A die testing machine adjustment method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGXI ZHAO CHI SEMICON CO LTD
- Filing Date
- 2023-12-13
- Publication Date
- 2026-07-21
AI Technical Summary
In existing technologies, the position and size of ink dots are inaccurate during the photoelectric testing of LED chips, resulting in low efficiency of manual inspection and inability to detect abnormalities in a timely manner, which affects product yield.
An ink-spraying sample library is constructed. The test machine automatically sprays ink onto the chips that fail the photoelectric test and compares them with the sample library to calculate the ink-spraying pass rate. The position of the ink-spraying needle and the amount of ink sprayed on the test machine are adjusted according to the type of failure.
It improves the efficiency of ink dot inspection, enables timely detection of abnormalities, increases product yield, and reduces the outflow of defective products.
Smart Images
Figure CN117766431B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of optoelectronic testing, and more specifically to a method for adjusting a grain testing machine. Background Technology
[0002] Light Emitting Diode (LED) is a new type of energy-saving and environmentally friendly light source that has received a lot of attention in recent years. Many countries regard LED-related semiconductor lighting as a strategic technology, and various types of LEDs are widely used in fields such as indicators, displays, backlighting, and projection.
[0003] In the LED chip manufacturing process, photoelectric testing is a crucial step. During photoelectric testing, the wafer is placed under a testing machine, which tests the LED chips arranged on the wafer and marks those that fail the test with ink. However, during the ink-marking process for these chips, the ink droplets may shift as the ink needle is ejected, leading to inaccuracies in the position and size of the ink droplets. Currently, checking the position and size of these ink droplets relies mainly on manual inspection of the testing machine's CCD image. This method suffers from slow feedback, high manpower consumption, and an inability to detect ink droplet anomalies during the marking process, resulting in defective chips being released and impacting product yield. Summary of the Invention
[0004] Therefore, the purpose of this invention is to provide a method for adjusting a grain testing machine to solve the problems existing in the prior art.
[0005] This invention provides a method for adjusting a grain testing machine, applicable to a testing machine, comprising the following steps: An ink-spraying sample library is constructed according to preset rules. The ink-spraying sample library contains grain samples that have passed ink-spraying and grain samples that have failed ink-spraying. The system acquires images of wafers after photoelectric testing by a testing machine, identifies wafers that fail the photoelectric test, and uses these wafers as test wafers. The testing machine automatically applies ink to the surface of the wafers that fail the photoelectric test. The test crystal is compared with the crystal samples in the ink-spraying sample library to identify the test crystals that pass the ink-spraying test and to calculate the ink-spraying pass rate. Determine whether the ink application pass rate meets the required ratio; If the ink application pass rate meets the required ratio, the testing equipment will not be adjusted, and the photoelectric testing of the next wafer will continue. If the ink application pass rate does not meet the required ratio, then select the unqualified ink application grains from the test grains and classify them into unqualified types. Adjust the test machine according to the adaptability of the classified unqualified types.
[0006] Preferably, the step of constructing an ink-spraying sample library according to preset rules, wherein the ink-spraying sample library contains qualified ink-spraying grain samples and unqualified ink-spraying grain samples includes: The surface of the grain sample is divided into regions, namely an ink-sprayed area and a non-ink-sprayed area, wherein the ratio of the area of the ink-sprayed area to the area of the grain sample surface satisfies a first preset requirement. If the ink dots on the surface of the grain sample are located within the ink application area and the ratio of the area of the ink dots to the area of the ink application area meets the second preset requirement, then the grain sample is considered to have passed the ink application test; otherwise, it is considered to have failed the ink application test.
[0007] Preferably, the first preset requirement is that the ratio of the area of the ink-spraying area to the area of the grain surface is 0.7-0.9; the second preset requirement is that the ratio of the area of the ink dot to the area of the ink-spraying area is greater than 0.3.
[0008] Preferably, the center of the ink-spraying area coincides with the center of the surface of the grain sample.
[0009] Preferably, the grain samples with unqualified ink application include at least grain samples with ink misalignment, grain samples with excessive ink application, and grain samples with insufficient ink application. In the grain sample with ink displacement, the ink dots do not fill the ink-spraying area and are partially or entirely located in the non-ink-spraying area; In the grain sample with excessive ink, the ink dots fill the ink-filled area and partially overflow into the non-ink-filled area; In the insufficiently inked grain sample, the ink droplet is located within the inking area and the ratio of the area of the ink droplet to the area of the inking area does not meet the second preset requirement.
