Fault alarm method and device, computer device and storage medium

Abstract

This invention relates to the field of server technology and discloses a fault alarm method, apparatus, computer equipment, and storage medium, comprising: detecting the presence status of various components of a target server; acquiring the component configuration information of the target server; determining whether a faulty target component exists in the target server based on the component configuration information and the presence status of various components of the target server; and, when the presence of a target component is determined, issuing an alarm based on the configuration information of the target component. This invention can avoid false alarms.

Description

Technical Field

[0001] This invention relates to the field of server technology, and more specifically to fault alarm methods, devices, computer equipment, and storage media. Background Technology

[0002] In server technology, servers typically determine whether a component is malfunctioning by detecting its presence signals. For each component, if the detected presence signal matches preset characteristics, the component is considered normal. If the detected presence signal does not match the preset characteristics, the component is considered malfunctioning, and an alarm is triggered.

[0003] However, servers may be shipped with some components temporarily downgraded. In this case, if the presence signal of a certain component does not meet the preset characteristics, it may be due to a malfunction of that component or that the component was not configured, which constitutes a downgrade. This can lead to false alarms. Summary of the Invention

[0004] In view of this, the present invention provides a fault alarm method, apparatus, computer equipment and storage medium to solve the problem of false alarms.

[0005] In a first aspect, the present invention provides a fault alarm method, comprising: Detect the presence status of each component of the target server; Obtain the component configuration information of the target server; Based on the component configuration and the presence status of each component of the target server, determine whether there is a faulty target component in the target server; When the target component is confirmed to exist, an alarm is triggered based on the configuration of the target component.

[0006] The fault alarm method provided by this invention has the following advantages: Since there can be various reasons why a component might be listed as "not in place," directly identifying an "not in place" component as the faulty target could lead to false alarms. This solution, however, after determining the presence status of each component, compares it with the component configuration to further determine whether the "not in place" component is indeed the actual faulty target component. This reduces the occurrence of false alarms.

[0007] In one optional implementation, the component configuration includes configuration information of the actual components configured in the target server; determining whether a faulty target component exists in the target server based on the component configuration and the presence status of each component of the target server includes: When it is determined that the configuration information of the actual configuration component includes the configuration information of the first component, and the presence status of the first component is determined to be absent, the first component is determined to be a target component with a fault. or, When it is determined that the first component is in place, or when it is determined that the configuration information of the actual configured component does not include the configuration information of the first component, and when it is determined that the first component is out of place, it is determined that the first component is not faulty.

[0008] Specifically, since the reason a component is not present could be due to either a reduction in specifications or a malfunction, directly identifying the absent component as the faulty target could lead to false alarms. In particular, if an alarm were triggered for a component with reduced specifications every time the server boots up, it would cause significant inconvenience for technical personnel and prevent the server from functioning properly. This solution, however, after determining the presence status of each component, can further determine the actual situation of the absent component by analyzing its configuration information, i.e., whether the absent component is a component with reduced specifications or a malfunctioning component. This avoids false alarms.

[0009] In one optional implementation, the component configuration information includes configuration information of fully configured components in the target server and configuration information of actually configured components in the target server; determining whether there is a faulty target component in the target server based on the component configuration information and the on-premises status of each component in the target server includes: Based on the configuration information of the fully configured components and the configuration information of the actually configured components, the configuration information of the components with reduced configuration is determined; When it is determined that the configuration information of the reduced-configuration component does not include the configuration information of the first component, and the presence status of the first component is determined to be absent, the first component is determined to be a target component with a fault. or, When it is determined that the configuration information of the reduced-configuration component includes the configuration information of the first component, and the presence status of the first component is determined to be either absent or present, it is determined that the first component is not faulty.

[0010] Specifically, since the reason a component is not present could be due to either a reduction in specifications or a malfunction, directly identifying the absent component as the faulty target could lead to false alarms. In particular, if an alarm were triggered for a component with reduced specifications every time the server boots up, it would cause significant inconvenience for technical personnel and prevent the server from functioning properly. This solution, however, after determining the presence status of each component, can further determine the actual situation of the absent component by analyzing its configuration information, i.e., whether the absent component is a component with reduced specifications or a malfunctioning component. This avoids false alarms.

[0011] In an optional implementation, when the target server includes at least one heat dissipation component among its various components, and it is determined that at least one of the heat dissipation components is a target heat dissipation component in an in-situ state, the method further includes: Obtain a first correlation index value between the target heat dissipation component and the first fan, and obtain a preset speed increase value of the second fan with the largest index value of the first correlation index value, wherein the first fan is any one of at least one fan of the target server. The speed increase value of the first fan is determined based on the first correlation index value and the preset speed increase value. Based on the increase in the speed of the first fan, the speed of the first fan is increased.

[0012] Specifically, since servers may contain multiple fans, maximizing the fan speed for all in-place heat dissipation components would lead to excessive power consumption. Furthermore, server noise levels are also high when all fans are running at maximum speed. Additionally, the correlation between the same component and different fans varies. For fans with low correlation, even maximizing their speed will not significantly improve heat dissipation, resulting in wasted resources. This solution, however, uses correlation indicators between fans and the components requiring cooling to adjust the speed of each fan specifically. This ensures safe heat dissipation while effectively reducing fan power consumption, minimizing resource waste, and reducing server noise.

