Leadless surface mount device soldering apparatus and method

Abstract

The application provides a leadless surface mount device soldering device and method, a moving track is a concave rack track with low middle and high ends, the two ends of the moving track are fixed on the support, the moving end is provided with a driving device, a device holding tool and a rack gear, the device holding tool is fixed with the rack gear, and the driving device drives the rack gear to move on the moving track; the device holding tool is installed with the leadless surface mount device to be soldered, and the surface to be soldered of the leadless surface mount device faces downward; the soldering pot is placed in the middle part of the moving track, solder used for soldering the surface mount device is placed in the soldering pot, and the liquid level of the solder ensures that the soldering end of the leadless surface mount device contacts to complete soldering. The application controls the moving speed of the moving end to achieve the effect of flowing soldering, ensures the soldering quality of the device, and ensures that there is no problem such as pull tip and continuous soldering after the device is soldered.

Description

Technical Field

[0001] This invention belongs to the field of electronic component tinning technology, specifically relating to a tinning apparatus and method for leadless surface mount components. Background Technology

[0002] Due to their unique structure, leadless surface-mount components currently rely heavily on manual soldering to remove gold and tin, which is highly dependent on the operator's skill level. This results in poor product consistency and risks such as pad bridging and overheating damage. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a soldering apparatus and method for leadless surface mount components. The solution of this invention can solve the problems existing in the prior art.

[0004] The technical solution of this invention:

[0005] According to a first aspect, a soldering device for leadless surface-mount components is provided, comprising a moving track, a support, a moving end, and a soldering pot. The moving track is a concave rack track with a lower middle section and higher ends. The two ends of the moving track are fixed to the support. The moving end is provided with a driving device, a device holding fixture, and a gear hobbing device. The device holding fixture is fixedly connected to the gear hobbing device. The driving device drives the gear hobbing device to move on the moving track. The device holding fixture holds the leadless surface-mount component to be soldered, with the side of the leadless surface-mount component to be soldered facing down. The soldering pot is placed in the middle part of the moving track and contains solder for soldering the component. The solder level ensures that the solder ends of the leadless surface-mount component make contact and complete the soldering process.

[0006] Furthermore, the leadless surface mount component tinning device also includes a positioning track. The positioning track has a smooth surface, the same shape as the moving track, and is installed at the same height as the moving track, with both ends fixed to the bracket.

[0007] Furthermore, the device mounting fixture includes a soldering platform, a mounting end, a device placement table, and a cover plate. The soldering platform has a first groove. The device placement table is a cuboid with a boss along its length on its upper surface and a second groove parallel to the lower surface near its lower surface. The mounting end has two blades, an upper blade for engaging with the device placement table to hold the device, and a lower blade for inserting into the second groove of the device placement table. The part to be soldered is placed between the boss of the device placement table and the upper blade of the mounting end, both placed in the first groove of the soldering platform. The cover plate fixes the mounting end to the soldering platform.

[0008] Furthermore, the thickness d of the lower blade at the bearing end and the width a of the groove of the device placement stage should satisfy: ad = 0.039 mm.

[0009] Furthermore, the dimensions of the boss on the device placement stage and the dimensions of the bearing end blade can be adjusted according to the dimensions of the part to be soldered.

[0010] Furthermore, the bosses on the device placement platform are symmetrical along the symmetrical plane, and each device placement platform has a clamping end on each of the left and right sides, clamping two rows of parts to be soldered.

[0011] Furthermore, the two clamping ends and one device placement platform constitute a set of clamping kits for the parts to be tinned. Depending on the size of the tinning platform groove and actual needs, multiple sets of clamping kits can be designed and installed in the same groove.

[0012] Furthermore, a fixing device is provided on the device holding fixture, and the positioning track passes through the fixing device, allowing the device holding fixture to slide on the positioning track.

[0013] Furthermore, the bracket is a pillar fixed to the support surface, and the moving track is fixed to the upper end of the pillar.

