A measurement method, a measurement system, and a measurement device

Abstract

A measurement method, a measurement system and a measurement device, wherein the measurement method comprises: measuring the first surface by the first measurement component to obtain a first reference surface in the measurement coordinate system; obtaining a first position coordinate of a first to-be-measured position in the measurement coordinate system according to a first reference position relationship between the first to-be-measured position and a first reference position of the first surface, wherein a relative position relationship between the first position coordinate and the first reference surface is the same as the first reference position relationship; and causing the second measurement component to measure the first to-be-measured position according to the first position coordinate to obtain a measurement coordinate of the first to-be-measured position along a to-be-measured direction, wherein the to-be-measured direction is parallel to the first reference surface or the to-be-measured direction has an acute angle with the first reference surface. The measurement method can improve the measurement accuracy.

Description

Technical Field

[0001] The present invention relates to the field of optical detection technology, and in particular to a measurement method, measurement system and measurement device for measuring a specific position of an object under test. Background Technology

[0002] In the production of workpieces, in order to ensure the quality of the workpieces and prevent distortion, it is necessary to inspect the three-dimensional shape. Contour accuracy is an important indicator for measuring the magnitude of workpiece distortion.

[0003] Profile tolerance refers to the variation of the actual profile of a measured object relative to its ideal profile. It is typically used to describe the accuracy of the shape of a surface or curve. Profile tolerance is an index used to define the limit of variation between the actual surface (line) and the ideal surface (line). Profile tolerance is the allowable variation of the actual measured feature (profile feature) from the ideal profile.

[0004] In the process of inspecting the profile of a hole, to improve the inspection speed, only the line profile of the inner wall of the hole at the height of interest needs to be inspected. However, if the inspection position is deviated, it will affect the inspection accuracy. When the hole diameter varies greatly with the hole height, even a small deviation in the inspection position will cause a large deviation in the measured diameter. Therefore, how to determine the position to be inspected is a challenge faced by existing technologies.

[0005] This application establishes a planar position reference by detecting the edge of the hole; the position to be measured of the hole is obtained based on the planar position reference, so as to accurately detect the distortion of the hole. Summary of the Invention

[0006] The problem solved by the embodiments of the present invention is to provide a measurement method that improves measurement accuracy by establishing a planar reference and locating the detection position.

[0007] To address the aforementioned problems, embodiments of the present invention provide a measurement method, comprising: providing a test object, the test object including a first surface and a sidewall to be measured, the first surface and the sidewall to be measured having a first reference position relationship, the first reference position relationship including a non-zero angle between the sidewall to be measured and the first surface; measuring the first surface using a first measuring component to obtain the coordinates of the first surface in the measuring coordinate system to obtain a first reference plane; obtaining a first position coordinate of the first test position in the measuring coordinate system based on the first test position of the sidewall to be measured and the first reference position relationship of the first surface, the relative position relationship between the first position coordinate and the first reference plane being the same as the first reference position relationship; and causing a second measuring component to measure the first test position based on the first position coordinate to obtain the measurement coordinates of the first test position along the test direction, the test direction being parallel to the first reference plane or the test direction having an acute angle with the first reference plane.

[0008] Optionally, the first measuring component has a first device coordinate system; the second measuring component has a second device coordinate system; before measuring the first surface using the measuring device, the measuring method further includes: aligning the first device coordinate system to the measuring coordinate system; and aligning the second device coordinate system to the measuring coordinate system.

[0009] Optionally, the objects to be measured and the second measuring components at different relative positions have different second device coordinate systems; the measurement method further includes: obtaining the second transformation relationship between the second device coordinate system and the measurement coordinate system at each relative position, and unifying each second device coordinate system to the measurement coordinate system.

[0010] Optionally, the measurement coordinate system and the first device coordinate system have a first preset transformation relationship; unifying the second device coordinates to the measurement coordinate system includes: providing a first standard object, the first standard object including a plurality of first feature points and a plurality of second feature points, the first feature points and the second feature points having a first preset positional relationship; measuring the plurality of first feature points using a first measurement component to obtain the first feature coordinates of each first feature point in the first device coordinate system, and transforming the first feature coordinates to the measurement coordinate system using the first preset transformation relationship as the first transformed coordinates; measuring the plurality of second feature points using a second measurement component to obtain the second feature coordinates of each second feature point in the second device coordinate system; obtaining a second transformation relationship between the second device coordinate system and the measurement coordinate system based on the first feature coordinates, the second feature coordinates, the first preset positional relationship of the plurality of first feature points and the plurality of second feature points, and the first preset transformation relationship, and transforming the second feature coordinates to the measurement coordinate system using the second transformation relationship as the second transformed coordinates, the positional relationship between the first transformed coordinates and the second transformed coordinates being the same as the first preset positional relationship.

[0011] Optionally, the second preset positional relationship includes: multiple first feature points are coplanar, multiple second feature points are coplanar, and the plane containing the multiple first feature points is perpendicular to the plane containing the multiple second feature points; the first preset transformation relationship is that the measurement coordinate system is the same as the first device coordinate system.

[0012] Optionally, one of the plurality of second device coordinate systems is a reference coordinate system, and the measurement coordinate system and the reference coordinate system have a second preset transformation relationship; unifying the first device coordinate system to the measurement coordinate system includes:

[0013] A first standard object is provided, the first standard object including a plurality of first feature points and a plurality of second feature points, the first feature points and the second feature points having a first preset positional relationship;

[0014] The first measurement component measures multiple first feature points to obtain the first feature coordinates of each first feature point in the first device coordinate system.

[0015] The second measurement component measures multiple second feature points to obtain the second feature coordinates of each second feature point in the reference coordinate system. The second feature coordinates are then transformed to the measurement coordinate system using a second preset transformation relationship to obtain the second transformed coordinates.

[0016] Based on the first preset positional relationship between the first feature point and the second feature point, and the second preset transformation relationship, a first transformation relationship between the first device coordinate system and the measurement coordinate system is obtained. Based on the first transformation relationship, the coordinates of the first feature point are transformed to the coordinates in the measurement coordinate system as the first transformed coordinates. The positional relationship between the first transformed coordinates and the second transformed coordinates is the same as the first preset positional relationship.

[0017] Optionally, one of the plurality of second device coordinate systems is a reference coordinate system, and the other second device coordinate systems besides the reference coordinate system are coordinate systems to be transformed;

[0018] The measurement coordinate system and the reference coordinate system have a second preset transformation relationship; unifying each second device coordinate system to the measurement coordinate system includes:

[0019] A second standard object is provided, the second standard object including a second feature point and a third feature point, and each third feature point has a second preset positional relationship with each second feature point;

[0020] The second feature point in the reference coordinate system is measured by the second measurement component to obtain the reference coordinates of the second feature point in the reference coordinate system. The reference coordinates are then transformed to the coordinates of the measurement coordinate system according to the second preset transformation relationship to obtain the second transformed coordinates.

[0021] The third feature point is measured using the second measuring component in the coordinate system to be transformed, and the third feature coordinates of the third feature point are obtained. The measurement process includes: adjusting the relative position of the second standard object and the second measuring component so that the second measuring component is aligned with the third feature point, and the second standard object is located in one of the coordinate systems to be transformed by the second measuring component; after adjusting the relative position of the second standard object and the second measuring component, the third feature coordinates of the third feature point in the coordinate system to be transformed are obtained using the second measuring component.

[0022] After the measurement process, the third feature coordinates of the third feature point, the reference coordinates, and the third preset transformation relationship between the coordinate system to be transformed and the reference coordinate system are calculated to obtain the third transformation relationship between the coordinate system to be transformed and the measurement coordinate system. The third feature coordinates are transformed to the coordinates in the measurement coordinate system according to the third transformation relationship to obtain the third transformed coordinates. The positional relationship between the third transformed coordinates and the second transformed coordinates is the same as the third preset positional relationship.

[0023] Repeat the measurement and calculation steps to obtain the third transformation relationship of each coordinate system to be transformed, so as to unify each coordinate system to be transformed into the measurement coordinate system.

[0024] Optionally, the first standard object is the same as the second standard object, the first standard object includes multiple reference surfaces, and adjacent reference surfaces have non-zero included angles; the first feature point and the second feature point are respectively located on different reference surfaces of the first standard object; the reference surface where the first feature point is located is perpendicular to the reference surface where the second feature point is located.

[0025] When the first standard object includes multiple sets of second feature points, the multiple sets of second feature points are located on different reference planes; the reference plane where each set of second feature points is located is perpendicular to the reference plane where the first feature point is located.

[0026] Optionally, the first measuring component has a first optical axis, and the first measuring component is used to measure the coordinates of the first position to be measured along the direction of the first optical axis; the first optical axis is perpendicular to the first surface;

[0027] The second measuring component has a second optical axis and is used to measure the coordinates of the first position to be measured along the direction of the second optical axis; the direction to be measured is parallel to the second optical axis; the second optical axis is perpendicular to the first optical axis.

[0028] Optionally, the object to be tested further includes a second surface, and the second surface and the sidewall to be tested have a second reference positional relationship, the second reference positional relationship including a non-zero included angle between the sidewall to be tested and the second surface;

[0029] The measurement method further includes: measuring the second surface using a third measurement component to obtain the coordinates of the second surface in the measurement coordinate system to obtain a second reference surface;

[0030] Based on the relationship between the second measured position of the sidewall to be measured and the second reference position of the second surface, the second position coordinates of the second measured position in the measurement coordinate system are obtained, and the relative position relationship between the second position coordinates and the second reference surface is the same as the second reference position relationship.

[0031] The second measuring component measures the second position to be measured based on the second position coordinates to obtain the coordinates of the second position to be measured along the direction to be measured, wherein the direction to be measured is parallel to the second reference plane or the direction to be measured has an acute angle with the second reference plane.

[0032] Optionally, the second surface is disposed opposite to the first surface, and the third measuring component has a third optical axis and a third device coordinate system; the third measuring component is used to measure the coordinates of the reference point of the second surface along the direction of the third optical axis;

[0033] The third optical axis of the third measuring component is parallel to the first optical axis of the first measuring component, and the light emission direction of the third measuring component is opposite to the light emission direction of the first measuring component.

[0034] Before measuring the second surface using the third measuring component, the measurement method further includes: aligning the third device coordinate system to the measurement coordinate system;

[0035] The process of unifying the third device coordinate system to the measurement coordinate system includes: unifying the coordinates perpendicular to the third optical axis in the third device coordinate system to the measurement coordinate system; and unifying the coordinates parallel to the third optical axis in the third device coordinate system to the measurement coordinate system.

