Display module and display device

Abstract

The application discloses a display module and a display device, and relates to the technical field of display technology. The display module comprises a display panel, a support plate and a heat dissipation film. The display panel comprises a display part, a bending part and a binding part which are sequentially connected. The support plate is arranged on the light-out side of the display part. The surface of the support plate comprises a recessed area, and the recessed area comprises a first recessed area which is located on the surface of the support plate away from the display part. The heat dissipation film is arranged in the recessed area on the surface of the support plate and comprises a first heat dissipation film which is located in the first recessed area. In the case that the bending part is in a bending state, the first heat dissipation film is located between the binding part and the support plate.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Technology

[0002] Currently, foldable display products typically have a rigid backplate attached to the back of the flexible display panel. The backplate is used to protect and support the flexible display panel, and works with the hinge to complete the folding task. Summary of the Invention

[0003] This disclosure provides a display module, including:

[0004] A display panel includes a display section, a bending section, and a bonding section connected in sequence; a support plate disposed away from the light-emitting side of the display section, the surface of the support plate including a recessed area, the recessed area including a first recessed area, the first recessed area being located on the surface of the support plate away from the display section; and

[0005] A heat dissipation film is disposed in a recessed area on the surface of the support plate, including a first heat dissipation film located in the first recessed area. When the bending portion is in a bent state, the first heat dissipation film is located between the binding portion and the support plate.

[0006] In some embodiments, the surface of the support plate opposite to the display portion further includes a first boss, and the first recessed area is located on at least one side of the periphery of the first boss;

[0007] The first heat dissipation film is disposed near the edge of the support plate, and the first heat dissipation film is a strip structure extending along the edge of the support plate.

[0008] In some embodiments, the support plate includes a first edge and a second edge, wherein the first edge is the edge of the support plate near the bent portion;

[0009] The first heat dissipation film includes a first extension strip and a second extension strip, the first extension strip being disposed near the first edge and the second extension strip being disposed near the second edge; in the direction from the center of the support plate to the edge of the support plate, the width of the first extension strip is greater than or equal to the width of the second extension strip.

[0010] In some embodiments, the surface of the support plate away from the display portion further includes a second protrusion, and a plurality of second protrusions are arranged separately from each other, with the first recessed area surrounding the periphery of the second protrusions;

[0011] The first heat dissipation film has a plurality of first through holes that are spaced apart from each other, and the walls of the first through holes are outwardly flared relative to the edge of the second boss.

[0012] In some embodiments, the support plate includes a first straight area, a bent area, and a second straight area connected in sequence;

[0013] A first heat dissipation film having the first through hole covers the first flat area and the side of the second flat area opposite to the display portion.

[0014] In some embodiments, the support plate includes an edge extending along a first direction and an edge extending along a second direction, and the plurality of first through holes are arranged in an array along the first direction and / or the second direction, the first direction and the second direction intersecting each other.

[0015] In some embodiments, the first heat dissipation film includes a plurality of mutually spaced third extension strips, with different third extension strips disposed in different first recessed areas;

[0016] The recessed area also includes a second recessed area, which is located on the surface of the support plate near the display part. The heat dissipation film also includes a second heat dissipation film located in the second recessed area. The second heat dissipation film includes a plurality of fourth extension strips that are separated from each other, and different fourth extension strips are disposed in different second recessed areas.

[0017] The extension direction of the fourth extension bar intersects with the extension direction of the third extension bar.

[0018] In some embodiments, the support plate includes a first straight area, a bent area, and a second straight area connected in sequence;

[0019] The first heat dissipation film includes a first sub-film and a second sub-film, which are separated from each other and located on both sides of the bending area.

[0020] In some embodiments, the first heat dissipation film further includes one or more connecting strips spaced apart from each other, the connecting strips being located on the side of the bent plate opposite to the display portion and connecting the first sub-film and the second sub-film;

[0021] The connecting strip is provided with a second through hole, and the bending area is provided with a third through hole. The second through hole and the third through hole at the corresponding position are interconnected.