[0014] Furthermore, the support pillars consist of four pillars, two of which have a moving track fixed to their upper ends, and the other two have a positioning track fixed to their upper ends.

[0015] Furthermore, the height of the support can be adjusted according to the size of different parts to be tinned and the height of the tinning liquid level.

[0016] Furthermore, the moving end moves at a speed of 90 mm / s to 110 mm / s when passing the tin pot.

[0017] Furthermore, the time for the part to be tinned to move in the tinning liquid is 2 to 3 seconds.

[0018] According to the second aspect, the above-mentioned method for soldering leadless surface-mount components includes the following steps:

[0019] Install the part to be soldered onto the mobile device.

[0020] Install the mobile device on the mobile track.

[0021] Adjust the support according to the distance between the part to be soldered and the surface of the soldering liquid;

[0022] The mobile end is started at the higher end of the moving track. The mobile end moves along the moving track, passes through the tinning pot, and then moves to the other end of the moving track.

[0023] Furthermore, when tinning different parts, the tinning requirements can be met by changing the components of the moving end and adjusting the height of the moving track.

[0024] The beneficial effects of this invention compared to the prior art are as follows:

[0025] (1) This invention achieves the effect of fluid soldering by controlling the moving speed of the mobile end, ensuring the soldering quality of the device and ensuring that there are no problems such as spikes or solder bridging after the device is soldered.

[0026] (2) This invention can meet the requirements for mounting different device thicknesses by changing the mounting end and device placement position in the device mounting fixture; by changing the height of the support pillar, it can ensure that the solder end of the device contacts the tin surface. Other components do not need to be changed, which can meet the tinning requirements of all leadless surface mount components, ensuring low cost and high efficiency in fixture manufacturing;

[0027] (3) By introducing a concave track, the present invention allows the part to be soldered to be installed at a high position and soldered at a low position, thus ensuring the safety of the soldering personnel.

[0028] (4) By changing the size and number of the bearing end and the device placement stage, the present invention can achieve the purpose of tinning multiple parts to be tinned each time, thereby improving the tinning efficiency. Attached Figure Description

[0029] The accompanying drawings, which form part of this specification, are provided to further illustrate embodiments of the invention and, together with the textual description, explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0030] Figure 1 A schematic diagram of a leadless surface mount component tinning device according to an embodiment of the present invention is shown.

[0031] Figure 2 A schematic diagram of a leadless surface mount component tinning method according to an embodiment of the present invention is shown;

[0032] Figure 3 A schematic diagram of a device mounting fixture provided according to an embodiment of the present invention is shown;

[0033] Figure 4 A schematic diagram of a device placement stage provided according to an embodiment of the present invention is shown;

[0034] Figure 5 A schematic diagram of the bearing end provided according to an embodiment of the present invention is shown;

[0035] Figure 6 A schematic diagram of a cover plate provided according to an embodiment of the present invention is shown;

[0036] Figure 7 A schematic diagram of a tinning platform provided according to an embodiment of the present invention is shown.

[0037] The above figures include the following reference numerals:

[0038] 1. Mobile end; 2. Component clamping fixture; 3. Moving track; 4. Bracket; 5. Fixed shaft; 6. Positioning track; 7. Base; 21. Soldering platform; 22. Cover plate; 23. Clamping end; 24. Component placement table. Detailed Implementation