[0036] Optionally, unifying the coordinates perpendicular to the third optical axis in the third device coordinate system to the measurement coordinate system includes: moving the third measurement component and the first measurement component relative to each other in a direction perpendicular to the third optical axis, so that the third optical axis coincides with the first optical axis.

[0037] Optionally, the measurement coordinate system and the first device coordinate system have a third preset transformation relationship; unifying the coordinates parallel to the third optical axis in the third device coordinate system to the measurement coordinate system includes:

[0038] A third standard object is provided, the third standard object including a first standard surface and a second standard surface that are opposite each other, the first standard surface and the second standard surface are parallel, and the thickness between the first standard surface and the second standard surface is a preset thickness;

[0039] The first standard surface is measured by the first measuring component to obtain the coordinates of the first standard surface in the first device coordinate system, and the first measuring surface is obtained by transforming the first measuring surface to the measuring coordinate system according to the first preset transformation relationship to obtain the first transformed surface;

[0040] The second standard surface is measured by the third measuring component to obtain the coordinates of the second standard surface in the three-device coordinate system, thus obtaining the second measuring surface;

[0041] Based on the first measurement surface, the second measurement surface, and the first preset transformation relationship, the sub-transformation relationship of the third device coordinate system along the third optical axis is obtained. The second measurement surface is compensated by the sub-transformation relationship to obtain the compensation surface. The distance between the compensation surface and the first transformation surface is equal to the preset thickness.

[0042] Optionally, the sidewall to be tested includes multiple test locations; the measurement method further includes: designating test locations whose distance from the first surface is less than or equal to a preset threshold as first test locations; and designating test locations whose distance from the first surface is greater than a preset threshold as second test locations.

[0043] Optionally, the sidewall to be tested has multiple first test locations;

[0044] The measurement method further includes: repeatedly obtaining the coordinates of the first test position along the test direction based on the first test position of the sidewall to be measured and the first reference position relationship of the first surface, and causing the second measurement component to measure the first test position according to the first position coordinates, so as to obtain the measurement coordinates of multiple first test positions along the test direction.

[0045] Optionally, the sidewall to be tested has multiple first test positions that are at the same vertical distance from the first surface; the first execution of the step of having the second measuring component measure the first test position according to the first position coordinates includes: moving the second measuring component along a direction perpendicular to the first surface to align with the plane where the multiple first test positions are located; rotating the second measuring component relative to the object to be tested about an axis perpendicular to the first surface until the second measuring component is aligned with the first test position;

[0046] The second and subsequent steps of having the second measuring component measure the first position to be measured according to the first position coordinates include: rotating the second measuring component relative to the object to be measured about an axis perpendicular to the first surface until the second measuring component is aligned with another first position to be measured.

[0047] Optionally, the object to be tested has a hole, and the sidewall to be tested is the sidewall of the hole; the extension direction of the hole is perpendicular to the first surface; the measurement method further includes: fitting the cross-sectional shape of the sidewall to be tested according to multiple first measurement coordinates to obtain a fitting curve; and obtaining the cross-sectional size or shape of the sidewall to be tested according to the fitting curve.

[0048] Optionally, measuring the first surface using the first measuring component to obtain the coordinates of the first surface in the measuring coordinate system to obtain the first reference surface includes: measuring multiple first reference points of the first surface of the object to be measured using the first measuring component to obtain the coordinates of each first reference point in the measuring coordinate system; fitting the first surface based on the coordinates of the multiple first reference points to obtain the coordinates of the first surface in the measuring coordinate system to obtain the first reference surface.

[0049] The present invention also provides a measurement system, comprising: a processing system, wherein the processing system is used to execute the measurement method described in any one of the above-mentioned methods.

[0050] The present invention also provides a measuring device, including a first measuring component, a second measuring component and a third measuring component; and the above-described measuring system.

[0051] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages:

[0052] The measurement method provided in this embodiment of the invention measures the first surface of the object under test using a first measurement component unified in a measurement coordinate system to obtain a first reference surface in the measurement coordinate system. The sidewall to be measured has a non-zero angle with the first surface, and based on the first reference position relationship, the first position coordinates of the first position to be measured in the measurement coordinate system can be obtained. This allows the second measurement component unified in the measurement coordinate system to locate the first position to be measured based on the first position coordinates, thereby enabling the measurement of the coordinates along the measurement direction at the first position on the sidewall to be measured, and obtaining the measurement coordinates. The measured coordinates can be compared with the design coordinates to obtain the distortion of the object under test.

[0053] Furthermore, the detection method also includes: aligning the coordinate systems of each second device with the measurement coordinate system; enabling the second measuring component to measure the object under test at different relative positions, thereby determining the size or shape of the sidewall to be measured of the object under test.

[0054] Furthermore, by having the first and second measuring components measure the first and second feature points of the first standard object respectively, and obtaining the transformation relationship based on the relationship between the planes containing the first and second feature points, the first and second measuring components can be unified under a measurement coordinate system. Even if the measurement directions of the first and second measuring components are perpendicular, they can still be unified under the same coordinate system. Moreover, the first and second measuring components can simultaneously measure the first standard object, increasing the speed.

[0055] Furthermore, by measuring the second surface using the third measuring component to obtain the coordinates of the second surface in the measuring coordinate system, a second reference surface is obtained. This allows different test positions with different distances from the first surface to be referenced using the first and second reference surfaces respectively. Specifically, the test position closer to the first surface can be designated as the first test position, and the first reference surface can be used as the reference to locate the first test position using the second measuring component. Similarly, the test position closer to the second surface can be designated as the second test position, and the second reference surface can be used as the reference to locate the second test position using the second measuring component. This reduces the positioning error of the test position and improves the detection accuracy.

[0056] Furthermore, since the measurement coordinate system is the same as the first device coordinate system, all second device coordinate systems and the third setting coordinate system of the third measurement component are unified to the first device coordinate system, which simplifies the method of unifying the first device coordinate system, the second device coordinate system, and the third device coordinate system to the measurement coordinate system.

[0057] Furthermore, by aligning the optical axes of the first and second measuring components to unify them into the same coordinate system, the calibration speed and accuracy of the first and second measuring components can be rapidly achieved. Attached Figure Description

[0058] Figure 1 This is a flowchart of each step in the first embodiment of the measurement method of the present invention;

[0059] Figures 2 to 6 This is a schematic diagram of the structure of each step in an embodiment of the measurement method of the present invention. Detailed Implementation

[0060] As is known from the background art, it is difficult to accurately locate the position to be measured in the existing technology, resulting in low measurement accuracy. This application detects the surface of the object to be measured to establish a planar position reference; and obtains the position to be measured based on the planar position reference to accurately detect the distortion of the object to be measured.

[0061] To address the aforementioned technical problem, embodiments of the present invention provide a measurement method, comprising: measuring a first surface using a first measuring component to obtain the coordinates of the first surface in a measuring coordinate system to obtain a first reference surface; obtaining the first position coordinates of the first position to be measured in the measuring coordinate system based on the relationship between the first position to be measured on the sidewall to be measured and the first reference position on the first surface, wherein the relative position relationship between the first position coordinates and the first reference surface is the same as the first reference position relationship; and causing a second measuring component to measure the first position to be measured based on the first position coordinates to obtain the measurement coordinates of the first position to be measured along a measurement direction, wherein the measurement direction is parallel to the first reference surface or forms an acute angle with the first reference surface. The measurement method of this application can improve measurement accuracy.

[0062] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0063] Figure 1 This is a flowchart of each step in the first embodiment of the measurement method of the present invention.

[0064] refer to Figure 1 The present invention provides a measurement method, comprising:

[0065] Step S01: Provide a test object, the test object including a first surface and a test sidewall, the first surface and the test sidewall having a first reference position relationship, the first reference position relationship including a non-zero included angle between the test sidewall and the first surface;

[0066] Step S02: Measure the first surface using the first measuring component to obtain the coordinates of the first surface in the measuring coordinate system and obtain the first reference surface;

[0067] The measurement of the first position to be measured is performed with the first reference plane as a reference, which includes steps S03 and S04.

[0068] Step S03: Based on the relationship between the first test position of the sidewall to be tested and the first reference position of the first surface, obtain the first position coordinates of the first test position in the measurement coordinate system. The relative position relationship between the first position coordinates and the first reference surface is the same as the first reference position relationship.

[0069] Step S04: The second measuring component measures the first position to be measured according to the first position coordinates to obtain the measurement coordinates of the first position to be measured along the direction to be measured, wherein the direction to be measured is parallel to the first reference plane or the direction to be measured has an acute angle with the first reference plane.

[0070] Figure 2 A schematic diagram of the structure of the measuring device for measuring the object to be measured in one embodiment of the measurement method provided by the present invention.

[0071] refer to Figure 2 In step S01, a test object 100 is provided. The test object 100 includes a first surface 101 and a test sidewall 104. The first surface 101 and the test sidewall 104 have a first reference position relationship. The first reference position relationship includes a non-zero included angle between the test sidewall 104 and the first surface 101.

[0072] In this embodiment, the object to be tested 100 includes a hole 103, and the sidewall of the hole 103 is the sidewall to be tested 104.

[0073] In this embodiment, the cross-sectional dimensions of the hole 103 are different at different positions along the extension direction. Specifically, the hole 103 includes a first hole 103 and a second hole 103 whose central axes coincide. The first hole is a circular hole, and the second hole is a conical hole. In other embodiments, the cross-sectional dimensions of the hole 103 are the same at different positions along the extension direction, and the hole 103 is a cylindrical hole; or, the hole 103 is a conical hole.

[0074] Accordingly, in this embodiment, the sidewall to be tested 104 includes: a sidewall with a first hole perpendicular to the first surface 101, and a sidewall with a second hole having an acute or obtuse angle with the first surface 101.

[0075] In this embodiment, the test object 100 further includes a second surface 102 opposite to the first surface 101.

[0076] In this embodiment, the first surface 101 is a plane; in other embodiments, the first surface 101 is a curve, such as an arc surface or a cylindrical surface. In this embodiment, the second surface 102 is a plane; in other embodiments, the second surface 102 is a curve, such as an arc surface or a cylindrical surface.

[0077] refer to Figure 3 , Figure 3 A schematic diagram of a measuring apparatus for performing the measurement method of this embodiment.

[0078] The test object 100 is measured by a measuring device, which includes a first measuring component 110 and a second measuring component.

[0079] In this embodiment, the measuring device further includes a third measuring component 130; the first measuring component 110 has a first device coordinate system; the second measuring component has a second device coordinate system; and the third measuring component 130 has a third device coordinate system.