[0022] In some embodiments, the first heat dissipation film is made of a conductive material, and the display module further includes:

[0023] A circuit board, connected to the bonding part, is disposed on the side of the first heat dissipation film away from the support plate, and the circuit board and the first heat dissipation film are bonded together by conductive adhesive.

[0024] In some embodiments, the depth of the recessed area is approximately equal to the thickness of the heat dissipation film.

[0025] In some embodiments, the surface of the support plate further includes a boss located between the recessed areas, and there is a gap between the boss and the heat dissipation film, wherein the gap width is less than or equal to 2 mm.

[0026] In some embodiments, the width of the continuous film layer in the heat dissipation film is greater than or equal to 5 mm.

[0027] In some embodiments, the support plate is made of carbon fiber, and the support plate includes:

[0028] A first sublayer, a second sublayer, and a third sublayer are stacked sequentially along a third direction. The carbon filaments in the first sublayer and the third sublayer are arranged along a fourth direction, and the carbon filaments in the second sublayer are arranged along a fifth direction and the third direction. The third direction, the fourth direction, and the fifth direction are perpendicular to each other.

[0029] This disclosure provides a display device, including a display module as described in any embodiment. The display module provided in this embodiment increases the heat dissipation area by providing a heat dissipation film between the bonding portion and the support plate. This allows heat generated by the driving chip to dissipate rapidly in the planar direction of the support plate, reducing heat accumulation and concentration in the thickness direction of the support plate. This prevents heat from being transferred to the display portion along the thickness direction of the support plate, thereby reducing the lifespan degradation of the light-emitting devices within the display portion. The display module provided in this embodiment not only accelerates heat dissipation from the driving chip but also dissipates heat generated by the light-emitting devices in the display portion through the heat dissipation film, improving the reliability of the display module from multiple dimensions and reducing the lifespan degradation of the light-emitting devices. Furthermore, by placing the heat dissipation film within the recessed area and by reasonably setting the recess depth and thickness of the heat dissipation film, it is possible to effectively prevent step differences between the heat dissipation film and the support plate, thereby avoiding problems such as bonding molding and reducing the overall thickness of the display module.

[0030] The above description is merely an overview of the technical solution disclosed herein. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure are described below. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments or related technologies of this disclosure, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the scale in the drawings is for illustration only and does not represent the actual scale. Figure 1 An exemplary schematic diagram of a stacked structure of a display module in the related art is shown; Figure 2 An exemplary schematic diagram of a stacked structure of a display module provided in this disclosure is shown; Figure 3 An exemplary schematic diagram of a stacked structure of a support plate and a heat dissipation film is shown; Figure 4 An exemplary schematic diagram of another stacked structure of support plate and heat dissipation film is shown; Figure 5 A schematic cross-sectional view of the support plate is shown as an example.

[0032] Figure 6 An exemplary schematic diagram of the planar structure of the first type of display module is shown;

[0033] Figure 7 An exemplary schematic diagram of the planar structure of the second type of display module is shown;

[0034] Figure 8 Exemplary schematic diagrams of the planar structures of the third to fifth display modules are shown; Figure 9 An exemplary schematic diagram of the planar structure of the sixth type of display module is shown. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure. (Refer to...) Figure 1 An exemplary schematic diagram of a stacked structure of a display module in the related art is shown. (Refer to...) Figure 2 An exemplary schematic diagram of a stacked structure of a display module provided in this disclosure is shown. Figure 1 and Figure 2 As shown, the display module includes: a display panel 11, comprising a display section 111, a bending section 112, and a bonding section 113 connected in sequence; and a support plate 12 disposed away from the light-emitting side of the display section 111. The bonding section 113 is used to bond the driver chip 13.

[0036] The inventors discovered that when the support plate 12 is made of materials with low thermal conductivity, such as carbon fiber, the display module faces reliability risks. For example... Figure 1 As shown by the middle arrow, the heat generated by the driver chip 13 is transferred to the light-emitting devices in the display panel 11 through each film layer, causing the light-emitting devices to age and develop problems such as yellowing and blackening during their lifespan.

