A control method and system of a semiconductor refrigeration device and a storage medium

Abstract

The application discloses a kind of control method, system and storage medium of semiconductor refrigeration equipment, applied to semiconductor refrigeration equipment, including semiconductor refrigerator, first heat exchanger, second heat exchanger, heat exchange fan and shell, the first heat exchanger and the second heat exchanger are provided with heat exchange passage, and the air outlet of the heat exchange fan is towards the air inlet end of the heat exchange passage Settings;The shell is provided with air inlet, refrigeration outlet and heat dissipation outlet;The control method of semiconductor refrigeration equipment includes the following steps: S1, obtain the switching temperature Ts of the air inlet;S2, open the heat exchange fan and obtain the current air inlet temperature Ti of the air inlet;When Ti < Ts, the semiconductor refrigeration equipment executes air supply mode;When Ti >= Ts, the semiconductor refrigeration equipment executes refrigeration mode.The control method proposed in the scheme, simple steps, strong operability, can effectively solve the problem of low refrigeration efficiency of semiconductor refrigeration system in prior art.

Description

Technical Field

[0001] This invention relates to the field of semiconductor refrigeration equipment technology, and in particular to a control method, system and storage medium for semiconductor refrigeration equipment. Background Technology

[0002] Semiconductor refrigeration utilizes the thermoelectric effect of materials, with a semiconductor refrigerator as the core refrigeration component. A refrigeration system is constructed by connecting cold and hot end heat exchangers to the cold and hot ends of the semiconductor refrigerator. This allows for heat exchange between the hot end heat exchanger and the ambient space, while the cold end heat exchanger cools the load. Adjusting the operating voltage or current of the semiconductor refrigerator controls its cooling output, greatly enhancing user convenience.

[0003] Compared to existing cooling systems, semiconductor cooling systems offer significant advantages in miniaturization and portability, providing a more suitable application scenario for temperature regulation in small spaces. Therefore, they are commonly used for outdoor loads requiring cooling. Since semiconductor cooling systems are typically used outdoors, to improve overall portability, the overall structure of these devices is generally trending towards further optimization and miniaturization. However, while the structure is compressed, the cooling effect is also reduced, resulting in lower cooling efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a control method, system, and storage medium for a semiconductor refrigeration device. The steps are simple and easy to operate, and it can effectively solve the problem of low refrigeration efficiency in existing semiconductor refrigeration systems, thereby overcoming the shortcomings of the prior art.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A control method for a semiconductor refrigeration device is provided, which is applied to the semiconductor refrigeration device, wherein the semiconductor refrigeration device includes a semiconductor cooler, a first heat exchanger, a second heat exchanger, a heat exchange fan, and a housing, wherein the semiconductor cooler, the first heat exchanger, the second heat exchanger, and the heat exchange fan are all installed inside the housing;

[0007] The semiconductor cooler is provided with a first end face and a second end face opposite to each other. The first heat exchanger is connected to the first end face, and the second heat exchanger is connected to the second end face. Both the first heat exchanger and the second heat exchanger are provided with heat exchange channels, and the air outlet of the heat exchange fan is arranged facing the air inlet of the heat exchange channel.

[0008] The outer casing has an air inlet, a cooling outlet and a heat dissipation outlet. The first end face is the cold end face of the semiconductor cooler, the second end face is the hot end face of the semiconductor cooler, and the air inlet of the heat exchange fan is located close to the air inlet. The air outlet of the heat exchange channel of the first heat exchanger is located close to the cooling outlet, and the air outlet of the heat exchange channel of the second heat exchanger is located close to the heat dissipation outlet.

[0009] The control method includes the following steps:

[0010] S1. Obtain the switching temperature Ts of the air inlet;

[0011] S2. Turn on the heat exchange fan and obtain the current air inlet temperature Ti.

[0012] When Ti < Ts, the semiconductor cooling device operates in air supply mode;

[0013] When Ti≥Ts, the semiconductor cooling device executes the cooling mode.

[0014] Preferably, the air supply mode is as follows:

[0015] The semiconductor cooler is turned off, and the heat exchange fan operates according to preset air supply parameters.

[0016] Preferably, the cooling mode is as follows:

[0017] Both the semiconductor cooler and the heat exchange fan operate according to preset cooling parameters until Ti < Ts.