[0010] Preferably, the ink offset includes at least ink offset to the left, ink offset to the right, ink offset to the top, and ink offset to the bottom.
[0011] Preferably, the ink application pass rate is greater than 95%.
[0012] Preferably, the step of selecting the non-compliant ink application rate from the test grains and classifying them into non-compliant types, and adjusting the testing machine according to the adaptability of the classified non-compliant types, if the ink application rate does not meet the ratio requirement, includes: Select the test grains that fail the ink application test, and divide the surface of the test grains that fail the ink application test. The surface-divided grains are matched with the grain samples with ink displacement, the grain samples with excessive ink, and the grain samples with insufficient ink, respectively, so as to classify the unqualified grains with unqualified ink into unqualified types. The number of grains with inking defects, including those with inking deviation, excessive inking, and insufficient inking, was counted separately. Based on the counted number of grains, the type of defect with the highest proportion of defects in inking defects was determined. The testing equipment is adjusted based on the adaptability of the most prevalent non-conforming type among the statistically analyzed grains.
[0013] Preferably, the step of adjusting the testing equipment based on the adaptability of the most numerous non-conforming type among the statistically analyzed grains includes: If the proportion of ink-displaced grains among the unqualified ink-displacement grains is the highest, then the ink-displacement needle of the test machine is adjusted in the opposite direction according to the direction of the ink displacement. If the proportion of over-inked grains among the unqualified ink-spraying grains is the highest, then the ink-spraying volume of the ink-spraying needle of the test machine should be appropriately reduced. If the proportion of insufficiently inkd crystals is the highest among the unqualified ink-spraying crystals, then the ink jet volume of the ink-spraying needle of the testing machine should be appropriately increased.
[0014] Preferably, the ink ejection volume of the inkjet needle is adjusted by adjusting the pulse voltage of the test instrument.
[0015] The beneficial effects of this invention are as follows: The die testing machine adjustment method provided by this invention involves inputting the constructed ink-spraying sample library data into the testing machine. When the testing machine performs photoelectric testing, it sprays ink onto the die that fails the photoelectric test, and matches the image of the ink-sprayed die with the image of the die sample in the ink-spraying sample library. Based on the matching result, the type of ink-spraying failure is determined, and the ink-spraying needle of the testing machine is adjusted according to the type of ink-spraying failure. The die testing machine adjustment method provided by this invention allows the testing machine system to monitor and inspect the ink dots in real time, greatly improving the efficiency of manual ink dot inspection. The testing machine triggers an alarm based on the monitoring data, which can promptly detect ink dot abnormalities. The method classifies the die that fails ink-spraying failure into failure types and sends the failure types to the display for the staff to view, reminding the staff to calibrate the testing machine in a timely manner. Problem feedback is timely, and the staff can adjust the testing machine according to the adaptability of the classified failure types, improving product yield and making it suitable for widespread promotion.
[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0017] Figure 1 The flowchart of the grain testing equipment adjustment method provided by the present invention is shown below; Figure 2 This is a schematic diagram of the grain ink-printing zone structure in the grain testing machine adjustment method provided by the present invention; Figure 3 This is a schematic diagram of the grain ink offset structure in the grain testing machine adjustment method provided by the present invention; Figure 4 This is a schematic diagram of the excessive ink application structure of the grains in the grain testing machine adjustment method provided by the present invention; Figure 5 This is a schematic diagram of the insufficient ink application structure of the grains in the grain testing machine adjustment method provided by the present invention.
[0018] Explanation of key component symbols: 11. Inking area; 12. Non-inking area.
[0019] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation
[0020] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of the invention are illustrated in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
[0021] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing alternative embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0023] This invention provides a method for adjusting a grain testing machine, such as... Figure 1 As shown, the preparation method includes steps S10-S40: S10, construct an ink-spraying sample library according to preset rules. The ink-spraying sample library contains grain samples that pass ink-spraying and grain samples that fail ink-spraying.
[0024] An ink-spraying sample library is constructed according to preset rules. The ink-spraying sample library contains chip samples that pass ink-spraying and chip samples that fail ink-spraying. It is understood that since the testing equipment may need to perform photoelectric testing on different types of chips, in specific implementation, the ink-spraying sample library may contain chip sample images of different types. Each type of chip sample includes sample images of samples that pass ink-spraying and sample images of samples that fail ink-spraying, in order to adapt to different requirements and expand the scope of application. It is understood that the testing equipment uses a similar method to ink-spray different types of chips that fail photoelectric testing. This embodiment uses one type of chip as an example for explanation. The ink-spraying process and method for other types of chips are similar and will not be described in detail here.
