Epoxy plastic packaging material, preparation method and application thereof

Abstract

The present application relates to the field of electronic packaging, and discloses an epoxy plastic packaging material, a preparation method and application thereof. With the total weight of raw materials for preparing the epoxy plastic packaging material being 100%, the raw materials contain 5-19% of epoxy resin, 3-9% of phenolic resin, 0.1-0.5% of curing accelerator, 0.5-30% of modified hollow glass microsphere, 60-90% of inorganic filler, 0.2-1% of release agent, 0.2-0.8% of coupling agent, 0.05-1% of ion capture agent, 0.1-2% of modifier and 0.05-1% of colorant. The epoxy plastic packaging material has good dielectric properties, less overflow and low density, and has good application prospect in the field of semiconductor packaging.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging, specifically to an epoxy molding compound, its preparation method, and its application. Background Technology

[0002] Epoxy molding materials possess many excellent properties and are widely used in the field of electronic packaging. With the continuous development of semiconductor devices, integrated circuit technology is advancing at an astonishing pace towards high integration, high density, and miniaturization. Currently, integrated circuit technology research is shifting its focus to integrating various optoelectronic devices, chemical sensors, electrobiology, actuators, and information processing systems to accomplish the system functions of information acquisition, processing, storage, transmission, and execution—a broader concept of system-integrated chips.

[0003] Silicon dioxide possesses excellent thermal stability and moisture resistance, making it a primary insulating material used between metal interconnects in integrated circuits. However, with advancements in integrated circuit technology, high-speed, high-device-density, low-power, and low-cost chips have become the main products in very large-scale integrated circuit (VLSI) manufacturing. In these integrated circuits, the wire density is continuously increasing, while the wire width and spacing are decreasing. The parasitic effects caused by resistance and capacitance in the interconnects are becoming increasingly pronounced, placing increasingly stringent demands on the chips. Therefore, overcoming the signal propagation delay, inter-line interference, and power dissipation caused by RC delays has become an unavoidable challenge in the development of integrated circuit technology. Reducing the dielectric constant of the material can effectively mitigate these problems. Summary of the Invention

[0004] The purpose of this invention is to overcome the problems of chip signal propagation delay, inter-line interference, and power dissipation in the prior art, and to provide an epoxy encapsulation material with low dielectric constant and good dispersion properties, which has good application prospects in the field of semiconductor packaging.

[0005] To achieve the above objectives, the present invention provides an epoxy molding compound in which the total weight of the raw materials used to prepare the epoxy molding compound is 100%. The raw materials contain 5-19% by weight of epoxy resin, 3-9% by weight of phenolic resin, 0.1-0.5% by weight of curing accelerator, 0.5-30% by weight of modified hollow glass microspheres, 60-90% by weight of inorganic filler, 0.2-1% by weight of release agent, 0.2-0.8% by weight of coupling agent, 0.05-1% by weight of ion trapping agent, 0.1-2% by weight of modifier, and 0.05-1% by weight of colorant.

[0006] Preferably, the modified hollow glass microspheres are prepared as follows:

[0007] (1) Mix water and coupling agent;

[0008] (2) Mix the hollow glass microspheres with the material obtained in step (1) and react them.

[0009] Preferably, in step (1), the mass concentration of the coupling agent is 0.1-10%.

[0010] Preferably, the epoxy resin is selected from one or more of the following: o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, ester ring epoxy resin, heterocyclic epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, dicyclopentadiene epoxy resin, naphthalene ring epoxy resin, and multifunctional epoxy resin.

[0011] Preferably, the phenolic resin is selected from one or more of the following: linear phenolic resin and its derivatives, biphenyl-type phenolic resin, linear phenolic resin and its derivatives, monohydroxy or dihydroxynaphthol phenolic resin and its derivatives, condensates of p-xylene and phenol, condensates of p-xylene and naphthol, and copolymers of dicyclopentadiene and phenol.