[0080] The first measuring component 110 includes a first measuring head 113, used to measure the coordinates of the point to be measured along the first measuring direction z1.

[0081] The first measuring component 110 further includes a first measuring stage 111 for measuring the coordinates of the point to be measured along the first coordinate axis x; and a second measuring stage 112 for measuring the coordinates of the point to be measured along the second coordinate axis y. The first coordinate axis x, the second coordinate axis y, and the first measuring direction z1 have non-zero included angles between each other.

[0082] The second measuring component includes a second measuring head 121 for measuring the coordinates of the point to be measured along a second measuring direction, wherein the first measuring direction z1 is different from the second measuring direction.

[0083] The second measuring component further includes a third measuring stage for measuring the coordinates of the point to be measured along the third coordinate axis z3; and a fourth measuring stage for measuring the coordinates of the point to be measured along the fourth coordinate axis, wherein the third coordinate axis z3, the fourth coordinate axis, and the second measuring direction have non-zero included angles with each other. In other embodiments, the second measuring component may not include the fourth coordinate axis.

[0084] In this embodiment, the first measurement direction z1 and the second measurement direction are perpendicular, and the third coordinate axis z3 is parallel to the first measurement direction z1. In other embodiments of the present invention, the first measurement direction z1 and the second measurement direction have an acute angle or an obtuse angle; the third coordinate axis z3 has an acute angle or an obtuse angle with the first measurement direction z1.

[0085] Specifically, in this embodiment, the second measuring head 121 is rotatable about a rotation axis, which is parallel to the third coordinate axis z3. The second measuring direction rotates with the rotation of the second measuring head 121.

[0086] The fourth measuring station includes a first sub-measuring station and a second sub-measuring station. The first sub-measuring station is used to measure the first sub-coordinate of the point to be measured along a first sub-coordinate axis; the second sub-measuring station is used to measure the second sub-coordinate of the point to be measured along a second sub-coordinate axis. The fourth measuring station obtains the coordinates of the point to be measured along the fourth coordinate axis by combining the first and second sub-coordinates. In this embodiment, the first sub-measuring station is the same as the first measuring station 111; the second sub-measuring station is the same as the second measuring station 112. That is, the first measuring component 110 and the second measuring component share the first measuring station 111 and the second measuring station 112.

[0087] Both the first measuring platform 111 and the second measuring platform 112 are movable platforms. The first measuring platform 111 and the second measuring platform 112 are used to move the object to be measured 100 and determine the first sub-coordinate and the second sub-coordinate of the point to be measured by the moving distance. In this embodiment, the first measuring platform and the second measuring platform are also used to align the point to be measured with the first measuring head 113 and the second measuring head 121 by moving the object to be measured 100.

[0088] In this embodiment, the first measuring head 113 and the second measuring head 121 are a spectral confocal measuring instrument or an interferometer. In other embodiments, the first measuring head 113 and the second measuring head 121 are a triangulation measuring instrument or a coordinate measuring machine.

[0089] In this embodiment, the first measuring component 110 has a first optical axis, which is the same as the first measuring direction z1. The first measuring component 110 is used to measure the coordinates of the position to be measured along the first optical axis direction. The first optical axis is perpendicular to the first surface 101.

[0090] The second measuring component has a second optical axis and is used to measure the coordinates of the position to be measured along the direction of the second optical axis; the direction to be measured is parallel to the second optical axis. In this embodiment, the second optical axis is perpendicular to the first optical axis.

[0091] The first measuring head 113 is used to generate a first measuring light, which is incident on the surface of the object to be measured 100 along the first optical axis. Different wavelengths of the first measuring light converge at different positions along the first optical axis. The first measuring light is reflected by the object to be measured 100 to form reflected light. The first measuring head 113 acquires the reflected light and determines the coordinates of the point to be measured along the first optical axis based on the wavelength of the light with the greatest light intensity in the reflected light.

[0092] The second measuring head is used to generate a second measuring light, which is incident on the surface of the object to be measured 100 along the second optical axis. Different wavelengths of the second measuring light converge at different positions along the second optical axis. The second measuring light is reflected by the object to be measured 100 to form reflected light. The second measuring head acquires the reflected light and determines the coordinates of the point to be measured along the second optical axis based on the wavelength of the light with the highest intensity in the reflected light.

[0093] In other embodiments of the invention, the measuring device may not include the third measuring component 130.

[0094] In this embodiment, before measuring the first surface 101 using the measuring device, the measurement method further includes: step S11, aligning the first device coordinate system to the measurement coordinate system; step S12, aligning the second device coordinate system to the measurement coordinate system; and step S13, aligning the third device coordinate system to the measurement coordinate system.

[0095] The measurement coordinate system and the first device coordinate system have a first preset transformation relationship; the second device coordinates are unified to the measurement coordinate system.

[0096] Specifically, in this embodiment, the first preset transformation relationship is a unit matrix E, meaning the measurement coordinate system is the same as the first device coordinate system; transforming the first device coordinate system into the measurement coordinate system includes using the first device coordinate system as the measurement coordinate system. In other embodiments of the present invention, the first preset transformation relationship may not be a unit matrix E. For example, the first preset transformation relationship may be to translate the coordinates in the first device coordinate system by a non-zero distance and / or rotate them by a non-zero angle to obtain the coordinates in the measurement coordinate system.

[0097] In this embodiment, unifying the coordinates of the second device to the measurement coordinate system includes:

[0098] Step S111: Provide a first standard object 200, which includes a plurality of first feature points 201 and a plurality of second feature points 202, and the first feature points 201 and the second feature points 202 have a second preset positional relationship.

[0099] refer to Figure 4 and Figure 5 , Figure 5 yes Figure 4 In the cross-sectional view of this embodiment, the second preset positional relationship includes: multiple first feature points 201 are coplanar, multiple second feature points 202 are coplanar, and the planes where the multiple first feature points 201 are located are different from the planes where the multiple second feature points 202 are located.

[0100] In this embodiment, the first standard object 200 has multiple sets of second feature points 202; the second feature points 202 in the same set are located on the same surface of the first standard object 200, and the second feature points 202 in different sets are located on different surfaces of the first standard object 200.

[0101] The first standard object 200 includes multiple reference surfaces, with non-zero included angles between adjacent reference surfaces; the first feature point 201 and the second feature point 202 are respectively located on different reference surfaces of the first standard object 200. The reference surface where the first feature point 201 is located is perpendicular to the reference plane where the second feature point 202 is located, and has an acute or obtuse included angle. Specifically, in this embodiment, the reference plane where the first feature point 201 is located is perpendicular to the reference plane where the second feature point 202 is located.

[0102] When the first standard object 200 includes multiple sets of second feature points 202, the multiple sets of second feature points 202 are located on different reference planes; each set of second feature points 202 has a non-zero included angle with the reference plane where the first feature point 201 is located. Specifically, the reference plane where each set of second feature points 202 is located is perpendicular to the reference plane where the first feature point 201 is located.

[0103] The reference surface can be a plane or a curved surface. In this embodiment, the reference surface is a plane.

[0104] Step S112: The first measurement component 110 measures multiple first feature points 201 to obtain the first feature coordinates of each first feature point 201 in the first device coordinate system. The first feature coordinates are then transformed to the measurement coordinate system using a first preset transformation relationship to obtain the first transformed coordinates.

[0105] Measuring multiple first feature points 201 by the first measuring component 110 includes: performing a first measurement operation on any one of the first feature points 201, the first measurement operation including: moving the first measuring table and the second measuring table to align the first measuring head 113 with the first feature point 201, and obtaining the first feature coordinate component along the first coordinate axis x and the second feature coordinate component along the second coordinate axis y of the first feature point 201 in the first device coordinate system;

[0106] After the first measuring head 113 is aligned with the first feature point 201, the first measuring head 113 measures the first feature point 201 to obtain the first measuring coordinate component of the first feature point 201 along the first measuring direction z1. The first feature coordinate includes the first feature coordinate component, the second feature coordinate component and the first measuring coordinate component.

[0107] Measuring multiple first feature points 201 using the first measurement component 110 includes repeating the steps of the first measurement operation until the first feature coordinates of the multiple first feature points 201 are obtained.

[0108] Step S113: Measure multiple second feature points 202 using the second measurement component to obtain the second feature coordinates of each second feature point 202 in the second device coordinate system.

[0109] In this embodiment, the second measuring head 121 is configured to translate along the third coordinate axis z3.

[0110] Measuring multiple second feature points 202 using the second measuring component includes: performing a second measurement operation on any one of the second feature points 202. The second measurement operation includes: moving the object to be measured 100 and the second measuring head 121 along the first and second sub-coordinate axes using the first and second sub-measuring stages, and moving the second measuring head 121 along the third coordinate axis z3 to align the second measuring head 121 with the second feature point 202, and obtaining the first sub-coordinate component and the second sub-coordinate component of the second feature point 202 along the first sub-coordinate axis and the third coordinate component of the second feature point 202 along the third coordinate axis z3 in the second device coordinate system; after the second measuring head 113 is aligned with the second feature point 202, measuring the second feature point 202 using the second measuring head 113 to obtain the second measurement coordinate component of the second feature point 202 along the second measurement direction.

[0111] Measuring multiple second feature points 202 using the second measurement component further includes: performing coordinate decomposition and combination on the first sub-coordinate component and the second sub-coordinate component to obtain the fourth coordinate component of the second feature point 202 along the fourth coordinate axis.

[0112] The second feature coordinate includes the third coordinate component, the fourth coordinate component, and the second measured coordinate component. The third coordinate component, the fourth coordinate component, and the second measured coordinate component are each at a non-zero angle; specifically, the third coordinate component, the fourth coordinate component, and the second measured coordinate component are each perpendicular to each other.

[0113] Measuring multiple second feature points 202 using the second measurement component includes repeating the steps of the second measurement operation until the second feature coordinates of the multiple second feature points 202 are obtained.

[0114] Step S114: Based on the first feature coordinates, the second feature coordinates, the first preset positional relationship of the plurality of first feature points 201 and the plurality of second feature points 202, and the first preset transformation relationship, obtain the second transformation relationship between the second device coordinate system and the measurement coordinate system. Through the second transformation relationship, the second feature coordinates are transformed to the coordinates in the measurement coordinate system as the second transformed coordinates. The positional relationship between the first feature coordinates and the second feature coordinates is the same as the second preset positional relationship.