[0018] Preferably, the cooling mode is as follows:

[0019] The difference ΔT between the inlet air temperature Ti and the switching temperature Ts is continuously acquired, i.e.:

[0020] ΔT = Ti - Ts;

[0021] Using the PID algorithm, the current cooling parameters of the semiconductor cooler and the heat exchange fan are calculated based on ΔT;

[0022] Both the semiconductor cooler and the heat exchange fan operate according to the current cooling parameters until Ti < Ts.

[0023] Preferably, the method further includes step S31, which specifically includes:

[0024] S311. Receive the shutdown command of the semiconductor cooling device;

[0025] S312, Turn off the semiconductor cooler;

[0026] S313. The heat exchange fan runs according to the preset dehumidification parameters for a preset dehumidification time and then turns off.

[0027] Preferably, the method further includes step S32, which specifically includes:

[0028] S321. Receive the shutdown command of the semiconductor cooling device;

[0029] S322. Turn off the semiconductor cooler and obtain the shutdown humidity Hs of the cooling outlet;

[0030] S323. Obtain the current outlet humidity Hi of the refrigeration outlet;

[0031] S324. The heat exchange fan operates according to the preset dehumidification parameters until Hi < Hs, at which point the heat exchange fan is turned off.

[0032] Preferably, the semiconductor cooling device further includes a power module for supplying power to the semiconductor cooling device;

[0033] The control method further includes step S0, which is located between steps S1, and step S0 specifically includes:

[0034] Obtain the usage status of the semiconductor cooling device;

[0035] When the semiconductor cooling device is in operation, the power module is powered on and proceeds to step S1.

[0036] A control system for a semiconductor refrigeration device is provided, which is applied to the semiconductor refrigeration device, wherein the semiconductor refrigeration device includes a semiconductor cooler, a first heat exchanger, a second heat exchanger, a heat exchange fan, and a housing, wherein the semiconductor cooler, the first heat exchanger, the second heat exchanger, and the heat exchange fan are all installed inside the housing;

[0037] The semiconductor cooler is provided with a first end face and a second end face opposite to each other. The first heat exchanger is connected to the first end face, and the second heat exchanger is connected to the second end face. Both the first heat exchanger and the second heat exchanger are provided with heat exchange channels, and the air outlet of the heat exchange fan is arranged facing the air inlet of the heat exchange channel.

[0038] The outer casing has an air inlet, a cooling outlet and a heat dissipation outlet. The first end face is the cold end face of the semiconductor cooler, the second end face is the hot end face of the semiconductor cooler, and the air inlet of the heat exchange fan is located close to the air inlet. The air outlet of the heat exchange channel of the first heat exchanger is located close to the cooling outlet, and the air outlet of the heat exchange channel of the second heat exchanger is located close to the heat dissipation outlet.

[0039] The control system includes an operation module, and the operation module includes a temperature acquisition switching unit and an execution mode determination unit.

[0040] The switching temperature acquisition unit is used to acquire the switching temperature Ts of the air inlet;

[0041] The execution mode determination unit is used to turn on the heat exchange fan and obtain the current air inlet temperature Ti.

[0042] When Ti < Ts, the semiconductor cooling device is set to air supply mode;

[0043] When Ti≥Ts, the semiconductor cooling device is set to run in cooling mode.

[0044] Preferably, it also includes a power failure protection module, and the power failure protection module includes a shutdown command receiving unit and a power failure protection execution unit;

[0045] The shutdown command receiving unit is used to receive the shutdown command of the semiconductor cooling device;

[0046] The power failure protection execution unit is used to shut down the semiconductor cooler and cause the heat exchange fan to run according to the preset dehumidification parameters for a preset dehumidification time before shutting down; or it is used to shut down the semiconductor cooler and cause the heat exchange fan to run according to the preset dehumidification parameters until the current outlet humidity Hi of the cooling outlet is less than the shutdown humidity Hs of the cooling outlet.

[0047] Preferably, it also includes a power supply detection module, which is used to obtain the usage status of the semiconductor cooling device and to power on the power supply module when the semiconductor cooling device is in operation.

[0048] A storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the control method for the semiconductor cooling device described above.

