Polyphenylene ether resin composition and use thereof

Abstract

The application discloses a polyphenyl ether resin composition and application thereof, and the polyphenyl ether resin composition comprises 100 parts by weight of polyphenyl ether resin, 5-80 parts by weight of a crosslinking agent and 1-60 parts by weight of a first flame retardant; the first flame retardant is a phosphorus-containing flame retardant containing a styrene group, and the structure is shown in structural formula (1); in the structural formula (1), X is hydrogen or any one of C1-C5 alkyl, and n is an integer of 1-10. Compared with the prior art, the polyphenyl ether resin composition of the application adds the phosphorus-containing flame retardant containing the styrene group, so that the compatibility of each component in the polyphenyl ether resin composition is good, the large DOPO group can make the polyphenyl ether resin system have excellent flame retardancy, the dielectric constant and dielectric loss can be further reduced, the peeling strength can be improved, and the water absorption rate can be reduced.

Description

Technical Field

[0001] This invention belongs to the field of electronic materials technology, and relates to a polyphenylene ether resin composition and its application in prepregs, laminates, insulating boards, insulating films, circuit boards and electronic devices. Background Technology

[0002] In recent years, with the development of the electronic information industry, the speed and volume of information processing have increased significantly. Terminals and base stations, represented by 5G communication, require faster signal transmission speeds and lower signal loss, thus placing higher demands on the overall performance of laminates.

[0003] The presence of benzene rings in polyphenylene ether (PPE) increases the rotational barriers within the molecular chain segments, resulting in a rigid macromolecular chain. Because PPE resin molecules do not contain polar groups, they possess excellent electrical properties, with low dielectric constant and low dielectric loss. Furthermore, due to the relatively regular and symmetrical structure of PPE resin, it exhibits a high glass transition temperature. Therefore, PPE resin is widely used in circuit board materials; however, its poor solvent resistance and compatibility significantly limit its application in high-frequency circuit printed circuit boards. Summary of the Invention

[0004] This application provides a polyphenylene ether resin composition and its application in prepregs, laminates, insulating boards, insulating films, circuit boards, and electronic devices, to solve the problems of poor solvent resistance and poor compatibility of polyphenylene ether resin.

[0005] To achieve the above-mentioned objective, one embodiment of the present invention provides a polyphenylene ether resin composition, comprising, by weight:

[0006] 100 parts by weight of polyphenylene ether resin;

[0007] 5-80 parts by weight of crosslinking agent;

[0008] 1-60 parts by weight of the first flame retardant;

[0009] The first flame retardant is a styrene-based phosphorus-containing flame retardant, and its structure is as follows:

[0010] X is hydrogen or any C1-C5 alkyl group, and n is an integer from 1 to 20.

[0011] As a further improvement to one embodiment of the present invention, n>2 in structural formula (1).

[0012] As a further improvement of one embodiment of the present invention, the side chain or end of the polyphenylene ether resin contains styrene groups.

[0013] As a further improvement to one embodiment of the present invention, the polyphenylene ether resin has the following structural formula:

[0014] R1, R2, R3, R4, R5, R6, R7, and R8 are each independently selected from hydrogen or any C1-C5 alkyl group, and Y is a non-linking bond, -O-, methylene, ethylene, -S-,

[0015] As a further improvement of one embodiment of the present invention, the crosslinking agent is selected from at least one of triallyl isocyanate monomer (i.e., TAIC), triallyl isocyanate prepolymer, butadiene monomer, styrene monomer, pentadiene monomer, dicyclopentadiene dimethacrylate monomer (i.e., DCP), norbornene monomer, and cyclopentadiene monomer.

[0016] As a further improvement of one embodiment of the present invention, the crosslinking agent is triallyl isocyanurate monomer (i.e., TAIC), dicyclopentadiene dimethacrylate monomer (i.e., DCP), or a combination of the two.

