Hinge pin assembly

Abstract

This invention discloses a hinge pin assembly device, relating to the field of hinge manufacturing technology. It includes a conveying device with a workpiece mold for placing hinge products to be processed; a pin flattening device comprising an alignment mold for holding the hinge cup position of the hinge product; a lower support mold for supporting the hinge cup position from below; and a flattening mold with a pressing surface for flattening the end of the U-shaped pin on the hinge product. By employing the pin flattening device to flatten the pin tip of the U-shaped pin on the hinge product, the pin flattening device, in conjunction with the alignment mold and the lower support mold, performs targeted positioning of the hinge product. The flattening mold can automatically flatten the end of the U-shaped pin on the hinge product to form a locking position, preventing the U-shaped pin from loosening from the hinge product and ensuring a more stable and reliable hinge structure.

Description

Technical Field

[0001] This invention relates to the field of hinge manufacturing technology, and more particularly to a hinge pin assembly device. Background Technology

[0002] A hinge, also known as a hinge body, connects two hinge plates via a hinge body and a hinge cup (or clasp), guiding the relative rotation between the two hinge plates. The hinge body connects to the hinge cup via upper and lower connecting arms of unequal lengths, with the hinge cup connected to the upper and lower connecting arms by U-shaped pins. In practice, the U-shaped pins on the hinge may loosen, therefore it is necessary to design new devices to reinforce the U-shaped pins and prevent them from coming loose from the hinge. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a hinge pin assembly device.

[0004] The technical solution adopted by this invention to solve its technical problem is as follows: A hinge pin assembly device is provided, including a conveying device with a workpiece mold for placing hinge products to be processed. The hinge product includes a hinge body, a hinge cup, a first connecting arm, and a second connecting arm. The hinge cup is connected to the first and second connecting arms by a U-shaped pin. The hinge cup includes a middle cup body portion and an outer hinge cup plate portion. The U-shaped pin includes a middle portion and two pin tip portions on both sides. The device also includes a pin flattening device. The flattening device is located next to the conveying device. The pin flattening device includes an alignment mold for holding the hinge cup position of the hinge product; a lower support mold for supporting the hinge cup position from below; and a flattening mold with a pressing surface for flattening the end position of the U-shaped pin on the hinge product. During the flattening process, the hinge cup is located on the front side of the hinge body. The lower support mold supports the lower side of the cup body of the hinge cup, the alignment mold holds the side of the cup body of the hinge cup and the middle part of the U-shaped pin, and the flattening mold flattens the tip part of the U-shaped pin.

[0005] The hinge pin assembly device provided by the present invention, by employing a pin flattening device to flatten the pin tip of the U-shaped pin in the hinge product, has at least the following technical effects: the pin flattening device, in conjunction with the alignment mold and the lower support mold, performs targeted positioning of the hinge product; the flattening mold can automatically flatten the pin tip of the U-shaped pin on the hinge product to form a locking position, so that the U-shaped pin will not come loose from the hinge product, ensuring that the hinge product structure is more stable and reliable.

[0006] In some preferred embodiments of the present invention, the flattening die is controlled to move up and down by a flattening die lifting control device.

[0007] In some preferred embodiments of the present invention, the lower mold is controlled to move up and down by a lower mold lifting control device.

[0008] In some preferred embodiments of the present invention, the alignment mold and the flattening mold are connected.

[0009] As some preferred embodiments of the present invention, the alignment mold is controlled by an alignment mold control device to control its longitudinal movement.

[0010] As some preferred embodiments of the present invention, the lower side of the pressing plane has a flattening transition bevel.

[0011] As some preferred embodiments of the present invention, it also includes a pressing mold, which is controlled to move up and down by a pressing mold lifting control device, and is used to press the hinge product on the workpiece mold.

[0012] As some preferred embodiments of the present invention, the pressing mold includes a front pressing part and a rear pressing plate. The front pressing part has a pressing recess, which is used to press the junction position between the hinge body and the first connecting arm and the second connecting arm on the hinge product. The rear pressing plate is used to press the rear side of the hinge body.

