FFU heating device, semiconductor measuring machine and temperature control method thereof

Abstract

This invention provides an FFU heating device, a semiconductor measurement instrument, and a temperature control method thereof. The FFU heating device includes: a chassis with air inlets on all four sides, each covered by an air inlet window; an air outlet at the bottom of the chassis; a drive unit mounted on the chassis and electrically connected to the air inlets for controlling their opening and closing; a fan mounted inside the chassis; a filter located inside the chassis adjacent to the fan for filtering the intake air; and a heater located inside the chassis adjacent to the filter for heating the filtered air. By controlling the opening and closing of the air inlets in different directions, the drive unit of the FFU heating device can change the orientation of the air inlets, moving them away from directions with large or unstable temperature fluctuations. This ensures a stable air temperature input to the FFU heating device, thereby ensuring stable internal temperature of the semiconductor measurement instrument equipped with the FFU heating device and improving the stability of semiconductor measurement data.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an FFU heating device, a semiconductor measuring machine, and a temperature control method thereof. Background Technology

[0002] In the manufacturing of semiconductor integrated circuits, from the initial wafer growth to the later chip packaging, measurement equipment is an indispensable part of the semiconductor industry chain. During wafer film thickness measurement, optical measurement systems are required, and the optical components within these systems are highly sensitive to temperature changes.

[0003] Existing semiconductor measurement equipment has extremely stringent requirements for internal temperature and stability, with temperature variations within the equipment limited to within 1°C. Semiconductor manufacturing workshops typically employ circulating air systems. Many factors influence workshop temperature, such as the heating temperature of the equipment, temperature variations during maintenance, the equipment's location against a wall, and its proximity to heat sources. The magnitude of temperature fluctuations is also related to the location of the circulating air system. Therefore, temperature fluctuations or instability in semiconductor manufacturing workshops severely impact the internal temperature stability of the equipment. This instability leads to inaccurate wafer or chip thickness measurements, affecting the measurement accuracy, production capacity, and yield of the semiconductor measurement equipment, and in severe cases, necessitating a shutdown of the equipment. Furthermore, the air inlet orientation of the fan filter unit (FFU) heating device on existing semiconductor measurement equipment is fixed. Fluctuations or instability in the ambient temperature towards which the air inlet faces can cause internal temperature instability within the equipment.

[0004] Therefore, it is necessary to provide a novel FFU heating device, a semiconductor measuring machine, and a temperature control method thereof to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0005] The purpose of this invention is to provide an FFU heating device, a semiconductor measurement instrument, and a temperature control method thereof to solve at least one defect in the prior art. By adjusting the air intake direction of the FFU heating device, the internal temperature of the semiconductor measurement instrument is stabilized, thereby improving the stability of the measurement data of the semiconductor measurement.

[0006] To achieve the above objectives, the FFU heating device of the present invention includes: a chassis, wherein air inlets are provided on all four sides of the chassis and the air inlets are covered with air inlet windows; an air outlet is provided at the bottom of the chassis; a drive unit is disposed on the chassis and electrically connected to the air inlet windows for controlling the opening and closing of the air inlet windows; a fan is disposed in the chassis; a filter is disposed in the chassis adjacent to the fan for filtering the air drawn in by the fan from the air inlets; and a heater is disposed in the chassis adjacent to the filter for heating the filtered clean air.

[0007] Furthermore, the drive unit includes at least four drive motors, which are evenly distributed on the side walls around the chassis, and each drive motor is electrically connected to the air inlet window in a one-to-one correspondence.

[0008] Furthermore, the air inlet window is a louvered window or a fan-shaped window.

[0009] The beneficial effects of the FFU heating device of the present invention are as follows: the FFU heating device is provided with an air inlet window and a drive unit electrically connected to the air inlet window and controlling the opening and closing of the air inlet window. By controlling the opening and closing of the air inlet window in different directions, the drive unit can keep the air inlet away from the direction of large or unstable temperature fluctuations, so that the air inlet always faces the direction of stable temperature, ensuring that the ambient air temperature input to the FFU heating device is stable, thereby ensuring that the semiconductor measurement equipment equipped with the FFU heating device can have a stable supply of fresh air.