[0017] The structural formula of the triallyl isocyanurate monomer (TAIC) is as follows:

[0018]

[0019] The structural formula of dicyclopentadiene dimethacrylate monomer (DCP) is as follows:

[0020]

[0021] As a further improvement of one embodiment of the present invention, the polyphenylene ether resin composition further includes a second flame retardant, the second flame retardant being selected from inorganic phosphorus, condensed phosphate ester compounds, phosphonic acid compounds, phosphonophosphonic acid compounds, phosphine oxide compounds, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ), 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, (m is an integer from 1 to 5) At least one of tris(2,6-dimethylphenyl)phosphine and phosphazene.

[0022] As a further improvement of one embodiment of the present invention, the polyphenylene ether resin composition further includes a second flame retardant, wherein the second flame retardant is selected from at least one of brominated flame retardants, nitrogen-based flame retardants, organosilicon flame retardants, organometallic flame retardants, and inorganic flame retardants.

[0023] As a further improvement of one embodiment of the present invention, the weight ratio of the first flame retardant to the second flame retardant is (20-99):(1-80).

[0024] As a further improvement of one embodiment of the present invention, the polyphenylene ether resin composition further includes 0.1 to 5 parts by weight of an initiator.

[0025] As a further improvement of one embodiment of the present invention, the initiator is at least one selected from benzoyl peroxide, dicumyl peroxide, tert-butane peroxide, dibutane peroxide, and butyl peroxyisopropyl monocarbonate.

[0026] As a further improvement of one embodiment of the present invention, the polyphenylene ether resin composition further includes 30 to 200 parts by weight of inorganic filler.

[0027] As a further improvement of one embodiment of the present invention, the inorganic filler is selected from at least one of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, alumina, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder.

[0028] As a further improvement of one embodiment of the present invention, the filler is pre-treated with a silane coupling agent, wherein the silane coupling agent is at least one of an aminosilane coupling agent, a carbon-carbon double bond silane coupling agent, or an epoxysilane coupling agent.

[0029] This invention also provides the application of the above-mentioned polyphenylene ether resin composition in prepregs, laminates, insulating boards, insulating films, circuit boards, and electronic devices, as detailed below:

[0030] The present invention also provides a semi-cured sheet comprising a reinforcing material and the aforementioned polyphenylene ether resin composition; wherein the polyphenylene ether resin composition is coated on the reinforcing material.

[0031] The method for preparing the prepreg is as follows: the polyphenylene ether resin composition is dissolved in a solvent to prepare an adhesive solution, and then the reinforcing material is immersed in the adhesive solution. The immersed reinforcing material is then taken out and baked at 100-180°C for 1-15 minutes. After drying, the prepreg is obtained.

[0032] The reinforcing material is selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics, preferably glass fiber cloth, and more preferably E glass fiber cloth, S glass fiber cloth, T glass fiber cloth, or Q glass fiber cloth. The glass fiber cloth is preferably an open-fiber cloth or a flat cloth.

[0033] Furthermore, when glass fiber cloth is used as the reinforcing material, it is pre-treated with a coupling agent to improve the interfacial bonding between the polyphenylene ether resin composition and the glass fiber cloth. The coupling agent is preferably an epoxy silane coupling agent or an amino silane coupling agent to give the reinforcing material good water resistance and heat resistance.

[0034] The present invention also provides a laminate comprising a prepreg sheet and a metal foil disposed on at least one surface of the prepreg sheet; or comprising a composite sheet formed by stacking multiple prepreg sheets together and a metal foil disposed on at least one surface of the composite sheet.

[0035] The method for preparing the laminate is as follows: A metal foil is coated onto one or both surfaces of a prepreg, or at least two prepregs are stacked to form a composite sheet, and a metal foil is coated onto one or both surfaces of the composite sheet. The laminate is then hot-pressed to obtain a metal foil laminate. The hot-pressing conditions are: pressure 0.2–2 MPa, temperature 150–250°C, and pressing time 2–4 hours.

[0036] One embodiment of the present invention also provides an insulating board, comprising at least one of the aforementioned prepreg sheets.

[0037] An embodiment of the present invention also provides an insulating film, comprising a carrier film and the aforementioned polyphenylene ether resin composition coated thereon, wherein the heat resistance of the insulating film is significantly improved.