[0013] In an optional implementation, when each component of the target server includes at least one heat dissipation component, and it is determined that there are multiple target heat dissipation components in an in-situ state among the at least one heat dissipation component, the method further includes: Count the number of the target heat dissipation components; For the third fan, obtain a first correlation index value between each target heat dissipation component and the third fan, and obtain a weight factor for each target heat dissipation component, wherein the third fan is any one of at least one fan of the target server; Based on the first correlation index value between each target heat dissipation component and the third fan, and the weight factor of each target heat dissipation component, the second correlation index value between the third fan and all target heat dissipation components is determined. The target speed increase value is determined based on the number of the target heat dissipation components, the type of each target heat dissipation component, and the second correlation index value between each fan and all target heat dissipation components; The speed increase value of the third fan is determined based on the second correlation index value between the third fan and all target heat dissipation components, the target speed increase value, and the second correlation index value between the fourth fan and all target heat dissipation components, wherein the fourth fan is the fan with the largest second correlation index value. The speed of the third fan is increased based on the increase value of the third fan's speed.

[0014] Specifically, since a server may have multiple fans, if all fans are run at maximum speed to cool in-place components, it will lead to excessive power consumption. Furthermore, server noise will be relatively high when all fans are running at maximum speed. Additionally, the correlation between different components and individual fans varies. For fans with low correlation, even if their speed is increased to maximum, the cooling effect on components will be minimal, resulting in wasted resources. This solution, however, uses correlation indicators between fans and components requiring cooling to adjust the speed of each fan specifically. This ensures safe cooling while effectively reducing fan power consumption, minimizing resource waste, and reducing server noise.

[0015] In one optional implementation, the step of determining the speed increase value of the first fan based on the first correlation index value and the preset speed increase value is expressed by the following expression: d N =l N ·d max1 / k max1 Where, d N Let l be the speed increase value of the Nth fan. N Let d be the first correlation index value for the Nth fan. max1 k is the preset speed increase value. max1 is the first correlation index value of the second fan, where N is an integer greater than zero.

[0016] Specifically, because the correlation between the target heat dissipation component and each fan varies, for some fans with low correlation, even if their speed is increased to the maximum, the heat dissipation effect on the component is not significant, resulting in wasted resources. This solution, however, uses the correlation index between the fan and the component requiring heat dissipation to adjust the speed of each fan specifically. This ensures heat dissipation safety while effectively reducing fan power consumption, resource waste, and server noise.

[0017] In one optional implementation, a second correlation index value between the third fan and all target heat dissipation components is determined based on a first correlation index value between each target heat dissipation component and the third fan, and a weighting factor for each target heat dissipation component. Use the following expression:

[0018] in, The second correlation index value for the Nth fan. Let be the first correlation index value between the Nth fan and the mth target heat dissipation component. is the weighting factor for the m-th target heat dissipation component.

[0019] Specifically, when multiple target heat dissipation components are in place simultaneously, the correlation between a certain fan and all target heat dissipation components can be considered to determine the degree of influence of the fan on all target heat dissipation components. Furthermore, based on the second correlation index value corresponding to each fan determined by formula (2), the speed of each fan can be adjusted in a targeted manner. In this way, while ensuring heat dissipation safety, fan power consumption can be effectively reduced, resource waste and server noise can be reduced.

[0020] Secondly, the present invention provides a fault alarm device, comprising: The detection module is used to detect the presence status of various components of the target server; The acquisition module is used to acquire the component configuration information of the target server; The determination module is used to determine whether there is a faulty target component in the target server based on the component configuration and the in-situ status of each component of the target server. An alarm module is used to trigger an alarm based on the configuration of the target component when the presence of the target component is determined.

[0021] In a second aspect, the present invention provides a computer device, comprising: a memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the computer instructions to perform the fault alarm method of the first aspect or any corresponding embodiment described above.

[0022] Fourthly, the present invention provides a computer-readable storage medium storing computer instructions for causing a computer to execute the fault alarm method of the first aspect or any corresponding embodiment thereof. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a flowchart illustrating a fault alarm method according to an embodiment of the present invention; Figure 2 This is a flowchart illustrating another fault alarm method according to an embodiment of the present invention; Figure 3 This is a flowchart illustrating another fault alarm method according to an embodiment of the present invention; Figure 4 This is a schematic flowchart of a method for heat dissipation of components according to an embodiment of the present invention; Figure 5 This is a schematic flowchart of a method for heat dissipation of components according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the target server according to an embodiment of the present invention; Figure 7 This is a flowchart illustrating another fault alarm method according to an embodiment of the present invention; Figure 8 This is a structural block diagram of a fault alarm device according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] In the field of server technology, servers are typically equipped with various types of components. The connections between these components and the server can malfunction, causing the server's Baseboard Management Controller (BMC) to detect that a component is missing, which in turn prevents the server from functioning properly. Therefore, the server's Baseboard Management Controller can detect the presence of these components so that technicians can promptly repair any problematic connections.

[0027] This invention provides a fault alarm method that avoids false alarms by pre-storing the server's component configuration information in the server.

[0028] According to an embodiment of the present invention, a fault alarm method embodiment is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0029] This embodiment provides a fault alarm method, which can be used in the aforementioned baseboard management controller. Figure 1 This is a flowchart of a fault alarm method according to an embodiment of the present invention, such as... Figure 1 As shown, the process includes the following steps: Step S101: Detect the presence status of each component of the target server.

[0030] The components may include at least one of the following: a central processing unit (CPU), memory, a fan, and a power supply unit (PSU).

