FFU heating device, semiconductor measuring machine and temperature control method thereof

Abstract

The application provides a FFU heating device, a semiconductor measuring machine and a temperature control method thereof. The FFU heating device comprises: a cabinet, the outer surface of the cabinet is provided with an air inlet and an air outlet, the air inlet is arranged above the cabinet, and the air outlet is arranged below the cabinet; a pipeline between the air inlet and the cabinet is provided with a rotatable air inlet connector, and the rotation connecting shaft of the air inlet connector changes the direction of the air inlet when rotating; a fan is arranged in the cabinet; a filter is arranged in the cabinet adjacent to the fan, and is used for filtering the air sucked into the fan from the air inlet; and a heater is arranged in the cabinet adjacent to the filter. The FFU heating device provided by the application can adjust the direction of the air inlet according to the requirement, so that the air inlet is always directed to a stable temperature direction, the temperature of the ambient air input into the FFU heating device is stable, and the semiconductor measuring machine provided with the FFU heating device can have stable fresh air supply.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an FFU heating device, a semiconductor measuring machine, and a temperature control method thereof. Background Technology

[0002] In the manufacturing of semiconductor integrated circuits, from the initial wafer growth to the later chip packaging, measurement equipment is an indispensable part of the semiconductor industry chain. During wafer film thickness measurement, optical measurement systems are required, and the optical components within these systems are highly sensitive to temperature changes.

[0003] Existing semiconductor measurement equipment has extremely stringent requirements for internal temperature and stability, with temperature variations within the equipment limited to within 1°C. Semiconductor manufacturing workshops typically employ circulating air systems. Many factors influence workshop temperature, such as the heating temperature of the equipment, temperature variations during maintenance, the equipment's location against a wall, and its proximity to heat sources. The magnitude of temperature fluctuations is also related to the location of the circulating air system. Therefore, temperature fluctuations or instability in semiconductor manufacturing workshops severely impact the internal temperature stability of the equipment. This instability leads to inaccurate wafer or chip thickness measurements, affecting the measurement accuracy, production capacity, and yield of the semiconductor measurement equipment, and in severe cases, necessitating a shutdown of the equipment. Furthermore, the air inlet orientation of the fan filter unit (FFU) heating device on existing semiconductor measurement equipment is fixed. Fluctuations or instability in the ambient temperature towards which the air inlet faces can cause internal temperature instability within the equipment.

[0004] Therefore, it is necessary to provide a novel FFU heating device, a semiconductor measuring machine, and a temperature control method thereof to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0005] The purpose of this invention is to provide an FFU heating device, a semiconductor measurement machine, and a temperature control method thereof, so as to enable the air inlet orientation of the FFU heating device to be adjustable.

[0006] To achieve the above objectives, the FFU heating device of the present invention includes: a housing, wherein an air inlet and an air outlet are provided on the outer surface of the housing, the air inlet being located above the housing and the air outlet being located below the housing; a rotatable air outlet connector is provided on the pipe between the air inlet and the housing, wherein the rotation coupling of the air outlet connector causes the orientation of the air inlet to change when rotated; a fan disposed in the housing; a filter disposed in the housing adjacent to the fan for filtering the air drawn in by the fan from the air inlet; and a heater disposed in the housing adjacent to the filter for heating the filtered clean air.

[0007] Furthermore, the air vent connector is made of a flexible material.

[0008] Furthermore, the air vent connector is sealed to the duct.

[0009] Furthermore, the central axis of the air inlet is perpendicular to the central axis of the air outlet.

[0010] Furthermore, the air inlet is a flared, trumpet-shaped opening.

[0011] Furthermore, the maximum rotation angle of the rotary coupling of the air vent connector is 360°.

[0012] The beneficial effects of the FFU heating device of the present invention are as follows: the FFU heating device is provided with an air inlet connector, and the rotating coupling of the air inlet connector can change the orientation of the air inlet when it rotates, so that the air inlet is away from the direction of large or unstable temperature fluctuations, so that the air inlet is always facing the direction of stable temperature, ensuring that the ambient air temperature input to the FFU heating device is stable, thereby ensuring that the semiconductor measurement equipment equipped with the FFU heating device can have a stable supply of fresh air.