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0041] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0042] like Figure 1 As shown, according to an embodiment of the present invention, a soldering apparatus for leadless surface-mount components is provided according to a first aspect, including a moving track 3, a support 4, a moving end 1, and a soldering pot. The moving track 3 is a concave rack and pinion track with a lower middle section and higher ends. The two ends of the moving track 3 are fixed to the support 4. The moving end 1 is provided with a driving device, a device holding fixture 2, and a gear hobbing device. The device holding fixture 2 is fixedly connected to the gear hobbing device. The driving device drives the gear hobbing device to move on the moving track 3. The device holding fixture 2 holds the leadless surface-mount component to be soldered, with the side of the leadless surface-mount component to be soldered facing down. The soldering pot is placed in the middle part of the moving track 3, and the solder used for soldering the component is placed in the soldering pot. The liquid level of the solder ensures that the solder ends of the leadless surface-mount component make contact to complete the soldering. The moving track 3 is not in a straight line, but in a bent form. This ensures that the device holding fixture 2 is kept away from the soldering pot when it is installed, ensuring the safety of the operator. At the same time, the bending motion moves the device holding fixture 2 to the surface of the soldering pot for soldering.

[0043] In a preferred embodiment, the driving device is a stepper motor.

[0044] In a further embodiment, the leadless surface mount component tinning device also includes a positioning track 6. The positioning track 6 has a smooth surface, the same shape as the moving track 3, and is installed parallel to the moving track 3 at the same height, with both ends fixed to the bracket 4. By installing the positioning track 6, the movement of the moving end 1 on the moving track 3 becomes more stable, which helps to improve the yield of leadless surface mount component tinning.

[0045] In a further embodiment, the device mounting fixture 2 includes a soldering platform 21, a mounting end 23, a device placement stage 24, and a cover plate 22. The soldering platform 21 has a groove 1. The device placement stage 24 is a cuboid with a boss along its length on its upper surface and a groove 2 parallel to the lower surface near its lower surface. The mounting end 23 has two blades, an upper blade for engaging with the device placement stage 24 to hold the device, and a lower blade for inserting into the groove 2 of the device placement stage 24. The part to be soldered is placed between the boss of the device placement stage 24 and the upper blade of the mounting end 23, and together they are placed in the groove 1 of the soldering platform 21. The cover plate 22 fixes the mounting end 23 to the soldering platform 21. The lower blade of the bearing end 23 needs to be inserted into the groove 2 of the device placement platform 24 to control the upward movement of the moving end 1 during the device bearing process, so as to prevent the device from being loosely bearing or falling off. In a preferred embodiment, the thickness d of the lower blade of the bearing end 23 and the width a of the groove 1 of the device placement platform should satisfy: ad = 0.039mm. While ensuring that the bearing end 23 can move arbitrarily, the limiting hole of the device placement platform 24 can restrict the lower blade of the bearing end 23 to prevent the bearing end 23 from tilting upward after the device is bearing.

[0046] In a further embodiment, the boss dimensions of the device placement stage 24 and the blade dimensions of the clamping end 23 can be adjusted according to the dimensions of the part to be soldered. Both the device placement stage 24 and the clamping end 23 are movable components, which can be freely replaced and matched for soldering parts of different thicknesses, ensuring soldering quality while reducing the cost of changing device clamping fixtures due to different part thicknesses.

[0047] In a further embodiment, the bosses on the device placement stage 24 are symmetrical along the plane of symmetry, and each device placement stage 24 has a holding end 23 on each of its left and right sides, clamping two rows of components to be soldered. By increasing the number of components to be soldered at one time, the efficiency of soldering is increased.

[0048] In one further embodiment, the two clamping ends 23 and the device placement platform 24 constitute a set of clamping kits for the parts to be soldered. According to the size of the groove 1 of the soldering platform 21 and the actual needs, multiple sets of clamping kits can be designed and installed in the same groove 1 to further increase the number of soldering cycles in one go and increase the efficiency of soldering.

[0049] In a further embodiment, a fixed position is provided on the device holding fixture 2, through which the positioning track 6 and the moving track 3 pass, and the device holding fixture 2 slides on the positioning track 6. To ensure smooth sliding of the device holding fixture 2, the overall width of the fixed position should not be too large to avoid it being unable to pass through the bend of the moving track 3, and the overall width of the fixed position should not be too small to avoid unstable support, which would cause the moving end 1 to wobble and become unstable when moving.

