A resin composition, a resin-coated copper foil, a metal-clad laminate, and applications

Abstract

The present application provides a kind of resin composition, coat resin copper foil, metal foil clad plate and application, the resin composition includes the following components by mass parts: thermosetting resin 15-30 parts, inorganic filler 70-85 parts, defoaming agent 0.1-1.5 parts;The thermosetting resin includes epoxy resin;The inorganic filler includes barium titanate and / or strontium titanate, its particle size D 20 50-250nm, D 50 300-800nm, D 90 0.9-1.8 μm, D 100 3 μm.The present application can form high filling compact packing by the design of inorganic filler, and with other components, so that inorganic filler has excellent dispersibility, can form defect-free high-quality dielectric layer.The resin composition has high dielectric constant, excellent high temperature and high humidity reliability, low leakage current and excellent voltage withstand performance, fully meets the use requirements of high performance buried container material.

Description

Technical Field

[0001] This invention belongs to the field of embedded material technology, specifically relating to a resin composition, resin-coated copper foil, metal-clad foil plate, and their applications. Background Technology

[0002] As electronic devices evolve towards higher functionality and miniaturization, the proportion of passive components in electronic systems is increasing significantly. For example, in mobile phones, the number of passive components is 20 times that of active components. Currently, passive components mainly use surface-mount mounting (e.g., discrete capacitors). This method occupies a large amount of substrate space, and the numerous interconnect lengths and solder points on the surface greatly reduce the electrical performance and reliability of the materials and the system. To provide lighter, higher-performance, cheaper, and more reliable electronic systems, converting from surface-mount packaging systems to embedded packaging systems is the only option. Among all passive components, capacitors are the most numerous and receive particular attention.

[0003] To save space on the circuit board surface and reduce electromagnetic interference, the main trend is to embed (laminate) discrete capacitors into multilayer printed circuit boards (PCBs) in the form of planar capacitors (a planar structure with two metal electrodes on the top and bottom and an insulating medium in the middle), i.e., to build an embedded packaging system.

[0004] To obtain embedded capacitors with high application value, the dielectric material needs to have high capacitance density, high withstand voltage (low leakage current), high peel strength between the dielectric and the metal electrode, and good high temperature and high humidity reliability.

[0005] As is well known, embedded capacitors require a thin dielectric layer and a high dielectric constant to achieve high capacitance density. To obtain a high dielectric constant, a large amount of high-dielectric ceramic filler needs to be filled into the substrate. To prepare thin dielectric layers, such as 3μm or 6μm layers, ultrafine fillers are required, meaning the particle size of the high-dielectric ceramic filler is reduced to the nanometer or submicrometer level. However, using highly filled ultrafine fillers to improve the dielectric constant often leads to problems such as poor filler dispersion, microscopic defects in the dielectric layer, and reduced dielectric strength.

[0006] To address the issue of voltage withstand strength, US6693793B2 discloses a double-sided copper-clad laminate for capacitor layer formation, in which a heat-resistant organic film is added as a supporting material in the middle, thereby improving the strength, brittleness, and voltage withstand strength of the embedded capacitor material. However, due to the use of an organic film with a low dielectric constant as the interlayer, the dielectric constant of the resulting embedded capacitor material is not high, affecting the capacitance density of the capacitor. CN105415803A discloses a dielectric layer for embedded capacitor materials, comprising a flexible resin composition layer, which includes a ceramic filler coated with inorganic filler, namely silica and / or alumina. The dielectric strength of the embedded capacitor material is improved by coating the ceramic filler with inorganic filler. However, because the surface of the high-dielectric ceramic filler is coated with a low-dielectric inorganic filler, the dielectric constant of the embedded capacitor material dielectric layer is between 8.2 and 13.4, which is not high enough to achieve a good capacitance density. In addition, existing embedded capacitor materials are prone to short-circuit failure under high temperature and high humidity conditions, resulting in insufficient reliability and limiting their application scenarios.

[0007] Therefore, developing dielectric materials for embedded capacitors with high dielectric constant, high temperature and humidity reliability, and good voltage withstand performance is an urgent problem to be solved in this field. Summary of the Invention

[0008] In view of the shortcomings of the prior art, the present invention aims to provide a resin composition, resin-coated copper foil, metal-clad foil plate and its application. Through the design of specific inorganic fillers and their mutual compounding with defoamers and thermosetting resins, the resin composition for embedded capacitor materials has high dielectric constant, excellent high temperature and high humidity reliability and voltage resistance performance, which can fully meet the application requirements of high-performance embedded capacitor materials.

