一种集成电路的背面电源分配网络的电压降计算方法
By dividing the power distribution network structure on the back of the integrated circuit into four parts and calculating the voltage drop separately, the problem of complex and time-consuming calculation in the prior art is solved, and fast and efficient voltage drop calculation is achieved.
CN117764018BActive Publication Date: 2026-07-17XIDIAN UNIV
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIDIAN UNIV
- Filing Date
- 2023-12-22
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In the existing technology, the voltage drop calculation method for the power distribution network on the back of an integrated circuit is cumbersome, time-consuming, and costly.
Method used
The back-side power distribution network structure is divided into four parts: solder joints, back-side metal mesh, micro-silicon vias, and buried power rails. The voltage drop of current flowing through each of these parts is calculated, and the results are summed to obtain the voltage drop of the back-side power distribution network nodes.
Benefits of technology
It enables rapid calculation of complex back-side power distribution network nodes, improving efficiency and saving time and cost.
✦ Generated by Eureka AI based on patent content.
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Figure CN117764018B_ABST
Abstract
本发明公开了一种集成电路的背面电源分配网络的电压降计算方法，包括：将背面电源分配网络结构划分为四部分，分别为焊接点、背面金属网格、微硅通孔和埋地电源轨；其中，焊接点、背面金属网格、微硅通孔和埋地电源轨沿第一方向依次排布，电流依次流经焊接点、背面金属网格、微硅通孔和埋地电源轨；分别计算电流流经焊接点的电压降、背面金属网格的电压降、微硅通孔的电压降、以及埋地电源轨的电压降，将焊接点的电压降、背面金属网格的电压降、微硅通孔的电压降和埋地电源轨的电压降相加，得到背面电源分配网络节点的电压降。本发明可以实现对结构复杂的背面电源分配网络节点的电压降进行快速计算，提高效率，节约时间。
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