[0050] The bracket 4 is used to support the overall structure of the tinning fixture. In one embodiment, the bracket 4 is a pillar fixed to the support surface, and the upper end of the pillar is fixed with a moving track 3. Preferably, the bracket 4 is designed to be thicker at the bottom and thinner at the top, so as to minimize the weight of the fixture while ensuring the stability of the bottom.

[0051] In one preferred embodiment, there are four support pillars, two of which have a movable rail 3 fixed to their upper ends, and the other two have a positioning rail 6 fixed to their upper ends. In one embodiment, in order to maintain the stability of the support 4, a fixing shaft 5 is provided between the support pillars 4 at the same end. The fixing shaft 5 passes through the support pillar, the movable rail 3, the positioning rail 6, and the support pillar, fixing the movable rail 3 and the positioning rail 6 while fixing the support 4.

[0052] In a further embodiment, the support column can be adjusted in height according to the size of different parts to be tinned and the height of the tinning liquid level, so that the device holding fixture 2 can be moved down or up, thereby meeting the tinning conditions of the parts to be tinned. This allows the tinning fixture to meet the tinning requirements of various devices, reducing the modification time and cost when tinning different devices.

[0053] In a further embodiment, the moving speed of the mobile end as it passes the solder pot is between 90 mm / s and 110 mm / s. By controlling the moving speed of the workpiece to be soldered, the workpiece is ensured to be soldered within the flowing solder, guaranteeing soldering quality, preventing solder spikes, bubbles, and ensuring complete soldering, thus preventing incomplete soldering due to excessive speed. The minimum power of the drive device is determined based on the moving speed of the mobile end as it passes the solder pot. In a preferred embodiment, the moving speed of the mobile end outside the solder pot can be appropriately increased to improve the efficiency of the soldering process.

[0054] In a further embodiment, the time for the workpiece to be soldered to move in the soldering liquid is 2 to 3 seconds. By controlling the movement time, the workpiece to be soldered is prevented from being burned, thus affecting the quality of the soldering. By controlling the movement speed and movement time, the minimum length of the overlapping portion of the moving track 3 and the positioning track 6 with the solder pot, as well as the minimum length of the solder pot along the movement direction, can be determined.

[0055] In a further embodiment, the leadless surface mount component tinning device also includes a base 7, with a bracket 4 fixed on the base 7. In a preferred embodiment, the base 7 serves as the base of the entire fixture. While ensuring overall stability, it must ensure that the tinning pot is completely within the base 7 and positioned at the center of the base 7, facilitating subsequent operation of the tinning fixture. Mounting holes are present on both sides of the base 7 for accommodating bracket mounting holes, providing overall support for the entire fixture. The bracket mounting holes connect the base 7 and the bracket 4. The bracket mounting holes are fixed to the base 7 with screws, ensuring the same stability as the base 7. The upper end of the bracket mounting hole is cylindrical and hollow, allowing direct insertion of a bracket. The hole walls of the bracket mounting hole are relatively thick, allowing direct insertion of the bracket for stability and reliability.

[0056] According to the second aspect of the embodiment, such as Figure 2 As shown, the above-mentioned method for soldering leadless surface mount components includes the following steps:

[0057] Install the part to be soldered onto the mobile device;

[0058] The mobile device is installed on the mobile track; the mobile track is not straight, but bent, which ensures that the device mounting fixture is kept away from the solder pot when installing the device and ensures the safety of the operator. At the same time, the device mounting fixture is sent to the surface of the solder pot for soldering by bending.

[0059] Adjust the support according to the distance between the part to be soldered and the surface of the soldering liquid;

[0060] The mobile end is started at the higher end of the moving track. The mobile end moves along the moving track, passes through the tinning pot, and then moves to the other end of the moving track.

[0061] As the mobile device moves, it passes over the solder pot at a constant speed to perform soldering. While ensuring proper soldering of the components, the process simulates flowing soldering to prevent issues such as solder spikes or bridging after soldering.