[0049] The technical solutions provided by the embodiments of the present invention may include the following beneficial effects:

[0050] 1. A heat exchange fan is installed at the cooling inlet of the semiconductor cooler, which helps to further reduce the size of the semiconductor cooling system and make its structure smaller and more portable.

[0051] 2. An air guide plate is added between the semiconductor cooler and the heat exchange fan to distribute the heat exchange of the first heat exchanger and the second heat exchanger. This distributes the total air volume of the heat exchange fan to the first heat exchanger and the second heat exchanger, ensuring that the heat exchange of the hot end heat exchanger is greater than that of the cold end heat exchanger. This achieves a match between the heat exchange and the cooling (heating) output, thereby increasing the cooling capacity of the semiconductor cooling system.

[0052] 3. The control method also incorporates the detection of inlet air temperature Ti. By comparing the inlet air temperature Ti with the switching temperature Ts, the current operating mode of the semiconductor refrigeration equipment can be determined, thereby effectively improving the intelligence level of the semiconductor refrigeration equipment and realizing automatic switching between air supply mode and cooling mode. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the structure of a semiconductor refrigeration device to which the control method of the semiconductor refrigeration device of the present invention is applicable.

[0054] Figure 2 This is an exploded view of the semiconductor refrigeration equipment to which the control method of the semiconductor refrigeration equipment of the present invention is applicable.

[0055] Figure 3 This is a flowchart illustrating the operating steps of a control method for a semiconductor cooling device according to the present invention.

[0056] Figure 4 This is a schematic flowchart of an embodiment of the power interruption protection step of the control method for a semiconductor refrigeration device according to the present invention.

[0057] Figure 5 This is a flowchart illustrating another embodiment of the power outage protection step of the control method for a semiconductor refrigeration device according to the present invention.

[0058] The components include a semiconductor cooler 1, a first heat exchanger 2, a second heat exchanger 3, a heat exchange fan 4, a housing 6, an air inlet 61, a cooling outlet 62, a heat dissipation outlet 63, and a power module 7. Detailed Implementation

[0059] The technical solution of the present invention will be further illustrated below through specific embodiments.

[0060] A control method for a semiconductor refrigeration device is provided, which is applied to the semiconductor refrigeration device, wherein the semiconductor refrigeration device includes a semiconductor cooler 1, a first heat exchanger 2, a second heat exchanger 3, a heat exchange fan 4, and a housing 6, wherein the semiconductor cooler 1, the first heat exchanger 2, the second heat exchanger 3, and the heat exchange fan 4 are all installed inside the housing 6.

[0061] The semiconductor cooler 1 is provided with a first end face and a second end face opposite to each other. The first heat exchanger 2 is connected to the first end face, and the second heat exchanger 3 is connected to the second end face. Both the first heat exchanger 2 and the second heat exchanger 3 are provided with heat exchange channels, and the air outlet of the heat exchange fan 4 is arranged facing the air inlet of the heat exchange channel.

[0062] The outer casing 6 has an air inlet 61, a cooling outlet 62, and a heat dissipation outlet 63. The first end face is the cold end face of the semiconductor cooler 1, and the second end face is the hot end face of the semiconductor cooler 1. The air inlet of the heat exchange fan 4 is located close to the air inlet 61. The air outlet of the heat exchange channel of the first heat exchanger 2 is located close to the cooling outlet 62, and the air outlet of the heat exchange channel of the second heat exchanger 3 is located close to the heat dissipation outlet 63.

[0063] The control method includes the following steps:

[0064] S1. Obtain the switching temperature Ts of the air inlet 61;

[0065] S2. Turn on the heat exchange fan 4 and obtain the current air inlet temperature Ti of the air inlet 61;

[0066] When Ti < Ts, the semiconductor cooling device operates in air supply mode;

[0067] When Ti≥Ts, the semiconductor cooling device executes the cooling mode.

[0068] Compared to existing cooling systems, semiconductor cooling systems offer significant advantages in miniaturization and portability, providing a more suitable application scenario for temperature regulation in small spaces. Therefore, they are commonly used for outdoor loads requiring cooling. Since semiconductor cooling systems are typically used outdoors, to improve overall portability, the overall structure of these devices is generally trending towards further optimization and miniaturization. However, while the structure is compressed, the cooling effect is also reduced, resulting in lower cooling efficiency.