[0038] The insulating film is prepared by dissolving the aforementioned polyphenylene ether resin composition in a solvent to form an adhesive solution, coating the adhesive solution onto a carrier film, and then heating and drying the carrier film coated with the adhesive solution to obtain the insulating film.

[0039] The solvent is selected from at least one of acetone, butanone, toluene, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0040] The carrier film is selected from at least one of PET film, PP film, PE film, and PVC film.

[0041] The present invention also provides a circuit board comprising at least one of the aforementioned prepreg and laminate. By adopting this technical solution, the heat resistance of the circuit board is greatly improved.

[0042] The present invention also provides an electronic device including the aforementioned circuit board. Because the heat resistance of the circuit board is greatly improved, the safety of the electronic device is significantly enhanced.

[0043] Due to the application of the above technical solution, the present invention has the following beneficial effects compared with the prior art: by adding a phosphorus-containing flame retardant with styrene group to the polyphenylene ether resin composition, not only is the compatibility of each component in the polyphenylene ether resin composition better, but the large DOPO group can make the polyphenylene ether resin system have excellent flame retardancy, and can further reduce the dielectric constant and dielectric loss, improve the peel strength, and reduce the water absorption rate. Detailed Implementation

[0044] The technical solution of the present invention will be further described below with reference to specific embodiments. The following embodiments are only descriptive and not limiting, and cannot be used to limit the scope of protection of this application.

[0045] One embodiment of the present invention provides a polyphenylene ether resin composition and prepreg, laminate, insulating board, insulating film, circuit board and electronic device made using the resin composition, that is, the application of the resin composition in prepreg, laminate, insulating board, insulating film, circuit board and electronic device.

[0046] First, the present invention provides a polyphenylene ether resin composition, comprising, by weight:

[0047] 100 parts by weight of polyphenylene ether resin;

[0048] 5-80 parts by weight of crosslinking agent;

[0049] 1-60 parts by weight of the first flame retardant;

[0050] The first flame retardant is a styrene-based phosphorus-containing flame retardant, and its structure is as follows:

[0051] X is hydrogen or any C1-C5 alkyl group, and n is an integer from 1 to 20.

[0052] By adding a styrene-based phosphorus-containing flame retardant to the polyphenylene ether resin composition, not only is the compatibility of the components in the polyphenylene ether resin composition better, but the large DOPO groups can also give the polyphenylene ether resin system excellent flame retardancy, further reduce the dielectric constant and dielectric loss, improve peel strength, and reduce water absorption.

[0053] Preferably, in structural formula (1), n>2, so that the styrene segment and DOPO form a copolymer, which can further improve the compatibility between the first flame retardant and the polyphenylene ether resin, and can also further effectively reduce the dielectric constant and dielectric loss, and obtain high peel strength. The first flame retardant is preferably PSMS-11 with a three-light coating.

[0054] Preferably, the side chains or ends of the polyphenylene ether resin contain styrene groups.

[0055] Since both polyphenylene ether resin and the first flame retardant contain thermoplastic groups, they have good compatibility. When both the first flame retardant and the polyphenylene ether resin contain styrene groups, the compatibility and processability between the first flame retardant and the polyphenylene ether resin can be further improved, so that the polyphenylene ether resin system can obtain better comprehensive performance.

[0056] Preferably, the polyphenylene ether resin has the following structural formula:

[0057] R1, R2, R3, R4, R5, R6, R7, and R8 are each independently selected from hydrogen or any C1-C5 alkyl group, and Y is a non-linking bond, -O-, methylene, ethylene, -S-,

[0058] Specifically, the polyphenylene ether resin can be SA90 or SA9000 manufactured by Sabiq, or OPE-2St manufactured by Mitsubishi.

[0059] Preferably, the crosslinking agent is selected from at least one of triallyl isocyanate monomer (i.e., TAIC), triallyl isocyanate prepolymer, butadiene monomer, styrene monomer, pentadiene monomer, dicyclopentadiene dimethacrylate monomer (i.e., DCP), norbornene monomer, and cyclopentadiene monomer.

[0060] More preferably, the crosslinking agent is triallyl isocyanurate monomer (i.e., TAIC), dicyclopentadiene dimethacrylate monomer (i.e., DCP), or a combination of the two.

