一种半导体产线拆盘设备
By combining the lifting mechanism and the tray-separating mechanism, the problem of separating and transferring the work tray and the empty tray in semiconductor production is solved, achieving efficient transfer of the work tray and support and storage of the empty tray, thus improving production efficiency.
CN117775699BActive Publication Date: 2026-07-17QINGDAO SIASUN ROBOT & AUTOMATION CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- QINGDAO SIASUN ROBOT & AUTOMATION CO LTD
- Filing Date
- 2024-01-25
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In semiconductor manufacturing, existing technologies struggle to efficiently separate and transfer work trays and empty trays, leading to confusion and inefficiency in subsequent processes.
Method used
The system employs a combination of a lifting mechanism, a tray separating mechanism, and a support mechanism. The lifting mechanism separates the loaded tray from the empty tray, the transmission mechanism transports the loaded tray, and the support mechanism supports and stores the empty tray.
Benefits of technology
It enables efficient separation and separate transfer of the loaded and empty pallets, improving production efficiency and avoiding process confusion.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN117775699B_ABST
Abstract
本发明公开了一种半导体产线拆盘设备，其技术方案要点是包括传输机构，所述传输机构用于对承载盘进行传输；顶升机构，所述顶升机构用于带动传输机构上的承载盘进行上下移动；分盘机构，所述分盘机构设置有两组且分别位于传输机构两侧，分盘机构包括分盘板，所述分盘板能够插入到相邻两承载盘之间并且将相邻两承载盘当中位于顶部的承载盘进行支撑；以及支撑机构，所述支撑机构用于对顶升机构顶起的空载盘进行支撑收纳；通过顶升机构和分盘机构的配合，能够将各载物盘分离，通过传输机构能够将分离出的载物盘依次传递至下一工序，通过支撑机构对分离出的空载盘进行支撑收纳。
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