Portable air-cooled and conduction-cooled machine case based on semiconductor refrigeration

Abstract

The application discloses a portable air-cooling and conduction-cooling machine box based on semiconductor refrigeration, which comprises a machine box shell, a plurality of electronic inserts are arranged in the machine box shell, and a semiconductor refrigeration fan assembly is arranged on the electronic inserts; the semiconductor refrigeration fan assembly comprises a semiconductor refrigeration sheet arranged on a vacuum heat insulation plate; a semiconductor heat dissipation tooth and a heat dissipation tooth cover plate are arranged above the semiconductor refrigeration sheet; a conduction plate cover plate and a partition plate are sequentially arranged below the semiconductor refrigeration sheet; a temperature sensor is arranged on the conduction plate cover plate, and a conduction fan is arranged on one side of the partition plate; the semiconductor heat dissipation tooth, the conduction plate cover plate and the vacuum heat insulation plate form a sealed structure, and the semiconductor refrigeration sheet is arranged in the sealed structure. The semiconductor refrigeration fan assembly is arranged on the electronic insert, the heat dissipation capacity of the airborne machine box is enhanced, and the portability of the electronic equipment is ensured.

Description

Technical Field

[0001] This invention belongs to the field of electronic device chassis technology, specifically relating to a lightweight air-cooled and heat-conducting chassis based on semiconductor refrigeration. Background Technology

[0002] Most electronic devices used in aerospace environments are highly integrated, and the internal modules of individual electronic devices generate a lot of heat. There are also high requirements for the weight and stability of electronic devices. Ordinary fan cooling and conductive cooling alone cannot meet the heat dissipation requirements of most electronic devices. Although liquid cooling has a better heat dissipation effect, in the aerospace environment, the addition of liquid cooling source equipment increases the overall weight of electronic devices, exceeding the user's requirements.

[0003] Patent application number CN201821247824.9 discloses a heat dissipation chassis for a power amplifier, comprising a front panel, a chassis, and a back panel. The front panel and back panel are fixedly disposed at both ends of the chassis. The chassis also includes a heat dissipation partition. The chassis has a rectangular frame structure with grooves on two opposite sides inside. The two ends of the heat dissipation partition are disposed within the grooves. The heat dissipation partition includes a heat-conducting plate, a heat-insulating plate, and a cold-conducting plate for supporting the functional components of the power amplifier. The cold-conducting plate, the heat-insulating plate, and the heat-conducting plate are arranged sequentially from top to bottom. Several thermoelectric coolers are disposed within the heat dissipation partition. The cold ends of the thermoelectric coolers are in contact with the cold-conducting plate, and the hot ends of the thermoelectric coolers are in contact with the heat-conducting plate. A heat dissipation toothed plate is fixedly disposed on the bottom surface of the heat-conducting plate. A heat dissipation fan is disposed at the bottom of the back panel, and a grid-like ventilation opening is disposed at the bottom of the front panel. The heat dissipation mechanism of this chassis is located at the bottom, with the amplifier components situated below it. The vents and cooling fans are also located at the bottom of the chassis. This results in poor heat dissipation in certain areas of the amplifier components, especially at the end furthest from the heat dissipation mechanism. Furthermore, several thermoelectric coolers are placed directly on the heat dissipation plate, which easily leads to condensation. Using a drying box to dry the air inside the chamber is ineffective. Summary of the Invention

[0004] To address the aforementioned problems, this invention aims to provide a lightweight air-cooled and heat-conducting chassis based on semiconductor refrigeration, thereby resolving the issue of insufficient heat dissipation capacity affecting equipment stability and performance limitations while ensuring portability.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A lightweight air-cooled and heat-conducting chassis based on semiconductor refrigeration includes a chassis shell, and multiple electronic components are arranged inside the chassis shell. Semiconductor refrigeration fan assemblies are arranged on the electronic components.