[0013] This invention also provides a semiconductor measurement apparatus, comprising an apparatus body, a temperature detection device, an FFU heating device as described above, and a controller, wherein: the temperature detection device includes at least four temperature sensors, respectively arranged around the apparatus body; the temperature detection device is used to detect the ambient temperature data around the apparatus body; a temperature detection system is provided inside the apparatus body for detecting the internal temperature data of the apparatus body; the air outlet of the FFU heating device is connected to the interior of the apparatus body; the controller is disposed on the apparatus body and is used to obtain detection results from the temperature detection device and the temperature detection system; when the ambient temperature data in the first direction currently facing the air inlet does not meet the preset conditions and the internal temperature data is abnormal, the controller controls the rotating coupling of the air inlet connector to rotate, so that the air inlet switches from the first direction to a second direction, the ambient temperature data in the second direction meets the preset conditions and the internal temperature data returns to stability.

[0014] The advantages of the semiconductor measurement equipment described in this invention are as follows:

[0015] To ensure the normal operation of the semiconductor measurement equipment, the internal temperature of the equipment body must be stable and constant. However, the internal temperature of the equipment body is easily affected by fluctuations in the external ambient temperature, impacting its normal operation. When the external ambient temperature in the first direction currently facing the air inlet fluctuates significantly, the ambient temperature data detected by the temperature sensor in the corresponding direction outside the equipment body becomes abnormal. This causes fluctuations in the internal temperature of the equipment body, and the internal temperature data detected by the temperature detection system inside the equipment body becomes abnormal. Applying external force to rotate the air outlet connector on the FFU heating device causes the rotating coupling of the air outlet connector to rotate, changing the orientation of the air inlet to find a new air intake direction. This switches the air inlet from facing the first direction to facing the second direction. The ambient temperature data detected by the temperature sensor in the second direction meets preset conditions, moving away from the first direction where the external ambient temperature fluctuates greatly. The internal temperature data detected by the temperature detection system inside the equipment body is no longer abnormal, and the internal temperature of the equipment body returns to stability. The air inlet facing the second direction ensures a stable supply of fresh air, guaranteeing a stable internal temperature for the instrument body. This prevents the external ambient temperature in the first direction from affecting the accuracy of the data measured by the instrument body, thereby improving the stability of the measurement data of the semiconductor measurement instrument and increasing the product measurement yield.

[0016] Furthermore, it also includes a motor mounted on the machine body, the motor being electrically connected to the air outlet connector and the controller, so as to drive the rotary coupling of the air outlet connector to rotate under the command of the controller, thereby causing the orientation of the air inlet to change.

[0017] This invention also provides a temperature control method for a semiconductor measurement machine, using the semiconductor measurement machine as described above, comprising the following steps: acquiring the detection results of the temperature detection device and the temperature detection system in real time or periodically, the detection results including ambient temperature data detected by the at least four temperature sensors and internal temperature data of the machine body detected by the temperature detection system; acquiring the detection results from the temperature detection device and the temperature detection system; when the ambient temperature data in the first direction currently facing the air inlet does not meet a preset condition and the internal temperature data is abnormal, controlling the rotating coupling of the air inlet connector to rotate, so that the air inlet switches from the first direction to a second direction, the ambient temperature data in the second direction meets the preset condition and the internal temperature data returns to stability.

[0018] Furthermore, the temperature range of the preset conditions is 21 degrees Celsius to 24 degrees Celsius.