[0009] To achieve this objective, the present invention adopts the following technical solution:

[0010] In a first aspect, the present invention provides a resin composition for embedded materials, the resin composition comprising, by weight, the following components:

[0011] 15-30 parts of thermosetting resin

[0012] 70-85 parts of inorganic filler

[0013] Defoamer 0.1-1.5 parts;

[0014] The thermosetting resin includes epoxy resin;

[0015] The inorganic filler comprises barium titanate and / or strontium titanate; the D of the inorganic filler 20 Particle size 50-250nm, D 50 Particle size is 300-800nm, D 90Particle size is 0.9-1.8 μm, D 100 Particle size < 3 μm.

[0016] This invention has found that in order to obtain high dielectric constant performance, it is necessary to fill the resin composition with high dielectric inorganic filler. However, when the inorganic filler has a narrow particle size distribution and a relatively uniform particle size, it is impossible to achieve the most compact packing. When the filling amount is high, the reliability of the resin composition will decrease and the withstand voltage performance will deteriorate. Therefore, it is necessary to select inorganic fillers with specific particle size distribution. Based on this, the resin composition for embedded capacitors provided by this invention, by designing inorganic fillers with specific particle size morphology, can form a specific high-fill and compact packing state, and has good dispersibility and dispersion stability. This allows the resin composition to achieve an excellent balance between high dielectric constant, excellent high temperature and high humidity reliability and high withstand voltage strength performance (low leakage current), thus possessing both excellent dielectric properties and reliability.

[0017] Furthermore, this invention has discovered that during the mixing process of the resin composition, the stirring and dispersion operations, as well as the material feeding, introduce a large amount of air into the resin composition. This is especially true during filler feeding, where a layer of gas film is adsorbed on the surface of the nanofiller. This gas film enters the resin composition along with the filler, resulting in a large number of air bubbles. While large air bubbles are gradually expelled during mixing, some microbubbles remain in the composition. During coating production, these microbubbles can cause defects such as bubbles and voids in the dielectric layer, leading to withstand voltage failure (excessive leakage current). Therefore, the resin composition for embedded capacitors provided by this invention uses a specific proportion of defoamer to solve the aforementioned defects in the dielectric layer.

[0018] Therefore, this invention, through the design of inorganic fillers and their synergistic effect with defoamers and thermosetting resins in specific proportions, enables the inorganic fillers to exhibit excellent dispersibility and dispersion stability in organic resin systems, forming a high-quality dielectric layer free from microscopic defects such as voids and agglomerations. The resin composition for embedded capacitors possesses high dielectric constant, excellent high-temperature and high-humidity reliability, low leakage current, and excellent voltage withstand strength, fully meeting the requirements for high-performance embedded capacitors.

[0019] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. The purpose and beneficial effects of the present invention can be better achieved and realized through the following preferred technical solutions.

[0020] In the resin composition for embedding materials of the present invention, the thermosetting resin is in the range of 15-30 parts by weight, for example, 16 parts, 18 parts, 20 parts, 22 parts, 24 parts, 25 parts, 26 parts or 28 parts, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0021] The inorganic filler is present in a mass fraction of 70-85 parts, for example, 72, 75, 78, 80, 82, or 84 parts, as well as specific values ​​within the above ranges. For space limitations and for the sake of brevity, this invention will not exhaustively list all the specific values ​​included in the range. If the amount of inorganic filler is less than 70 parts, the dielectric constant of the resin composition will be too low, failing to provide excellent capacitance density performance; if the amount of inorganic filler is greater than 85 parts, the insulation performance of the ultra-thin dielectric layer coated with the resin composition will decrease, resulting in withstand voltage failure (excessive leakage current).

[0022] The defoamer is present in a mass fraction of 0.1-1.5 parts, for example, 0.2 parts, 0.5 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, or 1.4 parts, as well as specific values ​​within the above ranges. For space limitations and for the sake of brevity, this invention will not exhaustively list all the specific values ​​included in the range. If the amount of defoamer is too low, <0.1 parts, the defoaming effect is not significant, and a small number of microbubbles still exist in the resin composition, affecting the pressure resistance and reliability of the medium layer. If the amount of defoamer is too high, >1.5 parts, excessive defoamer is prone to aggregate in the resin composition, leading to defoamer agglomeration defects in the medium layer.

[0023] The inorganic filler D 20 The particle size is 50-250nm, for example, it can be 60nm, 80nm, 100nm, 120nm, 150nm, 180nm, 200nm, 220nm or 240nm, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0024] The inorganic filler D 50 The particle size is 300-800nm, for example, it can be 320nm, 350nm, 380nm, 400nm, 420nm, 450nm, 480nm, 500nm, 520nm, 550nm, 580nm, 600nm, 620nm, 650nm, 680nm, 700nm, 720nm, 750nm or 780nm, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0025] The inorganic filler D 90 The particle size is 0.9-1.8 μm, for example, it can be 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm or 1.7 μm, as well as specific particle values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific particle values ​​included in the range.