[0013] As some preferred embodiments of the present invention, a testing device is also included. The testing device includes a test photoelectric sensor, a test head, and a test head control device. The test head control device is used to control the movement of the test head. The test head is used to move the hinge cup of the hinge product. The test photoelectric sensor is used to test the damping buffer time of the hinge cup.

[0014] As some preferred embodiments of the present invention, a reset device is also included. The reset device includes a reset push plate and a reset push plate control device. The reset push plate control device is used to control the movement of the reset push plate, and the reset push plate is used to actuate the hinge cup of the hinge product to reset.

[0015] The beneficial effects of this invention are:

[0016] 1. This invention uses a flattening mold to flatten the tip of the U-shaped pin on the hinge product to form a locking position, so that the U-shaped pin will not come out of the hinge product, ensuring that the hinge product structure is more stable and reliable.

[0017] 2. In the processing of this invention, the hinge cup position of the hinge product is held by the alignment mold, the hinge cup position is supported from the bottom by the lower support mold, and the end position of the U-shaped pin is flattened by the pressing plane, so as to realize the automated operation of the whole process and ensure the smooth progress of the flattening process;

[0018] 3. This invention uses a testing device to fold the hinge cup of the hinge product and test the damping buffer time. This allows for timely detection of whether the hinge product is properly assembled. Products that are not properly assembled can be rejected and reworked, ensuring a high product qualification rate.

[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] Additional aspects and advantages of the invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a perspective view of the hinge product assembled according to the present invention;

[0022] Figure 2 This is a perspective view of the present invention;

[0023] Figure 3 This is a perspective view of the pin flattening device in this invention;

[0024] Figure 4 This is a perspective view of the workpiece mold in this invention;

[0025] Figure 5 This is a perspective view of the pressure die in this invention;

[0026] Figure 6 This is a perspective view of the pressure mold in this invention;

[0027] Figure 7 This is a perspective view of another embodiment of the pin flattening device in this invention;

[0028] Figure 8 This is a perspective view of another embodiment of the pressure die in this invention;

[0029] Figure 9 This is a perspective view of the testing device in this invention;

[0030] Figure 10 This is a perspective view of another embodiment of the testing device in this invention;

[0031] Figure 11 This is a perspective view of the oiling device in this invention;

[0032] Figure 12 This is a perspective view of the reset device in this invention.

[0033] Figure label:

[0034] Hinge product 100, hinge body 110, hinge cup 120, cup body part 121, hinge cup plate part 122, first connecting arm 130, second connecting arm 140, U-shaped pin 150, pin middle part 151, pin tip part 152; conveying device 200, workpiece mold 210, front positioning frame 211, rear positioning frame 212, positioning gap 213; pin flattening device 300, lower support mold 310, lower support mold lifting control device 311, lower support mold lifting control slider 312, alignment mold 320, alignment mold control device 321, flattening mold 330, pressing plane 331, flattening transition bevel 332, flattening mold Lifting control device 333, pressing mold 340, front pressing part 341, rear pressing plate 342, pressing mold lifting control device 343; testing device 400, testing photoelectric sensor 410, testing head 420, testing pressure roller 421, testing head control device 422, testing pressing part 430, testing pressing part control device 431; reset device 500, reset push plate 510, reset push plate control device 511, reset pressing part 520, reset pressing part control device 521; oiling device 600, oiling mold 610, oiling mold front protrusion 611, oiling mold rear protrusion 612, oiling mold control device 613; discharge device 700. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0037] In the description of this invention, "multiple" means two or more, and "greater than," "less than," "exceeding," etc., are understood to exclude the stated number. The use of "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or their sequential relationship.

[0038] In the description of this invention, unless otherwise explicitly defined, terms such as "setting," "installing," and "connecting" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0039] Figure 2 This is a perspective view of one embodiment of the present invention, with reference to... Figure 2 One embodiment of the present invention provides a hinge pin assembly device for assembling hinge products 100.

