Universal transfer station and method of operation

Abstract

The application discloses a kind of omnipotent transfer station and operating method, transfer station is set between SMT surface mount line body and DIP packaging line body, respectively through SMT outboard subtrack and DIP inboard subtrack connection SMT surface mount line body and DIP packaging line body, still include the transfer machine of connection SMT surface mount line body, and the one end of transfer machine is connected with DIP inboard subtrack between through setting plate machine and push plate outboard track connection DIP inboard subtrack, and by the SMT outboard subtrack docking SMT surface mount line body end;The technical scheme of the application docks front SMT line body and rear DIP line body and intelligent warehousing, by AGV cooperation and its control platform, carries out direct current, transfer, storage;Different functions can be realized according to actual different production needs, more intelligent, saves manpower resources.

Description

Technical Field

[0001] This invention relates to the fields of manufacturing, transportation and storage technology, and in particular to a universal transfer station and its operation method. Background Technology

[0002] SMT (Surface Mount Technology) is a next-generation electronic assembly technology developed from hybrid integrated circuit technology. Characterized by surface mount technology for components and reflow soldering, it has become a leading assembly technology in electronic product manufacturing. The main equipment in an SMT production line includes: printers, pick-and-place machines (for surface-mount electronic components), reflow soldering machines, through-hole soldering machines, wave ovens, and testing and packaging equipment. The widespread application of SMT has promoted the miniaturization and multi-functionality of electronic products, providing conditions for mass production and low-defect manufacturing. However, due to the large variety and quantity of electrical components in the printed circuit board (PCB) production process, multiple soldering processes are required, and each process necessitates manual inspection.

[0003] Dual In-Line Package (DIP), also known as DIP packaging or DIL, is a type of integrated circuit packaging. Components in DIP packages (hereinafter referred to as DIP components) can be soldered into through-holes plated on a printed circuit board (PCB) or inserted into DIP sockets. In traditional production, workers at the insertion station use carriers to place the PCB on them for insertion. After insertion, the PCB and corresponding carrier are placed into a soldering machine for soldering. After soldering, the workers at the soldering station remove the product and collect the carrier in a recycling bin. Once the recycling bin is full, a trolley transports the carrier to the insertion station for use.

[0004] In existing technical solutions, PCBA board production typically requires configuring separate SMT or DIP lines based on the current production content. As a result, the functions of each production line are relatively isolated, requiring a large amount of manual labor to connect the SMT and DIP lines during the overall production process, which leads to a significant waste of human resources. Summary of the Invention

[0005] To address the aforementioned issues, this invention proposes a universal transfer station and its operation method, which connects to the front-end SMT line, the back-end DIP line, and intelligent warehousing. Through the cooperation of AGVs and their control platform, it performs operations such as DC transfer, transfer, and storage. The specific technical solution is as follows.

[0006] Firstly, a universal transfer station is provided, located between an SMT surface mount line and a DIP packaging line, connecting the SMT surface mount line and the DIP packaging line respectively via an SMT output track and a DIP input track. The station also includes a transfer machine connecting the SMT surface mount line, one end of which is connected to the DIP input track via a board loading machine and a board pushing and output track, and docks with the end of the SMT surface mount line via the SMT output track.

[0007] Furthermore, the SMT output track and the DIP input track are dual-track configurations, and the two tracks can operate simultaneously or independently.

[0008] Furthermore, an NG plate take-up machine and an OK plate take-up machine are also arranged adjacent to each other at the other end of the transfer machine.

[0009] Furthermore, a flipping machine is also provided at the other end of the transfer machine, and a flipping and retracting machine is correspondingly provided behind the flipping machine.

[0010] Furthermore, the relay station is also equipped with a signal transceiver and control module, which receives the AOI automatic optical inspection signal from the end of the SMT surface mount line and processes the board according to the inspection signal result.

