue from overflowing from the gap between the side wall 1111 and the second surface 122, thus also playing a role in preventing glue overflow. In addition, the recessed glue receiving groove 1112 provided in the side wall 1111 increases the bonding area between the glue solidified material 15 and the middle frame 11 while maintaining the aesthetics of the terminal device 10 and enhancing the product competitiveness of the terminal device 10.

[0044] refer to Figure 2 and Figure 4 As shown, in some embodiments, the included angle between the side surface 1114 and the bottom surface 1113 is greater than or equal to 130° and less than or equal to 140°, for example, it can be 135°. A reasonable configuration of the inclination angle of the side surface 1114 relative to the bottom surface 1113 helps reduce the processing difficulty of the adhesive reservoir 1112. Simultaneously, the gentle slope of the bottom surface 1113 not only prevents adhesive from overflowing from the gap between the second surface 122 and the side wall 1111, but also facilitates the smooth filling of the entire adhesive reservoir 1112 along the side surface 1114, thereby effectively increasing the adhesion area between the solidified adhesive 15 and the middle frame 11.

[0045] In some embodiments, the depth of the adhesive receiving groove 1112, i.e., the dimension of the side surface 1114 in the direction perpendicular to the bottom surface 1113, is greater than or equal to 0.05 mm and less than or equal to 0.15 mm, for example, it can be 0.1 mm; the width of the adhesive receiving groove 1112, i.e., the dimension of the bottom surface 1113 in the direction perpendicular to the bottom wall 1115, is greater than or equal to 0.3 mm and less than or equal to 0.4 mm, for example, it can be 0.35 mm. With this setting, the size of the adhesive receiving groove 1112 will not be too small, which helps to reduce the processing difficulty of the adhesive receiving groove 1112, and at the same time can effectively increase the bonding area between the glue solidified material 15 and the middle frame 11, thereby improving the bonding strength and sealing performance between the cover plate 12 and the middle frame 11. In addition, the size of the adhesive receiving groove 1112 will not be too large, thereby avoiding the setting of the adhesive receiving groove 1112 from affecting the structural strength of the middle frame 11.

[0046] Please see again. Figure 1 and Figure 2 It should be noted that in some embodiments, multiple support structures 13 are spaced apart along the edge region of the first surface 121 to increase the bonding area between the cover plate 12 and the middle frame 11, while the adhesive groove 1112 can cover the entire area of ​​the second surface 122 where the cover plate 12 and the middle frame 11 are bonded in the first direction. For example, in Figure 1In the illustrated embodiment, in one edge where the middle frame 11 and the cover plate 12 are glued together, the adhesive receiving groove 1112 is a through-groove extending along a first direction. The adhesive receiving groove 1112 covers the entire edge area of ​​the cover plate 12 in the first direction; in other words, the adhesive receiving groove 1112 covers the areas of the cover plate 12 where the support structure 13 is provided and where the support structure 13 is not provided. Therefore, the adhesive receiving groove 1112 is a through-groove, which simplifies manufacturing and maximizes the bonding area between the glue solidified material 15 and the middle frame 11, thereby maximizing the bonding strength and sealing performance between the cover plate 12 and the middle frame 11. It also prevents glue from overflowing between the second surface 122 and the sidewall 1111 to the greatest extent. Of course, in other embodiments, the adhesive receiving groove 1112 can also be multiple sub-grooves spaced apart along the sidewall 1111 in the first direction, which similarly increases the bonding area between the glue solidified material 15 and the middle frame 11.

[0047] It is understood that in this application, multiple support structures 13 located at the same edge of the first surface 121 and spaced apart can be flush with each other in the second direction, and the distance between each support structure 13 is equal. Therefore, in some embodiments, when the support structures 13 are attached to the first surface 121 by adhesive, multiple support structures 13 can be first placed on the same carrier, such as on the same diaphragm, and the positions of the multiple support structures 13 are controlled to be flush and the spacing equal. Then, the multiple support structures 13 on the diaphragm are simultaneously pasted onto the first surface 121 using a fixture. Thus, the simultaneous pasting of multiple support structures 13 can improve the accuracy of the placement of multiple support structures 13 on the first surface 121 and simplify the placement process of multiple support structures 13 on the first surface 121, thereby improving the manufacturing efficiency of the terminal device 10.

