石墨烯包覆铜粉的制备，利用其制备复合铜铬触头的方法
By introducing a liquid carbon source during the plasma atomization powder preparation process to form graphene-coated copper powder, and combining it with 3D printing and gradient structures, the problems of insufficient thermal and electrical conductivity and copper layer detachment in copper-chromium contact materials have been solved, achieving efficient and low-cost preparation of copper-chromium contacts.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 杭州英希捷科技有限责任公司
- Filing Date
- 2023-04-27
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional copper-chromium contact materials generally have poor thermal and electrical conductivity, which is difficult to improve. 3D printing processes are complex and costly, and the copper layer is prone to falling off during welding, making powder recycling cumbersome.
Liquid carbon source is introduced during plasma atomization powder production to form graphene-coated copper powder. Graphene composite copper-chromium contacts are then prepared by 3D printing. A gradient structure design is adopted, combined with laser sintering and heat treatment, to achieve material modification and recycling.
It reduces process costs, improves the thermal and electrical conductivity and anti-electro-erosion and anti-welding properties of copper-chromium contacts, avoids copper layer detachment, and simplifies the powder recycling process.
Smart Images
Figure CN117798362B_ABST