[0031] Specifically, after determining that its target server is powered on, the baseboard management controller can detect the presence signals of each component using pre-set codes. These pre-set codes include presence detection codes for each fully configured component of the target server; the presence signals can be pin signals, PRSENT signals, etc. For each component of the target server, the baseboard management controller can determine its presence status (which can include "present" and "absent") based on the characteristics of the detected presence signal. Specifically, the steps for determining the presence status of a component based on the characteristics of its detected presence signal can include: When the board management controller detects that the characteristics of the presence signal of the component are consistent with the preset characteristics, it determines that the component is in place; when the board management controller detects that the characteristics of the presence signal of the component are inconsistent with the preset characteristics, it determines that the component is not in place. The characteristics of the presence signal can be the waveform characteristics of the presence signal.

[0032] In some possible implementations, when the target server's components include a CPU, memory, fan, and power supply, the target server's Basic Input Output System (BIOS) can pre-store a first detection code, which includes presence detection code for the CPU and memory. The BIOS can determine the presence status of the CPU and memory based on the first detection code (the presence status can include both "present" and "absent"), and send this presence status to the baseboard management controller (BMC). The BMC can pre-store a second detection code, where the first detection code includes presence detection code for the fan and power supply. The BMC can determine the presence status of the fan and power supply based on the second detection code. In this way, the BMC can summarize the presence status of the CPU, memory, fan, and power supply.

[0033] Step S102: Obtain the component configuration information in the target server.

[0034] The component configuration information may include the component type, identification, and whether it has been actually configured, as well as information such as the component's manufacturer, serial number, and manufacturing date.

[0035] Specifically, the target server's storage chip can pre-store the component configuration information of the target server. Thus, after the baseboard management controller determines the presence status of each component, it can send a first retrieval command to the storage chip. Upon receiving the first retrieval command, the storage chip can retrieve the component configuration information from its stored data and send the configuration information to the baseboard management controller. The storage chip can be a Field Replacement Unit (FRU), and the type of storage chip can be Electrically Erasable Programmable Read Only Memory (EEPROM).

[0036] Step S103: Based on the component configuration and the presence status of each component of the target server, determine whether there is a faulty target component in the target server.

[0037] Specifically, after the baseboard management controller receives the component configuration information, it can first identify the components whose status is not in the location, and then compare the components that are not in the location with the component configuration information to determine whether the components that are not in the location are the target components with faults.

[0038] Step S104: When the existence of the target component is determined, an alarm is triggered based on the configuration of the target component.

[0039] Specifically, when the target component is determined not to exist, the baseboard management controller does not issue an alarm and operates normally. When the target component is determined to exist, the baseboard management controller generates an alarm message based on the target component's configuration and sends it to the client. The alarm message may include the identifier of the target component. Upon receiving the alarm message, the client can display the alarm information and also alert technicians via an alarm ring.

[0040] The fault alarm method provided in this embodiment addresses the issue that there are various reasons why a component might be absent. Therefore, directly identifying an absent component as the target component for a fault could lead to false alarms. However, this solution, after determining the presence status of each component, compares it with the component configuration to further determine whether the absent component is indeed the target component experiencing a fault. This reduces the occurrence of false alarms.

[0041] This embodiment provides a fault alarm method, which can be used in the aforementioned baseboard management controller. Figure 2 This is a flowchart of a fault alarm method according to an embodiment of the present invention, such as... Figure 2 As shown, the process includes the following steps: Step S201: Detect the presence status of each component of the target server.

[0042] Step S202: Obtain the component configuration information in the target server.

[0043] The specific processing of steps S201 to S202 is similar to that of steps S101 to S102, and will not be repeated here.

[0044] Step S203: Based on the component configuration and the presence status of each component of the target server, determine whether there is a faulty target component in the target server.

[0045] Specifically, when the component configuration only includes the configuration information of the actual components in the target server, step S203 above may include: Step S2031: When it is determined that the configuration information of the actual configuration component includes the configuration information of the first component, and the presence status of the first component is determined to be absent, the first component is determined to be the target component with a fault.

[0046] The first component is any one of the components of the target server.

[0047] Specifically, the substrate management controller can first determine the presence status of the first component. If the presence status of the first component is "not in place," it indicates that the first component may be faulty or has not been actually configured. Therefore, the substrate management controller can determine whether the configuration information of the actually configured component includes the configuration information of the first component. If the configuration information of the actually configured component includes the configuration information of the first component, it can be concluded that the first component is an actually configured component and has failed.

[0048] Step S2032: When it is determined that the presence status of the first component is in place, or when it is determined that the configuration information of the actual configured component does not include the configuration information of the first component, and when it is determined that the presence status of the first component is not in place, it is determined that the first component has no fault.

[0049] Specifically, when the presence status of the first component is determined to be "in place," it can be determined that the first component is an actually configured component and there is no fault. Alternatively, when the presence status of the first component is "out of place," it indicates that the first component may be faulty or has not been actually configured. Therefore, the baseboard management controller can determine whether the configuration information of the actually configured components includes the configuration information of the first component. If the configuration information of the actually configured components does not include the configuration information of the first component, it can be determined that the first component is not an actually configured component, which is a case of de-configuration, not a fault.

[0050] Step S204: When the existence of the target component is determined, an alarm is triggered based on the configuration of the target component.

[0051] The specific processing of step S204 is similar to that of step S104, and will not be described again here.

[0052] The fault alarm method provided in this embodiment addresses the issue that a component's absence could be due to either a reduction in specifications or a malfunction. Therefore, directly identifying the absent component as the faulty target could lead to false alarms. In particular, if an alarm were triggered for a component with reduced specifications every time the server boots up, it would cause significant inconvenience for technical personnel and prevent the server from functioning properly. This solution, however, after determining the presence status of each component, can further determine the actual situation of the absent component by analyzing its configuration information, thus identifying whether the absent component is a component with reduced specifications or a malfunctioning component. This avoids false alarms.