[0037] Reference Figure 3 and Figure 4 Exemplary schematic diagrams illustrate two stacked structures of a support plate and a heat dissipation film in the display module provided in this disclosure. For example... Figure 3 or Figure 4 As shown, the surface of the support plate 12 includes a recessed area A1, and the recessed area A1 includes a first recessed area A11, which is located on the surface of the support plate 12 opposite to the display part 111.

[0038] like Figures 2 to 4 As shown, the display module also includes a heat dissipation film 14, which is disposed in a recessed area A1 on the surface of the support plate 12, including a first heat dissipation film 141 located in the first recessed area A11. When the bending portion 112 is in a bent state, the first heat dissipation film 141 is located between the binding portion 113 and the support plate 12.

[0039] like Figure 2 As shown, when the bending portion 112 is in a bent state, the orthographic projection of the bonding portion 113 on the display portion 111 is located within the orthographic projection area of ​​the first heat dissipation film 141 on the display portion 111. The orthographic projection of the driving chip 13 on the display portion 111 is located within the orthographic projection area of ​​the first heat dissipation film 141 on the display portion 111.

[0040] For example, such as Figure 2 As shown by the dashed arrow, the heat generated by the driver chip 13 passes sequentially through the bonding portion 113, the bent pad 15 located between the bonding portion 113 and the first heat dissipation film 141, and then diffuses within the first heat dissipation film 141 along the planar direction of the support plate 12. The display module provided in this embodiment, by providing a heat dissipation film 14 between the bonding portion 113 and the support plate 12, increases the heat dissipation area, allowing the heat generated by the driver chip 13 to diffuse rapidly in the planar direction of the support plate 12. This reduces heat accumulation and concentration in the thickness direction of the support plate 12, preventing heat transfer along the thickness direction of the support plate 12 to the display portion 111, thereby reducing the lifespan degradation of the light-emitting devices within the display portion 111. The display module provided in this embodiment not only accelerates the heat diffusion of the driver chip 13 but also dissipates the heat generated by the light-emitting devices in the display portion 111 through the heat dissipation film 14, improving the reliability of the display module from multiple dimensions and reducing the lifespan degradation of the light-emitting devices.

[0041] In addition, by setting the heat dissipation film 14 in the recessed area A1 and by reasonably setting the recessed depth of the recessed area A1 and the thickness of the heat dissipation film 14, it is possible to effectively prevent the heat dissipation film 14 from having a step difference with the support plate 12, thereby avoiding problems such as bonding mold printing, and at the same time reducing the overall thickness of the display module.

[0042] In some implementations, such as Figure 3 or Figure 4 As shown, the surface of the support plate 12 also includes a boss A2, which is located between the recessed areas A1. By providing the boss A2, the influence of the recessed areas A1 on the support strength of the support plate 12 can be reduced.

[0043] For example, the recessed area A1 is located on at least one side of the boss A2, and the recessed area A1 may be located on one side, two sides, three sides or around the boss A2.

[0044] For example, such as Figure 3 As shown, when a first recessed area A11 is provided on the surface of the support plate 12 away from the display part 111, a boss A2 is also provided on the surface of the support plate 12 away from the display part 111, and the first recessed area A11 is located on at least one side of the boss A2.

[0045] For example, such as Figure 4 As shown, when a second recessed area A12 is provided on the surface of the support plate 12 near the display part 111, a corresponding boss A2 is also provided on the surface of the support plate 12 near the display part 111, and the second recessed area A12 is located on at least one side of the boss A2.

[0046] In specific implementation, the recessed area A1 and the boss A2 can be formed before the support plate 12 is hot-pressed and bonded to the display part 111, or the recessed area A1 and the boss A2 can be formed after the support plate 12 is hot-pressed and bonded to the display part 111. This disclosure does not limit this.