[0040] Furthermore, the hinge pin assembly device of the present invention includes a conveying device 200, on which a workpiece mold 210 is provided, as shown in the figure. Figure 3 , Figure 4 The workpiece mold 210 is used to hold the hinge product 100 to be processed, that is, the hinge product 100 is moved to various processes for processing by the conveying device 200. (Refer to...) Figure 1 The hinge product 100 includes a hinge body 110, a hinge cup 120, a first connecting arm 130, and a second connecting arm 140. The hinge cup 120 is connected to the first connecting arm 130 and the second connecting arm 140 via a U-shaped pin 150. The hinge cup 120 of the hinge product 100 is capable of rotational folding. The hinge product 100 connects to two hinge plates via the hinge body 110 and the hinge cup 120, guiding the relative rotational movement between the two hinge plates. The specific working principle of the hinge product 100 can be referred to other existing hinge devices. The hinge cup 120 includes a middle cup body portion 121 and an outer hinge cup plate portion 122. The cup body portion 121 is connected to the first connecting arm 130 and the second connecting arm 140, and the hinge cup plate portion 122 is connected to the hinge plate. The U-shaped pin 150 includes a middle part 151 and two pin tip parts 152 on both sides. The middle part 151 and the pin tip parts 152 on both sides form a "U"-shaped structure. The pin tip parts 152 of the U-shaped pin 150 are respectively connected to the first connecting arm 130 and the second connecting arm 140.

[0041] Furthermore, refer to Figure 3 The hinge pin assembly device of the present invention also includes a pin flattening device 300, which is located next to the conveying device 200. The pin flattening device 300 includes an alignment mold 320, which is used to hold the hinge cup 120 of the hinge product 100 in place.

[0042] Furthermore, the hinge pin assembly device of the present invention also includes a lower support mold 310, which is used to support the hinge cup 120 from below.

[0043] Furthermore, refer to Figure 5 The hinge pin assembly device of the present invention further includes a flattening mold 330, which has a pressing plane 331 for pressing the end position of the U-shaped pin 150 on the hinge product 100 flattening.

[0044] Furthermore, refer to Figure 3In the hinge pin assembly device of the present invention, during the flattening process, the hinge cup 120 is located on the front side of the hinge body 110. The lower support mold 310 supports the lower side of the cup body portion 121 of the hinge cup 120 to prevent the hinge cup 120 from becoming loose and affecting the flattening process. The alignment mold 320 clamps the side of the cup body portion 121 of the hinge cup 120 and the middle portion 151 of the pin of the U-shaped pin 150 to prevent the hinge cup 120 or the U-shaped pin 150 from becoming loose and affecting the flattening process. The flattening mold 330 flattens the pin tip portion 152 of the U-shaped pin 150, pressing out a locking position at the end of the pin tip portion 152 to ensure that the U-shaped pin 150 will not come loose.

[0045] During the aforementioned flattening process, the pin flattening device 300 can automatically flatten the tip portion 152 of the U-shaped pin 150 on the hinge product 100 to form a locking position, so that the U-shaped pin 150 will not come out of the hinge product 100, ensuring that the structure of the hinge product 100 is more stable and reliable.

[0046] It is conceivable that the installation method of the U-shaped pin 150 on the hinge product 100 can refer to other existing hinge assembly and processing devices. The installation of the U-shaped pin 150 can be completed on the hinge pin assembly device of the present invention, or it can be completed in other devices before the hinge pin assembly device of the present invention.

[0047] In some embodiments, the flattening die 330 is controlled to move up and down by the flattening die lifting control device 333. That is, when the hinge product 100 on the workpiece mold 210 is transferred to the pin flattening device 300, the flattening die 330 is controlled to press down by the flattening die lifting control device 333 to flatten the pin tip portion 152 from the side of the hinge product 100.