[0062] In a further embodiment, the moving speed of the mobile end as it passes the solder pot is between 90 mm / s and 110 mm / s. By controlling the moving speed of the workpiece to be soldered, the workpiece is ensured to be soldered within the flowing solder, guaranteeing soldering quality, preventing solder spikes, bubbles, and ensuring complete soldering, thus preventing incomplete soldering due to excessive speed. In a preferred embodiment, the moving speed of the mobile end outside the solder pot can be appropriately increased to improve the efficiency of the soldering process.

[0063] In another embodiment, the time for the part to be soldered to move in the soldering liquid is 2 to 3 seconds. By controlling the movement time, the part to be soldered is prevented from being burned, thus affecting the quality of the soldering.

[0064] In a further embodiment, when tinning different parts to be tinned, the tinning requirements are met by changing the components of the moving end and adjusting the height of the moving track.

[0065] To gain a better understanding of the leadless surface mount component tinning device provided by the present invention, a detailed description is provided below with reference to specific examples and accompanying drawings.

[0066] like Figure 1 As shown, the tinning control device consists of a base 7 that has a moving track with a rack and a limiting track without a rack fixed by a bracket; the moving end passes through the moving track and the limiting track through a fixing hole and is placed on the track; the moving end has a groove for storing a stepper motor and gears to provide power to the moving end; the device holding fixture is controlled by a support column to maintain a certain distance from the moving end, so as to ensure that different devices can be just immersed in the tin pot when tinning.

[0067] The base 7 serves as the foundation of the entire fixture. While ensuring overall stability, it is necessary to ensure that the tinning pot is completely inside the base 7 and that the tinning pot is located in the center of the base 7, so as to facilitate the operation of the tinning fixture in the future. There are mounting holes on both sides of the base 7 for mounting brackets, which serve as the overall support for the entire fixture.

[0068] The bracket mounting hole is used to connect the base 7 and the bracket. The bracket mounting hole is fixed to the base 7 with screws to ensure the same stability as the base 7; the upper end of the bracket mounting hole is cylindrical and hollow, so the bracket can be directly inserted; the hole wall of the bracket mounting hole is relatively thick, so the bracket can be directly inserted into the bracket mounting hole to achieve stability and reliability.

[0069] The bracket supports the overall structure of the tinning fixture. The bracket is designed to be thicker at the bottom and thinner at the top, minimizing the fixture's weight while ensuring stability at the bottom. Round and square holes are drilled at appropriate locations at the top to mount the fixed shaft 5 and the moving rail, ensuring the stability of the upper structure of the fixture.

[0070] Fixed axis 5 is a crossbeam that ensures stable support for the two supports on one side, preventing tilting. It also passes through the moving track to secure it.

[0071] The track is divided into left and right tracks. One track is a rack and pinion moving track with gears to ensure that the moving end can move normally. The other track is a limit moving track to ensure that the moving end can be placed smoothly on the track and to ensure that the moving end slides stably.

[0072] The mobile end is a component that moves along a moving track using a stepper motor. The mobile end has fixed positions on both sides to hold the moving track and limit its displacement. The overall width of the fixed positions should not be too large to avoid them being unable to pass through bends in the moving track, nor should it be too small to avoid unstable support, which would cause the mobile end to wobble and become unstable during movement. The mobile end has countersunk holes for inserting screws to tighten the lower-end fixture via a support column. The bottom of the mobile end has a slot to house the stepper motor and transmission device, facilitating concealment and improving the overall integrity of the fixture.

[0073] The support pillar is a tool for controlling the distance between the mobile terminal and the device mounting fixture. If the device mounting fixture is replaced, or its thickness becomes thinner or thicker, the length of the support pillar can be adjusted to ensure that the device mounting fixture makes good contact with the solder surface, thereby moving the device mounting fixture up or down to meet different needs.