[0010] The present invention also provides a semiconductor measurement apparatus, including an apparatus body, a temperature detection device, an FFU heating device as described above, and a controller, wherein: the temperature detection device includes at least four temperature sensors, respectively arranged around the apparatus body; the temperature detection device is used to detect the ambient temperature data around the apparatus body; a temperature detection system is provided inside the apparatus body for detecting the internal temperature data of the apparatus body; the air outlet of the FFU heating device is connected to the interior of the apparatus body; the controller is used to obtain detection results from the temperature detection device and the temperature detection system, and when the ambient temperature in the first direction currently facing the air inlet does not meet the preset conditions and the internal temperature data is abnormal, the controller controls the drive unit to open and close the air inlet windows in different directions, so that the air inlet switches from the first direction to a second direction, the ambient temperature in the second direction meets the preset conditions and the internal temperature data returns to stability.

[0011] Furthermore, the controller is used to open the air inlet window in the direction where the ambient temperature meets the preset conditions, and to close the air inlet window in the direction where the ambient temperature does not meet the preset conditions, so as to ensure the stability of the internal temperature data.

[0012] Furthermore, the controller is used to adjust the opening degree of the air inlet window to adjust the air intake volume.

[0013] The advantages of the semiconductor measurement equipment described in this invention are as follows:

[0014] To ensure the normal operation of the semiconductor measurement instrument, the internal temperature of the instrument body must be stable and constant. However, the internal temperature of the instrument body is easily affected by fluctuations in the external ambient temperature, impacting its normal operation. When the external ambient temperature in the first direction currently facing the air inlet fluctuates significantly, the ambient temperature data detected by the temperature sensor in the corresponding direction outside the instrument body becomes abnormal. This affects the internal temperature of the instrument body, causing fluctuations and abnormal internal temperature data. The controller then controls the drive unit to open and close the air inlets in different directions, changing the orientation of the air inlet and finding a new air intake direction. This switches the air inlet from facing the first direction to facing a second direction where the ambient temperature data meets preset conditions, moving away from the first direction where the external ambient temperature fluctuates significantly. As a result, the internal temperature data of the instrument body no longer becomes abnormal, and the internal temperature of the instrument body returns to stability. The air inlet facing the second direction ensures a stable supply of fresh air, guaranteeing a stable internal temperature for the instrument body. This prevents the external ambient temperature in the first direction from affecting the accuracy of the data measured by the instrument body, thereby improving the stability of the measurement data of the semiconductor measurement instrument and increasing the product measurement yield.

[0015] This invention also provides a temperature control method for a semiconductor measurement machine, using the semiconductor measurement machine as described above, comprising the following steps: acquiring the detection results of the temperature detection device and the temperature detection system in real time or periodically, the detection results including ambient temperature data detected by the at least four temperature sensors and internal temperature data of the machine body detected by the temperature detection system; acquiring the detection results from the temperature detection device and the temperature detection system; when the ambient temperature data in the first direction currently facing the air inlet does not meet a preset condition and the internal temperature data is abnormal, controlling the drive unit to open and close the air inlet windows in different directions, so that the air inlet switches from the first direction to a second direction, the ambient temperature data in the second direction meets the preset condition and the internal temperature data returns to stability.

[0016] Furthermore, the temperature range of the preset conditions is 21 degrees Celsius to 24 degrees Celsius.