[0026] The inorganic filler D 100 The particle size is <3μm, for example it can be 1.9μm, 2μm, 2.1μm, 2.2μm, 2.3μm, 2.4μm, 2.5μm, 2.6μm, 2.7μm, 2.8μm or 2.9μm, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, this invention will not exhaustively list the specific values ​​included in the range.

[0027] This invention has found that, within the aforementioned defined particle size range, the inorganic filler can meet the requirements of high-fill, close packing, while exhibiting good dispersibility and dispersion stability, thus giving the resin composition good dielectric properties and reliability. If the particle size of the inorganic filler is smaller than the aforementioned range, the filler particles are prone to agglomeration in the resin composition. Even if the resin composition is uniformly dispersed, during high-temperature curing, an excessive number of filler particles with a particle size below 100 nm can easily lead to re-agglomeration, causing the dielectric layer to easily experience withstand voltage failure (excessive leakage current). If the particle size of the inorganic filler is larger than the aforementioned range, in ultra-thin dielectric layers, large-diameter fillers can also cause a significant decrease in the insulation performance of the dielectric layer under high filling conditions, resulting in withstand voltage failure (excessive leakage current).

[0028] In this invention, particle size-related data (D) 20 D 50 D 90 D 100 The particle size distribution was obtained using an MS3000 Malvern laser particle size analyzer.

[0029] Preferably, the epoxy resin includes any one or a combination of at least two of the following: bisphenol A type epoxy resin, bisphenol F type epoxy resin, phosphorus-containing epoxy resin, isocyanate modified epoxy resin, phenolic epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene-containing epoxy resin, and alicyclic epoxy resin.

[0030] Preferably, the thermosetting resin further includes any one or a combination of at least two of the following: cyanate ester resin, polyphenylene ether resin, polybutadiene resin, styrene-butadiene resin, phenolic resin, acrylate resin, polyimide resin, liquid crystal resin, bismaleimide-triazine resin, bismaleimide resin, phenolic resin, and nitrile rubber. More preferably, it includes any one or a combination of at least two of the following: cyanate ester resin, phenolic resin, and phenolic resin. Even more preferably, it includes phenolic resin and / or phenolic resin.

[0031] Preferably, the thermosetting resin includes epoxy resin, optionally phenolic resin, and optionally phenolic oxy resin.

[0032] Preferably, the number average molecular weight of the polyimide resin, liquid crystal resin, phenolic resin, and nitrile rubber resin is ≥10000.

[0033] Preferably, the number average molecular weight of the resin with a molecular weight ≥ 10000 can be 12000, 15000, 18000, 20000, 22000, 25000, 28000, 30000, 35000, 40000, 45000, 50000, 55000, 60000, 70000, 80000, 90000, 100000, 120000, 150000, 180000, 200000, 250000, 300000, 350000, 400000, 450000, or 500000.

[0034] Preferably, the phenolic resin has a mass fraction of ≤30 parts, for example, it can be 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 18, 20, 22, 25 or 28 parts, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range, and 0-10 parts is further preferred.

[0035] Preferably, the phenolic resin has a mass fraction of ≤30 parts, for example, it can be 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 18, 20, 22, 25 or 28 parts, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range, and 0-10 parts is further preferred.

[0036] As a preferred technical solution, by adding a resin with a number average molecular weight ≥10000, the viscosity of the resin composition can be optimized, thereby improving the coating production precision.

[0037] Preferably, the resin with a number average molecular weight ≥ 10000 is selected from any one or a combination of at least two of polyimide resin, liquid crystal resin, phenolic resin, and nitrile rubber.

[0038] Preferably, the inorganic filler is barium titanate and / or strontium titanate, and more preferably barium titanate or strontium titanate.

[0039] Preferably, the inorganic filler has a D 20 Particle size is 50-100nm, D 50 Particle size is 300-500nm, D 90 Particle size is 1.0-1.5 μm, D 100Particle size < 2.5 μm.

[0040] Preferably, the inorganic filler comprises surface-treated inorganic filler.

[0041] Preferably, the surface treatment agent for the surface treatment includes any one or a combination of at least two of the following: silane coupling agent, borate coupling agent, zirconate coupling agent, phosphate coupling agent, titanate treatment agent, aluminate, zirconate, and surfactant; more preferably, silane coupling agent.

[0042] Preferably, the surfactant includes any one or a combination of at least two of cationic surfactants, anionic surfactants, amphoteric surfactants, and nonionic surfactants.

[0043] Preferably, the silane coupling agent includes an aminosilane coupling agent and / or an epoxysilane coupling agent.