[0025] A sample library of ink-sprayed grains is constructed. Several grain samples with ink-sprayed surfaces are selected. Workers divide the surface of the grain samples into ink-sprayed and non-ink-sprayed areas based on the grain model. The ratio of the area of the ink-sprayed area to the area of the grain sample surface meets a first preset requirement. Optionally, the surface areas of the grains are as follows: Figure 2 The solid-line frame divides the surface of the crystal sample into an ink-spraying area 11 within a dashed frame and a non-ink-spraying area 12 between the dashed and solid frames. The ink-spraying area 11 coincides with the center of the crystal sample surface and extends outward from the center of the crystal sample surface by a certain distance. The ink-spraying area is the area where ink is sprayed by the ink needle, which facilitates the identification of ink dots. Preferably, depending on the crystal model, the area of the ink-spraying area on the crystal surface can be adjusted as needed. Optionally, the ratio of the area of the ink-spraying area to the area of the crystal surface is 0.7-0.9.
[0026] In practice, if the ink dots on the surface of a grain sample are located within the ink-spraying area and the ratio of the area of the ink dots to the area of the ink-spraying area meets the second preset requirement, the grain sample is considered to have passed the ink-spraying test; otherwise, it is considered to have failed the ink-spraying test. Optionally, when constructing the ink-spraying sample library, staff can manually observe the ink-spraying samples and determine whether each grain is qualified. Specifically, the range of the ink-spraying area is set according to engineering experience and grain model. If the ink dots on the surface of a grain sample are located within the ink-spraying area and the ratio of the area of the ink dots to the area of the ink-spraying area meets the second preset requirement, the ink-spraying test of that grain sample is qualified. Specifically, when the ratio of the area of the ink dots to the area of the ink-spraying area is greater than 0.3, the ink-spraying test of that grain sample is considered qualified; otherwise, the ink-spraying test of that grain sample is considered unqualified.
[0027] Optionally, based on the position and shape of the ink dots, grain samples with substandard ink application include at least grain samples with misaligned ink application, grain samples with excessive ink application, and grain samples with insufficient ink application; it is understood that, such as Figure 3 As shown, in the grain sample with ink displacement, the ink dots do not completely fill the ink-dispensing area and are partially or entirely located in the non-ink-dispensing area. Optionally, ink displacement includes at least left displacement, right displacement, upward displacement, and downward displacement. Left displacement, right displacement, upward displacement, and downward displacement are respectively as follows: Figure 3 (a) Figure 3 (b) Figure 3 (c) Figure 3 As shown in (d), the ink spraying deviation is mainly due to the ink spraying needle of the testing machine not being positioned directly above the center of the grain, and the ink droplets ejected by the ink spraying needle being located on one side of the grain surface. Figure 4 As shown, in the grain sample with excessive ink spraying, ink dots fill the sprayed area and partially overflow into the non-sprayed area; excessive ink spraying is mainly caused by the ink needle spraying too much ink in a single stroke, which easily contaminates the surrounding grains; for example... Figure 5 As shown, in the insufficiently inked grain sample, the ink dots are located within the inked area, and the ratio of the ink dot area to the inked area does not meet the second preset requirement. In this embodiment, in the insufficiently inked grain sample, the ink dots are located within the inked area, and the ratio of the ink dot area to the inked area is not greater than 0.3. Insufficient inking may affect the identification of defective grains. Furthermore, after manually constructing the inked sample library, the rules of the inked sample library can be input into the control module of the testing machine through a program to calibrate the testing machine.
[0028] S20: Acquire an image of the wafer after photoelectric testing by the testing machine, and identify the wafers that fail the photoelectric test in the wafer image as test wafers. The testing machine automatically applies ink to the surface of the wafers that fail the photoelectric test. In practical implementation, the die testing machine adjustment method provided by this invention controls the ink-spraying needles to automatically apply ink. Optionally, the ink-spraying needles are installed on a photoelectric testing machine. The testing machine performs photoelectric testing on the wafers. Each wafer has several dies. The photoelectric testing of the wafers involves testing the dies on the wafers. Resulting dies that pass the photoelectric test are marked as OK, and those that fail are marked as NG, and are marked with ink by the ink-spraying needles on the testing machine. The technical solution provided in this application mainly targets dies that fail the photoelectric test and require surface ink application. The testing machine monitors the size and position of the ink dots on the die surface in real time and makes a judgment. Based on the judgment result, the ink-spraying parameters and position of the testing machine are adjusted in a timely manner. Defective products are identified promptly through ink dots, ensuring product quality and reducing the outflow of defective products.