[0061] The structural formula of the triallyl isocyanurate monomer (TAIC) is as follows:

[0062]

[0063] The structural formula of dicyclopentadiene dimethacrylate monomer (DCP) is as follows:

[0064]

[0065] Specifically, the triallyl isocyanurate monomer (TAIC) can be TAIC manufactured by Mitsubishi Chemical, TAIC manufactured by Evonik, or TAIC manufactured by Nippon Chemical; the dicyclopentadiene dimethacrylate monomer (DCP) can be A-DCP manufactured by Shin-Nakamura Chemical or DCP-A manufactured by Kyoeisha Chemical.

[0066] Furthermore, the polyphenylene ether resin composition also includes a second flame retardant.

[0067] Preferably, the second flame retardant is selected from inorganic phosphorus, condensed phosphate compounds, phosphonic acid compounds, phosphonophosphonic acid compounds, phosphine oxide compounds, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ), 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, (m is an integer from 1 to 5) At least one of tris(2,6-dimethylphenyl)phosphine and phosphazene.

[0068] In addition, the second flame retardant may also be selected from at least one of bromine-based flame retardants, nitrogen-based flame retardants, organosilicon flame retardants, organometallic flame retardants, and inorganic flame retardants.

[0069] Preferably, the weight ratio of the first flame retardant to the second flame retardant is (20-99):(1-80).

[0070] Furthermore, the polyphenylene ether resin composition further includes 0.1 to 5 parts by weight of an initiator.

[0071] Preferably, the initiator is at least one selected from benzoyl peroxide, dicumyl peroxide, tert-butane peroxide, dibutane peroxide, and butyl peroxyisopropyl monocarbonate.

[0072] Furthermore, the polyphenylene ether resin composition further includes 30 to 200 parts by weight of inorganic filler.

[0073] The inorganic filler is preferably selected from at least one of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, alumina, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder.

[0074] The inorganic filler is more preferably silica, especially spherical silica.

[0075] More preferably, the filler is pre-treated with a silane coupling agent, wherein the silane coupling agent is at least one of an aminosilane coupling agent, a carbon-carbon double bond silane coupling agent, or an epoxysilane coupling agent.

[0076] The silane coupling agent may be selected from one or more of the following: KBM-573, KBM-1003, KBM-1403 manufactured by Shin-Etsu Chemical, or Z-6883 manufactured by Dow Corning.

[0077] This invention also provides the application of the above-mentioned polyphenylene ether resin composition in prepregs, laminates, insulating boards, insulating films, circuit boards, and electronic devices, as detailed below:

[0078] The present invention also provides a semi-cured sheet comprising a reinforcing material and the aforementioned polyphenylene ether resin composition, wherein the polyphenylene ether resin composition is coated on the reinforcing material.

[0079] The method for preparing the prepreg is as follows: the aforementioned polyphenylene ether resin composition is dissolved in a solvent to form an adhesive solution, and then the reinforcing material is immersed in the adhesive solution. The immersed reinforcing material is then taken out and baked at a temperature of 100-180°C for 1-15 minutes. After drying, the prepreg is obtained.

[0080] The solvent may be selected from at least one of acetone, butanone, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0081] The reinforcing material can be selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics, preferably glass fiber cloth, and more preferably E glass fiber cloth, S glass fiber cloth, T glass fiber cloth, or Q glass fiber cloth. The glass fiber cloth is preferably an open-fiber cloth or a flat cloth.

[0082] Furthermore, when glass fiber cloth is used as the reinforcing material, it is pre-treated with a coupling agent to improve the interfacial bonding between the polyphenylene ether resin composition and the glass fiber cloth. The coupling agent is preferably an epoxy silane coupling agent or an amino silane coupling agent to give the reinforcing material good water resistance and heat resistance.

[0083] The present invention also provides a laminate comprising a prepreg sheet and a metal foil disposed on at least one surface of the prepreg sheet; or comprising a composite sheet formed by stacking multiple prepreg sheets and a metal foil disposed on at least one surface of the composite sheet.