[0047] In some implementations, such as Figure 5 As shown, the material of the support plate 12 includes carbon fiber. The support plate 12 includes a first sub-layer 51, a second sub-layer 52 and a third sub-layer 53 stacked sequentially along a third direction f3. The carbon filaments 54 in the first sub-layer 51 and the third sub-layer 53 are arranged along a fourth direction f4. The carbon filaments 54 in the second sub-layer 52 are arranged along a fifth direction f5 and a third direction f3. The third direction f3, the fourth direction f4 and the fifth direction f5 are perpendicular to each other.

[0048] For example, such as Figure 5As shown, the support plate 12 is formed by hot-pressing three layers of prepreg together. The three layers of prepreg are a first sub-layer 51, a second sub-layer 52, and a third sub-layer 53. Each layer of prepreg can be formed by spreading and flattening carbon filaments 54 and mixing them with resin 55 in a certain ratio. By arranging the carbon filaments 54 in the first sub-layer 51 and the third sub-layer 53 along the fourth direction f4, and the carbon filaments 54 in the second sub-layer 52 perpendicular to the fourth direction f4, the strength of the support plate 12 can be improved.

[0049] For example, on the third-direction f3, the thickness of the second sublayer 52 is greater than the thickness of the first sublayer 51 and the third sublayer 53. Since the second sublayer 52, which is the middle prepreg layer in the support plate 12, has the greatest thickness, it plays the main role in supporting and reinforcing the plate. Therefore, setting the recessed area A1 on the surface of the support plate 12, such as the first sublayer 51 and / or the second sublayer 52, will not have a significant impact on the strength of the support plate 12.

[0050] like Figure 5 As shown, the thickness of the first sublayer 51 and the third sublayer 53 along the third direction f3 is, for example, 25 micrometers, and the thickness of the second sublayer 52 along the third direction f3 is, for example, 100 micrometers. Exemplarily, the recessed area A1 and the boss A2 on the surface of the support plate 12 can be formed, for example, by a cutting process or by a laser cutting process; this disclosure does not limit this. In some embodiments, such as... Figure 3 As shown, in the direction f from the display section 111 to the support plate 12, the recessed depth d1 of the recessed area A1 is approximately equal to the thickness h1 of the heat dissipation film 14, so that the surface of the heat dissipation film 14 away from the support plate 12 is approximately flush with the surface of the boss A2, thereby avoiding the formation of a bonding mold mark.

[0051] For example, the thickness h1 of the heat dissipation film 14 can be greater than or equal to 30 micrometers and less than or equal to 50 micrometers. This ensures heat dissipation efficiency while reducing the impact on the strength of the support plate 12.

[0052] For example, the heat dissipation film 14 can be copper foil or conductive cloth, etc.

[0053] To further avoid adhesion to the molded image, in some implementations, such as Figure 3 or Figure 4 As shown, there is a gap between the boss A2 and the heat dissipation film 14, and the gap width d2 is less than or equal to 2 mm. Further, the gap width d2 is less than or equal to 1 mm or 0.5 mm.

[0054] Considering the bonding tolerance of the heat dissipation film 14, the width d2 of the gap between the boss A2 and the heat dissipation film 14 is designed to be, for example, 0.5 mm, to avoid the heat dissipation film 14 being bonded to the boss A2 during the subsequent bonding process.

[0055] To improve electrostatic discharge capability, in some implementation methods, such as Figure 2 As shown, the first heat dissipation film 141 is made of conductive material. The display module also includes a circuit board 16, which is connected to the bonding part 113 and is disposed on the side of the first heat dissipation film 141 away from the support plate 12. The circuit board 16 and the first heat dissipation film 141 are bonded together by conductive adhesive 17.

[0056] For example, the circuit board 16 is a multilayer structure with stacked layers, such as a two-layer structure, a four-layer structure, or a six-layer structure, etc. The multilayer structure includes conductive layers such as copper layers.