[0019] The beneficial effects of the temperature control method for the semiconductor measurement instrument of the present invention are as follows:

[0020] The detection results of the temperature detection device and the temperature detection system are acquired in real time or periodically. When the external ambient temperature in the first direction currently facing the air inlet fluctuates significantly, the ambient temperature data detected by the temperature sensor in the corresponding direction outside the machine body becomes abnormal. The internal temperature of the machine body is affected and fluctuates, and the internal temperature data of the machine body also becomes abnormal. An external force is applied to rotate the air outlet connector on the FFU heating device. The rotating coupling of the air outlet connector rotates and drives the orientation of the air inlet to change, finding a new air intake direction. This causes the air inlet to switch from facing the first direction to facing the second direction. The ambient temperature data detected by the temperature sensor in the second direction meets preset conditions, moving away from the first direction where the external ambient temperature fluctuates greatly. The internal temperature data of the machine body is no longer abnormal, and the internal temperature of the machine body returns to stability. The air inlet facing the second direction achieves a stable supply of fresh air, ensuring the stability of the internal temperature of the machine body. This avoids the external ambient temperature in the first direction affecting the accuracy of the data measured by the machine body, improves the stability of the measurement data of the semiconductor measurement machine, and improves the measurement yield of the product. Attached Figure Description

[0021] Figure 1This is an overall structural diagram of the FFU heating device provided in the embodiment of the present invention;

[0022] Figure 2 This is an overall structural diagram of the semiconductor measurement machine provided in the embodiments of the present invention;

[0023] Figure 3 A top view of a semiconductor measurement machine provided in an embodiment of the present invention;

[0024] Figure 4 A flowchart of a temperature control method for a semiconductor measurement machine provided in an embodiment of the present invention. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0026] To address the problems existing in the prior art, embodiments of the present invention provide an FFU heating device, a semiconductor measurement instrument, and a temperature control method thereof. The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0027] Figure 1 This is an overall structural diagram of the FFU heating device provided in the embodiment of the present invention.

[0028] Reference Figure 1As shown, in some embodiments of the present invention, an FFU heating device is provided. The FFU heating device 1 includes a housing 11, an air inlet 12, an air outlet 13, a duct 14, an air outlet connector 15, a fan, a filter, and a heater. The outer surface of the housing 11 is provided with an air inlet 12 and an air outlet 13, with the air inlet 12 located above the housing 11 and the air outlet 13 located below the housing 11. A rotatable air outlet connector 15 is provided on the duct 14 between the air inlet 12 and the housing 11. The air outlet connector 15 is located above the housing 11, and its rotating coupling causes the orientation of the air inlet 12 to change when rotated. The fan is disposed within the housing 11. The filter is disposed within the housing 11 adjacent to the fan and is used to filter the air drawn in by the fan from the air inlet 12. The heater is disposed within the housing 11 adjacent to the filter and is used to heat the filtered clean air. The air outlet 13 is used to deliver clean air heated by the heater to the semiconductor measurement machine connected to the FFU heating device 1.

[0029] In some embodiments of the present invention, the air vent connector 15 is made of a flexible material.

[0030] In some embodiments of the present invention, both ends of the air outlet connector 15 are sealed to the interface of the pipe 14 so that air from the external environment will not escape from the connection of the air outlet connector 15 when it enters the FFU heating device 1.

[0031] In some embodiments of the present invention, the central axis of the air inlet 12 is perpendicular to the central axis of the air outlet 13.

[0032] In some embodiments of the present invention, the air inlet 12 is a flared horn, with the opening of the flared horn facing away from the air outlet connector 15, and the opening diameter of the air inlet 12 is larger than the inner diameter of the air outlet connector 15, so as to increase the flow rate of air entering the air inlet 12 from the external environment. In some specific embodiments of the present invention, the flared horn is a truncated pyramid with trapezoidal sidewalls.

[0033] In some embodiments of the present invention, the maximum rotation angle of the rotary coupling of the air inlet connector 15 is 360°. This configuration ensures that the air inlet 12 can selectively intake air in any direction within 360 degrees, thus ensuring the selectivity of the FFU heating device 1 in response to the external ambient temperature.

[0034] In some specific embodiments of the present invention, the cross-section of the air vent connector 15 is circular.

[0035] Figure 2 This is an overall structural diagram of the semiconductor measurement machine provided in the embodiments of the present invention; Figure 3 This is a top view of a semiconductor measurement machine provided in an embodiment of the present invention.