[0048] Please refer to this again. Figure 1 In some embodiments, the terminal device 10 of this application may further include radio frequency (RF) circuitry, a memory including one or more computer-readable storage media, an input unit, a display unit, a sensor, an audio circuit, a wireless Fidelity (WiFi) module, a processor including one or more processing cores, and a power supply, among other components. Those skilled in the art will understand that... Figure 1 The structure of the terminal device 10 shown does not constitute a limitation on the terminal device 10. It may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0049] Radio frequency (RF) circuits can be used to send and receive information, or to receive and transmit signals during calls. Specifically, they receive downlink information from the base station and process it through one or more processors; additionally, they transmit uplink data to the base station. Typically, RF circuits include, but are not limited to, antennas, at least one amplifier, tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, transceiver, coupler, low-noise amplifier (LNA), and duplexer. Furthermore, RF circuits can communicate wirelessly with networks and other devices. This wireless communication can use any communication standard or protocol, including but not limited to GSM, GPRS, CDMA, WCDMA, LTE, email, and SMS.

[0050] The terminal device 10 also includes a power supply for powering the various components. Preferably, the power supply can be connected to the processor logic through a power management system, thereby enabling functions such as charging, discharging, and power consumption management through the power management system. The power supply may also include one or more DC or AC power sources, a recharging system, a power fault detection circuit, a power converter or inverter, a power status indicator, or any other components.

[0051] although Figure 1 As not shown in the diagram, terminal device 10 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or they can be arbitrarily combined and implemented as the same or several entities. For the specific implementation of the above modules, please refer to the previous method embodiments, which will not be described in detail here.

[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A terminal device, characterized in that, include: The middle frame has side walls and a bottom wall, the side walls and the bottom wall together forming a step; A cover plate having a first surface and a second surface opposite to the sidewall, a portion of the first surface being opposite to the bottom wall; as well as, A support structure is disposed on the first surface and at least partially abuts against the bottom wall, and a dispensing space is formed between the side wall, the bottom wall and the support structure; The terminal device further includes a display component located inside the bottom wall, and the support structure partially abuts against the bottom wall and partially is located between the bottom wall and the display component. The side wall is provided with an adhesive groove, the bottom surface of which is connected to the bottom wall and is opposite to a portion of the second surface. The adhesive groove also has a side surface connected to the bottom surface, which is inclined relative to the bottom surface toward the side away from the bottom surface.

2. The terminal device according to claim 1, characterized in that, The terminal device includes a plurality of the support structures, which are spaced apart along the extension direction of the bottom wall.

3. The terminal device according to claim 1, characterized in that, The angle between the side surface and the bottom surface is greater than or equal to 130° and less than or equal to 140°.

4. The terminal device according to claim 1, characterized in that, The depth of the adhesive groove is greater than or equal to 0.05 mm and less than or equal to 0.15 mm; the dimension of the bottom surface in the direction perpendicular to the bottom wall is greater than or equal to 0.3 mm and less than or equal to 0.4 mm.

5. The terminal device according to claim 1, characterized in that, The dimension of the support structure in the first direction is greater than or equal to 0.5 mm and less than or equal to 0.9 mm, and the dimension of the support structure in the second direction is greater than or equal to 0.3 mm and less than or equal to 0.7 mm. The first direction is parallel to the second surface, and the second direction is perpendicular to the first direction.

6. The terminal device according to claim 1, characterized in that, The thickness of the support structure is greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

7. The terminal device according to claim 1, characterized in that, The edge of the support structure is flush with the second surface.

8. The terminal device according to claim 1, characterized in that, The shortest distance between the edge of the support structure and the second surface is greater than or equal to 0.1 mm.

9. The terminal device according to claim 1, characterized in that, The support structure is attached to the first surface by adhesive bonding; or... The support structure is applied to the first surface using screen printing or pad printing; or... The support structure is formed by applying adhesive to the first surface.

10. The terminal device according to claim 1, characterized in that, The supporting structure is a plastic sheet, glue solidification, or ink layer.

Citation Information

Patent Citations

  • Electronic equipment

    CN113067920A

  • Electronic device

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  • Backlight module and display device

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  • Terminal device

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  • Frame glue structure of large liquid crystal display screen

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