[0044] Preferably, based on 100 parts of the inorganic filler to be treated, the mass of the surface treatment agent is 0.1-1.5 parts, for example, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part, 1.1 parts, 1.2 parts, 1.3 parts, or 1.4 parts, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0045] Preferably, the defoamer includes any one or a combination of at least two of the following: alcohol defoamers, fatty acid defoamers, fatty acid ester defoamers, phosphate ester defoamers, mineral oil defoamers, amide defoamers, polyether defoamers, silicone defoamers, and polyether-modified silicone defoamers.

[0046] Preferably, the resin composition further includes a curing agent and / or a curing accelerator.

[0047] Preferably, the curing agent includes any one or a combination of at least two of amine curing agents, acid anhydride curing agents, and reactive ester curing agents, with amine curing agents being more preferred.

[0048] Preferably, the amine curing agent includes dicyandiamide and / or aromatic diamine, with dicyandiamide being more preferred.

[0049] Preferably, the mass fraction of the amine curing agent is ≤5 parts, for example, it can be 0, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2, 2.5, 3, 3.5, 4 or 4.5 parts, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range, and 0-1 parts is further preferred.

[0050] Preferably, the curing accelerator includes any one or a combination of at least two of imidazole compounds, piperidine compounds, tertiary amines, tertiary phosphorus, organometallic complexes, and quaternary ammonium salts, with imidazole compounds being more preferred.

[0051] Preferably, the imidazole compound includes any one or a combination of at least two of 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 2-isopropylimidazole, 2-undecylimidazole, 2-dodecylimidazole, 2-heptadecanylimidazole, 1-benzyl-2-methylimidazole, 2-phenyl-4-methylimidazole, and 1-cyanoethyl-2-methylimidazole.

[0052] Preferably, the curing accelerator has a mass fraction of ≤1 part, for example, it can be 0.01 part, 0.05 part, 0.08 part, 0.1 part, 0.15 part, 0.2 part, 0.25 part, 0.3 part, 0.35 part, 0.4 part, 0.45 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part or 0.9 part, and specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range, and 0.01-0.5 parts is further preferred.

[0053] Preferably, the resin composition for embedding materials further includes other additives that those skilled in the art are motivated to add, such as flame retardants and / or viscosity modifiers.

[0054] Solvents may also be added to the above-mentioned resin composition. The amount of solvent added is selected by those skilled in the art based on experience and process requirements, so that the resin composition reaches a suitable viscosity for use, facilitating impregnation, coating, etc. During subsequent drying, semi-curing, or complete curing stages, the solvent in the resin composition will partially or completely evaporate.

[0055] The solvent used in this invention is not particularly limited, and generally can be ketones such as acetone, butanone, isobutanone, and cyclohexanone; aromatic hydrocarbons such as toluene and xylene; esters such as ethyl acetate and butyl acetate; alcohols such as methanol, ethanol, or butanol; alcohols such as ethyl cellosolve, butyl cellosolve, ethylene glycol monomethyl ether, carbitol, or butyl carbitol; and nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, or N-methyl-2-pyrrolidone. The solvent can be used alone or in mixtures of two or more. Preferably, ketones such as acetone, butanone, and cyclohexanone, and aromatic hydrocarbons such as toluene and xylene are used.

[0056] The resin composition for embedded materials provided by the present invention is prepared by the following method, the preparation method comprising: mixing and dispersing the components in the resin composition for embedded materials evenly to obtain the resin composition for embedded materials.

[0057] In a second aspect, the present invention provides a resin-coated copper foil comprising a copper foil layer and a resin layer, wherein the material of the resin layer comprises a resin composition for embedded materials as described in the first aspect.

[0058] Preferably, the resin-coated copper foil is obtained by coating the embedded material with a resin composition onto a copper foil and then drying and / or semi-curing it.

[0059] Preferably, the drying temperature is 80-120℃, for example, it can be 85℃, 90℃, 95℃, 100℃, 105℃, 110℃ or 115℃, and specific values ​​between the above points. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0060] Preferably, the drying time is 1-10 min, for example, it can be 2 min, 3 min, 4 min, 5 min, 6 min, 7 min, 8 min or 9 min, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range.

[0061] Preferably, the thickness of the resin layer is ≤15μm, for example, it can be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm or 14μm, as well as specific values ​​between the above values. Due to space limitations and for the sake of brevity, the present invention will not exhaustively list the specific values ​​included in the range, and 1-15μm is further preferred.

[0062] Thirdly, the present invention provides a metal-clad foil plate, the metal-clad foil plate comprising at least one resin-coated copper foil as described in the second aspect.

[0063] Preferably, the metal foil plate is an embedded copper-clad laminate.

[0064] Fourthly, the present invention provides a printed circuit board, the printed circuit board comprising at least one of the resin-coated copper foil as described in the second aspect and the metal-clad foil as described in the third aspect.