[0084] The laminate is prepared by: covering one or both surfaces of a prepreg sheet with metal foil, or stacking at least two prepreg sheets to form a composite sheet, covering one or both surfaces of the composite sheet with metal foil, and hot-pressing to obtain a metal foil laminate. The hot-pressing conditions are: pressure 0.2–2 MPa, temperature 150–250°C, and pressing time 2–4 h. The metal foil is selected from copper foil or aluminum foil, with a thickness of 5 μm, 8 μm, 12 μm, 18 μm, 35 μm, or 70 μm.

[0085] The present invention also provides an insulating board comprising at least one of the aforementioned prepreg sheets.

[0086] The present invention also provides an insulating film comprising a carrier film and the aforementioned polyphenylene ether resin composition coated thereon, wherein the heat resistance of the insulating film is significantly improved.

[0087] The insulating film is prepared by dissolving the aforementioned polyphenylene ether resin composition in a solvent to form an adhesive solution, coating the adhesive solution onto a carrier film, and then heating and drying the carrier film coated with the adhesive solution to obtain the insulating film.

[0088] The solvent is selected from at least one of acetone, butanone, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0089] The carrier film is selected from at least one of PET film, PP film, PE film, and PVC film.

[0090] The present invention also provides a circuit board comprising at least one of the aforementioned prepreg and laminate.

[0091] The present invention also provides an electronic device, including the aforementioned circuit board.

[0092] The technical solution of this application will be further described below with reference to some specific embodiments and comparative examples. Of course, these embodiments are only a part of the many variations contained in the implementation of this invention, and not all of them.

[0093] The chemical composition and content of the polyphenylene ether resin compositions of Examples 1-3 and Comparative Examples 1-3 are shown in Table 1.

[0094] Table 1

[0095]

[0096] Among them, polyphenylene ether resin A is OPE-2St manufactured by Mitsubishi, and polyphenylene ether resin B is SA9000 manufactured by SABIC; crosslinking agent A is TAIC manufactured by Evonik, and crosslinking agent B is A-DCP manufactured by Shin-Nakamura Chemical; the first flame retardant is PSMS-11 manufactured by Sanko, and the first flame retardant is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO); the inorganic filler is silica manufactured by Lianrui; and the initiator is benzoyl peroxide.

[0097] The above embodiments and comparative examples also disclose a prepreg, comprising a glass fiber cloth as a reinforcing material and a polyphenylene ether resin composition coated onto the glass fiber cloth by an impregnation method. The glass fiber cloth is a pre-treated open-fiber cloth using an epoxy silane coupling agent.

[0098] Specifically, the components of the polyphenylene ether resin compositions of Examples 1-3 and Comparative Examples 1-3 in Table 1 above were dissolved in methyl ethyl ketone, stirred and mixed, and then diluted to a solid content of 65 wt%. The T-glass fiber cloth, which is used as a reinforcing material, was pretreated with an epoxy silane coupling agent, impregnated in the above adhesive solution, removed after wetting, and placed in a forced-air drying oven at 160°C for 3-6 minutes to obtain a semi-cured sheet.

[0099] The above embodiments and comparative examples also disclose a laminate prepared by the following method:

[0100] The prepreg was cut to 300×300mm and stacked into a certain structure. Then, a low profile electrolytic copper foil with a thickness of 12μm was placed on each side of the composite sheet. The composite sheet was placed in a vacuum hot press and hot-pressed for 1.5h under a pressure of 1.5MPa and a temperature of 220℃ to obtain a copper-clad laminate.

[0101] The above embodiments and comparative examples also disclose an insulating board comprising at least one of the aforementioned prepreg sheets.

[0102] The above embodiments and comparative examples also disclose an insulating film, including a carrier film and the aforementioned polyphenylene ether resin composition coated thereon.

[0103] The above embodiments and comparative examples also disclose a circuit board, including a prepreg, which is prepared using conventional preparation methods of the prior art, and will not be described in detail here.