[0048] In this embodiment, optionally, the pressing mold lifting control device 333 adopts a cylinder.

[0049] In some embodiments, the lower mold 310 is controlled to move up and down by the lower mold lifting control device 311. That is, when the hinge product 100 on the workpiece mold 210 is transferred to the position of the pin flattening device 300, the lower mold lifting control device 311 controls the lower mold 310 to rise and press against the lower side of the cup body portion 121 of the hinge cup 120.

[0050] In this embodiment, optionally, the lower mold lifting control device 311 uses a vertically installed cylinder to achieve the control effect.

[0051] In this embodiment, optionally, refer to Figure 7 The lower mold lifting control device 311 uses a horizontally installed cylinder in conjunction with the lower mold lifting control slider 312 to achieve the control effect.

[0052] Some embodiments, refer to Figure 3 The alignment mold 320 is controlled by the alignment mold control device 321 to move longitudinally forward and backward. That is, when the hinge product 100 on the workpiece mold 210 is transferred to the pin flattening device 300, the alignment mold control device 321 controls the alignment mold 320 to move from the front side of the hinge product 100 toward the front side of the hinge cup 120. This design is suitable for the flattening process of the pin tip portion 152 when the hinge product 100 is in a folded state.

[0053] In this embodiment, optionally, the alignment mold control device 321 is a cylinder.

[0054] Some embodiments, refer to Figure 4 The workpiece mold 210 is equipped with a front positioning bracket 211 and a rear positioning bracket 212, with a space between them serving as a positioning clearance 213. The front positioning bracket 211 and the rear positioning bracket 212 work together to hold the front and rear ends of the hinge body 110 in place, while the positioning clearance 213 provides space for components such as adjusting screws on the hinge body 110. This design ensures that the hinge product 100 is sufficiently stable on the workpiece mold 210, and the hinge cup 120 can extend out of the workpiece mold 210.

[0055] Some embodiments, refer to Figure 7 , Figure 8 The alignment mold 320 is connected to the flattening mold 330. When the hinge product 100 on the workpiece mold 210 is transferred to the pin flattening device 300, the flattening mold lifting control device 333 controls the alignment mold 320 and the flattening mold 330 to descend together. While the alignment mold 320 presses against the side of the cup body portion 121 of the hinge cup 120, the flattening mold 330 completes the flattening process of the pin tip portion 152. This design is suitable for performing the flattening process of the pin tip portion 152 when the hinge product 100 is in the unfolded state.

[0056] Some embodiments, refer to Figure 5 , Figure 8 The flattening plane 331 has a flattening transition bevel 332 on its lower side, which makes it easier for the flattening die 330 to flatten the pin tip 152 into a suitable position.

[0057] Some embodiments, refer to Figure 3 , Figure 7 The hinge pin assembly device of the present invention also includes a pressing mold 340, which is located next to the conveying device 200. The pressing mold 340 is controlled to move up and down by the pressing mold lifting control device 343. The pressing mold 340 is used to press the hinge product 100 on the workpiece mold 210. That is, when the hinge product 100 on the workpiece mold 210 is conveyed to the position of the pin flattening device 300, the pressing mold 340 descends to press the hinge body 110 of the hinge product 100.

[0058] In this embodiment, optionally, refer to Figure 6 The pressing mold 340 includes a front pressing part 341 and a rear pressing plate 342. The front pressing part 341 has a pressing recess, which is used to press the junction between the hinge body 110 and the first connecting arm 130 and the second connecting arm 140 on the hinge product 100. The rear pressing plate 342 is used to press the rear side of the hinge body 110, ensuring that the pressing mold 340 can firmly press the hinge body 110 and prevent the hinge product 100 from loosening during processing.

[0059] In this embodiment, optionally, the pressing mold lifting control device 343 adopts a cylinder.