[0065] Compared with the prior art, the present invention has the following beneficial effects:

[0066] (1) The resin composition for embedded capacitors provided by this invention, by designing inorganic fillers with specific particle size morphology, can form a highly packed and densely packed state. Furthermore, by compounding and synergistically combining the inorganic filler with defoamer and thermosetting resin, the inorganic filler exhibits excellent dispersibility and dispersion stability in the organic resin system, enabling the formation of a high-quality dielectric layer free of voids, agglomerates, and microscopic defects. The resin composition for embedded capacitors possesses a high dielectric constant, excellent high-temperature and high-humidity resistance, low leakage current, and excellent voltage withstand strength, fully meeting the requirements for high-performance embedded capacitors.

[0067] (2) Through the component design and optimization of the resin composition for embedded capacitor materials, the present invention enables the prepared embedded capacitor dielectric material to have a dielectric constant of ≥17.7 at 1kHz, which can be 17.7-26.7. After testing for 168h at 85℃, 85%RH and 2.8V, no short circuit phenomenon will occur, and the leakage current is 0-2.6μA. It has high dielectric constant, low leakage current, excellent high temperature and high humidity reliability and voltage withstand strength performance, and is suitable for embedded capacitors with high application value. Detailed Implementation

[0068] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0069] In the following specific embodiments of the present invention, the specific information of the inorganic packing is shown in Table 1:

[0070] Table 1

[0071] Packing A Barium titanate 53.1 325 1055 2060 Packing B Barium titanate 98.5 475 1450 2420 Packing C Strontium titanate 91.3 426 1263 2250 Packing D Strontium titanate 121.0 525 1635 2570 Packing E Barium titanate 239.0 796 1760 2890 Packing F Barium titanate 32.5 145 675 1160 Packing G Barium titanate 675.0 786 920 975 Packing H Strontium titanate 469.0 1375 2260 5390 Packing I Barium titanate 90 319 435 508

[0072] Example 1

[0073] A resin composition for embedding materials comprises, by weight, the following components: 29.10 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.56 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.24 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 0.10 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 70 parts filler A surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler A to KBM403 is 100:1.5).

[0074] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0075] (1) Mix each component of the resin composition with methyl ethyl ketone according to the aforementioned formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto a copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain a resin-coated copper foil RCC with a resin layer thickness of 4 μm.

[0076] (2) Take the two RCCs obtained in step (1) and laminate them together with their adhesive surfaces. Then, laminate and cure them at 190℃ and 2MPa for 90 minutes to obtain the cured product, which is the copper clad laminate. Measure the dielectric constant, constant temperature and humidity reliability, leakage current and substrate cross-sectional quality.

[0077] Example 2

[0078] A resin composition for embedding materials comprises, by weight, the following components: 21.58 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 76.32 parts filler A surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler A to KBM403 is 100:1).

[0079] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0080] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0081] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0082] Example 3

[0083] A resin composition for embedding materials comprises, by weight, the following components: 21.58 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 76.32 parts filler B surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler B to KBM403 is 100:1).

[0084] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0085] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0086] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0087] Example 4

[0088] A resin composition for embedding materials comprises, by weight, the following components: 21.58 parts bisphenol F epoxy resin (BFE170, Changchun Artificial Resin Factory), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 76.32 parts filler B surface-treated with epoxy silane coupling agent (KBM403 of Shin-Etsu Chemical) (the mass ratio of filler B to KBM403 is 100:1).

[0089] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0090] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0091] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0092] Example 5

[0093] A resin composition for embedding materials comprises, by weight, the following components: 21.58 parts of phosphorus-containing epoxy resin (XZ92530, OLIN), 0.42 parts of curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts of curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts of defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 76.32 parts of filler B surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler B to KBM403 is 100:1).

[0094] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0095] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0096] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0097] Example 6

[0098] A resin composition for embedding materials comprises, by weight, the following components: 21.80 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 0.51 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), 77.09 parts epoxy silane coupling agent (Shin-Etsu Chemical's KBM403), and surface-treated filler C (the mass ratio of filler C to KBM403 is 100:0.1).

[0099] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0100] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0101] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0102] Example 7

[0103] A resin composition for embedding materials comprises, by weight, the following components: 21.80 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 0.51 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), 77.09 parts epoxy silane coupling agent (Shin-Etsu Chemical's KBM403), and surface-treated filler D (the mass ratio of filler D to KBM403 is 100:0.1).

[0104] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0105] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0106] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0107] Example 8

[0108] A resin composition for embedding materials comprises, by weight, the following components: 21.80 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 0.51 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), 77.09 parts epoxy silane coupling agent (Shin-Etsu Chemical's KBM403), and surface-treated filler E (the mass ratio of filler E to KBM403 is 100:0.5).