[0007] A semiconductor cooling fan assembly includes a semiconductor cooling chip mounted on a vacuum insulation panel; a semiconductor heat dissipation tooth and a heat dissipation tooth cover are provided above the semiconductor cooling chip, and a cold conduction plate cover and a middle partition are provided in sequence below the semiconductor cooling chip.

[0008] A temperature sensor is installed on the cover of the cooling plate, and a cooling fan is installed on one side of the middle partition.

[0009] The semiconductor heat dissipation teeth, the cold conduction plate cover, and the vacuum insulation plate form a sealed structure, and the semiconductor cooling chip is located in the sealed structure.

[0010] The electronic components are connected to the backplane via connectors, and the backplane is mounted on the chassis housing.

[0011] The partition plate is equipped with several heat dissipation teeth and openings, and the openings are correspondingly set between two adjacent electronic components.

[0012] A thermal pad is placed on the semiconductor refrigeration chip.

[0013] A cooling fan is installed on the semiconductor heat sink, and an air vent corresponding to the cooling fan is installed on the chassis.

[0014] The chassis has an air inlet waveguide window corresponding to the cooling fan.

[0015] The cooling fan passes through the cooling plate cover and connects to the outside of the chassis.

[0016] A thermal pad is provided between the semiconductor cooling fan assembly and the chassis housing.

[0017] The chassis includes an upper cover and a lower cover that are positioned opposite each other, a left side panel and a right side panel that are positioned opposite each other, and a front panel and a rear panel that are positioned opposite each other.

[0018] An air outlet waveguide window and a left side panel cover are provided on the left side panel; the air outlet waveguide window is located below the electronic plug-in.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] The present invention provides a lightweight air-cooled and heat-conducting chassis based on semiconductor refrigeration, wherein a semiconductor refrigeration fan assembly is provided on the electronic components to enhance the heat dissipation capacity of the airborne chassis while ensuring the portability of the electronic equipment.

[0021] The semiconductor cooling fan assembly combines heat-conducting and air-cooling components, improving the heat dissipation capacity of the chassis.

[0022] A temperature sensor is installed on the heat dissipation plate cover to monitor the temperature inside the chassis in real time, and the temperature can be controlled below the dew point temperature.

[0023] The semiconductor heat dissipation fins, the cold conduction plate cover, and the vacuum insulation plate form a sealed structure. The semiconductor cooling chip is placed in the sealed structure, which can isolate water vapor and prevent condensation from occurring on the semiconductor cooling chip. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the specific embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is an unfolded perspective view of a portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to the present invention.

[0026] Figure 2 This is a schematic diagram of the semiconductor cooling fan assembly in this invention;

[0027] Figure 3 This is a diagram showing the airflow direction of the chassis according to the present invention;

[0028] Figure 4 This is a schematic diagram of the partition structure in this invention;

[0029] Reference numerals: 1-Semiconductor cooling fan assembly, 101-Heat dissipation tooth cover plate, 102-Cooling fan, 103-Semiconductor heat dissipation tooth, 104-Cooling chip thermal pad, 105-Semiconductor cooling chip, 106-Vacuum insulation plate, 107-Cooling plate cover plate, 108-Middle partition plate, 109-Air inlet waveguide window, 110-Cooling fan, 2-Electronic component, 3-Back panel, 4-Left side panel, 5-Right side panel, 6-Rear panel, 7-Front panel, 8-Upper cover plate, 9-Lower cover plate, 10-Air outlet waveguide window, 11-Left side panel cover plate, 12-Cooling pad. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. However, it should not be construed that the scope of the subject matter of the present invention is limited to the following embodiments. All modifications, substitutions and alterations made based on ordinary technical knowledge and common practices in the art without departing from the above-described technical concept of the present invention are included within the scope of the present invention.