[0053] This embodiment provides a fault alarm method, which can be used in the aforementioned baseboard management controller. Figure 3 This is a flowchart of a fault alarm method according to an embodiment of the present invention, such as... Figure 3 As shown, the process includes the following steps: Step S301: Detect the presence status of each component of the target server.

[0054] Step S302: Obtain the component configuration information in the target server.

[0055] The specific processing of steps S301 to S302 is similar to that of steps S101 to S102, and will not be repeated here.

[0056] Step S303: Based on the component configuration and the presence status of each component of the target server, determine whether there is a faulty target component in the target server.

[0057] Specifically, when the component configuration includes the configuration information of the fully configured components in the target server and the configuration information of the actually configured components in the target server, the above step S303 may include: Step S3031: Determine the configuration information of the components to be reduced based on the configuration information of the fully equipped components and the configuration information of the actual configured components.

[0058] Specifically, the baseboard management controller can compare the configuration information of the fully configured components with the configuration information of the actually configured components. Specifically, it can compare the component identifiers in the configuration information of the fully configured components with the component identifiers in the configuration information of the actually configured components to determine the difference in configuration information, that is, to determine the configuration information of the components that are reduced in configuration.

[0059] In some possible implementations, the baseboard management controller can perform alarm shielding for each component that has been removed from the system based on the configuration information of the component. That is, when it is determined that the presence status of the component is not present, no alarm operation is performed.

[0060] Step S3032: When it is determined that the configuration information of the component to be reduced does not include the configuration information of the first component, and the presence status of the first component is determined to be absent, the first component is determined to be the target component with a fault.

[0061] Specifically, the substrate management controller can first determine the presence status of the first component. If the presence status of the first component is "not in place," it indicates that the first component may be faulty or has not been actually configured. Therefore, the substrate management controller can determine whether the configuration information of the removed component includes the configuration information of the first component. If the configuration information of the removed component does not include the configuration information of the first component, it indicates that the first component is an actually configured component and has failed.

[0062] Step S3033: When it is determined that the configuration information of the reduced component includes the configuration information of the first component, and the presence status of the first component is determined to be absent, or the presence status of the first component is determined to be present, it is determined that the first component is not faulty.

[0063] Specifically, when the presence status of the first component is "not in," it indicates that the first component may be faulty or has not been actually configured. Therefore, the baseboard management controller can determine whether the configuration information of the removed components includes the configuration information of the first component. If the configuration information of the removed components includes the configuration information of the first component, it can be concluded that the first component is a removed component and is not faulty. Alternatively, when the presence status of the first component is "in in," it can be determined that the first component is not a removed component and is not faulty.

[0064] In some possible implementations, the component configuration information may include the configuration information of components that have been removed from the configuration. In this way, the processing of step S3031 can be omitted in subsequent processes, which can speed up data processing and allow the faulty component to be identified more quickly.

[0065] Step S304: When the existence of the target component is determined, an alarm is triggered based on the configuration of the target component.

[0066] The specific processing of step S304 is similar to that of step S104, and will not be described again here.

[0067] The fault alarm method provided in this embodiment addresses the issue that a component's absence could be due to either a reduction in specifications or a malfunction. Therefore, directly identifying the absent component as the faulty target could lead to false alarms. In particular, if an alarm were triggered for a component with reduced specifications every time the server boots up, it would cause significant inconvenience for technical personnel and prevent the server from functioning properly. This solution, however, after determining the presence status of each component, can further determine the actual situation of the absent component by analyzing its configuration information, thus identifying whether the absent component is a component with reduced specifications or a malfunctioning component. This avoids false alarms.

[0068] When the target server includes at least one heat dissipation component, and it is determined that at least one of the heat dissipation components is in an in-situ state, the target heat dissipation component can be cooled. This embodiment provides a method for adjusting fan speed to cool the target heat dissipation component. This embodiment can be used in the aforementioned baseboard management controller. Figure 4 This is a flowchart of a method for heat dissipation of components according to an embodiment of the present invention, such as... Figure 4 As shown, the process includes the following steps: Step S401: Obtain the first correlation index value between the target heat dissipation component and the first fan, and obtain the preset speed increase value of the second fan with the largest first correlation index value.

[0069] The first fan can be any one of the fans in at least one fan of the target server, and the second fan can also be any one of the fans in at least one fan of the target server. The heat dissipation component can be a smart network interface card, an Open Compute Project (OCP) network interface card, or a Unit Baseboard (UBB), among others. The first relevant metric value can be determined by technicians using statistical data (e.g., temperature, power consumption, etc.) of each fan and the target heat dissipation component during operation.

[0070] Specifically, when the baseboard management controller determines that a target heat dissipation component is in place, it can send a second acquisition instruction to the memory chip. After receiving the second acquisition instruction, the memory chip determines the first correlation index value between the target heat dissipation component and each fan from the data stored in it, for example, Table 1.

[0071] Table 1

[0072] Wherein, k1 is the first correlation index value between the target heat dissipation component 001 and the fan 1, k2 is the first correlation index value between the target heat dissipation component 001 and the fan 2, k3 is the first correlation index value between the target heat dissipation component 001 and the fan 3, and so on.

[0073] In addition, the baseboard management controller can sort each fan from largest to smallest based on the first correlation index value, determine the second fan with the largest first correlation index value, and send a third acquisition command to the memory chip. This third acquisition command includes the identification information of the second fan. Upon receiving the third acquisition command, the memory chip retrieves the preset speed increase value corresponding to the identification information of the second fan from its stored data.