[0012] Preferably, the curing accelerator is selected from one or more of triphenylphosphine and its derivatives, imidazoles, and organic amine accelerators.

[0013] Preferably, the inorganic filler is selected from one or more of alumina, titanium dioxide, silicon nitride, aluminum nitride, and silicon dioxide.

[0014] Preferably, the release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, polypropylene wax, and fatty acid wax.

[0015] Preferably, the coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane.

[0016] Preferably, the ion scavenger is selected from one or more of anion scavengers, cation scavengers, and anion-cation composite ion scavengers.

[0017] Preferably, the modifier is selected from one or more of the following: silicone-modified epoxy resin, silicone resin, carboxyl-terminated liquid nitrile rubber, and silicone-containing triblock copolymer.

[0018] Preferably, the colorant is selected from one or more of carbon black, titanium dioxide, and zinc oxide.

[0019] A second aspect of the present invention provides a method for preparing the above-mentioned epoxy molding compound, the method comprising mixing epoxy resin, modified hollow glass microspheres, phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant, and then performing compounding.

[0020] Preferably, the method specifically includes the following steps:

[0021] A1: Epoxy resin and modified hollow glass microspheres are melt-mixed;

[0022] A2: Mix the material obtained in step A1 with phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant, and then knead.

[0023] A third aspect of this invention provides the application of the above-mentioned epoxy molding compound in the field of semiconductor packaging.

[0024] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0025] (1) The epoxy encapsulation material described in this invention has good dielectric properties and its dielectric constant is extremely low;

[0026] (2) The epoxy molding compound of the present invention has good overflow performance, which may be due to the small particle size of the hollow glass microspheres, which can effectively reduce the occurrence of overflow.

[0027] (3) The epoxy molding material described in this invention is lightweight, mainly because hollow glass microspheres have a low density.

[0028] (4) In this invention, by modifying the hollow glass microspheres, it is possible to ensure that the hollow glass microspheres are uniformly dispersed in the epoxy resin, and avoid the problems of overflow and deterioration of dielectric properties of epoxy molding material caused by the agglomeration and uneven dispersion of the hollow glass microspheres. Detailed Implementation

[0029] The following provides a detailed description of specific embodiments of the present invention. It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the scope of the invention.

[0030] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0031] This invention provides an epoxy molding compound, wherein the total weight of the raw materials used to prepare the epoxy molding compound is 100%, and the raw materials contain 5-19% by weight of epoxy resin, 3-9% by weight of phenolic resin, 0.1-0.5% by weight of curing accelerator, 0.5-30% by weight of modified hollow glass microspheres, 60-90% by weight of inorganic filler, 0.2-1% by weight of release agent, 0.2-0.8% by weight of coupling agent, 0.05-1% by weight of ion trapping agent, 0.1-2% by weight of modifier, and 0.05-1% by weight of colorant.

[0032] In specific embodiments, the content of epoxy resin can be 5% by weight, 6% by weight, 7% by weight, 8% by weight, 8.5% by weight, 9% by weight, 10% by weight, 11% by weight, 13% by weight, 15% by weight, 17% by weight, or 19% by weight.

[0033] In specific embodiments, the content of phenolic resin can be 3% by weight, 3.5% by weight, 4% by weight, 5% by weight, 6% by weight, 7% by weight, 8% by weight, or 9% by weight.

[0034] In specific embodiments, the content of the curing accelerator can be 0.1% by weight, 0.15% by weight, 0.2% by weight, 0.3% by weight, 0.4% by weight, or 0.5% by weight.

[0035] In specific embodiments, the content of modified hollow glass microspheres can be 0.5 wt%, 1 wt%, 3 wt%, 5 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, or 30 wt%.

[0036] In specific embodiments, the content of inorganic filler can be 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, or 90% by weight.

[0037] In specific embodiments, the content of the release agent can be 0.2% by weight, 0.4% by weight, 0.6% by weight, 0.8% by weight, or 1% by weight.