[0069] Therefore, in order to solve the problem of low cooling efficiency in existing semiconductor cooling systems, this technical solution proposes a semiconductor cooling device, such as... Figure 1-2 As shown, the system includes a first heat exchanger 2, a semiconductor cooler 1, a second heat exchanger 3, and a heat exchange fan 4, all connected in sequence. It should be noted that the semiconductor cooler 1 in this design utilizes the Peltier effect. The Peltier effect refers to the phenomenon where, when a direct current passes through a thermocouple composed of two semiconductor materials, one end of the thermocouple absorbs heat and the other end releases heat. In other words, the semiconductor cooler 1 is made of two semiconductor materials, forming a hot end and a cold end. The cold end continuously absorbs heat, achieving cooling; the hot end continuously releases heat, achieving heat dissipation.

[0070] Furthermore, in order to improve the cooling effect of the semiconductor cooler 1, the semiconductor cooling system in the prior art generally sets a cooling fan at the cooling end of the semiconductor cooler 1 and a cooling fan at its heat dissipation end, so that the cooling system needs to be equipped with at least two fans; and in order to avoid the mutual influence between the cooling airflow and the heat dissipation airflow, the two fans generally need to be separated, which is very unfavorable for the development of the cooling system towards smaller, more compact and more portable.

[0071] Therefore, in order to further reduce the size of the semiconductor cooling system and make its structure smaller and more portable, this solution provides a heat exchange fan 4 at the cooling inlet of the semiconductor cooler 1, which can be an axial fan, a centrifugal fan or a butterfly fan.

[0072] For ease of description, the first end face is used as the cold end face of the semiconductor cooler 1. That is, when the semiconductor cooling system of this solution is working, the heat exchange fan 4 delivers heat exchange gas. Since the air outlet of the heat exchange fan 4 is set towards the air inlet of the heat exchange channel of the first heat exchanger 2 and the second heat exchanger 3, the heat exchange gas is separated into two heat exchange gas streams at the air outlet of the heat exchange fan 4:

[0073] As the first end face cools, heat conduction occurs between the first heat exchanger 2 and the first end face due to their connection. The cooling energy generated on the first end face is transferred to the first heat exchanger 2. When one of the heat exchange airflows enters the heat exchange channel of the first heat exchanger 2, it carries the cooling energy from the first heat exchanger 2, generating a cooling airflow.

[0074] As heat is generated at the second end face, and because the second heat exchanger 3 is connected to the second end face, there is a thermal conduction connection between the two, and the heat generated at the second end face will be conducted to the second heat exchanger 3. When another heat exchange airflow enters the heat exchange channel of the second heat exchanger 3, it will carry the heat on the second heat exchanger 3 and generate a heat dissipation airflow.

[0075] It should be noted that since the heat exchange fan 4 in this solution is located at the cooling inlet of the semiconductor cooler 1, its number and spatial arrangement are more flexible than the fans located at the cooling outlet of the semiconductor cooler 1. It can be selected according to the actual application scenario of the semiconductor cooling system, such as by comprehensively considering both cooling capacity and volume.

[0076] In addition, to ensure that the semiconductor cooling equipment meets the user's needs, this solution also proposes a control method for the aforementioned semiconductor cooling equipment, the flowchart of which is shown below. Figure 3As shown. Since the semiconductor refrigeration device of this solution is a combination structure of semiconductor refrigeration unit 1 and heat exchange fan 4, and the heat exchange fan 4 is set towards the air inlet end of the heat exchange channel, the semiconductor refrigeration device of this solution can simultaneously have two functional modes, namely air supply mode (i.e., "small fan" function) and refrigeration mode (i.e., "small air conditioner" function).

[0077] Furthermore, in order to achieve automatic switching between air supply mode and cooling mode, this solution also introduces the detection of inlet air temperature Ti into the control method. By comparing the inlet air temperature Ti with the switching temperature Ts, the current functional mode that the semiconductor cooling equipment should operate in can be determined, thereby effectively improving the intelligence level of the semiconductor cooling equipment.

[0078] It should be noted that, in step S1, the acquisition of the switching temperature Ts of the air inlet 61 can be, in one embodiment, the switching temperature Ts can be the default value of the control system of the semiconductor refrigeration equipment, which is usually the factory setting of the semiconductor refrigeration equipment product; or it can be input and set by the user through a control panel, smartphone or other smart terminal, and this control method is not limited here.

