A packaging device for a crimping diode

Abstract

This application provides a packaging device for a press-fit diode, comprising: a platform assembly including a base plate, a support, and a base; a pressing assembly including a pressing sleeve, an upper pressing sleeve, a pressing pad, a pressing head, a connecting rod, a sensor assembly, a pressing screw, an upper flange, a spring seat, and a spring; and a pressurizing assembly including a support frame, a rotating shaft, a pressing rod, and an actuator. The packaging device only requires the application of mechanical pressure to cause plastic deformation of the diode metal, forming an integrated metal structure, enabling internal press-fit packaging. No thermal or electrical stress is required during the packaging process, reducing product weight, improving the diode's junction temperature and heat dissipation, and enhancing product reliability. Compared to traditional welding techniques, it reduces failure modes such as weld voids and solder melting caused by high-temperature welding, and reduces the use of solder and solder paste, further reducing product weight.

Description

Technical Field

[0001] This application belongs to the field of semiconductor component packaging, and specifically relates to a packaging device for a pressure-fit diode. Background Technology

[0002] In diode packaging, welding or crimping processes are commonly used. Diodes manufactured using welding are prone to failure due to high-temperature welding, resulting in weld voids, solder melting, and other defects. Furthermore, welding consumes additional raw materials such as solder and solder paste. Therefore, crimping is increasingly used in current technology to produce diodes. When crimping diodes, upper and lower dies are typically used to apply pressure to the diode's metal structure. However, the pressure value is unstable during crimping, easily leading to excessive or insufficient pressure, resulting in defective diodes. Additionally, concentricity can easily deviate during crimping, causing assembly errors. Summary of the Invention

[0003] The purpose of this application is to provide a packaging device for a press-fit diode to solve or mitigate at least one of the problems in the prior art.

[0004] The technical solution of this application is: a packaging device for a pressure-fit diode, comprising:

[0005] A stand assembly, comprising a base plate, a support, and a base, wherein the base plate forms a supporting plane, the support is fixed to the base plate, and the base is fixed to the base plate inside the support.

[0006] The pressing assembly includes: a lower pressing sleeve, an upper pressing sleeve, a pressure pad, a pressure head, a connecting rod, a sensor assembly, a pressing screw, an upper flange 1, a spring seat, and a spring. A diode is disposed between the lower and upper pressing sleeves. The pressure head passes through the upper pressing sleeve and presses against the diode. The upper flange 1 and the spring seat are joined to form a tubular cavity. The upper flange is located on the upper side of the support, and the spring seat is located on the inner side of the support, both fixed to the support. The sensor assembly is disposed within the tubular cavity, and the spring is disposed between the sensor assembly and the spring seat. The pressing screw is disposed on the upper side of the sensor assembly and threadedly engages with the upper flange. By rotating the pressing screw, the downward pressure is sequentially transmitted through the sensor assembly, the connecting rod, and the pressure head to the diode between the upper and lower pressing sleeves.

[0007] A pressurizing assembly includes a support frame, a rotating shaft, a pressure rod, and an actuator. The support frame is mounted on a bracket, and the rotating shaft passes through the lower end of the support frame and is mounted on the side wall of the bracket. The pressure rod is rotatably mounted on the rotating shaft, with one end extending to the pressure pad and the other end extending to the actuator. By controlling the actuator, the pressure rod can provide downward pressure to the pressure pad, thereby transmitting it to the diode.

[0008] Furthermore, the support has a zigzag structure.

[0009] Furthermore, the platform assembly also includes feet mounted at the corners of the underside of the base plate for supporting the base plate.

[0010] Furthermore, the pressing screw is provided with a locking nut for limiting and locking the pressing screw.

[0011] Furthermore, the sensor assembly is equipped with a pressure display device for displaying the pressure value measured by the sensor assembly.

[0012] Furthermore, the pressure display device is fixedly mounted on the base plate.

[0013] Furthermore, both ends of the rotating shaft are mounted on the side wall of the bracket via connectors, and a gasket is provided between the connector and the side wall of the bracket to prevent the connector from rubbing against the bracket.