[0038] In specific embodiments, the content of the coupling agent can be 0.2% by weight, 0.4% by weight, 0.6% by weight, or 0.8% by weight.

[0039] In specific embodiments, the content of the ion scavenger can be 0.05% by weight, 0.1% by weight, 0.2% by weight, 0.3% by weight, 0.5% by weight, or 1% by weight.

[0040] In specific embodiments, the content of the modifier can be 0.2% by weight, 0.4% by weight, 0.6% by weight, 0.8% by weight, 1% by weight, 1.6% by weight, or 2% by weight.

[0041] In specific embodiments, the content of the colorant can be 0.05% by weight, 0.1% by weight, 0.2% by weight, 0.3% by weight, 0.4% by weight, 0.5% by weight, or 1% by weight.

[0042] In a preferred embodiment, in order to uniformly disperse the hollow glass microspheres in the epoxy resin and avoid the problems of agglomeration and uneven dispersion of the hollow glass microspheres, the preparation method of the modified hollow glass microspheres is as follows:

[0043] (1) Mix water and coupling agent;

[0044] (2) Mix the hollow glass microspheres with the material obtained in step (1) and react them.

[0045] In a preferred embodiment, in step (1), the mass concentration of the coupling agent is 0.1-10%; specifically, the mass concentration of the coupling agent can be 0.1%, 1%, 3%, 4%, 5%, 8% or 10%.

[0046] In a specific implementation, the specific process of step (1) is as follows: add coupling agent to water, stir for 10 to 30 minutes, and prepare a mixed solution with a mass concentration of coupling agent of 0.1 to 10%.

[0047] In a specific implementation, in step (2), the material obtained in step (1) is heated to 50-80°C and stirred for 5-10 minutes. Then, hollow glass microspheres are added and reacted for 1-2 hours under stirring conditions. Then, solid-liquid separation and drying are carried out, followed by post-processing for later use.

[0048] In a specific implementation, solid-liquid separation is achieved by filtration, and drying is carried out in a forced-air drying oven at a temperature of 70–90°C for 20–30 hours.

[0049] In a specific implementation, the post-processing includes crushing and sieving, followed by bagging for later use.

[0050] In this invention, there are no special requirements for the "silane coupling agent" and any silane coupling agent conventionally used in the art can be used; specifically, it can be γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane or γ-aminopropyltrimethoxysilane.

[0051] In a preferred embodiment, the epoxy resin is selected from one or more of o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, ester ring epoxy resin, heterocyclic epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, dicyclopentadiene epoxy resin, naphthalene ring epoxy resin, and multifunctional epoxy resin.

[0052] In a preferred embodiment, the phenolic resin is selected from one or more of the following: linear phenolic resin and its derivatives, biphenyl-type phenolic resin, linear phenolic resin and its derivatives, monohydroxy or dihydroxynaphthol phenolic resin and its derivatives, condensates of p-xylene and phenol, condensates of p-xylene and naphthol, and copolymers of dicyclopentadiene and phenol.

[0053] In a preferred embodiment, the curing accelerator is selected from one or more of triphenylphosphine and its derivatives, imidazoles, and organic amine accelerators.

[0054] In this invention, the inorganic filler is used in a micro powder state with a size of 2 to 200 μm.

[0055] In a preferred embodiment, the inorganic filler is selected from one or more of alumina, titanium dioxide, silicon nitride, aluminum nitride, and silicon dioxide.

[0056] In a specific embodiment, the silicon dioxide is crystalline silicon dioxide and / or molten silicon dioxide.

[0057] In a preferred embodiment, the release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, polypropylene wax, and fatty acid wax.

[0058] In a preferred embodiment, the coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane.

[0059] In a preferred embodiment, the ion scavenger is selected from one or more of anion scavengers, cation scavengers, and anion-cation composite ion scavengers.

[0060] In a preferred embodiment, the modifier is selected from one or more of the following: silicone-modified epoxy resin, silicone resin, carboxyl-terminated liquid nitrile rubber, and silicone-containing triblock copolymer.