[0036] Reference Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments of the present invention, a semiconductor measurement instrument is also provided, including an instrument body 2, a temperature detection device 3, an FFU heating device 1 as described above, and a controller 4. The FFU heating device 1 is disposed on the top of the instrument body 2, and the air outlet 13 of the FFU heating device 1 communicates with the interior of the instrument body 2 to deliver external air into the interior of the instrument body 2. A temperature detection system is provided inside the instrument body 2 to detect and provide feedback on changes in the internal operating temperature of the instrument. The temperature detection device 3 includes four temperature sensors 31, which are respectively arranged around the instrument body 2. The four temperature sensors 31 are used to detect ambient temperature data in four different directions around the instrument body 2 to accurately determine the actual direction of the ambient temperature change around the instrument body 2. The instrument body 2 includes four side plates 21 connected in sequence, and each temperature sensor 31 corresponds to each side plate 21, and is disposed at the same height on the side of each side plate 21 facing the outside of the instrument body 2. A controller 4 is externally mounted on the machine body 2. The controller 4 is electrically connected to the temperature detection system and to each temperature sensor 31. The controller 4 is equipped with a display 41, which displays the temperature changes in the direction where the temperature sensors 31 are located externally on the machine body 2 and the temperature changes inside the machine body 2. The controller 4 obtains detection results from the temperature detection device 3 and the temperature detection system. When the ambient temperature data in the first direction that the air inlet 12 is currently facing does not meet the preset conditions and the internal temperature data of the machine body 2 is abnormal, the controller controls the rotating coupling of the air inlet connector 15 to rotate, so that the air inlet 12 switches from the first direction to the second direction. The ambient temperature data in the second direction meets the preset conditions and can restore the internal temperature data of the machine body 2 to stability. With this setup, based on the feedback from the external temperature sensor 31 and the internal temperature detection system of the machine body 2, external force is applied to manually rotate the air inlet connector 15, adjust the orientation of the air inlet 12, find a suitable air intake direction, and move away from the direction of large fluctuations in the external ambient temperature to achieve a stable supply of heated fresh air, ensuring the internal temperature of the machine body 2 is stable, and thus ensuring the stability of the measurement data of the semiconductor measurement machine.

[0037] In some embodiments of the present invention, the temperature detection device 3 has more than four temperature sensors 31, which are evenly distributed around the machine body 2 on the side wall of the machine body 2 to detect temperature changes in different directions around the machine body 2.

[0038] In other embodiments of the present invention, a motor is also provided on the outside of the machine body 2. The motor is rotatably connected to the air outlet connector 15 and electrically connected to the controller 4 to connect to the temperature sensor 31 of the temperature detection device 3. Under the feedback of the temperature sensor 31, the air outlet connector 15 is driven to rotate, thereby causing the orientation of the air inlet 12 to change. With this configuration, when the ambient temperature data of the first direction currently facing the air inlet 12 does not meet the preset conditions and the internal temperature data of the machine body 2 is abnormal, the controller 4 can automatically drive the air inlet 12 to rotate, find a suitable air intake direction, and move away from the direction with large fluctuations in the external ambient temperature. This achieves a stable supply of heated fresh air, ensures the stability of the internal temperature of the machine body 2, saves manpower, and can accurately control the rotation angle of the air outlet connector 15, making the found air intake direction more accurate.

[0039] In some embodiments of the present invention, a measurement platform is provided inside the instrument body 2. The measurement platform includes at least one heat source, at least one light source and at least one optical lens. The wafer to be measured is placed on the measurement platform. The heat source and ventilation heating filter ensure that the working environment temperature inside the instrument body 2 is maintained at a specific temperature. The light source and optical lens are combined to measure the film thickness data of the wafer to be measured.

[0040] Figure 4 A flowchart of a temperature control method for a semiconductor measurement machine provided in an embodiment of the present invention.