[0057] like Figure 2 As shown by the solid arrow in the diagram, the electrostatic charge in the circuit board 16 can be transferred to the heat dissipation film 14 through the internal conductive layer of the circuit board 16, and then dissipated by the heat dissipation film 14, thus preventing the accumulation of static electricity from damaging the circuit board 16, the driver chip 13, or the display panel 11, and improving the anti-static damage capability of the display module.

[0058] In some implementations, such as Figure 3 , Figure 6 or Figure 7 As shown, the boss A2 includes a first boss A21, which is located on the surface of the support plate 12 opposite to the display portion 111. A first recessed area A11 is located on at least one side of the periphery of the first boss A21. Correspondingly, a first heat dissipation film 141 is disposed near the edge b1 / b2 of the support plate 12, and the first heat dissipation film 141 is a strip structure extending along the edge of the support plate 12.

[0059] like Figure 7 As shown, the first recessed area A11 is disposed around the first protrusion A21. In this embodiment, since the first protrusion A21 is an integral structure and located in the middle region of the support plate 12, the first recessed area A11 and the first heat dissipation film 141 located within the first recessed area A11 are only disposed in the edge region, which can reduce the impact of the recessed area A1 on the strength of the support plate 12. For example, as... Figure 6 or Figure 7 As shown, the first heat dissipation film 141 of the strip structure is a continuous film layer, that is, the first heat dissipation film 141 is a non-perforated structure.

[0060] In some implementations, such as Figure 6 or Figure 7 As shown, the support plate 12 includes a first edge b1 and a second edge b2, where the first edge b1 is the edge of the support plate 12 near the bent portion 112. The first heat dissipation film 141 includes a first extension strip 61 and a second extension strip 62, where the first extension strip 61 is disposed near the first edge b1 and the second extension strip 62 is disposed near the second edge b2.

[0061] like Figure 6 or Figure 7 As shown, in the direction from the center of the support plate 12 to its edge, the width w1 of the first extension strip 61 is greater than or equal to the width w2 of the second extension strip 62. The second edge b2 is any edge different from the first edge b1. For example, as... Figure 6 or Figure 7 As shown, the first edge b1 is the right edge of the support plate 12 on the side of the surface opposite to the display part 111, and the second edge b2 can be the left edge, upper edge or lower edge of the support plate 12 on the side of the surface opposite to the display part 111.

[0062] Since the circuit board 16 and the driver chip 13 are both located close to the first edge b1, the heat dissipation and anti-static capabilities of the display module can be further improved by setting a wider first extension strip 61 near the first edge b1.

[0063] In some implementations, such as Figure 3 and Figure 8 As shown, the boss A2 includes a second boss A22, which is located on the surface of the support plate 12 opposite to the display section 111. Multiple second bosses A22 are spaced apart from each other, and a first recessed area A11 surrounds the periphery of the second bosses A22. Correspondingly, the first heat dissipation film 141 has multiple spaced-apart first through holes H1.

[0064] The first through hole H1 and the second boss A22 are respectively provided in a one-to-one correspondence. The first through hole H1 is used to avoid the second boss A22, and the second boss A22 is embedded in the first through hole H1.

[0065] Since the support plate 12 has a plurality of mutually spaced second protrusions A22 on the surface opposite to the display part 111, the first heat dissipation film 141 can be attached over a large area, and the plurality of second protrusions A22 can ensure that the support strength of the support plate 12 is not greatly affected.

[0066] For example, the orthographic projection shape of the first through hole H1 on the display unit 11 includes at least one of the following: polygons such as triangle, square, rectangle, trapezoid, and circle, ellipse, sector, etc.

[0067] For example, such as Figure 8 As shown, the hole wall b3 of the first through hole H1 is extended outward relative to the edge b4 of the second boss A22. By setting the hole wall of the first through hole H1 to be extended outward relative to the edge of the second boss A22, the first heat dissipation film 141 can be prevented from adhering to the second boss A22, thus avoiding adhesion mold marks caused by adhesion tolerance.

[0068] In some implementations, such as Figures 6 to 8As shown, the support plate 12 includes a first straight area 121, a bending area 122 and a second straight area 123 connected in sequence.