[0115] Based on the first feature coordinates, the second feature coordinates, the first preset positional relationship of the plurality of first feature points 201 and the plurality of second feature points 202, and the first preset transformation relationship, a second transformation relationship between the second device coordinate system and the measurement coordinate system is obtained, including: pairing the first feature points 201 and the second feature points 202 in pairs, wherein the paired first feature points 201 and the second feature points 202 have the first preset positional relationship; performing compensation processing on the first feature coordinates and / or the second feature coordinates according to the first preset positional relationship; making the coordinates of the compensated second feature coordinates after transformation by the intermediate transformation relationship equal to the paired first feature coordinates, thereby obtaining an intermediate transformation relationship; and combining the intermediate transformation relationship with the first preset transformation relationship to obtain the first transformation relationship, wherein the first transformation relationship is used to transform the coordinates measured by the second measurement component in the second device coordinate system to the measurement coordinate system.

[0116] The intermediate transformation relationship is a transformation matrix, which is the transformation matrix of the first preset transformation relationship; combining the intermediate transformation relationship with the first preset transformation relationship includes multiplying the intermediate transformation relationship with the first preset transformation relationship.

[0117] When the measurement coordinate system is the same as the first device coordinate system, the first preset transformation relationship is matrix E, that is, the intermediate transformation relationship is the first transformation relationship; combining the intermediate transformation relationship with the first preset transformation relationship includes: using the intermediate transformation relationship as the first transformation relationship.

[0118] In this embodiment, the first preset positional relationship includes: the reference plane where the plurality of first feature points 201 are located is perpendicular to the reference plane where the plurality of second feature points 202 are located, and the coordinates of the first feature points 201 after vertical angle transformation are equal to the coordinates of the paired second feature points.

[0119] In this embodiment, the angular range of the first measuring component 110 and the second measuring component can be less than 90°. If the first feature point 201 and the second feature point 202 are the same, then the optical axes of the first measuring component 110 and the second measuring component are perpendicular, and the angular range of the first feature point 201 and the second feature point 202 needs to be greater than or equal to 90°. This application, by having the first measuring component 110 and the second measuring component measure the first feature point 201 and the second feature point 202 of the first standard object 200 respectively, and obtaining the transformation relationship based on the relationship between the reference plane where the first feature point 201 is located and the reference plane where the second feature point 202 is located, can unify the first measuring component 110 and the second measuring component under the same measuring coordinate system. Even if the measuring axes of the first measuring component 110 and the second measuring component are perpendicular, they can still be unified under the same coordinate system. Furthermore, it allows the first measuring component 110 and the second measuring component to simultaneously measure the first standard object 200, improving speed.

[0120] Specifically, in this embodiment, the measuring angle range of the first measuring component 110 and the second measuring component is 5° to 80°, for example, 60°.

[0121] It should be noted that in this embodiment, the test object 100 and the second measuring component, which are in different relative positions, have different second device coordinate systems.

[0122] This embodiment measures the dimensions of the sidewall 104 to be measured, which requires measuring different positions of the sidewall 104. The angle difference between different positions of the sidewall 104 to be measured is greater than the measurement angle range of the second measuring component. Therefore, when measuring different positions, the object to be measured 100 and the second measuring component need to be moved. In this embodiment, the measurement method further includes: obtaining the second transformation relationship between the second device coordinate system and the measurement coordinate system at each relative position, and unifying each second device coordinate system to the measurement coordinate system.

[0123] Specifically, the measurement method further includes: repeating the step of unifying the second device coordinates to the measurement coordinate system, obtaining the first transformation relationship of each second device coordinate system, so as to transform each second device coordinate system to the measurement coordinate system.

[0124] To improve the positioning accuracy of the position to be measured, the measurement method of this embodiment further includes: step S05, measuring the second surface by the third measuring component to obtain the coordinates of the second surface in the measurement coordinate system to obtain the second reference surface.

[0125] In this embodiment, the measuring device further includes a third measuring component 130, which is used to measure the second surface 102.

[0126] The third measurement component 130 includes: a third measurement head 131 for measuring the coordinates of the point to be measured along a third measurement direction z2, wherein the third measurement direction z2 is parallel to the first measurement direction z1; a fifth measurement stage for measuring the coordinates of the point to be measured along a fifth coordinate axis; and a sixth measurement stage for measuring the coordinates of the point to be measured along a sixth coordinate axis.

[0127] Specifically, in this embodiment, the fifth measuring station is the same as the first measuring station, that is, the first measuring component 110 and the third measuring component 130 share the same first measuring station; the sixth measuring station is the same as the second measuring station, and the first measuring component 110 and the third measuring component 130 share the same second measuring station.

[0128] In this embodiment, the third measuring head 131 is a spectral confocal measuring instrument or an interferometer. In other embodiments, the third measuring head 131 is a triangulation measuring instrument or a coordinate measuring machine.

[0129] In this embodiment, the third measuring head 131 has a third optical axis, which is parallel to the third measuring direction z2. In other embodiments, the third optical axis has an acute angle with the third measuring direction z2.

[0130] In this embodiment, the light emission direction of the third measuring component 130 is opposite to the light emission direction of the first measuring component 110.

[0131] Before obtaining the second reference plane, the measurement method further includes: step S15, aligning the third device coordinate system with the measurement coordinate system.

[0132] The process of unifying the third device coordinate system to the measurement coordinate system includes: unifying the coordinates perpendicular to the third optical axis in the third device coordinate system to the measurement coordinate system; and unifying the coordinates parallel to the third optical axis in the third device coordinate system to the measurement coordinate system.

[0133] In this embodiment, unifying the coordinates perpendicular to the third optical axis in the third device coordinate system to the measurement coordinate system includes: moving the third measurement component 130 and the first measurement component 110 along a direction perpendicular to the third optical axis so that the third optical axis coincides with the first optical axis; after the third optical axis coincides with the first optical axis, compensating the coordinates of the first measurement device and / or the third measurement device along the direction perpendicular to the third optical axis to the same value, wherein the same value is the coordinate value in the measurement coordinate system.

[0134] Moving the second measuring component and the first measuring component 110 in a direction perpendicular to the third optical axis to make the third optical axis coincide with the first optical axis includes: acquiring the measuring light emitted by the first measuring head 113 through the second measuring head 121, and converging the measuring light onto the photosensitive surface of the first measuring head 113 to form a light spot; and moving the first measuring head 13 and the second measuring head 121 relative to each other according to the position of the light spot to make the third optical axis coincide with the first optical axis.

[0135] In this embodiment, the first measuring head 113 and the second measuring head 121 are moved relative to each other according to the position of the light spot so that the third optical axis coincides with the first optical axis. This includes: obtaining the position of the third optical axis according to the position of the light spot on the photosensitive surface; and moving the first measuring head 113 and the second measuring head 121 relative to each other according to the deviation between the position of the third optical axis and the position of the first optical axis so that the third optical axis coincides with the first optical axis.

[0136] The third optical axis is aligned with the first optical axis, and the fifth measuring stage is the same as the first measuring stage; the sixth measuring stage is the same as the second measuring stage. Then, the coordinates along the first coordinate axis x obtained by the first measuring component 110 and the third measuring component 130 are the same and are both determined by the coordinates output by the first measuring stage. The coordinates along the second coordinate axis y obtained by the first measuring component 110 and the third measuring component 130 are the same and are both determined by the coordinates output by the second measuring stage.

[0137] In this embodiment, the measurement coordinate system and the first device coordinate system have a first preset transformation relationship.

[0138] Unifying the coordinates parallel to the third optical axis in the third device coordinate system to the measurement coordinate system includes: providing a third standard object, the third standard object including a first standard surface and a second standard surface opposite to each other, the first standard surface and the second standard surface being parallel, and the thickness between the first standard surface and the second standard surface being a preset thickness; measuring the first standard surface using the first measuring component to obtain the coordinates of the first standard surface in the first device coordinate system to obtain a first measuring surface, and transforming the first measuring surface to the measurement coordinate system according to the first preset transformation relationship to obtain a first transformed surface; measuring the second standard surface using the third measuring component to obtain a second measuring surface; obtaining a sub-transformation relationship of the third device coordinate system along the third optical axis according to the first measuring surface, the second measuring surface and the first preset transformation relationship, and compensating the second measuring surface using the sub-transformation relationship to obtain a compensated surface, the distance between the compensated surface and the first transformed surface being equal to the preset thickness.

[0139] Specifically, in this embodiment, the first preset transformation relationship is E, meaning the first device coordinates are the measurement coordinate system. Therefore, the first transformed surface obtained after transforming the first measurement surface to the measurement coordinate system according to the third preset transformation relationship is the first measurement surface. Then, the distance between the compensated surface obtained after compensating the second measurement surface through the sub-transformation relationship and the first measurement surface is equal to the preset thickness. In other embodiments, the first preset transformation relationship may not be E.

[0140] Measuring the first standard surface using the first measuring component includes: measuring any multiple first points on the first standard surface using the first measuring device to obtain the coordinates of the multiple first points; and fitting the coordinates of the multiple first points to obtain the first measuring surface.

[0141] The second standard surface is measured by the third measuring device to obtain the first measuring surface. Any multiple second points on the first standard surface are measured by the second measuring device to obtain the coordinates of the multiple second points. The coordinates of the multiple second points are fitted to obtain the second measuring surface.

[0142] The process of obtaining the sub-transformation relationship of the third device coordinate system along the third optical axis based on the first and second measurement surfaces includes: obtaining the first normal of the first measurement surface; obtaining the projection of the difference between the first and second measurement surfaces onto the first normal to obtain the sub-transformation relationship.

[0143] In another embodiment of this application, the first measurement direction z1 is perpendicular to the first standard plane or has an acute angle with it. Specifically, obtaining the sub-transformation relationship of the third device coordinate system along the third optical axis based on the first measurement plane and the second measurement plane includes: measuring at least one first point on the first standard plane using a first measuring device to obtain the coordinates of the first point along the first measurement direction z1; measuring at least one second point on the second standard plane using a second measuring device to obtain the coordinates of the second point along the first measurement direction z1; subtracting the coordinates of the first point along the first measurement direction z1 from the coordinates of the second point along the first measurement direction z1 to obtain the sub-transformation relationship; and the distance between the compensated coordinates of the second point along the first measurement direction z1 after compensation using the sub-transformation relationship and the coordinates of the second point along the first measurement direction z1 is equal to the preset thickness.