[0031] Reference Figures 1 to 4This invention discloses a portable air-cooled and heat-conducting chassis based on semiconductor refrigeration, comprising a chassis shell, which is configured as a hollow rectangle. The chassis shell includes an upper cover plate 8 and a lower cover plate 9 arranged opposite each other, a left side plate 4 and a right side plate 5 arranged opposite each other, and a front panel 7 and a rear panel 6 arranged opposite each other. A semiconductor refrigeration fan assembly 1 is connected to the right side plate 5. Multiple electronic plug-in components 2 are arranged below the semiconductor refrigeration fan assembly 1. The lower part of the electronic plug-in components 2 is mounted on the left side plate 4. The left side plate 4 is provided with an air outlet waveguide window 10 and a left side plate cover plate 11. A back plate 3 is provided on the inner side of the lower cover plate 9. One side of the electronic plug-in component 2 connector is connected to the back plate 3. Each electronic plug-in component 2 is provided with heat dissipation teeth and air gaps. Air outlets are provided on the left side plate 4 and the rear panel 6.

[0032] The electronic plug-in 2 is provided with a semiconductor cooling fan assembly 1. The semiconductor cooling fan assembly 1 includes a partition plate 108 connected to the electronic plug-in 2. The partition plate 108 is provided with a number of heat dissipation teeth and openings, and the openings are correspondingly arranged between two adjacent electronic plug-ins 2.

[0033] A cooling plate cover 107 is installed on the partition plate 108, and a temperature sensor (not shown in the figure) is installed on the cooling plate cover 107 to monitor the temperature inside the chassis in real time.

[0034] A cooling fan 110 is provided on one side of the partition 108 and the cooling plate cover 107. The cooling fan 110 is connected to the outside of the right side plate 5. An air inlet waveguide window 109 corresponding to the cooling fan 110 is provided on the right side plate 5. The air inlet waveguide window 109 is provided for the purpose of air cooling outlet and shielding.

[0035] A vacuum insulation plate 106 is provided on the cold-conducting plate cover 107. A plurality of semiconductor cooling chips 105 are provided on the vacuum insulation plate 106. The lower part of the semiconductor cooling chip 105 is connected to the cold-conducting plate cover 107, and a cooling chip heat-conducting pad 104 is provided on the upper part of the semiconductor cooling chip 105.

[0036] A semiconductor heat dissipation tooth 103 and a heat dissipation tooth cover plate 101 are provided above the semiconductor cooling chip 105. The semiconductor heat dissipation tooth 103, the cold conduction plate cover plate 107 and the vacuum insulation plate 106 form a sealed structure that can isolate water vapor. The semiconductor cooling chip 105 is located in the sealed structure.

[0037] A cooling fan 102 is provided on one side of the semiconductor heat sink 103, and an air vent corresponding to the cooling fan 102 is provided on the chassis.

[0038] A thermal pad 12 is provided between the semiconductor cooling fan assembly 1 and the chassis housing. Specifically, the thermal pad 12 is located between the right side plate 5 and the semiconductor heat dissipation teeth 103.

[0039] The cooling process of this chassis is as follows: The cooling fan 110 of the semiconductor fan assembly inside the chassis draws in outside air through a closed toothed channel formed by the cooling plate cover 107 and the partition 108. The partition 108 has openings and corresponding heat dissipation teeth. Figure 4 As shown, air flows out from the opening, passes through the array composed of electronic plug-in 2, and the heat source inside the electronic plug-in 2 can be dissipated through this air flow, and then flows out through the air outlet waveguide window 10.

[0040] When air flows through the partition 1081, the cooling end of the thermoelectric cooler 105 cools down, causing the temperature of the heat-conducting plate cover 107 and the partition 108 to decrease. This not only reduces the airflow temperature when it enters the electronic component 2 when the outside temperature rises, thus enhancing its heat dissipation capacity, but also lowers the temperature of the partition 108. Furthermore, by increasing the heat transfer through the heat-conducting mechanism, the electronic component 2 can better transfer heat to the partition 108. The airflow direction is as follows: Figure 3 As shown.