[0017] The beneficial effects of the temperature control method for the semiconductor measurement instrument of the present invention are as follows:

[0018] The temperature detection device and system acquire detection results in real time or periodically. When the external ambient temperature in the first direction currently facing the air inlet fluctuates significantly, the ambient temperature data detected by the temperature sensor in the corresponding direction of the machine body becomes abnormal. This affects the internal temperature of the machine body, causing fluctuations and abnormal internal temperature data. The controller then controls the drive unit to open and close the air inlets in different directions, changing the orientation of the air inlet and finding a new air intake direction. This switches the air inlet from facing the first direction to facing a second direction where the ambient temperature data meets preset conditions, moving away from the first direction where the external ambient temperature fluctuates significantly, until the internal temperature data of the machine body is no longer abnormal and the internal temperature of the machine body stabilizes. The air inlet facing the second direction achieves a stable supply of fresh air, ensuring the stability of the internal temperature of the machine body. This avoids the external ambient temperature in the first direction affecting the accuracy of the measured data, improves the stability of the semiconductor measurement data, and increases the product measurement yield. Attached Figure Description

[0019] Figure 1 This is an overall structural diagram of the FFU heating device provided in the embodiment of the present invention;

[0020] Figure 2 A top view of the FFU heating device provided in the embodiment of the present invention;

[0021] Figure 3 This is an overall structural diagram of the semiconductor measurement machine provided in the embodiments of the present invention;

[0022] Figure 4 A top view of a semiconductor measurement machine provided in an embodiment of the present invention;

[0023] Figure 5 This is a schematic flowchart of a temperature control method for a semiconductor measurement machine according to an embodiment of the present invention. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0025] To address the problems existing in the prior art, embodiments of the present invention provide an FFU heating device, a semiconductor measurement instrument, and a temperature control method thereof. The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0026] Figure 1 This is an overall structural diagram of the FFU heating device provided in the embodiment of the present invention; Figure 2 This is a top view of the FFU heating device provided in the embodiment of the present invention.

[0027] Reference Figure 1 As shown, in some embodiments of the present invention, an FFU heating device is provided. The FFU heating device 1 includes a housing 11, an air inlet 12, an air outlet 13, a drive unit 14, a fan, a filter, and a heater. The outer surface of the housing 11 is provided with the air inlet 12 and the air outlet 13. Air inlets are provided on all four sides of the housing 11. The air inlets 12 are covered with air inlet windows, meaning the housing 11 includes four side walls 111, each with an air inlet window. The air outlet 13 is located at the bottom of the housing 11. The drive unit 14 is mounted on the housing 11 and electrically connected to the air inlet windows, used to control the opening and closing of the air inlets. The fan is disposed within the housing 11. The filter is disposed within the housing 11 adjacent to the fan, used to filter the air drawn in by the fan from the air inlet 12. The heater is disposed within the housing 11 adjacent to the filter, used to heat the filtered clean air. The air outlet 13 is used to deliver clean air heated by the heater to the semiconductor measurement machine connected to the FFU heating device 1.

[0028] Reference Figure 1 As shown, in some embodiments of the present invention, the drive unit 14 includes four drive motors 141, which are evenly distributed on the side walls around the housing 11. Each drive motor 141 is electrically connected to a corresponding air inlet window to control the opening and closing of the corresponding air inlet window. The air inlet window can be a louvered window or a fan-shaped window. Figure 1The illustration shows that the air inlet is a louvered window. It should be understood that the air inlet can also be other types, and the present invention does not specifically limit them.

[0029] Figure 3 This is an overall structural diagram of the semiconductor measurement machine provided in the embodiments of the present invention; Figure 4 This is a top view of a semiconductor measurement machine provided in an embodiment of the present invention.

[0030] Reference Figure 1 , Figure 3 and Figure 4 As shown, in some embodiments of the present invention, a semiconductor measurement instrument is also provided, including an instrument body 2, a temperature detection device 3, an FFU heating device 1 as described above, and a controller 4. The FFU heating device 1 is disposed on the top of the instrument body 2, and its air outlet 13 communicates with the interior of the instrument body 2 to deliver external air into the interior of the instrument body 2. A temperature detection system is provided inside the instrument body 2 to detect and provide feedback on changes in the internal operating temperature of the instrument body 2. The temperature detection device 3 includes four temperature sensors 31, which are respectively arranged around the instrument body 2. The four temperature sensors 34 are used to detect ambient temperature data in four different directions around the instrument body 2 to accurately determine the actual direction of the ambient temperature change around the instrument body 2. The instrument body 2 includes four side plates 21 connected in sequence, and each side plate 21 is provided with a temperature sensor 31. Each temperature sensor 31 is disposed at the same height on the side of each side plate 21 facing the outside of the instrument body 2. A controller 4 is installed on the outside of the machine body 2. The controller 4 is electrically connected to the temperature control system and also electrically connected to each temperature sensor 31. A display 41 is installed on the controller 4 to display the temperature changes in the direction of the temperature sensor 31 installed on the outside of the machine body 2 and the temperature changes inside the machine body 2.