[0109] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0110] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0111] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0112] Example 9

[0113] A resin composition for embedding materials comprises, by weight, the following components: 15 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.29 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.12 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 0.10 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 84.49 parts filler B surface-treated with aminosilane coupling agent (Shin-Etsu Chemical's KBM903) (the mass ratio of filler B to KBM903 is 100:1).

[0114] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0115] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 15μm.

[0116] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0117] Example 10

[0118] A resin composition for embedding materials comprises, by weight, the following components: 15.47 parts of bisphenol A epoxy resin (EPR627MEK80, HEXION), 7.07 parts of phenolic resin (KPH-L2005, KOLON), 0.03 parts of curing accelerator (2-methylimidazole, 2-MI, BASF), 0.10 parts of defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 77.33 parts of filler B surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler B to KBM403 is 100:1).

[0119] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0120] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0121] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0122] Example 11

[0123] A resin composition for embedding materials comprises, by weight, the following components: 15.23 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 6.51 parts phenolic resin (YP-50S, Nippon Steel), 0.30 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.10 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.01 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 76.85 parts filler B surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler B to KBM403 is 100:1).

[0124] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the aforementioned resin composition for embedded material are prepared as follows:

[0125] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0126] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0127] Comparative Example 1

[0128] A resin composition comprising, by weight, the following components: 21.58 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 76.32 parts filler F surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler F to KBM403 is 100:1).

[0129] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the resin composition are prepared by the following method:

[0130] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0131] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0132] Comparative Example 2

[0133] A resin composition comprising, by weight, the following components: 21.58 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (silicone defoamer, BYK-A530, BYK Chemical), and 76.32 parts filler G surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler G to KBM403 is 100:1).

[0134] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the resin composition are prepared by the following method:

[0135] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0136] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0137] Comparative Example 3

[0138] A resin composition comprising, by weight, the following components: 21.58 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (silicone defoamer, BYK-A530, BYK Chemical), and 76.32 parts filler H surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler H to KBM403 is 100:1).

[0139] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the resin composition are prepared by the following method:

[0140] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0141] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0142] Comparative Example 4

[0143] A resin composition comprising, by weight, the following components: 34.01 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.69 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.30 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 63.50 parts filler B surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler B to KBM403 is 100:1).

[0144] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the resin composition are prepared by the following method:

[0145] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0146] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0147] Comparative Example 5

[0148] A resin composition comprising, by weight, the following components: 10.15 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.17 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.08 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 88.10 parts filler B surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler B to KBM403 is 100:1).

[0149] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the resin composition are prepared by the following method:

[0150] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0151] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0152] Comparative Example 6

[0153] A resin composition comprising, by weight, the following components: 21.47 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 2 parts defoamer (organosilicone defoamer, BYK-A530, BYK Chemical), and 75.93 parts filler B surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler B to KBM403 is 100:1).

[0154] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the resin composition are prepared by the following method:

[0155] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0156] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0157] Comparative Example 7

[0158] A resin composition comprising, by weight, the following components: 21.90 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.43 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 0.03 parts defoamer (silicone defoamer, BYK-A530, BYK Chemical), and 77.46 parts filler B surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler B to KBM403 is 100:1).

[0159] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the resin composition are prepared by the following method:

[0160] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0161] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0162] Comparative Example 8

[0163] A resin composition comprising, by weight, the following components: 21.58 parts bisphenol A epoxy resin (EPR627MEK80, HEXION), 0.42 parts curing agent (dicyandiamide, DICY, Ningxia Darong), 0.18 parts curing accelerator (2-methylimidazole, 2-MI, BASF), 1.50 parts defoamer (silicone defoamer, BYK-A530, BYK Chemical), and 76.32 parts filler I surface-treated with epoxy silane coupling agent (Shin-Etsu Chemical's KBM403) (the mass ratio of filler I to KBM403 is 100:1).

[0164] A resin-coated copper foil (RCC) and a copper-clad laminate comprising the resin composition are prepared by the following method:

[0165] (1) Mix each component of the resin composition with methyl ethyl ketone according to the above formula to prepare a resin solution with a solid content of 65%; coat the resin solution onto copper foil, and then bake it in an oven at 155°C for 5 minutes to obtain resin-coated copper foil RCC with a resin layer thickness of 6μm.

[0166] (2) Take the RCC obtained in step (1) and stack them with their adhesive surfaces together. Then, laminate and cure them in the same way as in Example 1 to obtain a copper-clad laminate.

[0167] The copper-clad laminates provided in Examples 1-11 and Comparative Examples 1-8 were subjected to performance tests, and the specific methods are as follows:

[0168] (1) Dielectric constant Dk: The low-frequency bridge method was used for testing. The test conditions were A-state, and the test equipment was Agilent E4980A precision digital bridge with a frequency of 1kHz.