[0074] Step S402: Determine the speed increase value of the first fan based on the first correlation index value and the preset speed increase value.

[0075] The preset speed increase value can be determined by technicians based on statistical data (such as temperature and power consumption) of the target heat dissipation component during operation.

[0076] Specifically, the baseboard management controller can determine the fan speed increase value corresponding to each first correlation index value based on each first correlation index value and the preset speed increase value.

[0077] In some alternative implementations, step S402 can be expressed as follows: d N =l N ·d max1 / k max1 (1) Where, d N Let l be the speed increase value of the Nth fan. N Let d be the first correlation index value for the Nth fan. max1 k is the preset speed increase value. max1 is the first correlation index value for the second fan, where N is a positive integer.

[0078] Step S403: Increase the speed of the first fan according to the speed increase value of the first fan.

[0079] Specifically, the baseboard management controller can increase the speed of the corresponding fan based on the speed increase value of each fan. When the temperature of the target heat dissipation component is detected to be within the preset temperature threshold range, it can control each fan to stop rotating.

[0080] The heat dissipation method for components provided in this embodiment addresses the issue that since servers may have multiple fans, maximizing the fan speed for all in-place cooling components would lead to excessive power consumption. Furthermore, server noise would be significant when all fans are running at maximum speed. Additionally, the correlation between the same component and different fans varies. For fans with low correlation, maximizing their speed will not significantly improve heat dissipation, resulting in wasted resources. This solution, however, utilizes correlation indicators between fans and the components requiring cooling to selectively adjust the speed of each fan. This ensures heat dissipation safety while effectively reducing fan power consumption, resource waste, and server noise.

[0081] When each component of the target server includes at least one heat dissipation component, and it is determined that there are multiple target heat dissipation components in an in-situ state among the at least one heat dissipation component, heat dissipation can be performed on the target heat dissipation component. This embodiment provides a method for adjusting fan speed to dissipate heat from the target heat dissipation component. This embodiment can be used in the aforementioned baseboard management controller. Figure 5 This is a flowchart of a method for heat dissipation of components according to an embodiment of the present invention, such as... Figure 5 As shown, the process includes the following steps: Step S501: Count the number of target heat dissipation components.

[0082] Specifically, since the number of target heat dissipation components involves adjustments to specific heat dissipation strategies, the baseboard management controller needs to count the number of target heat dissipation components.

[0083] Step S502: For the third fan, obtain the first correlation index value between each target heat dissipation component and the third fan, and obtain the weight factor of each target heat dissipation component.

[0084] The third fan is any one of at least one fans in the target server.

[0085] Specifically, when the baseboard management controller counts the number of target heat dissipation components, it can send a fourth acquisition instruction to the memory chip. After receiving the fourth acquisition instruction, the memory chip determines the first correlation index value between each target heat dissipation component and each fan from its stored data, for example, Table 2, and determines the weight factor of each target heat dissipation component, and sends it to the baseboard management controller.

[0086] Table 2

[0087] Wherein, k11 is the first correlation index value between target heat dissipation component 001 and fan 1, k12 is the first correlation index value between target heat dissipation component 002 and fan 1, k21 is the first correlation index value between target heat dissipation component 001 and fan 2, and so on.

[0088] Step S503: Determine the second correlation index value between the third fan and all target heat dissipation components based on the first correlation index value between each target heat dissipation component and the third fan, and the weight factor of each target heat dissipation component.

[0089] Specifically, after receiving the first correlation index value between each target heat dissipation component and each fan, and the weight factor of each target heat dissipation component, the baseboard management controller can determine the second correlation index value between each fan and all target heat dissipation components based on the first correlation index value between the fan and each target heat dissipation component, and the weight factor of each target heat dissipation component.

[0090] In some alternative implementations, step S503 can be expressed as follows: (2) in, The second correlation index value for the Nth fan. Let be the first correlation index value between the Nth fan and the mth target heat dissipation component. is the weighting factor for the m-th target heat dissipation component.

[0091] For example, the first correlation index values ​​between fan 1 and each target heat dissipation component are k11, k12, and k13, respectively, and the second correlation index of fan 1 can be... .

[0092] Step S504: Determine the target speed increase value based on the number of target heat dissipation components, the type of each target heat dissipation component, and the second correlation index value between each fan and all target heat dissipation components.

[0093] Specifically, the baseboard management controller can determine the target model corresponding to the number of target heat dissipation components. Further, the number of target heat dissipation components, the type of each target heat dissipation component, and the second correlation index value between each fan and all target heat dissipation components are input into the target model to obtain the target speed increase value.

[0094] In some optional implementations, the specific processing of step S504 may be: For each target heat dissipation component, the baseboard management controller can determine the maximum speed increase value corresponding to that type, as well as the number of target heat dissipation components of that type, based on the type of the target heat dissipation component. Further, based on the number of target heat dissipation components of that type and the total number of target heat dissipation components, the proportion of that type of target heat dissipation component is determined. Then, based on the proportion of each type of target heat dissipation component and the maximum speed increase value, a preset speed increase value is determined for each type of target heat dissipation component. Based on the preset speed value for each type of target heat dissipation component, an average preset speed value is determined. Finally, based on the average preset speed value and the second correlation index value between each fan and all target heat dissipation components, the target speed increase value is determined.

[0095] Since different types of target heat dissipation components have different properties, taking into account the type of target heat dissipation component and the number of each type of target heat dissipation component can make the determined target speed increase value more accurate.

[0096] Step S505: Determine the speed increase value of the third fan based on the second correlation index value between the third fan and all target heat dissipation components, the target speed increase value, and the second correlation index value between the fourth fan and all target heat dissipation components.