[0041] In some embodiments of the present invention, a temperature control method for a semiconductor measurement machine is also provided. Using the semiconductor measurement machine as described above, the orientation of the air inlet 12 is selected to ensure that the internal temperature of the machine body 2 remains stable. The method includes the following steps: real-time or periodic acquisition of the detection results from the temperature detection device 3 and the temperature detection system. The detection results include ambient temperature data detected by at least four temperature sensors 31 and internal temperature data of the machine body 2 detected by the temperature detection system. The controller 4 acquires the detection results from the temperature detection device 3 and the temperature detection system. When the ambient temperature data in the first direction to which the air inlet 12 is currently facing does not meet preset conditions and the internal temperature data of the machine body 2 is abnormal, the controller manually controls the rotating coupling of the air inlet connector 15 to rotate, causing the air inlet 12 to switch from the first direction to a second direction. The ambient temperature data in the second direction meets preset conditions and allows the internal temperature data of the machine body 2 to return to stability. Figure 4 As shown, the detailed steps of this temperature control method include:

[0042] S0: Provides semiconductor measurement equipment;

[0043] S1: Start the semiconductor measurement equipment, turn on the semiconductor measurement machine, turn on the FFU heating device 1 and controller 4, set the gas temperature entering the machine body 2, and set the stable range of the internal temperature of the machine body 2.

[0044] S2: Turn on the internal temperature detection system of the machine body 2, detect the internal temperature data of the machine body 2, and wait for the internal temperature of the machine body 2 to reach a stable level.

[0045] S3: Turn on the four temperature sensors 31 of the temperature detection device 3 to detect the ambient temperature data around the machine body 2 respectively;

[0046] S4: The controller 4 acquires the detection results of the temperature detection device 3 and the temperature detection system in real time or periodically. The detection results include the ambient temperature data detected by at least four temperature sensors 31 and the internal temperature data of the machine body 2 detected by the temperature detection system. When the ambient temperature data detected by the temperature sensor 31 in the first direction that the air inlet 12 is currently facing does not meet the preset data range, the internal temperature of the machine body 2 is affected and fluctuates, and the internal temperature data detected by the temperature detection system will also fluctuate accordingly. If the internal temperature data exceeds the stable range set in step S1, that is, the internal temperature data is abnormal, it means that the ambient temperature in the first direction that the air inlet 12 is currently facing can no longer keep the internal temperature of the machine body 2 stable. Manually control the rotating coupling of the air outlet connector 15 to rotate, so that the air inlet 12 changes its orientation, finds a new air intake direction, and moves away from the first direction where the temperature sensor 31 is abnormal, until the internal temperature of the machine body 2 returns to stability. At this time, the orientation of the air inlet 12 is the second direction. The ambient temperature data in the second direction meets the preset conditions and can make the internal temperature data of the machine body 2 return to stability. The air inlet 12 switches from the first direction to the second direction.

[0047] Step S1 specifically includes the following steps:

[0048] S11: Turn on the heat source inside the machine body 2, and simultaneously turn on the heater and filter of the FFU heating device 1 to make the internal temperature of the machine body 2 reach the set stable range.

[0049] Step S2 specifically includes the following steps:

[0050] S21: Observe the feedback from the temperature detection system on the display 41 of the controller 4 outside the machine body 2 to ensure that the internal temperature data of the machine body 2 remains within a stable range.

[0051] In step S4, when the ambient temperature data detected by the temperature sensor 31 in the first direction currently facing the air inlet 12 meets the unpreset conditions and the detection result fluctuates significantly, it indicates that the external ambient temperature in the first direction currently facing the air inlet 12 fluctuates greatly and is unstable.

[0052] In other embodiments of the present invention, when the internal temperature of the machine body 2 is stable in step S4, and the ambient temperature data detected by the temperature sensor 31 in the first direction to which the air inlet 12 is currently facing does not meet the preset data range, the air direction may not be adjusted. However, in order to protect the machine body 2 and to ensure the normal operation of the machine body 2, the air direction of the air inlet 12 may be actively adjusted when it is determined that the ambient temperature fluctuation in the first direction to which the air inlet 12 is currently facing will affect the internal temperature stability of the machine body 2.