[0104] The copper-clad laminates obtained in Examples 1-3 and Comparative Examples 1-3 were subjected to performance testing, and the test results are shown in Table 2. The performance testing methods included:

[0105] (1) Glass transition temperature (Tg): The DMA (thermomechanical analysis) method was used, and the dynamic mechanical property tester (TA DMAQ800, USA) was used to test the temperature according to the method specified in IPC-TM-6502.4.25. The heating rate was 10℃ / min and the atmosphere was nitrogen.

[0106] (2) PCT water absorption rate: The method of IPC-TM-6502.6.2.1 was used for determination. Specifically, three samples with a length × width of 10cm × 10cm and a thickness of 0.8mm were taken and the electrolytic copper foil was removed from both sides. They were dried at 120℃ for 2h, weighed and recorded as W1. Then, they were treated in a pressure cooker at 121℃ and 2 atmospheres for 7h. After the surface free water was absorbed, they were placed in a desiccator to cool and weighed. The weight was recorded as W2. The water absorption rate was determined to be (W2-W1) / W1×100%.

[0107] (3) Peel strength (PS): The peel strength of the copper foil layer was tested according to the "post-thermal stress" test conditions in IPC-TM-650 2.4.8.

[0108] (4) Dk and Df: The dielectric constant Dk and dielectric loss Df at 10 GHz were determined using the plate method according to IPC-TM-650 2.5.5.9.

[0109] (5) Flame retardancy: determined according to the UL 94 vertical burning method.

[0110] Table 2

[0111]

[0112] Referring to Table 2, compared with the comparative example, the copper-clad laminate prepared by the polyphenylene ether resin composition of the present invention not only has excellent flame retardancy, but also has better peel strength, lower dielectric constant and dielectric loss value, and lower water absorption rate.

[0113] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0114] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A polyphenylene ether resin composition, characterized in that, By weight, including: 100 parts by weight of polyphenylene ether resin; 5-80 parts by weight of crosslinking agent; 1-60 parts by weight of the first flame retardant; The first flame retardant is a styrene-based phosphorus-containing flame retardant, and its structure is as follows: The structural formula is (1), where X is hydrogen or any alkyl group from C1 to C5, and n is an integer from 1 to 20.

2. The polyphenylene ether resin composition according to claim 1, characterized in that, The side chains or ends of the polyphenylene ether resin contain styrene groups.

3. The polyphenylene ether resin composition according to claim 2, characterized in that, The structural formula of the polyphenylene ether resin is as follows: Structural formula (2), where R1, R2, R3, R4, R5, R6, R7, and R8 are each independently selected from hydrogen or any C1-C5 alkyl group, and Y is a non-linking bond, -O-, methylene, ethylene, or... , or .

4. The polyphenylene ether resin composition according to claim 1, characterized in that, The crosslinking agent is selected from at least one of triallyl isocyanate monomer, triallyl isocyanate prepolymer, butadiene monomer, pentadiene monomer, dicyclopentadiene dimethacrylate monomer, and cyclopentadiene monomer.

5. The polyphenylene ether resin composition according to claim 1, characterized in that, It also includes a second flame retardant, which is selected from at least one of inorganic phosphorus, condensed phosphate compounds, phosphonic acid compounds, hypophosphonic acid compounds, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, tris(2,6-dimethylphenyl)phosphine, and phosphazenes.

6. The polyphenylene ether resin composition according to claim 1, characterized in that, It also includes a second flame retardant, which is selected from at least one of bromine-based flame retardants, nitrogen-based flame retardants, organosilicon flame retardants, organometallic flame retardants, and inorganic flame retardants.

7. The polyphenylene ether resin composition according to claim 5 or 6, characterized in that, The weight ratio of the first flame retardant to the second flame retardant is (20~99):(1~80).

8. The polyphenylene ether resin composition according to claim 1, characterized in that, The polyphenylene ether resin composition further includes 0.1 to 5 parts by weight of an initiator.

9. The polyphenylene ether resin composition according to claim 8, characterized in that, The initiator is at least one of benzoyl peroxide, dicumyl peroxide, tert-butane peroxide, dibutane peroxide, and butyl peroxyisopropyl monocarbonate.

10. The use of a polyphenylene ether resin composition as described in any one of claims 1 to 9 in a prepreg, laminate, insulating board, insulating film, circuit board or electronic device.

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