[0031] In this embodiment, the controller 4 obtains detection results from the temperature detection device 3 and the temperature detection system. When the ambient temperature data of the first direction in which the air inlet 12 is currently facing does not meet the preset conditions and the internal temperature data of the machine body 2 is abnormal, the controller 4 controls the drive motors 141 of different directions to open and close the air inlet windows of the corresponding directions and controls the opening degree of the air inlet windows, so that the air inlet 12 switches from the first direction to the second direction in which the ambient temperature data meets the preset conditions. The ambient temperature in the second direction can restore the internal temperature data of the machine body 2 to a stable state. With this setting, based on the feedback from the temperature sensor 31 outside the machine body 2 and the temperature detection system inside the machine body 2, the direction of the air inlet 12 is automatically adjusted by controlling the opening and closing of the air inlet windows and controlling the opening degree of the air inlet windows through the drive motors 141, finding a suitable air intake direction, away from the direction of large fluctuations in the external ambient temperature, achieving a stable supply of heated fresh air, ensuring the stability of the internal temperature of the machine body 2, and thus ensuring the stability of the measurement data of the semiconductor measurement machine.

[0032] In some embodiments of the present invention, the temperature detection device 3 has a number of temperature sensors 31 greater than or equal to four, which are evenly distributed around the machine body 2 on the side wall of the machine body 2 to detect temperature changes in different directions around the machine body 2.

[0033] In some embodiments of the present invention, the controller 4 is used to control the air inlet window to open when the ambient temperature data meets the preset conditions and can keep the internal temperature data of the machine body 2 stable, and to control the air inlet window to close when the ambient temperature data does not meet the preset conditions and cannot keep the internal temperature data of the machine body 2 stable, so as to adjust the air inlet direction of the FFU heating device 1 so that it always faces the direction when the ambient temperature data meets the preset conditions, thereby achieving a stable supply of fresh air and ensuring the stability of the internal temperature of the machine body 2.

[0034] In some embodiments of the present invention, the controller 4 can also adjust the opening degree of the air inlet window to adjust the air intake volume. For example, when the air inlet window is a louver, the airflow when the louver is fully open is twice the airflow when the louver is half open.

[0035] In some embodiments of the present invention, a measurement platform is provided inside the instrument body 2. The measurement platform includes at least one heat source, at least one light source and at least one optical lens. The wafer to be measured is placed on the measurement platform. The heat source and ventilation heating filter ensure that the working environment temperature inside the instrument body 2 is maintained at a specific temperature. The light source and optical lens are combined to measure the film thickness data of the wafer to be measured.

[0036] In some embodiments of the present invention, the present invention also provides a temperature control method for a semiconductor measurement instrument. Using the semiconductor measurement instrument as described above, the orientation of the air inlet 12 is selected to ensure that the internal temperature of the instrument body 2 remains stable. The method includes the following steps: real-time or periodic acquisition of the detection results from the temperature detection device 3 and the temperature detection system. The detection results include ambient temperature data detected by at least four temperature sensors 31 and internal temperature data of the instrument body 2 detected by the temperature detection system. The controller 4 acquires the detection results from the temperature detection device 3 and the temperature detection system. When the ambient temperature data in the first direction to which the air inlet 12 is currently facing does not meet preset conditions and the internal temperature data of the instrument body 2 is abnormal, the controller 4 controls the drive motors 141 in different directions to open and close the corresponding air inlets and the degree of opening of the air inlets, so that the air inlet 12 switches from the first direction to the second direction. The ambient temperature data in the second direction meets preset conditions and can restore the internal temperature data of the instrument body 2 to stability. Figure 5 As shown, the detailed steps of the above temperature control method include:

[0037] S0: Provides semiconductor measurement equipment;

[0038] S1: Start the semiconductor measurement equipment, turn on the semiconductor measurement machine, turn on the FFU heating device 1 and controller 4, set the gas temperature entering the machine body 2, and set the stable range of the internal temperature of the machine body 2.