[0053] In some embodiments of the present invention, the preset temperature range is 21 degrees Celsius to 24 degrees Celsius.

[0054] In summary, by using the temperature control method described above for the semiconductor measurement equipment, the orientation of the air inlet 12 can be adjusted to find a suitable air intake direction, moving away from the first direction where the external ambient temperature fluctuates greatly. This allows the air inlet 12 to switch from the first direction to the second direction, achieving a stable supply of fresh air and ensuring the internal temperature of the equipment body 2 remains stable. This prevents the external ambient temperature in the first direction from affecting the accuracy of the measurement data of the equipment body 2, improves the stability of the measurement data of the semiconductor measurement equipment, and increases the measurement yield of the products.

[0055] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A semiconductor measurement instrument, characterized in that, It includes the machine body, temperature detection device, FFU heating device and controller, wherein: The FFU heating device includes: a chassis, the outer surface of which is provided with an air inlet and an air outlet, the air inlet being located on the top of the chassis and the air outlet being located on the bottom of the chassis; a rotatable air outlet connector is provided in the pipe between the air inlet and the chassis, and the rotation coupling of the air outlet connector causes the orientation of the air inlet to change when it rotates; The fan is installed in the casing; A filter, disposed in the chassis adjacent to the fan, is used to filter the air drawn in by the fan from the air inlet; A heater, located in the chassis adjacent to the filter, is used to heat the filtered clean air; The temperature detection device includes at least four temperature sensors, which are respectively arranged around the machine body; the temperature detection device is used to detect the ambient temperature data around the machine body. The machine body is equipped with a temperature detection system for detecting the internal temperature data of the machine body; The air outlet of the FFU heating device is connected to the interior of the machine body; The controller is mounted on the machine body and is used to acquire detection results from the temperature detection device and the temperature detection system. When the ambient temperature data of the first direction in which the air inlet is currently facing does not meet the preset conditions and the internal temperature data is abnormal, the rotating coupling of the air inlet connector is controlled to rotate, so that the air inlet switches from the first direction to the second direction, the ambient temperature data of the second direction meets the preset conditions and the internal temperature data returns to stability.

2. The semiconductor measurement apparatus according to claim 1, characterized in that, It also includes a motor mounted on the machine body, which is electrically connected to the air outlet connector and the controller, so as to drive the rotary coupling of the air outlet connector to rotate under the command of the controller, thereby causing the orientation of the air inlet to change.

3. The semiconductor measurement apparatus according to claim 1, characterized in that, The air vent connector is made of flexible material.

4. The semiconductor measurement apparatus according to claim 3, characterized in that, The air outlet connector is sealed to the duct.

5. The semiconductor measurement apparatus according to claim 1, characterized in that, The central axis of the air inlet is perpendicular to the central axis of the air outlet.

6. The semiconductor measurement apparatus according to any one of claims 1 to 5, characterized in that, The air inlet is a flared, trumpet-shaped opening.

7. The semiconductor measurement apparatus according to any one of claims 1 to 5, characterized in that, The maximum rotation angle of the rotary coupling of the air vent connector is 360°.

8. A temperature control method for a semiconductor measuring instrument, characterized in that, The application of the semiconductor measurement equipment as described in any one of claims 1 to 7 includes the following steps: The detection results of the temperature detection device and the temperature detection system are acquired in real time or periodically. The detection results include ambient temperature data detected by the at least four temperature sensors and internal temperature data of the machine body detected by the temperature detection system. The detection results are obtained from the temperature detection device and the temperature detection system. When the ambient temperature data of the first direction in which the air inlet is currently facing does not meet the preset conditions and the internal temperature data is abnormal, the rotating coupling of the air inlet connector is controlled to rotate, so that the air inlet switches from the first direction to the second direction. The ambient temperature data of the second direction meets the preset conditions and the internal temperature data returns to stability.

9. The temperature control method for a semiconductor measurement machine according to claim 8, characterized in that, The preset temperature range is 21 degrees Celsius to 24 degrees Celsius.

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