[0011] On the other hand, a universal transfer station operation method, based on the aforementioned universal transfer station, includes single-track board output processing and dual-track board output processing for SMT surface mount lines. The dual-track board output processing for SMT surface mount lines includes: When both tracks of an SMT surface mount line produce single-sided boards, the produced single-sided boards enter the transfer station for processing via the SMT board output track. The signal transceiver and control module receives the AOI automatic optical inspection signal at the end of the SMT surface mount line, and automatically sends the boards that meet the inspection requirements into the OK board receiver and the boards that do not meet the requirements into the NG board receiver. If the current single-sided board does not need to be collected and needs to be processed by the next equipment, the transfer station will transfer the board to the DIP board entry track through the board loading machine and the board pushing and exiting track, and directly connect with the DIP packaging line to flow into the next equipment. If the preset requirements require that the production frequency of the front-end SMT surface mount line and the back-end DIP packaging line be consistent, then the transfer station will collect M boards according to the preset requirements, and connect N boards to the DIP packaging line via DC to flow into the next equipment. M and N are the number of single boards.

[0012] Furthermore, the dual-track board exit process of the SMT surface mount line also includes: When SMT surface mount line produces double-sided boards, the first track performs mounting on the first side of the double-sided board and then conveys it to the transfer station flipping machine and flipping and collecting machine, and puts it into the material frame; if the double-sided board does not need to be processed further, it is transferred to the PCBA warehouse for storage by intelligent warehouse AGV transport robot. If the double-sided board still needs processing, it will be transferred to the corresponding production line or transferred to the front-end SMT surface mount line to enter the second track for the second side mounting process.

[0013] Furthermore, after the second track performs the second side mounting process, the track conveys the double-sided panels with both sides already mounted to the transfer station for corresponding board collection processing, directly connecting with the DIP packaging line to flow into the next equipment, or collecting part of the double-sided panels and directly connecting part of them to flow into the next equipment according to preset requirements.

[0014] Furthermore, the single-track board output processing step of the SMT surface mount line is the same as when both tracks of the SMT surface mount line produce single-sided boards. The boards are conveyed to the transfer station for corresponding board receiving processing, directly docked with the DIP packaging line to flow into the next equipment, or according to preset requirements, part of the double-sided boards are received and part of them are directly docked to flow into the next equipment.

[0015] It also includes: when the SMT surface mount line and the back-end DIP packaging line process different PCBA boards, the front-end SMT surface mount line and the back-end DIP packaging line are separated to operate in coordination; according to the requirements, the transfer station collects and stores the boards processed by the SMT surface mount line or transfers them by AGV transport robots; for boards that need to be transferred to the back-end DIP packaging line for processing, the board material frame is automatically delivered into the transfer station at a set frequency.

[0016] The beneficial effects of this invention are as follows: This invention proposes a universal transfer station and its operation method, which connects to the front-end SMT line and the back-end DIP line and intelligent warehousing. Through the cooperation of AGVs and its control platform, it performs DC transfer, transfer and storage; it can realize different functions according to different actual production needs, making it more intelligent; it connects to the front and back lines to realize the hub function of connection and separation, and can be extended to other places; it connects to AGV intelligent warehousing to realize data connection, control and robot simulation of human labor, which greatly saves human resources. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a universal transfer station structure in an embodiment of the present invention; Figure 2 This is a schematic diagram of the connection process between the universal transfer station and the SMT line in an embodiment of the present invention; Among them, 1-SMT board output track, 2-DIP board input track, 3-Push board output track, 4-Board loading machine, 5-Transfer machine, 6-NG board collecting machine, 7-OK board collecting machine, 8-Flipping machine, 9-Flipped board collecting machine. Detailed Implementation

[0018] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the present invention will now be described with reference to the accompanying drawings.

[0019] This invention proposes a universal transfer station and its operation method. Firstly, a universal transfer station, such as... Figure 1 As shown, a transfer machine 5 is positioned between the SMT surface mount line and the DIP packaging line, connecting the two lines via an SMT board exit track 1 and a DIP board entry track 2, respectively. The transfer machine 5 also includes a transfer machine 5 that connects to the SMT surface mount line. One end of the transfer machine 5 is connected to the DIP board entry track 2 via a board loading machine 4 and a board pushing and exiting track 3, and it connects to the end of the SMT surface mount line via the SMT board exit track 1.