[0144] In other embodiments of the present invention, the first standard surface and the second standard surface may be parallel or have a non-zero included angle. The third standard object has a feature structure that penetrates the first standard surface and the second standard surface, and the feature structure has feature points. Unifying the coordinates parallel to the third optical axis in the third device coordinate system to the measurement coordinate system includes: detecting the feature structure exposed by the first standard surface using the first measurement component 110 to obtain the first feature coordinates of the feature structure; detecting the feature structure exposed by the second standard surface using the second measurement component to obtain the second feature coordinates of the feature structure; obtaining the coordinates of the first feature point 201 of the feature point in the first device coordinate system along the first measurement direction z1 based on the first feature coordinates; obtaining the coordinates of the second feature point 202 of the feature point in the third device coordinate system along the third measurement direction z2 based on the second feature coordinates; obtaining the sub-transformation relationship of the third device coordinate system along the third optical axis based on the coordinates of the first feature point 201 and the second feature point 202, and the compensated coordinates of the second feature point 202 after compensation by the sub-transformation relationship are equal to the coordinates of the first feature point 201. Specifically, the sub-transformation relationship is the difference between the coordinates of the second feature point 202 and the coordinates of the first feature point 201. The feature structure is a through hole 103 or a sphere. The feature point is the center of the feature structure.

[0145] In this embodiment, after aligning the first device coordinate system, the second device coordinate system, and the third device coordinate system to the measurement coordinate system, the first surface 101 is measured by the first measurement component 110 to obtain the coordinates of the first surface 101 in the measurement coordinate system, thus obtaining a first reference surface; the second surface 102 is measured by the second measurement component to obtain the coordinates of the second surface in the measurement coordinate system, thus obtaining a second reference surface. In other embodiments of the present invention, after measuring the first surface 101 by the first measurement component 110 to obtain the coordinates of the first surface 101 in the measurement coordinate system and thus obtaining the first reference surface, the third device coordinate system is aligned to the measurement coordinate system.

[0146] It should be noted that in the above embodiments, the first feature point 201 and the second feature point 202 are located on different surfaces of the first standard object 200. In other embodiments of the present invention, the first feature point 201 and the second feature point 202 are the same, and the plurality of first feature points 201 are not coplanar. By having the first measuring component 110 and the second measuring component measure the plurality of feature points, the transformation relationship between the first device coordinate system and the second device coordinate system is obtained, so that the first device coordinate system and the second device coordinate system are transformed to the same coordinate system.

[0147] Return to reference Figure 2In step S02, the first surface 101 is measured by the first measuring component 110 to obtain the coordinates of the first surface 101 in the measuring coordinate system and obtain the first reference surface.

[0148] The first measuring component 110, unified to the measuring coordinate system, measures the first surface 101 of the object under test 100 to obtain the first reference surface in the measuring coordinate system. The side wall 104 to be measured has a non-zero angle with the first surface 101. According to the first reference position relationship, the first position coordinates of the first position A to be measured in the measuring coordinate system can be obtained. Thus, the second measuring component, unified to the measuring coordinate system, can locate the first position A to be measured according to the first position coordinates, thereby realizing the measurement of the coordinates of the first position A to be measured along the measurement direction of the side wall 104 to be measured and obtaining the measurement coordinates. The measurement coordinates can be compared with the design coordinates to obtain the distortion of the object under test 100.

[0149] Measuring the first surface 101 using the first measuring component 110 to obtain the coordinates of the first surface 101 in the measuring coordinate system and obtaining a first reference surface includes: measuring multiple first reference points of the first surface 101 of the object under test 100 using the first measuring component 110 to obtain the coordinates of each first reference point in the measuring coordinate system; fitting the first surface 101 based on the coordinates of the multiple first reference points to obtain the coordinates of the first surface 101 in the measuring coordinate system and obtaining the first reference surface.

[0150] In this embodiment, the first reference surface is a plane. In other embodiments, the first reference surface can be a curved surface.

[0151] The reference point coordinates include: a first component coordinate along the first coordinate axis x; a second component coordinate along the second coordinate axis y; and a measurement component coordinate along the first measurement direction z1.

[0152] The number of reference points is greater than or equal to 3. The first reference surface can be determined based on the coordinates of the first reference points (3 or more). The first reference surface is the coordinate expression of the first surface 101 in the measurement coordinate system.

[0153] In other embodiments of the present invention, the first surface 101 is perpendicular to the first measurement direction z1. The coordinates of the first reference point may only include the measurement component coordinates along the first measurement direction z1. The first reference surface is used as a positioning reference for the first position to be measured A along a direction perpendicular to the first surface.

[0154] Return to reference Figure 2Execute step S05 to obtain the second reference plane, and use the second reference plane as a reference to measure the second position B to be measured.

[0155] In this embodiment, the method for obtaining the second reference plane is the same as the method for obtaining the first reference plane. All the methods described above for obtaining the first reference plane using the first measuring component 110 can be incorporated into the method for obtaining the first reference plane using the second measuring component.

[0156] Measuring the second surface 102 using the second measuring component to obtain the coordinates of the second surface 102 in the measuring coordinate system to obtain the second reference surface includes: measuring multiple second reference points of the second surface 102 of the object to be measured 100 using the second measuring component to obtain the coordinates of each second reference point in the measuring coordinate system.

[0157] Based on the coordinates of the second reference points of multiple second reference points, the second surface 102 is fitted to obtain the coordinates of the second surface in the measurement coordinate system, thus obtaining the second reference surface.

[0158] Specifically, there is a second reference position relationship between the second surface 102 and the sidewall 104 to be tested, and the second reference position relationship includes a non-zero included angle between the sidewall 104 to be tested and the second surface 102.

[0159] The measuring device also includes a third measuring component 130. By measuring the second surface 102 using the third measuring component 130, the coordinates of the second surface 102 in the measuring coordinate system are obtained to obtain a second reference plane. This allows different test positions of the sidewall 104 to be referenced using the first reference plane and the second reference plane respectively. Specifically, the test position closest to the first surface 101 can be designated as the first test position A, and the first test position A can be located using the second measuring component with the first reference plane as the reference. Similarly, the test position closest to the second surface 102 can be designated as the second test position B, and the second test position B can be located using the second measuring component with the second reference plane as the reference. This reduces the positioning error of the test position and improves the detection accuracy.

[0160] Before measuring the first test position A using the first reference plane as a reference, the measurement method further includes: designating a test position whose distance from the first surface 101 is less than or equal to a preset threshold as the first test position A; and designating a test position whose distance from the first surface 101 is greater than the preset threshold as the second test position B. Then, the first test position A is subsequently measured using the first reference plane as a reference; and the second test position B is measured using the second reference plane as a reference.

[0161] In this embodiment, the preset threshold is half the distance between the first surface 101 and the second surface 102.

[0162] refer to Figure 4 In step S03, based on the first position A of the sidewall to be measured 104 and the first reference position relationship of the first reference position of the first surface 101, the first position coordinates of the first position A in the measurement coordinate system are obtained. The relative position relationship between the first position coordinates and the first reference surface is the same as the first reference position relationship.

[0163] In this embodiment, the first measurement direction z1 is perpendicular to the first surface 101; the first reference position relationship includes the first measured position A to the first surface 101 having a first preset distance perpendicular to the first surface A; obtaining the first position coordinates of the first measured position A in the measurement coordinate system includes obtaining the coordinates of the position at which the perpendicular distance between the first reference surface and the first reference surface is the first preset distance to obtain the first position coordinates.

[0164] In other embodiments of the present invention, the first measurement direction z1 has a non-zero angle with the first surface 101; the first reference position relationship includes: the first position to be measured A and the first surface 101 have a first preset distance along the first measurement direction z1.

[0165] In this embodiment, the measurement method detects the diameter, width, or shape of the hole 103 located at a first preset distance perpendicular to the first surface 101. There are multiple first test locations A that are at the same first preset distance perpendicular to the first surface 101.

[0166] refer to Figure 5 Step S04 is executed, causing the second measuring component to measure the first position A to be measured according to the first position coordinates, and to obtain the measurement coordinates of the first position A to be measured along the measurement direction, wherein the measurement direction is parallel to the first reference plane or the measurement direction has an acute angle with the first reference plane.

[0167] The second measuring component measures the first position A according to the first position coordinates, including: moving the second measuring component relative to the object to be measured 100 so that the second measuring component is aligned with the first position A; after aligning the second measuring component with the first position A, measuring the coordinates of the first position A along the measurement direction through the second measuring component to obtain the measurement coordinates of the first position A along the measurement direction, wherein the measurement direction is parallel to the second measuring direction.

[0168] In this embodiment, the sidewall to be tested 104 has multiple first test positions A that are at the same vertical distance from the first surface 101.

[0169] The measurement method further includes: repeatedly obtaining the coordinates of the first measured position A along the measurement direction based on the first reference position relationship between the first measured position A of the sidewall 104 to be measured and the first reference position relationship of the first surface 101, and causing the second measurement component to measure the first measured position A according to the first position coordinates, so as to obtain the measurement coordinates of multiple first measured positions A along the measurement direction.

[0170] Specifically, in this embodiment, the first step of having the second measuring component measure the first position A according to the first position coordinates includes: moving the second measuring component relative to the object to be measured 100 along a plane perpendicular to the first measuring direction z1, so that the second measuring component is located on one side of the side wall 104 to be measured; after the second measuring component is located on one side of the side wall 104 to be measured of the object to be measured 100, moving the second measuring component along a direction perpendicular to the first surface 101 so that the second measuring component is aligned with the first position A to be measured.

[0171] It should be noted that when the first surface 101 is perpendicular to the third coordinate axis, moving the second measuring component along a direction perpendicular to the first surface 101 to align the second measuring component with the first measurement position A includes: moving the second measuring head 121 relative to the object 100 along the third coordinate axis to align the second measuring head 121 with the first measurement position A. When the first surface 101 and the third coordinate axis have an acute angle, the third measuring stage enables the second measuring head 121 to move relative to the object 100 along a direction perpendicular to the first surface 101 to align the second measuring head 121 with the first measurement position A. Because the first surface 101 and the third coordinate axis have an acute angle, the relative movement of the second measuring component and the object 100 along the third coordinate axis results in a relative movement component between the second measuring component and the object 100 along a direction perpendicular to the first surface 101. Therefore, this is also within the scope of protection of this application.

[0172] Specifically, in this embodiment, the extension direction of the hole 103, the first measurement method, and the third coordinate axis are all parallel and perpendicular to the first surface 101.

[0173] The second and subsequent steps of measuring the first position A according to the first position coordinates include: rotating the second measuring component relative to the object 100 about an axis perpendicular to the first surface 101 until the second measuring component is aligned with the first position A. Specifically, in this embodiment, the second measuring head 121 is rotated relative to the object 100 about an axis perpendicular to the first surface 101 until the second measuring component is aligned with another first position A.