[0079] To further explain, the air supply mode is specifically as follows:

[0080] The semiconductor cooler 1 is turned off, and the heat exchange fan 4 operates according to preset air supply parameters.

[0081] In some embodiments, only the heat exchange fan 4 operates in the air supply mode of this control method, thus turning the semiconductor refrigeration device into a "mini fan". It should be noted that, in one embodiment, the preset air supply parameters (such as operating voltage) of the heat exchange fan 4 can be the default air supply parameters of the control system of the semiconductor refrigeration device, which are usually the factory settings of the semiconductor refrigeration device product; or they can be input and set by the user through a control panel, smartphone or other smart terminal, etc. This control method does not limit this.

[0082] To further explain, the cooling mode is specifically as follows:

[0083] Both the semiconductor cooler 1 and the heat exchange fan 4 operate according to preset cooling parameters until Ti < Ts.

[0084] In a preferred embodiment of this technical solution, the cooling mode is achieved by the semiconductor cooler 1 and the heat exchange fan 4 operating according to constant preset cooling parameters, so that the semiconductor cooling device can be transformed into a "mini air conditioner". The method is simple and easy to operate.

[0085] It should be noted that the semiconductor cooler 1 and the heat exchange fan 4 can be the default cooling parameters of the control system of the semiconductor cooling equipment according to constant preset cooling parameters (such as the operating power of the semiconductor cooler 1 and the operating voltage of the heat exchange fan 4). These parameters are usually the factory settings of the semiconductor cooling equipment products. Alternatively, they can be input and set by the user through a control panel, smartphone or other smart terminal. This control method is not limited here.

[0086] To further explain, the cooling mode is specifically as follows:

[0087] The difference ΔT between the air inlet temperature Ti and the switching temperature Ts at the air inlet 61 is continuously obtained, that is:

[0088] ΔT = Ti - Ts;

[0089] Using the PID algorithm, the current cooling parameters of the semiconductor cooler 1 and the heat exchange fan 4 are calculated based on ΔT;

[0090] Both the semiconductor cooler 1 and the heat exchange fan 4 operate according to the current cooling parameters until Ti < Ts.

[0091] In another preferred embodiment of this technical solution, the cooling mode is operated by the semiconductor cooler 1 and the heat exchange fan 4 according to the dynamic cooling parameters obtained by the PID algorithm, so that the semiconductor cooling device becomes a "mini air conditioner", which is conducive to the semiconductor cooling device achieving precise temperature control.

[0092] To further explain, it also includes step S31, which specifically includes:

[0093] S311. Receive the shutdown command of the semiconductor cooling device;

[0094] S312, Turn off the semiconductor cooler 1;

[0095] S313, The heat exchange fan 4 runs according to the preset dehumidification parameters for a preset dehumidification time and then turns off.

[0096] To further explain, it also includes step S32, which specifically includes:

[0097] S321. Receive the shutdown command of the semiconductor cooling device;

[0098] S322, Turn off the semiconductor cooler 1 and obtain the shutdown humidity Hs of the cooling outlet 62;

[0099] S323. Obtain the current air humidity Hi at the cooling outlet 62;

[0100] S324. The heat exchange fan 4 operates according to the preset dehumidification parameters until Hi < Hs, at which point the heat exchange fan 4 is turned off.

[0101] In the semiconductor refrigeration equipment of this solution, one stream of heat exchange air passes through the first heat exchanger 2 located at the cold end of the semiconductor cooler 1. When the surface temperature of the first heat exchanger 2 is lower than the dew point temperature, the flowing heat exchange air will condense on the surface of the first heat exchanger 2, forming condensate. In cooling mode, since both the semiconductor cooler 1 and the heat exchange fan 4 are powered, when the driving force of the heat exchange fan 4 is greater than the surface tension of the condensate in the first heat exchanger 2, or when the driving force of the heat exchange fan 4 is greater than both the surface tension and the weight of the condensate, the condensate will be blown away by the airflow from the heat exchange fan 4. Furthermore, as the temperature of the first heat exchanger 2 decreases, the surface tension of the condensate increases. When the surface tension or the combined surface tension and gravity reach equilibrium with the airflow force of the heat exchange fan 4, some condensate will remain on the surface of the first heat exchanger 2. When the surface tension or the combined surface tension and gravity are greater than the airflow force, the condensate is very likely to detach from the first heat exchanger 2 and drip into the internal components of the semiconductor refrigeration equipment, such as the heat exchange fan 4, causing equipment malfunction.