[0169] (2) Constant temperature and humidity reliability test: One side of the copper-clad laminate to be tested is left unetched, while the other side is etched with a square copper sample of size 20mm×20mm. The sample is pretreated at 120℃ and 85%RH for 1h, and then tested at 2.8V for 168h at 85℃ and 85%RH. If the sample is short-circuited after the test, it indicates that the sample test has failed.

[0170] (3) Leakage current: One side of the copper-clad laminate to be tested is left unetched, while the other side is etched with a circular copper sample with a diameter of 12.7mm. A withstand voltage tester is used to increase the voltage to DC100 V at a rate of 10V / s and hold the voltage for 60s. The leakage current data is then observed. 18 data points are tested for each sample. If the leakage current data is ≤10μA, it meets the requirements. If it exceeds 10μA, the sample is considered to have exceeded the leakage current standard.

[0171] (4) Substrate cross-sectional quality: Prepare a cross-section of the copper clad laminate to be tested and observe the cross-sectional quality using an electron microscope (S-3400N, Hitachi). If there are no defects such as filler agglomeration, resin aggregation, or voids on the cross-section, the interface quality is excellent; if there are defects such as filler agglomeration, organic matter aggregation, or voids on the cross-section, it indicates that the quality of the copper clad laminate dielectric layer is poor.

[0172] The test results are shown in Table 2:

[0173] Table 2

[0174]

[0175]

[0176] According to the performance data in Table 2, the resin composition provided by the present invention, by designing inorganic fillers with specific particle size morphology, can form a highly packed and densely packed state. Combined with defoamers and thermosetting resins, the inorganic fillers exhibit excellent dispersibility and dispersion stability in the organic resin system. This results in the embedded capacitor materials prepared in Examples 1-11 having a dielectric constant of 17.7-26.7 at 1 kHz, and exhibiting no short circuit after 168 hours of testing at 85℃, 85%RH, and 2.8V. The leakage current is 0-2.6 μA. These materials possess high dielectric constant, low leakage current, excellent high-temperature and high-humidity reliability, and high voltage withstand strength, meeting the requirements for high-performance embedded capacitor materials.

[0177] As can be seen from Examples 1-11 and Comparative Examples 1-3 and Comparative Example 8, the inorganic packing material of the present invention has D 20 Particle size in the range of 50-250 nm, D 50 In the 300-800nm ​​range, D 90 In the range of 0.9-1.8 μm, D 100 When the particle size is <3μm, it can meet the requirements of high-density packing. Simultaneously, the inorganic filler has good dispersibility and dispersion stability, giving the resin composition containing it good dielectric properties and reliability. In Comparative Examples 1-3, when the inorganic filler has a narrow particle size distribution and a relatively uniform particle size, it cannot achieve the densest packing. A higher filler content will cause a decrease in the reliability of the resin composition, a deterioration in withstand voltage performance, and problems such as constant temperature and humidity reliability failure and excessive leakage current. When the inorganic filler particle size is smaller than the above-mentioned particle size range, filler agglomeration, constant temperature and humidity reliability failure, and excessive leakage current are prone to occur. When the inorganic filler particle size is larger than the above-mentioned particle size range, in ultra-thin dielectric layers, large-diameter fillers will also lead to a significant decrease in the insulation performance of the dielectric layer under high filler content, resulting in constant temperature and humidity reliability failure and excessive leakage current. In Comparative Example 8, although the inorganic filler D... 20 Particle size in the range of 50-250 nm, D 50 In the 300-800nm ​​range, D 100 <3μm, but because the compound uses a large number of small-diameter fillers, D 90 <0.9μm, leading to filler agglomeration and voids in the media layer. Furthermore, a comparison of Examples 1-6 and Examples 7-8 shows that when the particle size D of the inorganic filler is <0.9μm, ... 20 In the 50-100nm range, D 50 In the 300-500nm range, D 90 In the range of 1.0-1.5μm, D 100 When the diameter is less than 2.5μm, lower leakage current and more outstanding withstand voltage performance can be obtained.

[0178] Comparative Examples 1-11 and 4-5 show that when the amount of inorganic filler in the resin composition is less than 70 parts, the dielectric constant of the resin composition is low and cannot provide excellent capacitance performance; when the amount of inorganic filler is more than 85 parts, it will lead to a decrease in the insulation performance of the ultra-thin dielectric layer formed by the resin composition, defects such as filler agglomeration, and problems such as constant temperature and humidity reliability failure and excessive leakage current.