[0069] In some implementations, such as Figure 8 As shown, the first heat dissipation film 141 with the first through hole H1 covers the entire surface of the first flat area 121 and the second flat area 123 on the side opposite to the display unit 111. In this way, by attaching the first heat dissipation film 141 over a large area, the heat diffusion area can be further increased, and the heat dissipation capacity and antistatic capacity of the display module can be further improved.

[0070] In some implementations, such as Figure 8 As shown, the support plate 12 includes an edge extending along a first direction f1 and an edge extending along a second direction f2, the first direction f1 and the second direction f2 intersecting each other. Figure 8 In the middle, the first direction f1 and the second direction f2 are perpendicular to each other.

[0071] For example, such as Figure 8 As shown in Figure b, multiple first through holes H1 are arranged in an array along the first direction f1.

[0072] For example, such as Figure 8 As shown in Figure c, multiple first through holes H1 are arranged in an array along the second direction f2.

[0073] For example, such as Figure 8 As shown in Figure a, multiple first through holes H1 are arranged in an array along the first direction f1 and the second direction f2.

[0074] In some implementations, such as Figure 4 As shown, the recessed area A1 further includes a second recessed area A12, which is located on the surface of the support plate 12 near the display unit 111. Correspondingly, the heat dissipation film 14 also includes a second heat dissipation film 142 located within the second recessed area A12. By providing recessed areas A1 on both the surface of the support plate 12 near the display unit 111 and the surface away from the display unit 111, and then attaching the heat dissipation film 14 on both sides, the heat dissipation capacity and antistatic capacity of the display module can be further enhanced. In some embodiments, such as Figure 9 As shown, the first heat dissipation film 141 includes a plurality of mutually spaced third extension strips 91, with different third extension strips 91 disposed in different first recessed areas A11. The second heat dissipation film 142 includes a plurality of mutually spaced fourth extension strips 92, with different fourth extension strips 92 disposed in different second recessed areas A12. The extending directions of the fourth extension strips 92 intersect the extending directions of the third extension strips 91.

[0075] By intersecting the fourth extension strip 92 and the third extension strip 91, the first recessed area A11 and the second recessed area A12 can be staggered, thereby avoiding stress concentration caused by a large overlap between the first recessed area A11 and the second recessed area A12, and reducing the impact on the strength of the support layer. For example, as... Figure 9 As shown, the multiple third extension strips 91 extend in the same direction, and the multiple fourth extension strips 92 extend in the same direction. The extension direction of the fourth extension strips 92 is perpendicular to the extension direction of the third extension strips 91. Figure 9 In the middle, multiple third extension strips 91 extend along the first direction f1 and are arranged along the second direction f2, and multiple fourth extension strips 92 extend along the second direction f2 and are arranged along the first direction f1.

[0076] In some implementations, such as Figure 6 As shown, the first heat dissipation film 141 includes a first sub-film 63 and a second sub-film 64, which are separated from each other and located on both sides of the bending area 122.

[0077] like Figure 6 As shown, the first sub-film 63 is located to the left of the bending area 122, and the first sub-film 63 is located on the side of the first flat area 121 opposite to the display portion 111. The second sub-film 64 is located to the right of the bending area 122, and the second sub-film 64 is located on the side of the second flat area 123 opposite to the display portion 111. The orthographic projections of the first sub-film 63 and the second sub-film 64 on the support plate 12 do not overlap with the bending area 122. In some embodiments, such as Figures 7 to 8 As shown in any one of the diagrams, the first heat dissipation film 141 also includes one or more connecting strips 71 that are separated from each other. The connecting strips 71 are located on the side of the bending area 122 away from the display section 111 and are connected between the first sub-film 63 and the second sub-film 64.

[0078] like Figures 7 to 8 As shown in any one of the figures, a second through hole H2 is provided on the connecting strip 71, and a third through hole H3 is provided on the bending area 122. The second through hole H2 and the third through hole H3 at the corresponding positions are interconnected.