[0102] Therefore, in order to extend the service life of semiconductor equipment, the control method of this solution also proposes a power-off protection procedure for the semiconductor cooling equipment, the flowchart of which is as follows: Figure 4-5 As shown, after receiving the shutdown command of the semiconductor refrigeration equipment, the semiconductor refrigeration unit 1 is turned off first, and the heat exchange fan 4 is allowed to continue running for a period of time before being turned off. This allows the output airflow of the heat exchange fan 4 to blow away or dry the condensate on the surface of the first heat exchanger 2, thereby preventing the condensate from leaving the first heat exchanger 2 and dripping into the internal parts of the semiconductor refrigeration equipment, such as the heat exchange fan 4, which could cause equipment failure.

[0103] In a preferred embodiment of the power failure protection steps described above, dehumidification can be achieved by setting a fixed preset dehumidification time in the control method, or by detecting the outlet humidity of the cooling outlet 62 and comparing the current outlet humidity Hi of the cooling outlet 62 with the shutdown humidity Hs.

[0104] It should be noted that in the above power failure protection steps, the preset dehumidification parameters, preset dehumidification time, and shutdown humidity Hs can be the default parameters of the control system of the semiconductor refrigeration equipment, which are usually the factory settings of the semiconductor refrigeration equipment products; they can also be input and set by the user through the control panel, smartphones, or other smart terminals. This control method is not limited here.

[0105] Furthermore, the semiconductor cooling device also includes a power module 7, which is used to supply power to the semiconductor cooling device;

[0106] The control method further includes step S0, which is located between steps S1, and step S0 specifically includes:

[0107] Obtain the usage status of the semiconductor cooling device;

[0108] When the semiconductor cooling device is in operation, the power module 7 is powered on and proceeds to step S1.

[0109] It should be noted that the power module of this solution includes a battery assembly and / or an adapter assembly. Both the battery assembly and the adapter assembly can be used to power the semiconductor refrigeration equipment, including but not limited to the semiconductor refrigeration unit 1, the heat exchange fan 4, and the sensors used to implement various detection functions in the semiconductor refrigeration equipment.

[0110] This solution can use either DC or AC power to power the semiconductor cooling device. To further improve the portability of the semiconductor cooling device, this solution preferably uses a battery pack to power it, thus enabling convenient carrying of the device. It should be noted that the battery pack in this solution can be a dry cell battery or a lithium battery, and is not limited thereto.

[0111] Preferably, the battery assembly is either a dry cell battery or a rechargeable battery; the semiconductor refrigeration device in this technical solution can be powered by a disposable battery or a rechargeable battery, providing a variety of power supply options and improving the flexibility of the semiconductor refrigeration device.

[0112] When the battery assembly is a rechargeable battery, the power module also includes a DC input port (not shown in the figure). The DC input port is used to connect an external adapter to charge the battery assembly, thereby enabling the battery assembly to be reused and achieving environmental protection.

[0113] When the semiconductor refrigeration equipment uses DC power as its power supply, in order to improve the effective working endurance of the power supply; and when the semiconductor refrigeration equipment uses AC power as its power supply, in order to save energy and avoid unnecessary energy consumption of the refrigeration equipment when it is not in use, this solution also adds a power supply detection step to the control method of the semiconductor refrigeration equipment. By obtaining the usage status of the semiconductor refrigeration equipment, it is determined whether the power module 7 is powered on, thereby further improving the intelligence level of the semiconductor refrigeration equipment.

[0114] Preferably, the semiconductor refrigeration device further includes a usage status detection sensor, which is electrically connected to the power module. The usage status detection sensor is used to detect whether the semiconductor refrigeration device is in use or idle, so as to achieve the purpose of energy saving and environmental protection.

[0115] In one embodiment, an infrared sensor is used for state detection, which has a simple structure and is easy to install.

[0116] In another embodiment, the state detection sensor used is an attitude sensor, which has high detection accuracy.