[0020] In this embodiment, the SMT board output track 1 and the DIP board input track 2 are configured as dual tracks, which can operate simultaneously or independently. An NG board receiving machine 6 and an OK board receiving machine 7 are also adjacent to each other at the other end of the transfer machine 5. A flipping machine 8 is also provided at the other end of the transfer machine 5, and a flipping and retrieving machine 9 is correspondingly provided behind the flipping machine 8. The transfer station is also equipped with a signal transceiver and control module, which receives the AOI automatic optical inspection signal from the end of the SMT surface mount line and processes the boards according to the inspection signal results.

[0021] On the other hand, the present invention also proposes a universal transfer station operation method, based on the aforementioned universal transfer station, including single-track board output processing and dual-track board output processing for SMT surface mount lines, such as... Figure 2 As shown, the dual-track board exit process of the SMT surface mount line includes: When both tracks of the SMT surface mount line produce single-sided boards, the produced single-sided boards enter the transfer station for processing via SMT board output track 1. The signal transceiver and control module receives the AOI automatic optical inspection signal at the end of the SMT surface mount line, and automatically sends the boards that meet the inspection requirements into the OK board taker 7, and those that do not meet the requirements into the NG board taker 6. If the current single-sided board does not need to be collected and needs to be processed by the next equipment, the transfer station will transfer the board to the DIP board entry track 2 through the board loading machine 4 and the board pushing and exiting track 3, and directly connect with the DIP packaging line to flow into the next equipment. If the preset requirements require that the production frequency of the front-end SMT surface mount line and the back-end DIP packaging line be consistent, then the transfer station will collect M boards according to the preset requirements, and connect N boards to the DIP packaging line via DC to flow into the next equipment. M and N are the number of single boards.

[0022] In this embodiment, the dual-track board exit process of the SMT surface mount line further includes: When the SMT surface mount line produces double-sided boards, the first track performs mounting processing on the first side of the double-sided board and then conveys it to the transfer station flipper 8 and flipping and collecting machine 9 to collect it into the material frame; if the double-sided board does not require further processing, it is transferred to the PCBA warehouse for storage by intelligent warehouse AGV transport robot. If the double-sided board still needs processing, it will be transferred to the corresponding production line or transferred to the front-end SMT surface mount line to enter the second track for the second side mounting process.

[0023] After the second track performs the second side mounting process, the track conveys the double-sided panels with both sides mounted to the transfer station for corresponding board collection processing, directly connecting with the DIP packaging line to flow into the next equipment, or collecting part of the double-sided panels and directly connecting the other part to flow into the next equipment according to preset requirements.

[0024] The board output process for a single track on an SMT surface mount line is the same as when both tracks on the SMT surface mount line produce single-sided boards. The boards are then conveyed to a transfer station for appropriate board collection, directly docked with the DIP packaging line, and flow into the next device. Alternatively, according to preset requirements, a portion of the double-sided boards are collected and the remaining portion is directly docked into the next device.

[0025] In this embodiment, when the SMT surface mount line and the subsequent DIP packaging line process different PCBA boards, the front-end SMT surface mount line and the rear-end DIP packaging line are separated and operate in coordination. According to the requirements, the transfer station collects and stores the boards processed by the SMT surface mount line or transports them by AGV robots. For boards that need to be transferred to the subsequent DIP packaging line, the board material frame is automatically delivered into the transfer station at a set frequency.

[0026] In the universal transfer station and operation method proposed in this invention, the transfer station connects the front-end (SMT) and back-end (DIP) stages and intelligent warehousing. Through the cooperation of AGVs and their control platform, operations such as direct current transfer, transfer, and storage are performed. After the PCBA boards are inspected by the AOI at the SMT end, the AOI sends NG or OK signals to the universal transfer station. Upon receiving the signal, the universal transfer station can separately collect and store NG and OK boards according to the settings. For special double-sided boards that require two reflow cycles, automatic flipping and collection can be achieved, saving manpower. Simultaneously, it connects with AGV intelligent transport robots to achieve automated cycles of board collection, transfer, and reprocessing. PCBA boards flowing into the universal transfer station can be partially stored and partially direct current processed according to requirements (OK settings, numerical settings); or OK direct current processed and NG boards collected, making it more intelligent and technologically advanced. As a connecting hub, the universal transfer station can connect the SMT and DIP stages for integrated production, or it can isolate them without interference.