[0079] For example, such as Figures 7 to 8 As shown in either case, the orthographic projections of the second through hole H2 and the corresponding third through hole H3 on the display unit 111 completely overlap, and both have the same size and shape. For example, the second through hole H2 and the third through hole H3 can be formed simultaneously using a laser cutting process.

[0080] For example, the orthographic projection shape of the second through hole H2 on the display unit 11 includes at least one of the following: polygons such as triangle, square, rectangle, trapezoid, and circle, ellipse, sector, etc.

[0081] For example, the orthographic projection shape of the third through hole H3 on the display unit 11 includes at least one of the following: polygons such as triangle, square, rectangle, trapezoid, and circle, ellipse, sector, etc.

[0082] like Figures 7 to 8 As shown in any embodiment, two connecting strips 71 are provided between the first sub-film 63 and the second sub-film 64. One connecting strip 71 is located on the side of the upper end of the bending area 122 facing away from the display part 111, and the other connecting strip 71 is located on the side of the lower end of the bending area 122 facing away from the display part 111. In some embodiments, the width of the continuous film layer in the heat dissipation film 14 is greater than or equal to 5 mm. This reduces the difficulty of attachment while achieving excellent electrical and thermal conductivity. This disclosure provides a display device including the display module provided in any embodiment. Those skilled in the art will understand that the display device provided in this disclosure has the advantages of the above-described display module.

[0083] For example, the display device provided in this disclosure is a foldable display device. The display device provided in this disclosure can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, in-vehicle display device, smartwatch, fitness wristband, personal digital assistant, etc.

[0084] In this disclosure, "multiple" means two or more, and "at least one" means one or more, unless otherwise expressly and specifically defined.

[0085] In this disclosure, the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this disclosure.

[0086] In this document, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0087] The terms "an embodiment," "some embodiments," "exemplary embodiments," "one or more embodiments," "example," "one example," "some examples," etc., used herein are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

[0088] In this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations.

[0089] In describing some embodiments, the terms "coupled" and "connected" may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "coupled" or "communically coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0090] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0091] "A and / or B" includes three combinations: A only, B only, and a combination of A and B. As used herein, the term "if" is optionally interpreted, depending on the context, as meaning "when," "at," "in response to determination," or "in response to detection." Similarly, depending on the context, the phrase "if it is determined..." or "if [the stated condition or event] is optionally interpreted as meaning "in response to determining..." or "in response to detecting [the stated condition or event]."

[0092] The use of “configured as” or “configured to” in this article implies an open and inclusive language that does not exclude devices that are suitable for being configured or configured to perform additional tasks or steps.

[0093] The use of "based on" or "according to" in this document implies openness and inclusiveness. A process, step, calculation, or other action based on one or more of the stated conditions or values ​​may, in practice, be based on other conditions or values ​​beyond those stated.

[0094] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0095] As used herein, “parallel,” “perpendicular,” “equal,” and “flush” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where the acceptable range of deviation for approximate parallelism can be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where the acceptable range of deviation for approximate perpendicularity can also be, for example, within 5°. “Equal” includes absolute equality and approximate equality, where the acceptable range of deviation for approximate equality can be, for example, the difference between the two equals being less than or equal to 5% of either one. “Flush” includes absolute flush and approximate flush, where the acceptable range of deviation for approximate flush can be, for example, the distance between the flush twos being less than or equal to 5% of either one of the dimensions.

[0096] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0097] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views as idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing. For example, etched regions shown as rectangular will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments. Unless otherwise specified, film thickness refers to the dimension of the film layer in its normal direction. Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and not to limit them; although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A display module, comprising: The display panel includes a display section, a bending section, and a binding section connected in sequence. A support plate is disposed away from the light-emitting side of the display unit. The surface of the support plate includes a recessed area, and the recessed area includes a first recessed area, which is located on the surface of the support plate away from the display unit. as well as A heat dissipation film is disposed in a recessed area on the surface of the support plate, including a first heat dissipation film located in the first recessed area. When the bent portion is in a bent state, the first heat dissipation film is located between the binding portion and the support plate. The support plate also includes a second protrusion on the surface away from the display part, and a plurality of second protrusions are arranged separately from each other, with the first recessed area surrounding the periphery of the second protrusions; The first heat dissipation film has a plurality of first through holes that are spaced apart from each other, and the walls of the first through holes are outwardly flared relative to the edge of the second boss.