[0074] Device holding fixtures are used to hold devices in place and immerse them in a solder pot to solder them. For example... Figure 3 As shown, the device mounting fixture consists of a soldering platform 21, a mounting end 23, a device placement stage 24, and a cover plate 22.

[0075] The mounting end 23 is a crucial component for mounting devices. To ensure stable device mounting, the mounting end 23 must be effectively integrated with the device placement platform 24, such as... Figure 5 As shown, the clamping end 23 has two blades, an upper blade for clamping the device and a lower blade for inserting into the device placement platform 24. This is to control the device clamping process and prevent the moving end from tilting upwards, which could cause the device to be clamped loosely or fall off easily.

[0076] like Figure 4As shown, the device placement stage 24 is the device placement area, which is combined with the clamping end 23. The two parts clamp the device for soldering operations. The device placement area has a stepped shape to hold the device body in place. Both the device placement area and the clamping end 23 are movable components, which can be freely replaced and matched for soldering devices of different thicknesses. This ensures the soldering quality while reducing the cost of changing the device clamping fixture due to different device thicknesses.

[0077] like Figure 6 As shown, the cover plate 22 is the final step in the device mounting fixture process. The mounting end 23 and the device placement stage 24 assembly are mounted onto the soldering platform 21 via the cover plate 22. The soldering platform is as follows... Figure 7 As shown, the device is mounted on a single fixture.

[0078] The present invention also relates to a method for soldering the aforementioned leadless surface mount components, comprising the following steps:

[0079] The moving component used in this device is a stepper motor hidden inside the moving end, which drives gears to move along a rack. The rack has a curvature, causing the moving end to move according to the shape of the rack. There is a height difference, allowing the components to be placed at the higher position and then moved to the soldering position via the rack.

[0080] The device mounting fixture and the mobile terminal need to be tested and installed. The distance between the two components is adjusted by using a support column to ensure that the device on the device mounting fixture can be immersed in the solder pot and to ensure the quality of soldering.

[0081] The device mounting fixture consists of a replaceable mounting end 23 and a device placement stage 24, meeting the soldering requirements of leadless surface mount components of different thicknesses. The upper and lower blades of the mounting end 23 should match the dimensions of the limiting holes of the device placement stage 24, ensuring that the bottom surface of the upper blade is in contact with the surface of the device placement stage 24. Simultaneously, the thickness d of the lower blade of the mounting end 23 and the groove width a of the device placement stage 24 should satisfy: ad = 0.039 mm. While ensuring that the mounting end 23 can move freely, the limiting holes of the device placement stage 24 should restrict the lower blade of the mounting end 23 to prevent the mounting end 23 from tilting upwards after mounting the device.

[0082] During soldering, the device is held in place by a device holding fixture. As the moving end moves, its speed is 200 mm / s before reaching the solder pot, and then it passes over the solder pot at a uniform speed of 100 mm / s for soldering. Simulating flow immersion, the device is soldered without issues such as solder spikes or bridging, ensuring proper soldering.

[0083] The clamping end 23 in the device clamping fixture cooperates with the device placement stage 24; by changing the clamping end 23 and the device placement stage 24, devices of different thicknesses can be tinned, so that the same fixture can meet the tinning requirements of devices of various thicknesses by only changing some components.

[0084] Due to the inconsistency in the thickness of the components, the mounting end 23 on the component mounting fixture and the component placement stage 24 are replaced, resulting in an inconsistency in the thickness of the component mounting fixture. In order to ensure that the component mounting fixtures of different thicknesses can make contact without sinking into the solder surface, the required distance is obtained by adjusting the height of the fixture support.

[0085] In summary, the leadless surface mount component soldering apparatus and method provided by the present invention have at least the following advantages compared with the prior art:

[0086] (1) This invention achieves the effect of fluid soldering by controlling the moving speed of the mobile end, ensuring the soldering quality of the device and ensuring that there are no problems such as spikes or solder bridging after the device is soldered.