[0174] In this embodiment, the angle between the second measuring component and the object to be measured 100 rotating relative to each other about an axis perpendicular to the first surface 101 is 15° to 90°, and a measurement is performed on the first position to be measured, A. The extension direction of the hole 103 is perpendicular to the first surface 101.

[0175] The measurement method further includes: fitting the cross-sectional shape of the sidewall 104 to be measured according to multiple first measurement coordinates to obtain a fitting curve; and obtaining the cross-sectional size or shape of the sidewall 104 to be measured according to the fitting curve. In this embodiment, the measurement method further includes: obtaining the cross-sectional size or shape of the hole 103 at a first preset distance according to the first measurement coordinates of multiple first measurement positions A; and obtaining the hole 103 according to the second measurement coordinates of the second measurement position.

[0176] Specifically, based on the measurement coordinates of multiple first measurement positions, the size or shape of the hole 103 at a first preset distance is obtained, including: fitting the measurement coordinates of multiple first measurement positions A to obtain a fitting curve of the sidewall of the hole 103 at a distance of the first preset distance from the first surface 101; and obtaining the size or shape of the hole 103 at the first preset distance based on the fitting curve.

[0177] The measurement method of the present invention further includes: step S06, obtaining the second position coordinates of the second position to be measured in the measurement coordinate system according to the second position relationship between the second position to be measured on the sidewall to be measured and the second reference position relationship on the second surface, wherein the relative position relationship between the second position coordinates and the second reference surface is the same as the second reference position relationship; step S07, causing the second measuring component to measure the second position to be measured according to the second position coordinates, thereby obtaining the coordinates of the second position to be measured along the direction to be measured, wherein the direction to be measured is parallel to the second reference surface or the direction to be measured has an acute angle with the second reference surface.

[0178] In this embodiment, the step of obtaining the second position coordinates is the same as the step of obtaining the first position coordinates, and will not be described again here. The step of having the second measuring component measure the second position to be measured based on the second position coordinates is the same as the step of having the second measuring component measure the first position to be measured based on the first position coordinates, and will not be described again here.

[0179] It should be noted that the second measuring component for measuring the first and second test positions can be the same measuring component or different measuring components.

[0180] In other embodiments of the present invention, the size of the hole 103 at a first preset distance is obtained based on the measurement coordinates of a plurality of first measurement positions, including: obtaining the measurement coordinates of two first measurement positions A at a first preset distance where the difference in rotation relative to the central axis of the hole 103 is 180°, and obtaining the edge coordinates; and obtaining the size of the hole 103 at the first preset distance based on the difference between the two edge coordinates.

[0181] Figure 1 The illustrated embodiment uses the first device coordinate system as the measurement coordinate system as an example for explanation. This application also provides a second embodiment of the measurement method.

[0182] The similarities between the second embodiment and the first embodiment of the present invention will not be repeated here, but the differences include:

[0183] The plurality of second device coordinate systems includes a reference coordinate system, and the measurement coordinate system and the reference coordinate system have a second preset transformation relationship; the transformation of the first device coordinate system to the measurement coordinate system includes:

[0184] A first standard object is provided, the first standard object including a plurality of first feature points and a plurality of second feature points, the first feature points and the second feature points having a first preset positional relationship;

[0185] The first measurement component measures multiple first feature points to obtain the first feature coordinates of each first feature point in the first device coordinate system.

[0186] The second measurement component measures multiple second feature points to obtain the second feature coordinates of each second feature point in the reference coordinate system. The second feature coordinates are then transformed to the measurement coordinate system using a second preset transformation relationship to obtain the second transformed coordinates.

[0187] Based on the second preset positional relationship between the first feature point and the second feature point, and the first preset transformation relationship, a first transformation relationship between the first device coordinate system and the measurement coordinate system is obtained. Based on the first transformation relationship, the first feature coordinates are transformed to coordinates in the measurement coordinate system as the first transformed coordinates. The positional relationship between the first transformed coordinates and the second feature coordinates is the same as the second preset positional relationship.

[0188] The second device coordinate system and the measurement coordinate system have a second preset transformation relationship, that is, the transformation relationship between the second device coordinate system and the measurement coordinate system is a known value. Specifically, in one embodiment, the second preset transformation relationship is E, and the second device coordinate system is the measurement coordinate system. Transforming the first device coordinate system to the measurement coordinate system means transforming the first device coordinate system to the second device coordinate system, so that the coordinates measured in the first device coordinate system are the same as the coordinates measured in the second device coordinate system after transformation by the second transformation relationship.

[0189] When the test object 100 and the second measuring component are in different relative positions and have different second device coordinate systems, there is a reference coordinate system among the plurality of second device coordinate systems, and the measuring coordinate system and the reference coordinate system have a second preset transformation relationship; unifying the first device coordinates to the measuring coordinate system includes: there is a reference coordinate system among the plurality of second device coordinate systems, and other second device coordinate systems other than the reference coordinate system are coordinate systems to be transformed.

[0190] The measurement coordinate system and the reference coordinate system have a second preset transformation relationship; unifying each second device coordinate system to the measurement coordinate system includes:

[0191] A second standard object is provided, the second standard object including a second feature point and a third feature point, and each third feature point has a second preset position with respect to the second feature point;

[0192] The second feature point in the reference coordinate system is measured by the second measurement component to obtain the reference coordinates of the second feature point in the reference coordinate system. The reference coordinates are then transformed to the coordinates of the measurement coordinate system according to the second preset transformation relationship to obtain the second transformed coordinates.

[0193] The third feature point in the coordinate system to be transformed is measured by the second measuring component to obtain the third feature coordinates of the third feature point; the measurement process includes: adjusting the relative position of the second standard object and the second measuring component so that the second measuring component is aligned with the third feature point, and the second standard object is located in one of the coordinate systems to be transformed by the second measuring component; after adjusting the relative position of the second standard object and the second measuring component, the third feature coordinates of the third feature point in the coordinate system to be transformed are obtained by the second measuring component.

[0194] After the measurement process, the third feature coordinates of the third feature point, the reference coordinates, and the third preset transformation relationship between the coordinate system to be transformed and the reference coordinate system are calculated to obtain the third transformation relationship between the coordinate system to be transformed and the measurement coordinate system. The third feature coordinates are transformed to the coordinates in the measurement coordinate system according to the third transformation relationship to obtain the third transformed coordinates. The positional relationship between the third transformed coordinates and the second transformed coordinates is the same as the third preset positional relationship.

[0195] Repeat the measurement and calculation steps to obtain the third transformation relationship of each coordinate system to be transformed, so as to unify each coordinate system to be transformed into the measurement coordinate system.

[0196] The second standard object includes multiple faces, with non-zero included angles between adjacent faces; the second feature point and the third feature point are located on different faces of the second standard object; the face containing the second feature point is perpendicular to the face containing the third feature point. If the second standard object includes multiple sets of third feature points, these sets of third feature points are located on different reference faces; each set of reference faces containing third feature points is perpendicular to the face containing the first feature point.

[0197] The first and second standard objects may be the same or different. In this embodiment, the first and second standard objects are the same standard object.

[0198] Among the plurality of second device coordinate systems, there is a reference coordinate system, and the other second device coordinate systems other than the reference coordinate system are the coordinate systems to be transformed.

[0199] The present invention also provides a measurement system, including a processing system, wherein the measurement system is used to execute any one of the measurement methods in the above embodiments. Specifically, the processing system includes:

[0200] The input module includes providing a test object 100, the test object 100 including a first surface 101 and a test sidewall 104, the first surface 101 and the test sidewall 104 having a first reference position relationship, the first reference position relationship including a non-zero included angle between the test sidewall 104 and the first surface 101.

[0201] The input module can be a mechanical feeding system or a manual one.

[0202] The first reference surface acquisition module is used to measure the first surface 101 through the first measurement component 110, and obtain the coordinates of the first surface 101 in the measurement coordinate system to obtain the first reference surface;

[0203] The coordinate measuring head is used to obtain the first position coordinates of the first position A in the measuring coordinate system based on the first position A of the side wall 104 to be measured and the first reference position relationship of the first reference position relationship. The relative position relationship between the first position coordinates and the first reference surface is the same as the first reference position relationship.

[0204] The control module is used to enable the second measuring component to measure the first position A to be measured according to the first position coordinates, and to obtain the measurement coordinates of the first position A to be measured along the direction to be measured, wherein the direction to be measured is parallel to the first reference plane or the direction to be measured has an acute angle with the first reference plane.

[0205] The first measuring component 110 has a first device coordinate system; the second measuring component has a second device coordinate system.

[0206] Before measuring the first surface 101 using the measuring device, the processing system further includes: a first calibration module, used to align the first device coordinate system to the measurement coordinate system and align the second device coordinate system to the measurement coordinate system.

[0207] In this embodiment, the test object 100 and the second measuring component, which are in different relative positions, have different second device coordinate systems.

[0208] The processing system further includes a second calibration module, used to obtain the second transformation relationship between the second device coordinate system and the measurement coordinate system at each relative position, and to align each second device coordinate system to the measurement coordinate system.

[0209] The measurement coordinate system has a first preset transformation relationship with the first device coordinate system; the second device coordinates are unified into the measurement coordinate system. Specifically, the first calibration module is used to: provide a first standard object 200, which includes multiple first feature points 201 and multiple second feature points 202, the first feature points 201 and second feature points 202 having a first preset positional relationship; measure the multiple first feature points 201 using the first measurement component 110 to obtain the first feature coordinates of each first feature point 201 in the first device coordinate system; and transform the first feature coordinates to the measurement coordinate system using the first preset transformation relationship to obtain the coordinates of the first feature point 201. First, coordinate transformation is performed. Multiple second feature points 202 are measured using a second measuring component to obtain the second feature coordinates of each second feature point 202 in the second device coordinate system. Based on the first feature coordinates, the second feature coordinates, the first preset positional relationship between the multiple first feature points 201 and the multiple second feature points 202, and the first preset transformation relationship, a second transformation relationship between the second device coordinate system and the measurement coordinate system is obtained. The second transformation relationship is used to transform the second feature coordinates to the measurement coordinate system, resulting in the second transformed coordinates. The positional relationship between the first transformed coordinates and the second transformed coordinates is the same as the first preset positional relationship.

[0210] The second preset positional relationship includes: multiple first feature points 201 are coplanar, multiple second feature points 202 are coplanar, and the plane containing the multiple first feature points 201 is perpendicular to the plane containing the multiple second feature points 202; the first preset transformation relationship is that the measurement coordinate system is the same as the first device coordinate system.