[0014] Furthermore, the actuator is a hydraulic actuator, which is equipped with a hydraulic pump. The hydraulic pump is mounted on the base plate 11 and connected to the actuator through a pipeline.

[0015] Furthermore, a pressure gauge is provided between the hydraulic pump and the actuator to monitor the pressure supplied by the hydraulic pump to the actuator.

[0016] The compression diode packaging device provided in this application only requires the application of mechanical pressure to cause plastic deformation of the diode metal, forming an integrated metal structure. This enables internal compression packaging, eliminating the need for thermal and electrical stress during the packaging process. This reduces product weight, improves the junction temperature and heat dissipation of the diode, and enhances product reliability. Compared to traditional welding techniques, it reduces failure modes such as weld voids and solder melting caused by high-temperature welding, and reduces the use of solder and solder paste, further reducing product weight. By adding sensor components and a pressure display device, the pressure value during diode compression can be better controlled, avoiding diode product defects caused by excessive or insufficient pressure. Attached Figure Description

[0017] To more clearly illustrate the technical solutions provided in this application, the accompanying drawings will be briefly described below. Obviously, the drawings described below are merely some embodiments of this application.

[0018] Figure 1 This is a schematic diagram of the overall packaging device for the pressure-fit diode provided in this application.

[0019] Figure 2 This is a cross-sectional view of the packaging device for the pressure-fit diode provided in this application.

[0020] Figure 3 Rear view of the packaging device for the pressure-coupled diode improved in this application.

[0021] Figure label:

[0022] 10- Bench Components

[0023] 11-Base Plate

[0024] 12-Staff

[0025] 13-Base

[0026] 14-Bottom

[0027] 20-Downward assembly

[0028] 21-Lower pressure sleeve

[0029] 22-Upper pressure sleeve

[0030] 23-Pad

[0031] 24-pressure head

[0032] 25-Connecting rod

[0033] 26-Sensor Assembly

[0034] 261-Pressure display device

[0035] 27-Pressing Screw

[0036] 271-Locking Nut

[0037] 281-Upper Flange

[0038] 282-Spring seat

[0039] 29-Spring

[0040] 30-Pressure Component

[0041] 31-Support Frame

[0042] 32-shaft

[0043] 33-Compression bar

[0044] 34-Actuator

[0045] 35-Hydraulic pump Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings.

[0047] To overcome the shortcomings of existing diode packaging processes, this application provides a press-fit diode packaging device. This packaging device only requires the application of mechanical pressure to cause plastic deformation of the diode metal, forming an integrated metal structure. No thermal or electrical stress is required during the packaging process, which can reduce product weight, improve the junction temperature and heat dissipation of the diode, and enhance product reliability.

[0048] like Figure 1 As shown, the pressure-fit diode packaging device provided in this application includes: a test bench assembly 10, a pressure-down assembly 20, and a pressure-applying assembly 30.

[0049] The test bench assembly 10 includes a base plate 11, a support 12, and a base 13. The base plate 11 forms a supporting plane, the support 12 is shaped like a zigzag and is fixed to the base plate 11, and the base 13 is mounted on the base plate 11 inside the support 12. Furthermore, the test bench assembly 10 also includes feet 14, which are located at the four corners of the base plate 11 to support the base plate 11.

[0050] like Figure 2 As shown, the pressing assembly 20 includes: a pressing sleeve 21, an upper pressing sleeve 22, a pressure pad 23, a pressure head 24, a connecting rod 25, a sensor assembly 26, a pressing screw 27, an upper flange 281, a spring seat 282, and a spring 29.

[0051] The diode is positioned between the lower pressure sleeve 21 and the upper pressure sleeve 22, and the pressure head 24 passes through the upper pressure sleeve 22 and presses against the diode.

[0052] The upper flange 281 and the spring seat 282 are joined together to form a tubular cavity. The upper flange 281 is located on the upper side of the bracket 12, and the spring seat 282 is located on the inner side of the bracket 12. The two are fixed to the bracket 12 by bolts.