[0087] (2) This invention can meet the requirements for mounting different device thicknesses by changing the mounting end and device placement position in the device mounting fixture; by changing the height of the support pillar, it can ensure that the solder end of the device contacts the tin surface. Other components do not need to be changed, which can meet the tinning requirements of all leadless surface mount components, ensuring low cost and high efficiency in fixture manufacturing;

[0088] (3) By introducing a concave track, the present invention allows the part to be soldered to be installed at a high position and soldered at a low position, thus ensuring the safety of the soldering personnel.

[0089] (4) By changing the size and number of the bearing end and the device placement stage, the present invention can achieve the purpose of tinning multiple parts to be tinned each time, thereby improving the tinning efficiency.

[0090] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0091] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0092] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A soldering apparatus for leadless surface mount components, characterized in that, The device includes a moving track, a support, a moving end, and a soldering pot. The moving track is a concave rack and pinion track with a lower center and higher ends. The two ends of the moving track are fixed to the support. The moving end is equipped with a drive device, a device holding fixture, and a gear hobbing device. The device holding fixture is fixedly connected to the gear hobbing device. The drive device drives the gear hobbing device to move on the moving track. The device holding fixture holds the leadless surface-mount components to be soldered, with the soldering side of the leadless surface-mount components facing down. The soldering pot is placed in the middle of the moving track and contains the solder used for soldering the components. The solder level is such that the solder ends of the leadless surface-mount components make contact and complete the soldering process. The device mounting fixture includes a soldering platform, a mounting end, a device placement table, and a cover plate. The soldering platform has a first groove. The device placement table is a cuboid with a boss along its length on its upper surface and a second groove parallel to the lower surface near its lower surface. The mounting end has two blades, an upper blade for engaging with the device placement table to hold the device, and a lower blade for inserting into the second groove of the device placement table. The part to be soldered is placed between the boss of the device placement table and the upper blade of the mounting end, and together they are placed in the first groove of the soldering platform. The cover plate fixes the mounting end to the soldering platform.

2. The leadless surface mount component tinning device according to claim 1, characterized in that, The leadless surface mount component tinning device further includes a positioning track. The positioning track has a smooth surface, the same shape as the moving track, and is installed at the same height and parallel to the moving track. Both ends are fixed to the bracket.

3. The leadless surface mount component tinning device according to claim 2, characterized in that, The thickness d of the lower blade at the bearing end and the width a of the groove of the device placement stage should satisfy: ad = 0.039 mm.

4. The leadless surface mount component tinning device according to claim 3, characterized in that, The two clamping ends and one device placement platform constitute a set of clamping kits for the tin-plated parts. According to the size of the tin-plating platform groove and actual needs, multiple sets of clamping kits can be designed and installed in the same groove.

5. The leadless surface mount component tinning device according to claim 4, characterized in that, A fixing device is provided on the device holding fixture, and the positioning track passes through the fixing device, allowing the device holding fixture to slide on the positioning track.

6. The leadless surface mount component tinning device according to claim 2, characterized in that, The bracket is a pillar fixed to the support surface, and the moving track is fixed to the upper end of the pillar.

7. The leadless surface mount component tinning device according to claim 1, characterized in that, The moving speed of the mobile device when passing the tin pot is between 90 mm / s and 110 mm / s, and the time for the part to be tinned to move in the tinning liquid is between 2 and 3 seconds.

8. A method for soldering leadless surface-mount components using a soldering apparatus for leadless surface-mount components as described in any one of claims 1-7, characterized in that, The method includes the following steps: Install the part to be soldered onto the mobile device. Install the mobile device on the mobile track. Adjust the support according to the distance between the part to be soldered and the surface of the soldering liquid; The mobile end is started at the higher end of the moving track. The mobile end moves along the moving track, passes through the tinning pot, and then moves to the other end of the moving track.

9. A method for tinning leadless surface-mount components according to claim 8, characterized in that, When tinning different parts, the tinning requirements are met by changing the components of the moving end and adjusting the height of the moving track.

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