[0061] In a preferred embodiment, the colorant is selected from one or more of carbon black, titanium dioxide, and zinc oxide.

[0062] In this invention, by adding modified hollow glass microspheres, the epoxy molding compound exhibits good dielectric properties, minimal overflow, and low density. This is likely due to the low density of the modified hollow glass microspheres, which reduces the material's density and thus lowers its dielectric constant, resulting in good dielectric properties. Furthermore, the small particle size of the modified hollow glass microspheres effectively reduces overflow. Additionally, the uniform dispersion of the modified hollow glass microspheres in the epoxy resin effectively prevents overflow and deterioration of dielectric properties caused by agglomeration and uneven dispersion.

[0063] A second aspect of the present invention provides a method for preparing the above-mentioned epoxy molding compound, the method comprising mixing epoxy resin, modified hollow glass microspheres, phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant, and then performing compounding.

[0064] In a preferred embodiment, the method specifically includes the following steps:

[0065] A1: Epoxy resin and modified hollow glass microspheres are melt-mixed;

[0066] A2: Mix the material obtained in step A1 with phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant, and then knead.

[0067] In a preferred embodiment, in step A1, the melting and mixing temperature is 130–180°C and the time is 30–90 min.

[0068] In a specific implementation, step A1 involves heating the epoxy resin to 130–180°C, then adding equal amounts of modified hollow glass microspheres in 3–6 portions, stirring for 30–90 minutes, cooling, and then pulverizing and sieving.

[0069] In a preferred embodiment, in step A2, the mixing is carried out in an open mill at a temperature of 70–110°C for a time of 5–20 minutes.

[0070] In a specific implementation, step A2 further includes cooling, pulverizing and cakeping the mixed material.

[0071] A third aspect of this invention provides the application of the above-mentioned epoxy molding compound in the field of semiconductor packaging.

[0072] The following examples further illustrate the epoxy molding compound, its preparation method, and its application according to the present invention. These examples are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures; however, the scope of protection of the present invention is not limited to the following examples.

[0073] Unless otherwise specified, the experimental methods used in the following examples are conventional methods in the art. The experimental materials used in the following examples are as follows: o-cresol epoxy resin (SQCN700-3, commercially available from Shengquan Chemical Co., Ltd.), linear phenolic resin (PF8010, commercially available from Shengquan Chemical Co., Ltd.), hollow glass microspheres (S60HS, commercially available from 3M Corporation), 2-ethyl-4-methylimidazole (from Nanjing Lanbian Biochemical Technology Co., Ltd.), coupling agent KH560 (from Jiangsu Chenguang Co., Ltd.), modifier (SF-8241EG, commercially available from Dow Corning), and hydrotalcite (DHT-4C, commercially available from Kyowa Chemical Industry Co., Ltd., Japan). Other experimental materials are commercially available unless otherwise specified.

[0074] Table 1

[0075]

[0076]

[0077] Example 1

[0078] The raw materials for preparing epoxy molding compound S1 are as follows: the epoxy resin is o-cresol epoxy resin, the phenolic resin is linear phenolic resin, the curing accelerator is 2-ethyl-4-methylimidazole, the hollow glass microspheres are of grade S60HS, the inorganic filler is fused silica, the release agent is oxidized polyethylene wax, the coupling agent is KH560, the ion scavenger is hydrotalcite of grade DHT-4C, the modifier is silicone resin of grade SF-8241EG, and the colorant is carbon black. The amounts of the raw materials are shown in Table 1.

[0079] Preparation of modified hollow glass microspheres M1:

[0080] (1) Add the coupling agent to water and stir for 20 minutes to prepare a mixed solution with a mass concentration of 5%;

[0081] (2) Heat the solution from step (1) to 70°C, stir for 5 min, add hollow glass microspheres, stir for 1 h to react, then let stand, filter off the supernatant, and dry the solid product in a forced-air drying oven at 80°C for 24 h to obtain modified hollow glass microspheres M1. Crush and sieve the modified hollow glass microspheres M1, and then pack them into bags for later use.