[0097] Among them, the fourth fan is the fan with the highest second correlation index value.

[0098] Specifically, the baseboard management controller can first identify the fan with the highest second correlation index value, i.e., the fourth fan. Further, the target speed increase value can be determined as the speed increase value of the fourth fan. For the other fans besides the fourth fan, the baseboard management controller can determine the speed increase value of each fan based on the second correlation index between each fan and all target heat dissipation components, and the second correlation index value between the fourth fan and all target heat dissipation components.

[0099] In some alternative implementations, step S505 can be expressed as follows: d N =k N ·d max2 / k max2 (3) Where, d N Let k be the speed increase value of the Nth fan. N d is the second correlation index value between the Nth fan and all target heat dissipation components. max2 k is the target speed increase value. max2 is the second correlation index value between the fourth fan and all target heat dissipation components, where N is a positive integer.

[0100] Step S506: Increase the speed of the third fan according to the speed increase value of the third fan.

[0101] The specific processing of step S506 is similar to that of step S403, and will not be repeated here.

[0102] The heat dissipation method for components provided in this embodiment addresses the issue that since servers may have multiple fans, maximizing the fan speed for all in-place cooling components would lead to excessive power consumption. Furthermore, operating all fans at maximum speed would result in significant server noise. Additionally, the correlation between different components and individual fans varies. For fans with low correlation, even maximizing their speed will not significantly improve heat dissipation, leading to resource waste. This solution, however, utilizes correlation indicators between fans and the components requiring cooling to selectively adjust the speed of each fan. This ensures heat dissipation safety while effectively reducing fan power consumption, resource waste, and server noise.

[0103] This embodiment provides a fault alarm method, which can be used for the aforementioned target server. The target server can be structured as follows: Figure 6 As shown, it includes the BMC, BIOS, memory chip, and various components whose presence status needs to be detected. These components may include the CPU, memory, fan, and PSU mentioned above. Figure 7 This is a flowchart of a fault alarm method according to an embodiment of the present invention, such as... Figure 7 As shown, the process includes the following steps: Step S701: BMC determines that its target server is powered on.

[0104] Specifically, once the BMC receives the power-on command, it determines that the target server is powered on.

[0105] In step S702, the BIOS detects the presence status of the CPU and memory, and sends the presence status of the CPU and memory to the BMC.

[0106] In step S703, the BMC detects the presence status of the fan and PSU, and summarizes the presence status of the CPU, memory, fan and PSU.

[0107] The specific processing of steps S702 and S703 is similar to that of step S101, and will not be repeated here.

[0108] In step S704, the BMC obtains the configuration information of the actual configuration component from the memory chip.

[0109] In step S705, the BMC determines whether the configuration information of the component whose status is in place is the same as the configuration information of the actual configured component. If yes, then step S706 is executed; otherwise, step S707 is executed.

[0110] Step S706: Alarm activated.

[0111] The specific processing of steps S704 to S706 is similar to that of steps S102 to S104, and will not be repeated here.

[0112] In step S707, the BMC obtains the configuration information of the fully configured components from the memory chip, and determines the configuration information of the components to be reduced based on the configuration information of the actual configured components and the configuration information of the fully configured components.

[0113] The specific processing of step S707 is similar to that of step S3031, and will not be described again here.

[0114] In step S708, the BMC masks the alarm information for the components that have been removed from the configuration.

[0115] Specifically, BMC can mask the detection codes corresponding to the missing parts, or mask the alarm information of the missing parts when it is determined that the missing parts are not in place.

[0116] The fault alarm method provided in this embodiment addresses the issue that there are various reasons why a component might be absent. Therefore, directly identifying the absent component as the target of the fault could lead to false alarms. In this solution, after determining the presence status of each component, the system compares it with the configuration information of the actual configured components to further determine whether the absent component is indeed the target of the fault. Furthermore, the configuration information of components with missing parts can be predetermined, and alarm information for these components can be masked. This dual approach reduces the occurrence of false alarms.

[0117] This embodiment also provides a fault alarm device for implementing the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can refer to a combination of software and / or hardware that performs a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0118] This embodiment provides a fault alarm device, such as Figure 8 As shown, it includes: The detection module 801 is used to detect the presence status of various components of the target server.

[0119] Module 802 is used to obtain the component configuration information in the target server.

[0120] The determination module 803 is used to determine whether there is a faulty target component in the target server based on the component configuration and the in-situ status of each component of the target server.

[0121] The alarm module 804 is used to trigger an alarm based on the configuration of the target component when the presence of the target component is determined.

[0122] In one alternative implementation, the determining module 803 is configured to: When it is determined that the configuration information of the actual configured component includes the configuration information of the first component, and the presence status of the first component is determined to be absent, the first component is determined to be the target component with a fault.

[0123] or, When it is determined that the first component is in place, or when it is determined that the configuration information of the actual configured components does not include the configuration information of the first component, and when it is determined that the first component is out of place, it is determined that the first component is not faulty.

[0124] In one optional implementation, the component configuration information includes configuration information of fully configured components in the target server and configuration information of actually configured components in the target server. The determination module 803 is used for: Based on the configuration information of the fully equipped components and the actual configuration information of the components, determine the configuration information of the components that are to be removed.

[0125] When it is determined that the configuration information of the component to be reduced does not include the configuration information of the first component, and the presence status of the first component is determined to be absent, the first component is determined to be the target component with a fault.

[0126] or, When it is determined that the configuration information of the component being downgraded includes the configuration information of the first component, and the presence status of the first component is determined to be either absent or present, it is determined that the first component is not faulty.