[0211] In another embodiment of the present invention, the plurality of second device coordinate systems include a reference coordinate system, and the measurement coordinate system and the reference coordinate system have a second preset transformation relationship; the first device coordinate system is integrated into the measurement coordinate system, and the first calibration module is specifically used to: provide a first standard object 200, the first standard object 200 including a plurality of first feature points 201 and a plurality of second feature points 202, the first feature points 201 and the second feature points 202 having a first preset positional relationship; measure the plurality of first feature points 201 through the first measurement component 110 to obtain the first feature coordinates of each first feature point 201 in the first device coordinate system; and through the second... The measurement component measures multiple second feature points 202, obtains the second feature coordinates of each second feature point 202 in the reference coordinate system, and transforms the second feature coordinates to the coordinates in the measurement coordinate system through a second preset transformation relationship to obtain the second transformed coordinates; according to the first preset positional relationship between the first feature point 201 and the second feature point 202, and the second preset transformation relationship, the first transformation relationship between the first device coordinate system and the measurement coordinate system is obtained, and the first feature coordinates are transformed to the coordinates in the measurement coordinate system according to the first transformation relationship to obtain the first transformed coordinates, and the positional relationship between the first transformed coordinates and the second transformed coordinates is the same as the first preset positional relationship.

[0212] Among the plurality of second device coordinate systems, there is a reference coordinate system, and the other second device coordinate systems other than the reference coordinate system are coordinate systems to be transformed.

[0213] The measurement coordinate system and the reference coordinate system have a second preset transformation relationship; to unify each second device coordinate system into the measurement coordinate system, including: providing a second standard object, the second standard object including a second feature point and a third feature point, the third feature point and the second feature point having a second preset positional relationship; measuring the second feature point in the reference coordinate system through a second measurement component to obtain the reference coordinates of the second feature point in the reference coordinate system, and transforming the reference coordinates to the coordinates in the measurement coordinate system according to the second preset transformation relationship as the second transformed coordinates;

[0214] The third feature point 202 in the coordinate system to be transformed is measured by the second measuring component to obtain the third coordinate of the third feature point. The measurement process includes: adjusting the relative position of the second standard object and the second measuring component so that the second measuring component is aligned with the third feature point, and the second standard object is in one of the coordinate systems to be transformed by the second measuring component; after adjusting the relative position of the second standard object and the second measuring component, the second feature point 202 is detected by the second measuring component in the coordinate system to be transformed; after the measurement process, the third feature coordinate of the third feature point, the reference coordinate, and the third preset transformation relationship between the coordinate system to be transformed and the reference coordinate system are calculated to obtain the third transformation relationship between the coordinate system to be transformed and the measurement coordinate system, and the third feature coordinate is transformed to the coordinates in the measurement coordinate system according to the third transformation relationship to obtain the third transformation coordinate; the measurement process and calculation process are repeated to obtain the third transformation relationship of each coordinate system to be transformed so as to unify each coordinate system to be transformed into the measurement coordinate system.

[0215] In this embodiment, the first standard object 200 includes multiple reference surfaces, and adjacent reference surfaces have non-zero included angles; the first feature point 201 and the second feature point 202 are respectively located on different reference surfaces of the first standard object 200; the reference surface where the first feature point 201 is located is perpendicular to the reference surface where the second feature point 202 is located; when the first standard object 200 includes multiple sets of second feature points 202, the multiple sets of second feature points 202 are located on different reference surfaces; the reference surface where each set of second feature points 202 is located is perpendicular to the reference surface where the first feature point 201 is located.

[0216] The first measuring component 110 has a first optical axis and is used to measure the coordinates of the position to be measured along the direction of the first optical axis; the first optical axis is perpendicular to the first surface 101; the second measuring component has a second optical axis and is used to measure the coordinates of the position to be measured along the direction of the second optical axis; the direction to be measured is parallel to the second optical axis; the second optical axis is perpendicular to the first optical axis.

[0217] The test object 100 also includes a second surface 102 opposite to the first surface 101. The second surface 102 and the test sidewall 104 have a second reference position relationship. The second reference position relationship includes a non-zero included angle between the test sidewall 104 and the second surface 102.

[0218] The measurement system further includes: a second reference plane acquisition module, used to measure the second surface 102 through a third measurement component to obtain the coordinates of the second surface 102 in the measurement coordinate system to obtain the second reference plane; based on the second position B of the side wall to be measured 104 and the second reference position relationship of the second surface, to obtain the second position coordinates of the second position B in the measurement coordinate system, the relative position relationship between the second position coordinates and the second reference plane is the same as the second reference position relationship; and to cause the second measurement component to measure the second position B according to the second position coordinates to obtain the coordinates of the second position B along the measurement direction, the measurement direction being parallel to the second reference plane or having an acute angle with the second reference plane.

[0219] The measuring device further includes a third measuring component 130, which has a third optical axis and a third device coordinate system. The third measuring component 130 is used to measure the coordinates of the reference point of the second surface 102 along the direction of the third optical axis. The third optical axis of the third measuring component 130 is parallel to the optical axis of the first measuring component 110, and the light emission direction of the third measuring component 130 is opposite to the light emission direction of the first measuring component 110. Before measuring the third surface through the third measuring component 130, the processing system further includes a third calibration module for aligning the third device coordinate system to the measuring coordinate system.

[0220] The third calibration module is specifically used to: unify the coordinates perpendicular to the third optical axis in the third equipment coordinate system to the measurement coordinate system; and unify the coordinates parallel to the third optical axis in the third equipment coordinate system to the measurement coordinate system.

[0221] The third calibration system is used to unify the coordinates perpendicular to the third optical axis in the third device coordinate system to the measurement coordinate system. Specifically, the third calibration system is used to move the third measurement component 130 and the first measurement component 110 in a direction perpendicular to the third optical axis so that the third optical axis coincides with the first optical axis.

[0222] The measurement coordinate system has a third preset transformation relationship with the first device coordinate system; the coordinates parallel to the third optical axis in the third device coordinate system are unified to the measurement coordinate system. The third calibration system is specifically used for: providing a third standard object, the third standard object including a first standard surface and a second standard surface that are parallel to each other, and the thickness between the first standard surface and the second standard surface is a preset thickness; measuring the first standard surface using the first measurement component to obtain the coordinates of the first standard surface in the first device coordinate system to obtain a first measurement surface; transforming the first measurement surface to the measurement coordinate system according to the first preset transformation relationship to obtain a first transformed surface; measuring the second standard surface using the third measurement component to obtain the coordinates of the second standard surface in the third device coordinate system to obtain a second measurement surface; obtaining a sub-transformation relationship of the third device coordinate system along the third optical axis according to the first measurement surface, the second measurement surface, and the first preset transformation relationship; compensating the second measurement surface using the sub-transformation relationship to obtain a compensated surface; the distance between the compensated surface and the first transformed surface is equal to the preset thickness.

[0223] The sidewall 104 to be tested includes multiple test locations; the processing system further includes a division module, which is used to: designate test locations whose distance from the first surface 101 is less than or equal to a preset threshold as first test locations A, and designate test locations whose distance from the first surface 101 is greater than the preset threshold as second test locations B.

[0224] The sidewall 104 to be tested has multiple first test positions A that are at the same vertical distance from the first surface 101.

[0225] The steps described above are used to repeatedly obtain the coordinates of the first test position A along the test direction based on the first test position A of the test sidewall 104 and the first reference position relationship of the first surface 101, and to make the second measuring component measure the first test position A according to the first position coordinates, so as to obtain the measurement coordinates of multiple first test positions A along the test direction.

[0226] In the first execution of the step of having the second measuring component measure the first position A according to the first position coordinates, the coordinate measuring head is specifically used to: move the second measuring component along a direction perpendicular to the first surface 101 to align with the plane where the plurality of first positions A are located; rotate the second measuring component and the object to be measured 100 relative to each other about an axis perpendicular to the first surface 101 until the second measuring component is aligned with the first position A;

[0227] In the second and subsequent steps of having the second measuring component measure the first position A according to the first position coordinates, the coordinate measuring head is specifically used to: rotate the second measuring component and the object to be measured 100 relative to each other about an axis perpendicular to the first surface 101, until the second measuring component is aligned with another first position A.

[0228] The object to be tested 100 has a hole 103, and the sidewall to be tested 104 is the sidewall of the hole 103; the extending direction of the hole 103 is perpendicular to the first surface 101;

[0229] The processing system further includes a data acquisition module, used to fit the cross-sectional shape of the sidewall 104 to be measured according to multiple first measurement coordinates, obtain a fitting curve, and obtain the cross-sectional size or shape of the sidewall 104 to be measured according to the fitting curve.

[0230] The first reference acquisition module is specifically used to: measure multiple first reference points of the first surface 101 of the object under test 100 using the first measurement component 110, and obtain the coordinates of each first reference point in the measurement coordinate system; and fit the first surface 101 according to the first reference point coordinates of the multiple first reference points to obtain the coordinates of the first surface 101 in the measurement coordinate system to obtain the first reference surface.

[0231] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A measurement method, characterized in that, include: A test object is provided, the test object including a first surface and a sidewall to be tested, the first surface and the sidewall to be tested having a first reference positional relationship, the first reference positional relationship including a non-zero included angle between the sidewall to be tested and the first surface; The first surface is measured by the first measuring component to obtain the coordinates of the first surface in the measuring coordinate system, thereby obtaining the first reference surface; Based on the relationship between the first test position of the sidewall to be tested and the first reference position of the first surface, the first position coordinates of the first test position in the measurement coordinate system are obtained, and the relative position relationship between the first position coordinates and the first reference surface is the same as the first reference position relationship. The second measuring component measures the first position to be measured based on the first position coordinates, and obtains the measurement coordinates of the first position to be measured along the direction to be measured, wherein the direction to be measured is parallel to the first reference plane or the direction to be measured has an acute angle with the first reference plane.

2. The measurement method as described in claim 1, characterized in that, The first measuring component has a first device coordinate system; the second measuring component has a second device coordinate system. Before measuring the first surface using the first measuring component, the measurement method further includes: aligning the first device coordinate system to the measurement coordinate system; and aligning the second device coordinate system to the measurement coordinate system.

3. The measurement method as described in claim 1, characterized in that, The object under test and the second measuring component, which are in different relative positions, have different second device coordinate systems; The measurement method further includes: obtaining the second transformation relationship between the second device coordinate system and the measurement coordinate system at each relative position, and unifying each second device coordinate system to the measurement coordinate system.