[0082] Preparation of epoxy molding compound S1:

[0083] A1: Heat the epoxy resin to 140℃ to melt it, add the modified hollow glass microspheres M1 in 4 equal portions, stir for 60 minutes, cool and then crush and sieve.

[0084] A2: Mix the material obtained in step A1 with phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant. Then add the mixed material to a two-roll mill for mixing at a temperature of 85°C for 15 minutes. Then cool, pulverize and cake the mixture.

[0085] Example 2

[0086] The raw materials for preparing epoxy molding compound S2 are as follows: the epoxy resin is o-cresol epoxy resin, the phenolic resin is linear phenolic resin, the curing accelerator is 2-ethyl-4-methylimidazole, the hollow glass microspheres are of grade S60HS, the inorganic filler is fused silica, the release agent is oxidized polyethylene wax, the coupling agent is KH560, the ion scavenger is hydrotalcite of grade DHT-4C, the modifier is silicone resin of grade SF-8241EG, and the colorant is carbon black. The amounts of the raw materials are shown in Table 1.

[0087] Preparation of modified hollow glass microspheres M2:

[0088] (1) Add the coupling agent to water and stir for 15 minutes to prepare a mixed solution with a mass concentration of 8%;

[0089] (2) Heat the solution from step (1) to 75°C, stir for 5 min, add hollow glass microspheres, stir for 2 h to react, then let stand, filter off the supernatant, and dry the solid product in a forced-air drying oven at 80°C for 24 h to obtain modified hollow glass microspheres M2. Crush and sieve the modified hollow glass microspheres M2, and then pack them into bags for later use.

[0090] Preparation of epoxy molding compound S2:

[0091] A1: Heat the epoxy resin to 150℃ to melt it, add the modified hollow glass microspheres M2 in 5 equal portions, stir for 80 minutes, cool and then crush and sieve.

[0092] A2: Mix the material obtained in step A1 with phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant. Then add the mixed material to a two-roll mill for mixing at a temperature of 90°C for 15 minutes. Then cool, pulverize and cake the mixture.

[0093] Example 3

[0094] The raw materials for preparing epoxy molding compound S3 are as follows: the epoxy resin is o-cresol epoxy resin, the phenolic resin is linear phenolic resin, the curing accelerator is 2-ethyl-4-methylimidazole, the hollow glass microspheres are of grade S60HS, the inorganic filler is fused silica, the release agent is oxidized polyethylene wax, the coupling agent is KH560, the ion scavenger is hydrotalcite of grade DHT-4C, the modifier is silicone resin of grade SF-8241EG, and the colorant is carbon black. The amounts of the raw materials are shown in Table 1.

[0095] Preparation of modified hollow glass microspheres M3:

[0096] (1) Add the coupling agent to water and stir for 20 minutes to prepare a mixed solution with a mass concentration of 1%;

[0097] (2) Heat the solution from step (1) to 80°C, stir for 5 min, add hollow glass microspheres, stir for 2 h to react, then let stand, filter off the supernatant, and dry the solid product in a forced-air drying oven at 90°C for 24 h to obtain modified hollow glass microspheres M3. Crush and sieve the modified hollow glass microspheres M3, and then pack them into bags for later use.

[0098] Preparation of epoxy molding compound S3:

[0099] A1: Heat the epoxy resin to 150℃ to melt it, add the modified hollow glass microspheres M3 in 6 equal portions, stir for 90 minutes, cool and then crush and sieve.

[0100] A2: Mix the material obtained in step A1 with phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant. Then add the mixed material to a two-roll mill for mixing at 100°C for 12 minutes. Then cool, pulverize and cake the mixture.