[0053] The sensor assembly 26 is disposed inside the tubular cavity, and one end of the spring 29 is connected to the sensor assembly 26, while the other end is mounted on the spring seat 282.

[0054] A pressing screw 27 is provided on the upper side of the sensor assembly 26. The pressing screw 27 is threadedly engaged with the upper flange 281. By rotating the pressing screw 27, the downward pressure is transmitted sequentially through the sensor assembly 26, the connecting rod 25, and the pressure head 24 to the diode between the upper pressure sleeve 21 and the lower pressure sleeve 22.

[0055] In this application, a locking nut 271 is provided on the pressing screw 27 for limiting and locking the pressing screw 27.

[0056] In addition, the sensor assembly 26 is equipped with a pressure display device 261, which is connected to the sensor assembly 26 and used to display the pressure value measured by the sensor assembly 26. The pressure display device 261 is mounted on the base plate 11. By displaying the pressure value of the sensor assembly 26 through the pressure display device 261, the pressure during diode pressing can be controlled to avoid diode damage due to excessive pressure and poor pressing effect and product defects due to insufficient pressure.

[0057] like Figure 3 As shown, the pressurization assembly 30 includes: a support frame 31, a rotating shaft 32, a pressure rod 33, an actuator 34, and a hydraulic pump 35.

[0058] The support frame 31 is vertically mounted on the bracket 12, with its upper end fixedly connected to the bracket 12 by bolts, and its lower end having a through hole. The rotating shaft 32 passes through the through hole at the lower end of the support frame 31, and its two ends are mounted on the side wall of the bracket 12 by connectors. In a preferred embodiment of this application, gaskets 321 may be provided at both ends of the rotating shaft 32 to prevent the connectors at both ends of the rotating shaft 32 from rubbing against the bracket 11.

[0059] The pressure rod 33 is mounted on the rotating shaft 32, with one end extending to the upper side of the pressure pad 23 and the other end extending to the upper side of the actuator 34. The actuator 34 is mounted on the base plate 11 near the base 13. By controlling the movement of the actuator 34, the pressure rod 33 can be rotated around the rotating shaft 32, thereby providing downward pressure to the pressure pad 23.

[0060] In a preferred embodiment of this application, the actuator 34 is a hydraulic actuator, which is equipped with a hydraulic pump 35. The hydraulic pump 35 is mounted on the base plate 11 and connected to the actuator 34 via a pipeline (not shown). Furthermore, in order to control the pressure supplied by the hydraulic pump 35 to the actuator 34 within a reasonable range, a pressure gauge is provided between the hydraulic pump 35 and the actuator 34 to monitor the pressure.

[0061] During the press-fit encapsulation process, by screwing down the pressing screw 27, the sensor assembly 26 measures the clamping force provided by the pressing screw 27 and transmits the applied pressure to the pressure display device 261 to display the pressure value. At the same time, the sensor assembly 26 transmits the downward pressure to the upper part of the transistor through the connecting rod 26 and the upper pressing head 24, generating a downward clamping force. When the upper metal of the transistor is subjected to pressure F, a very large compressive force is generated between the upper and lower parts of the transistor, causing them to undergo plastic deformation under external force and maintain close contact.

[0062] During the press-fitting process, the lower pressure sleeve 21 and the upper pressure sleeve 22 are used to position the diode, which can control the assembly deviation caused by assembly and ensure the concentricity of the diode.

[0063] Simultaneously, the actuator 34 is displaced, causing the pressure rod 33 to rotate around the shaft 32. The pressure rod 33 transmits pressure to the pressure pad 23, which further controls the upper pressure sleeve 22 to generate a shearing force towards the side of the diode casing. After the actuator 34 generates a downward pressing force on the upper pressure sleeve 22, the angled bottom of the upper pressure sleeve 22 causes the outer ring of the diode to tighten inward while applying the downward pressing force. This keeps the tightly contacted components inside the diode formed by the downward pressure F, storing the force inside the diode. When the pressure F disappears, the tight contact between the components generates a force that restores the side of the diode casing to its original shape due to the elasticity of the material. It is this energy stored on the side of the casing that generates pressure on the internal components of the diode, forming an electrical contact.