[0060] Some embodiments, refer to Figure 4 , Figure 9 The hinge pin assembly device of the present invention also includes a testing device 400, which is located next to the conveying device 200. The testing device 400 includes a test photoelectric sensor 410, a test head 420, and a test head control device 422. The test head control device 422 is used to control the movement of the test head 420. The test head 420 is used to move the hinge cup 120 of the hinge product 100. The test photoelectric sensor 410 is used to test the damping buffer time of the hinge cup 120.

[0061] In this embodiment, optionally, refer to Figure 4 The photoelectric sensor 410 is installed on the workpiece mold 210 to ensure that each hinge product 100 is tested and operated accordingly. The test head 420 and the test head control device 422 are relatively fixed outside the conveying device 200.

[0062] In this embodiment, optionally, refer to Figure 9 The test head 420 is equipped with a test pressure roller 421, which presses down on the hinge cup 120 to control the hinge product 100 to fold.

[0063] In this embodiment, optionally, refer to Figure 10 The test head 420 is equipped with multiple test pressure rollers 421, which are connected to the test head 420 via a frame. The test pressure rollers 421 press down on the hinge cup 120 to control the folding of the hinge product 100. This design is suitable for larger hinge products 100.

[0064] In this embodiment, optionally, the testing device 400 includes a testing pressure member 430 and a testing pressure member control device 431. The testing pressure member control device 431 controls the lifting and lowering movement of the testing pressure member 430. That is, when the hinge product 100 on the workpiece mold 210 is transferred to the position of the testing device 400, the hinge product 100 is pressed down by the testing pressure member 430.

[0065] In this embodiment, optionally, the test head control device 422 is a cylinder.

[0066] Some embodiments, refer to Figure 11 The hinge pin assembly device of the present invention further includes an oiling device 600, which is located next to the conveying device 200. The oiling device 600 includes an oiling mold 610, and an oiling mold control device 613 is used to control the movement of the oiling mold 610. The oiling mold 610 includes a front protrusion 611 and a rear protrusion 612, which correspond to the junction positions between the hinge body 110 and the first connecting arm 130 and the second connecting arm 140 on the hinge product 100, respectively, and the junction positions between the hinge cup 120 and the first connecting arm 130 and the second connecting arm 140. Oil outlets are respectively opened on the front protrusion 611 and the rear protrusion 612 of the oiling mold. When the hinge product 100 on the workpiece mold 210 is conveyed to the oiling device 600, the front protrusion 611 and the rear protrusion 612 of the oiling mold press against the junction between the hinge body 110 and the first connecting arm 130 and the second connecting arm 140, as well as the junction between the hinge cup 120 and the first connecting arm 130 and the second connecting arm 140, to perform the oiling operation on the hinge product 100, making the hinge product 100 move more smoothly.

[0067] Some embodiments, refer to Figure 12 The hinge pin assembly device of the present invention also includes a reset device 500, which is located next to the conveying device 200. The reset device 500 includes a reset push plate 510 and a reset push plate control device 511. The reset push plate control device 511 is used to control the movement of the reset push plate 510, and the reset push plate 510 is used to push the hinge cup 120 of the hinge product 100 back to the unfolded state.

[0068] In this embodiment, optionally, the reset device 500 may further include a reset pressing member 520 and a reset pressing member control device 521. The reset pressing member control device 521 is used to control the movement of the reset pressing member 520, that is, when the hinge product 100 on the workpiece mold 210 is transferred to the position of the reset device 500, the hinge product 100 is pressed by the reset pressing member 520.

[0069] In this embodiment, optionally, the reset push plate 510 faces the front and lower part of the hinge product 100.

[0070] In this embodiment, optionally, the reset push plate 510 has reset push plate protrusions on the left and right sides, corresponding to the left and right sides of the hinge cup plate portion 122 of the hinge cup 120.

[0071] In this embodiment, optionally, the reset push plate control device 511 is a cylinder.

[0072] Some embodiments, refer to Figure 2 After the hinge pin assembly device of the present invention completes the processing, the hinge product 100 is sent to the discharge device 700 for conveying.