[0029] After calibrating the testing equipment, photoelectric testing can be performed on the dies on the wafer. The testing equipment automatically applies ink to the surface of dies that fail the photoelectric test. The testing equipment takes pictures with a CCD camera to identify the dies that fail the photoelectric test and uses them as test dies. The technical solution of this application is mainly used to determine whether the ink application on the surface of the test die is qualified, and adjusts the ink application needle of the testing equipment according to the determination result to improve the pass rate of ink application on the surface of the test die.
[0030] S30, compare the test die with the die samples in the ink-spraying sample library, find the die that passes the ink-spraying test, and calculate the ink-spraying pass rate; After capturing images of wafers that failed the photoelectric test using a CCD camera, the images of these failed wafers are compared with those of wafers that passed the photoelectric test and wafers that failed the photoelectric test in the corresponding photoelectric sample library. Based on the comparison results, the system determines the photoelectric test status of the wafers that failed the photoelectric test and judges whether the photoelectric test is successful. The system then identifies the wafers that passed the photoelectric test and calculates the photoelectric test success rate based on the wafers that passed the photoelectric test and the wafers that failed the photoelectric test but were still photoelectric tested.
[0031] It is understood that each wafer may have several dies arranged on it. If the testing equipment detects that there are m test dies on the wafer that fail the photoelectric test and have ink stains on their surface, the system compares the m test dies with the corresponding model of ink-staining qualified die samples and ink-staining unqualified die samples in the ink staining sample library, and finds the n dies that are ink-staining qualified among the m test dies. Then the ink staining qualification rate of the testing equipment is n / m*100%. Preferably, in this embodiment, the ink staining qualification rate of the testing equipment is greater than 95%.
[0032] S40, determine whether the ink application pass rate meets the ratio requirement; If the ink application pass rate of the testing machine is greater than 95%, it means that the testing machine meets the ink application requirements and no adjustment is needed. The photoelectric testing of the next wafer can continue.
[0033] If the ink application pass rate is not greater than 95%, it means that the testing machine does not meet the ink application requirements and needs to be calibrated. Optionally, during calibration, select the test dies that fail the ink application test and classify the failure types, and adjust the testing machine according to the classification of failure types.
[0034] Specifically, when classifying defective inking granules, the classification criteria for corresponding granule types in the inking sample library are referenced based on the granule type. This involves dividing the granules into inking and non-inking zones. Then, the defective inking granules are compared with samples of different types of defective inking granules in the inking sample library. The number of granules with inking misalignment, excessive inking, and insufficient inking is counted. Based on the counted granules, the most prevalent type of defect is determined. The testing equipment is then adjusted according to the most prevalent type of defect.
[0035] In practice, if the proportion of ink-misaligned grains among the unqualified ink-spraying grains is the highest, the ink-spraying needle of the testing machine is adjusted in the opposite direction according to the direction of ink misalignment. For example, if the proportion of ink-misaligned grains with the leftward ink misalignment is the highest among the unqualified ink-spraying grains, the ink-spraying needle is adjusted to the right appropriately; if the proportion of ink-misaligned grains with the rightward ink misalignment is the highest among the unqualified ink-spraying grains, the ink-spraying needle is adjusted to the left appropriately. It can be understood that during one ink-spraying process, since the position of the ink-spraying needle relative to the testing machine is relatively fixed, it is unlikely that the proportion of ink-misaligned grains with the leftward ink misalignment and the rightward ink misalignment will be similar at the same time. In other words, if the proportion of left-shifted ink dots is the highest among the unqualified ink dots, the ink needle will be positioned at the upper left of the ink dot when applying ink. Most ink dots on qualified ink dots are also located on the left side of the ink application area. A very small number of ink dots on the surface of the ink dots may be due to the precision error of the ink needle. Therefore, if the proportion of left-shifted ink dots is the highest among the unqualified ink dots, even if the ink needle is adjusted to the right appropriately, it will not cause too many right-shifted ink dots to appear in the subsequent ink application process of the testing machine.