[0027] The foregoing description and illustrations have shown and described the basic principles, main features, and advantages of this invention. Those skilled in the art should understand that this invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to this invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method for operating a universal transfer station, applied to a universal transfer station set between an SMT surface mount line and a DIP packaging line, characterized in that, This includes single-track board output processing and dual-track board output processing for SMT surface mount lines. The universal transfer station connects the SMT surface mount line and the DIP packaging line via SMT board output track (1) and DIP board input track (2), respectively, and also includes a transfer machine (5) connecting the SMT surface mount line; one end of the transfer machine (5) is connected to the DIP board input track (2) via a board loading machine (4) and a board pushing and output track (3), and docks with the end of the SMT surface mount line via the SMT board output track (1); the transfer machine ( 5) At the other end, there are also NG board take-up machine (6), OK board take-up machine (7) and flipping machine (8) respectively. A flipping board take-up machine (9) is set up after the flipping machine (8); the SMT board output track (1) and DIP board input track (2) are set up as dual tracks, and the two tracks can run simultaneously or independently; a signal transceiver and control module is also provided. The signal transceiver and control module receives the AOI automatic optical detection signal at the end of the SMT surface mount line and processes the board according to the detection signal result; The dual-track board exit process of the SMT surface mount line includes: When both tracks of the SMT surface mount line produce single-sided boards, the produced single-sided boards enter the transfer station for processing via the SMT board output track (1). The signal transceiver and control module receives the AOI automatic optical inspection signal at the end of the SMT surface mount line. Based on the inspection results, the board that meets the requirements is automatically sent to the OK board receiving machine (7), and the board that does not meet the requirements is sent to the NG board receiving machine (6). If the current single-sided board does not need to be collected and needs to be processed by the next equipment, the transfer station will transfer the board to the DIP board entry track (2) through the board loading machine (4) and the board pushing and exiting track (3), and directly connect with the DIP packaging line to flow into the next equipment; If the preset requirements require that the production frequency of the front-end SMT surface mount line and the back-end DIP packaging line be consistent, then the transfer station will collect M boards according to the preset requirements, and connect N boards to the DIP packaging line via DC to flow into the next equipment. M and N are the number of single boards. The dual-track board exit process for the SMT surface mount line also includes: When the SMT surface mount line produces double-sided boards, the first track performs mounting processing on the first side of the double-sided board and then conveys it to the transfer station flipping machine (8) and flipping and collecting machine (9) to collect it into the material frame; if the double-sided board does not need to be processed further, it is transferred to the PCBA warehouse for storage by the intelligent warehouse AGV transport robot. If this double-sided board still needs processing, it will be transferred to the corresponding production line or transferred to the front-end SMT surface mount line to enter the second track for the second side mounting process. When the SMT surface mount line and the subsequent DIP packaging line process different PCBA boards, they can be separated and operated in coordination. According to the requirements, the transfer station collects and stores the boards processed by the SMT surface mount line or transports them by AGV robots. For boards that need to be transferred to the subsequent DIP packaging line, the board material frame is automatically delivered to the transfer station at a set frequency.

2. The universal transfer station operation method according to claim 1, characterized in that, After the second track performs the second-side mounting process, the track conveys the double-sided panels with both sides mounted to the transfer station for corresponding board collection processing, directly connecting with the DIP packaging line to flow into the next equipment, or collecting part of the double-sided panels and directly connecting part of them to flow into the next equipment according to preset requirements.

3. The universal transfer station operation method according to claim 1, characterized in that, The single-track board output processing steps of the SMT surface mount line are the same as those when both tracks of the SMT surface mount line produce single-sided boards. The boards are then conveyed to the transfer station for corresponding board receiving processing, directly docked with the DIP packaging line to flow into the next equipment, or, according to preset requirements, part of the double-sided boards are received and the other part is directly docked to flow into the next equipment.

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