[0127] In an optional implementation, when the target server includes at least one heat dissipation component, and it is determined that at least one of the heat dissipation components is a target heat dissipation component with an in-situ status, the acquisition module 802 is further configured to: Obtain a first correlation index value between the target heat dissipation component and the first fan, and obtain a preset speed increase value of the second fan with the largest first correlation index value, wherein the first fan is any one of at least one fan of the target server; Module 803 is also used for: The speed increase value of the first fan is determined based on the first correlation index value and the preset speed increase value. Based on the increase in the speed of the first fan, the speed of the first fan is increased.

[0128] In an optional implementation, when each component of the target server includes at least one heat dissipation component, and it is determined that there are multiple target heat dissipation components in the at least one heat dissipation component with an in-situ state, the determining module 803 is further configured to: Count the number of target heat dissipation components; For the third fan, obtain the first correlation index value between each target heat dissipation component and the third fan, and obtain the weight factor of each target heat dissipation component, wherein the third fan is any one of the fans of at least one of the target server. Based on the first correlation index value between each target heat dissipation component and the third fan, and the weighting factor of each target heat dissipation component, the second correlation index value between the third fan and all target heat dissipation components is determined. The target speed increase is determined based on the number of target heat dissipation components, the type of each target heat dissipation component, and the second correlation index value between each fan and all target heat dissipation components. The speed increase value of the third fan is determined based on the second correlation index value between the third fan and all target heat dissipation components, the target speed increase value, and the second correlation index value between the fourth fan and all target heat dissipation components. The fourth fan is the fan with the largest second correlation index value. Based on the increase in the speed of the third fan, the speed of the third fan is increased.

[0129] In one optional implementation, the speed increase value of the first fan is determined based on the first correlation index value and the preset speed increase value, using the following expression: d N =l N ·d max1 / k max1 Where, d N Let l be the speed increase value of the Nth fan. N Let d be the first correlation index value for the Nth fan. max1 k is the preset speed increase value. max1 is the first correlation index value for the second fan, where N is a positive integer.

[0130] In one optional implementation, a second correlation index value between the third fan and all target heat dissipation components is determined based on a first correlation index value between each target heat dissipation component and the third fan, and a weighting factor for each target heat dissipation component. Use the following expression:

[0131] in, The second correlation index value for the Nth fan. Let be the first correlation index value between the Nth fan and the mth target heat dissipation component. is the weighting factor for the m-th target heat dissipation component.

[0132] Further functional descriptions of the above modules and units are the same as those in the corresponding embodiments described above, and will not be repeated here.

[0133] In this embodiment, the fault alarm device is presented in the form of a functional unit. Here, a unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that execute one or more software or fixed programs, and / or other devices that can provide the above functions.

[0134] This invention also provides a computer device having the above-described features. Figure 8 The fault alarm device shown.

[0135] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure of a computer device provided in an optional embodiment of the present invention, such as... Figure 9 As shown, the computer device includes one or more processors 20, memory 20, and interfaces for connecting the components, including high-speed interfaces and low-speed interfaces. The components communicate with each other via different buses and can be mounted on a common motherboard or otherwise installed as needed. The processors can process instructions executed within the computer device, including instructions stored in or on memory to display graphical information of a GUI on external input / output devices (such as display devices coupled to the interfaces). In some alternative implementations, multiple processors and / or multiple buses can be used with multiple memories and multiple memory modules, if desired. Similarly, multiple computer devices can be connected, each providing some of the necessary operations (e.g., as a server array, a group of blade servers, or a multiprocessor system). Figure 9 Take a processor 20 as an example.

[0136] Processor 20 may be a central processing unit, a network processor, or a combination thereof. Processor 20 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The programmable logic device may be a complex programmable logic device (CAMP), a field-programmable gate array (FPGA), a general-purpose array logic (GPA), or any combination thereof.

[0137] The memory 20 stores instructions executable by at least one processor 20 to cause the at least one processor 20 to perform the method shown in the above embodiments.

[0138] The memory 20 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function. The data storage area may store data created based on the use of the computer device. Furthermore, the memory 20 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, the memory 20 may optionally include memory remotely located relative to the processor 20, which can be connected to the computer device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0139] Memory 20 may include volatile memory, such as random access memory. Memory may also include non-volatile memory, such as flash memory, hard disk, or solid-state drive. Memory 20 may also include combinations of the above types of memory.

[0140] The computer device also includes a communication interface 30 for communicating with other devices or communication networks.

[0141] This invention also provides a computer-readable storage medium. The methods described above according to embodiments of the invention can be implemented in hardware or firmware, or implemented as computer code that can be recorded on a storage medium, or implemented as computer code downloaded over a network and originally stored on a remote storage medium or a non-transitory machine-readable storage medium and then stored on a local storage medium. Thus, the methods described herein can be processed by software stored on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. The storage medium can be a magnetic disk, optical disk, read-only memory, random access memory, flash memory, hard disk, or solid-state drive, etc. Further, the storage medium may also include combinations of the above types of memory. It is understood that computers, processors, microprocessor controllers, or programmable hardware include storage components capable of storing or receiving software or computer code, which, when accessed and executed by the computer, processor, or hardware, implements the methods shown in the above embodiments.