[0117] A control system for a semiconductor refrigeration device is provided, which is applied to the semiconductor refrigeration device, and the semiconductor refrigeration device includes a semiconductor cooler 1, a first heat exchanger 2, a second heat exchanger 3, a heat exchange fan 4, and a housing 6, wherein the semiconductor cooler 1, the first heat exchanger 2, the second heat exchanger 3, and the heat exchange fan 4 are all installed inside the housing 6.

[0118] The semiconductor cooler 1 is provided with a first end face and a second end face opposite to each other. The first heat exchanger 2 is connected to the first end face, and the second heat exchanger 3 is connected to the second end face. Both the first heat exchanger 2 and the second heat exchanger 3 are provided with heat exchange channels, and the air outlet of the heat exchange fan 4 is arranged facing the air inlet of the heat exchange channel.

[0119] The outer casing 6 has an air inlet 61, a cooling outlet 62, and a heat dissipation outlet 63. The first end face is the cold end face of the semiconductor cooler 1, and the second end face is the hot end face of the semiconductor cooler 1. The air inlet of the heat exchange fan 4 is located close to the air inlet 61. The air outlet of the heat exchange channel of the first heat exchanger 2 is located close to the cooling outlet 62, and the air outlet of the heat exchange channel of the second heat exchanger 3 is located close to the heat dissipation outlet 63.

[0120] The control system includes an operation module, and the operation module includes a temperature acquisition switching unit and an execution mode determination unit.

[0121] The switching temperature acquisition unit is used to acquire the switching temperature Ts of the air inlet 61;

[0122] The execution mode determination unit is used to turn on the heat exchange fan 4 and obtain the current air inlet temperature Ti of the air inlet 61.

[0123] When Ti < Ts, the semiconductor cooling device is set to air supply mode;

[0124] When Ti≥Ts, the semiconductor cooling device is set to run in cooling mode.

[0125] Furthermore, it also includes a power failure protection module, which includes a shutdown command receiving unit and a power failure protection execution unit;

[0126] The shutdown command receiving unit is used to receive the shutdown command of the semiconductor cooling device;

[0127] The power failure protection execution unit is used to shut down the semiconductor cooler 1 and cause the heat exchange fan 4 to run according to the preset dehumidification parameters for a preset dehumidification time before shutting down; or it is used to shut down the semiconductor cooler 1 and cause the heat exchange fan 4 to run according to the preset dehumidification parameters until the current outlet humidity Hi of the cooling outlet 62 is less than the shutdown humidity Hs of the cooling outlet 62.

[0128] Furthermore, it also includes a power supply detection module, which is used to obtain the usage status of the semiconductor cooling device and to power on the power module 7 when the semiconductor cooling device is in operation.

[0129] A storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the control method for the semiconductor cooling device described above.

[0130] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. A control method for a semiconductor cooling device, characterized in that, The invention is applied to a semiconductor refrigeration device, wherein the semiconductor refrigeration device includes a semiconductor refrigerator, a first heat exchanger, a second heat exchanger, a heat exchange fan, and a housing, wherein the semiconductor refrigerator, the first heat exchanger, the second heat exchanger, and the heat exchange fan are all installed inside the housing; The semiconductor cooler is provided with a first end face and a second end face opposite to each other. The first heat exchanger is connected to the first end face, and the second heat exchanger is connected to the second end face. Both the first heat exchanger and the second heat exchanger are provided with heat exchange channels, and the air outlet of the heat exchange fan is arranged facing the air inlet of the heat exchange channel. The outer casing has an air inlet, a cooling outlet and a heat dissipation outlet. The first end face is the cold end face of the semiconductor cooler, the second end face is the hot end face of the semiconductor cooler, and the air inlet of the heat exchange fan is located close to the air inlet. The air outlet of the heat exchange channel of the first heat exchanger is located close to the cooling outlet, and the air outlet of the heat exchange channel of the second heat exchanger is located close to the heat dissipation outlet. The control method includes the following steps: S1. Obtain the switching temperature Ts of the air inlet; S2. Turn on the heat exchange fan and obtain the current air inlet temperature Ti. When Ti < Ts, the semiconductor cooling device operates in air supply mode; When Ti≥Ts, the semiconductor cooling device executes the cooling mode; The specific air supply mode is as follows: the semiconductor cooler is turned off, and the heat exchange fan operates according to the preset air supply parameters; The cooling mode is specifically as follows: the semiconductor cooler and the heat exchange fan both operate according to preset cooling parameters until Ti < Ts; Alternatively, continuously obtain the difference ΔT between the inlet air temperature Ti and the switching temperature Ts, i.e.: ΔT = Ti - Ts; use the PID algorithm to calculate the current cooling parameters of the thermoelectric cooler and the heat exchange fan based on ΔT; the thermoelectric cooler and the heat exchange fan both operate according to the current cooling parameters until Ti < Ts; It also includes step S31, which specifically includes: S311. Receive the shutdown command of the semiconductor cooling device; S312, Turn off the semiconductor cooler; S313. The heat exchange fan runs according to the preset dehumidification parameters for a preset dehumidification time and then turns off. It also includes step S32, which specifically includes: S321. Receive the shutdown command of the semiconductor cooling device; S322. Turn off the semiconductor cooler and obtain the shutdown humidity Hs of the cooling outlet; S323. Obtain the current outlet humidity Hi of the refrigeration outlet; S324. The heat exchange fan operates according to the preset dehumidification parameters until Hi < Hs, at which point the heat exchange fan is turned off.