[0036] Optionally, if the proportion of over-inked grains among the defective ink-spraying grains is the highest, the ink ejection volume of the ink-spraying needles on the testing machine can be appropriately reduced; if the proportion of under-inked grains among the defective ink-spraying grains is the highest, the ink ejection volume of the ink-spraying needles on the testing machine can be appropriately increased. In this embodiment, the ink ejection volume of the ink-spraying needles can be adjusted by adjusting the pulse voltage of the testing machine. It is understood that during a single ink-spraying process, it is unlikely that the proportions of over-inked and under-inked grains will be similar at the same time. In other words, if the proportion of over-inked grains among the unqualified inking grains is the highest, then the ink needle will dispense more ink. Most of the ink dots on the qualified inking grains may also have a large area. The very few grains with insufficient ink dots on the surface may be due to the precision error of the ink needle. Therefore, if the proportion of over-inked grains among the unqualified inking grains is the highest, even if the ink dispensing amount of the ink needle is appropriately reduced, it will not lead to too many under-inked grains in the subsequent inking process of the testing machine.
[0037] It is understandable that if the non-compliant ink-spraying chips simultaneously contain chips with leftward ink offset and excessive ink dispensing, then the ink-spraying needle should be adjusted to the right and its ink output reduced accordingly. The adjustment methods for other types of non-compliant ink-spraying are similar and will not be elaborated here. Preferably, in this embodiment, the testing machine is equipped with a data analysis module and an alarm module. When the ink-spraying pass rate of the testing machine is lower than the preset requirement of 95%, the testing machine will promptly issue an alarm and classify the non-compliant chips in the test chips according to their non-compliance type, displaying this information on the testing machine's display screen to promptly remind the staff to calibrate the testing machine.
[0038] Furthermore, the die testing machine adjustment method provided in this embodiment also includes: identifying the dies that the testing machine determines are unqualified in ink application, and manually conducting a secondary inspection on the dies that are determined to be unqualified in ink application. If the dies that the testing machine determines are unqualified in ink application, and the manual secondary inspection shows that the ink application meets the requirements, it is generally considered that the testing machine's inspection standard is too strict and not conducive to improving production efficiency. In this case, the testing machine can be manually calibrated to appropriately reduce the required precision, for example, by appropriately increasing the area of the ink application area or appropriately reducing the ink application pass rate. Similarly, the dies that the testing machine determines are qualified in ink application can also be identified, and manually conducting a secondary inspection on the dies that are determined to be qualified in ink application. If the dies that the testing machine determines are qualified in ink application, and the manual secondary inspection shows that the ink application does not meet the requirements, it is generally considered that the testing machine's inspection standard is too lenient and not conducive to quality control. In this case, the testing machine can be manually calibrated to appropriately increase the required precision, for example, by appropriately decreasing the area of the ink application area or appropriately increasing the ink application pass rate.
[0039] In summary, the die testing equipment adjustment method provided in this application is applied to an optical testing equipment. It constructs an ink-spraying sample library according to preset rules, containing die samples that pass ink-spraying and those that fail. The types of failures include at least ink-spraying misalignment, excessive ink-spraying, and insufficient ink-spraying. The ink-spraying sample library is then entered into the testing system. The testing equipment acquires images of the wafers after photoelectric testing, identifies the die samples that fail the photoelectric test, and uses these as test dies. The testing equipment automatically applies ink to the surface of the die samples that fail the photoelectric test. The test dies are then compared with the die samples in the ink-spraying sample library to identify the die samples that fail the photoelectric test. For qualified ink-sprayed chips, the ink-spraying pass rate is calculated. If the ink-spraying pass rate does not meet the ratio requirements, the testing machine alarms. The chip testing machine adjustment method provided in this embodiment uses the testing machine system to monitor and check the ink dots in real time, which greatly improves the efficiency of manual ink dot inspection. The testing machine triggers an alarm based on the monitoring data, which can promptly detect ink dot abnormalities. Chips that fail ink-spraying are classified into non-conforming types, and the non-conforming types are sent to the display for staff to view, reminding staff to calibrate the testing machine in a timely manner. Problem feedback is timely, and staff can adjust the testing machine according to the classified non-conforming types to improve product yield, making it suitable for widespread promotion.
[0040] It should be noted that the above implementation process is only to illustrate the feasibility of this application, but it does not mean that the die testing equipment adjustment method of this application has the above implementation process. On the contrary, as long as the die testing equipment adjustment method of this application can be implemented, it can be included in the feasible implementation scheme of this application.
[0041] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0042] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.