2. The display module according to claim 1, wherein, The surface of the support plate away from the display part also includes a first protrusion, and the first recessed area is located on at least one side of the periphery of the first protrusion; The first heat dissipation film is disposed near the edge of the support plate, and the first heat dissipation film is a strip structure extending along the edge of the support plate.

3. The display module according to claim 2, wherein, The support plate includes a first edge and a second edge, wherein the first edge is the edge of the support plate near the bent portion; The first heat dissipation film includes a first extension strip and a second extension strip, wherein the first extension strip is disposed near the first edge and the second extension strip is disposed near the second edge; In the direction from the center of the support plate to the edge of the support plate, the width of the first extension strip is greater than or equal to the width of the second extension strip.

4. The display module according to claim 1, wherein, The support plate includes a first straight section, a bent section, and a second straight section connected in sequence. A first heat dissipation film having the first through hole covers the first flat area and the side of the second flat area opposite to the display portion.

5. The display module according to claim 1, wherein, The support plate includes an edge extending along a first direction and an edge extending along a second direction, and the plurality of first through holes are arranged in an array along the first direction and / or the second direction, the first direction and the second direction intersecting each other.

6. The display module according to claim 1, wherein, The first heat dissipation film includes a plurality of mutually spaced third extension strips, with different third extension strips disposed in different first recessed areas; The recessed area also includes a second recessed area, which is located on the surface of the support plate near the display part. The heat dissipation film also includes a second heat dissipation film located in the second recessed area. The second heat dissipation film includes a plurality of fourth extension strips that are separated from each other, and different fourth extension strips are disposed in different second recessed areas. The extension direction of the fourth extension bar intersects with the extension direction of the third extension bar.

7. The display module according to claim 1, wherein, The support plate includes a first straight section, a bent section, and a second straight section connected in sequence. The first heat dissipation film includes a first sub-film and a second sub-film, which are separated from each other and located on both sides of the bending area.

8. The display module according to claim 7, wherein, The first heat dissipation film also includes one or more connecting strips that are spaced apart from each other. The connecting strips are located on the side of the bent plate away from the display part and are connected between the first sub-film and the second sub-film. The connecting strip is provided with a second through hole, and the bending area is provided with a third through hole. The second through hole and the third through hole at the corresponding position are interconnected.

9. The display module according to any one of claims 1 to 8, wherein, The first heat dissipation film is made of a conductive material, and the display module further includes: A circuit board, connected to the bonding part, is disposed on the side of the first heat dissipation film away from the support plate, and the circuit board and the first heat dissipation film are bonded together by conductive adhesive.

10. The display module according to any one of claims 1 to 8, wherein, The depth of the recessed area is equal to the thickness of the heat dissipation film.

11. The display module according to any one of claims 1 to 8, wherein, The surface of the support plate also includes a boss located between the recessed areas. There is a gap between the boss and the heat dissipation film, and the gap width is less than or equal to 2 mm.

12. The display module according to any one of claims 1 to 8, wherein, The width of the continuous film layer in the heat dissipation film is greater than or equal to 5 mm.

13. The display module according to any one of claims 1 to 8, wherein, The support plate is made of carbon fiber, and the support plate includes: A first sublayer, a second sublayer, and a third sublayer are stacked sequentially along a third direction. The carbon filaments in the first sublayer and the third sublayer are arranged along a fourth direction, and the carbon filaments in the second sublayer are arranged along a fifth direction and the third direction. The third direction, the fourth direction, and the fifth direction are perpendicular to each other.

14. A display device comprising a display module as described in any one of claims 1 to 13.

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