[0039] S2: Turn on the internal temperature detection system of the machine body 2, detect the internal temperature data of the machine body 2, and wait for the internal temperature of the machine body 2 to reach a stable level.

[0040] S3: Turn on the four temperature sensors 31 of the temperature detection device 3 to detect the ambient temperature data around the machine body 2 respectively;

[0041] S4: The controller 4 acquires the detection results of the temperature detection device 3 and the temperature detection system in real time or periodically. The detection results include the ambient temperature data detected by at least four temperature sensors 31 and the internal temperature data of the machine body 2 detected by the temperature detection system. When the ambient temperature data detected by the temperature sensor 31 in the first direction that the air inlet 12 is currently facing does not meet the preset data range, it indicates that the ambient temperature in the first direction has fluctuated significantly, the internal temperature of the machine body 2 is affected and fluctuates, and the internal temperature data detected by the temperature detection system also fluctuates accordingly. If the internal temperature data exceeds the stable range set in step S1, it means that the ambient temperature in the first direction that the air inlet 12 is currently facing can no longer keep the internal temperature of the machine body 2 stable. The controller 4 controls the drive motor 141 in the first direction to close the air inlet window in the corresponding direction, controls the drive motor 141 in other directions to open the air inlet windows in other corresponding directions in turn, and controls the opening and closing degree of the air inlet windows, so that the air inlet 12 changes direction, finds a new air inlet direction, and moves away from the first direction where the temperature sensor 31 is abnormal, until the internal temperature of the machine body 2 returns to stability. At this time, the orientation of the air inlet 12 is the second direction. The ambient temperature data in the second direction meets the preset conditions and can make the internal temperature data of the machine body 2 return to stability. The air inlet 12 switches from the first direction to the second direction.

[0042] Step S1 specifically includes the following steps:

[0043] S11: Turn on the heat source inside the machine body 2, and simultaneously turn on the heater and filter of the FFU heating device 1 to make the internal temperature of the machine body 2 reach the set stable range.

[0044] Step S2 specifically includes the following steps:

[0045] S21: Observe the feedback from the temperature detection system on the display 41 of the controller 4 outside the machine body 2 to ensure that the internal temperature of the machine body 2 is kept within a stable range.

[0046] In step S4, when the ambient temperature data detected by the temperature sensor 31 in the first direction currently facing the air inlet 12 meets the unpreset conditions and the detection result fluctuates significantly, it indicates that the external ambient temperature in the first direction currently facing the air inlet 12 fluctuates greatly and is unstable.

[0047] In some specific embodiments of the present invention, when the ambient temperature in the first direction to which the air inlet 12 is currently facing is too high, and the ambient temperature data detected by the temperature sensor 31 in the first direction does not meet the preset conditions, the internal temperature of the machine body 2 is affected and fluctuates, and the internal temperature data detected by the temperature detection system also fluctuates. The controller 4 will control the air inlet window in the first direction to close, and open the air inlet window in the direction where the ambient temperature data meets the preset conditions according to the detection results of the temperature sensor 31. After the air inlet window where the ambient temperature data meets the preset conditions is opened, the opening degree of the air inlet window is determined by the feedback of the temperature detection system inside the machine body 2. When the internal temperature of the machine body 2 returns to stability, and the internal temperature data detected by the temperature detection system returns to stability, the controller 4 controls the air inlet window to stop opening and remain in the open / closed position.