[0179] As can be seen from Examples 1-11 and Comparative Examples 6-7, when the content of defoamer in the resin composition is less than 0.1 parts, the microbubbles in the resin composition are not sufficiently defoamed, which easily leads to voids in the dielectric layer, resulting in reliability failure of constant temperature and humidity and excessive leakage current. When the content of defoamer in the resin composition is greater than 1.5 parts, defoamer is prone to aggregation, leading to abnormal dielectric layer quality, void defects, and causing reliability failure of constant temperature and humidity and excessive leakage current.

[0180] The applicant declares that the above embodiments illustrate the resin composition, resin-coated copper foil, metal-clad foil plate, and applications of the present invention. However, the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions of the raw materials of the products of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A resin composition for embedding materials, characterized in that, The resin composition for the embedding material comprises the following components in parts by weight: 15-30 parts of thermosetting resin 70-85 parts of inorganic filler 0.1-1.5 parts of silicone defoamer; The thermosetting resin includes epoxy resin; The inorganic filler comprises barium titanate and / or strontium titanate; the D of the inorganic filler 20 Particle size 50-250 nm, D 50 Particle size is 300-800 nm, D 90 Particle size is 0.9-1.8 μm, D 100 Particle size < 3 μm.

2. The resin composition for embedded materials according to claim 1, characterized in that, The thermosetting resin further includes any one or a combination of at least two of the following: cyanate ester resin, polyphenylene ether resin, polybutadiene resin, styrene-butadiene resin, phenolic resin, acrylate resin, polyimide resin, liquid crystal resin, bismaleimide-triazine resin, bismaleimide resin, phenolic resin, and nitrile rubber.

3. The resin composition for embedded materials according to claim 1, characterized in that, The inorganic filler D 20 Particle size 50-100 nm, D 50 Particle size is 300-500 nm, D 90 Particle size is 1.0-1.5 μm, D 100 Particle size < 2.5 μm.

4. The resin composition for embedded materials according to claim 1, characterized in that, The inorganic filler includes surface-treated inorganic fillers.

5. The resin composition for embedded materials according to claim 4, characterized in that, The surface treatment agent for the surface treatment includes any one or a combination of at least two of the following: silane coupling agent, borate coupling agent, zirconate coupling agent, phosphate coupling agent, titanate treatment agent, aluminate, zirconate, and surfactant.

6. The resin composition for embedded materials according to claim 4, characterized in that, The surface treatment agent used in the surface treatment is a silane coupling agent.

7. The resin composition for embedded materials according to claim 5 or 6, characterized in that, The silane coupling agent includes aminosilane coupling agents and / or epoxysilane coupling agents.

8. The resin composition for embedded materials according to claim 5, characterized in that, The surface treatment agent is 0.1-1.5 parts by mass, based on 100 parts of the inorganic filler to be treated.

9. The resin composition for embedded materials according to claim 1, characterized in that, The resin composition also includes a curing agent and / or a curing accelerator.

10. The resin composition for embedded materials according to claim 9, characterized in that, The curing agent includes any one or a combination of at least two of the following: amine curing agents, acid anhydride curing agents, and reactive ester curing agents.

11. The resin composition for embedded materials according to claim 9, characterized in that, The curing agent is an amine-based curing agent.

12. The resin composition for embedding materials according to claim 10 or 11, characterized in that, The amine curing agent includes dicyandiamide and / or aromatic diamine.

13. The resin composition for embedding materials according to claim 10 or 11, characterized in that, The amine curing agent is dicyandiamide.

14. The resin composition for embedded materials according to claim 9, characterized in that, The curing accelerator includes any one or a combination of at least two of the following: imidazole compounds, piperidine compounds, tertiary amines, tertiary phosphorus compounds, organometallic complexes, and quaternary ammonium salts.

15. A resin-coated copper foil, characterized in that, The resin-coated copper foil comprises a copper foil layer and a resin layer, wherein the material of the resin layer comprises the resin composition for embedded materials as described in any one of claims 1-14.

16. The resin-coated copper foil according to claim 15, characterized in that, The resin-coated copper foil is obtained by coating the embedded material with a resin composition onto a copper foil, followed by drying and / or semi-curing.

17. The resin-coated copper foil according to claim 15, characterized in that, The thickness of the resin layer is ≤15 μm.

18. The resin-coated copper foil according to claim 15, characterized in that, The thickness of the resin layer is 1-15 μm.

19. A metal-clad foil plate, characterized in that, The metal-clad foil includes at least one resin-coated copper foil as described in any one of claims 15-18.

20. The metal-clad foil plate according to claim 19, characterized in that, The metal-clad foil is an embedded copper-clad laminate.

21. A printed circuit board, characterized in that, The printed circuit board includes at least one of the resin-coated copper foil as described in any one of claims 15-18 and the metal-clad foil as described in claim 19 or 20.

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