[0073] In the description of this specification, references to terms such as "some embodiments" or "as one might imagine" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0074] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A hinge pin assembly device, comprising a conveying device (200), wherein a workpiece mold (210) is provided on the conveying device (200) for placing a hinge product (100) to be processed, the hinge product (100) comprising a hinge body (110), a hinge cup (120), a first connecting arm (130), and a second connecting arm (140), the hinge cup (120) being connected to the first connecting arm (130) and the second connecting arm (140) by a U-shaped pin (150), the hinge cup (120) comprising a middle cup body portion (121) and an outer hinge cup plate portion (122), the U-shaped pin (150) comprising a pin middle portion (151) and pin tip portions (152) on both sides, characterized in that: It also includes a pin flattening device (300), which is located next to the conveying device (200). The pin flattening device (300) includes an alignment mold (320), which is used to hold the hinge cup (120) of the hinge product (100) in place. The alignment mold (320) is controlled to move longitudinally forward and backward through the alignment mold control device (321) or connected to the flattening mold (330). The flattening mold (330) is controlled to move up and down through the flattening mold lifting control device (333). The lower support mold (310) is used to support the hinge cup (120) from below; A flattening die (330) has a pressing plane (331) for flattening the end position of the U-shaped pin (150) on the hinge product (100); During the flattening process, the hinge cup (120) is located in front of the hinge body (110), the lower support mold (310) supports the lower side of the cup body part (121) of the hinge cup (120), the alignment mold (320) clamps the side of the cup body part (121) of the hinge cup (120) and the middle part (151) of the pin of the U-shaped pin (150), and the flattening mold (330) flattens the tip part (152) of the pin of the U-shaped pin (150); When the hinge product (100) is in a folded state, the hinge product (100) on the workpiece mold (210) is transferred to the position of the pin flattening device (300), and the alignment mold control device (321) controls the alignment mold (320) to move from the front side of the hinge product (100) toward the hinge product (100) and press against the front side of the hinge cup (120); When the hinge product (100) is in the unfolded state, the hinge product (100) on the workpiece mold (210) is transferred to the pin flattening device (300). The flattening mold lifting control device (333) controls the alignment mold (320) and the flattening mold (330) to descend together. While the alignment mold (320) presses against the side of the cup body part (121) of the hinge cup (120), the flattening mold (330) completes the flattening process of the pin tip part (152).

2. A hinge pin assembly device according to claim 1, characterized in that: The lower mold (310) is controlled to move up and down via the lower mold lifting control device (311).

3. A hinge pin assembly device according to claim 1, characterized in that: The flattened transition bevel (332) is located on the lower side of the flattened plane (331).

4. A hinge pin assembly device according to claim 1, characterized in that: It also includes a pressing mold (340), which is controlled to move up and down by a pressing mold lifting control device (343). The pressing mold (340) is used to press the hinge product (100) on the workpiece mold (210).

5. A hinge pin assembly device according to claim 4, characterized in that: The pressing mold (340) includes a front pressing part (341) and a rear pressing plate (342). The front pressing part (341) has a pressing recess. The pressing recess of the front pressing part (341) is used to press the junction between the hinge body (110) and the first connecting arm (130) and the second connecting arm (140) on the hinge product (100). The rear pressing plate (342) is used to press the rear side of the hinge body (110).

6. A hinge pin assembly device according to claim 1, characterized in that: It also includes a testing device (400), which includes a test photoelectric sensor (410), a test head (420) and a test head control device (422). The test head control device (422) is used to control the movement of the test head (420), the test head (420) is used to actuate the hinge cup (120) of the hinge product (100), and the test photoelectric sensor (410) is used to test the damping buffer time of the hinge cup (120).

7. A hinge pin assembly device according to claim 1, characterized in that: It also includes a reset device (500), which includes a reset push plate (510) and a reset push plate control device (511). The reset push plate control device (511) is used to control the movement of the reset push plate (510), and the reset push plate (510) is used to reset the hinge cup (120) of the hinge product (100).

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