[0142] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A fault alarm method, characterized in that, The method includes: Detect the presence status of each component of the target server; Obtain the component configuration information of the target server; Based on the component configuration and the presence status of each component of the target server, determine whether there is a faulty target component in the target server; When the target component is confirmed to exist, an alarm is triggered based on the configuration of the target component. When each component of the target server includes at least one heat dissipation component, and it is determined that there are multiple target heat dissipation components in the at least one heat dissipation component whose in-situ state is in-situ, the number of the target heat dissipation components is counted. For the third fan, obtain a first correlation index value between each target heat dissipation component and the third fan, and obtain a weight factor for each target heat dissipation component, wherein the third fan is any one of at least one fan of the target server; Based on the first correlation index value between each target heat dissipation component and the third fan, and the weight factor of each target heat dissipation component, the second correlation index value between the third fan and all target heat dissipation components is determined. The target speed increase value is determined based on the number of the target heat dissipation components, the type of each target heat dissipation component, and the second correlation index value between each fan and all target heat dissipation components; The speed increase value of the third fan is determined based on the second correlation index value between the third fan and all target heat dissipation components, the target speed increase value, and the second correlation index value between the fourth fan and all target heat dissipation components, wherein the fourth fan is the fan with the largest second correlation index value. Based on the increase in the speed of the third fan, the speed of the third fan is increased; The second correlation index value between the third fan and all target heat dissipation components is determined based on the first correlation index value between each target heat dissipation component and the third fan, and the weighting factor of each target heat dissipation component, using the following expression: in, The second correlation index value for the Nth fan. Let be the first correlation index value between the Nth fan and the mth target heat dissipation component. is the weighting factor for the m-th target heat dissipation component.

2. The method according to claim 1, characterized in that, The component configuration information includes the configuration information of the actual components in the target server; determining whether there are faulty target components in the target server based on the component configuration information and the presence status of each component of the target server includes: When it is determined that the configuration information of the actual configuration component includes the configuration information of the first component, and the presence status of the first component is determined to be absent, the first component is determined to be a target component with a fault. or, When it is determined that the first component is in place, or when it is determined that the configuration information of the actual configured component does not include the configuration information of the first component, and when it is determined that the first component is out of place, it is determined that the first component is not faulty.

3. The method according to claim 1, characterized in that, The component configuration information includes the configuration information of fully configured components in the target server and the configuration information of actually configured components in the target server; determining whether there are faulty target components in the target server based on the component configuration information and the on-premises status of each component in the target server includes: Based on the configuration information of the fully configured components and the configuration information of the actually configured components, the configuration information of the components with reduced configuration is determined; When it is determined that the configuration information of the reduced-configuration component does not include the configuration information of the first component, and the presence status of the first component is determined to be absent, the first component is determined to be a target component with a fault. or, When it is determined that the configuration information of the reduced-configuration component includes the configuration information of the first component, and the presence status of the first component is determined to be either absent or present, it is determined that the first component is not faulty.

4. The method according to any one of claims 1-3, characterized in that, When the target server includes at least one heat dissipation component among its various components, and it is determined that at least one of the heat dissipation components is a target heat dissipation component with an in-situ status, the method further includes: Obtain a first correlation index value between the target heat dissipation component and the first fan, and obtain a preset speed increase value of the second fan with the largest index value of the first correlation index value, wherein the first fan is any one of at least one fan of the target server. The speed increase value of the first fan is determined based on the first correlation index value and the preset speed increase value. Based on the increase in the speed of the first fan, the speed of the first fan is increased.

5. The method according to claim 4, characterized in that, The step of determining the speed increase value of the first fan based on the first correlation index value and the preset speed increase value uses the following expression: d N =l N ·d max1 / k max1 Where, d N Let l be the speed increase value of the Nth fan. N Let d be the first correlation index value for the Nth fan. max1 k is the preset speed increase value. max1 is the first correlation index value of the second fan, where N is an integer greater than zero.

6. A fault alarm device, characterized in that, The device includes: The detection module is used to detect the presence status of various components of the target server; The acquisition module is used to acquire the component configuration information of the target server; The determination module is used to determine whether there is a faulty target component in the target server based on the component configuration and the in-situ status of each component of the target server. An alarm module is used to trigger an alarm based on the configuration of the target component when the presence of the target component is determined. The determining module is further configured to: count the number of target heat dissipation components when each component of the target server includes at least one heat dissipation component, and when it is determined that there are multiple target heat dissipation components in an in-situ state among the at least one heat dissipation component; for the third fan, obtain a first correlation index value between each target heat dissipation component and the third fan, and obtain a weight factor for each target heat dissipation component, wherein the third fan is any one of the at least one fans of the target server; determine a second correlation index value between the third fan and all target heat dissipation components based on the first correlation index value between each target heat dissipation component and the third fan, and the weight factor for each target heat dissipation component; determine a target speed increase value based on the number of target heat dissipation components, the type of each target heat dissipation component, and the second correlation index value between each fan and all target heat dissipation components; determine a speed increase value for the third fan based on the second correlation index value between the third fan and all target heat dissipation components, the target speed increase value, and the second correlation index value between the fourth fan and all target heat dissipation components, wherein the fourth fan is the fan with the largest second correlation index value; and increase the speed of the third fan based on the speed increase value of the third fan. The second correlation index value between the third fan and all target heat dissipation components is determined based on the first correlation index value between each target heat dissipation component and the third fan, and the weighting factor of each target heat dissipation component, using the following expression: in, The second correlation index value for the Nth fan. Let be the first correlation index value between the Nth fan and the mth target heat dissipation component. is the weighting factor for the m-th target heat dissipation component.

7. A computer device, characterized in that, include: A memory and a processor are communicatively connected, the memory stores computer instructions, and the processor executes the computer instructions to perform the fault alarm method according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing the computer to execute the fault alarm method according to any one of claims 1 to 5.

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