Claims
1. A method for adjusting a grain testing machine, applied to a testing machine, characterized in that, Includes the following steps: An ink-spraying sample library is constructed according to preset rules. The ink-spraying sample library contains grain samples that have passed ink-spraying and grain samples that have failed ink-spraying. The system acquires images of wafers after photoelectric testing by a testing machine, identifies wafers that fail the photoelectric test, and uses these wafers as test wafers. The testing machine automatically applies ink to the surface of the wafers that fail the photoelectric test. The test crystal is compared with the crystal samples in the ink-spraying sample library to identify the test crystals that pass the ink-spraying test and to calculate the ink-spraying pass rate. Determine whether the ink application pass rate meets the required ratio; If the ink application pass rate meets the required ratio, the testing equipment will not be adjusted, and the photoelectric testing of the next wafer will continue. If the ink application pass rate does not meet the required ratio, then select the unqualified ink application crystals in the test crystals and classify them into unqualified types, and adjust the test machine according to the classified unqualified types. The step of constructing an ink-spraying sample library according to preset rules, wherein the ink-spraying sample library contains qualified ink-spraying grain samples and unqualified ink-spraying grain samples, includes: The surface of the grain sample is divided into regions, namely an ink-sprayed area and a non-ink-sprayed area, wherein the ratio of the area of the ink-sprayed area to the area of the grain sample surface satisfies a first preset requirement. If the ink dots on the surface of the grain sample are located within the ink-spraying area and the ratio of the area of the ink dots to the area of the ink-spraying area meets the second preset requirement, then the grain sample is considered to be inked successfully; otherwise, it is considered to be inked unsuccessfully. The defective grain samples include at least grain samples with misaligned ink, grain samples with excessive ink, and grain samples with insufficient ink. In the grain sample with ink displacement, the ink dots do not fill the ink-spraying area and are partially or entirely located in the non-ink-spraying area; In the grain sample with excessive ink, the ink dots fill the ink-filled area and partially overflow into the non-ink-filled area; In the insufficiently inked grain sample, the ink droplet is located within the inking area and the ratio of the area of the ink droplet to the area of the inking area does not meet the second preset requirement.
2. The method for adjusting a grain testing machine according to claim 1, characterized in that, The first preset requirement is that the ratio of the area of the ink-spraying area to the area of the grain surface is 0.7-0.9; the second preset requirement is that the ratio of the area of the ink dot to the area of the ink-spraying area is greater than 0.
3.
3. The method for adjusting a grain testing machine according to claim 1, characterized in that, The center of the ink-spraying area coincides with the center of the surface of the grain sample.
4. The method for adjusting a grain testing machine according to claim 1, characterized in that, The ink offset includes at least ink offset to the left, ink offset to the right, ink offset to the top, and ink offset to the bottom.
5. The method for adjusting a grain testing machine according to claim 1, characterized in that, The ink application pass rate is greater than 95%.
6. The method for adjusting a grain testing machine according to claim 1, characterized in that, If the ink application pass rate does not meet the required ratio, the step of selecting the unqualified ink application grains from the test grains for non-conformity classification, and adjusting the test equipment according to the classified non-conformity types includes: Select the test grains that fail the ink application test, and divide the surface of the test grains that fail the ink application test. The surface-divided grains are matched with the grain samples with ink displacement, the grain samples with excessive ink, and the grain samples with insufficient ink, respectively, so as to classify the unqualified grains with unqualified ink into unqualified types. The number of grains with inking defects, including those with inking deviation, excessive inking, and insufficient inking, was counted separately. Based on the counted number of grains, the type of defect with the highest proportion of defects in inking defects was determined. The testing equipment is adjusted based on the adaptability of the most prevalent non-conforming type among the statistically analyzed grains.
7. The method for adjusting a grain testing machine according to claim 6, characterized in that, The step of adjusting the testing equipment based on the adaptability of the most prevalent non-conforming type among the statistically analyzed grains includes: If the proportion of inking-misaligned grains is the highest among the unqualified inking grains, then the inking needle of the test machine is adjusted in the opposite direction according to the direction of the inking misalignment. If the proportion of over-inked grains among the unqualified ink-spraying grains is the highest, then the ink-spraying volume of the ink-spraying needle of the test machine should be appropriately reduced. If the proportion of insufficiently inkd crystals is the highest among the unqualified ink-spraying crystals, then the ink jet volume of the ink-spraying needle of the testing machine should be appropriately increased.
8. The method for adjusting a grain testing machine according to claim 7, characterized in that, The ink ejection volume of the inkjet needle is adjusted by adjusting the pulse voltage of the test instrument.