[0041] The semiconductor cooling chip 105 is sealed as a whole by the cold-conducting plate cover 107, the hollow heat insulation plate, the semiconductor heat dissipation teeth 103, and the cooling chip heat conduction pad 104. The cold end and the hot end are separated by the hollow heat insulation plate. The heat of the hot end is drawn into the outside airflow by the cooling fan 102 and discharged from the air outlet on the rear panel 6 through the semiconductor heat dissipation teeth 103.

[0042] In this invention, heat exchange during the semiconductor cooling process is achieved through the semiconductor cooling fan assembly 1, and cooling is performed by the semiconductor cooling chip 105 in the semiconductor cooling fan assembly 1. The cooling capacity can be controlled by the temperature sensor on the cold conduction plate cover 107 to ensure cooling.

[0043] To prevent condensation during cooling, the semiconductor cooling chip 105 is sealed in a sealed environment consisting of the semiconductor heat dissipation tooth 103, the cold conduction plate cover 107, and the vacuum insulation plate 106. Furthermore, a temperature sensor ensures that the temperature of the cold conduction plate cover 107 is the same as the outside temperature after cooling, thus preventing condensation from occurring below the dew point temperature.

[0044] The present invention provides a detailed description of a portable air-cooled and heat-conducting chassis based on semiconductor refrigeration. Specific examples have been used to illustrate the structure and working principle of the invention. The descriptions of the embodiments are merely for the purpose of helping to understand the method and core ideas of the invention. It should be noted that those skilled in the art can make various improvements and modifications to the invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims.

Claims

1. A lightweight air-cooled and heat-conducting chassis based on semiconductor refrigeration, characterized in that: Includes a chassis housing, and multiple electronic components (2) are provided inside the chassis housing. A semiconductor cooling fan assembly (1) is provided on the electronic components (2). The semiconductor cooling fan assembly (1) includes a semiconductor cooling chip (105) disposed on a vacuum insulation plate (106); a semiconductor heat dissipation tooth (103) and a heat dissipation tooth cover plate (101) are disposed above the semiconductor cooling chip (105), and a cold conduction plate cover plate (107) and a middle partition plate (108) are disposed below the semiconductor cooling chip (105). A temperature sensor is installed on the cooling plate cover (107), and a cooling fan (110) is installed on one side of the partition plate (108). The semiconductor heat dissipation teeth (103), the cold conduction plate cover (107) and the vacuum insulation plate (106) form a sealed structure, and the semiconductor cooling chip (105) is disposed in the sealed structure.

2. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to claim 1, characterized in that: The electronic plug-in (2) is connected to the backplate (3) via a connector, and the backplate (3) is mounted on the chassis housing.

3. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to claim 1, characterized in that: The partition plate (108) is provided with several heat dissipation teeth and openings, and the openings are correspondingly set between two adjacent electronic plug-ins (2).

4. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to claim 1, characterized in that: A thermal pad (104) is provided on the semiconductor cooling chip (105).

5. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to claim 1, characterized in that: A cooling fan (102) is provided on the semiconductor heat sink (103), and an air vent corresponding to the cooling fan (102) is provided on the chassis.

6. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to claim 1, characterized in that: The chassis is provided with an air inlet waveguide window (109) corresponding to the cooling fan (110).

7. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to claim 6, characterized in that: The cooling fan (110) passes through the cooling plate cover (107) and communicates with the outside of the chassis.

8. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to claim 1, characterized in that: A thermal pad (12) is provided between the semiconductor cooling fan assembly (1) and the chassis housing.

9. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to any one of claims 1-8, characterized in that: The chassis includes an upper cover (8) and a lower cover (9) arranged opposite to each other, a left side panel (4) and a right side panel (5) arranged opposite to each other, and a front panel (7) and a rear panel (6) arranged opposite to each other.

10. A portable air-cooled and heat-conducting chassis based on semiconductor refrigeration according to claim 9, characterized in that: An air outlet waveguide window (10) and a left side plate cover (11) are provided on the left side plate (4); the air outlet waveguide window (10) is located below the electronic plug-in (2).

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