2. The control method for a semiconductor cooling device according to claim 1, characterized in that, The semiconductor cooling device also includes a power module, which is used to supply power to the semiconductor cooling device. The control method further includes step S0, which is located between steps S1, and step S0 specifically includes: Obtain the usage status of the semiconductor cooling device; When the semiconductor cooling device is in operation, the power module is powered on and proceeds to step S1.

3. A control system for a semiconductor cooling device, characterized in that, The invention is applied to a semiconductor refrigeration device, wherein the semiconductor refrigeration device includes a semiconductor refrigerator, a first heat exchanger, a second heat exchanger, a heat exchange fan, and a housing, wherein the semiconductor refrigerator, the first heat exchanger, the second heat exchanger, and the heat exchange fan are all installed inside the housing; The semiconductor cooler is provided with a first end face and a second end face opposite to each other. The first heat exchanger is connected to the first end face, and the second heat exchanger is connected to the second end face. Both the first heat exchanger and the second heat exchanger are provided with heat exchange channels, and the air outlet of the heat exchange fan is arranged facing the air inlet of the heat exchange channel. The outer casing has an air inlet, a cooling outlet and a heat dissipation outlet. The first end face is the cold end face of the semiconductor cooler, the second end face is the hot end face of the semiconductor cooler, and the air inlet of the heat exchange fan is located close to the air inlet. The air outlet of the heat exchange channel of the first heat exchanger is located close to the cooling outlet, and the air outlet of the heat exchange channel of the second heat exchanger is located close to the heat dissipation outlet. The control system includes an operation module, and the operation module includes a temperature acquisition switching unit and an execution mode determination unit. The switching temperature acquisition unit is used to acquire the switching temperature Ts of the air inlet; The execution mode determination unit is used to turn on the heat exchange fan and obtain the current air inlet temperature Ti. When Ti < Ts, the semiconductor cooling device is set to air supply mode; When Ti≥Ts, the semiconductor cooling device is set to run in cooling mode.

4. The control system for a semiconductor cooling device according to claim 3, characterized in that, It also includes a power failure protection module, and the power failure protection module includes a power-off command receiving unit and a power failure protection execution unit; The shutdown command receiving unit is used to receive the shutdown command of the semiconductor cooling device; The power failure protection execution unit is used to shut down the semiconductor cooler and cause the heat exchange fan to run according to the preset dehumidification parameters for a preset dehumidification time before shutting down; or it is used to shut down the semiconductor cooler and cause the heat exchange fan to run according to the preset dehumidification parameters until the current outlet humidity Hi of the cooling outlet is less than the shutdown humidity Hs of the cooling outlet.

5. The control system for a semiconductor refrigeration device according to claim 3, characterized in that, It also includes a power supply detection module and a power supply module. The power supply detection module is used to obtain the usage status of the semiconductor cooling device, and when the semiconductor cooling device is in the operating state, it powers on the power supply module, which is used to supply power to the semiconductor cooling device.

6. A storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the control method for the semiconductor cooling device according to any one of claims 1 to 2.

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