[0048] In some embodiments of the present invention, when the internal temperature of the machine body 2 is stable in step S4, and the ambient temperature data detected by the temperature sensor 31 in the first direction to which the air inlet 12 is currently facing does not meet the preset data range, the air direction may not be adjusted. However, in order to protect the machine body 2 and to ensure the normal operation of the machine body 2, when it is determined that the ambient temperature fluctuation in the first direction to which the air inlet 12 is currently facing will affect the internal temperature stability of the machine body 2, the controller 4 can actively control the opening and closing of the air inlet windows in different directions and the degree of opening and closing of the air inlet windows to adjust the orientation of the air inlet 12.

[0049] In some embodiments of the present invention, the preset temperature range is 21 degrees Celsius to 24 degrees Celsius.

[0050] In summary, by using the temperature control method described above for the semiconductor measurement equipment, the orientation of the air inlet 12 can be adjusted to find a suitable air intake direction, moving away from the first direction where the external ambient temperature fluctuates greatly. This allows the air inlet 12 to switch from the first direction to the second direction, achieving a stable supply of fresh air and ensuring the internal temperature of the equipment body 2 remains stable. This prevents the external ambient temperature in the first direction from affecting the accuracy of the measurement data of the equipment body 2, improves the stability of the measurement data of the semiconductor measurement equipment, and increases the measurement yield of the products.

[0051] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A semiconductor measurement instrument, characterized in that, The system includes a machine body, a temperature detection device, an FFU heating device, and a controller. The FFU heating device includes: The chassis has air inlets on all four sides, each covered with an air inlet window; the chassis also has an air outlet at the bottom. The drive unit is mounted on the chassis and electrically connected to the air inlet window, and is used to control the opening and closing of the air inlet window; The fan is installed in the casing; A filter, disposed in the chassis adjacent to the fan, is used to filter the air drawn in by the fan from the air inlet; A heater, located in the chassis adjacent to the filter, is used to heat the filtered clean air; The drive unit includes at least four drive motors, which are evenly distributed on the side walls around the chassis. Each drive motor is electrically connected to one of the air inlets. The air inlets are louvers or fan-shaped windows. Wherein: the temperature detection device includes at least four temperature sensors, which are respectively arranged around the machine body; the temperature detection device is used to detect the ambient temperature data around the machine body; The machine body is equipped with a temperature detection system for detecting the internal temperature data of the machine body; The air outlet of the FFU heating device is connected to the interior of the machine body; The controller is used to obtain detection results from the temperature detection device and the temperature detection system. When the ambient temperature data of the first direction in which the air inlet is currently facing does not meet the preset conditions and the internal temperature data is abnormal, the controller controls the drive unit to open and close the air inlet windows in different directions, so that the air inlet switches from the first direction to the second direction, and the ambient temperature data in the second direction meets the preset conditions and the internal temperature data returns to stability.

2. The semiconductor measurement apparatus according to claim 1, characterized in that, The controller is used to open the air inlet window when the ambient temperature data meets the preset conditions, and to close the air inlet window when the ambient temperature data does not meet the preset conditions, so as to ensure the stability of the internal temperature data.

3. The semiconductor measurement apparatus according to claim 1, characterized in that, The controller is used to adjust the opening degree of the air inlet window to adjust the air intake volume.

4. A temperature control method for a semiconductor measuring instrument, characterized in that, The application of the semiconductor measurement equipment as described in any one of claims 1 to 3 includes the following steps: The detection results of the temperature detection device and the temperature detection system are acquired in real time or periodically. The detection results include ambient temperature data detected by the at least four temperature sensors and internal temperature data of the machine body detected by the temperature detection system. The detection results are obtained from the temperature detection device and the temperature detection system. When the ambient temperature data of the first direction in which the air inlet is currently facing does not meet the preset conditions and the internal temperature data is abnormal, the drive unit is controlled to open and close the air inlet windows in different directions, so that the air inlet switches from the first direction to the second direction, the ambient temperature data in the second direction meets the preset conditions and the internal temperature data returns to stability.

5. The temperature control method for a semiconductor measurement machine according to claim 4, characterized in that, The preset temperature range is 21 degrees Celsius to 24 degrees Celsius.

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