4. The measurement method as described in claim 2 or 3, characterized in that, The measurement coordinate system and the first device coordinate system have a first preset transformation relationship; Unify the coordinates of the second device to the measurement coordinate system, including: A first standard object is provided, the first standard object including a plurality of first feature points and a plurality of second feature points, the first feature points and the second feature points having a first preset positional relationship; The first measurement component measures multiple first feature points to obtain the first feature coordinates of each first feature point in the first device coordinate system. The first feature coordinates are then transformed to the measurement coordinate system using a first preset transformation relationship to obtain the first transformed coordinates. The second measurement component measures multiple second feature points to obtain the second feature coordinates of each second feature point in the second device coordinate system. Based on the first feature coordinates, the second feature coordinates, the first preset positional relationship between the plurality of first feature points and the plurality of second feature points, and the first preset transformation relationship, a second transformation relationship between the second device coordinate system and the measurement coordinate system is obtained. The second transformation relationship is used to transform the second feature coordinates to the measurement coordinate system, which are then used as the second transformed coordinates. The positional relationship between the first transformed coordinates and the second transformed coordinates is the same as the first preset positional relationship.

5. The measurement method as described in claim 4, characterized in that, The first preset positional relationship includes: multiple first feature points are coplanar, multiple second feature points are coplanar, and the plane containing the multiple first feature points is perpendicular to the plane containing the multiple second feature points; the first preset transformation relationship is that the measurement coordinate system is the same as the first device coordinate system.

6. The measurement method as described in claim 3, characterized in that, The different second device coordinate systems each have a reference coordinate system, and the measurement coordinate system and the reference coordinate system have a second preset transformation relationship; To align the first device coordinate system with the measurement coordinate system, including: A first standard object is provided, the first standard object including a plurality of first feature points and a plurality of second feature points, the first feature points and the second feature points having a first preset positional relationship; The first measurement component measures multiple first feature points to obtain the first feature coordinates of each first feature point in the first device coordinate system. The second measurement component measures multiple second feature points to obtain the second feature coordinates of each second feature point in the reference coordinate system. The second feature coordinates are then transformed to the measurement coordinate system using a second preset transformation relationship to obtain the second transformed coordinates. Based on the first preset positional relationship between the first feature point and the second feature point, and the second preset transformation relationship, a first transformation relationship between the first device coordinate system and the measurement coordinate system is obtained. Based on the first transformation relationship, the coordinates of the first feature point are transformed to the coordinates in the measurement coordinate system as the first transformed coordinates. The positional relationship between the first transformed coordinates and the second transformed coordinates is the same as the first preset positional relationship.

7. The measurement method as described in claim 6, characterized in that, Among the plurality of second device coordinate systems, there is a reference coordinate system, and the other second device coordinate systems other than the reference coordinate system are coordinate systems to be transformed. The measurement coordinate system and the reference coordinate system have a second preset transformation relationship; Allocate the coordinate systems of each second device to the measurement coordinate system, including: A second standard object is provided, the second standard object including a second feature point and a third feature point, and each third feature point has a second preset positional relationship with each second feature point; The second feature point in the reference coordinate system is measured by the second measurement component to obtain the reference coordinates of the second feature point in the reference coordinate system. The reference coordinates are then transformed to the coordinates of the measurement coordinate system according to the second preset transformation relationship to obtain the second transformed coordinates. The third feature point is measured using the second measuring component in the coordinate system to be transformed, and the third feature coordinates of the third feature point are obtained. The measurement process includes: adjusting the relative position of the second standard object and the second measuring component so that the second measuring component is aligned with the third feature point, and the second standard object is located in one of the coordinate systems to be transformed by the second measuring component; after adjusting the relative position of the second standard object and the second measuring component, the third feature coordinates of the third feature point in the coordinate system to be transformed are obtained using the second measuring component. After the measurement process, the third feature coordinates of the third feature point, the reference coordinates, and the third preset transformation relationship between the coordinate system to be transformed and the reference coordinate system are calculated to obtain the third transformation relationship between the coordinate system to be transformed and the measurement coordinate system. The third feature coordinates are transformed to the coordinates in the measurement coordinate system according to the third transformation relationship to obtain the third transformed coordinates. The positional relationship between the third transformed coordinates and the second transformed coordinates is the same as the third preset positional relationship. Repeat the measurement and calculation steps to obtain the third transformation relationship of each coordinate system to be transformed, so as to unify each coordinate system to be transformed into the measurement coordinate system.

8. The measurement method as described in claim 7, characterized in that, The first standard object is the same as the second standard object. The first standard object includes multiple reference surfaces, and adjacent reference surfaces have non-zero included angles. The first feature point and the second feature point are located on different reference surfaces of the first standard object. The reference surface where the first feature point is located is perpendicular to the reference surface where the second feature point is located. When the first standard object includes multiple sets of second feature points, the multiple sets of second feature points are located on different reference planes; the reference plane where each set of second feature points is located is perpendicular to the reference plane where the first feature point is located.

9. The measurement method as described in claim 1, characterized in that, The first measuring component has a first optical axis, and the first measuring component is used to measure the coordinates of the first position to be measured along the direction of the first optical axis; the first optical axis is perpendicular to the first surface; The second measuring component has a second optical axis and is used to measure the coordinates of the first position to be measured along the direction of the second optical axis; the direction to be measured is parallel to the second optical axis. The second optical axis is perpendicular to the first optical axis.

10. The measurement method as described in claim 1, characterized in that, The object to be tested further includes a second surface, and the second surface and the sidewall to be tested have a second reference positional relationship, the second reference positional relationship including that the sidewall to be tested and the second surface have a non-zero included angle; The measurement method further includes: measuring the second surface using a third measurement component to obtain the coordinates of the second surface in the measurement coordinate system to obtain a second reference surface; Based on the relationship between the second measured position of the sidewall to be measured and the second reference position of the second surface, the second position coordinates of the second measured position in the measurement coordinate system are obtained, and the relative position relationship between the second position coordinates and the second reference surface is the same as the second reference position relationship. The second measuring component measures the second position to be measured based on the second position coordinates to obtain the coordinates of the second position to be measured along the direction to be measured, wherein the direction to be measured is parallel to the second reference plane or the direction to be measured has an acute angle with the second reference plane.

11. The measurement method as described in claim 10, characterized in that, The second surface is disposed opposite to the first surface, and the third measuring component has a third optical axis and a third device coordinate system; the third measuring component is used to measure the coordinates of the reference point of the second surface along the direction of the third optical axis; The third optical axis of the third measuring component is parallel to the first optical axis of the first measuring component, and the light emission direction of the third measuring component is opposite to the light emission direction of the first measuring component. Before measuring the second surface using the third measuring component, the measurement method further includes: aligning the third device coordinate system to the measurement coordinate system; The process of unifying the third device coordinate system to the measurement coordinate system includes: unifying the coordinates perpendicular to the third optical axis in the third device coordinate system to the measurement coordinate system; and unifying the coordinates parallel to the third optical axis in the third device coordinate system to the measurement coordinate system.

12. The measurement method as described in claim 11, characterized in that, Unifying the coordinates perpendicular to the third optical axis in the third device coordinate system to the measurement coordinate system includes: The third measuring component is moved relative to the first measuring component in a direction perpendicular to the third optical axis, so that the third optical axis coincides with the first optical axis.

13. The measurement method as described in claim 11, characterized in that, The measurement coordinate system and the first equipment coordinate system have a third preset transformation relationship; Unifying the coordinates parallel to the third optical axis in the third device coordinate system to the measurement coordinate system includes: A third standard object is provided, the third standard object including a first standard surface and a second standard surface that are opposite each other, the first standard surface and the second standard surface are parallel, and the thickness between the first standard surface and the second standard surface is a preset thickness; The first standard surface is measured by the first measuring component to obtain the coordinates of the first standard surface in the first device coordinate system, and the first measuring surface is obtained by transforming the first measuring surface to the measuring coordinate system according to the first preset transformation relationship to obtain the first transformed surface; The second standard surface is measured by the third measuring component to obtain the coordinates of the second standard surface in the three-device coordinate system, thus obtaining the second measuring surface; Based on the first measurement surface, the second measurement surface, and the first preset transformation relationship, the sub-transformation relationship of the third device coordinate system along the third optical axis is obtained. The second measurement surface is compensated by the sub-transformation relationship to obtain the compensation surface. The distance between the compensation surface and the first transformation surface is equal to the preset thickness.

14. The measurement method as described in claim 10, characterized in that, The sidewall to be measured includes multiple locations to be measured; the measurement method further includes: The test position whose distance from the first surface is less than or equal to a preset threshold is designated as the first test position; the test position whose distance from the first surface is greater than the preset threshold is designated as the second test position.

15. The measurement method as described in claim 1, characterized in that, The sidewall to be tested has multiple first test locations; The measurement method further includes: repeatedly obtaining the coordinates of the first test position along the test direction based on the first test position of the sidewall to be measured and the first reference position relationship of the first surface, and causing the second measurement component to measure the first test position according to the first position coordinates, so as to obtain the measurement coordinates of multiple first test positions along the test direction.

16. The measurement method as described in claim 15, characterized in that, The sidewall to be tested has multiple first test positions that are at the same vertical distance from the first surface; The first execution of the step of causing the second measuring component to measure the first position to be measured according to the first position coordinates includes: moving the second measuring component along a direction perpendicular to the first surface to align with the plane where the plurality of first positions to be measured are located; rotating the second measuring component relative to the object to be measured about an axis perpendicular to the first surface until the second measuring component is aligned with the first position to be measured. The second and subsequent steps of having the second measuring component measure the first position to be measured according to the first position coordinates include: rotating the second measuring component relative to the object to be measured about an axis perpendicular to the first surface until the second measuring component is aligned with another first position to be measured.

17. The measurement method as described in claim 15, characterized in that, The object to be tested has a hole, and the sidewall to be tested is the sidewall of the hole; the extension direction of the hole is perpendicular to the first surface; The measurement method further includes: fitting the cross-sectional shape of the sidewall to be measured according to multiple measurement coordinates to obtain a fitting curve; and obtaining the cross-sectional size or shape of the sidewall to be measured according to the fitting curve.

18. The measurement method as described in claim 1, characterized in that, The first reference surface is obtained by measuring the first surface using the first measuring component and obtaining the coordinates of the first surface in the measuring coordinate system, including: The first measuring component measures multiple first reference points on the first surface of the object to be measured, and obtains the coordinates of each first reference point in the measuring coordinate system. Based on the coordinates of multiple first reference points, the first surface is fitted to obtain the coordinates of the first surface in the measurement coordinate system, thus obtaining the first reference surface.

19. A measurement system, characterized in that, include: A processing system for performing the measurement method according to any one of claims 1 to 18.

20. A measuring device, comprising a first measuring component, a second measuring component, and a third measuring component; and the measuring system of claim 19.

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