[0101] Example 4

[0102] The raw materials for preparing epoxy molding compound S4 are as follows: the epoxy resin is o-cresol epoxy resin, the phenolic resin is linear phenolic resin, the curing accelerator is 2-ethyl-4-methylimidazole, the hollow glass microspheres are of grade S60HS, the inorganic filler is fused silica, the release agent is oxidized polyethylene wax, the coupling agent is KH560, the ion scavenger is hydrotalcite of grade DHT-4C, the modifier is silicone resin of grade SF-8241EG, and the colorant is carbon black. The amounts of the raw materials are shown in Table 1.

[0103] Preparation of modified hollow glass microspheres M4:

[0104] (1) Add the coupling agent to water and stir for 10 minutes to prepare a mixed solution with a mass concentration of 4%;

[0105] (2) Heat the solution from step (1) to 60°C, stir for 5 min, add hollow glass microspheres, stir for 2 h to react, then let stand, filter off the supernatant, and dry the solid product in a forced-air drying oven at 85°C for 24 h to obtain modified hollow glass microspheres M4. Crush and sieve the modified hollow glass microspheres M4, and then pack them into bags for later use.

[0106] Preparation of epoxy molding compound S4:

[0107] A1: Heat the epoxy resin to 140℃ to melt it, add the modified hollow glass microspheres M4 in 4 equal portions, stir for 80 minutes, cool and then crush and sieve.

[0108] A2: Mix the material obtained in step A1 with phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant. Then add the mixed material to a two-roll mill for mixing at a temperature of 85°C for 10 minutes. Then cool, pulverize and cake the mixture.

[0109] Example 5

[0110] The raw materials for preparing epoxy molding compound S5 are as follows: the epoxy resin is o-cresol epoxy resin, the phenolic resin is linear phenolic resin, the curing accelerator is 2-ethyl-4-methylimidazole, the hollow glass microspheres are of grade S60HS, the inorganic filler is fused silica, the release agent is oxidized polyethylene wax, the coupling agent is KH560, the ion scavenger is hydrotalcite of grade DHT-4C, the modifier is silicone resin of grade SF-8241EG, and the colorant is carbon black. The amounts of the raw materials are shown in Table 1.

[0111] Preparation of modified hollow glass microspheres M5:

[0112] (1) Add the coupling agent to water and stir for 15 minutes to prepare a mixed solution with a mass concentration of 8%;

[0113] (2) Heat the solution from step (1) to 60°C, stir for 5 min, add hollow glass microspheres, stir for 1.5 h to react, then let stand, filter off the supernatant, and dry the solid product in a forced-air drying oven at 80°C for 24 h to obtain modified hollow glass microspheres M5. Crush and sieve the modified hollow glass microspheres M5, and then pack them into bags for later use.

[0114] Preparation of epoxy molding compound S5:

[0115] A1: Heat the epoxy resin to 130℃ to melt it, add the modified hollow glass microspheres M5 in three equal portions, stir for 80 minutes, cool and then crush and sieve.

[0116] A2: Mix the material obtained in step A1 with phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant. Then add the mixed material to a two-roll mill for mixing at a temperature of 90°C for 10 minutes. Then cool, pulverize and cake the mixture.

[0117] Example 6

[0118] The method described in Example 1 was followed, except that all the raw materials were directly melted and mixed together.

[0119] Comparative Example 1

[0120] The implementation was carried out in accordance with Example 1, except that the same weight of silica was used instead of the modified hollow glass microspheres.

[0121] Comparative Example 2

[0122] The implementation was carried out in accordance with Example 2, except that hollow glass microspheres of the same weight were used instead of modified hollow glass microspheres.

[0123] Comparative Example 3

[0124] The implementation was carried out in accordance with Example 3, except that in step (1), the content of modified hollow glass microspheres was 35% by weight, and in step (2), the content of molten silica was 49.7% by weight.

[0125] Test case

[0126] The relevant properties of the products prepared in the above embodiments and comparative examples were tested;

[0127] 1. The gelation time of the product was evaluated according to the provisions of the national standard GB / T 40564-2021, and the test results are shown in Table 2.