[0064] The compression diode packaging device provided in this application only requires the application of mechanical pressure to cause plastic deformation of the diode metal, forming an integrated metal structure. This enables internal compression packaging, eliminating the need for thermal and electrical stress during the packaging process. This reduces product weight, improves the junction temperature and heat dissipation of the diode, and enhances product reliability. Compared to traditional welding techniques, it reduces failure modes such as weld voids and solder melting caused by high-temperature welding, and reduces the use of solder and solder paste, further reducing product weight. By adding sensor components and a pressure display device, the pressure value during diode compression can be better controlled, avoiding diode product defects caused by excessive or insufficient pressure.

[0065] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A packaging device for a pressure-fit diode, characterized in that, include: A stand assembly, comprising a base plate, a support, and a base, wherein the base plate forms a supporting plane, the support is fixed to the base plate, and the base is fixed to the base plate inside the support. The pressing assembly includes: a lower pressing sleeve, an upper pressing sleeve, a pressure pad, a pressure head, a connecting rod, a sensor assembly, a pressing screw, an upper flange, a spring seat, and a spring. A diode is positioned between the lower and upper pressing sleeves. The pressure head passes through the upper pressing sleeve and presses against the diode. The upper flange and spring seat are joined to form a tubular cavity. The upper flange is located on the upper side of the support, and the spring seat is located on the inner side of the support, both fixed to the support. The sensor assembly is positioned within the tubular cavity. The spring is positioned between the sensor assembly and the spring seat. The pressing screw is positioned on the upper side of the sensor assembly and threadedly engages with the upper flange. By rotating the pressing screw, the downward pressure is sequentially transmitted through the sensor assembly, the connecting rod, and the pressure head to the diode between the upper and lower pressing sleeves. A pressurizing assembly includes a support frame, a rotating shaft, a pressure rod, and an actuator. The support frame is mounted on a bracket, and the rotating shaft passes through the lower end of the support frame and is mounted on the side wall of the bracket. The pressure rod is rotatably mounted on the rotating shaft, with one end extending to the pressure pad and the other end extending to the actuator. By controlling the actuator, the pressure rod can provide downward pressure to the pressure pad, thereby transmitting it to the diode.

2. The packaging apparatus for a pressure-fit diode as described in claim 1, characterized in that, The support structure is shaped like a zigzag.

3. The packaging apparatus for a pressure-fit diode as described in claim 1, characterized in that, The platform assembly also includes feet mounted at the corners of the underside of the base plate for supporting the base plate.

4. The packaging apparatus for a pressure-fit diode as described in claim 1, characterized in that, The pressing screw is equipped with a locking nut for limiting and locking the pressing screw.

5. The packaging apparatus for a pressure-fit diode as described in claim 1, characterized in that, The sensor assembly is equipped with a pressure display device for displaying the pressure value measured by the sensor assembly.

6. The packaging apparatus for a pressure-fit diode as described in claim 5, characterized in that, The pressure display device is fixedly mounted on the base plate.

7. The packaging apparatus for a pressure-fit diode as described in claim 1, characterized in that, The two ends of the rotating shaft are mounted on the side wall of the bracket via connectors. A gasket is provided between the connector and the side wall of the bracket to prevent the connector from rubbing against the bracket.

8. The packaging apparatus for a pressure-fit diode as described in claim 1, characterized in that, The actuator is a hydraulic actuator, which is equipped with a hydraulic pump. The hydraulic pump is mounted on the base plate and connected to the actuator through pipelines.

9. The packaging apparatus for a pressure-fit diode as described in claim 8, characterized in that, A pressure gauge is installed between the hydraulic pump and the actuator to monitor the pressure supplied by the hydraulic pump to the actuator.

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