[0128] 2. The spiral flow length of the product was evaluated according to the provisions of the national standard GB / T 40564-2021. The test results are shown in Table 2.

[0129] 3. The overflow performance of the product was evaluated according to the provisions of the national standard GB / T 40564-2021. The test results are shown in Table 2.

[0130] 4. The dielectric properties of the product were evaluated according to the provisions of the national standard GB / T 1409-2006, and the test results are shown in Table 2.

[0131] 5. The density of the product was evaluated according to the provisions of the national standard GB / T 1033.1-2008, and the test results are shown in Table 2.

[0132] Table 2

[0133]

[0134] As can be seen from the data in Table 2, the epoxy encapsulation material described in this invention has a low dielectric constant, less overflow, and low density. Therefore, this epoxy encapsulation material is lightweight, has good dielectric properties, and has good application prospects in the field of semiconductor packaging.

[0135] The preferred embodiments of the present invention have been described in detail above; however, the present invention is not limited thereto. Within the scope of the inventive concept, various simple modifications can be made to the technical solutions of the present invention, including combinations of various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. An epoxy molding compound, characterized in that, The total weight of the raw materials used to prepare the epoxy molding compound is 100%, and the raw materials contain 5-19% by weight of epoxy resin, 3-9% by weight of phenolic resin, 0.1-0.5% by weight of curing accelerator, 0.5-25% by weight of modified hollow glass microspheres, 60-90% by weight of inorganic filler, 0.2-1% by weight of release agent, 0.2-0.8% by weight of coupling agent, 0.05-1% by weight of ion trap, 0.1-2% by weight of modifier, and 0.05-1% by weight of colorant; The modified hollow glass microspheres are prepared as follows: (1) Mix water and coupling agent; (2) Mix the hollow glass microspheres with the material obtained in step (1) and react them; The ion scavenger is selected from one or more of anion scavengers, cation scavengers, and anion-cation composite ion scavengers; The modifier is selected from one or more of the following: organosilicon-modified epoxy resin, silicone resin, carboxyl-terminated liquid nitrile rubber, and organosilicon-containing triblock copolymer. The preparation method of the epoxy molding compound specifically includes the following steps: A1: Epoxy resin and modified hollow glass microspheres are melt-mixed; A2: Mix the material obtained in step A1 with phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion scavenger, modifier and colorant, and then knead. The inorganic filler is selected from one or more of alumina, titanium dioxide, silicon nitride, aluminum nitride, and silicon dioxide.

2. The epoxy molding compound according to claim 1, characterized in that, In step (1), the mass concentration of the coupling agent is 0.1-10%.

3. The epoxy molding compound according to claim 1, characterized in that, The epoxy resin is selected from one or more of the following: o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, dicyclopentadiene epoxy resin, and naphthalene ring epoxy resin.

4. The epoxy molding compound according to claim 1 or 3, characterized in that, The phenolic resin is selected from one or more of the following: linear phenolic resin and its derivatives, biphenyl-type phenolic resin, linear phenolic resin and its derivatives, monohydroxy or dihydroxynaphthol phenolic resin and its derivatives, condensates of p-xylene and phenol, condensates of p-xylene and naphthol, and copolymers of dicyclopentadiene and phenol.

5. The epoxy molding compound according to claim 1, characterized in that, The curing accelerator is selected from one or more of triphenylphosphine and its derivatives, imidazoles, and organic amine accelerators.

6. The epoxy molding compound according to claim 5, characterized in that, The release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, polypropylene wax, and fatty acid wax.

7. The epoxy molding compound according to claim 5, characterized in that, The coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane.

8. The epoxy molding compound according to claim 5, characterized in that, The colorant is selected from one or more of carbon black, titanium dioxide, and zinc oxide.

9. The application of the epoxy encapsulation material according to any one of claims 1-8 in the field of semiconductor packaging.

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